JPH08108287A

JPH08108287A - Chamfering method

Info

Publication number: JPH08108287A
Application number: JP6243574A
Authority: JP
Inventors: Seiji Ishibe; 征治石部
Original assignee: Individual
Current assignee: Individual
Priority date: 1994-10-07
Filing date: 1994-10-07
Publication date: 1996-04-30

Abstract

PURPOSE: To provide a chamfering method where the efficiency of chamfering a work is improved, even a recessed part of complicate shape can be chamfered, the part unnecessary for chamfering is not affected, and automation can be achieved by irradiating the laser beam of the intensity incapable of cutting a work at the position slightly deviated from the edge. CONSTITUTION: In a CO2 gas laser beam machine, oxygen is used as the assist gas for example, and a work 1 (a stainless steel sheet of 1mm in thickness) whose moving speed is 1m/min. is cut by the laser beam 4 in the just-focus condition with the output of the beam source of 500W. An edge is formed at the cut part of the work 1. The focus of the laser beam 4 is elevated by 1mm to the edge part of this work 1, and air is used as the assist gas, and the position where the beam center is deviated from the edge part by 0.5mm is irradiated with the laser beam with the output of the laser beam source of 500W and the moving speed of the work of 2m/min. A uniform and excellent chamfered part 3 is formed thereby.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明は、切断や穴加工によって
生じるほぼ直角に近いエッジ部分に丸みをもたせる面取
りをレーザ加工によって行なう面取り加工方法に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chamfering method by laser machining for chamfering an edge portion, which is formed by cutting or drilling, and has a substantially right angle.

【０００２】[0002]

【従来の技術】レーザ加工や機械的に加工された金属、
或いは鋳物のエッジ部分はほぼ直角のもの、鋭角をなす
ものなど、そのままでは手に触れて痛かったり、衣服等
の表面に傷を付けるなどの問題があって、エッジ部分に
丸みを持たせる面取り加工が施されている。この面取り
加工の手段としてはサンドペーパーや鑢でエッジ部分を
手作業で研摩するとか、サンドブラスト等の機械的な強
制除去方法が採用されてきた。2. Description of the Related Art Laser processed or mechanically processed metal,
Or, the chamfering process that makes the edge part round, because the edge part of the casting is almost right-angled or has an acute angle, there is a problem that it will be touched by hand and scratch the surface of clothes etc. Has been applied. As a method of this chamfering, sandpaper or sandpaper has been used to manually grind the edge portion, or a mechanical forced removal method such as sandblasting has been adopted.

【０００３】[0003]

【発明が解決しようとする課題】手作業で研摩して面取
りする場合は能率が悪い。サンドブラスト等の機械的な
研摩手段は、能率はよいが、複雑な形状の場合特に凹部
に面取りできない部分が生じる難点がある。また、精密
な加工の施されている場合はサンドブラスト等の機械的
な研摩手段は適していない。更に、面取りの必要のない
部分への影響もある。When chamfering by polishing manually, the efficiency is low. Although mechanical polishing means such as sandblasting is efficient, it has a drawback in that, in the case of a complicated shape, a recessed portion cannot be chamfered. Further, when precision processing is performed, mechanical polishing means such as sandblasting is not suitable. Furthermore, there is also an effect on the part that does not require chamfering.

【０００４】[0004]

【課題を解決するための手段】本発明は、切断や穴加工
によって形成されたワークのエッジを面取りするに際し
て、エッジより少しずれた位置に切断しない程度のレー
ザ光を照射してエッジを除去することを特徴とする。こ
こにいうエッジより少しずれた位置とは、切断や穴加工
の施された部分の端面からワーク本体側へ0.3〜0.8mm、
好ましくは0.3〜0.5mmレーザ光をずらすのである。ま
た、切断しない程度のレーザ光を照射する方法として
は、光源出力を低下させるとか、ワーク又は光源の移動
速度を速くするとか、アシストガス又は焦点距離を通常
の切断等の加工時に比べて弱くなるように設定する等で
ある。According to the present invention, when chamfering an edge of a work formed by cutting or drilling, the edge is removed by irradiating a laser beam which does not cut at a position slightly deviated from the edge. It is characterized by The position slightly displaced from the edge mentioned here means 0.3 to 0.8 mm from the end face of the part that has been cut or drilled to the work body side,
It is preferable to shift the laser beam by 0.3 to 0.5 mm. Further, as a method of irradiating the laser light to the extent that cutting is not performed, the light source output is reduced, the moving speed of the work or the light source is increased, or the assist gas or the focal length becomes weaker than that during processing such as normal cutting. And so on.

【０００５】[0005]

【作用】本発明のエッジより少しずれた位置に切断しな
い程度のレーザ光を照射することによって、容易かつ正
確にワークの面取りが可能となる。特に鋭角部分の面取
りが隅々まで効率的に行なえるようになる。また、レー
ザ光で切断した場合は、その後、直ちに少し位置をずら
せて倣い走行をすればよいので、制御が極めて容易であ
る。The chamfering of the work can be easily and accurately performed by irradiating the laser beam at a position slightly deviated from the edge of the present invention so that the laser beam is not cut. In particular, chamfering of sharp corners can be performed efficiently in every corner. Further, when the cutting is performed by the laser beam, it is sufficient to immediately shift the position a little and then follow the traveling, so that the control is extremely easy.

【０００６】[0006]

【実施例】【Example】

実施例１炭酸ガスレーザ加工装置において、まず、アシストガ
スに酸素を用い、光源出力500Ｗ、ワーク(１mm厚ステン
レス板)の移動速度１ｍ／minにして、図１〜図３のよう
にレーザビーム４をジャストフォーカス(適正焦点)で切
断した。ワーク１の切断された部分にはエッジ２が形成
されている。Example 1 In a carbon dioxide laser processing apparatus, first, oxygen was used as an assist gas, a light source output was 500 W, a moving speed of a work (1 mm thick stainless steel plate) was 1 m / min, and a laser beam 4 was emitted as shown in FIGS. It was cut at just focus. An edge 2 is formed on the cut portion of the work 1.

【０００７】このワークのエッジ部分に対して、図４
のようにビームの焦点を１mm上昇させ、アシストガスに
空気を用い、かつビーム中心をエッジ部分から0.5mmず
らした位置へ、光源出力500Ｗ、ワークの移動速度２ｍ
／minにして照射した。これにより均一で良好な面取り
部３が形成された。The edge portion of this work is shown in FIG.
The beam focus is raised by 1 mm, air is used as the assist gas, and the beam center is shifted 0.5 mm from the edge, the light source output is 500 W, and the work speed is 2 m.
/ Min and irradiated. As a result, a uniform and good chamfer 3 was formed.

【０００８】実施例２アシストガスに酸素を用い、光源出力300Ｗ、ワーク
(1.5mm厚鋼板)の移動速度1.2ｍ／minにして、レーザビ
ームをジャストフォーカスで切断した。ワークの切断さ
れた部分には通常みられるエッジが形成された。Example 2 Oxygen was used as an assist gas, the light source output was 300 W, and the workpiece was
The laser beam was cut by just focus at a moving speed of (1.5 mm thick steel plate) of 1.2 m / min. Edges that are normally seen were formed on the cut part of the work.

【０００９】このワークのエッジ部分に対して、アシ
ストガスに窒素を用い、かつレーザビーム中心をエッジ
部分から0.3mmずらした位置へ、光源出力300Ｗ、ワーク
の移動速度を2.4ｍ／minにして照射した。これによって
良好な面取りができた。Irradiate the edge part of this work with a light source output of 300 W and a work moving speed of 2.4 m / min at a position where nitrogen is used as an assist gas and the center of the laser beam is displaced 0.3 mm from the edge part. did. This enabled good chamfering.

【００１０】[0010]

【発明の効果】本発明によってワークの面取りの能率を
向上させ、複雑な形状の場合でも凹部の面取りを可能と
した。また、ワークの面取りの必要のない部分への影響
もない優れた面取り方法となっている。加えて、レーザ
加工から面取りに到る工程の自動化を可能にした。According to the present invention, the efficiency of chamfering of a work is improved and the chamfering of a recess can be performed even in the case of a complicated shape. In addition, it is an excellent chamfering method that does not affect the part of the work that does not need chamfering. In addition, it has made it possible to automate the processes from laser processing to chamfering.

【図面の簡単な説明】[Brief description of drawings]

【図１】レーザ加工の様子を示す斜視図である。FIG. 1 is a perspective view showing a state of laser processing.

【図２】レーザによる切断を完了した部品の斜視図であ
る。FIG. 2 is a perspective view of a component that has been cut by a laser.

【図３】図２中Ａ−Ａ断面拡大図である。FIG. 3 is an enlarged view taken along the line AA in FIG.

【図４】レーザによる面取りの様子を示す断面拡大図で
ある。FIG. 4 is an enlarged cross-sectional view showing a state of chamfering with a laser.

【符号の説明】[Explanation of symbols]

１ワーク２エッジ３面取り部４レーザビーム 1 Work 2 Edge 3 Chamfer 4 Laser beam

Claims

【特許請求の範囲】[Claims]

【請求項１】切断や穴加工によって形成されたワーク
のエッジを面取りするに際して、エッジより少しずれた
位置に切断しない程度のレーザ光を照射してエッジを除
去することを特徴とする面取り加工方法。1. A chamfering method, wherein when chamfering an edge of a work formed by cutting or boring, the edge is removed by irradiating a laser beam to a position slightly deviated from the edge so as not to cut. .