JPH0810898A - Device for heating metallic mold for casting - Google Patents
Device for heating metallic mold for castingInfo
- Publication number
- JPH0810898A JPH0810898A JP14914094A JP14914094A JPH0810898A JP H0810898 A JPH0810898 A JP H0810898A JP 14914094 A JP14914094 A JP 14914094A JP 14914094 A JP14914094 A JP 14914094A JP H0810898 A JPH0810898 A JP H0810898A
- Authority
- JP
- Japan
- Prior art keywords
- heater
- mold
- heating
- hole
- inorganic adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Molds, Cores, And Manufacturing Methods Thereof (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、鋳造用金型の加熱装置
に関し、特に、鋳造用金型と一体に組み立てられ、複数
のヒータが交換自在に保持されるバックアッププレート
を有する鋳造用金型の加熱装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a casting mold heating apparatus, and more particularly, to a casting mold having a backup plate assembled integrally with the casting mold and having a plurality of heaters exchangeably held therein. Heating device.
【０００２】[0002]
【従来の技術】鋳込み金属や溶融状態の樹脂系材料を流
し込んで凝固させるための鋳型として繰返し使用が可能
な金型においては、肉厚の変化部等の金型における温度
分布が適切でないことなどによる引け巣やき裂、更には
湯まわりなどの欠陥が生じ易い。特に重力式の鋳造用金
型ではこのような問題が顕著である。2. Description of the Related Art In a mold that can be repeatedly used as a mold for casting and solidifying cast metal or molten resin-based material, the temperature distribution in the mold such as the thickness change part is not appropriate. Shrinkage cavities, cracks, and defects such as around the hot water tend to occur. In particular, such a problem is remarkable in the gravity type casting mold.
【０００３】そこで、従来から金型の周囲部にヒータや
冷却手段を配設し、これらを介して金型の温度を管理す
ることが考えられてきた。特開平５−２３７６２４号公
報に開示されている例は、金型とは別体にヒータと冷却
水を循環させる冷却手段とを組込んだ加熱・冷却手段
を、金型のうち、特に上述のような欠陥の生じ易い部分
に配設するようにしたものである。Therefore, conventionally, it has been considered that a heater or a cooling means is arranged around the mold and the temperature of the mold is controlled via these. The example disclosed in Japanese Unexamined Patent Publication No. 5-237624 has a heating / cooling means, in which a heater and a cooling means for circulating cooling water are incorporated separately from the die, among the die, particularly the above-mentioned. It is arranged at a portion where such a defect is likely to occur.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、上述の
開示例では、ヒータを熱伝導体内に直接装填し、このよ
うな熱伝導体を金型に装着するように構成されている。
そこで、ヒータ装填部とヒータとの間のすき間が問題と
なる。すなわち、一般にはヒータと熱伝導体とでは熱膨
張率が異なるために、これを見込んでヒータと熱伝導体
との間の遊びを大きくすると、その遊びのすき間に介在
する空気が熱伝導の妨げとなり、加熱が効果的に行われ
なくなる虞がある。かくして、設定温度とするために大
きい電力が要求されることになりヒータの寿命を短命に
するのみならず経済的にも好ましくない。また、逆に上
述の遊びを少なくすると相互間の変形により、ヒータが
断線した場合、熱伝導体から外すことができず、全体的
な交換が強いられる結果を招く。However, in the above disclosed example, the heater is directly loaded into the heat conductor, and the heat conductor is mounted on the mold.
Therefore, the gap between the heater loading portion and the heater becomes a problem. That is, in general, the coefficient of thermal expansion differs between the heater and the heat conductor. Therefore, if the play between the heater and the heat conductor is increased in consideration of this, the air present in the gap of the play impedes heat conduction. Therefore, there is a possibility that heating will not be performed effectively. Thus, a large amount of electric power is required to reach the set temperature, which not only shortens the life of the heater but is economically unfavorable. On the contrary, if the above-mentioned play is reduced, when the heaters are broken due to mutual deformation, they cannot be removed from the heat conductor, resulting in a forced replacement.
【０００５】本発明の目的は、上述した従来の問題に着
目し、その解決を図るべく、効果的に加熱することがで
き、しかも断線の際にヒータの交換が容易な鋳造用金型
の加熱装置を提供することにある。It is an object of the present invention to pay attention to the above-mentioned conventional problems, and in order to solve the problems, it is possible to effectively heat the heating of the casting mold, which is easy to replace the heater when the wire is broken. To provide a device.
【０００６】[0006]
【課題を解決するための手段】かかる目的を達成するた
めに、本発明は、金型に接する加熱部材の貫通孔に嵌合
されたカートリッジ式ヒータを有し、該ヒータと前記貫
通孔との間に熱伝導率が高く、硬化時に脆性のある無機
質接着剤を介在させたことを特徴とするものである。In order to achieve such an object, the present invention has a cartridge type heater fitted in a through hole of a heating member in contact with a mold, and the heater and the through hole are provided. An inorganic adhesive having a high thermal conductivity and being brittle during curing is interposed between the two.
【０００７】[0007]
【作用】本発明によれば、ヒータを加熱部材の貫通孔に
装着するにあたり、ヒータと貫通孔との間に熱伝導率が
高く、硬化時に脆性のある無機質接着剤を介在させたこ
とにより、ヒータによる金型加熱動作時にヒータと貫通
孔との間に空気層が介在せず、かつ上述のように熱伝導
率の高い無機質接着剤が充填されていることで効率良く
金型を加熱することができると共にヒータ交換時には脆
性を利用して容易に要交換ヒータを個別に貫通孔から引
き出すことができる。According to the present invention, when the heater is mounted in the through hole of the heating member, the brittle inorganic adhesive having a high thermal conductivity is set between the heater and the through hole. Efficiently heating the mold by the fact that there is no air layer between the heater and the through hole during the mold heating operation by the heater and the inorganic adhesive with high thermal conductivity is filled as described above. In addition, it is possible to easily pull out the heaters requiring replacement individually from the through holes by utilizing brittleness when replacing the heaters.
【０００８】[0008]
【実施例】以下に、図面に基づいて本発明の実施例を詳
細かつ具体的に説明する。Embodiments of the present invention will be described in detail and specifically below with reference to the drawings.
【０００９】図１は本発明の一実施例を示す。ここで、
１は鋳造用の金型であり、金型１内には金属や樹脂の溶
湯が注入される不図示のキャビティが形成されていて、
金型自体は溶湯の流動に耐えると共に耐伸縮性に富んだ
金属によって形成されている。２は組合わされた金型
１，１の外側の両面に沿って配設され、金型１と共に一
体に締結されて金型１をこのような組合わせ状態に保つ
部材（以下でモールドキャリアという）である。また、
３はモールドキャリア２に嵌め合わされた状態に保持さ
れる熱伝導性のある加熱部材（以下でバックプレートと
いう）であり、本例の場合、銅などで形成したバックプ
レート３が図２に示すようにモールドキャリア２の両側
にそれぞれ配設されていて、バックプレート３の凹部３
Ａにモールドキャリア２の凸部２Ａが嵌合されると共に
バックプレート３の孔部３Ｂにモールドキャリア２のピ
ンボス部２Ｂが嵌め合わされている。FIG. 1 shows an embodiment of the present invention. here,
Reference numeral 1 denotes a casting die, and a cavity (not shown) into which a molten metal or resin is injected is formed in the die 1,
The mold itself is formed of a metal that is resistant to the flow of the molten metal and is highly stretchable. A member 2 is disposed along both outer surfaces of the combined molds 1 and 1, and is integrally fastened together with the mold 1 to keep the mold 1 in such a combined state (hereinafter referred to as a mold carrier). Is. Also,
Reference numeral 3 is a heating member having heat conductivity (hereinafter referred to as a back plate) which is held in a state of being fitted in the mold carrier 2. In this example, the back plate 3 formed of copper or the like is as shown in FIG. Are disposed on both sides of the mold carrier 2 and are provided in the recess 3 of the back plate 3.
The convex portion 2A of the mold carrier 2 is fitted to A, and the pin boss portion 2B of the mold carrier 2 is fitted to the hole 3B of the back plate 3.
【００１０】かくして、双方向の嵌合位置決め状態が保
たれるもので、３Ｃはこのようなバックプレート３に穿
設されている貫通のヒータ支持孔、また、４はこれらの
ヒータ支持孔３Ｃに嵌合固定される円柱状カートリッジ
式のヒータ（シースヒータ）である。なお、個々のヒー
タ４には図２に示すように嵌め込み側の突出端部４Ａに
ヒータ４内の発熱線（不図示）に接続されるリード線５
が設けられている。しかして、本例ではこのようなシー
スヒータ４をバックプレート３のヒータ支持孔３Ｃに嵌
め合わすにあたり、図１の（Ｂ）に示すようにシースヒ
ータ４の外筒周りに無機質の接着剤６を塗着しておくか
若しくは支持孔３Ｃ側に接着剤６を予め充填しておき、
このような接着剤６によりヒータ４とヒータ支持孔３Ｃ
との間のすき間が充填されるようにする。Thus, the bidirectional fitting and positioning state is maintained, 3C is a penetrating heater support hole formed in such a back plate 3, and 4 is these heater support holes 3C. It is a cylindrical cartridge type heater (sheath heater) that is fitted and fixed. As shown in FIG. 2, a lead wire 5 connected to a heating wire (not shown) in the heater 4 is attached to the protruding end portion 4A on the fitting side of each heater 4.
Is provided. Therefore, in this example, when such a sheath heater 4 is fitted into the heater support hole 3C of the back plate 3, as shown in FIG. 1B, the inorganic adhesive 6 is applied around the outer cylinder of the sheath heater 4. Or pre-fill the support hole 3C with the adhesive 6,
With such an adhesive 6, the heater 4 and the heater support hole 3C are formed.
Make sure the gap between and is filled.
【００１１】なお、無機質の接着剤６としては、セラミ
ック系高温型のＡｌ2 Ｏ3 （アルミナ）とＭｇＯ（マグ
ネシア）またはセラミック系高温型のＳｉＣ（炭化珪
素）とＭｇＯ（マグネシア）を主成分とする熱硬化性の
ものが好適である。すなわち、これらセラミック系の主
成分は、公知の如く、耐熱性がある上、充填材として優
れており、しかも電気的絶縁性があって焼結状態では気
孔が殆んど存在しない性質を具えている。また、ＭｇＯ
も脆性などの特性があることから、かかる無機質接着剤
６によって固定されたヒータ４ではその断線等による交
換時にヒータ本体の端部に衝撃を与えることで、無機質
接着剤６を破壊させ容易に固定状態を消滅させることが
可能となる。The inorganic adhesive 6 is mainly composed of ceramic high temperature type Al 2 O 3 (alumina) and MgO (magnesia) or ceramic high temperature type SiC (silicon carbide) and MgO (magnesia). A thermosetting resin is suitable. That is, as is well known, these ceramic-based main components have heat resistance, are excellent as fillers, and have electrical insulation properties, and have few pores in the sintered state. There is. Also, MgO
Also, since the heater 4 fixed by the inorganic adhesive 6 has a characteristic such as brittleness, the inorganic adhesive 6 is easily fixed by breaking the inorganic adhesive 6 by impacting the end portion of the heater main body at the time of replacement due to disconnection or the like. It becomes possible to extinguish the state.
【００１２】再び図１の（Ａ）に戻り、本発明にかかる
加熱装置の全体的な構成について説明しておく。Returning to FIG. 1A again, the overall structure of the heating apparatus according to the present invention will be described.
【００１３】図１の（Ａ）は、先にも述べたように金型
１と複数のヒータ４が組込まれたバックプレート３とモ
ールドキャリア２とが締結ボルト７により一体に結合さ
れた状態を示すもので、このような状態に保たれた金型
１，１に対し、不図示の湯口から金属あるいは樹脂系の
溶湯が金型１，１内のキャビティに注入される。８は本
例の場合、金型１，１の温度を検出する熱電対、９はヒ
ータ４のオン・オフによりバックプレート３を介して金
型１，１の温度を制御する温度制御部、また１０は金型
１，１に要求される温度の設定が可能な温度設定器であ
る。FIG. 1A shows a state in which the back plate 3 having the mold 1 and the plurality of heaters 4 incorporated therein and the mold carrier 2 are integrally connected by the fastening bolts 7 as described above. As shown in the figure, with respect to the molds 1 and 1 kept in such a state, a metal or resin-based molten metal is injected into a cavity in the molds 1 and 1 from a sprue (not shown). In the case of this example, 8 is a thermocouple for detecting the temperature of the molds 1, 1, 9 is a temperature control unit for controlling the temperature of the molds 1, 1 via the back plate 3 by turning on / off the heater 4, Reference numeral 10 is a temperature setter capable of setting the temperature required for the molds 1, 1.
【００１４】このように構成した鋳造用金型の加熱装置
においては、金型１，１のキャビティに注入された溶湯
が固化成形されるまでの間、金型１，１の温度が温度制
御部９によるヒータ４のオン・オフにより制御されるも
ので、その間の制御は温度設定器１０に設定されている
温度に従って行われる。特に引け巣などが発生し易い個
所に対してはその個所近傍に対応して配置されているヒ
ータ４を駆動することでその発生を防止することができ
る。In the heating device for the casting mold thus constructed, the temperature of the molds 1, 1 is controlled by the temperature controller until the molten metal injected into the cavities of the molds 1, 1 is solidified. The heater 9 is controlled by turning on / off the heater 4, and the control during that time is performed according to the temperature set in the temperature setter 10. Especially for a location where shrinkage cavities are likely to occur, the heater 4 arranged in the vicinity of the location can be driven to prevent the occurrence.
【００１５】また、ヒータ４のいずれかが断線等により
故障したような場合には、図１の（Ａ）に示すように組
立を終った鋳造装置を分解し、金型１，１から図２に示
すようにモールドキャリア２と共にこれに保持されるバ
ックプレート３を引外す。そして、モールドキャリア２
から更に故障したヒータ４が嵌合されているバックプレ
ート３を取外し、図３に示す状態とする。図３におい
て、２０は打抜きポンチ、２１は打抜きポンチ２０をヒ
ータ支持孔３Ｃに向けて打込むためのハンマである。な
お、ここで、打抜きポンチ２０の直径としてはヒータ４
と同径若しくは同径より稍径が大きい目のものが望まし
い。但し、ヒータ支持孔３Ｃの内径よりは小さく、かつ
ヒータ支持孔３Ｃの長さより長めにしておく。If any of the heaters 4 breaks down due to a disconnection or the like, the assembled casting apparatus is disassembled as shown in FIG. The mold carrier 2 and the back plate 3 held by the mold carrier 2 are removed as shown in FIG. And the mold carrier 2
Then, the back plate 3 to which the broken heater 4 is fitted is removed to obtain the state shown in FIG. In FIG. 3, 20 is a punch punch, and 21 is a hammer for punching the punch punch 20 toward the heater support hole 3C. The diameter of the punch 20 is set to the heater 4 here.
It is desirable that the diameter is equal to or larger than the diameter. However, it is smaller than the inner diameter of the heater support hole 3C and longer than the length of the heater support hole 3C.
【００１６】このような打抜きポンチ２０を要交換ヒー
タ４が嵌合されているヒータ支持孔３Ｃのヒータ４が突
出していない側に差込み、ハンマ２１により打抜きポン
チ２０を介してヒータ４に衝撃を与えることで、ヒータ
４の周りに充填されている無機質接着剤（図１の（Ｂ）
参照）６の脆性接合状態を破壊し、ヒータ４を引き出す
ことができる。そして、このあと新たなヒータ４の周り
にこれまでと同様な無機質接着剤６を塗着した上、清掃
した元のヒータ支持孔３Ｃに挿入することで容易にヒー
タ４の交換を行うことができる。The punching punch 20 is inserted into the side of the heater supporting hole 3C into which the heater 4 to be replaced is fitted, from which the heater 4 does not project, and the hammer 21 gives an impact to the heater 4 through the punching punch 20. As a result, the inorganic adhesive filled around the heater 4 ((B) in FIG. 1)
The brittle joining state of 6) can be destroyed and the heater 4 can be pulled out. Then, after that, the same inorganic adhesive 6 as before is applied around the new heater 4, and the heater 4 can be easily replaced by inserting it into the cleaned heater support hole 3C. .
【００１７】なお、上述の実施例では、２つの合わせ金
型の両外側からヒータを保持させたバックプレートをモ
ールドキャリアと共に一体結合させるようにしたが、か
かるバックプレートおよびこれらに保持されるヒータの
数やその配置位置はこれに限られるものではなく、金型
に要求される加熱位置および金型の形態に応じて適切に
設定されればよい。In the above-described embodiment, the back plates holding the heaters are integrally joined together with the mold carrier from both outsides of the two mating dies. However, the back plates and the heaters held by these back plates are The number and the arrangement position thereof are not limited to this, and may be appropriately set according to the heating position required for the mold and the form of the mold.
【００１８】図４は図１〜図３により説明してきた実施
例に対し、更にその上下にヒータ４を保持させたバック
プレート３を配置すると共に、個々のバックプレート３
に保持されるヒータ４の数を６本宛としたもので、これ
らの突出端部４Ａに接続されるリード線５は個別に制御
可能なように温度制御部９（図１の（Ａ）参照）に導か
れる。但し、グループ別もしくは全体を纏めて温度制御
部９に導くようにして同時制御されるようにしてもよ
い。FIG. 4 is different from the embodiment described with reference to FIGS. 1 to 3 in that a back plate 3 holding a heater 4 is arranged above and below the individual back plates 3.
The number of heaters 4 held in the heater is set to 6 and the lead wires 5 connected to these protruding ends 4A can be individually controlled so that the temperature controller 9 (see FIG. 1A) can be controlled. ). However, they may be controlled simultaneously by guiding them to the temperature control unit 9 group by group or as a whole.
【００１９】図５は更に他の例で本例は、図１〜図３に
示した実施例に対し、ヒータ４をバックプレート３の上
下方向に配設したものである。FIG. 5 shows still another example, which is different from the embodiment shown in FIGS. 1 to 3 in that the heater 4 is arranged in the vertical direction of the back plate 3.
【００２０】また、ヒータの形状も上述の例のように円
柱状に限られるものではなく、例えば円形断面を有する
円弧形状のものであってもよく、かかる場合、上述の形
状に合わせたヒータ支持孔とヒータとの間に同様の無機
質接着剤を充填することで、ヒータ交換時には同様の手
順でその接合状態を解除し、ヒータを引き出すことがで
きる。なお、充填はヒータをヒータ支持孔に挿入した後
に行うようにしてもよい。Further, the shape of the heater is not limited to the columnar shape as in the above-mentioned example, and may be, for example, an arc shape having a circular cross section. In such a case, the heater support corresponding to the above shape is provided. By filling the same inorganic adhesive between the holes and the heater, the joined state can be released and the heater can be pulled out by the same procedure when replacing the heater. The filling may be performed after inserting the heater into the heater support hole.
【００２１】更にまた、無機質接着剤の好適例として、
Ａｌ2 Ｏ3 とＭｇＯあるいはＳｉＣとＭｇＯとの混合体
を主成分とするものを挙げたが、耐熱性，充填性があ
り、しかもヒータ嵌合時には軟かく、熱によって硬化す
ると共に熱伝導性が高く、絶縁性があり、また脆性のあ
る無機質の接着剤、充填材である限りどのような材質の
ものであってもよいことはいうまでもない。Furthermore, as a preferable example of the inorganic adhesive,
The main component is a mixture of Al 2 O 3 and MgO or SiC and MgO. It has heat resistance and filling properties, is soft when fitted with a heater, and is hardened by heat and has thermal conductivity. It goes without saying that any material may be used as long as it is an inorganic adhesive or filler which is high, has insulating properties, and is brittle.
【００２２】[0022]
【発明の効果】以上説明してきたように、本発明によれ
ば、ヒータと前記貫通孔との間に熱伝導率が高く、硬化
時に脆性のある無機質接着剤を介在させたので、個別に
シースヒータの取換えを容易に行うことが可能となり、
ヒータ故障時に加熱部材全体の交換を必要としない上、
ヒータ支持孔のヒータに対する公差を大きくしてもヒー
タ周りの無機質接着剤充填によって空気の断熱層がなく
加熱部材との間に満足な熱伝導が得られる。従って電力
消費量の抑制に貢献するのみならず、適切な加熱による
型温の制御が可能であり、ヒータ自体の延命効果が期待
できる。As described above, according to the present invention, since an inorganic adhesive having high thermal conductivity and brittleness is interposed between the heater and the through hole, the sheath heater is individually provided. Can be easily replaced,
When the heater fails, it is not necessary to replace the entire heating member,
Even if the tolerance of the heater supporting hole with respect to the heater is increased, there is no heat insulating layer of air due to the filling of the inorganic adhesive around the heater, and satisfactory heat conduction with the heating member can be obtained. Therefore, not only contributing to the suppression of power consumption, but also the mold temperature can be controlled by appropriate heating, and the effect of extending the life of the heater itself can be expected.
【図１】本発明の構成を断面図（Ａ）およびヒータ周り
の拡大断面図（Ｂ）によって示す説明図である。FIG. 1 is an explanatory view showing a configuration of the present invention by a sectional view (A) and an enlarged sectional view (B) around a heater.
【図２】本発明にかかる加熱部材とモールドキャリアと
の組立状態を示す側面図である。FIG. 2 is a side view showing an assembled state of a heating member and a mold carrier according to the present invention.
【図３】本発明にかかるヒータ交換動作の説明図であ
る。FIG. 3 is an explanatory diagram of a heater replacement operation according to the present invention.
【図４】本発明の他の実施例を断面図（Ａ）および
（Ａ）のＢ−Ｂ線断面図（Ｂ）によって示す説明図であ
る。FIG. 4 is an explanatory view showing another embodiment of the present invention with sectional views (A) and a sectional view (B) taken along line BB of (A).
【図５】本発明の更に他の実施例を上面図（Ａ）および
（Ａ）のＣ−Ｃ線断面図（Ｂ）によって示す説明図であ
る。FIG. 5 is an explanatory view showing still another embodiment of the present invention by a top view (A) and a sectional view (B) taken along the line CC of FIG.
１ 金型 ２ モールドキャリア ３ 加熱部材（バックプレート） ３Ａ 凹部 ３Ｂ 孔部 ３Ｃ ヒータ支持孔 ４ ヒータ（シースヒータ） ４Ａ 突出端部 ５ リード線 ６ 無機質接着剤 ７ 締結ボルト ９ 温度制御部 １０ 温度設定器 ２０ 打抜きポンチ 1 Mold 2 Mold Carrier 3 Heating Member (Back Plate) 3A Recess 3B Hole 3C Heater Support Hole 4 Heater (Sheath Heater) 4A Projection End 5 Lead Wire 6 Inorganic Adhesive 7 Fastening Bolt 9 Temperature Controller 10 Temperature Setter 20 Punch punch
Claims (4)
れたカートリッジ式ヒータを有し、該ヒータと前記貫通
孔との間に熱伝導率が高く、硬化時に脆性のある無機質
接着剤を介在させたことを特徴とする鋳造用金型の加熱
装置。1. An inorganic adhesive having a cartridge-type heater fitted in a through hole of a heating member in contact with a mold, having a high thermal conductivity between the heater and the through hole, and being brittle during curing. A heating device for a casting mold, characterized in that a heating element is interposed.
2 Ｏ3 とＭｇＯまたはセラミック系ＳｉＣとＭｇＯを主
成分とすることを特徴とする請求項１に記載の鋳造用金
型の加熱装置。2. The inorganic adhesive is a ceramic Al
2. The heating device for a casting mold according to claim 1, wherein the main components are 2 O 3 and MgO or ceramic-based SiC and MgO.
装する円柱状のシースヒータであって、一方の端部に前
記発熱線に接続されるリード線を有することを特徴とす
る請求項１または２に記載の鋳造用金型の加熱装置。3. The cartridge-type heater is a cylindrical sheath heater having a heating wire inside, and has a lead wire connected to the heating wire at one end thereof. A heating device for the described casting mold.
貫通孔の個々に前記カートリッジ式ヒータが嵌合される
ことを特徴とする請求項１ないし３のいずれかの項に記
載の鋳造用金型の加熱装置。4. The heating member according to claim 1, wherein the heating member has a plurality of through holes, and the cartridge heater is fitted into each of the through holes. Heating device for casting mold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14914094A JPH0810898A (en) | 1994-06-30 | 1994-06-30 | Device for heating metallic mold for casting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14914094A JPH0810898A (en) | 1994-06-30 | 1994-06-30 | Device for heating metallic mold for casting |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0810898A true JPH0810898A (en) | 1996-01-16 |
Family
ID=15468638
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14914094A Pending JPH0810898A (en) | 1994-06-30 | 1994-06-30 | Device for heating metallic mold for casting |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0810898A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0909599A1 (en) * | 1997-10-17 | 1999-04-21 | Wilhelm Hedrich Vakuumanlagen GmbH & Co.KG | Mould closing apparatus |
| JP2002248545A (en) * | 2001-02-23 | 2002-09-03 | Sugitani Kinzoku Kogyo Kk | Forming die for extremely thin-walled cast of light metal alloy |
| JP2005322505A (en) * | 2004-05-10 | 2005-11-17 | Shigeru Sonohara | Wire connection structure of electric heater |
| WO2006030503A1 (en) * | 2004-09-15 | 2006-03-23 | Asahi Co., Ltd | Mold, method of manufacturing mold, block for forming heat exchange flow passage, and molded product |
| JP2008284555A (en) * | 2007-05-15 | 2008-11-27 | Mitsubishi Electric Corp | Die for die casting |
| JP2009090331A (en) * | 2007-10-09 | 2009-04-30 | Furukawa Battery Co Ltd:The | Casting device of lattice substrate for lead storage battery |
| JP2010162822A (en) * | 2009-01-19 | 2010-07-29 | Japan Steel Works Ltd:The | Mold apparatus |
-
1994
- 1994-06-30 JP JP14914094A patent/JPH0810898A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0909599A1 (en) * | 1997-10-17 | 1999-04-21 | Wilhelm Hedrich Vakuumanlagen GmbH & Co.KG | Mould closing apparatus |
| JP2002248545A (en) * | 2001-02-23 | 2002-09-03 | Sugitani Kinzoku Kogyo Kk | Forming die for extremely thin-walled cast of light metal alloy |
| JP2005322505A (en) * | 2004-05-10 | 2005-11-17 | Shigeru Sonohara | Wire connection structure of electric heater |
| JP4516783B2 (en) * | 2004-05-10 | 2010-08-04 | 繁 園原 | Wiring structure of electric heater |
| WO2006030503A1 (en) * | 2004-09-15 | 2006-03-23 | Asahi Co., Ltd | Mold, method of manufacturing mold, block for forming heat exchange flow passage, and molded product |
| JP2008284555A (en) * | 2007-05-15 | 2008-11-27 | Mitsubishi Electric Corp | Die for die casting |
| JP2009090331A (en) * | 2007-10-09 | 2009-04-30 | Furukawa Battery Co Ltd:The | Casting device of lattice substrate for lead storage battery |
| JP2010162822A (en) * | 2009-01-19 | 2010-07-29 | Japan Steel Works Ltd:The | Mold apparatus |
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