JPH08160597A - Pellicle and reticle - Google Patents
Pellicle and reticleInfo
- Publication number
- JPH08160597A JPH08160597A JP3990095A JP3990095A JPH08160597A JP H08160597 A JPH08160597 A JP H08160597A JP 3990095 A JP3990095 A JP 3990095A JP 3990095 A JP3990095 A JP 3990095A JP H08160597 A JPH08160597 A JP H08160597A
- Authority
- JP
- Japan
- Prior art keywords
- pellicle
- reticle
- frame
- transparent body
- quartz glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、ペリクル及びレチクル
に係わり、特に防塵効果が高く、取扱い性に優れ、且つ
半永久的に使用可能な長寿命ペリクル及びレチクルに関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pellicle and a reticle, and more particularly to a long-life pellicle and a reticle which have a high dustproof effect, are easy to handle, and can be used semipermanently.
【０００２】[0002]
【従来の技術】ステッパー露光をする場合、通常、レチ
クル上へ異物が付着しレジストパターンに欠陥が発生す
るのを防止するため、防塵用のペリクルを装着したレチ
クルが用いられている。2. Description of the Related Art When performing stepper exposure, a reticle equipped with a dust-proof pellicle is usually used to prevent foreign matter from adhering to the reticle and causing a defect in the resist pattern.
【０００３】従来のペリクルは、図５に示すように、ア
ルミニウム製のペリクルフレーム５１に数百ｎｍ〜数μ
ｍ厚のニトロセルロース等からなるペリクル膜５２を張
着したものが用いられ、これをレチクル５０板上の回路
パターン５３を覆うように配設し接着剤５４で固定して
いる。A conventional pellicle has a pellicle frame 51 made of aluminum, as shown in FIG.
An m-thick pellicle film 52 made of nitrocellulose or the like is used, which is arranged so as to cover the circuit pattern 53 on the reticle 50 plate and fixed with an adhesive 54.
【０００４】しかし、このようなレチクルでは、接着剤
５４の一部が欠落して回路上に付着したり、あるいは露
光を繰り返し行うことにより接着剤が分解し回路パター
ン上に再付着してパターンの欠陥を生じてしまう等の問
題がある。この問題は、露光波長に短波長の光を用いる
場合ほど顕著になる。また、例えばｉ線、ｇ線それ自体
は接着剤を分解作用は比較的少ないため、それほど大き
な問題とはならないが、光源から同時に放射される短波
長光により分解が加速されるという問題がある。このた
め、現場においては定期的に異物検査を行い、異物が認
められる度毎にペリクルを交換するという手順を踏むの
が現状である。この交換周期はレチクル使用頻度、露光
波長等により異なるが、通常１〜３カ月である。However, in such a reticle, a part of the adhesive 54 is dropped and adhered on the circuit, or the adhesive is decomposed by repeated exposure and redeposited on the circuit pattern to form a pattern. There are problems such as defects. This problem becomes more remarkable when short-wavelength light is used as the exposure wavelength. Further, for example, the i-line and the g-line itself have a relatively small effect of decomposing the adhesive, so that they are not so serious problems, but there is a problem that the decomposition is accelerated by the short wavelength light emitted simultaneously from the light source. For this reason, it is the current practice to carry out a foreign matter inspection on a regular basis and replace the pellicle every time a foreign matter is detected. This replacement cycle varies depending on the reticle usage frequency, exposure wavelength, etc., but is usually 1 to 3 months.
【０００５】また、ペリクル膜は破損し易いため、膜の
フレームへの張着やレチクルへの装着には細心の注意と
熟練を要する。また、ペリクル膜上の異物は、焼き付け
されるレジストパターンへの影響は少ないとは言えそれ
には限度があり、大きなゴミが付着したり多量に付着し
た場合にはパターンの欠陥が生じるため、ゴミを取り除
かなければならないが、その除去は実際上困難である。Further, since the pellicle film is easily damaged, meticulous care and skill are required to attach the film to the frame or attach it to the reticle. Further, although the foreign matter on the pellicle film has a small effect on the resist pattern to be baked, there is a limit to it, and if large dust or large amounts of dust are attached, pattern defects will occur. It must be removed, but its removal is practically difficult.
【０００６】ペリクルを取り外す場合も、ペリクル膜の
剥離・除去、フレームの剥離等の工程が必要で、レチク
ルパターンを傷付けないよう細心の注意を要するもので
ある。Even when the pellicle is removed, steps such as peeling / removal of the pellicle film and peeling of the frame are required, and great care must be taken not to damage the reticle pattern.
【０００７】以上のように、従来のペリクルは寿命が短
く、しかも交換にかなりの工数を必要とする事から生産
性が低くなり、最終的には半導体デバイスの価格をつり
上げるという問題がある。As described above, since the conventional pellicle has a short life and requires a considerable number of man-hours for replacement, the productivity is lowered, and finally there is a problem that the price of the semiconductor device is raised.
【０００８】[0008]
【発明が解決しようとする課題】かかる状況に鑑み、本
発明は、ペリクル及びレチクルの取扱い性を改善すると
ともに、接着剤による回路パターン面の汚染の問題を解
決したペリクル及びレチクルを提供することを目的とす
る。In view of the above situation, the present invention provides a pellicle and a reticle that improve the handling property of the pellicle and the reticle and solve the problem of contamination of the circuit pattern surface by the adhesive. To aim.
【０００９】[0009]
【課題を解決するための手段】本発明のペリクルは、フ
レームの上面に透明体を接合したペリクルにおいて、前
記フレーム及び透明体を石英ガラスで構成したことを特
徴とする。The pellicle of the present invention is a pellicle in which a transparent body is joined to the upper surface of a frame, wherein the frame and the transparent body are made of quartz glass.
【００１０】前記フレーム及び前記透明体の接合面は、
光学的平面に研磨して溶着したことを特徴とする。平面
のニュートンリング数は３本以下、平滑度は３μｍ以下
であるのが好ましい。The joint surface between the frame and the transparent body is
It is characterized by being polished and welded to an optical plane. The number of Newton rings on the plane is preferably 3 or less, and the smoothness is preferably 3 μm or less.
【００１１】前記フレームと前記透明体は、接合部を重
ね合わせた後、３００〜８００℃の雰囲気中で溶着した
ことを特徴とする。あるいは、接合部を重ね合わせた
後、微細バーナーで接合部を加熱して溶着させたことを
特徴とする。The frame and the transparent body are characterized in that they are welded together in an atmosphere of 300 to 800 ° C. after the joint portions are overlapped with each other. Alternatively, it is characterized in that after the joining portions are superposed, the joining portions are heated and welded by a fine burner.
【００１２】本発明のレチクルは、上記ペリクルをレチ
クル板の回路パターン面側に配設したことを特徴とす
る。あるいは、上記ペリクルをレチクル板の両面に配設
したことを特徴とする。The reticle of the present invention is characterized in that the pellicle is disposed on the circuit pattern surface side of the reticle plate. Alternatively, the pellicle is arranged on both sides of a reticle plate.
【００１３】前記ペリクルフレームとレチクル板は、接
合部を重ね合わせた後、３００〜８００℃の雰囲気中で
溶着させるのが好ましい。あるいは、接合部を重ね合わ
せた後、微細バーナーで接合部を加熱して溶着させても
良い。It is preferable that the pellicle frame and the reticle plate are welded in an atmosphere of 300 to 800 ° C. after the joining portions are overlapped. Alternatively, after superposing the joints, the joints may be heated and welded with a fine burner.
【００１４】また、本発明のレチクルは、レチクル板の
回路パターン側の面または両面にペリクルを配設したレ
チクルにおいて、該ペリクルのフレームが石英ガラスか
らなり、該フレームの一方の端面が溶着により前記レチ
クル板に接合され、ペリクルの他方の端面に有機膜が張
着されていることを特徴とする。Further, the reticle of the present invention is a reticle in which a pellicle is arranged on the surface or both surfaces of the reticle plate on the side of the circuit pattern, and the frame of the pellicle is made of quartz glass, and one end surface of the frame is welded to form the reticle. It is characterized in that it is joined to a reticle plate and an organic film is attached to the other end face of the pellicle.
【作用】本発明のペリクルは、フレーム及び透明体に石
英ガラスを用いることにより、取扱い性を高めるととも
に、たとえ透明体（薄板石英ガラス）上にゴミ等が付着
しても容易に除去することが可能となる。またフレーム
及び透明体を光学的平面まで研磨することにより、低温
で両者を溶着可能となり、接着剤を用いずにペリクルを
作製することができる。In the pellicle of the present invention, by using the quartz glass for the frame and the transparent body, the handling property is improved, and even if dust or the like adheres to the transparent body (thin quartz glass), it can be easily removed. It will be possible. Further, by polishing the frame and the transparent body to an optical plane, both can be welded at a low temperature, and a pellicle can be manufactured without using an adhesive.
【００１５】フレーム及び薄板ガラスの研磨面は、低温
で溶着できる程度の平面とするのが好ましい。具体的に
は、例えばニュートンリングの数で３本以下、平滑度Ｒ
ａで３μｍ以下とするのが好ましく、さらにはニュート
ンリングの数で２本以下、平滑度Ｒａで２μｍ以下とす
るのが一層好ましい。The polishing surfaces of the frame and the thin glass plate are preferably flat surfaces that can be welded at a low temperature. Specifically, for example, the number of Newton rings is 3 or less, and the smoothness R is
It is preferable that a is 3 μm or less, and it is more preferable that the number of Newton rings is 2 or less and the smoothness Ra is 2 μm or less.
【００１６】光学的平面に研磨したフレームと透明体
は、接触させて押さえるだけで物理的な相互作用が働
き、重力に対しても透明体が落下しない程度に保持され
るようになるが、これを加熱雰囲気に放置することによ
り接合強度は著しく向上する。これは、接合面で溶着が
起こり、溶着と物理的相互作用により透明体がフレーム
上に強固に固定されるためと考えられる。The frame polished to an optical plane and the transparent body are brought into contact with each other and pressed to exert a physical interaction so that the transparent body is held to the extent that the transparent body does not drop even against gravity. The joint strength is remarkably improved by leaving the alloy in a heated atmosphere. It is considered that this is because welding occurs at the joint surface, and the transparent body is firmly fixed on the frame due to the physical interaction with the welding.
【００１７】溶着方法としては、この他に、プロパンや
水素ガス等のマイクロガスバーナにより、溶着部を加熱
することで溶着することも可能である。この場合、バー
ナのノズルは０．３ｍｍφ程度のものが好適に用いられ
る。In addition to this, as a welding method, it is also possible to perform welding by heating the welding portion with a micro gas burner such as propane or hydrogen gas. In this case, the burner nozzle having a diameter of about 0.3 mm is preferably used.
【００１８】本発明において、透明体として用いる石英
ガラスの厚さは、０．０１〜０．５ｍｍが好ましく、取
扱い性、生産性及び溶着性を考慮すると０．０５〜０．
５ｍｍが好ましい。また、透明体の少なくとも片面に、
少なくとも露光波長に対する反射防止効果を有する膜を
形成するのが好ましい。In the present invention, the thickness of the quartz glass used as the transparent body is preferably 0.01 to 0.5 mm, and in view of handleability, productivity and weldability, it is 0.05 to 0.
5 mm is preferable. Also, on at least one side of the transparent body,
It is preferable to form a film having an antireflection effect on at least the exposure wavelength.
【００１９】反射防止膜は、公知のＭｇＦ2，Ａｌ
2Ｏ3，ＺｒＯ2等を用いて単層、２層、４層またはそれ
以上の公知の構成とし、用いる露光波長に対し反射率が
極小値をとる膜構成とすれば良い。形成方法は、例えば
真空蒸着法等公知の方法を用いれば良い。The antireflection film is made of known MgF 2 , Al.
2 O 3 , ZrO 2 or the like may be used to form a known structure having a single layer, two layers, four layers or more, and a film structure in which the reflectance has a minimum value with respect to the exposure wavelength used. As a forming method, a known method such as a vacuum vapor deposition method may be used.
【００２０】また、フレームの幅は、１〜５ｍｍが好ま
しく、また２〜３ｍｍがより好ましい。この範囲で溶着
がより容易になる。フレームの高さは、通常３〜５ｍｍ
程度が用いられる。The width of the frame is preferably 1 to 5 mm, more preferably 2 to 3 mm. Welding becomes easier in this range. Frame height is usually 3-5mm
Degree is used.
【００２１】本発明のレチクルは、上記本発明のペリク
ルをレチクル上の回路パターンを保護するように配設し
たものである。The reticle of the present invention comprises the pellicle of the present invention arranged so as to protect the circuit pattern on the reticle.
【００２２】本発明において、ペリクルフレームと透明
体との接合及びペリクルのレチクル板上への接合は、従
来のように接着剤を用いることも可能である。前述した
ように接着剤による悪影響はあるが、ペリクルの再利用
やペリクル膜上のゴミ除去が可能となり、ペリクルコス
トを従来に比べて大幅に下げることができる。In the present invention, an adhesive may be used as in the prior art for joining the pellicle frame and the transparent body and joining the pellicle onto the reticle plate. Although the adhesive has a bad effect as described above, the pellicle can be reused and dust on the pellicle film can be removed, and the pellicle cost can be significantly reduced compared to the conventional case.
【００２３】しかしながら、ペリクル交換に関する工数
増加及びパターン焼き付けの信頼性等を考慮すると、ペ
リクルフレームと薄板ガラスの場合と同様にレチクルと
ペリクルを加熱溶着して固定するのが好ましい。この場
合、フレームのレチクルとの接合部は光学的平面まで研
磨するのが好ましい。レチクルとペリクルを合わせ、加
圧した状態で加熱雰囲気中に放置する事により溶着する
ことができる。However, considering the increase in man-hours involved in pellicle replacement and the reliability of pattern printing, it is preferable to heat-weld and fix the reticle and pellicle as in the case of the pellicle frame and thin glass plate. In this case, it is preferable to polish the joint portion of the frame with the reticle to an optical plane. The reticle and pellicle can be welded together by leaving the reticle and pellicle in a heated atmosphere in a pressurized state.
【００２４】本発明において、ペリクルフレームと透明
体またはペリクルフレームとレチクル板を溶着させるた
めの雰囲気の温度としては、３００℃以上さらには５０
０℃以上が好ましく、この温度範囲で接合強度は一層向
上する。一方、上限温度は回路パターン（酸化クロム
等）への影響及び薄板ガラスの歪等を考慮して８００℃
以下とするのが好ましい。In the present invention, the temperature of the atmosphere for welding the pellicle frame and the transparent body or the pellicle frame and the reticle plate is 300 ° C. or more, and further 50 or more.
It is preferably 0 ° C. or higher, and the bonding strength is further improved in this temperature range. On the other hand, the upper limit temperature is 800 ° C considering the influence on the circuit pattern (chromium oxide etc.) and the distortion of thin glass.
It is preferable to set the following.
【００２５】ペリクルフレームとレチクル溶着は、マイ
クロバーナで加熱して行っても良い。この場合、（１）
レチクル板側から重なり部の中心線に沿って、バーナー
の炎をあてても良いし、（２）レチクル板とペリクルフ
レーム外周の接触部にバーナーの炎を当てて溶着しても
良い。接合強度は後者の方が大きくなり、また、平面性
の劣るフレームや薄板ガラスを用いることができる。The pellicle frame and reticle welding may be performed by heating with a microburner. In this case, (1)
The burner flame may be applied from the reticle plate side along the center line of the overlapping portion, or (2) the burner flame may be applied to the contact portion between the reticle plate and the outer periphery of the pellicle frame for welding. The latter has a higher bonding strength, and a frame or thin glass having poor flatness can be used.
【００２６】ペリクル、レチクル板とも石英ガラス製と
して、接着剤を使わずに作製することによって、Ｈ2Ｓ
Ｏ4，ＮＨ4ＯＨ，ＮＨ4ＯＨ−Ｈ2Ｏ2等の薬剤を用いて
洗浄することが可能となる。従って、ペリクルやレチク
ル板等にゴミが付いた場合でも、上記薬剤洗浄により容
易に且つ完全にゴミを取り除くことができる。Both the pellicle and the reticle plate are made of quartz glass, and are manufactured without using an adhesive to produce H 2 S.
It becomes possible to clean using a chemical such as O 4 , NH 4 OH, and NH 4 OH-H 2 O 2 . Therefore, even if dust is attached to the pellicle or reticle plate, the dust can be easily and completely removed by the above-mentioned chemical cleaning.
【００２７】さらに、本発明においては、レチクル板の
両側に上記ペリクルを設けても良い。縮小光学系の場合
には、波面光学的には、露光波長の出射側のペリクルの
透明体は入射側よりも薄くするのが好ましい。Further, in the present invention, the pellicle may be provided on both sides of the reticle plate. In the case of a reduction optical system, in terms of wavefront optics, it is preferable that the transparent body of the pellicle on the exit side of the exposure wavelength be thinner than that on the entrance side.
【００２８】以上述べたように、本発明の構成をとるこ
とにより、ペリクルを交換することなくレチクルを半永
久的に使用することが可能となる。As described above, with the configuration of the present invention, the reticle can be used semipermanently without replacing the pellicle.
【００２９】また、これまでは、回路パターン等の保護
用透明体として、石英製薄板ガラスを用いた場合につい
て述べてきたが、従来の如くニトロセルロースに代表さ
れる有機膜を用い、フレームとレチクル板とを溶着によ
り固定しても良い。この場合、強度の弱い有機膜を用い
るために取扱い性等は劣るが、フレームとレチクル板と
の接合部の接着剤を排除したため、接着剤が光によって
分解し、再度回路面に付着するという上記問題等を回避
することができ、使用期間を延ばすことが可能となる。
尚、本発明において、有機膜はニトロセルロースに限る
ことはなく、フッ素樹脂その他の樹脂膜を用いることも
できる。あるいは、これらに有機ポリマー、無機質の反
射防止膜をコートしたものも好適に用いることができ
る。Although the case where the thin glass plate made of quartz is used as the transparent body for protecting the circuit pattern and the like has been described above, an organic film typified by nitrocellulose is used as in the conventional case, and the frame and the reticle are used. It may be fixed to the plate by welding. In this case, since the organic film having low strength is used, the handling property is poor, but since the adhesive at the joint between the frame and the reticle plate is eliminated, the adhesive decomposes by light and adheres to the circuit surface again. Problems and the like can be avoided and the usage period can be extended.
In the present invention, the organic film is not limited to nitrocellulose, and a fluororesin or other resin film may be used. Alternatively, those obtained by coating an organic polymer or an inorganic antireflection film can also be suitably used.
【００３０】透明体に有機膜を用いてレチクルを構成す
る場合は、ペリクルフレームの一方の端面をレチクル板
に溶着した後ペリクルフレームの他方の端面に有機膜を
張着しても良いし、あるいはペリクルフレームに有機膜
を張着した後レチクル板に溶着しても良い。但し、有機
膜を張着したペリクルをレチクル板に溶着する場合は、
有機膜を損傷しないように低温で処理する必要がある。
この場合、例えば、有機膜を加熱しないようにレチクル
板側から上記のマイクロバーナをあて溶着部分のみを加
熱するようにして溶着すれば良い。When a reticle is formed by using an organic film as a transparent body, one end surface of the pellicle frame may be welded to the reticle plate and then the organic film may be attached to the other end surface of the pellicle frame. The organic film may be attached to the pellicle frame and then welded to the reticle plate. However, when welding the pellicle with the organic film attached to the reticle plate,
It is necessary to process at a low temperature so as not to damage the organic film.
In this case, for example, the above-mentioned microburner may be applied from the reticle plate side so as not to heat the organic film, and only the welding portion may be heated to perform the welding.
【００３１】[0031]
【実施例】以下に実施例を挙げて本発明をより詳細に説
明するが、本発明がこれら実施例に限定されることはな
い。The present invention will be described in more detail below with reference to examples, but the present invention is not limited to these examples.
【００３２】（実施例１）図１に本発明のペリクルの一
例を示す。図１（ａ）は平面図、図１（ｂ）は図１
（ａ）のＡ−Ａ’に沿った断面図である。図において、
１０はペリクル本体、１１は石英ガラス製ペリクルフレ
ーム、１２は透明体であり、溶着部以外に反射防止膜１
３を形成した薄板石英ガラスである。(Embodiment 1) FIG. 1 shows an example of the pellicle of the present invention. 1A is a plan view and FIG. 1B is FIG.
It is sectional drawing which followed the AA 'of (a). In the figure,
Reference numeral 10 is a pellicle body, 11 is a quartz glass pellicle frame, and 12 is a transparent body.
3 is a thin quartz glass plate.
【００３３】ペリクルフレーム１１については、まず加
熱したグラファイト製の型に２酸化珪素粉末を入れ溶融
・凝固し、適当な厚さに切断した。続いて、接合させる
部分ａ、ｂをニュートンリング３本、平滑度Ｒａ＝３μ
ｍ以下まで研磨した。このようにして作製したフレーム
の形状は、高さ（ｔ１）４ｍｍ、外寸（Ｌ）１００ｍ
ｍ、幅（ｄ）２．５ｍｍである。With respect to the pellicle frame 11, first, silicon dioxide powder was put into a heated graphite mold, melted and solidified, and cut into an appropriate thickness. Subsequently, the parts a and b to be joined are three Newton rings, and the smoothness Ra = 3 μ.
Polished to m or less. The frame thus manufactured has a height (t 1 ) of 4 mm and an outer dimension (L) of 100 m.
m, width (d) 2.5 mm.
【００３４】一方、薄板ガラス１２は、厚さ（ｔ2）
０．１ｍｍ、１００ｍｍ角の石英ガラス板をニュートン
リング数３本、平滑度Ｒａ＝３μｍ以下まで研磨した
後、真空蒸着装置に設置して接合する部分ａを除いて反
射防止膜１３を形成した。On the other hand, the thin glass sheet 12 has a thickness (t 2 )
After polishing a quartz glass plate having a size of 0.1 mm and 100 mm square to three Newton rings and a smoothness Ra of 3 μm or less, the antireflection film 13 was formed except for a portion a which was placed in a vacuum vapor deposition apparatus and bonded.
【００３５】以上のようにして、ペリクルフレームと薄
板ガラスを複数個作製し、フレームと薄板ガラスを重ね
合わせ、２０ｇの加重をかけた状態で炉内に入れ、２０
０〜８００℃の間の種々の温度に昇温して１５分放置し
た。As described above, a plurality of pellicle frames and thin glass sheets were produced, the frames and thin glass sheets were superposed on each other, and placed in a furnace with a weight of 20 g applied to them.
The temperature was raised to various temperatures between 0 and 800 ° C. and left for 15 minutes.
【００３６】冷却後、接合したペリクルを取り出し、接
合状態を調べたところ、３００℃以上の処理で接合強度
はより大きくなることが分かった。また、上記温度範囲
では薄板ガラスの平面性は接合前に比べ全く変化はなか
った。After cooling, the bonded pellicle was taken out and the bonding state was examined. It was found that the bonding strength was further increased by the treatment at 300 ° C. or higher. Further, in the above temperature range, the flatness of the thin glass plate did not change at all as compared with that before bonding.
【００３７】なお、本実施例では、フレームは成型した
ものを用いたが、適当な寸法の石英ガラス板材を溶着し
たものを用いても同様の結果が得られることは言うまで
もない。In this embodiment, the molded frame is used, but it goes without saying that the same result can be obtained by using a fused quartz glass plate material having an appropriate size.
【００３８】（実施例２）実施例１と同様にして、フレ
ーム及び薄板ガラスを用意し、これを重ね合わせ、先端
０．３ｍｍのプロパンガスバーナーで重なり部の中心線
に沿って薄板ガラス側から加熱し、両者を溶着させた。(Example 2) In the same manner as in Example 1, a frame and thin glass sheets were prepared, these were stacked, and a propane gas burner with a tip of 0.3 mm was used along the center line of the overlapping portion from the thin glass sheet side. It heated and made both welded.
【００３９】このようにして得られたペリクルは、フレ
ームと薄板ガラスの接合強度は十分高く、また、薄板ガ
ラスの平坦性も全く変化はなかった。In the pellicle thus obtained, the bonding strength between the frame and the thin glass plate was sufficiently high, and the flatness of the thin glass plate did not change at all.
【００４０】（実施例３）図２に本発明のレチクルの一
例を示す。図において、２０はレチクル板、２１はペリ
クル、２２は回路パターンである。なお、ペリクル２１
は実施例１で５００℃で溶着して作製したペリクルであ
る。(Embodiment 3) FIG. 2 shows an example of the reticle of the present invention. In the figure, 20 is a reticle plate, 21 is a pellicle, and 22 is a circuit pattern. The pellicle 21
Is a pellicle manufactured by welding at 500 ° C. in Example 1.
【００４１】石英ガラス製５インチ角のレチクル２０の
回路パターンを保護するように囲んでペリクル２１を配
置し、２０ｇの加重をかけた状態で炉内に設置し、５０
０℃に昇温して１５分間放置した。A pellicle 21 is arranged so as to protect a circuit pattern of a quartz glass 5-inch square reticle 20, and the pellicle 21 is placed in a furnace with a weight of 20 g applied to it.
The temperature was raised to 0 ° C. and left for 15 minutes.
【００４２】以上により、レチクルとペリクル板は強固
に接合することが確認され、しかも、回路パターンには
全く影響はみられなかった。From the above, it was confirmed that the reticle and the pellicle plate were firmly bonded to each other, and the circuit pattern was not affected at all.
【００４３】また、完成したペリクル２１を用いず、レ
チクル２０上に実施例１のペリクルフレーム及び石英薄
板ガラスを配置し、これに加重をかけた状態で炉内に設
置し、５００℃に昇温して１５分間放置して作製したレ
チクルの場合も同様に高い接合強度が得られた。Further, without using the completed pellicle 21, the pellicle frame of Example 1 and the quartz thin plate glass are placed on the reticle 20, and the pellicle frame and the quartz thin plate glass are placed in the furnace while being weighted and heated to 500 ° C. Similarly, in the case of the reticle manufactured by leaving it for 15 minutes, high bonding strength was obtained.
【００４４】（実施例４）図３に、本発明の第４の実施
例を示す。本実施例では、レチクル板の両面を２つのペ
リクルで保護する構成としたものである。(Embodiment 4) FIG. 3 shows a fourth embodiment of the present invention. In this embodiment, both surfaces of the reticle plate are protected by two pellicles.
【００４５】図３（ａ）は、２つのペリクル３１、３２
の間にレチクル板３０を挟み、実施例３と同様にして炉
内で５００℃に昇温して溶着させたものである。FIG. 3A shows two pellicles 31, 32.
The reticle plate 30 is sandwiched between the two, and the temperature is raised to 500 ° C. in the furnace and welding is performed in the same manner as in Example 3.
【００４６】図３（ｂ）は、２つのペリクル３１、３２
の間にレチクル板３０を挟み、図に矢印Ａで示した接合
部を外周に沿ってバーナーで加熱して溶着したものであ
る。FIG. 3B shows two pellicles 31, 32.
The reticle plate 30 is sandwiched between the two, and the joint portion indicated by the arrow A in the figure is heated by a burner along the outer periphery and welded.
【００４７】図３（ｃ）は、実施例３と同様にして、回
路パターン面にペリクル３１を接合させた後、実施例２
と同様にバーナーで、回路パターンと反対側面にペリク
ル３２を接合したものである。バーナーをレチクル板側
から加熱して（図の矢印Ｂ）溶着させる関係上、ペリク
ル３２のフレームは、ペリクル３１のフレームよりも大
きくしてある。FIG. 3C shows the second embodiment after the pellicle 31 is bonded to the circuit pattern surface in the same manner as the third embodiment.
Similarly to the above, the pellicle 32 is joined to the side opposite to the circuit pattern with a burner. The frame of the pellicle 32 is made larger than the frame of the pellicle 31 in order to heat and burn the burner from the reticle plate side (arrow B in the figure).
【００４８】以上のようにして、作製したレチクルは、
部材間の接合強度がいずれも十分に高く、また回路パタ
ーンには全く変化はなかった。The reticle produced as described above is
The joining strength between the members was sufficiently high, and there was no change in the circuit pattern.
【００４９】（実施例５）図４は、本発明の第５の実施
例を示す模式図である。本実施例のレチクルは、ｉ線
（４３６ｎｍ）用に、厚さ０．８６５ｎｍのニトロセル
ロース４２を石英ガラスフレーム４１に張着したペリク
ルを微細バーナーでレチクル板４０に溶着して固定した
ものである。(Embodiment 5) FIG. 4 is a schematic view showing a fifth embodiment of the present invention. In the reticle of this embodiment, a pellicle in which nitrocellulose 42 having a thickness of 0.865 nm is adhered to a quartz glass frame 41 for the i-line (436 nm) is fixed to the reticle plate 40 by welding with a fine burner. .
【００５０】[0050]
【発明の効果】本発明のペリクルは、機械的強度及び取
扱い性に優れ、またたとえゴミ等が付着しても容易に除
去することが可能である。The pellicle of the present invention has excellent mechanical strength and handleability, and even if dust or the like is attached, it can be easily removed.
【００５１】また、本発明のレチクルは、ペリクルの固
定に接着剤を用いずに作製できるため、接着剤による汚
染を抑制することができ、レチクル交換周期を延ばすこ
とができる。Since the reticle of the present invention can be manufactured without using an adhesive for fixing the pellicle, contamination by the adhesive can be suppressed, and the reticle exchange period can be extended.
【００５２】従って、半導体製造プロセスにおける生産
性は向上し、半導体装置のコストダウンを達成できる。Therefore, the productivity in the semiconductor manufacturing process is improved and the cost of the semiconductor device can be reduced.
【図１】実施例１のペリクルを示す模式図である。FIG. 1 is a schematic diagram showing a pellicle according to a first embodiment.
【図２】実施例３のレチクルを示す模式図である。FIG. 2 is a schematic diagram showing a reticle according to a third embodiment.
【図３】実施例４のレチクルを示す模式図である。FIG. 3 is a schematic diagram showing a reticle of Example 4.
【図４】実施例５のレチクルを示す模式図である。FIG. 4 is a schematic diagram showing a reticle of Example 5.
【図５】従来のレチクルを示す模式図である。FIG. 5 is a schematic view showing a conventional reticle.
１０、２１、３１、３２ ペリクル、 １１、４１ ペリクルフレーム、 １２ 薄板石英ガラス、 １３ 反射防止膜、 ２０、３０、４０、５０ レチクル板、 ２２、３３、４３、５３ 回路パターン、 ４２、５２ ニトロセルロース膜、 ５１ アルミニウム製フレーム、 ５４ 接着剤。 10, 21, 31, 32 pellicle, 11, 41 pellicle frame, 12 thin quartz glass, 13 antireflection film, 20, 30, 40, 50 reticle plate, 22, 33, 43, 53 circuit pattern, 42, 52 nitrocellulose Membrane, 51 Aluminum frame, 54 Adhesive.
Claims (7)
クルにおいて、前記フレーム及び透明体を石英ガラスで
構成したことを特徴とするペリクル。1. A pellicle having a transparent body bonded to the upper surface of a frame, wherein the frame and the transparent body are made of quartz glass.
光学的平面に研磨して、接着または溶着したことを特徴
とする請求項１に記載のペリクル。2. The joint surface between the frame and the transparent body is
The pellicle according to claim 1, wherein the pellicle is ground to an optical plane and then adhered or welded.
３本以下であり、平滑度は３μｍ以下であることを特徴
とする請求項２に記載のペリクル。3. The pellicle according to claim 2, wherein the optical plane has a Newton's ring number of 3 or less and a smoothness of 3 μm or less.
重ね合わせた後、３００〜８００℃の雰囲気中で溶着さ
せたことを特徴とする請求項２または３に記載のペリク
ル。4. The pellicle according to claim 2, wherein the frame and the transparent body are welded together in an atmosphere of 300 to 800 ° C. after the joining portions are overlapped with each other.
重ね合わせた後、微細バーナーで接合部を加熱して溶着
させたことを特徴とする請求項２または３に記載のペリ
クル。5. The pellicle according to claim 2, wherein the frame and the transparent body are formed by superposing the joints and then heating the joints with a fine burner to weld them.
リクルをレチクル板の回路パターン面側または両面に配
設したことを特徴とするレチクル。6. A reticle in which the pellicle according to any one of claims 1 to 5 is disposed on a circuit pattern surface side or both surfaces of a reticle plate.
両面にペリクルを配設したレチクルにおいて、該ペリク
ルのフレームが石英ガラスからなり、該フレームの一方
の端面が溶着により前記レチクル板に接合され、ペリク
ルの他方の端面に有機膜が張着されていることを特徴と
するレチクル。7. A reticle in which a pellicle is arranged on a surface or both surfaces of a reticle plate on a circuit pattern side, a frame of the pellicle is made of quartz glass, and one end surface of the frame is joined to the reticle plate by welding. A reticle having an organic film attached to the other end surface of the pellicle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP03990095A JP3529062B2 (en) | 1994-10-07 | 1995-02-28 | Pellicle and reticle |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6-243690 | 1994-10-07 | ||
| JP24369094 | 1994-10-07 | ||
| JP03990095A JP3529062B2 (en) | 1994-10-07 | 1995-02-28 | Pellicle and reticle |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003330776A Division JP3775745B2 (en) | 1994-10-07 | 2003-09-22 | Reticle |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH08160597A true JPH08160597A (en) | 1996-06-21 |
| JP3529062B2 JP3529062B2 (en) | 2004-05-24 |
Family
ID=26379305
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP03990095A Expired - Lifetime JP3529062B2 (en) | 1994-10-07 | 1995-02-28 | Pellicle and reticle |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3529062B2 (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999049366A1 (en) * | 1998-03-20 | 1999-09-30 | Nikon Corporation | Photomask and projection exposure system |
| EP1160624A2 (en) * | 2000-06-01 | 2001-12-05 | Asahi Glass Company Ltd. | Pellicle and method of using the same |
| US6665049B1 (en) | 1999-08-10 | 2003-12-16 | Nikon Corporation | Photomask, method for manufacturing the same, projection aligner using the photomask, and projection exposing method |
| JP2005165141A (en) * | 2003-12-04 | 2005-06-23 | Semiconductor Leading Edge Technologies Inc | Method for manufacturing pellicle |
| KR100698602B1 (en) * | 1999-04-02 | 2007-03-21 | 신에쓰 가가꾸 고교 가부시끼가이샤 | Pellicle for photolithography |
| KR20180109177A (en) * | 2017-03-27 | 2018-10-08 | 삼성전자주식회사 | Method of manufacturing pellicle and apparatus for assembling pellicle |
| US10488751B2 (en) | 2014-09-19 | 2019-11-26 | Mitsui Chemicals, Inc. | Pellicle, production method thereof, exposure method |
| US10585348B2 (en) * | 2014-09-19 | 2020-03-10 | Mitsui Chemicals, Inc. | Pellicle, pellicle production method and exposure method using pellicle |
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|---|---|---|---|---|
| JPS58100852A (en) * | 1981-12-11 | 1983-06-15 | Hitachi Ltd | Photomask |
| JPS62288842A (en) * | 1986-06-09 | 1987-12-15 | Tosoh Corp | Protective dustproof body for photomask reticle |
| JPH03153255A (en) * | 1989-11-10 | 1991-07-01 | Seiko Epson Corp | Photomask and manufacture of semiconductor device |
| JPH0545710U (en) * | 1991-11-26 | 1993-06-18 | 凸版印刷株式会社 | Pellicle frame |
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1995
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|---|---|---|---|---|
| JPS58100852A (en) * | 1981-12-11 | 1983-06-15 | Hitachi Ltd | Photomask |
| JPS62288842A (en) * | 1986-06-09 | 1987-12-15 | Tosoh Corp | Protective dustproof body for photomask reticle |
| JPH03153255A (en) * | 1989-11-10 | 1991-07-01 | Seiko Epson Corp | Photomask and manufacture of semiconductor device |
| JPH0545710U (en) * | 1991-11-26 | 1993-06-18 | 凸版印刷株式会社 | Pellicle frame |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999049366A1 (en) * | 1998-03-20 | 1999-09-30 | Nikon Corporation | Photomask and projection exposure system |
| US6627365B1 (en) | 1998-03-20 | 2003-09-30 | Nikon Corporation | Photomask and projection exposure apparatus |
| KR100698602B1 (en) * | 1999-04-02 | 2007-03-21 | 신에쓰 가가꾸 고교 가부시끼가이샤 | Pellicle for photolithography |
| US6665049B1 (en) | 1999-08-10 | 2003-12-16 | Nikon Corporation | Photomask, method for manufacturing the same, projection aligner using the photomask, and projection exposing method |
| EP1160624A2 (en) * | 2000-06-01 | 2001-12-05 | Asahi Glass Company Ltd. | Pellicle and method of using the same |
| EP1160624A3 (en) * | 2000-06-01 | 2003-10-22 | Asahi Glass Company Ltd. | Pellicle and method of using the same |
| JP2005165141A (en) * | 2003-12-04 | 2005-06-23 | Semiconductor Leading Edge Technologies Inc | Method for manufacturing pellicle |
| US10488751B2 (en) | 2014-09-19 | 2019-11-26 | Mitsui Chemicals, Inc. | Pellicle, production method thereof, exposure method |
| US10585348B2 (en) * | 2014-09-19 | 2020-03-10 | Mitsui Chemicals, Inc. | Pellicle, pellicle production method and exposure method using pellicle |
| KR20180109177A (en) * | 2017-03-27 | 2018-10-08 | 삼성전자주식회사 | Method of manufacturing pellicle and apparatus for assembling pellicle |
Also Published As
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|---|---|
| JP3529062B2 (en) | 2004-05-24 |
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