JPH08102574A - Hybrid integrated circuit device - Google Patents
Hybrid integrated circuit deviceInfo
- Publication number
- JPH08102574A JPH08102574A JP6237504A JP23750494A JPH08102574A JP H08102574 A JPH08102574 A JP H08102574A JP 6237504 A JP6237504 A JP 6237504A JP 23750494 A JP23750494 A JP 23750494A JP H08102574 A JPH08102574 A JP H08102574A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- connector
- lead
- integrated circuit
- hybrid integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Detail Structures Of Washing Machines And Dryers (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、混成集積回路装置に関
するもので、特に小型化、耐湿性および放熱性を考慮し
た混成集積回路装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hybrid integrated circuit device, and more particularly to a hybrid integrated circuit device in consideration of miniaturization, moisture resistance and heat dissipation.
【0002】[0002]
【従来の技術】まず一般の洗濯機に関する構造を図5を
用いて簡単に説明する。この構造は、実願昭63ー89
874号に関するものであり、図5に於いて1は、機
枠、2は前記機枠1の上部後方に設けられたの給水ユニ
ットや電源スイッチ等を収容する給水部、3は前記機枠
1内に弾性的に設けられた外槽、4はこの外槽3に内設
され、周囲に多数の脱水孔5・・・を有する脱水兼洗濯
槽、6は前記洗濯槽の底部に設けられた回転翼、7は前
記外槽の外底部に設けられた駆動モータであり、洗濯槽
3および回転翼に小プーリー8、大プーリー9、ベルト
10および動力伝達機構11を介して連結され、洗濯時
には前記回転翼6を反転させ、脱水時には前記洗濯槽4
および回転翼6を共に高速で一方向に回転させる。12
は前記外槽3の底部に設けられた排水口、13は排水口
に接続された配水管、14は配水管13に介在された排
水電動弁、15は吸水管16に介在された給水電磁弁で
ある。2. Description of the Related Art First, the structure of a general washing machine will be briefly described with reference to FIG. This structure has
In FIG. 5, reference numeral 1 is a machine frame, 2 is a water supply unit provided in the upper rear part of the machine frame 1 for accommodating a water supply unit, a power switch, and the like, and 3 is the machine frame 1 An outer tub 4 elastically provided inside is provided in the outer tub 3 and has a dehydration and washing tub having a large number of dewatering holes 5 ... Surrounding it, and 6 is provided at the bottom of the washing tub. Rotating blades 7 are drive motors provided on the outer bottom of the outer tub, which are connected to the washing tub 3 and the rotating blades via a small pulley 8, a large pulley 9, a belt 10 and a power transmission mechanism 11, and are used for washing. The rotary wing 6 is turned over so that the washing tub 4 can be used for dehydration.
And both the rotary blades 6 are rotated at high speed in one direction. 12
Is a drainage port provided at the bottom of the outer tub 3, 13 is a water distribution pipe connected to the drainage port, 14 is a drainage electric valve interposed in the water distribution pipe 13, and 15 is a water supply solenoid valve interposed in the water absorption pipe 16. Is.
【0003】前記電源スイッチは、例えば駆動モータ用
の駆動回路がプリント基板等に実装され、半導体IC、ト
ランス、ブザーおよびコンデンサ等で構成されている。
またこの給水部の表面には洗濯や脱水等のスイッチが並
び、これはこのプリント基板と電気的に接続され、これ
らスイッチの背面に接続されている。また機枠1の背面
に隠れて配線が設けられ駆動モータと電気的に接続され
ている。The power switch has, for example, a drive circuit for a drive motor mounted on a printed circuit board or the like, and is composed of a semiconductor IC, a transformer, a buzzer, a capacitor and the like.
Further, switches for washing, dehydration and the like are arranged on the surface of the water supply section, which are electrically connected to the printed circuit board and are connected to the back surfaces of these switches. Wiring is provided hidden behind the machine frame 1 and electrically connected to the drive motor.
【0004】[0004]
【発明が解決しようとする課題】前述のような構成の洗
濯機を用いる場合、前記給水部の基板は、水を使用する
ために漏電等の配慮が施され水が進入できないように完
全防水型になっている。しかし洗濯槽の老朽化により水
がこぼれることを考えた場合、給水部は上方に設けた方
が好ましく、そのためにこの給水部が従来高い位置に配
置されることになり、必然的に洗濯機の高さが高くなり
洗濯物を取り出す際に取り出しにくく、また操作がしに
くい問題があった。When the washing machine having the above-mentioned structure is used, the base plate of the water supply section is of a completely waterproof type so that water cannot enter due to consideration of leakage due to the use of water. It has become. However, considering that water may be spilled due to the deterioration of the washing tub, it is preferable to install the water supply part in the upper part. There is a problem that the height becomes high and it is difficult to take out the laundry when it is taken out, and the operation is difficult.
【0005】また放熱性の良い金属基板を採用するた
め、図4のように少なくとも底部が金属で成るケースに
当接させて、金属基板の熱を外部に放出していたが、こ
の場合プリント基板が前記金属基板の上層となるため、
コネクタはこのプリント基板の上に実装され、本混成集
積回路装置の厚さが厚くなりコンパクト化できない問題
があった。またコネクタのリードが完全に隠れるように
樹脂が注入されるため、モールド厚が厚い問題もあっ
た。Further, since a metal substrate having a good heat dissipation property is adopted, as shown in FIG. 4, the heat of the metal substrate is radiated to the outside by being brought into contact with a case having at least a bottom portion made of metal. Is an upper layer of the metal substrate,
The connector is mounted on this printed circuit board, and there is a problem that the thickness of the hybrid integrated circuit device becomes thick and it cannot be made compact. Further, since the resin is injected so that the leads of the connector are completely hidden, there is a problem that the mold thickness is large.
【0006】以上、湿気の多い雰囲気内で、耐湿性、放
熱性、非漏電性、コンパクト化および取り扱い易さ等を
一度に解決したものが要望されていた。[0006] As described above, there has been a demand for a product that can solve the problems of moisture resistance, heat dissipation, non-leakage, compactness, and ease of handling all at once in a humid atmosphere.
【0007】[0007]
【課題を解決するための手段】本発明は前述の問題に鑑
みて成され、第1に、ケースには、その底面から前記第
2基板、この第2基板上にサイズの小さい第1基板が積
層され、第1基板と対向しない前記第2基板上に、前記
スルーホールにリードが挿入されたコネクタが設けら
れ、封止樹脂表面は、前記リードの付け根且つ前記第1
基板裏面よりも上層に設けられることで解決するもので
ある。SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems. First, the case has the second substrate from the bottom surface thereof, and the first substrate having a small size on the second substrate. A connector having a lead inserted into the through hole is provided on the second substrate that is laminated and does not face the first substrate, and a sealing resin surface has a root of the lead and the first substrate.
The solution is to be provided in a layer above the back surface of the substrate.
【0008】第2に、ケースには、その底面から前記第
2基板、この第2基板上にサイズが小さい前記第1基板
が積層され、第1基板の導電路が設けられた面が前記第
2基板表面と対向し、前記導電路が設けられた面に固着
されたリードがスルーホールを介して前記第2基板と電
気的に固着され、前記第1基板と対向しない前記第2基
板上に、前記スルーホールにリードが挿入されたコネク
タが設けられ、封止樹脂表面は、前記リードの付け根且
つ前記第1基板裏面よりも上層に設けられることで解決
するものである。Secondly, in the case, the second substrate is stacked from the bottom surface thereof, the first substrate having a small size is laminated on the second substrate, and the surface of the first substrate on which the conductive paths are provided is the first substrate. On the second substrate, which is opposed to the surface of the second substrate, the leads fixed to the surface provided with the conductive path are electrically fixed to the second substrate through the through holes and do not face the first substrate. A solution is provided in which a connector having a lead inserted in the through hole is provided, and the sealing resin surface is provided at the base of the lead and above the back surface of the first substrate.
【0009】[0009]
【作用】第1に、ケースには、その底面から前記第2基
板、この第2基板上にサイズの小さい第1基板が積層さ
れ、第1基板と対向しない前記第2基板上に、スルーホ
ールにリードが挿入されたコネクタを設けることで、接
続部が剥がれない状態でしっかりとコネクタが設けら
れ、上層基板よりも一段下がった位置に、コネクタが設
けられるため封止樹脂厚も薄くコンパクト化が実現でき
る。しかも封止樹脂表面は、前記リードの付け根且つ前
記第1基板裏面よりも上層に設けられることでコネクタ
と上層に設けられる基板の耐湿性、漏電性が十分に確保
できる。First, in the case, the second substrate is stacked from the bottom surface thereof, and the first substrate having a small size is stacked on the second substrate, and the through hole is formed on the second substrate which does not face the first substrate. By providing the connector with the lead inserted in the connector, the connector is firmly provided in the state where the connection part is not peeled off, and the connector is provided at a position one step lower than the upper layer substrate, so that the sealing resin thickness is thin and compact. realizable. Moreover, the surface of the sealing resin is provided above the root of the lead and above the back surface of the first substrate, whereby sufficient moisture resistance and electric leakage can be ensured for the connector and the substrate provided on the upper layer.
【0010】第2に、前記第1の作用の他に、第1基板
の導電路が設けられた面が前記第2基板表面と対向させ
ることで、第1基板裏面が封止樹脂近傍に位置し、第1
基板の熱は、若干の厚さの封止樹脂を介して放熱させる
ことができる。Secondly, in addition to the first action, the surface of the first substrate on which the conductive paths are provided faces the surface of the second substrate, so that the back surface of the first substrate is located near the sealing resin. And first
The heat of the substrate can be radiated through the sealing resin having a slight thickness.
【0011】[0011]
【実施例】以下に本発明の実施例を説明する。洗濯機の
図面は、従来例で用いた図5を共用する。前記機枠1の
上部後方に設けられた給水部2は、洗濯機を駆動するた
めの操作パネルが設けられ、従来ではこの下方に、これ
らと電気的に接続されている駆動回路が組み込まれた基
板が設けられていたが、本発明ではこの回路を組み込ん
だ装置が実現され、給水部にはこの回路を省略してい
る。また最近では、図番30で示した領域に操作パネル
が設けられ、給水部の上に突出した領域が全く省略され
ているものもある。どちらにしても操作パネル部の下層
には駆動回路の基板を設けていない(あるいは削減して
いる)ので、操作パネル部の位置を従来構造よりも低く
設定できる。また従来は駆動モータとの接続配線を機枠
1背面の外側または内側に設ける必要があるが、一番駆
動能力が高いために配線を太くする必要があるこの配線
は、この機枠背面に設ける必要がなくなった。Embodiments of the present invention will be described below. The drawing of the washing machine shares FIG. 5 used in the conventional example. The water supply unit 2 provided at the upper rear of the machine casing 1 is provided with an operation panel for driving the washing machine, and conventionally, a drive circuit electrically connected to these is installed below the operation panel. Although the board was provided, the present invention realizes a device incorporating this circuit, and omits this circuit in the water supply section. Further, recently, in some cases, an operation panel is provided in the area shown in FIG. 30 and the area protruding above the water supply section is omitted altogether. In either case, since the substrate for the drive circuit is not provided (or eliminated) in the lower layer of the operation panel unit, the position of the operation panel unit can be set lower than that of the conventional structure. Conventionally, it is necessary to provide a connection wiring with a drive motor on the outside or inside of the rear surface of the machine frame 1, but it is necessary to make the wiring thick because it has the highest driving ability. I no longer need it.
【0012】水がたまる洗濯槽4の底部には、駆動モー
ター7が設けられ小プーリー8と大プーリー9およびベ
ルト10の動力伝達機構11を介し、洗濯時には回転翼
6が、脱水時には洗濯槽4および回転翼6が共に高速で
一方向に回転している。本願は、図2の構造のものが前
記駆動モーター7の近傍に設けられ、ここには駆動モー
ターの冷却用にファン31が設けられている。A drive motor 7 is provided at the bottom of the washing tub 4 where water accumulates, and a rotary pulley 6 is used for washing, and a washing tub 4 is used for dewatering via a power transmission mechanism 11 of a small pulley 8 and a large pulley 9 and a belt 10. And both the rotary blades 6 are rotating at high speed in one direction. In the present application, the structure shown in FIG. 2 is provided in the vicinity of the drive motor 7, and a fan 31 is provided here for cooling the drive motor.
【0013】またこのファン31により外部雰囲気から
流れてくる空気の流れ、所謂冷却風を有効に活用してお
り、図に示した矢印のような風の流れに本構造の混成集
積回路を挿入し効果的に基板に発生する熱を放出してい
る。図では流入路を活用しているが、流出路でもよく、
機枠や外槽またはモーター等が実装されている空間の一
領域に、また別途ステージを設けて配置しても良い。Further, the flow of air flowing from the outside atmosphere, that is, so-called cooling air is effectively utilized by the fan 31, and the hybrid integrated circuit of this structure is inserted into the air flow as shown by the arrow in the figure. The heat generated in the substrate is effectively released. Although the inflow path is used in the figure, it may be an outflow path,
A stage may be separately provided in one area of the space in which the machine frame, the outer tub, the motor, etc. are mounted.
【0014】また図番33は混成集積回路装置であり、
固定金具34で洗濯機の底面に固定されているが、固定
方法はこれに限らず、縦に配置しても良い。ただし洗濯
水や水道からの水が洗濯機の底部に進入すると、特に漏
電等の問題を無くしているが、底面から離れて配置すべ
きである。また本装置の上部から水の滴下の可能性もあ
るので、ケースの封止樹脂面は、下方に向いていること
が好ましい。Reference numeral 33 is a hybrid integrated circuit device,
Although it is fixed to the bottom surface of the washing machine by the fixing metal fitting 34, the fixing method is not limited to this, and may be arranged vertically. However, when washing water or water from the tap enters the bottom of the washing machine, it eliminates problems such as electric leakage, but should be placed away from the bottom. Further, since water may drop from the upper part of the device, it is preferable that the sealing resin surface of the case faces downward.
【0015】更に放熱性を考えた場合、ケースに封止さ
れる上層基板は、金属基板が好ましい。この場合、この
金属基板は、耐湿性を考え、表面に薄く樹脂が被覆され
ていることが好ましい。次に混成集積回路装置の一実施
例を図1を参照しながら説明する。この実施例は、プリ
ント基板41と混成集積回路基板42を一体にしたもの
で、第1基板42は、表面を絶縁処理した金属基板であ
り、×印でハッチングしたもので、表面に所定の導電路
や半導体チップ等が実装されている。以下半導体素子が
実装された面を表面とし、ハッチング面を裏面とした。
また第2基板41は、第1基板が実装される面を表面と
した。Further considering the heat dissipation, the upper substrate sealed in the case is preferably a metal substrate. In this case, it is preferable that the surface of the metal substrate is thinly coated with resin in consideration of moisture resistance. Next, an embodiment of the hybrid integrated circuit device will be described with reference to FIG. In this embodiment, a printed circuit board 41 and a hybrid integrated circuit board 42 are integrated with each other. The first board 42 is a metal board whose surface has been subjected to an insulation treatment. Roads, semiconductor chips, etc. are mounted. Hereinafter, the surface on which the semiconductor element is mounted is referred to as the front surface, and the hatching surface is referred to as the back surface.
The second substrate 41 has the surface on which the first substrate is mounted as the front surface.
【0016】ここで金属基板42は、アルマイト処理さ
れたAl基板であり、この表面には絶縁性の優れた樹脂
が全面に被覆され、この上には所定のパターンの導電路
がホットプレスで被着されている。またこの上には、半
導体チップ、例えばLSIチップ、Tr、ダイオードお
よび抵抗等が半田で電気的に固着され、所望の回路が構
成されている。ここでは前述したように操作パネルを介
して駆動モータ7等を駆動する回路が実装されている。
また半導体チップと第1の基板42は、必要により金属
細線がワイヤーボンドされ、この第1の基板42の二側
辺には、導電路等から導出された端子群が設けられ、L
字型のリード43・・・が半田等で電気的に接続されて
いる。またLSIチップ表面は、エポキシ樹脂等がポッ
ティングされている。Here, the metal substrate 42 is an alumite-treated Al substrate, the surface of which is coated with a resin having an excellent insulating property, and a conductive path having a predetermined pattern is formed on the surface by hot pressing. It is worn. Further, a semiconductor chip, for example, an LSI chip, a Tr, a diode, a resistor and the like are electrically fixed by soldering on this, thereby forming a desired circuit. Here, as described above, the circuit for driving the drive motor 7 and the like via the operation panel is mounted.
If necessary, the semiconductor chip and the first substrate 42 are wire-bonded with a fine metal wire, and a terminal group derived from a conductive path or the like is provided on two sides of the first substrate 42.
The V-shaped leads 43 ... Are electrically connected by soldering or the like. The surface of the LSI chip is potted with epoxy resin or the like.
【0017】次にプリント基板41は、実装強度上サー
フェイスマウントは好ましくないコネクタ44等の外づ
け部品がスルーホールTを介して実装され、この基板4
1の表面や裏面に形成された導電路やこれから延在され
る電極パッドと半田で電気的に接続されている。または
少なくともコネクタ44は、スルーホールTにリードが
挿入された状態で半田で電気的に接続されている。ここ
でプリント基板41は、エポキシ樹脂より成っている
が、例えばスルーホールが形成可能な基板であるセラミ
ック基板等でも良い。また前記コネクタ44は、プリン
ト基板のサイド、すなわち第1基板42との非重畳領域
に設けられ、前述したように、洗濯機の一領域に取り付
けられた相手側のコネクタとコンタクトしている。Next, on the printed circuit board 41, external components such as a connector 44, which is not preferable for surface mounting in terms of mounting strength, are mounted through the through holes T.
The conductive paths formed on the front surface and the back surface of No. 1 and the electrode pads extending from the conductive paths are electrically connected by solder. Alternatively, at least the connector 44 is electrically connected by solder with the lead inserted in the through hole T. Here, the printed board 41 is made of epoxy resin, but may be, for example, a ceramic board which is a board in which through holes can be formed. Further, the connector 44 is provided on the side of the printed circuit board, that is, in a non-overlapping region with the first substrate 42, and as described above, is in contact with the mating connector attached to one region of the washing machine.
【0018】一方、ケース45は、前記一対の基板4
1,42の外形よりも若干大きく形成され、矢印のよう
にケースに簡単に挿入できるようになっている。またケ
ース45の底面は、前記プリント基板41の裏面と当接
し、この裏面に設けられた電気的手段(例えば配線、ス
ルーホールを介して挿入されたリード等)との電気的絶
縁を考慮して、ケース自体が絶縁性樹脂で一体成型され
ている。また残ったこの空間にはウレタンやエポキシ等
の絶縁性樹脂46等が注入されている。これを説明した
ものが図2であり、またその断面図が図3である。On the other hand, the case 45 includes the pair of substrates 4
It is formed to be slightly larger than the outer shapes of 1, 42 so that it can be easily inserted into the case as indicated by the arrow. Further, the bottom surface of the case 45 contacts the back surface of the printed circuit board 41, and in consideration of electrical insulation from the electrical means (for example, wiring, leads inserted through through holes, etc.) provided on the back surface. , The case itself is integrally molded with insulating resin. Insulating resin 46 such as urethane or epoxy is injected into the remaining space. FIG. 2 illustrates this, and FIG. 3 is a sectional view thereof.
【0019】本発明の特徴は、第1に、第2基板41の
表面にサイズの小さい第1基板42を実装し、第1基板
と重畳しない、つまり第1基板の周辺にコネクタ44を
設けたことにある。つまり第2基板41は、スルーホー
ルTが設けられる必要があり、コネクタ44のリード4
7は、スルーホールTに挿入され、半田で固着されてい
る。ここでは第2基板の裏面に電極が設けられ、この電
極、リードが半田を介して固着されている。従ってコネ
クタは、第1基板42よりも一段低い所にしっかりと固
着されており、一段下がった分注入樹脂厚が薄くその分
コンパクト化が実現できる。しかもリードの付け根およ
び第1基板42裏面よりも封止樹脂46の表面が上層に
配置されることで、コネクタリード47間は完全に被覆
され、第1基板42は完全に覆われるので、湿気の多い
ところであっても漏電等の問題は生じない。The feature of the present invention is, firstly, that the first substrate 42 having a small size is mounted on the surface of the second substrate 41 and does not overlap the first substrate, that is, the connector 44 is provided around the first substrate. Especially. That is, the second substrate 41 needs to be provided with the through hole T, and the lead 4 of the connector 44 is provided.
7 is inserted into the through hole T and fixed by soldering. Here, an electrode is provided on the back surface of the second substrate, and the electrode and the lead are fixed via solder. Therefore, the connector is firmly fixed at a position one step lower than the first substrate 42, and the thickness of the injected resin is thin due to the step down, so that the connector can be made compact accordingly. Moreover, since the root of the lead and the surface of the sealing resin 46 are disposed above the root of the first substrate 42, the space between the connector leads 47 is completely covered, and the first substrate 42 is completely covered. Even in many places, problems such as leakage do not occur.
【0020】第2に、前記第1の特徴以外に、第1基板
42の裏面が上になり、この上に前記封止樹脂が若干薄
く配置されるため、(本実施例では約1ミリである)、
第1基板に発生した熱は、この薄い封止樹脂により外部
に放出できる。従って、第2基板をケース底面に当接す
る(具体的には第2基板の裏面に形成された導電手段が
当接する)ため、図4のケース底面の導電体を絶縁体に
変えた樹脂一体成型にしても、この薄い封止樹脂により
従来の放熱効果と同等のものを実現できる。Secondly, in addition to the first characteristic, the back surface of the first substrate 42 is on the upper side, and the sealing resin is disposed on this slightly thinly. is there),
The heat generated in the first substrate can be released to the outside by this thin sealing resin. Therefore, the second substrate is brought into contact with the bottom surface of the case (specifically, the conductive means formed on the back surface of the second substrate is brought into contact), so that the conductor on the bottom surface of the case in FIG. However, this thin sealing resin can realize the same heat radiation effect as the conventional one.
【0021】またしっかりと固定されたコネクタが封止
樹脂から露出してあり、たんに相手側のコネクタに差し
込めば良く、コンパクトでワンタッチ接続が可能なもの
が実現できる。また第1基板に半導体チップを固着でき
るために駆動回路の実装された本体は、大幅に小さくで
きそのために、図5に示すような駆動モーターが設置さ
れたところの狭い空き空間に設置でき、洗濯機の操作パ
ネルの位置を低く設定できる。しかも本混成集積回路装
置は、駆動モータのファンにより発生する冷却風によ
り、基板に熱が発生しても効率よく冷却することができ
る。Further, the firmly fixed connector is exposed from the encapsulating resin, and it suffices to simply insert the connector into the mating connector, and a compact and one-touch connection can be realized. In addition, since the semiconductor chip can be fixed to the first substrate, the main body on which the drive circuit is mounted can be made significantly smaller, which allows it to be installed in a narrow empty space where a drive motor as shown in FIG. 5 is installed. The position of the control panel of the machine can be set low. Moreover, the hybrid integrated circuit device can be efficiently cooled by the cooling air generated by the fan of the drive motor even if heat is generated on the substrate.
【0022】[0022]
【発明の効果】以上の説明から明らかなように、第1に
本装置には、操作部や駆動モーターを除いて、電源部、
駆動回路やパワー出力部等が組み込めるため、また駆動
モータの近傍の狭いあいている空間に配置でき、洗濯機
の操作部を高くしている原因の一つである操作パネル下
層の回路基板を省略でき、操作パネル面を低い位置に設
定できる。As is apparent from the above description, firstly, in the present device, the power supply unit, except for the operation unit and the drive motor,
Since the drive circuit and power output part can be installed, it can be placed in a narrow open space near the drive motor, which is one of the reasons for raising the operating part of the washing machine. The circuit board under the operation panel is omitted. Yes, the operation panel surface can be set to a low position.
【0023】しかもコネクタは、第2基板のスルーホー
ルを介して実装されるため、強度的にもサイズ的にも改
善することができる。また封止樹脂の表面よりも下層に
前記コネクタのリードや第1基板の裏面が配置されるた
め、コネクタのリード間や第1基板の回路の耐湿性、耐
漏電性が改善される。更には、プリント基板を絶縁性の
ケースの底面に配置したため、第1基板の裏面を封止樹
脂の表面近傍まで近接させ、第1基板の熱を薄く設けら
れたこの封止樹脂により効率よく放熱させているので、
従来構造と同等の放熱性を保つことができる。Moreover, since the connector is mounted through the through hole of the second substrate, the strength and size can be improved. Further, since the leads of the connector and the back surface of the first substrate are arranged in a layer lower than the surface of the sealing resin, the moisture resistance and the leakage resistance of the circuit between the leads of the connector and the circuit of the first substrate are improved. Furthermore, since the printed circuit board is arranged on the bottom surface of the insulating case, the back surface of the first substrate is brought close to the surface of the sealing resin, and the heat of the first substrate is efficiently dissipated by the thin sealing resin. I am making it
It is possible to maintain heat dissipation equivalent to that of the conventional structure.
【図1】本発明の混成集積回路装置の組立構成を説明す
る図である。FIG. 1 is a diagram illustrating an assembly configuration of a hybrid integrated circuit device of the present invention.
【図2】本発明の混成集積回路装置の図である。FIG. 2 is a diagram of a hybrid integrated circuit device of the present invention.
【図3】図2の断面図である。3 is a cross-sectional view of FIG.
【図4】従来の混成集積回路装置の断面図である。FIG. 4 is a cross-sectional view of a conventional hybrid integrated circuit device.
【図5】混成集積回路装置が実装された洗濯機の図であ
る。FIG. 5 is a diagram of a washing machine in which a hybrid integrated circuit device is mounted.
41 第2の基板 42 第1の基板 43 リード 44 コネクタ 45 ケース 46 封止樹脂 47 コネクタリード 41 Second Substrate 42 First Substrate 43 Lead 44 Connector 45 Case 46 Sealing Resin 47 Connector Lead
Claims (2)
その表面に設けられた金属性の第1基板と、この金属性
基板と積層されスルーホールを有する第2基板とを絶縁
性ケースに収納し樹脂封止された混成集積回路装置に於
いて、 前記ケースには、その底面から前記第2基板、この第2
基板上にサイズの小さい第1基板が積層され、第1基板
と対向しない前記第2基板上に、前記スルーホールにリ
ードが挿入されたコネクタが設けられ、前記封止樹脂表
面は、前記リードの付け根且つ前記第1基板裏面よりも
上層に設けられることを特徴とする混成集積回路装置。1. An insulating case accommodates a metallic first substrate provided with a conductive path at least on its surface through an adhesive resin, and a second substrate laminated with the metallic substrate and having a through hole. In the resin-sealed hybrid integrated circuit device, the second substrate, the second substrate
A first substrate having a small size is laminated on a substrate, a connector having a lead inserted into the through hole is provided on the second substrate that does not face the first substrate, and the sealing resin surface is formed on the surface of the lead. A hybrid integrated circuit device, characterized in that the hybrid integrated circuit device is provided at the base and above the back surface of the first substrate.
その表面に設けられた金属性の第1基板と、この金属性
基板と積層されスルーホールを有する第2基板とを絶縁
性ケースに収納し樹脂封止された混成集積回路装置に於
いて、 前記ケースには、その底面から前記第2基板、この第2
基板上にサイズが小さい前記第1基板が積層され、前記
第1基板の導電路が設けられた面が前記第2基板表面と
対向し、前記導電路が設けられた面に固着されたリード
が前記スルーホールを介して前記第2基板と電気的に固
着され、前記第1基板と対向しない前記第2基板上に、
前記スルーホールにリードが挿入されたコネクタが設け
られ、前記封止樹脂表面は、前記リードの付け根且つ前
記第1基板裏面よりも上層に設けられることを特徴とす
る混成集積回路装置。2. An insulating case accommodates a metallic first substrate provided with a conductive path at least on its surface via an adhesive resin, and a second substrate laminated with the metallic substrate and having a through hole. In the resin-sealed hybrid integrated circuit device, the second substrate, the second substrate
The first substrate having a small size is laminated on the substrate, the surface of the first substrate on which the conductive path is provided faces the surface of the second substrate, and the lead fixed on the surface of the conductive path is provided. On the second substrate, which is electrically fixed to the second substrate through the through hole and does not face the first substrate,
The hybrid integrated circuit device is characterized in that a connector having a lead inserted therein is provided in the through hole, and the surface of the sealing resin is provided at a base of the lead and above the back surface of the first substrate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23750494A JP3778586B2 (en) | 1994-09-30 | 1994-09-30 | Hybrid integrated circuit device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23750494A JP3778586B2 (en) | 1994-09-30 | 1994-09-30 | Hybrid integrated circuit device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH08102574A true JPH08102574A (en) | 1996-04-16 |
JP3778586B2 JP3778586B2 (en) | 2006-05-24 |
Family
ID=17016304
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP23750494A Expired - Fee Related JP3778586B2 (en) | 1994-09-30 | 1994-09-30 | Hybrid integrated circuit device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3778586B2 (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100525691B1 (en) * | 2001-06-11 | 2005-11-03 | 아이신세이끼가부시끼가이샤 | A bidet |
JP2006190725A (en) * | 2005-01-04 | 2006-07-20 | Hitachi Ltd | Resin-sealing engine controller and its manufacturing method |
US7209367B2 (en) | 2005-04-13 | 2007-04-24 | Denso Corporation | Electronic apparatus and method for manufacturing the same |
JP2008160034A (en) * | 2006-12-26 | 2008-07-10 | Shindengen Electric Mfg Co Ltd | Resin sealed electronic apparatus and its manufacturing process |
CN113039655A (en) * | 2018-11-08 | 2021-06-25 | Lg伊诺特有限公司 | Thermoelectric module |
-
1994
- 1994-09-30 JP JP23750494A patent/JP3778586B2/en not_active Expired - Fee Related
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100525691B1 (en) * | 2001-06-11 | 2005-11-03 | 아이신세이끼가부시끼가이샤 | A bidet |
JP2006190725A (en) * | 2005-01-04 | 2006-07-20 | Hitachi Ltd | Resin-sealing engine controller and its manufacturing method |
US7209367B2 (en) | 2005-04-13 | 2007-04-24 | Denso Corporation | Electronic apparatus and method for manufacturing the same |
JP2008160034A (en) * | 2006-12-26 | 2008-07-10 | Shindengen Electric Mfg Co Ltd | Resin sealed electronic apparatus and its manufacturing process |
CN113039655A (en) * | 2018-11-08 | 2021-06-25 | Lg伊诺特有限公司 | Thermoelectric module |
CN113039655B (en) * | 2018-11-08 | 2024-01-23 | Lg伊诺特有限公司 | Thermoelectric module |
Also Published As
Publication number | Publication date |
---|---|
JP3778586B2 (en) | 2006-05-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5767573A (en) | Semiconductor device | |
KR100307465B1 (en) | Power module | |
TWI402952B (en) | Circuit device and manufacturing method thereof | |
US7679182B2 (en) | Power module and motor integrated control unit | |
JP3804861B2 (en) | Electrical device and wiring board | |
JPH1174433A (en) | Semiconductor device | |
JP2848068B2 (en) | Semiconductor device | |
JP4091669B2 (en) | How to make a multichip package | |
JP3778586B2 (en) | Hybrid integrated circuit device | |
JPH04171994A (en) | Printed-circuit board for mounting of large-power semiconductor chip; and driving component using same | |
US5324890A (en) | Direct bond copper-output footprint | |
JP3764214B2 (en) | Printed circuit board and electronic apparatus equipped with the same | |
KR102313764B1 (en) | Cooling system for semiconductor component having semiconductor chip with cooling apparatus | |
JP2973646B2 (en) | Mounting structure of bare chip LSI | |
JPH09213878A (en) | Semiconductor device | |
JP5039388B2 (en) | Circuit equipment | |
US20020005579A1 (en) | Semiconductor apparatus and frame used for fabricating the same | |
KR20030063178A (en) | Electrical device | |
JP3639325B2 (en) | Hybrid integrated circuit device | |
EP0942635A1 (en) | A power semiconductor device for "flip-chip" connections | |
JP3392517B2 (en) | Hybrid integrated circuit device and refrigerator using the same | |
JPH0969601A (en) | Hybrid integrated circuit device | |
JPH03120851A (en) | Semiconductor mounting substrate | |
JP3248117B2 (en) | Semiconductor device | |
JP2919313B2 (en) | Printed wiring board and its mounting method |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20050413 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20050510 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20050708 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20051004 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20051201 |
|
RD01 | Notification of change of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7421 Effective date: 20051226 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20060214 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20060228 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100310 Year of fee payment: 4 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110310 Year of fee payment: 5 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110310 Year of fee payment: 5 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120310 Year of fee payment: 6 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130310 Year of fee payment: 7 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130310 Year of fee payment: 7 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140310 Year of fee payment: 8 |
|
LAPS | Cancellation because of no payment of annual fees |