JPH08130363A - Bond used for preliminarily fastening electronic part and soldering method of electronic part - Google Patents

Bond used for preliminarily fastening electronic part and soldering method of electronic part

Info

Publication number
JPH08130363A
JPH08130363A JP26716094A JP26716094A JPH08130363A JP H08130363 A JPH08130363 A JP H08130363A JP 26716094 A JP26716094 A JP 26716094A JP 26716094 A JP26716094 A JP 26716094A JP H08130363 A JPH08130363 A JP H08130363A
Authority
JP
Japan
Prior art keywords
solder
electronic component
bond
substrate
melting point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP26716094A
Other languages
Japanese (ja)
Other versions
JP3146888B2 (en
Inventor
Yoshiyuki Wada
義之 和田
Tadahiko Sakai
忠彦 境
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP26716094A priority Critical patent/JP3146888B2/en
Publication of JPH08130363A publication Critical patent/JPH08130363A/en
Application granted granted Critical
Publication of JP3146888B2 publication Critical patent/JP3146888B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3431Leadless components

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE: To enable an electronic part to be firmly soldered without impeding a self- aligning effect by a method wherein the curing temperature of bonding material used for preliminarily fastening an electronic part to a board is set higher than the melting point of solder, and a holding power of the bonding material at a temperature at which solder is melted is set lower than that at a room temperature. CONSTITUTION: Cream solder 3 is applied onto circuit patterns 2 formed on a board 1 through a screen printing method, and preliminarily fastening bond 7 is applied onto a space between the circuit patterns 2 on the upside of the board 1. An electronic part 4 is mounted on the cream solder 3 provided onto the circuit patterns 2. Then, the board 1 is introduced into a reflow device, quickly heated up to a temperature of 150 deg.C or so from a room temperature, and left to stand for 30 minutes at a temperature of 150 deg.C or so, when the preliminarily fastening bond starts spreading over the board 1 as it melts. When the board 1 is heated up to higher temperatures, the cream solder 3 turns into a molten solder 6 at the melting point of solder to put the square chip 4 in a self-aligned state. Then, the board 1 is cooled down to solidify the molten solder 6, whereby a firm soldering operation is carried out.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、電子部品の仮止め用ボ
ンド及び電子部品の半田付け方法に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bond for temporarily fixing electronic parts and a method for soldering electronic parts.

【0002】[0002]

【従来の技術】従来、基板に電子部品を面実装(特に両
面実装)する際、電子部品の仮止め用ボンドが用いられ
ている。この電子部品の仮止め用ボンドは、基板の回路
パターンにクリーム半田を塗布した後、基板に塗られ、
次に搭載される電子部品の下面と基板との間に介在し
て、クリーム半田の溶融固化が完了するまで、電子部品
を仮接着するために使用される。
2. Description of the Related Art Conventionally, when surface-mounting (particularly double-sided) an electronic component on a substrate, a bond for temporarily fixing the electronic component is used. This temporary bond for electronic parts is applied to the board after applying cream solder to the circuit pattern of the board,
It is interposed between the lower surface of the electronic component to be mounted next and the substrate, and is used for temporarily adhering the electronic component until the melting and solidification of the cream solder is completed.

【0003】以下従来の電子部品の仮止め用ボンドを用
いた工程について、図7、図8を参照しながら説明す
る。図7(a)〜(e)は従来の工程を電子部品の上方
からみた工程説明図、図8(a)〜(e)は従来の工程
を電子部品の側方からみた工程説明図である。
A conventional process for using a temporary bonding bond for an electronic component will be described below with reference to FIGS. 7 and 8. 7A to 7E are process explanatory views of the conventional process as viewed from above the electronic component, and FIGS. 8A to 8E are process explanatory diagrams of the conventional process as viewed from the side of the electronic component. .

【0004】まず図7(a)、図8(a)に示すよう
に、電子部品の一例としての角チップ4をクリーム半田
3、従来の仮止め用ボンド5の上に搭載した状態から説
明する。なお、1は基板、2は基板1に形成された回路
パターンであり、回路パターン2の上にクリーム半田3
が塗布されている。以下クリーム半田3を用いて角チッ
プ4の固着を行う場合を述べるが、クリーム半田3でな
く半田レベラ工法や半田メッキ工法等による場合にも、
同様の問題点がある。
First, as shown in FIGS. 7 (a) and 8 (a), a state in which a square chip 4 as an example of an electronic component is mounted on a cream solder 3 and a conventional temporary bonding bond 5 will be described. . 1 is a substrate, 2 is a circuit pattern formed on the substrate 1, and cream solder 3 is provided on the circuit pattern 2.
Has been applied. Hereinafter, the case where the square chip 4 is fixed by using the cream solder 3 will be described. However, when the solder leveler method or the solder plating method is used instead of the cream solder 3,
There are similar problems.

【0005】さて、図7(a)、図8(a)に示すよう
に、一般に角チップ4はいわゆる理想位置にあるように
実装されず、傾きや位置ずれを生じていることが多い。
この傾きや位置ずれなどは、半田が溶融した際における
セルフアライメント(溶けた半田の表面張力によって位
置ずれを生じている電子部品が正規の位置に戻る現象)
によって矯正されるように予定されている。
Now, as shown in FIGS. 7 (a) and 8 (a), generally, the corner chip 4 is not mounted so as to be in a so-called ideal position, and an inclination or a positional shift is often generated.
This tilt or misalignment causes self-alignment when the solder melts (a phenomenon in which an electronic component that is misaligned due to the surface tension of the melted solder returns to its normal position).
Scheduled to be corrected by.

【0006】また、従来の仮止め用ボンド5は、角チッ
プ4を早めに仮接着すべく、硬化開始温度が半田の融点
よりも低くなっており、半田が溶ける前に硬化する。
Further, the conventional temporary bonding bond 5 has a curing start temperature lower than the melting point of the solder in order to temporarily bond the square chip 4 earlier, and is cured before the solder is melted.

【0007】さて図7(b)、図8(b)に示すよう
に、基板1をリフロー装置などの加熱手段に入れ、半田
の融点よりも低い温度(約150℃)で加熱すると仮止
め用ボンド5が硬化する(図7(c)、図8(c))。
ここで、クリーム半田3は未だ融点に達していないの
で、セルフアライメントは発生しない。従って、角チッ
プ4は、硬化した仮止め用ボンド5により位置ずれなど
を生じたまま、位置を拘束されてしまう。
Now, as shown in FIGS. 7 (b) and 8 (b), when the substrate 1 is put in a heating means such as a reflow device and heated at a temperature lower than the melting point of the solder (about 150 ° C.), it is temporarily fixed. The bond 5 is cured (FIGS. 7C and 8C).
Here, since the cream solder 3 has not yet reached the melting point, self-alignment does not occur. Therefore, the position of the square chip 4 is restricted while the position of the square chip 4 is displaced by the cured temporary bonding bond 5.

【0008】そして、図7(d)、図8(d)に示すよ
うに、さらに加熱して、半田の融点(通常183℃)に
達すると、クリーム半田3は溶けた半田6となる。ここ
で、半田が溶けると若干体積が減少し、溶けた半田6は
その表面張力により回路パターン2付近(すなわち下
方)に丸く凝集する。この際、クリーム半田3の量がわ
ずかでも少ないと、角チップ4は仮止め用ボンド5によ
って、上下方向についての移動を規制されているので、
溶けた半田6が完全に角チップ4から離れてしまい(こ
の現象を半田オープンという)、角チップ4は接続不良
になる。
Then, as shown in FIGS. 7 (d) and 8 (d), when further heating reaches the melting point of the solder (usually 183 ° C.), the cream solder 3 becomes the melted solder 6. Here, when the solder is melted, the volume is slightly reduced, and the melted solder 6 is roundly aggregated in the vicinity of the circuit pattern 2 (that is, below) due to the surface tension. At this time, if the amount of the cream solder 3 is small, the square chip 4 is restricted from moving in the vertical direction by the temporary fixing bond 5.
The melted solder 6 is completely separated from the corner chip 4 (this phenomenon is referred to as solder open), and the corner chip 4 has a poor connection.

【0009】[0009]

【発明が解決しようとする課題】上述したように、従来
の仮止め用ボンドは、セルフアライメントを阻害するば
かりでなく半田オープンを招きやすいという問題点があ
った。
As described above, the conventional temporary bonding bond has a problem that it not only hinders self-alignment but also easily causes solder opening.

【0010】そこで本発明は、セルフアライメントを阻
害せず、確実な半田付けを実現できる電子部品の仮止め
用ボンド及び電子部品の半田付け方法を提供することを
目的とする。
Therefore, it is an object of the present invention to provide a bond for electronic component temporary fixing and a method of soldering an electronic component that can realize reliable soldering without hindering self-alignment.

【0011】[0011]

【課題を解決するための手段】本発明の電子部品の仮止
め用ボンドは、硬化温度が半田の融点より高く、且つ半
田溶融時における電子部品を保持する保持力が室温時よ
りも低く形成されている。
The bond for temporary fixing of electronic parts of the present invention is formed such that the curing temperature is higher than the melting point of the solder and the holding force for holding the electronic part when the solder is melted is lower than that at room temperature. ing.

【0012】[0012]

【作用】上記構成において、硬化開始温度が半田の融点
以上であるので、電子部品の仮止め用ボンドよりも、半
田が先に溶融し、確実にセルフアライメントが発生し
て、電子部品の位置ずれの矯正が済んだあとに、電子部
品の仮止め用ボンドが硬化し、電子部品の仮接着が行わ
れる。
In the above structure, since the curing start temperature is equal to or higher than the melting point of the solder, the solder is melted before the temporary fixing bond of the electronic component, and the self-alignment is surely generated, resulting in the displacement of the electronic component. After the correction is completed, the temporary fixing bond of the electronic component is cured and the electronic component is temporarily bonded.

【0013】[0013]

【実施例】次に図面を参照しながら、本発明の実施例を
説明する。ここで、従来の技術を示す図7〜図8の構成
要素と同様の構成要素については同一符号を付すことに
より、説明を省略する。
Embodiments of the present invention will now be described with reference to the drawings. Here, the same components as those of FIGS. 7 to 8 showing the conventional technique are designated by the same reference numerals, and the description thereof will be omitted.

【0014】まず、本明細書に言う広がり率を定義す
る。図1(a)〜(c)は、本発明の一実施例における
広がり率の説明図である。
First, the spread rate referred to in this specification is defined. 1 (a) to 1 (c) are explanatory views of the spread rate in one embodiment of the present invention.

【0015】まず図1(b)に示すように、ガラスエポ
キシからなる主剤1aにレジスト膜1bが形成された基
板1のレジスト膜1b上に、約0.5mgの仮止め用ボ
ンド7を点状に塗布し、約5分間放置した時の仮止め用
ボンド7の広がりD1(直径)を計測する。この時の温
度は室温(25℃)である。次に仮止め用ボンド7が塗
布された基板1を加熱炉に入れ、図1(b)に示すよう
に条件温度(150℃)で30秒間加熱する。次に加熱
された基板1を加熱炉から取り出して、仮止め用ボンド
7の広がりD2(直径)を計測する。そして広がり率
は、次の式で求める。
First, as shown in FIG. 1 (b), about 0.5 mg of a temporary bonding bond 7 is spotted on the resist film 1b of the substrate 1 in which the resist film 1b is formed on the base material 1a made of glass epoxy. Then, the spread D1 (diameter) of the temporary-bonding bond 7 is measured when the adhesive is applied to the substrate and left for about 5 minutes. The temperature at this time is room temperature (25 ° C.). Next, the substrate 1 coated with the temporary bonding bond 7 is put into a heating furnace and heated at a condition temperature (150 ° C.) for 30 seconds as shown in FIG. Next, the heated substrate 1 is taken out of the heating furnace, and the spread D2 (diameter) of the temporary bonding bond 7 is measured. Then, the spread rate is calculated by the following formula.

【0016】 広がり率=100×(D2−D1)/D1(%) 次に本実施例の仮止め用ボンド7の組成を(表1)を参
照しながら説明する。本実施例の仮止め用ボンド7の配
合例は、(表1)に示すとおりである。
Spread rate = 100 × (D2−D1) / D1 (%) Next, the composition of the temporary bonding bond 7 of this embodiment will be described with reference to (Table 1). A compounding example of the temporary bonding bond 7 of this example is as shown in (Table 1).

【0017】[0017]

【表1】 [Table 1]

【0018】すなわち、主剤について、従来の仮止め用
ボンド5では、ビスフェノールA型エポキシ樹脂のみで
あったものを、本実施例の仮止め用ボンド7では、第1
例として、ビスフェノールA型エポキシ樹脂を80重量
%、多官能型エポキシ樹脂を20重量%としている。又
第2例として、ビスフェノールA型エポキシ樹脂を70
重量%、多官能型エポキシ樹脂を30重量%としてい
る。またフィラーについても、従来品では50重量%で
あったものを、第1例では10重量%、第2例では5重
量%としている。
That is, regarding the main agent, the conventional temporary bonding bond 5 was made of only the bisphenol A type epoxy resin, while the temporary bonding bond 7 of this embodiment was
As an example, the bisphenol A type epoxy resin is 80% by weight and the polyfunctional type epoxy resin is 20% by weight. Also, as a second example, a bisphenol A type epoxy resin 70
% By weight, and 30% by weight of polyfunctional epoxy resin. Also, regarding the filler, the content of the conventional product was 50% by weight, whereas that of the first example was 10% by weight and that of the second example was 5% by weight.

【0019】このように多官能型エポキシ樹脂を配合
し、かつフィラーの量を少なくすることにより、従来品
に比べて室温時では同等の粘度を保ち、150℃付近で
は低い粘度をもつようになり、広がりやすくなる。
By blending the polyfunctional epoxy resin and reducing the amount of the filler as described above, the same viscosity is maintained at room temperature as compared with the conventional product, and the viscosity becomes low at around 150 ° C. , Easy to spread.

【0020】硬化剤は、従来2−メチルイミダゾールを
5重量%入れていたが、本実施例の仮止め用ボンド7で
は、2,4−ジアミノ−6−[2−ウンデシルイミダゾ
ール−(1)]−エチル−S−トリアジンを5重量%入
れている。これにより、仮止め用ボンド7の硬化条件を
従来品では150℃30秒であったものを200℃30
秒以内とし、半田が溶融した後で仮止め用ボンド7が硬
化するようにしている。これにより、溶融した半田によ
る電子部品のセルフアライメントを妨げないといった効
果がある。このほか、硬化剤として、イソフタル酸ヒド
ラシド、2,4−ジアミノ−6−[2−ウンデシルイミ
ダゾリル−(1)]−エチル−S−トリアジン、ジシア
ンジアミド、2,4−ジアミノ−6−[2−エチル−4
−メチルイミダゾリル−(1)]−エチル−S−トリア
ジン、ジアミノマレオニトリルの一種又は二種以上の組
み合わせを用いても、同様の作用効果が得られる。
Conventionally, 5% by weight of 2-methylimidazole was added as the curing agent, but in the bond 7 for temporary fixing of this example, 2,4-diamino-6- [2-undecylimidazole- (1) was used. ] 5% by weight of -ethyl-S-triazine is added. As a result, the curing condition of the temporary fixing bond 7 is 150 ° C. for 30 seconds in the conventional product and 200 ° C. for 30 seconds.
The time is set to within a second, and after the solder is melted, the temporary bonding bond 7 is cured. This has the effect of not hindering the self-alignment of the electronic component by the molten solder. In addition, as a curing agent, isophthalic acid hydraside, 2,4-diamino-6- [2-undecylimidazolyl- (1)]-ethyl-S-triazine, dicyandiamide, 2,4-diamino-6- [2- Ethyl-4
Similar effects can be obtained by using one or a combination of two or more of -methylimidazolyl- (1)]-ethyl-S-triazine and diaminomaleonitrile.

【0021】次に添加剤については、第1例、第2例と
もに水添ヒマシ油を1重量%加えている。これらの添加
剤は、主剤の室温時の粘度を高く保つが、150℃付近
ではその効果がなくなるため、高温(約150℃)で仮
止め用ボンド7の粘度が下がってだれるようになる。つ
まり前述した広がり率を大きくするといった効果があ
る。また第1例や第2例では、従来品に比べてフィラー
の量が少ないので、仮止め用ボンド7は一段とだれやす
くなっている。仮止め用ボンド7がだれると電子部品の
保持力も弱くなるので、溶けた半田のセルフアライメン
ト作用によって電子部品は容易にその位置を変えること
ができる。なお、水添ヒマシ油に代えて脂肪酸アマイド
ワックス、有機ベントナイト、ゼラチン、ベンズアルデ
ヒド縮合体、セルロースの少なくとも1種を配合しても
よい。
Next, regarding the additive, 1% by weight of hydrogenated castor oil was added in both the first and second examples. These additives keep the viscosity of the main component at room temperature high, but lose their effect at around 150 ° C., so that the viscosity of the temporary bonding bond 7 decreases at high temperature (about 150 ° C.). That is, there is an effect of increasing the above-mentioned spread rate. In addition, in the first and second examples, since the amount of the filler is smaller than that of the conventional product, the temporary bonding bond 7 is more likely to sag. Since the holding force of the electronic component is weakened when the temporary bonding bond 7 sags, the position of the electronic component can be easily changed by the self-alignment action of the melted solder. At least one of fatty acid amide wax, organic bentonite, gelatin, benzaldehyde condensate, and cellulose may be blended instead of hydrogenated castor oil.

【0022】次に図4を参照しながら、本実施例の仮止
め用ボンド7の広がり率について説明する。図4は、半
田付け工程における本発明の一実施例における仮止め用
ボンドの広がり率を示すグラフである。図4に示すよう
に、この広がり率は、半田の融点より低い130℃程度
で急上昇し半田の融点付近で100%以上となってい
る。すなわち、半田の融点の前後で電子部品の上下方向
及び水平面内の移動を許容することを示している。
Next, with reference to FIG. 4, the spreading rate of the temporary bonding bond 7 of this embodiment will be described. FIG. 4 is a graph showing the spread rate of the temporary bonding bond in one embodiment of the present invention in the soldering process. As shown in FIG. 4, the spread rate sharply increases at about 130 ° C., which is lower than the melting point of the solder, and is 100% or more near the melting point of the solder. That is, it indicates that the electronic component is allowed to move in the vertical direction and in the horizontal plane before and after the melting point of the solder.

【0023】また本発明者らは、本実施例の第1例、第
2例の仮止め用ボンド7について、電子部品保持限界加
速度を測定したので、これを図5(本発明の一実施例に
おける仮止め用ボンドの電子部品保持限界加速度を示す
グラフ)を参照しながら説明する。この電子部品保持限
界加速度の測定は、図6(本発明の一実施例における電
子部品保持限界加速度の説明図)に示す要領で計測し
た。すなわち、角速度を自在に可変できる回転テーブル
を用意し、この回転テーブル上に本実施例の仮止め用ボ
ンド7で仮接着した電子部品を載置し、温度をパラメー
タとして電子部品が回転テーブルからはずれるときの角
速度を計測し、このときの半径方向の加速度を求め、こ
の加速度を電子部品保持限界加速度としたものである。
The inventors of the present invention measured the holding acceleration limit of the electronic parts of the temporary bonding bond 7 of the first and second examples of the present embodiment. (Graph showing the electronic component holding limit acceleration of the temporary bonding bond) in FIG. The measurement of the electronic component holding limit acceleration was performed according to the procedure shown in FIG. 6 (an explanatory diagram of the electronic component holding limit acceleration in one embodiment of the present invention). That is, a rotary table whose angular velocity can be freely changed is prepared, and the electronic component temporarily bonded by the temporary bonding bond 7 of this embodiment is placed on the rotary table, and the electronic component is removed from the rotary table by using the temperature as a parameter. The angular velocity at this time is measured, the acceleration in the radial direction at this time is obtained, and this acceleration is taken as the electronic component holding limit acceleration.

【0024】図5に示すように、第1例、第2例の電子
部品保持限界加速度は、ともに、半田の融点の前後約2
0℃で極端に低い値を示しており、この領域の温度で
は、仮止め用ボンド7によって仮接着される電子部品が
極めて容易に移動できることがわかる。
As shown in FIG. 5, the electronic component holding limit accelerations of the first and second examples are both about 2 before and after the melting point of the solder.
It shows an extremely low value at 0 ° C., and it can be seen that at the temperature in this region, the electronic component temporarily bonded by the temporary bonding bond 7 can move extremely easily.

【0025】次に図2、図3を参照しながら、本実施例
の仮止め用ボンドを用いた半田付け工程について説明す
る。図2(a1)〜(e1)は本発明の一実施例におけ
る半田付け工程を電子部品の上方からみた工程説明図、
図2(a2)〜(e2)は本発明の一実施例における半
田付け工程を電子部品の側方からみた工程説明図、図3
は本発明の一実施例の半田付け工程における温度プロフ
ァイルを示すグラフである。図3の時間軸(横軸)にお
ける(a)〜(e)なる文字は図2の図番に対応してい
る。まず図2(a1)、(a2)に示すようにクリーム
半田3を基板1上の回路パターン上にスクリーン印刷し
て供給し、また仮止め用ボンド7を回路パターン2の間
の基板1の上面に塗布する。そして電子部品4を回路パ
ターン2上のクリーム半田3の上に搭載する。この状態
で電子部品4の中央部は、仮止め用ボンド7によって基
板1上に保持されている。
Next, the soldering process using the temporary bonding bond of this embodiment will be described with reference to FIGS. 2 (a1) to (e1) are process explanatory views of the soldering process in one embodiment of the present invention as viewed from above the electronic component,
2 (a2) to 2 (e2) are process explanatory views of the soldering process in one embodiment of the present invention viewed from the side of the electronic component, FIG.
3 is a graph showing a temperature profile in a soldering process of an example of the present invention. Characters (a) to (e) on the time axis (horizontal axis) of FIG. 3 correspond to the drawing numbers of FIG. First, as shown in FIGS. 2 (a1) and (a2), cream solder 3 is screen-printed and supplied onto a circuit pattern on the substrate 1, and a temporary bonding bond 7 is provided on the upper surface of the substrate 1 between the circuit patterns 2. Apply to. Then, the electronic component 4 is mounted on the cream solder 3 on the circuit pattern 2. In this state, the central portion of the electronic component 4 is held on the substrate 1 by the temporary bonding bond 7.

【0026】次に図3の(a)〜(e)に示すように基
板1をリフロー装置に入れ、室温から約150℃まで急
速に加熱する。さらに図3の(c)まで約150℃で3
0秒程度加熱すると、仮止め用ボンド7はだれて基板1
上に広がりはじめる(図2(c1),(c2)参照)。
従って、角チップ4はクリーム半田3の高さ次第で降下
し始め、常にクリーム半田3に載った状態にある。
Next, as shown in FIGS. 3A to 3E, the substrate 1 is placed in a reflow apparatus and rapidly heated from room temperature to about 150.degree. Furthermore, up to (c) in FIG.
After heating for about 0 seconds, the temporary bonding bond 7 drops and the substrate 1
It begins to spread upward (see FIGS. 2 (c1) and 2 (c2)).
Therefore, the corner chip 4 starts to descend depending on the height of the cream solder 3, and is always on the cream solder 3.

【0027】さらに温度を上げていくと、図3の(d)
で示すように、半田の融点でクリーム半田3は溶けた半
田6となり、角チップ4に対してセルフアライメントが
発生する。ここで、本実施例の仮止め用ボンド7はだれ
て弱く角チップ4に接着しているので、セルフアライメ
ントが阻害されることはない(図2(d1)(d
2))。また、仮止め用ボンド7はだれて、角チップ4
の下降を許すので、溶けた半田6に角チップ4の電極が
沈み込んで十分接触し、図2(d2)に示すように断面
略三角形の半田フィレットが形成される。そして図3の
(e)で示すように、半田の融点よりも高い温度で加熱
すると、仮止め用ボンド7は硬化した仮止め用ボンド8
となって、基板1に角チップ4をしっかり仮接着する。
ここで、図2(d1)に示す段階でセルフアライメント
による位置ずれ矯正は済んでいるので、図2(e1)、
(e2)に示す状態で、角チップ4の位置ずれがない位
置が確定される。
When the temperature is further raised, (d) in FIG.
As indicated by, the cream solder 3 becomes the melted solder 6 at the melting point of the solder, and self-alignment occurs with respect to the corner chip 4. Here, since the temporary fixing bond 7 of this embodiment is weakly adhered to the corner chip 4, the self-alignment is not hindered (FIG. 2 (d1) (d).
2)). Also, the temporary bonding bond 7 is dripping, and the square chip 4
Since the electrode of the square chip 4 sinks into the melted solder 6 and makes sufficient contact with the melted solder 6, a solder fillet having a substantially triangular cross section is formed as shown in FIG. 2 (d2). Then, as shown in (e) of FIG. 3, when the heating is performed at a temperature higher than the melting point of the solder, the temporary fixing bond 7 is cured and the temporary fixing bond 8 is formed.
Then, the square chip 4 is firmly and temporarily adhered to the substrate 1.
Here, since the positional deviation correction by self-alignment has been completed at the stage shown in FIG. 2 (d1),
In the state shown in (e2), the position where the corner chip 4 is not displaced is determined.

【0028】次に基板1を冷却して溶けた半田6を固化
する。以上で半田付け工程が終了する。なお本実施例で
は、クリーム半田3を基板1の回路パターンへ供給した
が、予め半田を回路パターン上にコーティングしたプリ
コート基板を使用してもよい。
Next, the board 1 is cooled to solidify the melted solder 6. This completes the soldering process. Although the cream solder 3 is supplied to the circuit pattern of the substrate 1 in this embodiment, a pre-coated substrate in which the circuit pattern is preliminarily coated with solder may be used.

【0029】本実施例の第1例、第2例の仮止め用ボン
ドの全体的な成績評価は(表2)に示すとおりである。
ことに、本実施例の仮止め用ボンドでは半田オープンが
全く発生してない点に注目されたい。
The overall performance evaluation of the temporary bonding bonds of the first and second examples of this embodiment is shown in (Table 2).
In particular, it should be noted that the temporary bonding bond of this embodiment does not cause any solder open.

【0030】[0030]

【表2】 [Table 2]

【0031】[0031]

【発明の効果】本発明の電子部品の仮止め用ボンドは、
主剤と硬化剤とを含んでなり、硬化開始温度が半田の融
点以上であり、室温時の広がり率よりも半田の融点にお
ける広がり率が大きいので、セルフアライメントを阻害
せず、確実な半田付けを実現できる。
EFFECTS OF THE INVENTION The bond for temporarily fixing electronic parts of the present invention is
It contains a main agent and a curing agent, and the curing start temperature is equal to or higher than the melting point of the solder, and the spreading rate at the melting point of the solder is larger than the spreading rate at room temperature, so self-alignment is not hindered and reliable soldering is performed. realizable.

【図面の簡単な説明】[Brief description of drawings]

【図1】(a)〜(c)本発明の一実施例における広が
り率の説明図
FIG. 1A to FIG. 1C are explanatory diagrams of a spread rate in an embodiment of the present invention.

【図2】(a1)〜(e1)本発明の一実施例における
工程を電子部品の上方からみた工程説明図 (a2)〜(e2)本発明の一実施例における工程を電
子部品の側方からみた工程説明図
FIGS. 2 (a1) to (e1) are process explanatory views of the steps in one embodiment of the present invention seen from above the electronic component. (A2) to (e2) The steps in one embodiment of the present invention are performed laterally of the electronic component. Process explanatory diagram viewed from

【図3】本発明の一実施例の半田付け方法における温度
プロファイルを示すグラフ
FIG. 3 is a graph showing a temperature profile in a soldering method according to an embodiment of the present invention.

【図4】本発明の一実施例における仮止め用ボンドの広
がり率の温度変化を示すグラフ
FIG. 4 is a graph showing a temperature change of a spreading ratio of a temporary bonding bond in an example of the present invention.

【図5】本発明の一実施例における仮止め用ボンドの電
子部品保持限界加速度を示すグラフ
FIG. 5 is a graph showing a holding acceleration limit of an electronic component of a temporary bonding bond according to an embodiment of the present invention.

【図6】本発明の一実施例における電子部品保持限界加
速度の説明図
FIG. 6 is an explanatory diagram of an electronic component holding limit acceleration in one embodiment of the present invention.

【図7】(a)〜(e)従来の工程を電子部品の上方か
らみた工程説明図
7A to 7E are process explanatory views of a conventional process viewed from above the electronic component.

【図8】(a)〜(e)従来の工程を電子部品の側方か
らみた工程説明図
FIG. 8A to FIG. 8E are process explanatory views of a conventional process viewed from the side of an electronic component.

【符号の説明】[Explanation of symbols]

3 クリーム半田 4 角チップ 7 仮止め用ボンド 3 Cream solder 4 Square tip 7 Bond for temporary fixing

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】基板の回路パターン上に供給された半田上
に搭載された電子部品を基板に仮止めする電子部品の仮
止め用ボンドであって、 硬化温度が半田の融点より高く、且つ半田溶融時におけ
る電子部品を保持する保持力が室温時よりも低くなるこ
とを特徴とする電子部品の仮止め用ボンド。
1. A bond for temporary fixing of an electronic component, which temporarily fixes an electronic component mounted on a solder supplied onto a circuit pattern of the substrate to the substrate, wherein the curing temperature is higher than the melting point of the solder and the solder is used. A holding bond for an electronic component, which has a lower holding force for holding the electronic component when melted than at room temperature.
【請求項2】条件温度150℃における広がり率が30
%以上であることを特徴とする請求項1記載の電子部品
の仮止め用ボンド。
2. The spread rate at a condition temperature of 150 ° C. is 30.
% Or more, The bond for temporary fixing of electronic parts according to claim 1.
【請求項3】基板の回路パターン上に供給された半田上
に搭載された電子部品を基板に仮止めする電子部品の仮
止め用ボンドであって、 主剤と硬化剤と添加剤を配合し、硬化温度が半田の融点
より高く、且つ前記添加剤に水添ヒマシ油、脂肪酸アマ
イドワックス、有機ベントナイト、ゼラチン、ベンズア
ルデヒド縮合体、セルロースのうちの少なくとも1種を
含むことを特徴とする電子部品の仮止め用ボンド。
3. A bond for temporarily fixing an electronic component mounted on a solder supplied onto a circuit pattern of the substrate to the substrate, which comprises a main agent, a curing agent and an additive. A temporary electronic component characterized by having a curing temperature higher than the melting point of solder and containing at least one of hydrogenated castor oil, fatty acid amide wax, organic bentonite, gelatin, benzaldehyde condensate and cellulose as the additive. Stop bond.
【請求項4】基板の回路パターン上に供給された半田上
に電子部品を搭載し、この電子部品を硬化温度が半田の
融点よりも高く、且つ半田溶融時における電子部品を保
持する保持力が室温時よりも低くなる仮止め用ボンドで
基板上に保持した状態で基板を加熱して半田付けを行う
電子部品の半田付け方法であって、 前記基板を前記半田の融点よりも低い温度で加熱するこ
とにより前記仮止め用ボンドによる電子部品の保持力を
低くする工程と、 前記半田を融点まで加熱して溶融させる工程と、 前記基板を前記半田の融点よりも高い温度で加熱するこ
とにより、前記仮止め用ボンドを硬化させる工程と、 前記基板を冷却して溶融した半田を固化させる工程を含
むことを特徴とする電子部品の半田付け方法。
4. An electronic component is mounted on the solder supplied onto the circuit pattern of the substrate, and the electronic component has a curing temperature higher than the melting point of the solder and a holding force for holding the electronic component when the solder is melted. A method of soldering an electronic component, comprising heating a substrate while holding it on a substrate with a bond for temporary fixing, which is lower than room temperature, and heating the substrate at a temperature lower than the melting point of the solder. By lowering the holding power of the electronic component by the temporary bonding bond by doing, heating the solder to a melting point to melt, by heating the substrate at a temperature higher than the melting point of the solder, A method of soldering an electronic component, comprising: a step of curing the temporary bonding bond; and a step of cooling the substrate to solidify the melted solder.
JP26716094A 1994-10-31 1994-10-31 Bond for temporary fixing of electronic components Expired - Lifetime JP3146888B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP26716094A JP3146888B2 (en) 1994-10-31 1994-10-31 Bond for temporary fixing of electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26716094A JP3146888B2 (en) 1994-10-31 1994-10-31 Bond for temporary fixing of electronic components

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP20309899A Division JP3147116B2 (en) 1999-07-16 1999-07-16 Soldering method for electronic parts and bond for temporary fixing of electronic parts
JP11203099A Division JP2000040870A (en) 1999-07-16 1999-07-16 Bond for temporarily fixing electronic component

Publications (2)

Publication Number Publication Date
JPH08130363A true JPH08130363A (en) 1996-05-21
JP3146888B2 JP3146888B2 (en) 2001-03-19

Family

ID=17440933

Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
JP (1) JP3146888B2 (en)

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