JPH0783003B2 - Waferbot transport method - Google Patents
Waferbot transport methodInfo
- Publication number
- JPH0783003B2 JPH0783003B2 JP61162560A JP16256086A JPH0783003B2 JP H0783003 B2 JPH0783003 B2 JP H0783003B2 JP 61162560 A JP61162560 A JP 61162560A JP 16256086 A JP16256086 A JP 16256086A JP H0783003 B2 JPH0783003 B2 JP H0783003B2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- cap
- transfer arm
- charging
- boat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は反応炉を縦型に設置した拡散装置,CVD装置等の
縦型半導体製造装置に係り、特に縦型反応炉内に下方か
ら搬入出されるウェーハボートの搬送方法に関する。Description: TECHNICAL FIELD The present invention relates to a vertical semiconductor manufacturing apparatus such as a diffusion apparatus or a CVD apparatus in which a reaction furnace is installed vertically, and particularly, it is loaded into the vertical reaction furnace from below. The present invention relates to a method of transporting a wafer boat to be taken out.
従来の縦型半導体製造装置を第６図によって説明する
と、１は石英反応管２とその外周に設けたヒータ３とよ
りなる縦型反応炉、４はヒータベースである。５は縦型
反応炉１内に下から搬入出されるウェーハボートで、多
数の溝にウェーハ６を挿入して保持するウェーハチャー
ジ部７とこのチャージ部７の下端に一体に形成され炉内
の熱放散を防ぐ断熱材入りのキャップ部８とよりなる。A conventional vertical semiconductor manufacturing apparatus will be described with reference to FIG. 6. Reference numeral 1 is a vertical reaction furnace including a quartz reaction tube 2 and a heater 3 provided on the outer periphery thereof, and 4 is a heater base. Reference numeral 5 denotes a wafer boat which is loaded into and unloaded from the vertical reaction furnace 1 from below, and a wafer charging section 7 for inserting and holding the wafers 6 in a large number of grooves and a heat generation inside the furnace integrally formed at the lower end of the charging section 7. It is composed of a cap portion 8 containing a heat insulating material for preventing radiation.
従来はウェーハボート５をボート搬送アーム９の先端載
置部9a上に載せて炉口の真下まで搬送し、次いでボート
搬送アーム９を昇降させることによりウェーハボート５
を反応炉１内に搬入出させていた。Conventionally, the wafer boat 5 is mounted on the tip mounting portion 9a of the boat transfer arm 9 and transferred to a position right below the furnace port, and then the boat transfer arm 9 is moved up and down to move the wafer boat 5
Were carried in and out of the reaction furnace 1.
従来のウェーハボート５はウェーハチャージ部７とキャ
ップ部８を一体に構成していたので、ウェーハボート５
を反応炉１内に搬入出するためには、装置を天井の高い
部屋に設置しなければならなかった。In the conventional wafer boat 5, the wafer charging unit 7 and the cap unit 8 are integrally formed.
In order to carry in and out of the reactor into the reactor 1, the device had to be installed in a room with a high ceiling.
従って天井の低い部屋に装置を設置する場合には、反応
炉１の長さとウェーハボート５の長さを短くする必要が
あるため、装置の設計変更を行わねばならないばかりで
なく、ウェーハ６の処理枚数が減りウェーハ処理能力
（スループット）が低下するという問題点があった。Therefore, when the apparatus is installed in a room with a low ceiling, it is necessary to shorten the length of the reaction furnace 1 and the length of the wafer boat 5, so that the design of the apparatus must be changed and the processing of the wafer 6 is required. There is a problem that the number of wafers decreases and the wafer processing capacity (throughput) decreases.
本発明方法は上記の問題点を解決するため、第１図〜第
５図示のように縦型反応炉１内にウェーハチャージ部７
とキャップ部８よりなるウェーハボート５を下方より搬
入出する装置において、上記ウェーハボート５を、ウェ
ーハチャージ部７とキャップ部８に２分割し、ボート搬
入時はチャージ部搬送アーム12先端の２つの爪状載置部
12aに、ウェーハチャージ部７の下部10に設けた頸れ部
分11を挟み込んで載置し、このチャージ部搬送アーム12
をウェーハチャージ部７が搬送開始位置より縦型反応炉
１の真下位置にくるまでチャージ部搬送アーム12の移動
手段により移動した後、所定高さ位置までチャージ部搬
送アーム12の昇降手段により上昇させ、しかる後、先端
の載置部16aにキャップ部８の下面を嵌め込んで載置し
たキャップ部搬送アーム16を、待機位置より縦型反応炉
１の真下位置にくるまでキャップ部搬送アーム16の移動
手段により移動し、次いでキャップ部搬送アーム16の昇
降手段により上昇させてウェーハチャージ部７の下面を
キャップ部８の上面に嵌め込んで載置させ、ウェーハチ
ャージ部７の支持がチャージ部搬送アーム12先端の２つ
の爪状載置部12aよりキャップ部８に移行したら、チャ
ージ部搬送アーム12をその移動手段により移動させてウ
ェーハチャージ部７の頸れ部分11から爪状載置部12aを
離脱させ、しかる後、キャップ部搬送アーム16を，その
昇降手段によりウェーハチャージ部７とキャップ部８を
載置した状態で縦型反応炉１の最終ボート搬入位置まで
上昇して停止させ、ボート搬出は上記とは逆の過程で行
うようにしたウェーハボートの搬送方法である。According to the method of the present invention, in order to solve the above problems, the wafer charging unit 7 is provided in the vertical reactor 1 as shown in FIGS.
In the device for loading and unloading the wafer boat 5 including the cap portion 8 and the cap portion 8, the wafer boat 5 is divided into a wafer charging portion 7 and a cap portion 8, and two portions at the tip of the charging portion transfer arm 12 are loaded at the time of loading the boat. Claw mount
The neck portion 11 provided on the lower portion 10 of the wafer charging unit 7 is sandwiched and mounted on the wafer 12a.
Is moved by the moving means of the charge part transfer arm 12 until the wafer charge part 7 is located directly below the vertical reactor 1 from the transfer start position, and is then raised by the elevating means of the charge part transfer arm 12 to a predetermined height position. After that, the cap portion transfer arm 16 in which the lower surface of the cap portion 8 is fitted and placed on the mounting portion 16a at the tip is placed on the cap portion transfer arm 16 until the position directly below the vertical reactor 1 from the standby position. The wafer charging unit 7 is moved by the moving unit and then raised by the lifting unit of the cap unit transfer arm 16 so that the lower surface of the wafer charging unit 7 is fitted and placed on the upper surface of the cap unit 8, and the wafer charging unit 7 is supported by the charging unit transfer arm. After shifting from the two claw-shaped mounting portions 12a at the tip 12 to the cap portion 8, the charging portion transfer arm 12 is moved by the moving means to move the neck of the wafer charging portion 7. The claw-shaped mounting portion 12a is detached from the minute portion 11, and then the cap portion transfer arm 16 is loaded into the final boat of the vertical reactor 1 with the wafer charging portion 7 and the cap portion 8 placed by the elevating means. This is a wafer boat transfer method in which the boat is carried out in the reverse order of the above, after being raised to the position and stopped.
以下図面により本発明の実施例を説明する。 Embodiments of the present invention will be described with reference to the drawings.
第１図は本発明ウェーハボートの一例を用いた縦型半導
体製造装置の簡略断面図、第２図は本発明ウェーハボー
トとその搬送系の斜視図である。FIG. 1 is a simplified cross-sectional view of a vertical semiconductor manufacturing apparatus using an example of the wafer boat of the present invention, and FIG. 2 is a perspective view of the wafer boat of the present invention and its transfer system.
まず、本発明に係る縦型半導体製造装置の構成を説明す
る。First, the configuration of the vertical semiconductor manufacturing apparatus according to the present invention will be described.
第１図，第２図において１は上記従来装置と同様に反応
管２とヒータ３とよりなる縦型反応炉である。５は縦型
反応炉１内に下から搬入出されるウェーハボートで、多
数の溝にウェーハ６を水平に近い角度で挿入して保持す
るウェーハチャージ部７と，炉内の熱放散を防ぐ石英ウ
ール等の断熱材17入りのキャップ部８の２部品よりな
る。換言すれば、従来の一体構造のウェーハボートをウ
ェーハチャージ部７とキャップ部８とに２分割したもの
である。In FIG. 1 and FIG. 2, 1 is a vertical reactor having a reaction tube 2 and a heater 3 as in the conventional apparatus. Reference numeral 5 denotes a wafer boat that is loaded into and unloaded from the vertical reaction furnace 1 from below, a wafer charging section 7 that holds the wafer 6 by inserting it in a number of grooves at angles close to horizontal, and quartz wool that prevents heat dissipation in the furnace. It is composed of two parts of the cap portion 8 containing the heat insulating material 17 such as. In other words, the conventional wafer boat having an integral structure is divided into the wafer charging section 7 and the cap section 8.
ウェーハチャージ部７の下部10はドラムまたは糸巻き状
になっており、その頸れ部分11にチャージ部搬送アーム
12先端の２つの爪状載置部12aを嵌め込んで当該ウェー
ハチャージ部７を支持することができる。ウェーハチャ
ージ部７の下部10下面の中心部には円形穴13が設けられ
ている。The lower part 10 of the wafer charging part 7 is in the form of a drum or a spool, and the neck part 11 has a charging part carrying arm.
The wafer charging section 7 can be supported by fitting the two claw-shaped mounting sections 12a at the tips of the 12 pieces. A circular hole 13 is provided at the center of the lower surface of the lower portion 10 of the wafer charging section 7.
キャップ部８上面の中心部には円形突起14が設けられ、
ウェーハチャージ部７はキャップ部８上に突起14と穴13
が嵌入した状態でズレ落ちることなく支持することがで
きる。キャップ部８下面の中央部には円形突起15が設け
られ、キャップ部搬送アーム16先端のリング状載置部16
aの孔18に突起15が嵌入した状態で支持することができ
る。A circular protrusion 14 is provided at the center of the upper surface of the cap portion 8,
The wafer charging section 7 has a projection 14 and a hole 13 on the cap section 8.
It can be supported without slipping when it is inserted. A circular protrusion 15 is provided at the center of the lower surface of the cap portion 8, and a ring-shaped mounting portion 16 at the tip of the cap portion transfer arm 16 is provided.
It can be supported with the projection 15 fitted in the hole 18 of a.
また、ウェーハチャージ部７の下部10下面の中心部に円
形突起14を，キャップ部８上面の中央部に円形穴13を設
けてキャップ部８上にウェーハチャージ部７を位置出し
とズレ落ち防止を図って支持するようにしてもよいし、
同様にキャップ部８下面の中央部に円形孔18を設け、キ
ャップ部搬送アーム16先端の載置部16aを円形突起15を
有する載置部としてキャップ部搬送アーム16先端の載置
部16aにキャップ部８を位置出しとズレ落ち防止を図っ
て支持するようにしてもよい。In addition, a circular protrusion 14 is provided at the center of the lower surface of the lower portion 10 of the wafer charging portion 7, and a circular hole 13 is provided at the central portion of the upper surface of the cap portion 8 to position the wafer charging portion 7 on the cap portion 8 and prevent misalignment. It may be designed and supported,
Similarly, a circular hole 18 is provided in the center of the lower surface of the cap portion 8, and the mounting portion 16a at the tip of the cap portion transfer arm 16 is used as a mounting portion having the circular protrusion 15 and the mounting portion 16a at the tip of the cap portion transfer arm 16 is capped. The portion 8 may be supported by positioning and preventing displacement.
次に本発明ウェーハボートの搬入出について説明する。Next, loading / unloading of the wafer boat of the present invention will be described.
ボート搬入時は、チャージ部搬送アーム12の爪状載置部
12aにウェーハチャージ部７の頸れ部11を挟み込んで載
置し、当該チャージ部搬送アーム12をウェーハチャージ
部７が搬送開始位置より反応炉１の真下位置にくるまで
回転する。キャップ部８はキャップ部搬送アーム16の載
置部16aに載置し横で待機している（第３図（ａ），第
４図（ａ），第５図（ａ）参照）。When loading the boat, the claw-shaped mounting part of the charging part transfer arm 12
The neck portion 11 of the wafer charging unit 7 is sandwiched and placed on 12a, and the charging unit transfer arm 12 is rotated until the wafer charging unit 7 comes to a position directly below the reaction furnace 1 from the transfer start position. The cap portion 8 is placed on the placing portion 16a of the cap portion transfer arm 16 and is standing by sideways (see FIGS. 3 (a), 4 (a) and 5 (a)).
しかる後、チャージ部搬送アーム12を上昇させ、ウェー
ハチャージ部７を反応炉１内に搬入開始する。ウェーハ
チャージ部７の下端がキャップ部８の上面より上まで上
昇したら、キャップ部搬送アーム16をキャップ部８がウ
ェーハチャージ部７の真下に位置するまで回転する（第
３図（ｂ），第４図（ｂ），第５図（ｂ）参照）。Then, the charging section transfer arm 12 is raised to start loading the wafer charging section 7 into the reaction furnace 1. When the lower end of the wafer charging unit 7 rises above the upper surface of the cap unit 8, the cap unit transfer arm 16 is rotated until the cap unit 8 is positioned directly below the wafer charging unit 7 (see FIGS. 3B and 4C). See FIG. 5 (b) and FIG. 5 (b).
次いでキャップ部搬送アーム16を上昇させ、キャップ部
８の上面をウェーハチャージ部７の下面に接触させた
後、ウェーハチャージ部７の支持がチャージ部搬送アー
ム12からキャップ部８に移行するまで当該キャップ部搬
送アーム16を上昇させる。ウェーハチャージ部７の支持
がキャップ部８に完全に移行し、チャージ部搬送アーム
12がウェーハチャージ部７から離れたら、チャージ部搬
送アーム12を回転してウェーハチャージ部７の頸れ部11
から爪状載置部12a離脱させる（第３図（ｃ），第４図
（ｃ），第５図（ｃ）参照）。Then, the cap transfer arm 16 is raised to bring the upper surface of the cap part 8 into contact with the lower surface of the wafer charging part 7, and then the cap of the wafer charging part 7 is moved from the charging part transfer arm 12 to the cap part 8 until the support of the wafer charging part 7 shifts. The part transfer arm 16 is raised. The support of the wafer charging unit 7 is completely transferred to the cap unit 8, and the charging unit transfer arm
When the wafer 12 is separated from the wafer charging unit 7, the charging unit transfer arm 12 is rotated and the neck 11 of the wafer charging unit 7 is rotated.
The claw-shaped mounting portion 12a is disengaged from (see FIG. 3 (c), FIG. 4 (c), and FIG. 5 (c)).
しかる後、キャップ部搬送アーム16を，ウェーハチャー
ジ部７とキャップ部８を載置した状態で反応炉１の最終
ボート搬入位置まで上昇して停止させ、ウェーハボート
５の搬入を終了する（第３図（ｄ），第４図（ｄ），第
５図（ｄ）参照）。Then, the cap transfer arm 16 is lifted to the final boat loading position of the reaction furnace 1 with the wafer charging section 7 and the cap section 8 placed thereon, and stopped, and the loading of the wafer boat 5 is completed (third step). See FIG. (D), FIG. 4 (d), and FIG. 5 (d)).
ボート搬出は上記とは逆の過程で行うことになる。The boat will be carried out in the reverse order of the above.
本発明においては、ウェーハチャージ部７とキャップ部
８を反応炉１の真下位置まで移動する手段として回転に
よる手段に限らず、横方向に移動する手段であってもよ
い。また、ウェーハチャージ部７とキャップ部８の昇降
手段も従来公知の手段を使用することができる。In the present invention, the means for moving the wafer charging portion 7 and the cap portion 8 to the position directly below the reaction furnace 1 is not limited to the means by rotation, but may be means for moving in the lateral direction. Further, as the means for raising and lowering the wafer charging section 7 and the cap section 8, conventionally known means can be used.
上述のように本発明によれば、縦型反応炉１内にウェー
ハチャージ部７とキャップ部８よりなるウェーハボート
５を下方より搬入出する装置において、上記ウェーハボ
ート５を、ウェーハチャージ部７とキャップ部８に２分
割し、ボート搬入時はチャージ部搬送アーム12先端の２
つの爪状載置部12aに、ウェーハチャージ部７の下部10
に設けた頸れ部分11を挟み込んで載置し、このチャージ
部搬送アーム12をウェーハチャージ部７が搬送開始位置
より縦型反応炉１の真下位置にくるまでチャージ部搬送
アーム12の移動手段により移動した後、所定高さ位置ま
でチャージ部搬送アーム12の昇降手段により上昇させ、
しかる後、先端の載置部16aにキャップ部８の下面を嵌
め込んで載置したキャップ部搬送アーム16を、待機位置
より縦型反応炉１の真下位置にくるまでキャップ部搬送
アーム16の移動手段により移動し、次いでキャップ部搬
送アーム16の昇降手段により上昇させてウェーハチャー
ジ部７の下面をキャップ部８の上面に嵌め込んで載置さ
せ、ウェーハチャージ部７の支持がチャージ部搬送アー
ム12先端の２つの爪状載置部12aよりキャップ部８に移
行したら、チャージ部搬送アーム12をその移動手段によ
り移動させてウェーハチャージ部７の頸れ部分11から爪
状載置部12aを離脱させ、しかる後、キャップ部搬送ア
ーム16を，その昇降手段によりウェーハチャージ部７と
キャップ部８を載置した状態で縦型反応炉１の最終ボー
ト搬入位置まで上昇して停止させ、ボート搬出は上記と
は逆の過程で行うようにしたウェーハボートの搬送方法
であるから、ウェーハチャージ部７とキャップ部８を一
体に構成した従来のウェーハボートの搬入出の場合に比
べてウェーハ処理能力を低下させることなくキャップ部
８の高さ分だけ装置の全高を低くでき、それだけ天井の
低い部屋に設置できる。換言すれば従来と同じ高さの部
屋に設置する場合、ウェーハ６の処理枚数をキャップ部
８の長さに対応する枚数だけ増大でき、ウェーハ処理能
力の向上を図ることができる。また、ウェーハボート５
の洗浄はウェーハチャージ部７とキャップ部８に分けて
行うことができるので容易になる。As described above, according to the present invention, in the apparatus for loading and unloading the wafer boat 5 including the wafer charging unit 7 and the cap unit 8 into the vertical reactor 1 from below, the wafer boat 5 is replaced with the wafer charging unit 7. It is divided into two parts in the cap part 8, and when the boat is loaded, the charge part transfer arm 12 has a tip 2
The lower part 10 of the wafer charging part 7 is attached to the two claw-shaped mounting parts 12a.
The charging part transfer arm 12 is placed by sandwiching the neck part 11 provided on the upper part of the wafer, and the charging part transfer arm 12 is moved by the moving means of the charging part transfer arm 12 until the wafer charging part 7 is located directly below the vertical reactor 1 from the transfer start position. After moving, it is lifted up to the predetermined height position by the elevating means of the charging section transfer arm 12,
After that, the cap portion transfer arm 16 in which the lower surface of the cap portion 8 is fitted and placed on the mounting portion 16a at the tip is moved from the standby position to a position directly below the vertical reactor 1 until the cap portion transfer arm 16 moves. The wafer charging section 7 is moved by the means, and then is moved up and down by the lifting and lowering means of the cap section transfer arm 16 to fit the lower surface of the wafer charging section 7 onto the upper surface of the cap section 8 and place the wafer charging section 7 on the charging section transfer arm 12. After shifting from the two claw-shaped mounting parts 12a at the tip to the cap part 8, the charging part transfer arm 12 is moved by the moving means to separate the claw-shaped mounting part 12a from the neck part 11 of the wafer charging part 7. After that, the cap portion transfer arm 16 is lifted up to the final boat loading position of the vertical reactor 1 with the wafer charging portion 7 and the cap portion 8 placed thereon by the elevating means and stopped. Since the boat unloading is a wafer boat carrying method performed in the reverse process to the above, as compared with the case of unloading and loading the conventional wafer boat in which the wafer charging unit 7 and the cap unit 8 are integrally configured. The overall height of the apparatus can be lowered by the height of the cap portion 8 without lowering the wafer processing capacity, and the apparatus can be installed in a room with a low ceiling. In other words, when the wafer 6 is installed in a room having the same height as the conventional one, the number of processed wafers 6 can be increased by the number corresponding to the length of the cap portion 8, and the wafer processing capacity can be improved. Also, the wafer boat 5
The cleaning can be performed separately for the wafer charging section 7 and the cap section 8 and thus is facilitated.
第１図は本発明ウェーハボートの一例を用いた縦型半導
体製造装置の簡略断面図、第２図は本発明ウェーハボー
トとその搬送系の斜視図、第３図（ａ）〜（ｄ）は本発
明におけるボート搬入過程の説明用斜視図、第４図
（ａ）〜（ｄ）は同じくその説明用簡略断面図、第５図
（ａ）〜（ｄ）は同じくその説明用平面図、第６図は従
来ウェーハボートの一例を用いた縦型半導体製造装置の
簡略断面図である。 １……縦型反応炉、５……ウェーハボート、６……ウェ
ーハ、７……ウェーハチャージ部、８……キャップ部、
10……下部、11……頸れ部分、12……チャージ部搬送ア
ーム、12a……爪状載置部、16……キャップ部搬送アー
ム、16a……（リング状）載置部。FIG. 1 is a simplified cross-sectional view of a vertical semiconductor manufacturing apparatus using an example of the wafer boat of the present invention, FIG. 2 is a perspective view of the wafer boat of the present invention and a transfer system thereof, and FIGS. 3 (a) to 3 (d) are FIG. 4 (a) to FIG. 4 (d) are the same simplified sectional views for explaining the boat loading process in the present invention, and FIGS. 5 (a) to 5 (d) are the same plan views for explaining the same. FIG. 6 is a simplified sectional view of a vertical semiconductor manufacturing apparatus using an example of a conventional wafer boat. 1 ... Vertical reactor, 5 ... Wafer boat, 6 ... Wafer, 7 ... Wafer charging section, 8 ... Cap section,
10 ... Lower part, 11 ... neck part, 12 ... Charging part transfer arm, 12a ... claw-shaped mounting part, 16 ... Cap part transfer arm, 16a ... (ring-shaped) mounting part.
Claims (1)
（７）とキャップ部（８）よりなるウェーハボート
（５）を下方より搬入出する装置において、上記ウェー
ハボート（５）を、ウェーハチャージ部（７）とキャッ
プ部（８）に２分割し、ボート搬入時はチャージ部搬送
アーム（12）先端の２つの爪状載置部（12a）に、ウェ
ーハチャージ部（７）の下部（10）に設けた頸れ部分
（11）を挟み込んで載置し、このチャージ部搬送アーム
（12）をウェーハチャージ部（７）が搬送開始位置より
縦型反応炉（１）の真下位置にくるまでチャージ部搬送
アーム（12）の移動手段により移動した後、所定高さ位
置までチャージ部搬送アーム（12）の昇降手段により上
昇させ、しかる後、先端の載置部（16a）にキャップ部
（８）の下面を嵌め込んで載置したキャップ部搬送アー
ム（16）を、待機位置より縦型反応炉（１）の真下位置
にくるまでキャップ部搬送アーム（16）の移動手段によ
り移動し、次いでキャップ部搬送アーム（16）の昇降手
段により上昇させてウェーハチャージ部（７）の下面を
キャップ部（８）の上面に嵌め込んで載置させ、ウェー
ハチャージ部（７）の支持がチャージ部搬送アーム（1
2）先端の２つの爪状載置部（12a）よりキャップ部
（８）に移行したら、チャージ部搬送アーム（12）をそ
の移動手段により移動させてウェーハチャージ部（７）
の頸れ部分（11）から爪状載置部（12a）を離脱させ、
しかる後、キャップ部搬送アーム（16），その昇降手段
によりウェーハチャージ部（７）とキャップ部（８）を
載置した状態で縦型反応炉（１）の最終ボート搬入位置
まで上昇して停止させ、ボート搬出は上記とは逆の過程
で行うようにしたウェーハボートの搬送方法。1. An apparatus for loading and unloading a wafer boat (5) comprising a wafer charging section (7) and a cap section (8) into a vertical reactor (1) from below, wherein the wafer boat (5) is: The wafer charging part (7) and the cap part (8) are divided into two parts, and when the boat is loaded, the two claw-shaped mounting parts (12a) at the tip of the charging part transfer arm (12) are attached to the lower part of the wafer charging part (7). The neck part (11) provided on (10) is sandwiched and placed, and the charge part transfer arm (12) is placed at a position just below the vertical reactor (1) from the transfer start position of the wafer charge part (7). After moving by the moving means of the charging part transfer arm (12) to the predetermined height, it is raised to a predetermined height by the elevating means of the charging part transfer arm (12), and then the cap part is attached to the mounting part (16a) at the tip. Insert the lower surface of (8) and place it The cap transfer arm (16) is moved by the moving means of the cap transfer arm (16) from the standby position to the position directly below the vertical reactor (1), and then the lifting means of the cap transfer arm (16) is moved. And the lower surface of the wafer charging unit (7) is fitted onto the upper surface of the cap unit (8) to be mounted thereon, and the wafer charging unit (7) is supported by the charging unit transfer arm (1).
2) After shifting from the two claw-shaped mounting parts (12a) at the tip to the cap part (8), the charging part transfer arm (12) is moved by the moving means to move the wafer charging part (7).
Remove the nail-like placement part (12a) from the neck part (11) of
Thereafter, the cap transfer arm (16) and the elevating means thereof are used to lift the wafer charging section (7) and the cap section (8) to the final boat loading position of the vertical reactor (1) and stop. Then, the wafer boat is carried out in the reverse process of the above-mentioned method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61162560A JPH0783003B2 (en) | 1986-07-09 | 1986-07-09 | Waferbot transport method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61162560A JPH0783003B2 (en) | 1986-07-09 | 1986-07-09 | Waferbot transport method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6317521A JPS6317521A (en) | 1988-01-25 |
| JPH0783003B2 true JPH0783003B2 (en) | 1995-09-06 |
Family
ID=15756909
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61162560A Expired - Fee Related JPH0783003B2 (en) | 1986-07-09 | 1986-07-09 | Waferbot transport method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0783003B2 (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63128624A (en) * | 1986-11-18 | 1988-06-01 | Deisuko Haitetsuku:Kk | Method of carrying in and out wafer boat in vertical semiconductor heat treatment system |
| KR970008320B1 (en) * | 1987-11-17 | 1997-05-23 | 도오교오 에레구토론 가부시끼가이샤 | Heat-treatment apparatus |
| JP2691752B2 (en) * | 1988-10-13 | 1997-12-17 | 東京エレクトロン株式会社 | Vertical heat treatment equipment |
| JPH03125453A (en) * | 1989-10-09 | 1991-05-28 | Toshiba Corp | Semiconductor wafer transfer device |
| JPH03270221A (en) * | 1990-03-20 | 1991-12-02 | Tokyo Electron Sagami Ltd | Boat carriage to vertical type processing container |
| JP2536994Y2 (en) * | 1990-11-30 | 1997-05-28 | 神鋼電機株式会社 | Boat transport equipment for semiconductor manufacturing equipment |
| JP3218488B2 (en) * | 1993-03-16 | 2001-10-15 | 東京エレクトロン株式会社 | Processing equipment |
| JP3406488B2 (en) * | 1997-09-05 | 2003-05-12 | 東京エレクトロン株式会社 | Vacuum processing equipment |
| US6207006B1 (en) | 1997-09-18 | 2001-03-27 | Tokyo Electron Limited | Vacuum processing apparatus |
-
1986
- 1986-07-09 JP JP61162560A patent/JPH0783003B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6317521A (en) | 1988-01-25 |
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| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |