JPH08148842A - Electronic apparatus - Google Patents
Electronic apparatusInfo
- Publication number
- JPH08148842A JPH08148842A JP28316494A JP28316494A JPH08148842A JP H08148842 A JPH08148842 A JP H08148842A JP 28316494 A JP28316494 A JP 28316494A JP 28316494 A JP28316494 A JP 28316494A JP H08148842 A JPH08148842 A JP H08148842A
- Authority
- JP
- Japan
- Prior art keywords
- cover
- circuit board
- printed circuit
- conductive member
- insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Casings For Electric Apparatus (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は特に、車両用エンジンを
制御し、複数の電子素子が実装されたプリント基板と、
前記プリント基板を収容する導電部材で形成されるケー
スと、前記ケースの上下開口部を覆うカバーとを備えた
電子制御装置（以下ＥＣＵと記す）に関するものであ
る。BACKGROUND OF THE INVENTION The present invention particularly relates to a printed circuit board for controlling a vehicle engine and having a plurality of electronic elements mounted thereon,
The present invention relates to an electronic control device (hereinafter referred to as ECU) including a case formed of a conductive member that accommodates the printed circuit board, and a cover that covers upper and lower openings of the case.
【０００２】[0002]
【従来の技術】前記ＥＣＵは複数の電子回路部品が両面
に実装されたプリント基板と、このプリント基板を包
囲、保持するケースと、前記ケースの上下開口部を覆う
金属製のカバーとからなっているが、前記ＥＣＵでは何
らかの外力が前記カバーに印加され、前記カバーは前記
ＥＣＵ内部に向かって変形した場合、前記カバーが前記
プリント基板の導電部材あるいは素子リードの半田付け
部と電気的に接触し、回路ショートに至り、前記ＥＣＵ
の致命的な破壊となる。2. Description of the Related Art The ECU comprises a printed circuit board having a plurality of electronic circuit components mounted on both sides, a case surrounding and holding the printed circuit board, and a metal cover for covering the upper and lower openings of the case. However, when some external force is applied to the cover in the ECU and the cover is deformed toward the inside of the ECU, the cover electrically contacts the conductive member of the printed circuit board or the soldering portion of the element lead. , Circuit short circuit, and the ECU
Will be a fatal destruction of.
【０００３】このため、従来では前記カバー内側の絶縁
フィルムの貼り付け、または、樹脂等で形成された絶縁
性のスペーサをプリント基板に付設するといった電気的
絶縁部品を採用している。For this reason, conventionally, an electrically insulating component such as an insulating film attached to the inside of the cover or an insulating spacer made of resin or the like attached to a printed circuit board has been used.
【０００４】[0004]
【発明が解決しようとする課題】上記ＥＣＵ構成では絶
縁部品が必要であるため、部品点数の増加による組み付
け手番の増加、コストアップ、また、回路設計、プリン
ト基板設計する上での部品選択、部品実装位置に制約を
与えることになる。本発明は、上記のような事情に鑑み
てなされたものであり、前記カバーに外力が印加された
時、電気的絶縁を保ちながら、部品点数を削減し、組み
付け手番の削減及びコストダウンを目的とする。Since the above-mentioned ECU structure requires insulating parts, an increase in the number of parts, an increase in the number of parts to be assembled, an increase in cost, and selection of parts in circuit design and printed circuit board design, It imposes restrictions on the component mounting position. The present invention has been made in view of the circumstances as described above, and when an external force is applied to the cover, while maintaining electrical insulation, the number of parts is reduced, the number of assembly steps is reduced, and the cost is reduced. To aim.
【０００５】[0005]
【課題を解決するための手段】本発明は、前記問題点を
解決するために、複数の電子回路部品が実装されるとと
もに、導電部材が露出した面を有するプリント基板と、
前記プリント基板が収容されるケースと、少なくとも前
記プリント基板の導電部材が露出した面に対向する部分
が導電部材で形成されるカバーとを備えた電子機器にお
いて、前記カバーと対向する前記プリント基板導電部材
露出面に、前記複数の電子回路部品に包含されるととも
に前記カバー最近接部が絶縁部材にて形成された絶縁電
子回路部品を実装したことを特徴とする電子機器を提供
するものである。In order to solve the above-mentioned problems, the present invention provides a printed circuit board having a plurality of electronic circuit components mounted thereon and having a surface on which a conductive member is exposed,
In an electronic device including a case in which the printed circuit board is housed and a cover in which at least a portion of the printed circuit board facing the exposed surface of the conductive member is formed of a conductive material, the printed circuit board conductive surface facing the cover is provided. Provided is an electronic device, wherein an insulated electronic circuit component, which is included in the plurality of electronic circuit components and has the cover closest portion formed of an insulating member, is mounted on a member exposed surface.
【０００６】また、絶縁電子回路部品と、前記ケースと
は接触させてもよい。Further, the insulating electronic circuit component and the case may be brought into contact with each other.
【０００７】[0007]
【作用及び発明の効果】本発明は、前記カバーと対向す
る前記プリント基板導電部材露出面に前記カバー最近接
部が絶縁部材にて形成された絶縁電子回路部品を実装す
ることで、前記カバーに外力が印加されても絶縁電子回
路部品の絶縁部材にカバーの導電部材が接触して、カバ
ーとプリント基板との間の絶縁が保たれるため、部品点
数の削減及びコストダウンを実現した上で、前記外力が
前記ケースに印加された時においても、電気的ショート
が回避できる効果がある。According to the present invention, by mounting an insulating electronic circuit component in which the closest portion of the cover is formed of an insulating member on the exposed surface of the printed circuit board conductive member facing the cover, the cover is mounted on the cover. Even if an external force is applied, the conductive member of the cover comes into contact with the insulating member of the insulated electronic circuit component, and the insulation between the cover and the printed circuit board is maintained, thus reducing the number of components and reducing the cost. Also, even when the external force is applied to the case, there is an effect that an electrical short circuit can be avoided.
【０００８】[0008]
【実施例】以下、本発明を適用した前記カバーと対向す
る前記プリント基板の導電部材露出面に前記カバー最近
接部が絶縁部材にて形成された絶縁電子回路部品を実装
した時の一実施例を図面を用いて説明する。図１、図２
は本発明のＥＣＵの構成を示しており、その構成は両面
に電子回路部品５、６、７を搭載したプリント基板１
と、このプリント基板１を密閉して包囲、保持するケー
ス２と、この開口部を覆う鉄、アルミ等の金属製カバー
３とから成る。EXAMPLE An example of mounting an insulating electronic circuit component in which the closest part of the cover is formed of an insulating member on the exposed surface of the conductive member of the printed circuit board facing the cover to which the present invention is applied will be described below. Will be described with reference to the drawings. 1 and 2
Shows the structure of the ECU of the present invention, which is a printed circuit board 1 having electronic circuit parts 5, 6, 7 mounted on both sides.
And a case 2 for hermetically surrounding and holding the printed circuit board 1, and a metal cover 3 made of iron, aluminum or the like for covering the opening.
【０００９】ケース２は図１に示すように例えば、アル
ミニウムのダイカスト鋳造により成形された片側開口の
四角箱であって、ケース２の片側開口面側内壁面の複数
箇所には内側へ張り出して形成されたプリント基板１を
固定するための棚部２１と、プリント基板１及びカバー
３締め付け用雌ネジ部２２が形成されている。プリント
基板１は電子回路部品５、６、７を搭載するとともに、
ケース２の雌ネジ部２２に対応した位置にケース２との
締め付け用の複数の締め付け用穴部１１が形成されてお
り、ネジ４により棚部２１に締め付けられる。As shown in FIG. 1, the case 2 is, for example, a square box having one side opening formed by die casting of aluminum. The case 2 is formed by projecting inward at a plurality of locations on the inner wall surface of the one side opening surface. A shelf portion 21 for fixing the printed circuit board 1 and a female screw portion 22 for tightening the printed circuit board 1 and the cover 3 are formed. The printed circuit board 1 has electronic circuit components 5, 6 and 7 mounted thereon,
A plurality of tightening holes 11 for tightening with the case 2 are formed at positions corresponding to the female screw parts 22 of the case 2, and are tightened to the shelf part 21 with the screws 4.
【００１０】カバー３は全周にわたり形成された絞り部
３２と、ケース２の雌ネジ部２２に対応したケース２と
の締め付け用の複数の締め付け用穴部３３とからなり、
プレス等により一体形成される。本実施例では、プリン
ト基板１のカバー３側の面（以下半田面１２と記す）に
素子リード５２が電気的絶縁性がある樹脂によりモール
ドされている素子の上面部５１の高さよりも低い位置か
らでている絶縁電子回路部品をなすＱＦＰ素子５を配置
する。以上のような構成とすることにより、カバー３に
外力が印加され変形しても絶縁電子回路部品の絶縁部材
にカバー３が接触する。これによりプリント基板１上に
実装された電子回路部品６のリード半田付け部６１、チ
ップ素子としての電子回路部品７の半田付け部といった
プリント基板１のカバー側に露出した導電部材と、カバ
ー３の導電部材との間の絶縁が保たれるため、部品点数
の削減及びコストダウンを実現した上で、電気的ショー
トが回避できる尚、上記絶縁電子回路部品は前記素子リ
ード５２が電気的絶縁性がある樹脂によりモールドされ
ている素子の上面部の高さよりも低い位置からでている
電子素子であり、外力によるカバー３の変形時にプリン
ト基板１に露出した導電部材とカバー３の導電部材との
間の絶縁を保つものであればよく、トランジスタ等の電
子素子を配置した場合や、複数の絶縁電子回路部品を配
置した場でも同様の効果が得られる。また、素子の放熱
効果向上を図る為、図３に示すようにカバー３の裏主面
３４と前記素子リード５２が電気的絶縁性がある樹脂５
１によりモールドされている素子５の上面部とは接触さ
せてもよい。The cover 3 comprises a narrowed portion 32 formed over the entire circumference and a plurality of tightening holes 33 for tightening the case 2 corresponding to the female screw portion 22 of the case 2.
It is integrally formed by a press or the like. In this embodiment, a position lower than the height of the upper surface portion 51 of the element in which the element lead 52 is molded on the surface of the printed board 1 on the cover 3 side (hereinafter referred to as the solder surface 12) with the electrically insulating resin. The QFP element 5 forming the insulated electronic circuit component is placed. With the above-described configuration, the cover 3 contacts the insulating member of the insulated electronic circuit component even if the cover 3 is deformed by an external force applied thereto. As a result, the conductive member exposed on the cover side of the printed circuit board 1 such as the lead soldering portion 61 of the electronic circuit component 6 mounted on the printed circuit board 1, the soldering portion of the electronic circuit component 7 as a chip element, and the cover 3 Since the insulation with the conductive member is maintained, the number of parts can be reduced and the cost can be reduced, and an electrical short circuit can be avoided. Further, in the above insulated electronic circuit component, the element lead 52 has an electrical insulation property. It is an electronic element that is emitted from a position lower than the height of the upper surface of the element molded by a certain resin, and is between the conductive member exposed on the printed board 1 and the conductive member of the cover 3 when the cover 3 is deformed by an external force. The same effect can be obtained when an electronic element such as a transistor is arranged or when a plurality of insulating electronic circuit parts are arranged. Further, in order to improve the heat radiation effect of the element, as shown in FIG. 3, the back main surface 34 of the cover 3 and the element lead 52 are made of a resin 5 having an electrical insulation property.
You may make it contact with the upper surface part of the element 5 molded by 1.
【図１】本発明の一実施例を示す分解斜視図である。FIG. 1 is an exploded perspective view showing an embodiment of the present invention.
【図２】図１のＡ−Ａ断面図である。FIG. 2 is a sectional view taken along line AA of FIG.
【図３】本発明の他の実施例を示す断面図である。FIG. 3 is a sectional view showing another embodiment of the present invention.
１ プリント基板 ２ ＥＣＵケース ３ ＥＣＵカバー ５ ＱＦＰ素子 1 printed circuit board 2 ECU case 3 ECU cover 5 QFP element
Claims (2)
に、導電部材が露出した面を有するプリント基板と、前
記プリント基板が収容されるケースと、少なくとも前記
プリント基板の導電部材が露出した面に対向する部分が
導電部材で形成されるカバーとを備えた電子機器におい
て、 前記カバーと対向する前記プリント基板導電部材露出面
に、前記複数の電子回路部品に包含されるとともに前記
カバー最近接部が絶縁部材にて形成された絶縁電子回路
部品を実装したことを特徴とする電子機器。1. A printed circuit board on which a plurality of electronic circuit components are mounted and which has a conductive member exposed, a case in which the printed circuit board is accommodated, and at least a surface of the printed circuit board where the conductive member is exposed. In an electronic device including a cover in which a facing portion is formed of a conductive member, the printed board conductive member exposed surface facing the cover includes the plurality of electronic circuit components and the cover closest portion. An electronic device having an insulating electronic circuit component formed of an insulating member mounted thereon.
接触させることを特徴とする請求項１記載の電子機器。2. The electronic device according to claim 1, wherein the insulating electronic circuit component and the cover are brought into contact with each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28316494A JPH08148842A (en) | 1994-11-17 | 1994-11-17 | Electronic apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28316494A JPH08148842A (en) | 1994-11-17 | 1994-11-17 | Electronic apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08148842A true JPH08148842A (en) | 1996-06-07 |
Family
ID=17662019
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28316494A Pending JPH08148842A (en) | 1994-11-17 | 1994-11-17 | Electronic apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08148842A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7120030B2 (en) | 2002-11-14 | 2006-10-10 | Mitsubishi Denki Kabushiki Kaisha | Housing structure of vehicle-mounted electronic equipment |
| JP2006344687A (en) * | 2005-06-07 | 2006-12-21 | Denso Corp | Cabinet for electronic device |
| US7601011B2 (en) | 2006-08-04 | 2009-10-13 | The Furukawa Electric Co., Ltd. | Electrical connecting box and method for protecting printed circuit board and mounted parts inside the electrical connecting box |
| JP2012104797A (en) * | 2010-11-12 | 2012-05-31 | Kmw Inc | Housing for communication |
| JP2015501754A (en) * | 2011-12-08 | 2015-01-19 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツングＲｏｂｅｒｔ Ｂｏｓｃｈ Ｇｍｂｈ | Electronic module structure between the transmission compartment and the engine compartment |
| CN105799535A (en) * | 2016-05-06 | 2016-07-27 | 合肥国轩高科动力能源有限公司 | Installation mode of slave control module of electric automobile |
| WO2016122522A1 (en) * | 2015-01-29 | 2016-08-04 | Hewlett-Packard Development Company, L.P. | Printed circuit board component cover |
| DE102015220949A1 (en) | 2015-03-02 | 2016-09-08 | Mitsubishi Electric Corporation | Electronic device |
-
1994
- 1994-11-17 JP JP28316494A patent/JPH08148842A/en active Pending
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7120030B2 (en) | 2002-11-14 | 2006-10-10 | Mitsubishi Denki Kabushiki Kaisha | Housing structure of vehicle-mounted electronic equipment |
| JP2006344687A (en) * | 2005-06-07 | 2006-12-21 | Denso Corp | Cabinet for electronic device |
| US7601011B2 (en) | 2006-08-04 | 2009-10-13 | The Furukawa Electric Co., Ltd. | Electrical connecting box and method for protecting printed circuit board and mounted parts inside the electrical connecting box |
| JP2012104797A (en) * | 2010-11-12 | 2012-05-31 | Kmw Inc | Housing for communication |
| CN104333986A (en) * | 2010-11-12 | 2015-02-04 | K.M.W.株式会社 | Communication box |
| JP2015501754A (en) * | 2011-12-08 | 2015-01-19 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツングＲｏｂｅｒｔ Ｂｏｓｃｈ Ｇｍｂｈ | Electronic module structure between the transmission compartment and the engine compartment |
| WO2016122522A1 (en) * | 2015-01-29 | 2016-08-04 | Hewlett-Packard Development Company, L.P. | Printed circuit board component cover |
| TWI615081B (en) * | 2015-01-29 | 2018-02-11 | 惠普發展公司有限責任合夥企業 | Printed circuit board component cover, system for protecting components on a printed circuit board and method of protecting a printed circuit board |
| US10772186B2 (en) | 2015-01-29 | 2020-09-08 | Hewlett-Packard Development Company, L.P. | Printed circuit board component cover |
| DE102015220949A1 (en) | 2015-03-02 | 2016-09-08 | Mitsubishi Electric Corporation | Electronic device |
| US9844140B2 (en) | 2015-03-02 | 2017-12-12 | Mitsubishi Electric Corporation | Electronic device |
| CN105799535A (en) * | 2016-05-06 | 2016-07-27 | 合肥国轩高科动力能源有限公司 | Installation mode of slave control module of electric automobile |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6222732B1 (en) | Electrical device, in particular a switching and control unit for motor vehicles | |
| US4204248A (en) | Heat transfer mounting arrangement for a solid state device connected to a circuit board | |
| US7203073B2 (en) | Circuit-constituting member and circuit unit | |
| US4858071A (en) | Electronic circuit apparatus | |
| US5946192A (en) | Power transistor module packaging structure | |
| JP4709454B2 (en) | Electronic control unit | |
| US5461542A (en) | Multi-board electrical control device | |
| JPH07193187A (en) | Electronic device having both heat sink and electric contact on single plane | |
| JP2017163810A (en) | Electric motor control device | |
| US20060240689A1 (en) | Mounting structure of high frequency apparatus | |
| JPH08148842A (en) | Electronic apparatus | |
| JPH08195568A (en) | Electronic device and method of assembling | |
| JP4089300B2 (en) | Substrate storage box | |
| JP2002324989A (en) | Heat radiating structure for printed circuit board | |
| US10681848B2 (en) | ECU, control box and CFM having the same | |
| JP2671700B2 (en) | Electrical equipment | |
| JPH0617353Y2 (en) | Electronic device housing structure | |
| JP2001223489A (en) | Electronic control device for vehicle | |
| JP3754197B2 (en) | Hybrid integrated circuit device | |
| JPS5910796Y2 (en) | Cooling structure for electrical equipment | |
| WO2023276647A1 (en) | Circuit structure and electrical junction box | |
| WO2020017470A1 (en) | Substrate structure | |
| JP2563680Y2 (en) | Power unit | |
| JPH0451486Y2 (en) | ||
| JPH1154961A (en) | Structure of electrical connection between printed wiring board and case |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A131 | Notification of reasons for refusal |
Effective date: 20040831 Free format text: JAPANESE INTERMEDIATE CODE: A131 |
|
| A521 | Written amendment |
Effective date: 20041029 Free format text: JAPANESE INTERMEDIATE CODE: A523 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20050419 |