JPH08110434A - Waveguide type optical module - Google Patents

Waveguide type optical module

Info

Publication number
JPH08110434A
JPH08110434A JP24543694A JP24543694A JPH08110434A JP H08110434 A JPH08110434 A JP H08110434A JP 24543694 A JP24543694 A JP 24543694A JP 24543694 A JP24543694 A JP 24543694A JP H08110434 A JPH08110434 A JP H08110434A
Authority
JP
Japan
Prior art keywords
waveguide
type optical
waveguide type
optical module
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP24543694A
Other languages
Japanese (ja)
Other versions
JP3171023B2 (en
Inventor
Tatsuo Teraoka
達夫 寺岡
Kazuya Murakami
和也 村上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Priority to JP24543694A priority Critical patent/JP3171023B2/en
Publication of JPH08110434A publication Critical patent/JPH08110434A/en
Application granted granted Critical
Publication of JP3171023B2 publication Critical patent/JP3171023B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Optical Couplings Of Light Guides (AREA)
  • Optical Integrated Circuits (AREA)

Abstract

PURPOSE: To omit the process of attaching a module to a print circuit board by forming a fixing stand for soldering and fixing of the module main body to a print circuit board. CONSTITUTION: A silicon single crystal is subjected to anisotropic etching with using a KOH soln. to form two parallel V-shaped grooves. The obtd. material is called as a silicon bench 101. Then a glass waveguide 102 having an optical circuit with an input port and an output port is adhered and fixed to the silicon bench 101. Then the silicon bench 101 with the glass waveguide 102 fixed is adhered and fixed to a fixing stand 103 formed by folding and bending a metal plate. The assembled body is housed in a transfer mold die and molded with an epoxy resin containing a glass filler to integrate the fixing stand 103 and the silicon bench 101 while glass holes 104 are formed. Thus, the waveguide type optical module is obtd.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、導波路型光モジュール
に係る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a waveguide type optical module.

【0002】[0002]

【従来の技術】通信、計測、情報処理等の分野において
は、光をより高度に利用するために光の合波、分波、分
岐等の種々の機能を有する光集積回路が研究されてお
り、このような光集積回路を構成する要素として光ファ
イバと光導波路とを接続した光導波路型光モジュールが
使用されている。
2. Description of the Related Art In the fields of communication, measurement, information processing, and the like, optical integrated circuits having various functions such as light multiplexing, demultiplexing, and branching have been studied in order to utilize light at higher levels. An optical waveguide type optical module in which an optical fiber and an optical waveguide are connected is used as an element constituting such an optical integrated circuit.

【0003】斯かる光導波路型光モジュールとしては、
図7に示すように石英ガラスまたは単結晶シリコン基板
上701上に屈折率の高いコア領域702と屈折率の低
いクラッド領域703を形成し、コア領域702に光を
閉じ込めて伝搬させる光導波路素子704に、コア70
6及びクラッド707からなる光ファイバ705を接続
したものが考えられている。
As such an optical waveguide type optical module,
As shown in FIG. 7, a core region 702 having a high refractive index and a clad region 703 having a low refractive index are formed on a quartz glass or single crystal silicon substrate 701, and an optical waveguide device 704 for confining and propagating light in the core region 702. The core 70
An optical fiber 705 including 6 and a clad 707 is considered to be connected.

【0004】光導波路素子704と光ファイバ705の
接続は、光ファイバ705を光ファイバホルダ708に
取付け、導波路コア706と光軸調心を行い、接着剤7
09を用いて双方の端面を接着固定する方法がよく用い
られている。
To connect the optical waveguide element 704 and the optical fiber 705, the optical fiber 705 is attached to the optical fiber holder 708, the optical axis is aligned with the waveguide core 706, and the adhesive 7
The method of adhesively fixing both end faces using 09 is often used.

【0005】この光ファイバと導波路の光軸調心は、通
常、光導波路コアの一端に光を入射し、出射端の光を光
ファイバで受け、光ファイバへ入射される光量が最大と
なるように、光ファイバの位置を調整するものである。
従って調心作業には多くの時間を要し、モジュールのコ
ストが高くなる一因となっていた。このような光軸調心
作業時間を軽減するために、光導波路コア位置と精密な
位置関係にあるガイド機構を用いて簡略的に光軸合せを
行う方法が考えられている。
In the optical axis alignment of the optical fiber and the waveguide, the light is normally incident on one end of the optical waveguide core, the light at the emitting end is received by the optical fiber, and the amount of light incident on the optical fiber is maximized. Thus, the position of the optical fiber is adjusted.
Therefore, it takes a lot of time to perform the centering work, which is one of the causes of the high cost of the module. In order to reduce such an optical axis alignment work time, a method of simply performing optical axis alignment using a guide mechanism having a precise positional relationship with the optical waveguide core position has been considered.

【0006】例えば、特開平4−128809に開示さ
れた実施例は、図8に示すごとく、単結晶シリコン基板
上801に、異方性エッチングによるガイド溝802を
形成し、さらに、火炎堆積法及びドライエッチングを用
いて、GeO2 −SiO2 コア203、SiO2 クラッ
ド804から成る石英系光導波路素子805を形成す
る。また、光ファイバホルダ806はエポキシ樹脂成形
体807に光ファイバ808を配列すると共に、ガイド
ピン809を植設したものである。この実施例の調心作
業では、光ファイバホルダ806のガイドピン809を
光導波路素子805上のガイド溝802にはめ合せるこ
とによって調心作業時間の短縮を行っている。
For example, in the embodiment disclosed in Japanese Unexamined Patent Publication No. 4-128809, as shown in FIG. 8, a guide groove 802 is formed by anisotropic etching on a single crystal silicon substrate 801, and a flame deposition method and By using dry etching, a silica-based optical waveguide element 805 including a GeO 2 —SiO 2 core 203 and a SiO 2 clad 804 is formed. The optical fiber holder 806 is formed by arranging optical fibers 808 in an epoxy resin molding 807 and implanting guide pins 809. In the centering work of this embodiment, the guide pin 809 of the optical fiber holder 806 is fitted in the guide groove 802 on the optical waveguide device 805 to shorten the centering work time.

【0007】[0007]

【発明が解決しようとする課題】ところで導波路型光モ
ジュールは、プリント基板上に装着して、発光モジュー
ルや受光モジュールと組合せて用いられる例が多いが、
この場合、以下のような問題点があった。
The waveguide type optical module is often mounted on a printed circuit board and used in combination with a light emitting module or a light receiving module.
In this case, there were the following problems.

【0008】 プリント基板上への導波路型光モジュ
ールの装着は、留金具や接着剤を用いて成されている
が、プリント基板上への電子部品のはんだ付け工程とは
別に行われるため、2度手間となる。
Mounting of the waveguide type optical module on the printed circuit board is performed by using metal fittings and an adhesive, but since it is performed separately from the step of soldering the electronic component on the printed circuit board, 2 It will be troublesome.

【0009】 光ファイバが固着されている導波路型
光モジュールでは、プリント基板上への装着時に光ファ
イバが自動装着作業の障害となるため、手作業で装着せ
ざるを得ない。
In the waveguide type optical module to which the optical fiber is fixed, the optical fiber interferes with the automatic mounting work when mounted on the printed circuit board, so that the optical fiber must be mounted manually.

【0010】前述のごとく導波路と光ファイバの接続簡
略化によってある程度コストを下げることができたとし
ても、モジュールをプリント基板に装着するのに時間と
手間を要するため、伝送装置全体としてのコストはまだ
高いものとなっており、この改善が望まれていた。
Even if the cost can be reduced to some extent by simplifying the connection between the waveguide and the optical fiber as described above, it takes time and labor to mount the module on the printed circuit board, so that the cost of the entire transmission device is low. It is still high, and this improvement was desired.

【0011】本発明の目的は、プリント基板への取付け
手間の省略化を図れる導波路型光モジュールを提供する
ことにある。
An object of the present invention is to provide a waveguide type optical module which can save the labor for mounting on a printed circuit board.

【0012】[0012]

【課題を解決するための手段】本発明は、導波路素子ま
たは導波路素子を接合固定したベンチを有し、少なくと
も導波路素子の光入射または出射端面を露出させると共
に、光入出射端面と光ファイバを連結するための着脱可
能な連結機構を備えている導波路型光モジュールに於
て、モジュール本体をプリント基板にはんだ接合固定す
るための固定具足を設けたものであり、これによって、
プリント基板上への導波路型光モジュールの固定が、電
気部品と同時にできるようにしたものである。
The present invention has a waveguide element or a bench to which waveguide elements are bonded and fixed, and at least exposes the light incident or emission end face of the waveguide element, and at the same time, the light incident or emission end face and the light In a waveguide type optical module provided with a detachable coupling mechanism for coupling fibers, a fixture foot for soldering and fixing the module body to a printed circuit board is provided.
The waveguide type optical module can be fixed on the printed circuit board at the same time as the electric parts.

【0013】また、導波路素子を接合固定したベンチ上
に、受・発光素子を載置しワイヤボンディング等の手段
により、前記固定具足と電気配線することにより、受・
発光素子内蔵型の導波路型光モジュールをプリント基板
に簡便に取付け配線できるようにしたものである。
Further, the receiving / light emitting element is placed on the bench to which the waveguide element is bonded and fixed, and the fixing tool is electrically wired by means of wire bonding or the like.
A waveguide type optical module with a built-in light emitting element is easily attached to a printed circuit board and can be wired.

【0014】[0014]

【実施例】本発明の一実施例を図1により説明する。シ
リコン単結晶にKOH溶液を用いて異方性エッチングを
行い2本の平行なV溝を形成した。これをシリコンベン
チ101と呼ぶ。シリコンベンチ101上に入力4ポー
ト、出力4ポートの光回路を有するガラス導波路102
を接着固定した。接着に当っては、前述のシリコンベン
チ101上の2本のV溝の位置を基準として、ガラス導
波路102のコア位置が所定位置に位置するように顕微
鏡により観察しながら接着固定を行った。次に、ガラス
導波路102を固定したシリコンベンチ101を金属板
を折り曲げ成形した固定具足103上に接着固定した。
これをトランスファモールド金型内に収容し、ガラスフ
ィラー入りのエポキシ樹脂をモールド成形し、固定具足
103とシリコンベンチ101を一体化すると共に、ガ
イドホール104を成形し、本発明導波路型光モジュー
ルを得た。
DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described with reference to FIG. The silicon single crystal was anisotropically etched using a KOH solution to form two parallel V-grooves. This is called a silicon bench 101. A glass waveguide 102 having an optical circuit with 4 input ports and 4 output ports on a silicon bench 101.
Was fixed by adhesion. At the time of adhesion, adhesion and fixing were performed while observing with a microscope so that the core position of the glass waveguide 102 was located at a predetermined position with reference to the positions of the two V-grooves on the silicon bench 101 described above. Next, the silicon bench 101 to which the glass waveguide 102 was fixed was adhered and fixed onto the fixing foot 103 formed by bending a metal plate.
This is housed in a transfer mold, and epoxy resin containing glass filler is molded to integrate the fixing feet 103 and the silicon bench 101, and the guide hole 104 is molded to obtain the waveguide type optical module of the present invention. Obtained.

【0015】これを図2に示すごとく、プリント基板2
01上に載置すると共に、はんだを流し、固定具足10
3をプリント基板201に他の電気部品と同時にはんだ
固定した。その後、ガイドホール104にガイドピン2
02を挿通すると共に、ガイドホール203を有する多
心光コネクタ204にガイドピン202を挿入し、光フ
ァイバの接続を行った。
As shown in FIG. 2, the printed circuit board 2
01 and place solder on top of the
3 was soldered to the printed circuit board 201 at the same time as other electric parts. After that, the guide pin 2 is inserted into the guide hole 104.
02 was inserted, and the guide pin 202 was inserted into the multi-core optical connector 204 having the guide hole 203 to connect the optical fibers.

【0016】他の実施例を図3に示す。図3(a) は固定
具足として金属ピン301を用いた。図3(b) は、固定
具足として、固定板302に設けたはんだボール303
を用いた。固定板302は、セラミック板にはんだボー
ルを付着させる金めっきを施したものを用いたが、他
に、金属板やプラスチック板でもよい。
Another embodiment is shown in FIG. In FIG. 3A, the metal pin 301 is used as the fixing foot. FIG. 3 (b) shows a solder ball 303 provided on the fixing plate 302 as a fixing foot.
Was used. As the fixing plate 302, a ceramic plate plated with gold for attaching solder balls was used, but a metal plate or a plastic plate may be used instead.

【0017】図4に他の実施例を示す。固定具足103
はモールド樹脂401によって保持されると共に、モー
ルド樹脂401は、導波路型光モジュールを保持するた
めのスナップフィット402を形成する。導波路型光モ
ジュールはスナップフィット402が引掛かる凹部が形
成されており、スナップフィット402によって着脱可
能な構造となっている。このように着脱できるようにし
ておけば、導波路型光モジュールが故障した場合、はん
だ固定部を外すことなく取替えができる。
FIG. 4 shows another embodiment. Fixing foot 103
Is held by the mold resin 401, and the mold resin 401 forms a snap fit 402 for holding the waveguide type optical module. The waveguide type optical module is formed with a concave portion to which the snap fit 402 is hooked, and has a structure which can be attached and detached by the snap fit 402. If the waveguide type optical module is broken down in this way, it can be replaced without removing the solder fixing portion.

【0018】他の実施例を図5に示す。前記図1に示し
たと同様に、ガラス導波路102は、シリコンベンチ1
01上に固定されると共に、発光素子501、受光素子
502及び信号処理用IC503をシリコンベンチ上に
固定した。受・発光素子は、ICとワイヤボンディング
504により電気配線されると共に、ICは、固定具足
103とワイヤボンディング504により電気配線され
ている。このように固定具足を介して、シリコンベンチ
の受・発光素子に給電することが可能である。図6は、
他の実施例を示す。導波路型光モジュールには、金属ピ
ン301がモールド固定されていると共に、シリコンベ
ンチ上に取付けた発光素子及び受光素子(図示せず)と
ワイヤボンディングによって電気配線されている。ま
た、固定具足103は、モールド樹脂401によってモ
ールドされると共に、前記金属ピン301が挿入できる
ピン嵌合部601が形成されている。ピン嵌合部601
に導波路型光モジュールの金属ピン301を挿入するこ
とによりモジュールの固定と電気的導通を同時に行うも
のである。
Another embodiment is shown in FIG. As shown in FIG. 1, the glass waveguide 102 is a silicon bench 1
01, and the light emitting element 501, the light receiving element 502, and the signal processing IC 503 were fixed on a silicon bench. The light receiving / light emitting element is electrically wired by the IC and the wire bonding 504, and the IC is electrically wired by the fixing foot 103 and the wire bonding 504. In this way, it is possible to supply power to the light receiving / light emitting element of the silicon bench via the fixing foot. FIG.
Another embodiment will be described. In the waveguide type optical module, metal pins 301 are fixed in a mold and electrically connected to a light emitting element and a light receiving element (not shown) mounted on a silicon bench by wire bonding. Further, the fixture foot 103 is molded with a mold resin 401 and is formed with a pin fitting portion 601 into which the metal pin 301 can be inserted. Pin fitting part 601
By inserting the metal pin 301 of the waveguide type optical module into the module, the module is fixed and electrically connected at the same time.

【0019】[0019]

【発明の効果】以上述べたごとく、本発明によれば、プ
リント基板への導波路型光モジュールの固定が、他の電
気部品と同時にはんだ固定可能となり、取付け手間の省
略化ができるようになった。
As described above, according to the present invention, the waveguide type optical module can be fixed to the printed circuit board by soldering at the same time as other electric parts, and the labor for mounting can be omitted. It was

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明導波路型光モジュールの一実施例を示す
断面説明図。
FIG. 1 is an explanatory sectional view showing an embodiment of a waveguide type optical module of the present invention.

【図2】本発明導波路型光モジュールをプリント基板に
固定した様子を示す説明図。
FIG. 2 is an explanatory view showing a state in which the waveguide type optical module of the present invention is fixed to a printed board.

【図3】本発明導波路型光モジュールの二つの実施例を
示す断面説明図。
FIG. 3 is an explanatory sectional view showing two embodiments of the waveguide type optical module of the present invention.

【図4】本発明導波路型光モジュールの他の実施例を示
す断面説明図。
FIG. 4 is an explanatory sectional view showing another embodiment of the waveguide type optical module of the present invention.

【図5】本発明導波路型光モジュールの実施例を示す斜
視断面説明図。
FIG. 5 is a perspective sectional explanatory view showing an embodiment of the waveguide type optical module of the present invention.

【図6】本発明導波路型光モジュールの実施例を示す断
面説明図。
FIG. 6 is an explanatory sectional view showing an embodiment of the waveguide type optical module of the present invention.

【図7】導波路素子と光ファイバの接続方法の一例を示
す断面説明図。
FIG. 7 is an explanatory cross-sectional view showing an example of a method for connecting a waveguide element and an optical fiber.

【図8】導波路素子と光ファイバの接続方法の他の一例
を示す斜視説明図。
FIG. 8 is a perspective explanatory view showing another example of a method of connecting a waveguide element and an optical fiber.

【符号の説明】[Explanation of symbols]

101 シリコンベンチ 102 導波路素子 103 固定具足 201 プリント基板 204 多心光コネクタ 101 Silicon Bench 102 Waveguide Element 103 Fixing Feet 201 Printed Circuit Board 204 Multi-fiber Optical Connector

Claims (6)

【特許請求の範囲】[Claims] 【請求項1】導波路素子と該導波路素子の少なくとも光
入射または出射端面の一方を露出させると共に該露出端
面と光ファイバを連結するための着脱可能な連結機構を
備えて成る導波路型光モジュールに於て、該モジュール
本体に該モジュールを外部部材にはんだ接合固定するた
めの固定具足を設けて構成されたことを特徴とする導波
路型光モジュール。
1. A waveguide type optical device comprising a waveguide element and a detachable coupling mechanism for exposing at least one of a light incident surface or a light emitting end surface of the waveguide element and for connecting the exposed end surface to an optical fiber. In the module, a waveguide type optical module is characterized in that the module main body is provided with fixing feet for soldering and fixing the module to an external member.
【請求項2】固定具足がモジュール本体にプラスチック
によってモールド一体化されて構成されていることを特
徴とする請求項1記載の導波路型光モジュール。
2. The waveguide type optical module according to claim 1, wherein the fixing feet are molded and integrated with the module body by plastic.
【請求項3】固定具足は着脱可能な保持機構によりモジ
ュール本体に装着されて構成されていることを特徴とす
る請求項1記載の導波路型光モジュール。
3. The waveguide type optical module according to claim 1, wherein the fixing foot is attached to the module body by a detachable holding mechanism.
【請求項4】導波路素子に少なくとも発光素子または受
光素子の一方が接合固定されており、該発光素子または
/及び受光素子と固定具足が電気的に接続されて構成さ
れていることを特徴とする請求項1から3のいずれか記
載の導波路型光モジュール。
4. At least one of a light emitting element and a light receiving element is bonded and fixed to the waveguide element, and the light emitting element and / or the light receiving element and the fixing foot are electrically connected to each other. The waveguide type optical module according to any one of claims 1 to 3.
【請求項5】導波路素子がシリコンベンチ上に接合固定
されて構成されていることを特徴とする請求項1から4
のいずれか記載の導波路型光モジュール。
5. The waveguide element is constructed by being bonded and fixed on a silicon bench.
2. A waveguide type optical module according to any one of 1.
【請求項6】シリコンベンチ上に、導波路素子のコアの
位置決めをするための基準となるV溝を設けて構成され
たことを特徴とする請求項5記載の導波路型光モジュー
ル。
6. A waveguide type optical module according to claim 5, wherein a V groove serving as a reference for positioning the core of the waveguide element is provided on the silicon bench.
JP24543694A 1994-10-11 1994-10-11 Waveguide type optical module Expired - Fee Related JP3171023B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24543694A JP3171023B2 (en) 1994-10-11 1994-10-11 Waveguide type optical module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24543694A JP3171023B2 (en) 1994-10-11 1994-10-11 Waveguide type optical module

Publications (2)

Publication Number Publication Date
JPH08110434A true JPH08110434A (en) 1996-04-30
JP3171023B2 JP3171023B2 (en) 2001-05-28

Family

ID=17133639

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24543694A Expired - Fee Related JP3171023B2 (en) 1994-10-11 1994-10-11 Waveguide type optical module

Country Status (1)

Country Link
JP (1) JP3171023B2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999017141A1 (en) * 1997-09-26 1999-04-08 Siemens Aktiengesellschaft Method for producing an optoelectronic plug connector element and optoelectronic plug
KR100302144B1 (en) * 1999-08-05 2001-11-01 고한준 connector-type optical transceiver using SOI optical wave-guide
WO2004074892A1 (en) * 2003-02-20 2004-09-02 Tomoegawa Paper Co., Ltd. Optical transmission medium connecting method, optical connecting structure, and optical transmission medium connecting part
JP2011248361A (en) * 2010-05-24 2011-12-08 National Central Univ Signal transmission module having optical waveguide structure
JP2012203277A (en) * 2011-03-28 2012-10-22 Sumitomo Bakelite Co Ltd Connector and method for manufacturing connector

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Publication number Priority date Publication date Assignee Title
WO1999017141A1 (en) * 1997-09-26 1999-04-08 Siemens Aktiengesellschaft Method for producing an optoelectronic plug connector element and optoelectronic plug
KR100302144B1 (en) * 1999-08-05 2001-11-01 고한준 connector-type optical transceiver using SOI optical wave-guide
WO2004074892A1 (en) * 2003-02-20 2004-09-02 Tomoegawa Paper Co., Ltd. Optical transmission medium connecting method, optical connecting structure, and optical transmission medium connecting part
KR100779891B1 (en) * 2003-02-20 2007-11-28 가부시키가이샤 도모에가와 세이시쇼 Optical transmission medium connecting method, optical connecting structure, and optical transmission medium connecting part
JP2011248361A (en) * 2010-05-24 2011-12-08 National Central Univ Signal transmission module having optical waveguide structure
US8644654B2 (en) 2010-05-24 2014-02-04 National Central University Optical coupler module having optical waveguide structure
JP2012203277A (en) * 2011-03-28 2012-10-22 Sumitomo Bakelite Co Ltd Connector and method for manufacturing connector

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