JPH079328A - Polishing method and polishing device - Google Patents
Polishing method and polishing deviceInfo
- Publication number
- JPH079328A JPH079328A JP17599793A JP17599793A JPH079328A JP H079328 A JPH079328 A JP H079328A JP 17599793 A JP17599793 A JP 17599793A JP 17599793 A JP17599793 A JP 17599793A JP H079328 A JPH079328 A JP H079328A
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- workpiece
- polishing cloth
- cloth
- pressure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は主として半導体基板であ
るＳＯＩ（Silicon-on-Insulator）基板やＳｉ基板等を
均一な厚さに研磨する方法及び装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention mainly relates to a method and an apparatus for polishing a semiconductor substrate such as an SOI (Silicon-on-Insulator) substrate or a Si substrate to a uniform thickness.
【０００２】[0002]
【従来の技術】従来は、図３に示すように、基板等の被
加工物１の表面にコロイダルシリカの液を流しながら、
被加工物１の上方に配置した研磨棒２９の下端に取り付
けたポリウレタンパッドを被加工物１に接触させ、研磨
棒２９を中心線の回りに自転させつつ被加工物１の上を
相対的に往復させながら順次に横方向に移動して研磨し
ている。研磨量は、あらかじめ被加工物１の各部分にお
ける厚さを測定して置き、研磨棒２９の自転速度、被加
工物１への圧接力、停滞時間を各部分の研磨量に対応す
るよう調節することにより行われている。一度に１個の
研磨棒２９が研磨する面積が小さいことによる加工能率
の低さは、研磨棒２９を複数配置することで補われる。2. Description of the Related Art Conventionally, as shown in FIG. 3, while flowing a liquid of colloidal silica on the surface of a workpiece 1 such as a substrate,
A polyurethane pad attached to the lower end of a polishing rod 29 arranged above the workpiece 1 is brought into contact with the workpiece 1, and the polishing rod 29 is rotated about its center line while relatively moving over the workpiece 1. While reciprocating, it moves laterally in sequence and polishes. The polishing amount is set by measuring the thickness of each portion of the workpiece 1 in advance, and adjusting the rotation speed of the polishing rod 29, the pressure contact force to the workpiece 1, and the stagnation time so as to correspond to the polishing amount of each portion. It is done by doing. The low processing efficiency due to the small polishing area of one polishing rod 29 at a time is compensated by disposing a plurality of polishing rods 29.
【０００３】この研磨方法では、研磨棒２９が、被加工
物１の研磨面に垂直となるように配置され、研磨棒２９
の下端が研磨面に平行な平面に形成されており、被加工
物１が回転せず、研磨棒２９の方が自転するので、研磨
棒２９の被加工物１に対する相対速度は最外周部で最大
となり中心部でゼロとなる。このため、ある研磨位置で
は研磨棒２９の周囲の方だけ研磨され、研磨棒２９の中
心部直下の領域は山となって残る。被加工物１の表面
は、極端に言えば、丘陵地帯の山や谷のような凹凸をな
しているが、山の部分を研磨するときは、この傾向が顕
著となり所望に研磨できない。In this polishing method, the polishing rod 29 is arranged so as to be perpendicular to the polishing surface of the workpiece 1, and the polishing rod 29 is
Is formed in a plane parallel to the polishing surface, the workpiece 1 does not rotate, and the polishing rod 29 rotates, so that the relative speed of the polishing rod 29 to the workpiece 1 is at the outermost peripheral portion. Maximum and zero at the center. Therefore, at a certain polishing position, only the periphery of the polishing rod 29 is polished, and the region immediately below the central portion of the polishing rod 29 remains as a mountain. To the extreme, the surface of the work piece 1 has irregularities such as mountains and valleys in a hilly region, but when polishing the mountain portion, this tendency becomes remarkable, and it cannot be polished as desired.
【０００４】又、研磨棒２９が被加工物１の研磨面に対
して傾いているときは、研磨面が非対称に加工される。
研磨棒２９を自転させながら研磨棒２９を公転させるい
わゆる遊星運動型装置では、前述の研磨棒２９の最外周
部のみで極端に加工が進行する問題を解決することがで
きる。しかし、この装置では研磨棒２９の駆動機構が複
雑となり大型化するため、複数の研磨棒２９を被加工物
１の上方に密に配置することができなくなり、加工能率
の良いものが得られない。研磨棒２９が被加工物１の研
磨面に対して傾いているときの非対称な加工が生ずる問
題も解決出来ない。When the polishing rod 29 is inclined with respect to the polishing surface of the workpiece 1, the polishing surface is processed asymmetrically.
In the so-called planetary motion type device in which the polishing rod 29 is revolved while revolving the rotation of the polishing rod 29, it is possible to solve the problem that the processing is extremely advanced only in the outermost peripheral portion of the polishing rod 29. However, in this apparatus, since the drive mechanism of the polishing rod 29 becomes complicated and becomes large in size, it becomes impossible to densely arrange the plurality of polishing rods 29 above the workpiece 1, and it is not possible to obtain the one with high processing efficiency. . The problem that asymmetric processing occurs when the polishing rod 29 is inclined with respect to the polishing surface of the workpiece 1 cannot be solved.
【０００５】又、このような研磨棒自転型研磨装置で
は、研磨棒２９の最外周部の線速度で加工速度が決まる
が、最外周部の接触圧力が低下すると、加工能率が低く
なるので最外周部まで必要充分な荷重を印加することが
必要となる。このため、研磨棒２９が被加工物１に圧接
する周縁とその外周との間の被加工物１の表面層に強い
剪断応力が働き、場合によっては、単結晶シリコンのよ
うな結晶組織に欠陥を生ずる問題もあった。Further, in such a polishing rod rotation type polishing apparatus, the processing speed is determined by the linear velocity of the outermost peripheral portion of the polishing rod 29. However, if the contact pressure of the outermost peripheral portion is lowered, the processing efficiency becomes low, so It is necessary to apply a necessary and sufficient load to the outer peripheral portion. Therefore, a strong shear stress acts on the surface layer of the work piece 1 between the peripheral edge of the polishing rod 29 that is pressed against the work piece 1 and the outer periphery thereof, and in some cases, a defect may occur in the crystal structure such as single crystal silicon. There was also a problem that caused.
【０００６】本発明者は、上記の従来装置が有する問題
を解決し、被加工物を従来よりも均一な厚さに効率よく
研磨でき、結晶組織に欠陥を生ずることのない下記この
種の研磨装置を特願平４−３５０９７７号出願により提
案した。The present inventor has solved the problems of the above-mentioned conventional apparatus, can efficiently polish a workpiece to a more uniform thickness than before, and does not cause defects in the crystal structure of this type of polishing described below. A device was proposed by Japanese Patent Application No. 4-350977.
【０００７】(1) 被加工物の研磨面に接して研磨布を
配置し、被加工物の研磨面の面積よりも小さい面積の領
域に、加圧棒で、被加工物の研磨面に研磨布を接触圧力
を調節しつつ圧接せしめ、研磨布に対して被加工物を、
研磨面に沿い自転を伴なわず前記の領域の差し渡し長さ
よりも小さい半径の周回運動をさせつつ研磨を行うこと
を特徴とする研磨方法。 (2) 加圧棒の研磨布に対向する面が凸球面に形成され
ている上記(1)に記載の研磨方法。 (3) 研磨布の加圧棒側に板状の弾性体を配置して行う
上記(1)(2)の何れか１つに記載の研磨方法。 (4) 被加工物の研磨面の上方に複数の加圧棒を配置
し、被加工物の研磨面を複数箇所で同時に研磨する上記
(1)(2)(3)の何れか１つに記載の研磨方法。 (5) 被加工物を支持して被加工物の研磨面に沿い周回
運動しつつ研磨面に沿い移動し更に一方向と逆方向に移
動するジグザク移動をする被加工物支持装置と、被加工
物の研磨面と相対して研磨面と平行に研磨布を周縁で支
持し研磨布を被加工物の研磨面に接離可能に移動する研
磨布支持装置と、研磨布の被加工物と反対側に配置され
複数の加圧棒を研磨布側に移動可能に保持する加圧棒支
持装置とを備え、加圧棒の研磨布に面する先端が凸球面
をなしている研磨装置。 (6) 研磨布の加圧棒側に、板状の弾性体が研磨布に接
して配置されているか、加圧棒先端の凸球面が、凸球面
に沿う形状の弾性体で覆われている上記(5)に記載の研
磨装置。にある。(1) A polishing cloth is placed in contact with the polishing surface of the work piece, and a pressure bar is used to polish the polishing surface of the work piece in an area smaller than the area of the polishing surface of the work piece. Adjust the contact pressure of the cloth and press it against the work cloth against the polishing cloth.
A polishing method characterized in that polishing is performed along a polishing surface while making a circular motion with a radius smaller than the passing length of the region without rotation. (2) The polishing method according to (1) above, wherein the surface of the pressure rod facing the polishing cloth is formed into a convex spherical surface. (3) The polishing method according to any one of (1) and (2) above, in which a plate-shaped elastic body is arranged on the pressure rod side of the polishing cloth. (4) Arranging a plurality of pressure rods above the polishing surface of the workpiece, and polishing the polishing surface of the workpiece at multiple locations simultaneously
(1) The polishing method according to any one of (2) and (3). (5) A workpiece support device that supports the workpiece, moves along the polishing surface while moving along the polishing surface of the workpiece, and further moves in a zigzag direction that moves in the opposite direction to the one direction, and the workpiece. A polishing cloth support device that supports the polishing cloth at the peripheral edge in parallel to the polishing surface of the object and moves the polishing cloth so that it can be moved toward and away from the polishing surface of the workpiece, and the polishing cloth support device is opposite to the workpiece of the polishing cloth. And a pressure rod support device that holds a plurality of pressure rods movably on the polishing cloth side, and the tip of the pressure rod facing the polishing cloth is a convex spherical surface. (6) On the pressure rod side of the polishing cloth, a plate-shaped elastic body is arranged in contact with the polishing cloth, or the convex spherical surface at the tip of the pressure rod is covered with an elastic body along the convex spherical surface. The polishing apparatus according to (5) above. It is in.
【０００８】この発明によれば、被加工物の研磨面の面
積よりも小さい面積の領域に、加圧棒で、被加工物の研
磨面に研磨布を接触圧力を調節しつつ圧接せしめるよう
にしたので、一つの加圧棒で被加工物の表面の局部を研
磨量を微細に調整して研磨できる。こうすることによ
り、局部の加工精度を高くできる。According to this invention, the polishing cloth is brought into pressure contact with the area of the area smaller than the area of the polishing surface of the work piece by the pressure rod while adjusting the contact pressure. Therefore, it is possible to polish the local portion of the surface of the work piece with a single polishing rod while finely adjusting the polishing amount. By doing so, the local processing accuracy can be increased.
【０００９】又、研磨布に対して被加工物を、研磨面に
沿い自転を伴なわず周回運動をさせつつ研磨を行うよう
にすると、研磨面のどの部分でも一様に周回しているの
で、研磨布に対する研磨面の相対移動速度がどの部分で
も一様になる。Further, when the object to be polished is lapped along the surface to be lapped without rotating, it is possible to lap evenly on any part of the surface. The relative movement speed of the polishing surface with respect to the polishing cloth is uniform at any part.
【００１０】図２に示すように、周回運動Ｅの半径Ｒを
研磨布が圧接されている研磨面上の領域Ｆの差し渡し長
さよりも小さくすることにより、周回運動により加工さ
れる領域Ｇの周辺部は、断続的にしか研磨布により圧接
されないのに対して、その中心部は持続的に研磨布によ
り圧接され、加工研磨を受け続ける。従って、延べ加工
時間は中心部で最大であり、周辺部で次第に短くなる。
その結果、加工される領域Ｇは、中空円環状とはならず
内周部において重畳加工されて中心部で加工量が最大と
なり、周辺部へ次第に小さくなる。As shown in FIG. 2, the radius R of the orbiting motion E is made smaller than the transit length of the region F on the polishing surface against which the polishing cloth is pressed, so that the region G to be processed by the orbiting motion is surrounded. The portion is pressed by the polishing cloth only intermittently, whereas the central portion is continuously pressed by the polishing cloth and continues to be subjected to work polishing. Therefore, the total machining time is maximum in the central part and gradually shortens in the peripheral part.
As a result, the region G to be processed does not have a hollow annular shape, but is overlapped in the inner peripheral portion, the processing amount becomes maximum at the central portion, and gradually decreases toward the peripheral portion.
【００１１】前記の領域の差し渡し長さよりも周回運動
の半径を小さくするのは、前記の領域の差し渡し長さよ
りも周回運動の半径が大きいと、周回運動により加工さ
れる領域が中空円環状となり、凸部を効果的に平坦化出
来なくなるという不都合を生ずるからである。The radius of the orbiting motion is made smaller than the passing length of the above-mentioned region, when the radius of the orbiting motion is larger than the passing length of the above-mentioned region, the region to be processed by the orbiting motion becomes a hollow annular shape, This is because the disadvantage that the convex portion cannot be effectively flattened occurs.
【００１２】加圧棒の先端を凸球面とすることにより、
研磨布を介して被加工物と接するとき、頂面で最も接触
圧が高く頂面から遠ざかる周囲に行くに従い接触圧が次
第に低下する。研磨圧力が周辺に次第に小さくなるの
で、基板に対して従来のように剪断応力を与えることが
なく、基板の結晶組織に欠陥が生ずるような恐れもなく
なる。加圧棒が研磨面に対して傾くことから生ずる非対
称加工の問題も解決できる。By making the tip of the pressure bar a convex spherical surface,
When coming into contact with a work piece through a polishing cloth, the contact pressure is highest on the top surface, and the contact pressure gradually decreases as the distance from the top surface increases. Since the polishing pressure is gradually reduced to the periphery, shear stress is not applied to the substrate as in the conventional case, and there is no fear of causing defects in the crystal structure of the substrate. The problem of asymmetrical processing caused by the pressure bar tilting with respect to the polishing surface can also be solved.
【００１３】その上弾性体を介して加圧棒の先端が研磨
布を圧するようになっているので、加圧棒の加圧力は、
加圧棒と弾性体との接触領域の外周まで弾性体を変形さ
せ、被加工物に対して研磨布を、加圧棒の外周に加圧力
がなだらかに低下した状態に圧接せしめる。山の部分を
研磨するとき、山の頂部で接触圧が大きく山裾側に行く
に従い接触圧が次第に低下するので、前記の接触圧の分
布は更に、中心部から周囲になだらかに低下しつつ広が
ったものとなる。この作用により、従来よりも均一な厚
さに効率よく研磨できる。Moreover, since the tip of the pressing rod presses the polishing cloth through the elastic body, the pressing force of the pressing rod is
The elastic body is deformed up to the outer periphery of the contact region between the pressure rod and the elastic body, and the polishing cloth is pressed against the workpiece in such a state that the pressing force gently decreases on the outer periphery of the pressure rod. When polishing the crest part, the contact pressure is large at the crest of the crest, and the contact pressure gradually decreases toward the crest of the crest, so the distribution of the contact pressure further spreads while gradually decreasing from the center to the periphery. Will be things. By this action, it is possible to efficiently polish to a more uniform thickness than before.
【００１４】加圧棒は一つでも、被加工物の研磨面を周
回運動させつつ、被加工物の研磨面に平行に研磨面を、
加圧棒に対して一方向に一端から他端に移動させ、次い
で一方向に直角に移動し次いで一方向と逆に若干の重な
りを有して移動させるジグザグ移動させつつ片側から他
側に掃引して研磨することにより、被加工物の表面全面
を研磨できる。Even if only one pressure bar is used, the polishing surface of the work piece is rotated, and the polishing surface is parallel to the polishing surface of the work piece.
Move from one end to the other end in one direction with respect to the pressure bar, then move at a right angle in one direction and then move with a slight overlap in the opposite direction to one direction Sweep from one side to the other while moving zigzag Then, the entire surface of the workpiece can be polished.
【００１５】加工能率を上げるためには、例えば加圧棒
を１列に６個で６列配置する等して複数個で同時に研磨
面を研磨することで解決できる。この場合、１個の加圧
棒が研磨を担当する領域は小さくなるから、ジクザグ移
動させる範囲は狭い一定の範囲となる。従って、四角な
領域を四角な外形に沿って、外側から、又は内側から渦
状に移動させて研磨してもよい。In order to increase the processing efficiency, it is possible to solve the problem by polishing the polishing surface with a plurality of pressure rods at the same time, for example by arranging six pressure rods in one row in six rows. In this case, the area in which one pressure rod is in charge of polishing is small, and therefore the range in which the zigzag movement is performed is a narrow fixed range. Therefore, the square region may be moved in a spiral shape from the outside or the inside along the square outline to be polished.
【００１６】上記の装置において研磨布支持装置は、被
加工物に対して接離可能に設けられているが、被加工物
に対して平行移動したり、回転したりするように設けら
れていなかった。In the above apparatus, the polishing cloth support device is provided so as to be able to come into contact with and separate from the work piece, but is not provided so as to move in parallel or rotate with respect to the work piece. It was
【００１７】一般に用いられている研磨布は、ポリウレ
タン製の不織布、又は、それに更にポリウレタン樹脂を
含浸させることにより硬化処理を施したものである。そ
の表面は凹凸を有し、又、粗い組織の密度むらに起因す
る硬度むらが存在し、研磨のための荷重印加時には、乱
雑な圧力分布を与えていることが分かった。The polishing cloth generally used is a non-woven fabric made of polyurethane, or a non-woven fabric which is hardened by further impregnating it with a polyurethane resin. It was found that the surface had irregularities, and there was unevenness in hardness due to uneven density of the coarse structure, and a random pressure distribution was given when a load for polishing was applied.
【００１８】上記の研磨装置では、加圧棒により狭い領
域を研磨するため、研磨布は被加工物に対して回転した
り移動したりせず、常に同一位置状態で接するため、研
磨布表面の硬度むらや凹凸が被加工物の表面に転写され
る傾向があり、加工量の分布に不規則性が生ずる。この
結果、生じる起伏は研磨布の組織の粗さの程度（０.１
〜０.５ｍｍ）の短い周期を持っており、被加工物表面
の面粗度を悪化させていることが分かった。In the above-mentioned polishing apparatus, since the narrow area is polished by the pressure rod, the polishing cloth does not rotate or move with respect to the workpiece, but is always in contact with the workpiece at the same position. The unevenness of hardness or unevenness tends to be transferred to the surface of the work piece, which causes irregularity in the processing amount distribution. As a result, the resulting undulations have a degree of roughness of the polishing cloth (0.1
It has a short cycle of up to 0.5 mm) and is found to deteriorate the surface roughness of the surface of the work piece.
【００１９】[0019]
【発明が解決しようとする課題】本発明は上記の装置に
おいて、研磨布による面粗度の悪化を防止しうる研磨装
置を提供することを課題とする。SUMMARY OF THE INVENTION It is an object of the present invention to provide a polishing apparatus which can prevent deterioration of surface roughness due to a polishing cloth in the above apparatus.
【００２０】[0020]
【課題を解決するための手段】本発明は、上記の装置に
おいて、研磨棒支持装置により研磨布支持装置を同一位
置で回転可能に保持させ、研磨布と被加工物との間に生
ずる摩擦力と被加工物の周回運動により研磨布を同一位
置で回転させつつ研磨を行うようにすることにより、上
記の課題を解決するものである。According to the present invention, in the above-mentioned apparatus, a polishing rod supporting device holds a polishing cloth supporting device rotatably at the same position, and a frictional force generated between the polishing cloth and a workpiece is generated. The problem is solved by performing polishing while rotating the polishing cloth at the same position by the orbital movement of the workpiece.
【００２１】[0021]
【作用】本発明では、研磨布が被加工物に対して、被加
工物の加工面に平行な面に沿って回転運動を行うので、
加工量分布の不規則の原因である研磨布表面の凹凸が広
い領域で平均化され、加工量の不規則分布の問題を生ず
る事がなくなり、時事刻々意図した加工量を与えること
が出来る。In the present invention, since the polishing cloth makes a rotary motion with respect to the work piece along a plane parallel to the work surface of the work piece,
The irregularities on the surface of the polishing cloth, which are the cause of the irregularity of the amount of machining, are averaged over a wide area, the problem of irregular distribution of the amount of machining is eliminated, and the intended amount of machining can be given from time to time.
【００２２】[0022]
【実施例】研磨布の加圧棒側に板状の弾性体を研磨布に
接して配置した場合の実施例を図１について説明する。
本発明装置は被加工物支持装置３と、研磨布支持装置４
と、加圧棒支持装置５とを備え、被加工物支持装置３
は、円環状の固定枠６と、固定枠６の内側にゴムベロー
ズ８で周縁を固定枠６と結合した加工台７と、支持枠９
と、支持枠９に支持され図示しないモータにより回転さ
れる軸１０とを有し、加工台７は軸１０の一端に形成し
た偏心部１１により、ゴムベローズ８に拘束され同一位
置で、偏心部１１の偏心量に対応する周回運動をするよ
うになっている。この偏心運動から生ずる振動をなくす
るために、偏心部１１の偏心側と反対側において、軸１
０の外側に位置して錘２４が軸１０に取り付けてある。EXAMPLE An example in which a plate-shaped elastic body is placed on the pressure rod side of the polishing cloth in contact with the polishing cloth will be described with reference to FIG.
The device of the present invention comprises a workpiece supporting device 3 and a polishing cloth supporting device 4.
And a pressure rod support device 5, and the workpiece support device 3
Is an annular fixed frame 6, a working table 7 having a peripheral edge joined to the fixed frame 6 by a rubber bellows 8 inside the fixed frame 6, and a support frame 9
And a shaft 10 supported by a support frame 9 and rotated by a motor (not shown). A circular motion corresponding to the eccentric amount of 11 is performed. In order to eliminate the vibration caused by this eccentric movement, the shaft 1 is provided on the side opposite to the eccentric side of the eccentric portion 11.
A weight 24 is attached to the shaft 10 outside the zero.
【００２３】固定枠６内の加工台７の上には、基板等の
被加工物１が吸着により固定できるようになっている。
固定枠６、支持枠９等からなる被加工物支持装置３は、
図示しない装置により、被加工物１の研磨面１２に平行
な面上で一方向に移動し、次いで一方向と直角な横方向
に僅かに移動し、前と反対に移動し、前と同方向の横方
向に僅かに移動するというジグザグ移動を一定の領域で
行うように構成されている。A work piece 1 such as a substrate can be fixed on the work table 7 in the fixed frame 6 by suction.
The workpiece support device 3 including the fixed frame 6 and the support frame 9 is
By a device (not shown), it moves in one direction on a plane parallel to the polishing surface 12 of the workpiece 1, then slightly moves in a lateral direction perpendicular to the one direction, moves in the opposite direction to the front, and moves in the same direction as the front. The zigzag movement of slightly moving in the horizontal direction is performed in a certain area.
【００２４】この送り装置は直角２方向へのボールネジ
による送り機構を備えた、通常のＸＹテーブルである。
各方向への送り量はボールネジを回転駆動するモーター
の回転量によって調節される。１方向への送り量を周期
的に増減しながら、直角方向への一定速度の送りを行う
ことによって、ジグザク運動を行うようになっている。
又、固定枠６は、被加工物１が浸かるようにコロイダル
シリカの溶液が一方から他方に通過するようにコロイダ
ルシリカ溶液の供給及び排出口が設けられている。This feeding device is an ordinary XY table provided with a feeding mechanism by ball screws in two directions at right angles.
The feed amount in each direction is adjusted by the rotation amount of the motor that rotationally drives the ball screw. Zigzag motion is performed by periodically increasing or decreasing the feed amount in one direction and feeding at a constant speed in the right angle direction.
Further, the fixed frame 6 is provided with a colloidal silica solution supply and discharge port so that the colloidal silica solution passes from one side to the other so that the workpiece 1 is dipped.
【００２５】研磨布支持装置４は、中央が開口した円筒
部２７の一端にフランジが形成された形状をした研磨布
取付枠１３と、研磨布取付枠１３の円筒部２７の他端を
閉じるように周縁で円筒部２７の他端に固着された研磨
布１４とがあり、研磨布１４が加工台７上の被加工物１
の研磨面１２と平行に研磨面１２に接したり、研磨面１
２から離れたりしうるように図示しない上下装置により
支持されている。研磨布１４の被加工物１と反対側に
は、シリコンゴムからなる板状の弾性体１５が研磨布１
４に接着されている。The polishing cloth support device 4 closes the polishing cloth mounting frame 13 having a shape in which a flange is formed at one end of a cylindrical portion 27 having an opening in the center, and the other end of the cylindrical portion 27 of the polishing cloth mounting frame 13. There is a polishing cloth 14 fixed to the other end of the cylindrical portion 27 at the periphery, and the polishing cloth 14 is the work piece 1 on the processing table 7.
The polishing surface 12 in parallel with the polishing surface 12 of the
It is supported by a vertical device (not shown) so that it can be separated from 2. A plate-shaped elastic body 15 made of silicon rubber is provided on the opposite side of the polishing cloth 14 from the workpiece 1.
It is glued to 4.
【００２６】加圧棒支持装置５は、研磨布１４に平行な
支持板１６と、支持板１６に直角に支持板１６を貫通し
て軸方向に移動可能に支持板１６に保持された多数の加
圧棒２と、支持板１６の上方に配置されたシリンダブロ
ック１７と、シリンダブロック１７の上面に加圧棒２と
相対して取り付けられた加圧棒２と同数のリニアアクチ
ュエータ１８と、リニアアクチュエータ１８の押圧力を
加圧棒２側に伝達するシリンダブロック１７内に設けた
ばね１９と、各加圧棒２の上端に接続された接続筒２１
と、接続筒２１内に配置された圧力センサ２２と、ばね
１９の圧力を圧力センサ２２を介して加圧棒２に伝える
中間軸２０とを備えている。The pressure rod support device 5 includes a support plate 16 which is parallel to the polishing cloth 14 and a large number of which are supported by the support plate 16 so as to penetrate the support plate 16 at right angles to the support plate 16 and to be movable in the axial direction. The pressure rod 2, a cylinder block 17 arranged above the support plate 16, a linear actuator 18 of the same number as the pressure rod 2 mounted on the upper surface of the cylinder block 17 so as to face the pressure rod 2, and a linear actuator 18. A spring 19 provided in the cylinder block 17 for transmitting the pressing force of the actuator 18 to the pressure rod 2 side, and a connecting cylinder 21 connected to the upper end of each pressure rod 2.
And a pressure sensor 22 arranged in the connection cylinder 21, and an intermediate shaft 20 for transmitting the pressure of the spring 19 to the pressure rod 2 via the pressure sensor 22.
【００２７】又、加圧棒２の弾性体１５側に突出した先
端２３は凸球面に形成してある。支持板１６にはリニア
アクチュエータ２６が取り付けられており、支持板１６
の下側に配置した研磨布ガイド２５をリニアアクチュエ
ータ２６で上下できるようになっている。研磨布ガイド
２５の中央は円筒部２８に形成されていて、研磨加工の
前後にはリニアアクチュエータ２６により研磨布ガイド
２５より上方に保持され、研磨布１４が被加工物１と接
する加工状態のときには、研磨布ガイド２５はリニアア
クチュエータ２６により下降され、円筒部２８の外周
は、研磨布取付枠１３の円筒部２７の内周に嵌合して研
磨布取付枠１３を同一位置で回転出来るように保持す
る。Further, the tip end 23 of the pressure rod 2 protruding toward the elastic body 15 is formed into a convex spherical surface. A linear actuator 26 is attached to the support plate 16 and
The polishing cloth guide 25 arranged on the lower side can be moved up and down by a linear actuator 26. The center of the polishing cloth guide 25 is formed into a cylindrical portion 28, which is held above the polishing cloth guide 25 by a linear actuator 26 before and after polishing, and when the polishing cloth 14 is in contact with the workpiece 1, it is in a processing state. The polishing cloth guide 25 is lowered by the linear actuator 26, and the outer circumference of the cylindrical portion 28 is fitted to the inner circumference of the cylindrical portion 27 of the polishing cloth mounting frame 13 so that the polishing cloth mounting frame 13 can be rotated at the same position. Hold.
【００２８】上記の実施例においては、研磨布ガイド２
５は支持板１６に支持されているが、研磨布取付枠の周
囲に配置してもよい。In the above embodiment, the polishing cloth guide 2
Although 5 is supported by the support plate 16, it may be arranged around the polishing cloth attachment frame.
【００２９】被加工物１の研磨面１２の研磨は次のよう
にして行う。まず、各部分の厚みを測定した被加工物１
を加工台７に取り付け、固定枠６内にコロイダルシリカ
液を研磨面１２が浸かるように流す。研磨布取付枠１３
を下降して研磨布１４を研磨面１２に接せしめる。リニ
アアクチュエータ２６により研磨布ガイド２５を下降さ
せ、円筒部２８を研磨布取付枠１３の円筒部２７の内部
に挿入する。リニアアクチュエータ１８を動作させ、加
圧棒２を下降して先端２３を弾性体１５に圧接させる。
軸１０を回転させ被加工物１をその位置で周回させつつ
研磨面の一端側から他端側に一方向に移動を開始させ
る。Polishing of the polishing surface 12 of the workpiece 1 is performed as follows. First, the workpiece 1 whose thickness is measured
Is attached to the processing table 7, and the colloidal silica liquid is poured into the fixed frame 6 so that the polishing surface 12 is immersed. Polishing cloth mounting frame 13
Is lowered to bring the polishing cloth 14 into contact with the polishing surface 12. The polishing cloth guide 25 is lowered by the linear actuator 26, and the cylindrical portion 28 is inserted into the cylindrical portion 27 of the polishing cloth mounting frame 13. The linear actuator 18 is operated and the pressure rod 2 is lowered to bring the tip end 23 into pressure contact with the elastic body 15.
The shaft 10 is rotated to orbit the workpiece 1 at that position and start moving in one direction from one end side to the other end side of the polishing surface.
【００３０】このとき、加圧棒２によって圧接される研
磨面１２の各部分の測定結果により決定された研磨量に
相当する研磨が得られるようにリニアアクチュエータ１
８を動作させ、この動作を圧力センサ２２でリニアアク
チュエータ１８に帰還して各部分の研磨量に相当する研
磨が行なわれるようにする。他端側に移動した研磨面は
一方向と直角に若干移動させ、次いで一方向と逆に移動
させて順次に横に移動して複数個の加圧棒で研磨面全面
が掃引されるように研磨する。被加工物１に周回運動が
与えられると、研磨布１４は、被加工物１と研磨布１４
との摩擦により、周回方向にその位置で周回速度に比較
して非常にゆっくりとした自転を行う。At this time, the linear actuator 1 is provided so that the polishing amount corresponding to the polishing amount determined by the measurement result of each portion of the polishing surface 12 pressed by the pressure rod 2 is obtained.
8 is operated, and this operation is returned to the linear actuator 18 by the pressure sensor 22 so that polishing corresponding to the polishing amount of each portion is performed. Move the polishing surface moved to the other end slightly at right angles to one direction, then move it in the opposite direction and move laterally in sequence so that the entire polishing surface is swept by a plurality of pressure rods. Grind. When the orbiting motion is applied to the work piece 1, the polishing cloth 14 is
Due to the friction with, the rotation in the orbiting direction at that position is very slow compared to the orbiting speed.
【００３１】この装置で、研磨布１４としてポリウレタ
ン樹脂を含浸したポリウレタン繊維不織布を用いた。加
圧棒２の先端２３の直径を２０ｍｍ、下面の曲率半径を
２５ｍｍとした。板状のシリコンゴムからなる弾性体１
５の厚さを５ｍｍ、先端２３の弾性体１５の接触部の直
径１５ｍｍとした。被加工物１の周回直径２ｍｍ、周回
回転数１０００回／分で、被加工物１の往復移動の際の
振幅を２５ｍｍ、往復の重なり幅を０.２ｍｍとして研
磨を行った結果、仕上げ表面の平均面粗度はＲａ値にし
て２０Åであった。これに対して従来の研磨布固定型の
研磨装置での仕上げ表面の平均面粗度は、Ｒａ値にして
１００Åであった。In this apparatus, a polyurethane fiber non-woven fabric impregnated with a polyurethane resin was used as the polishing cloth 14. The diameter of the tip 23 of the pressure rod 2 was 20 mm, and the radius of curvature of the lower surface was 25 mm. Elastic body 1 made of plate-shaped silicone rubber
The thickness of 5 was 5 mm, and the diameter of the contact portion of the elastic body 15 at the tip 23 was 15 mm. When the orbiting diameter of the work piece 1 is 2 mm, the number of revolutions is 1000 revolutions / minute, the amplitude of the back and forth movement of the work piece 1 is 25 mm, and the overlapping width of the reciprocation is 0.2 mm. The average surface roughness was a Ra value of 20Å. On the other hand, the average surface roughness of the finished surface in the conventional polishing cloth fixed type polishing machine was 100Å in Ra value.
【００３２】[0032]
【発明の効果】本発明によれば、被加工物を均一な厚さ
に研磨できると共に、従来よりも良好な面粗度に研磨で
き、又、シリコン基板の単結晶に欠陥を生ずる恐れのな
い研磨方法及び装置を提供することができる。According to the present invention, a work piece can be polished to a uniform thickness and can be polished to a surface roughness better than before, and there is no risk of causing defects in a single crystal of a silicon substrate. A polishing method and apparatus can be provided.
【図１】本発明装置の実施例の断面図である。FIG. 1 is a sectional view of an embodiment of the device of the present invention.
【図２】本発明方法における被加工物の周回運動と、一
つの加圧棒による加工領域との関係の説明図である。FIG. 2 is an explanatory diagram of the relationship between the orbital movement of the workpiece and the processing region by one pressure bar in the method of the present invention.
【図３】従来の研磨装置の説明図である。FIG. 3 is an explanatory view of a conventional polishing apparatus.
１ 被加工物 ２ 加圧棒 ３ 被加工物支持装置 ４ 研磨布支持装置 ５ 加圧棒支持装置 ６ 固定枠 ７ 加工台 ８ ゴムベローズ ９ 支持枠 １０ 軸 １１ 偏心部 １２ 研磨面 １３ 研磨布取付枠 １４ 研磨布 １５ 弾性体 １６ 支持板 １７ シリンダブロック １８ リニアアクチュエータ １９ ばね ２０ 中間軸 ２１ 接続筒 ２２ 圧力センサ ２３ 先端 ２４ 錘 ２５ 研磨布ガイド ２６ リニアアクチュエータ ２７ 円筒部 ２８ 円筒部 1 Workpiece 2 Pressure rod 3 Workpiece support device 4 Polishing cloth support device 5 Pressure rod support device 6 Fixed frame 7 Processing table 8 Rubber bellows 9 Support frame 10 Shaft 11 Eccentric part 12 Polishing surface 13 Polishing cloth mounting frame 14 Polishing Cloth 15 Elastic Body 16 Support Plate 17 Cylinder Block 18 Linear Actuator 19 Spring 20 Intermediate Shaft 21 Connection Cylinder 22 Pressure Sensor 23 Tip 24 Weight 25 Polishing Cloth Guide 26 Linear Actuator 27 Cylindrical Part 28 Cylindrical Part
Claims (6)
し、被加工物の研磨面の面積よりも小さい面積の領域
に、加圧棒で、被加工物の研磨面に研磨布を接触圧力を
調節しつつ圧接せしめ、研磨布に対して被加工物を、研
磨面に沿い自転を伴なわず前記の領域の差し渡し長さよ
りも小さい半径の周回運動をさせると同時に、研磨面に
沿い移動をさせ、研磨布と被加工物との間に生ずる摩擦
力と被加工物の周回運動により研磨布を同一位置で回転
させつつ研磨を行うことを特徴とする研磨方法。1. A polishing cloth is placed in contact with the polishing surface of a workpiece, and a polishing pad is applied to the polishing surface of the workpiece with a pressure rod in an area having an area smaller than the area of the polishing surface of the workpiece. Is pressed against the polishing cloth while adjusting the contact pressure, and the workpiece is moved along the polishing surface without rotation and with a radius smaller than the transfer length of the above-mentioned region. A polishing method which comprises moving the polishing cloth at the same position by moving the polishing cloth at a same position by a frictional force generated between the polishing cloth and the workpiece and a circular motion of the workpiece.
形成されている請求項１に記載の研磨方法。2. The polishing method according to claim 1, wherein the surface of the pressure rod facing the polishing cloth is formed into a convex spherical surface.
して行う請求項１、２の何れか１つに記載の研磨方法。3. The polishing method according to claim 1, wherein a plate-shaped elastic body is arranged on the pressure rod side of the polishing cloth.
を配置し、被加工物の研磨面を複数箇所で同時に研磨す
る請求項１、２、３の何れか１つに記載の研磨方法。4. The method according to claim 1, wherein a plurality of pressure rods are arranged above the polishing surface of the work piece, and the polishing surface of the work piece is simultaneously polished at a plurality of locations. Polishing method.
沿い周回運動しつつ研磨面に沿い移動をする被加工物支
持装置と、被加工物の研磨面と相対して研磨面と平行に
研磨布を周縁で支持し研磨布を被加工物の研磨面に接離
可能に移動し、かつ同一位置で回転可能に保持される研
磨布支持装置と、研磨布の被加工物と反対側に配置され
複数の加圧棒を研磨布側に移動可能に保持する加圧棒支
持装置とを備え、加圧棒の研磨布に面する先端が凸球面
をなしている研磨装置。5. A workpiece support device that supports a workpiece and moves along the polishing surface while moving along the polishing surface of the workpiece, and a polishing surface relative to the polishing surface of the workpiece. A polishing cloth supporting device that supports the polishing cloth at its peripheral edge in parallel with the polishing cloth, moves the polishing cloth to and away from the polishing surface of the workpiece, and is rotatably held at the same position; A pressure rod supporting device that is arranged on the opposite side and movably holds a plurality of pressure rods on the polishing cloth side, and the tip of the pressure rod facing the polishing cloth has a convex spherical surface.
布に接して配置されているか、加圧棒先端の凸球面が、
凸球面に沿う形状の弾性体で覆われている請求項５に記
載の研磨装置。6. A plate-shaped elastic body is disposed on the polishing cloth on the pressure rod side in contact with the polishing cloth, or the convex spherical surface at the tip of the pressure rod is
The polishing apparatus according to claim 5, which is covered with an elastic body having a shape along a convex spherical surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17599793A JP3326442B2 (en) | 1993-06-23 | 1993-06-23 | Polishing method and apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17599793A JP3326442B2 (en) | 1993-06-23 | 1993-06-23 | Polishing method and apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH079328A true JPH079328A (en) | 1995-01-13 |
| JP3326442B2 JP3326442B2 (en) | 2002-09-24 |
Family
ID=16005907
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17599793A Expired - Fee Related JP3326442B2 (en) | 1993-06-23 | 1993-06-23 | Polishing method and apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3326442B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000006003A (en) * | 1998-04-21 | 2000-01-11 | Asahi Glass Co Ltd | Pressing method for flat member and pressing device |
| WO2000056502A1 (en) * | 1999-03-19 | 2000-09-28 | Fujitsu Limited | Lapping machine, lapping method, and method of fabricating magnetic head |
| US7014532B2 (en) | 2001-09-10 | 2006-03-21 | Fujitsu Limited | Lapping machine, lapping method, and method of manufacturing magnetic head |
-
1993
- 1993-06-23 JP JP17599793A patent/JP3326442B2/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000006003A (en) * | 1998-04-21 | 2000-01-11 | Asahi Glass Co Ltd | Pressing method for flat member and pressing device |
| WO2000056502A1 (en) * | 1999-03-19 | 2000-09-28 | Fujitsu Limited | Lapping machine, lapping method, and method of fabricating magnetic head |
| US6722947B2 (en) | 1999-03-19 | 2004-04-20 | Fujitsu Limited | Lapping machine, lapping method, and method of manufacturing magnetic head |
| US7014532B2 (en) | 2001-09-10 | 2006-03-21 | Fujitsu Limited | Lapping machine, lapping method, and method of manufacturing magnetic head |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3326442B2 (en) | 2002-09-24 |
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