JPH0773160B2 - Parts recognition device - Google Patents
Parts recognition deviceInfo
- Publication number
- JPH0773160B2 JPH0773160B2 JP61277261A JP27726186A JPH0773160B2 JP H0773160 B2 JPH0773160 B2 JP H0773160B2 JP 61277261 A JP61277261 A JP 61277261A JP 27726186 A JP27726186 A JP 27726186A JP H0773160 B2 JPH0773160 B2 JP H0773160B2
- Authority
- JP
- Japan
- Prior art keywords
- camera
- image
- electronic component
- half mirror
- recognition device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Supply And Installment Of Electrical Components (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明は、電子部品装着装置において、電子部品の吸着
位置及び形状を認識する部品認識装置に関するものであ
る。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component recognition device for recognizing a suction position and a shape of an electronic component in an electronic component mounting device.
従来の技術 以下図面を参照しながら従来の技術を説明する。第６図
は従来の技術の一例の全体図である。101はＸテーブル
であり、図中Ｘ方向に位置決め可能である。102はＹテ
ーブルであり、図中Ｙ方向に位置決め可能である。103
は吸着ノズルであり、電子部品104を吸着により保持す
ることが可能である。2. Description of the Related Art A conventional technology will be described below with reference to the drawings. FIG. 6 is an overall view of an example of a conventional technique. 101 is an X table, which can be positioned in the X direction in the figure. A Y table 102 can be positioned in the Y direction in the drawing. 103
Is a suction nozzle, which can hold the electronic component 104 by suction.
電子部品の装着の手順は、図示されない部品供給装置か
ら、吸着ノズル103が電子部品104をピックアップする。In the procedure of mounting the electronic component, the suction nozzle 103 picks up the electronic component 104 from a component supply device (not shown).
XYテーブルの移動により、電子部品104は第１のカメラ1
05上に移動する。第１のカメラ105に取りつけられた第
１のレンズ106により、電子部品104の全体像をとらえ
る。第７図に第１のカメラ105のとらえた電子部品104の
全体像を示す第１のカメラ105によりとらえた画像で、
認識装置107は、電子部品104のリード線108の数を、予
め登録されている数と比較し、一致しなければプリント
基板109上への装着の禁止指令を発する。さらにリード
線間のピッチを検定し、予め登録されたピッチと異なる
場合にも装着の禁止指令を発する。By moving the XY table, the electronic component 104 is moved to the first camera 1
05 Move up. The first lens 106 attached to the first camera 105 captures the entire image of the electronic component 104. FIG. 7 is an image captured by the first camera 105 showing an overall image of the electronic component 104 captured by the first camera 105.
The recognition device 107 compares the number of the lead wires 108 of the electronic component 104 with the number registered in advance, and if they do not match, issues a prohibition command for mounting on the printed circuit board 109. Furthermore, the pitch between the lead wires is verified, and if the pitch is different from the pitch registered in advance, a mounting prohibition command is issued.
次にXYテーブルが移動し、電子部品104は第２のカメラ1
10上に移動する。第２のカメラ110にはレンズ111が取付
けられており、電子部品104の一部分を拡大した像をと
らえる。電子部品104の一部分を拡大した像を第８図に
示す。この像により、認識装置107はリード線108の画面
上の位置から吸着ノズル103との相対位置を割り出し、
予め登録された値とのズレ量を算出し、プリント基板10
9上への装着位置を補正する。一部分を拡大した像をと
らえる理由は、相対位置の割り出しを精度よく行うため
に、認識装置１画素当りの分解能を上げるためである。Next, the XY table moves, and the electronic component 104 moves to the second camera 1
Move up 10. A lens 111 is attached to the second camera 110 to capture a magnified image of a part of the electronic component 104. An enlarged image of a part of the electronic component 104 is shown in FIG. From this image, the recognition device 107 determines the relative position with respect to the suction nozzle 103 from the position of the lead wire 108 on the screen,
Calculate the deviation from the value registered in advance and
9 Correct the mounting position on the top. The reason for capturing an image in which a part of the recognition device is enlarged is to increase the resolution per pixel of the recognition device in order to accurately calculate the relative position.
発明が解決しようとする問題点 以上のように従来の技術では、全体像をとらえるカメラ
及びレンズと、部分拡大像をとらえるカメラ及びレンズ
が別個のものとなっているため、像をとらえるためにテ
ーブル移動しなければならず、機械の動きに余分な時間
がかかる。また、限られたXYテーブルのストロークの中
で、カメラ間の移動スペースを確保しなければならず、
機械全体をコンパクトにまとめるのが困難である。DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention As described above, in the conventional technique, the camera and the lens for capturing the entire image and the camera and the lens for capturing the partially magnified image are separate from each other. They have to move and the machine takes extra time to move. Also, within the limited stroke of the XY table, it is necessary to secure a movement space between the cameras,
It is difficult to make the entire machine compact.
問題点を解決するための手段 以上のような問題点を解決するために、本発明は、装着
ヘッドにピックアップされている部品の位置及び形状認
識を画像入力装置によって行う部品認識装置において、
前記吸着ヘッドの吸着面に対向して所定の位置に開口部
を形成し、前記開口部を通して入射した電子部品の像を
光路途中で互いに直交する２つの光路に分岐するハーフ
ミラーと、ハーフミラーを透過した側の光路の像をとら
える第１のカメラと、前記ハーフミラーにて反射された
側の光路の像をとらえる第２のカメラと、前記ハーフミ
ラーと前記第２のカメラの撮像面との間に、少なくとも
１つ配された所定倍率のレンズとを有し、装着ヘッドに
ピックアップされた電子部品の下面の撮像を、前記第１
のカメラと前記第２のカメラにおいて互いに異なる倍率
で同時にとらえる構成とし、さらにハーフミラーと第１
のカメラとの間に全反射ミラーを配置した。Means for Solving the Problems In order to solve the above problems, the present invention provides a component recognition device that performs position and shape recognition of components picked up by a mounting head by an image input device.
A half mirror, which has an opening formed at a predetermined position facing the suction surface of the suction head, and which splits an image of an electronic component incident through the opening into two optical paths orthogonal to each other in the optical path, and a half mirror. A first camera that captures an image of the optical path on the transmitted side, a second camera that captures an image of the optical path on the side that is reflected by the half mirror, and the half mirror and the imaging surface of the second camera. And a lens of a predetermined magnification disposed between the first and second lenses, and the first surface is used for imaging the lower surface of the electronic component picked up by the mounting head.
Of the first camera and the second camera at different magnifications at the same time.
A total reflection mirror was placed between the camera and the camera.
作用 以上のような構成にすることによって、倍率の異なるレ
ンズが同一視点に配置されているため、視野を切り換え
るに際して電子部品を保持しているXYテーブルの移動を
ほとんど要しないため、余分な時間がかからない。ま
た、視点が一点のため、XYテーブルの有効ストローク中
でレンズが占める割合が小さく、機械全体をコンパクト
におさめることが可能である。With the above configuration, the lenses with different magnifications are arranged at the same viewpoint, and it is not necessary to move the XY table that holds the electronic components when switching the field of view, so extra time is needed. It does not take. Also, since there is only one viewpoint, the lens occupies a small proportion of the effective stroke of the XY table, and it is possible to keep the entire machine compact.
実 施 例 以下図面を参照しながら本発明の一実施例について説明
する。第１図は本発明の一実施例の断面図である。Embodiment An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a sectional view of an embodiment of the present invention.
１は電子部品であり、吸着ノズル２に真空吸着にて保持
されている。吸着ノズル２は図示されないXYテーブルに
固定されており、紙面に対して垂直は平面上で位置決め
可能である。３は照明装置であり、反射板４を経て半透
明拡散板５を照らしている。これは、電子部品１の影像
をとらえる際の背景となる。６は第１のレンズであり、
電子部品１の影雑を下方よりとり込む。７はハーフミラ
ーであり、第１のレンズ６がとらえた像の光路８を図中
下方の光路９と図中左方の光路10に２分岐する。光路９
は全反射ミラー11を経て第１のカメラ12の撮像面13にて
結像する。電子部品１の影像を第１のカメラ12でとらえ
る際の倍率は、被写体である電子部品１から第１のレン
ズ６までの距離と、第１のレンズ６のレンズ倍率と、第
１のレンズ６から第１のカメラ12の撮像面13までの距離
よって定まるが、ここでは電子部品１の位置をより正確
に割り出せるように分解能を上げるために電子部品１の
一部を拡大した像となっている。第１カメラにより入力
された像は部品認識装置18に入力され、その外形線より
吸着ノズル２との相対ズレ量を割り出し、プリント基板
上への装着の際に補正する。An electronic component 1 is held by the suction nozzle 2 by vacuum suction. The suction nozzle 2 is fixed to an XY table (not shown) and can be positioned on a plane perpendicular to the paper surface. Reference numeral 3 denotes an illuminating device, which illuminates the semitransparent diffusion plate 5 via the reflection plate 4. This serves as a background for capturing the image of the electronic component 1. 6 is the first lens,
The shadow of the electronic component 1 is taken in from below. Reference numeral 7 denotes a half mirror, which splits the optical path 8 of the image captured by the first lens 6 into an optical path 9 on the lower side of the figure and an optical path 10 on the left side of the figure. Optical path 9
Forms an image on the imaging surface 13 of the first camera 12 via the total reflection mirror 11. The magnification when the image of the electronic component 1 is captured by the first camera 12 is the distance from the electronic component 1 which is the subject to the first lens 6, the lens magnification of the first lens 6, and the first lens 6 Is determined by the distance from the first camera 12 to the image pickup surface 13 of the first camera 12. Here, an image of a part of the electronic component 1 is enlarged in order to increase the resolution so that the position of the electronic component 1 can be more accurately determined. . The image input by the first camera is input to the component recognizing device 18, and the amount of relative deviation from the suction nozzle 2 is calculated from the outline of the image, and is corrected when it is mounted on the printed circuit board.
次に部品認識装置18は電子部品１のリード線17のピッチ
を検定し所定のピッチでないリード線の有無を確認す
る。リード線ピッチが所定の範囲内にない場合、プリン
ト基板上に装置の際、隣のリードのパターンとブリッヂ
をおこし電気回路上不都合が生じる。このピッチ検定に
おいては、すべてのリード間についておこなう。従って
電子部品１の部分拡大像では全リードの検定を行うに際
しXYテーブルの移動により視野を順次切換える必要があ
る。従って移動に時間がかかるという欠点を有するた
め、検定に必要な分解能を損わない限り視野を広げる方
が有利となる。そこで本発明では、第１図に示すよう
に、第１レンズ６でとらえた電子部品１の像の光路８を
ハーフミラー７にて２分岐し、光路10を得る。14は補助
レンズであり第１のカメラ12が得る像とは異なる視野を
得るため、電子部品１の像の倍率をかえている。倍率の
かわった電子部品１の像は第２のカメラ15の撮像面16に
て結像する第２のカメラでとらえた画像を第２図に示
す。本発明では、視野の異なる第１のカメラ12と第２の
カメラ15との像取り込みの第１レンズ６が共通のため、
吸着ノズル２はほとんど移動せずに認識装置18へ送る画
像を切り換えることができる。Next, the component recognition device 18 verifies the pitch of the lead wires 17 of the electronic component 1 and confirms the presence or absence of the lead wires which are not at a predetermined pitch. If the lead wire pitch is not within the predetermined range, the pattern of the adjacent lead and the bridge occur when the device is mounted on the printed circuit board, which causes inconvenience in the electric circuit. This pitch test is performed between all leads. Therefore, in the partially enlarged image of the electronic component 1, it is necessary to sequentially switch the field of view by moving the XY table when performing verification of all leads. Therefore, it has a drawback that it takes a long time to move, so it is advantageous to widen the field of view as long as the resolution required for the assay is not impaired. Therefore, in the present invention, as shown in FIG. 1, the optical path 8 of the image of the electronic component 1 captured by the first lens 6 is bifurcated by the half mirror 7 to obtain the optical path 10. Reference numeral 14 denotes an auxiliary lens, which changes the magnification of the image of the electronic component 1 in order to obtain a field of view different from the image obtained by the first camera 12. FIG. 2 shows an image of the electronic component 1 whose magnification has been changed, which is captured by the second camera formed on the imaging surface 16 of the second camera 15. In the present invention, the first camera 6 and the second camera 15 having different fields of view share the same first lens 6 for image capturing,
The suction nozzle 2 can switch the image to be sent to the recognition device 18 with almost no movement.
発明の効果 以上のように本発明では、吸着ヘッド側の移動をほとん
どせずに、視野の切り換えが可能となる。また限られた
XYテーブルのストロークの中で、異なる倍率の像を一点
でとりこめるため、電子部品の供給装置等に有効にスト
ロークを配分できるという利点を有する。EFFECTS OF THE INVENTION As described above, according to the present invention, the field of view can be switched with almost no movement on the suction head side. Also limited
Since the images of different magnifications can be captured at one point among the strokes of the XY table, there is an advantage that the strokes can be effectively distributed to the electronic component supply device and the like.
第１図は本発明の一実施例における部品認識装置の断面
図、第２図は第２のカメラがとらえた電子部品の全体像
を示す説明図、第３図は第１のカメラがとらえた電子部
品の部分拡大像を示す説明図、第４図は従来例の概略斜
視図、第５図は同じくその第１のカメラのとらえた電子
部品の全体像を示す説明図、第６図は同じくその第２の
カメラのとらえた電子部品の部分拡大像を示す説明図で
ある。 １……電子部品、３……照明装置、６……第１のレン
ズ、７……ハーフミラー、11……全反射ミラー、12……
第１のカメラ、14……補助レンズ、15……第２のカメ
ラ、17……電子部品のリード線、18……認識装置、101
……Ｘテーブル、102……Ｙテーブル、104……電子部
品、105……第１のカメラ、106……第１のレンズ、108
……リード線、110……第２のカメラ、111……第２のレ
ンズ。FIG. 1 is a cross-sectional view of a component recognition apparatus according to an embodiment of the present invention, FIG. 2 is an explanatory view showing an overall image of electronic components captured by a second camera, and FIG. 3 is captured by a first camera. FIG. 4 is an explanatory view showing a partially enlarged image of an electronic component, FIG. 4 is a schematic perspective view of a conventional example, FIG. 5 is an explanatory diagram showing an overall image of the electronic component captured by the first camera, and FIG. 6 is also the same. It is explanatory drawing which shows the partially expanded image of the electronic component caught by the 2nd camera. 1 ... Electronic parts, 3 ... Illumination device, 6 ... First lens, 7 ... Half mirror, 11 ... Total reflection mirror, 12 ...
First camera, 14 ... Auxiliary lens, 15 ... Second camera, 17 ... Electronic component lead wire, 18 ... Recognition device, 101
...... X table, 102 ・ ・ ・ Y table, 104 …… electronic parts, 105 …… first camera, 106 …… first lens, 108
...... Lead wire, 110 …… Second camera, 111 …… Second lens.
Claims (2)
の位置及び形状認識を画像入力装置によって行う部品認
識装置において、前記吸着ヘッドの吸着面に対向して所
定の位置に開口部を形成し、前記開口部を通して入射し
た電子部品の像を光路途中で互いに直交する２つの光路
に分岐するハーフミラーと、ハーフミラーを透過した側
の光路の像をとらえる第１のカメラと、前記ハーフミラ
ーにて反射された側の光路の像をとらえる第２のカメラ
と、前記ハーフミラーと前記第２のカメラの撮像面との
間に、少なくとも１つ配された所定倍率のレンズとを有
し、装着ヘッドにピックアップされた電子部品の下面の
影像を、前記第１のカメラと前記第２のカメラにおいて
互いに異なる倍率で同時にとらえることを特徴とした部
品認識装置。1. A component recognition device for recognizing the position and shape of a component picked up by a mounting head by an image input device, wherein an opening is formed at a predetermined position facing a suction surface of the suction head, A half mirror that splits an image of an electronic component that has entered through an opening into two optical paths that are orthogonal to each other in the middle of the optical path, a first camera that captures an image of the optical path on the side that has passed through the half mirror, and a reflection by the half mirror. A second camera that captures an image of the optical path on the side where the light is reflected, and at least one lens with a predetermined magnification disposed between the half mirror and the imaging surface of the second camera. A component recognition device characterized in that a shadow image of a lower surface of a picked-up electronic component is simultaneously captured by the first camera and the second camera at different magnifications.
射ミラーを配置したことを特徴とする特許請求の範囲第
１項記載の部品認識装置。2. The component recognition device according to claim 1, further comprising a total reflection mirror arranged between the half mirror and the first camera.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61277261A JPH0773160B2 (en) | 1986-11-20 | 1986-11-20 | Parts recognition device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61277261A JPH0773160B2 (en) | 1986-11-20 | 1986-11-20 | Parts recognition device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63129700A JPS63129700A (en) | 1988-06-02 |
| JPH0773160B2 true JPH0773160B2 (en) | 1995-08-02 |
Family
ID=17581059
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61277261A Expired - Lifetime JPH0773160B2 (en) | 1986-11-20 | 1986-11-20 | Parts recognition device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0773160B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997049273A1 (en) * | 1996-06-20 | 1997-12-24 | Matsushita Electric Industrial Co., Ltd. | Electronic part mounting apparatus |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0770872B2 (en) * | 1989-01-27 | 1995-07-31 | 富士機械製造株式会社 | Electronic component mounting device |
| JP2805909B2 (en) * | 1989-11-10 | 1998-09-30 | 松下電器産業株式会社 | Electronic component lead measuring device and measuring method |
| JPH0543008U (en) * | 1991-11-13 | 1993-06-11 | 株式会社小松製作所 | Appearance inspection device for goods |
-
1986
- 1986-11-20 JP JP61277261A patent/JPH0773160B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997049273A1 (en) * | 1996-06-20 | 1997-12-24 | Matsushita Electric Industrial Co., Ltd. | Electronic part mounting apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63129700A (en) | 1988-06-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |