JPH0796699A - Manufacture of inorganic decorative plate - Google Patents

Manufacture of inorganic decorative plate

Info

Publication number
JPH0796699A
JPH0796699A JP24405993A JP24405993A JPH0796699A JP H0796699 A JPH0796699 A JP H0796699A JP 24405993 A JP24405993 A JP 24405993A JP 24405993 A JP24405993 A JP 24405993A JP H0796699 A JPH0796699 A JP H0796699A
Authority
JP
Japan
Prior art keywords
inorganic decorative
transfer sheet
decorative board
embossed shape
bonded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP24405993A
Other languages
Japanese (ja)
Other versions
JP3254847B2 (en
Inventor
Seiji Sano
誠治 佐野
Mitsuru Nakakawara
満 中河原
Yoichi Morita
洋一 守田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toppan Inc
Original Assignee
Toppan Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toppan Printing Co Ltd filed Critical Toppan Printing Co Ltd
Priority to JP24405993A priority Critical patent/JP3254847B2/en
Publication of JPH0796699A publication Critical patent/JPH0796699A/en
Application granted granted Critical
Publication of JP3254847B2 publication Critical patent/JP3254847B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PURPOSE:To provide a method tor manufacturing an inorganic decorative plate wherein a highly decorative picture pattern harmonized with an embossing is efficiently provided on an inorganic decorative base material having the embossing on its surface. CONSTITUTION:A transfer sheet is laid on the surface of an inorganic decorative plate base material 6 having an embossed shape on its surface, which is bonded with heat pressure by a desired means such that it follows the said embossed shape. After a transferred base film 1 of the transfer sheet is peeled, a picture pattern layer 7 of the transfer sheet on the inorganic decorative plate base material 6 is further bonded with the heat pressure by the desired means such that it follows the embossed shape.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、外装材等に利用するエ
ンボス形状を有する無機系化粧板基材に、意匠性の高い
絵柄を効率よく設ける、無機系化粧板の製造方法に関す
る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing an inorganic decorative board by efficiently providing a highly decorative design on an inorganic decorative board substrate having an embossed shape which is used as an exterior material or the like.

【0002】[0002]

【従来の技術】従来より住宅の外装に各種無機系化粧板
が使用されているが、近年高級化、高意匠化の傾向と共
に表面にエンボスを設けた製品が好まれるようになって
きた。表面にエンボスがある場合、単色の塗料を塗装す
るか、砂をまく等簡単な製造方法があるが、その他にエ
ンボスに同調した絵付けをする方法として、弾性体によ
る転写方式があるが、微細なエンボスの凹部転写抜けが
起こり、完全に絵柄層を密着させることは困難であっ
た。
2. Description of the Related Art Conventionally, various inorganic decorative boards have been used for the exterior of houses, but in recent years, products having embossed surfaces have been favored along with the tendency toward higher quality and higher design. If there is embossing on the surface, there is a simple manufacturing method such as painting with a single color paint or sprinkling sand, but there is also a transfer method using an elastic body as a method of painting in synchronization with embossing, It was difficult to completely adhere the pattern layer due to the lack of transfer of the embossed concave portion.

【0003】[0003]

【発明が解決しようとする課題】本発明はこのような従
来の問題に鑑みてなされたものであり、その課題とする
ところは、特に表面にエンボスが施されている無機系化
粧板基材に対して、エンボスに調和した意匠性の高い絵
柄を効率よく設ける、無機系化粧板の製造方法を提案す
ることにある。
SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems of the prior art, and it is an object of the present invention, in particular, to provide an inorganic decorative board substrate whose surface is embossed. On the other hand, another object of the present invention is to propose a method for manufacturing an inorganic decorative board, which efficiently provides a design with high design in harmony with embossing.

【0004】[0004]

【課題を解決するための手段】本発明はこの課題を解決
するため、表面にエンボス形状を有する無機系化粧板基
材の表面に転写シートを載せ、所望の手段により前記エ
ンボス形状に追従するように熱圧着し、転写シートの基
体フィルムを剥離後、さらに前記無機系化粧板基材上に
転写した転写シートの絵柄層を所望の手段により前記エ
ンボス形状に追従するように熱圧着することを特徴とす
る無機系化粧板の製造方法を提供する。また、前記熱圧
着をロール状の弾性体により行なうか、平型の弾性体を
介して行なうことを特徴とする無機系化粧板の製造方法
を提供する。
In order to solve this problem, the present invention places a transfer sheet on the surface of an inorganic decorative board base material having an embossed shape on the surface, and follows the embossed shape by a desired means. After the base film of the transfer sheet is peeled off by thermocompression bonding, the pattern layer of the transfer sheet transferred onto the inorganic decorative board substrate is further thermocompression bonded so as to follow the embossed shape by a desired means. A method for manufacturing an inorganic decorative board is provided. Further, there is provided a method for producing an inorganic decorative board, characterized in that the thermocompression bonding is carried out by a roll-shaped elastic body or through a flat elastic body.

【0005】以下、本発明を詳細に説明する。図1に本
発明で用いる転写シートの断面の構成の一例を示す。基
体フィルム1の表面に剥離ニス層2、絵柄層3、接着層
4を順次設けた構成となっている。
The present invention will be described in detail below. FIG. 1 shows an example of the cross-sectional structure of the transfer sheet used in the present invention. The base film 1 has a structure in which a release varnish layer 2, a pattern layer 3, and an adhesive layer 4 are sequentially provided on the surface of the base film 1.

【0006】基体フィルムとしては、弾性体による転写
時の熱圧着の熱により無機系化粧板基材に表面エンボス
形状に追従することが可能な熱可塑性樹脂フィルムを用
いる。具体的には塩化ビニル、ポリレチレン、ポリプロ
ピレン、ナイロン、ポリエステル、等が挙げられる。
As the base film, a thermoplastic resin film capable of following the surface embossed shape on the inorganic decorative board base material by the heat of thermocompression bonding at the time of transfer by the elastic body is used. Specific examples include vinyl chloride, polyretylene, polypropylene, nylon, polyester, and the like.

【0007】基体フィルムの種類、厚み等は、表面のエ
ンボスの程度、転写温度とのかねあいで選択すれば良
い。例えば、150℃〜180℃の転写温度では、厚み
100μm以下の塩化ビニル樹脂フィルムで最も良好な
結果が得られる。
The type and thickness of the base film may be selected depending on the degree of embossing on the surface and the transfer temperature. For example, at a transfer temperature of 150 ° C. to 180 ° C., a vinyl chloride resin film having a thickness of 100 μm or less gives the best results.

【0008】剥離ニス層としては、基材フィルムの種類
により適宣選択すれば良いが、塩化ビニルを基体フィル
ムに用いた場合、ポリビニルブチラールで良好な結果が
得られた。
The release varnish layer may be appropriately selected depending on the type of the base film, but when vinyl chloride is used as the base film, polyvinyl butyral gave good results.

【0009】絵柄層は、通常のグラビア印刷、スクリー
ン印刷等で印刷することができる。インキのバインダー
は、加熱時の伸び、最終製品の耐久性等を考慮して決定
される。
The pattern layer can be printed by ordinary gravure printing, screen printing or the like. The binder of the ink is determined in consideration of the elongation during heating, the durability of the final product, and the like.

【0010】接着層としては、ポリビニルアルコール、
アクリル、ヒドロキシメチルセルロース、ポリエステ
ル、ポリアミド等が用いられる。また基材上に予め接着
剤を塗布する工程を想定した場合は、接着剤は必ずしも
必要ではない。
As the adhesive layer, polyvinyl alcohol,
Acrylic, hydroxymethyl cellulose, polyester, polyamide and the like are used. Further, when assuming the step of applying the adhesive agent on the base material in advance, the adhesive agent is not always necessary.

【0011】図2に無機系化粧板基材の上に絵柄を転写
している状態を示す。エンボス形状と同調するように転
写シートを載せ、加熱されたロール5を用いて表面のエ
ンボス形状に追従するように熱圧着する。その他のエン
ボス形状に追従するような熱圧着の方法としては、平型
の弾性体を介する方法、表面のエンボス形状とオス型と
メス型の関係をなす形状の弾性体のロール、平型を用い
る方法等がある。
FIG. 2 shows a state in which a pattern is transferred onto the inorganic type decorative board substrate. The transfer sheet is placed so as to be synchronized with the embossed shape, and thermocompression bonding is performed using the heated roll 5 so as to follow the embossed shape on the surface. As a method of thermocompression bonding that follows other embossed shapes, a method of using a flat elastic body, an elastic roll of a shape having a relationship between a surface embossed shape and a male type or a female type, or a flat type is used. There are ways.

【0012】無機系化粧板基材6としては、石綿セメン
ト、ケイ酸カルシウム板、ケイ酸マグネシウム板、木片
セメント板等を用いることができる。
As the inorganic decorative board base material 6, asbestos cement, calcium silicate board, magnesium silicate board, wood chip cement board and the like can be used.

【0013】図3に転写シートの基体フィルム1を剥離
後、残った絵柄層7をさらに加熱されたロール5で熱圧
着している状態を示す。また、図4に平型の弾性体8を
介して熱圧着する場合を示す。その他、先に示したよう
な方法で、エンボスに追従するように熱圧着を行うこと
ができる。また、この上から表面保護のためにクリヤー
塗装を施す事も適宜行える。
FIG. 3 shows a state in which after the base film 1 of the transfer sheet is peeled off, the remaining pattern layer 7 is further thermocompression bonded by the heated roll 5. Further, FIG. 4 shows a case where thermocompression bonding is performed via the flat elastic body 8. In addition, thermocompression bonding can be performed so as to follow the embossing by the method described above. Further, clear coating may be applied on the surface for protection of the surface.

【0014】[0014]

【作用】転写において、微細なエンボスの凹部転写抜け
が起こる原因は、熱圧着する弾性体と基材の間に、転写
シートを介するため、転写シートの厚み、また熱がかか
る事による縮み等の影響によるもので、凹部形状に弾性
体が完全に追従する事が難しい。
[Function] In transfer, the cause of transfer dropout of fine embossed recesses is that the transfer sheet is interposed between the elastic body to be thermocompression-bonded and the base material, and therefore, the thickness of the transfer sheet and shrinkage due to application of heat may occur. Because of the influence, it is difficult for the elastic body to completely follow the concave shape.

【0015】本発明は、転写シートの基体フィルムを剥
離後さらに熱圧着する事で、密着せずにエンボス凹部上
に浮いている絵柄層を熱圧着するものである。転写シー
トの基体フィルムを剥離後、さらに熱圧着するため、転
写シートの基体フィルムを間に介さず、これまでの転写
において、密着させることの出来なかった形状のエンボ
ス凹部にも絵柄層を密着させることが出来る。
According to the present invention, after the base film of the transfer sheet is peeled off and further thermocompression-bonded, the pattern layer floating on the embossed recess without being adhered is thermocompression-bonded. Since the base film of the transfer sheet is peeled off and then thermocompression-bonded, the pattern layer is also adhered to the embossed recesses of a shape that could not be adhered in the transfer so far without the base film of the transfer sheet being interposed. You can

【0016】[0016]

【実施例】【Example】

<実施例1>転写シートの基体フィルムとして厚さ75
μmの半硬質塩化ビニルシートを用い、この表面に剥離
ニス層としてポリビニルブチラール樹脂を塗布した後、
塩酢ビ樹脂をバインダーとするインキを用いてグラビア
印刷法により、後述の無機系化粧板基材のエンボス形状
と調和する模様を印刷して絵柄層を設け、さらに、接着
層としてポリエステル樹脂を塗布して転写シートを作製
した。
<Example 1> A base film of a transfer sheet having a thickness of 75
After applying a polyvinyl butyral resin as a release varnish layer on this surface using a semi-rigid vinyl chloride sheet of μm,
By a gravure printing method using an ink using vinyl chloride resin as a binder, a pattern that is in harmony with the embossed shape of the inorganic decorative board substrate described below is printed to form a pattern layer, and then a polyester resin is applied as an adhesive layer. Then, a transfer sheet was prepared.

【0017】一方、無機系化粧板基材として表面にレン
ガ状のエンボス形状を有するケイ酸カルシウム板を用意
し、除塵し、シーラー処理した。接着剤を塗布、乾燥し
た後、150℃に加熱された表面硬度が40゜のシリコ
ンで形成されたロールを用いて転写した。転写後、転写
シートの基体フィルムを剥離し、更に150℃に加熱さ
れた表面硬度が40゜のロールで熱圧着した。
On the other hand, a calcium silicate board having a brick-like embossed surface was prepared as an inorganic decorative board base material, dust was removed, and a sealer treatment was performed. After the adhesive was applied and dried, transfer was performed using a roll formed of silicon heated to 150 ° C. and having a surface hardness of 40 °. After the transfer, the base film of the transfer sheet was peeled off and thermocompression bonded with a roll heated to 150 ° C. and having a surface hardness of 40 °.

【0018】<実施例2>実施例1同様の転写シートを
用い、無機系化粧板基材として表面にレンガ形状を有す
るケイ酸カルシウム板を用意し、除塵し、シーラー処理
した。接着剤を塗布、乾燥した後、150℃に加熱され
た表面硬度が40゜のシリコンで形成されたロールを用
いて、実施例1で使用したのと同様の転写シートを熱圧
着し、絵柄層を転写した。転写後、転写シートの基体フ
ィルムを剥離し、更に150℃に加熱された厚さ20m
m表面硬度40゜の平型のシリコンで熱圧着した。
Example 2 Using the same transfer sheet as in Example 1, a calcium silicate plate having a brick shape on the surface was prepared as an inorganic decorative plate substrate, dust was removed, and a sealer treatment was performed. After applying and drying the adhesive, a transfer sheet similar to that used in Example 1 was thermocompression-bonded using a roll formed of silicon having a surface hardness of 40 ° heated to 150 ° C. Was transcribed. After transfer, the base film of the transfer sheet is peeled off, and further heated to 150 ° C to a thickness of 20 m.
Thermocompression bonding was performed using flat silicon having a surface hardness of 40 °.

【0019】実施例1、2で得られた化粧板の表面に、
表面保護層としてアクリルウレタントップコートを塗装
した。こうして得られた化粧板は、微小なエンボス形状
にも追従、同調した絵柄を持つ極めて意匠性の高いもの
であった。
On the surface of the decorative boards obtained in Examples 1 and 2,
An acrylic urethane top coat was applied as a surface protective layer. The decorative board thus obtained had a very high designability, following a fine embossed shape and having a synchronized pattern.

【0020】[0020]

【発明の効果】以上に示したように、本発明により、転
写、剥離後さらにロールで熱圧着をかける事により、従
来のような転写シート上から熱、圧着をかけ転写するだ
け以上に意匠性の高い、エンボスと絵柄が調和した無機
系化粧板が得られるようになった。基材凹部にも絵柄層
が圧着し、エンボスと絵柄が調和した、意匠性の高い無
機系化粧板が得られるようになった。
As described above, according to the present invention, after transfer and peeling, by further thermocompression bonding with a roll, heat and pressure bonding from a transfer sheet as in the prior art is performed, and thus the designability is improved. It is now possible to obtain a high-quality inorganic decorative board with a harmony of embossing and design. The design layer was also pressure-bonded to the concave portion of the base material, and it was possible to obtain an inorganic decorative board with a high design in which the embossing and the design were in harmony.

【0021】[0021]

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明に用いる転写シートの断面の構成を示す
模式図である。
FIG. 1 is a schematic view showing a configuration of a cross section of a transfer sheet used in the present invention.

【図2】ロールにより転写シートを熱圧着している状態
を示す模式図である。
FIG. 2 is a schematic diagram showing a state in which a transfer sheet is thermocompression bonded by a roll.

【図3】ロール状の弾性体により、転写シートの基体フ
ィルムを剥離後、絵柄層を熱圧着している状態を示す模
式図である。
FIG. 3 is a schematic view showing a state in which a base layer film of a transfer sheet is peeled off by a roll-shaped elastic body and then a design layer is thermocompression bonded.

【図4】平型の弾性体により、転写シートの基体フィル
ムを剥離後、絵柄層を熱圧着している状態を示す模式図
である。
FIG. 4 is a schematic view showing a state in which the pattern layer is thermocompression bonded after the base film of the transfer sheet is peeled off by the flat elastic body.

【符号の説明】[Explanation of symbols]

1…基体フィルム 2…剥離層 3…絵柄層 4
…接着層 5…ロール状の弾性体 6…無機系化粧板基材 7
…絵柄層 8…平型の弾性体
1 ... Base film 2 ... Release layer 3 ... Design layer 4
... Adhesive layer 5 ... Roll-shaped elastic body 6 ... Inorganic decorative board base material 7
… Design layer 8… Flat elastic body

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】表面にエンボス形状を有する無機系化粧板
基材の表面に転写シートを載せ、所望の手段により前記
エンボス形状に追従するように熱圧着し、転写シートの
基体フィルムを剥離後、さらに前記無機系化粧板基材上
に転写した転写シートの絵柄層を所望の手段により前記
エンボス形状に追従するように熱圧着することを特徴と
する無機系化粧板の製造方法。
1. A transfer sheet is placed on the surface of an inorganic decorative board base material having an embossed shape on the surface, thermocompression-bonded by a desired means so as to follow the embossed shape, and after peeling the base film of the transfer sheet, Furthermore, the method for producing an inorganic decorative board, characterized in that the pattern layer of the transfer sheet transferred onto the inorganic decorative board substrate is thermocompression bonded by a desired means so as to follow the embossed shape.
【請求項2】熱圧着をロール状の弾性体により行なうこ
とを特徴とする請求項1記載の無機系化粧板の製造方
法。
2. The method for producing an inorganic decorative board according to claim 1, wherein the thermocompression bonding is performed by using a roll-shaped elastic body.
【請求項3】熱圧着を平型の弾性体を介して行なうこと
を特徴とする請求項1記載の無機系化粧板の製造方法。
3. The method for producing an inorganic decorative board according to claim 1, wherein the thermocompression bonding is performed via a flat elastic body.
JP24405993A 1993-09-30 1993-09-30 Manufacturing method of inorganic decorative board Expired - Fee Related JP3254847B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24405993A JP3254847B2 (en) 1993-09-30 1993-09-30 Manufacturing method of inorganic decorative board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24405993A JP3254847B2 (en) 1993-09-30 1993-09-30 Manufacturing method of inorganic decorative board

Publications (2)

Publication Number Publication Date
JPH0796699A true JPH0796699A (en) 1995-04-11
JP3254847B2 JP3254847B2 (en) 2002-02-12

Family

ID=17113122

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24405993A Expired - Fee Related JP3254847B2 (en) 1993-09-30 1993-09-30 Manufacturing method of inorganic decorative board

Country Status (1)

Country Link
JP (1) JP3254847B2 (en)

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Cited By (11)

* Cited by examiner, † Cited by third party
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