JPH0793391B2 - Mounting method of sealing frame of semiconductor package - Google Patents
Mounting method of sealing frame of semiconductor packageInfo
- Publication number
- JPH0793391B2 JPH0793391B2 JP63230610A JP23061088A JPH0793391B2 JP H0793391 B2 JPH0793391 B2 JP H0793391B2 JP 63230610 A JP63230610 A JP 63230610A JP 23061088 A JP23061088 A JP 23061088A JP H0793391 B2 JPH0793391 B2 JP H0793391B2
- Authority
- JP
- Japan
- Prior art keywords
- sealing frame
- printed wiring
- sealing
- substrate
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Structure Of Printed Boards (AREA)
Description
本発明はPGAのような半導体パッケージの封止枠の装着
方法に関する。The present invention relates to a method for mounting a sealing frame of a semiconductor package such as PGA.
従来にあっては、封止枠用材を枠形状に切断加工して封
止枠６を形成し、この封止枠６に接着剤層２を設けて各
封止枠６を位置決めプレート10にセットし、パッケージ
本体となる複数のプリント配線板が配列形成された基板
５に各封止枠６を各プリント配線板４に対応させて接着
させることにより装着されている。Conventionally, a sealing frame material is cut into a frame shape to form a sealing frame 6, an adhesive layer 2 is provided on the sealing frame 6, and each sealing frame 6 is set on a positioning plate 10. Then, each sealing frame 6 is attached to the substrate 5 on which a plurality of printed wiring boards to be a package body are formed in an array so as to correspond to each printed wiring board 4.
従来の方法にあっては、封止枠６が単体であるため、逐
一位置決めプレート10にセットしなければならないなど
基本的に封止枠６を一個毎基板５のプリント配線板に装
着しなければならなく、従って、大量生産には適してい
ないという問題があった。 本発明は上記事情に鑑みて為されたものであり、その目
的とするところは、複数の封止枠を一度に装着でき、し
かも、装着位置のばらつきも少ない半導体パッケージの
封止枠の装着方法を提供することにある。In the conventional method, since the sealing frame 6 is a single body, it must be set on the positioning plate 10 one by one. Basically, the sealing frame 6 must be mounted on the printed wiring board of the substrate 5 one by one. Therefore, there is a problem that it is not suitable for mass production. The present invention has been made in view of the above circumstances, and an object of the present invention is to attach a plurality of sealing frames at one time and to attach a sealing frame of a semiconductor package with less variation in mounting position. To provide.
本発明の半導体パッケージの封止枠の装着方法における
第１の手段は、封止枠用材１の片面に所定ピッチで接着
剤を枠状に塗布し、封止枠用材１の枠状の接着剤層２の
内側をくり抜くと共に接着剤層２の外周に凹溝３を設
け、封止枠用材１をプリント配線板４が所定のピッチで
配列形成された基板５に枠状の接着剤層２と各プリント
配線板４とを対応させて接合し、この後、凹溝３にて封
止枠用材１を切断し封止枠６を形成することにより基板
５の各プリント配線板４に封止枠６を装着し、次いで基
板１を各プリント配線板４毎に切断することを特徴とす
るものであり、第２の手段は、封止枠用材１の片面に所
定ピッチで接着剤を枠状に塗布すると共に他面に接着シ
ート７を貼着し、封止枠用材１を枠状の接着剤層２の内
周と外周に沿って切断して接着シート７上に所定の枠形
状の複数の封止枠６を形成し、この後、複数の封止枠６
を接着剤層２にて接着シート７を介して一体的にプリン
ト配線板４が所定のピッチで配列形成された基板５に各
封止枠６と各プリント配線板４とを対応させて接合し、
次いで、接着シート７を剥がすと共に基板５を各プリン
ト配線板４毎に切断することを特徴とするものであり、
この構成により上記課題が解決されたものである。 ［作用］ 本発明の第１の手段にあっては、封止枠用材１をプリン
ト配線板４が所定のピッチで配列形成された基板に枠状
の接着剤層２と各プリント配線板４とを対応させて接合
し、この後、凹溝３にて封止枠用材１を切断し封止枠６
を形成することにより基板１の各プリント配線板４に封
止枠６を装着し、次いで基板１を各プリント配線板４毎
に切断するので、又、第２の手段にあっては、接着シー
ト７上に所定の枠形状の複数の封止枠６を形成し、この
後、複数の封止枠６を接着剤層２にて接着シート７を介
して一体的にプリント配線板４が所定のピッチで配列形
成された基板５に各封止枠６と各プリント配線板４とを
対応させて接合し、次いで、接着シート７を剥がすと共
に基板５を各プリント配線板４毎に切断するので、複数
の封止枠６の装着が一度にでき、しかも、装着位置のば
らつきも少なくなるものである。 以下、本発明を添付の図面に基づいて説明する。 第１図及び第２図は本発明の一実施例を示しており、ま
ず封止枠用材１の片面に所定ピッチで接着剤を枠状に塗
布する（第１図（ａ））。 次に、この封止枠用材１の枠状の接着剤層２の内側をく
り抜くと共に接着剤層２の外周に凹溝３を貫通させない
ように設ける（第１図（ｂ）（ｃ））。 この後、封止枠用材１をプリント配線板４が所定のピッ
チで配列形成された基板５に枠状の接着剤層２と各プリ
ント配線板４とを対応させて接合する（第１図
（ｄ））。 次に、カッター９により凹溝３にて封止枠用材１を切断
し封止枠６を形成することにより基板１の各プリント配
線板４に封止枠６を装着させる（第１図（ｆ））。 次いで、基板５を各プリント配線板４毎に切断する（第
２図）。 尚、プリント配線板４の半導体実装用凹部８に半導体を
実装し、プリント配線板４の各導体パターンとボンディ
ングさせて電気的に接続し、封止枠６内に封止樹脂を充
填させて封止することにより半導体パッケージを製造す
る。 第３図及び第４図は本発明の他の実施例を示しており、
まず上記実施例と同様に封止枠用材１の片面に所定ピッ
チで接着剤を枠状に塗布する（第３図（ａ））。 この封止枠用材１の他面には接着シート７を貼着した
後、封止枠用材１を枠状の接着剤層２の内周と外周に沿
って切断して接着シート７上に所定の枠形状の複数の封
止枠６を形成する（第３図（ｂ）（ｃ））。 次に、複数の封止枠６を接着剤層２にて接着シート７を
介して一体的にプリント配線板４が所定のピッチで配列
形成された基板５に各封止枠６と各プリント配線板４と
を対応させて接合し、次いで、接着シート７を剥がす
（第３図（ｃ））。 次に、基板５を各プリント配線板４毎に切断する（第４
図）。The first means in the method for mounting the sealing frame of the semiconductor package of the present invention is to apply an adhesive agent in a frame shape on one surface of the sealing frame material 1 at a predetermined pitch to form a frame-shaped adhesive agent for the sealing frame material 1. The inner side of the layer 2 is hollowed out, and the groove 3 is provided on the outer periphery of the adhesive layer 2, and the sealing frame material 1 is formed on the substrate 5 on which the printed wiring boards 4 are arrayed at a predetermined pitch. The printed wiring boards 4 are joined to each other in a corresponding manner, and then the sealing frame material 1 is cut in the concave grooves 3 to form the sealing frame 6, whereby the printed wiring boards 4 of the substrate 5 are sealed with the sealing frame. 6 is mounted, and then the substrate 1 is cut into each printed wiring board 4, and the second means is that one side of the sealing frame material 1 is framed with an adhesive at a predetermined pitch. Along with the application, the adhesive sheet 7 is attached to the other surface, and the sealing frame material 1 is cut along the inner circumference and the outer circumference of the frame-shaped adhesive layer 2. And a plurality of sealing frame 6 having a predetermined frame shape on the adhesive sheet 7 is formed by, after this, a plurality of sealing frame 6
Each sealing frame 6 and each printed wiring board 4 are bonded to the substrate 5 on which the printed wiring boards 4 are integrally formed with the adhesive layer 2 via the adhesive sheet 7 in an array at a predetermined pitch. ,
Next, the adhesive sheet 7 is peeled off and the substrate 5 is cut into individual printed wiring boards 4.
The above problem is solved by this configuration. [Operation] In the first means of the present invention, the frame material 1 and the printed wiring board 4 are formed on the substrate on which the printed wiring boards 4 are arranged with the sealing frame material 1 arranged at a predetermined pitch. Corresponding to each other, and thereafter, the sealing frame material 1 is cut in the concave groove 3 to form the sealing frame 6
By forming the sealing frame 6 on each printed wiring board 4 of the substrate 1 and then cutting the substrate 1 into each printed wiring board 4, the adhesive sheet is used in the second means. A plurality of sealing frames 6 having a predetermined frame shape are formed on the printed wiring board 7. Then, the plurality of sealing frames 6 are integrated with the adhesive layer 2 via the adhesive sheet 7 so that the printed wiring board 4 has a predetermined shape. Since each sealing frame 6 and each printed wiring board 4 are bonded to the board 5 arranged in a pitch in a corresponding manner, and then the adhesive sheet 7 is peeled off and the board 5 is cut for each printed wiring board 4, The plurality of sealing frames 6 can be mounted at the same time, and moreover, variations in mounting positions are reduced. Hereinafter, the present invention will be described with reference to the accompanying drawings. FIGS. 1 and 2 show an embodiment of the present invention. First, an adhesive is applied in a frame shape on one surface of the sealing frame material 1 at a predetermined pitch (FIG. 1 (a)). Next, the inside of the frame-shaped adhesive layer 2 of the sealing frame material 1 is hollowed out, and the concave groove 3 is provided so as not to penetrate the outer periphery of the adhesive layer 2 (FIGS. 1 (b) and (c)). Thereafter, the sealing frame material 1 is bonded to the substrate 5 on which the printed wiring boards 4 are arrayed at a predetermined pitch so that the frame-shaped adhesive layer 2 and each printed wiring board 4 correspond to each other (see FIG. 1 ( d)). Next, the cutter 9 cuts the sealing frame material 1 along the concave groove 3 to form the sealing frame 6, so that the sealing frame 6 is attached to each printed wiring board 4 of the substrate 1 (see FIG. )). Next, the board 5 is cut into each printed wiring board 4 (FIG. 2). A semiconductor is mounted in the semiconductor mounting recess 8 of the printed wiring board 4 and is electrically connected by bonding with each conductor pattern of the printed wiring board 4, and the sealing frame 6 is filled with a sealing resin and sealed. The semiconductor package is manufactured by stopping. 3 and 4 show another embodiment of the present invention,
First, in the same manner as in the above embodiment, an adhesive is applied in a frame shape on one surface of the sealing frame material 1 at a predetermined pitch (Fig. 3 (a)). After the adhesive sheet 7 is attached to the other surface of the sealing frame material 1, the sealing frame material 1 is cut along the inner and outer peripheries of the frame-shaped adhesive layer 2 to give a predetermined amount on the adhesive sheet 7. A plurality of sealing frames 6 having the frame shape are formed (Figs. 3 (b) and (c)). Next, the plurality of sealing frames 6 are integrated with the adhesive layer 2 via the adhesive sheet 7 on the substrate 5 on which the printed wiring boards 4 are arrayed at a predetermined pitch. The plate 4 and the plate 4 are joined together and then the adhesive sheet 7 is peeled off (FIG. 3 (c)). Next, the board 5 is cut into each printed wiring board 4 (fourth
Figure).
本発明の第１の手段にあっては、封止枠用材をプリント
配線板が所定のピッチで配列形成された基板に枠状の接
着剤層と各プリント配線板とを対応させて接合し、この
後、凹溝にて封止枠用材を切断し封止枠を形成すること
により基板の各プリント配線板に封止枠を装着し、次い
で基板を各プリント配線板毎に切断するので、又、第２
の手段にあっては、接着シート上に所定の枠形状の複数
の封止枠を形成し、この後、複数の封止枠を接着剤層に
て接着シートを介して一体的にプリント配線板が所定の
ピッチで配列形成された基板に各封止枠と各プリント配
線板とを対応させて接合し、次いで、接着シートを剥が
すと共に基板を各プリント配線板毎に切断するので、複
数の封止枠の装着が一度にでき、しかも、装着位置のば
らつきも少なくなるものである。In the first means of the present invention, a sealing frame material is bonded to a substrate on which printed wiring boards are arranged at a predetermined pitch so that the frame-shaped adhesive layer and each printed wiring board are associated with each other. After that, the sealing frame material is cut in the groove to form the sealing frame, thereby mounting the sealing frame on each printed wiring board of the substrate, and then cutting the substrate for each printed wiring board. , Second
In this method, a plurality of sealing frames each having a predetermined frame shape are formed on the adhesive sheet, and then the plurality of sealing frames are integrally bonded to the printed wiring board by the adhesive layer with the adhesive sheet. Since each sealing frame and each printed wiring board are bonded to the substrate formed by arranging them at a predetermined pitch in a corresponding manner, and then the adhesive sheet is peeled off and the substrate is cut into each printed wiring board, a plurality of seals are formed. The stop frame can be mounted at once, and the variation in mounting position is reduced.
【図面の簡単な説明】 第１図は本発明の一実施例の各工程を示す説明図、第２
図は同上により封止枠が装着されたプリント配線板を示
す平面図、第３図は本発明の他の実施例の各工程を示す
説明図、第４図は同上により封止枠が装着されたプリン
ト配線板を示す平面図、第５図は従来例の各工程を示す
説明図であって、１は封止枠用材、２は接着剤層、３は
凹溝、４はプリント配線板、５は基板、６は封止枠、７
は接着シートである。BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an explanatory view showing each step of one embodiment of the present invention, and FIG.
FIG. 3 is a plan view showing a printed wiring board with a sealing frame attached according to the above, FIG. 3 is an explanatory view showing each step of another embodiment of the present invention, and FIG. 5 is a plan view showing the printed wiring board, FIG. 5 is an explanatory view showing each step of the conventional example, 1 is a sealing frame material, 2 is an adhesive layer, 3 is a groove, 4 is a printed wiring board, 5 is a substrate, 6 is a sealing frame, and 7
Is an adhesive sheet.
Claims (2)
枠状に塗布し、封止枠用材の枠状の接着剤層の内側をく
り抜くと共に接着剤層の外周に凹溝を設け、封止枠用材
をプリント配線板が所定のピッチで配列形成された基板
に枠状の接着剤層と各プリント配線板とを対応させて接
合し、この後、凹溝にて封止枠用材を切断し封止枠を形
成することにより基板の各プリント配線板に封止枠を装
着し、次いで基板を各プリント配線板毎に切断すること
を特徴とする半導体パッケージの封止枠の装着方法。1. An adhesive agent is applied in a frame shape on one surface of a sealing frame material at a predetermined pitch, the inside of the frame-shaped adhesive layer of the sealing frame material is hollowed out, and a groove is provided on the outer periphery of the adhesive layer. The sealing frame material is bonded to the substrate on which the printed wiring boards are arranged at a predetermined pitch so that the frame-shaped adhesive layer and the respective printed wiring boards are associated with each other, and then the sealing frame material is formed in the groove. A method of mounting a sealing frame of a semiconductor package, which comprises mounting the sealing frame on each printed wiring board of a substrate by cutting the substrate to form a sealing frame, and then cutting the substrate for each printed wiring board. .
枠状に塗布すると共に他面に接着シートを貼着し、封止
枠用材を枠状の接着剤層の内周と外周に沿って切断して
接着シート上に所定の枠形状の複数の封止枠を形成し、
この後、複数の封止枠を接着剤層にて接着シートを介し
て一体的にプリント配線板が所定のピッチで配列形成さ
れた基板に各封止枠と各プリント配線板とを対応させて
接合し、次いで、接着シートを剥がすと共に基板を各プ
リント配線板毎に切断することを特徴とする半導体パッ
ケージの封止枠の装着方法。2. A sealing frame material is applied to one surface of the sealing frame material at a predetermined pitch in a frame shape, and an adhesive sheet is attached to the other surface, and the sealing frame material is applied to the inner and outer circumferences of the frame-shaped adhesive layer. Form a plurality of sealing frames of a predetermined frame shape on the adhesive sheet by cutting along
After that, each sealing frame and each printed wiring board are made to correspond to a substrate in which a plurality of sealing frames are integrally formed with an adhesive layer through an adhesive sheet and printed wiring boards are arranged in an array at a predetermined pitch. A method for mounting a sealing frame of a semiconductor package, which comprises bonding, then peeling off the adhesive sheet, and cutting the substrate for each printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63230610A JPH0793391B2 (en) | 1988-09-14 | 1988-09-14 | Mounting method of sealing frame of semiconductor package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63230610A JPH0793391B2 (en) | 1988-09-14 | 1988-09-14 | Mounting method of sealing frame of semiconductor package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0278250A JPH0278250A (en) | 1990-03-19 |
| JPH0793391B2 true JPH0793391B2 (en) | 1995-10-09 |
Family
ID=16910458
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63230610A Expired - Lifetime JPH0793391B2 (en) | 1988-09-14 | 1988-09-14 | Mounting method of sealing frame of semiconductor package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0793391B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE59001120D1 (en) * | 1989-11-09 | 1993-05-06 | Contraves Ag | METHOD FOR PRODUCING HYBRID CIRCUITS WITH AN ARRAY OF SAME ELECTRONIC ELEMENTS. |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57138149A (en) * | 1981-02-20 | 1982-08-26 | Shindo Denshi Kogyo Kk | Mounting method for chip |
-
1988
- 1988-09-14 JP JP63230610A patent/JPH0793391B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0278250A (en) | 1990-03-19 |
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