JPH0774497A - Flexible wiring board and its treatment - Google Patents

Flexible wiring board and its treatment

Info

Publication number
JPH0774497A
JPH0774497A JP5237294A JP23729493A JPH0774497A JP H0774497 A JPH0774497 A JP H0774497A JP 5237294 A JP5237294 A JP 5237294A JP 23729493 A JP23729493 A JP 23729493A JP H0774497 A JPH0774497 A JP H0774497A
Authority
JP
Japan
Prior art keywords
fpc
base sheet
board
automatic mounting
adhesive base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5237294A
Other languages
Japanese (ja)
Inventor
Junichiro Nishikawa
潤一郎 西川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP5237294A priority Critical patent/JPH0774497A/en
Publication of JPH0774497A publication Critical patent/JPH0774497A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor

Landscapes

  • Structure Of Printed Boards (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

PURPOSE:To carry out automatic mounting for a flexible printed board with high accuracy and efficiency, by previously drilling a hole at a given position in a weakly adhesive base sheet used for sticking the flexible printed board. CONSTITUTION:As an example, in an automatic mounting machine, a flexible printed circuit board(FPC) 2 that is temporarily stuck in a given place of a weakly adhesive base sheet 1 is pushed up by a projected part of a pin jig 5 at a given position of the automatic mounting machine through a hole 4 drilled in a given place of the base sheet 1. After the FPC board 2 is lifted up from the weakly adhesive base sheet 1, the PFC board 2 is picked or sucked by a chuck member 6 or a suction member 7 at a suitable point of the automatic mounting machine and the FPC board 2 is carried to a given position. In this way, the FPC board 2 closely stuck to the base sheet l is lifted by the pin jig 5 so that the FPC board 2 is removed efficiently, and the automatic mounting is carried out with high accuracy and efficiency.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明は、フレキシブルプリント
配線板の自動実装を精度良くかつ効率よく行うことがで
きる、仮接着ＦＰＣ及びその取扱い方法に関する。詳細
には、本発明は、簡単な治具の使用により穿孔付き仮接
着ＦＰＣからＦＰＣを容易に剥がし、効率よくＦＰＣを
取り外すことを可能とする、仮接着ＦＰＣ及びその取扱
い方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a temporary adhesive FPC capable of accurately and efficiently automatically mounting a flexible printed wiring board and a method of handling the same. More specifically, the present invention relates to a temporary adhesion FPC and a handling method thereof, which enables the FPC to be easily peeled from the perforated temporary adhesion FPC by using a simple jig, and the FPC can be efficiently removed.

【０００２】[0002]

【従来の技術及び課題】従来、ＦＰＣについて製品の検
査・搬送等には複数の製品を取扱い、実装するときに
は、１製品ずつ分離して行う方法が知られている（特開
平２−３９４８９号公報、特開平４−２６４７９０公
報）。また、配線板の実装に際して、作製されたＦＰＣ
を複数個まとめて取り扱う方法として、複数のＦＰＣを
共通のシルク印刷非接着部を設けたベースシート（補強
板）上に仮接着したＦＰＣを先に提案した。2. Description of the Related Art Conventionally, there has been known a method of handling and mounting a plurality of products on the FPC for inspecting / transporting the products, and separately mounting each product (JP-A-2-39489). , JP-A-4-264790). In addition, the FPC manufactured when mounting the wiring board
As a method for handling a plurality of FPCs collectively, an FPC in which a plurality of FPCs are temporarily adhered onto a base sheet (reinforcing plate) provided with a common silk printing non-adhesive portion was previously proposed.

【０００３】しかし、このようなＦＰＣの実装を効率よ
く実施するために、該ＦＰＣ群を自動実装機により吸
引、搬送する必要があるが、図２に示されるように、ベ
ースシート（補強板）１に仮接着されたＦＰＣ２もその
粘着部３’の粘着性にバラツキがあり、吸引してもＦＰ
Ｃが外れ難い等の問題点があった。また、自動実装機に
よりＦＰＣをチャッキングで直接につかむにしてもベー
スシートへ密着しているため自動装着が困難であった。However, in order to efficiently implement such FPC mounting, it is necessary to suck and convey the FPC group by an automatic mounting machine. As shown in FIG. 2, a base sheet (reinforcing plate) is used. The FPC 2 temporarily adhered to 1 also has a variation in the adhesiveness of the adhesive portion 3 ', and even if it is sucked, the FP
There was a problem that C was difficult to come off. Further, even if the FPC is directly gripped by chucking with an automatic mounting machine, it is difficult to automatically mount the FPC because it is in close contact with the base sheet.

【０００４】[0004]

【課題を解決するための手段】本発明者は上記課題につ
いて種々検討した結果、ＦＰＣを仮接着するベースシー
トの所定位置に予め穿孔を設け、それと対応してベース
シートに密着しているＦＰＣをピン治具で浮かすことに
より、効率よくＦＰＣを取り外すことが可能となり、そ
の結果ＦＰＣの自動実装を精度良くかつ効率よく行うこ
とができるを見出し、本発明を完成するに至った。As a result of various studies on the above-mentioned problems, the present inventor provided an FPC which is pre-drilled at a predetermined position of a base sheet for temporarily adhering the FPC and correspondingly adheres to the base sheet. It was found that the FPC can be removed efficiently by floating it with a pin jig, and as a result, automatic mounting of the FPC can be performed accurately and efficiently, and the present invention has been completed.

【０００５】すなわち、本発明は： 微粘着ベースシ
ート上に複数個の配置されたフレキシブルプリント配線
板（以下、ＦＰＣという）群において、該ＦＰＣを粘着
させる微粘着ベースシートの所定位置に予め穿孔してお
く、仮接着ＦＰＣである。さらに、 予め穿孔された
微粘着ベースシートの穿孔に一致する凸部を持つピン治
具を用いて、微粘着ベースシートに仮接着されたＦＰＣ
を該シートから取り外す、ＦＰＣの取扱い方法である。That is, the present invention: In a group of flexible printed wiring boards (hereinafter referred to as FPCs) arranged on a slightly adhesive base sheet, pre-drilling at a predetermined position of the slightly adhesive base sheet to which the FPC is adhered. It is a temporary adhesion FPC. Further, the FPC temporarily adhered to the slightly adhesive base sheet by using a pin jig having a convex portion that corresponds to the perforation of the slightly adhesive base sheet that has been pre-punched.
Is a method of handling the FPC in which the sheet is removed from the sheet.

【０００６】以下、本発明を図面に基づいて説明する。
図１−（イ）は、本発明の仮接着ＦＰＣの概略を示す平
面図であり、図１−（ロ）は、その部分横断面であり、
図１−（ハ）は、本発明の仮接着ＦＰＣからＦＰＣを浮
かせて吸引、取り外す状態を示す横断面である。図１に
おいて、１はＦＰＣを仮接着させる微粘着ベースシート
であり、２はＦＰＣであり、３は粘着剤であり、４はベ
ースシートの所定位置に設けられた穿孔である。The present invention will be described below with reference to the drawings.
FIG. 1- (a) is a plan view showing the outline of the temporary adhesion FPC of the present invention, and FIG. 1- (b) is a partial cross-section thereof,
FIG. 1- (c) is a cross-sectional view showing a state in which the FPC is floated from the temporarily bonded FPC of the present invention, sucked, and removed. In FIG. 1, 1 is a slightly adhesive base sheet for temporarily adhering an FPC, 2 is an FPC, 3 is an adhesive, and 4 is a perforation provided at a predetermined position of the base sheet.

【０００７】また、図１−（ハ）において、５は微粘着
ベースシート１の穿孔４に凸部を突き上げてＦＰＣを浮
かせる作用を有するピン治具であり、６は微粘着ベース
シート１から浮かされたＦＰＣをつかみ、所定の実装位
置にはめこむチャッキングであり、７は同様のＦＰＣを
吸引して所定の実装位置にはめこむ吸引具である。Further, in FIG. 1- (c), 5 is a pin jig having a function of pushing up a convex portion on the perforation 4 of the slightly adhesive base sheet 1 to float the FPC, and 6 is floated from the slightly adhesive base sheet 1. A chucking tool that grips the FPC and inserts it into a predetermined mounting position, and a suction tool 7 that absorbs the same FPC and inserts it into the predetermined mounting position.

【０００８】このようにすることによって、例えば自動
実装機の場合には、微粘着ベースシート１の所定位置に
仮接着しているＦＰＣは、自動実装機（図示されていな
い）のそれぞれ所定の位置に配備されているピン治具５
の凸部がベースシート１の所定位置に設けられた穿孔４
より突き上げられて、ＦＰＣ２は微粘着ベースシート１
から浮き上がり、次いで上記自動実装機の適宜位置に配
設されたチャッキング６又は吸引具７により、つかみ取
られ又は吸引されて所定の位置に搬送、固定されるので
ある。By doing so, for example, in the case of an automatic mounting machine, the FPC temporarily adhered to the predetermined position of the slightly adhesive base sheet 1 has a predetermined position of the automatic mounting machine (not shown). Pin jig 5
The perforations 4 provided at the predetermined positions of the base sheet 1
Further pushed up, FPC2 is slightly adhesive base sheet 1
Then, the chucking 6 or the suction tool 7 arranged at an appropriate position of the above automatic mounting machine grabs or sucks it and conveys and fixes it at a predetermined position.

【０００９】[0009]

【発明の効果】本発明によると、自動実装機によるＦＰ
Ｃの吸引・搬送又はチャキング搬送が容易になる。ま
た、簡単な治具の使用により穿孔付き仮接着ＦＰＣから
ＦＰＣを容易に剥がし、効率よくＦＰＣを取り外すこと
が可能である。According to the present invention, the FP by the automatic mounting machine
Suction / conveyance or chucking conveyance of C becomes easy. Further, it is possible to easily remove the FPC from the temporarily bonded FPC with perforations by using a simple jig, and to efficiently remove the FPC.

【図面の簡単な説明】[Brief description of drawings]

【図１】（イ）は、本発明の仮接着ＦＰＣの概略を示す
平面図であり、（ロ）は、その部分横断面であり、
（ハ）は、本発明の仮接着ＦＰＣからＦＰＣを浮かせて
吸引、取り外す状態を示す横断面である。FIG. 1A is a plan view showing the outline of a temporary adhesion FPC of the present invention, and FIG. 1B is a partial cross section thereof.
(C) is a cross-sectional view showing a state in which the FPC is floated from the temporary adhesion FPC of the present invention, sucked, and removed.

【図２】従来の仮接着ＦＰＣの構造を示す模式図であ
り、（イ）はその平面図であり、（ロ）はその部分横断
面である。FIG. 2 is a schematic view showing a structure of a conventional temporary adhesion FPC, in which (a) is a plan view thereof and (b) is a partial cross section thereof.

【符号の説明】[Explanation of symbols]

１ 微粘着ベースシート ２ ＦＰＣ ３ 粘着剤 ３’ 粘着部 ４ 穿孔 ５ ピン治具 ６ チャッキング ７ 吸引具 1 slightly adhesive base sheet 2 FPC 3 adhesive 3'adhesive part 4 perforation 5 pin jig 6 chucking 7 suction tool

Claims (2)

【特許請求の範囲】[Claims] 【請求項１】 微粘着ベースシート上に複数個の配置さ
れたフレキシブルプリント配線板（以下、ＦＰＣとい
う）群において、該ＦＰＣを粘着させる微粘着ベースシ
ートの所定位置に予め穿孔しておくことを特徴とする、
仮接着ＦＰＣ。1. In a group of a plurality of flexible printed wiring boards (hereinafter referred to as FPC) arranged on a slightly adhesive base sheet, pre-drilling at a predetermined position of the slightly adhesive base sheet to which the FPC is adhered. Characteristic,
Temporary adhesive FPC. 【請求項２】 予め穿孔された微粘着ベースシートの穿
孔に一致する凸部を持つピン治具を用いて、微粘着ベー
スシートに仮接着されたＦＰＣを該シートから取り外す
ことを特徴とする、ＦＰＣの取扱い方法。2. The FPC temporarily adhered to the slightly adhesive base sheet is detached from the sheet by using a pin jig having a convex portion corresponding to the perforation of the slightly adhesive base sheet pre-punched, How to handle FPC.
JP5237294A 1993-08-31 1993-08-31 Flexible wiring board and its treatment Pending JPH0774497A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5237294A JPH0774497A (en) 1993-08-31 1993-08-31 Flexible wiring board and its treatment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5237294A JPH0774497A (en) 1993-08-31 1993-08-31 Flexible wiring board and its treatment

Publications (1)

Publication Number Publication Date
JPH0774497A true JPH0774497A (en) 1995-03-17

Family

ID=17013242

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5237294A Pending JPH0774497A (en) 1993-08-31 1993-08-31 Flexible wiring board and its treatment

Country Status (1)

Country Link
JP (1) JPH0774497A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR970078783A (en) * 1996-05-14 1997-12-12 이대원 Carrier system for mounting flexible printed circuit board components and control method thereof
KR100457642B1 (en) * 2003-06-26 2004-11-18 에스이디스플레이 주식회사 Automatic transfer system of flexible printed circuit
CN100377634C (en) * 2003-02-07 2008-03-26 松下电器产业株式会社 Substrate holder, method for producing substrate holder, and method for producing mold
CN100428875C (en) * 2003-05-30 2008-10-22 松下电器产业株式会社 Substrate holder
CN103079357A (en) * 2012-12-28 2013-05-01 大连吉星电子有限公司 FPC (Flexible Printed Circuit) board die-cutting and component assembly process
CN103491718A (en) * 2013-09-16 2014-01-01 无锡博一光电科技有限公司 Method for enabling flexible circuit board to be attached to touch pad
CN106163129A (en) * 2016-08-12 2016-11-23 杭州纽登科技有限公司 The small-sized placement equipment of segmentation
CN114578215A (en) * 2022-04-27 2022-06-03 东莞市煜锦实业有限公司 FPC test equipment convenient to piece is got out to FPC board

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR970078783A (en) * 1996-05-14 1997-12-12 이대원 Carrier system for mounting flexible printed circuit board components and control method thereof
CN100377634C (en) * 2003-02-07 2008-03-26 松下电器产业株式会社 Substrate holder, method for producing substrate holder, and method for producing mold
CN100428875C (en) * 2003-05-30 2008-10-22 松下电器产业株式会社 Substrate holder
KR100457642B1 (en) * 2003-06-26 2004-11-18 에스이디스플레이 주식회사 Automatic transfer system of flexible printed circuit
CN103079357A (en) * 2012-12-28 2013-05-01 大连吉星电子有限公司 FPC (Flexible Printed Circuit) board die-cutting and component assembly process
CN103491718A (en) * 2013-09-16 2014-01-01 无锡博一光电科技有限公司 Method for enabling flexible circuit board to be attached to touch pad
CN106163129A (en) * 2016-08-12 2016-11-23 杭州纽登科技有限公司 The small-sized placement equipment of segmentation
CN106163129B (en) * 2016-08-12 2019-06-18 杭州纽登科技有限公司 It is segmented small-sized placement equipment
CN114578215A (en) * 2022-04-27 2022-06-03 东莞市煜锦实业有限公司 FPC test equipment convenient to piece is got out to FPC board
CN114578215B (en) * 2022-04-27 2022-07-29 东莞市煜锦实业有限公司 FPC test equipment convenient to FPC board takes out

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