JPH077166U - Sub board mounting structure - Google Patents
Sub board mounting structureInfo
- Publication number
- JPH077166U JPH077166U JP3503993U JP3503993U JPH077166U JP H077166 U JPH077166 U JP H077166U JP 3503993 U JP3503993 U JP 3503993U JP 3503993 U JP3503993 U JP 3503993U JP H077166 U JPH077166 U JP H077166U
- Authority
- JP
- Japan
- Prior art keywords
- board
- land
- sub
- longitudinal direction
- mother board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Combinations Of Printed Boards (AREA)
Abstract
(57)【要約】
【目的】 耐振性が高く実装スペ−スの少ない子基板実
装構造の提供。
【構成】 本考案の子基板実装構造は子基板２の電気接
続部であるランド５と母基板１の差し込み穴９の内周部
にあるランド６との隙間を均等にする位置規制を母基板
１の位置決め部８に子基板の位置決め部７を挿入して行
い、子基板２のランド５と母基板１のランド６とを直接
半田付けする構成よりなる。
(57) [Summary] [Purpose] To provide a mounting structure for a daughter board that has high vibration resistance and a small mounting space. According to the sub-board mounting structure of the present invention, the mother board is provided with a position regulation for equalizing the gap between the land 5 which is an electrical connection portion of the sub-board 2 and the land 6 which is inside the insertion hole 9 of the mother board 1. The positioning portion 7 of the daughter board is inserted into the positioning portion 8 of No. 1 and the land 5 of the daughter board 2 and the land 6 of the mother board 1 are directly soldered.
Description
【０００１】[0001]
本考案は鉄道、自動車、航空機などに用いられる電気機器のように、振動が 印加される状態で使用されるものに特に適した子基板実装構造に関するもの。 The present invention relates to a sub-board mounting structure particularly suitable for use in a state where vibration is applied, such as electric equipment used in railways, automobiles, aircrafts, and the like.
【０００２】[0002]
従来の子基板実装構造は、図６に示すようにチップ状の電子部品などを実装し た子基板は、それの電気回路接続部に固定されたコム端子や丸ピンなどの端子３ を母基板１ｄの端子挿入口に立てて実装され、半田付けにより電気的、機械的に 接続する構成になっている。又他の従来例では図７に示すように母基板１ｅの電 気回路部をソケット４で構成し、子基板２の電気回路接続部であるランド５ｅを ソケット４に差し込むことにより子基板を母基板に電気的、機械的に接続する構 成になっている。 In the conventional sub-board mounting structure, as shown in Fig. 6, the sub-board on which chip-shaped electronic components are mounted has a terminal 3 such as a comb terminal or a round pin fixed to the electric circuit connection part of the sub-board. It is mounted upright on the terminal insertion opening of 1d and is electrically and mechanically connected by soldering. In another conventional example, as shown in FIG. 7, the electric circuit portion of the mother board 1e is formed by the socket 4, and the land 5e which is the electric circuit connecting portion of the child board 2 is inserted into the socket 4 to form the mother board. It is configured to be electrically and mechanically connected to the board.
【０００３】[0003]
しかし上記した従来の子基板実装構造において、図６に示す従来例においては 子基板２ｄの電気回路接続部にリ−ド端子３を固定し母基板１ｄの電気回路接続 部に実装するために、実装スペ−スは小さいが、電気機器に振動が加わった場合 位置規制しているので、子基板への応力がリ−ド端子３に集中して半田クラック 発生しやすく耐振性が低い問題がある。 又図７に示す従来例にあっては母基板と子基板との機械的接続が互いの端子部の 平面的な圧接によって成されているために耐振性が改善されたが、子基板２ｅの ランド５ｅはソケット４にバネ圧で保持されているため振動、衝撃により脱落す る問題がある。又ソケット４を母基板１ｅに実装するためソケット分のスペ−ス が母基板上に必要となるから実装スペ−スが大となり、又ソケット分だけコスト が増大する問題がある。本考案の目的は耐振性が高く実装スペ−スの少ない子基 板実装構造の提供にある。 However, in the above-described conventional sub board mounting structure, in the conventional example shown in FIG. 6, in order to fix the lead terminal 3 to the electric circuit connecting portion of the sub board 2d and mount it on the electric circuit connecting portion of the mother board 1d, Although the mounting space is small, since the position is regulated when vibration is applied to electrical equipment, stress on the daughter board concentrates on the lead terminals 3 and solder cracks tend to occur, resulting in low vibration resistance. . Further, in the conventional example shown in FIG. 7, the vibration resistance is improved because the mechanical connection between the mother board and the daughter board is made by the planar pressure contact of the terminals of each other. Since the land 5e is held by the socket 4 by the spring pressure, there is a problem that it falls off due to vibration or impact. Further, since the socket 4 is mounted on the mother board 1e, a space for the socket is required on the mother board, so that the mounting space becomes large, and the cost for the socket increases. An object of the present invention is to provide a substrate mounting structure having high vibration resistance and a small mounting space.
【０００４】[0004]
上記した課題を解決するために、本考案の子基板実装構造は子基板の電気接 続部であるランドと母基板の差し込み穴の内周部にあるランドとの隙間を均等に する位置規制を行い、位置規制部で子基板の振動を吸収し、さらに子基板のラン ドと母基板のランドとを直接半田付けする構成よりなる。 In order to solve the above-mentioned problems, the sub-board mounting structure of the present invention is provided with a position regulation that makes the gap between the land, which is the electrical connection portion of the sub-board, and the land at the inner peripheral portion of the insertion hole of the mother board uniform. The position regulation unit absorbs the vibration of the daughter board, and the land of the daughter board and the land of the mother board are directly soldered.
【０００５】[0005]
以下、本考案の第１実施例を図１に基づいて説明する。図番２は子基板で、子 基板の下端の両面に電気回路接続部である銅箔のランド５を複数個備え、かつそ れの長手方向の両端の下端縁に位置決め用ボス７を下方に向けて突出する形状 になっている。図番１は母基板で、この母基板１は子基板２の差し込み穴９と、 その長手方向の両端に位置決め用ボス挿入穴８を有し、かつ、差し込み穴９の内 周面に、子基板２の下端の両面に有る複数個のランド５と均等の間隔を有し電気 回路接続部である銅箔のランド６を形成している。また位置決め用ボス挿入穴８ は母基板１の差し込み穴９の長手方向のセンタ−と一致する位置に設けられ、 また子基板２の位置決め用ボス７は子基板の長手方向センタ−と一致するよう に設けられる。そして子基板２の位置決め用ボス７は図５に示すように母基板１ の位置決め用ボス挿入穴８に嵌合して挿入されることにより、子基板２のランド ５と母基板１のランド６との隙間が均等なものとされる。次に子基板２のランド ５と母基板１のランド６とを組み合わせた状態でフラックス洗浄した後、溶融半 田槽を通すことで半田が図２の１０のごとくランド間を直接固定する。 Hereinafter, a first embodiment of the present invention will be described with reference to FIG. Fig. 2 shows a child board, which is provided with a plurality of copper foil lands 5 which are electric circuit connecting portions on both sides of the lower end of the child board, and which has positioning bosses 7 at the lower edges of both ends in the longitudinal direction thereof. It has a shape that projects toward you. Reference numeral 1 is a mother board. This mother board 1 has an insertion hole 9 for a child board 2 and positioning boss insertion holes 8 at both ends in the longitudinal direction, and an inner surface of the insertion hole 9 has a child board. A plurality of lands 5 on both sides of the lower end of the substrate 2 are formed with copper foil lands 6 which are electrical circuit connecting portions and are equally spaced from each other. Further, the positioning boss insertion hole 8 is provided at a position corresponding to the center of the insertion hole 9 of the mother board 1 in the longitudinal direction, and the positioning boss 7 of the daughter board 2 is aligned with the center of the daughter board in the longitudinal direction. It is provided in. Then, the positioning boss 7 of the daughter board 2 is inserted into the positioning boss insertion hole 8 of the mother board 1 as shown in FIG. 5, so that the land 5 of the daughter board 2 and the land 6 of the mother board 1 are inserted. The gap between and is even. Next, the lands 5 of the daughter substrate 2 and the lands 6 of the mother substrate 1 are combined with each other, and then flux cleaning is performed. Then, the solder is passed through a molten solder bath so that the solder directly fixes the lands as shown in FIG.
【０００６】 次に第２の実施例を図３に基づいて説明する。この実施例では子基板２ａの位 置決め用ボスを円柱形状とし、円柱形状の取り付け面が母基板１ａの上面に接す る事により子基板の挿入を止め、第１実施例と同様にランド間を半田により直接 固定する。Next, a second embodiment will be described with reference to FIG. In this embodiment, the positioning boss of the sub-board 2a has a cylindrical shape, and the insertion surface of the sub-board is stopped by contacting the cylindrical mounting surface with the upper surface of the main board 1a. The space is fixed directly with solder.
【０００７】 次に第３の実施例を図４に基づいて説明する。この実施例では子基板２ｂの位 置決め用ボスを角柱形状とし、角柱形状の取り付け面が母基板１ｂの上面に接す る事により子基板の挿入をとめ、第一実施例と同様にランド間を半田により直接 固定する。Next, a third embodiment will be described with reference to FIG. In this embodiment, the positioning boss of the child board 2b has a prismatic shape, and the mounting surface of the prismatic shape is in contact with the upper surface of the mother board 1b to stop the insertion of the child board. The space is fixed directly with solder.
【０００８】 次に第４の実施例を図５に基づいて説明する。この実施例では子基板２ｃは複 数個の角柱形状の銅箔のランド５ｃと子基板２ｃの長手方向の両端に位置決め用 ボス７ｃを有する形状よりなっている。母基板１ｃは子基板２ｃの複数個のラン ド５ｃに対応して均等の隙間を持つ差し込み穴の内周面に銅箔のランド６ｃを有 し、ランド６ｃの長手方向の両端に位置決め用ボス挿入穴８ｃを形成している。 また子基板２ｃの位置決め用ボス７ｃは子基板２ｃの長手方向のセンタ−と一致 する位置に設けられ、また位置決め用ボス挿入穴８ｃは母基板の差し込み穴の 長手方向のセンタ−と一致する位置に設けられる。そして第一実施例と同様にラ ンド間を半田により直接固定する。Next, a fourth embodiment will be described with reference to FIG. In this embodiment, the child board 2c has a plurality of prismatic copper foil lands 5c and positioning bosses 7c at both longitudinal ends of the child board 2c. The mother board 1c has copper foil lands 6c on the inner peripheral surface of the insertion holes having even gaps corresponding to the plurality of lands 5c of the child board 2c, and positioning bosses are provided at both longitudinal ends of the lands 6c. The insertion hole 8c is formed. Further, the positioning boss 7c of the sub-board 2c is provided at a position which coincides with the longitudinal center of the sub-board 2c, and the positioning boss insertion hole 8c coincides with the longitudinal center of the insertion hole of the mother board. It is provided in. Then, as in the first embodiment, the land is directly fixed with solder.
【０００９】[0009]
請求項１記載の子基板実装構造は、子基板２の位置決め用ボス７が母基板１の 位置決め用ボス挿入穴８に嵌合して挿入されるので、位置決め用ボス７が子基板 ２の振動を吸収する。又従来、子基板２に固定されていたリ−ド端子が無く、子 基板２の電気回路接続部のランド５を母基板１の差し込み穴９にランド６との隙 間を均等にして挿入し、ランド５とランド６とを直接半田付けすることができる ので、半田付けの信頼性が増すと同時に子基板２の脱落や振動による劣化を防ぐ ことが出来る。次に子基板２に固定されていたリ−ド端子が無く、母基板に挿入 されていたソケットがないので、コストが安く、子基板２の実装面積が小さい。 In the child board mounting structure according to claim 1, since the positioning boss 7 of the child board 2 is inserted into the positioning boss insertion hole 8 of the mother board 1 and inserted, the positioning boss 7 vibrates the child board 2. Absorbs. Conventionally, there is no lead terminal fixed to the child board 2, and the land 5 of the electric circuit connecting portion of the child board 2 is inserted into the insertion hole 9 of the mother board 1 with a uniform gap with the land 6. Since the land 5 and the land 6 can be directly soldered, the reliability of the soldering can be increased and at the same time the detachment of the child board 2 and the deterioration due to vibration can be prevented. Next, since there is no lead terminal fixed to the daughter board 2 and there is no socket inserted in the mother board, the cost is low and the mounting area of the daughter board 2 is small.
【００１０】 請求項２記載の子基板実装構造は、前項と同様の効果を奏するうえに、母基板 １ｃの差し込み穴を兼ねたランド６ｃが分離しているので、隣接しているランド 間での半田結合や絶縁不良がなくなる。According to the sub-board mounting structure of the second aspect, in addition to the same effect as the preceding paragraph, the land 6c which also serves as the insertion hole of the mother board 1c is separated, so that the land between adjacent lands is separated. Eliminates solder joints and insulation defects.
【図１】本考案の第１の実施例を示す斜視図である。FIG. 1 is a perspective view showing a first embodiment of the present invention.
【図２】図１の実施例の要部断面図である。FIG. 2 is a cross-sectional view of an essential part of the embodiment shown in FIG.
【図３】本考案の第２の実施例を示す斜視図である。FIG. 3 is a perspective view showing a second embodiment of the present invention.
【図４】本考案の第３の実施例を示す斜視図である。FIG. 4 is a perspective view showing a third embodiment of the present invention.
【図５】本考案の第４の実施例を示す斜視図である。FIG. 5 is a perspective view showing a fourth embodiment of the present invention.
【図６】従来例を示す斜視図である。FIG. 6 is a perspective view showing a conventional example.
【図７】他の従来例を示す斜視図である。FIG. 7 is a perspective view showing another conventional example.
【図８】図７のソケット４の斜視図である。8 is a perspective view of the socket 4 of FIG. 7. FIG.
１、１ａ、１ｂ，１ｃ，１ｄ，１ｅ 母基板 ２、２ａ，２ｂ，２ｃ，２ｄ，２ｅ 子基板 ３ 端子 ４ ソケット ５，５ａ，５ｂ，５ｃ，５ｄ，５ｅ 子基板ラ
ンド ６，６ａ，６ｂ，６ｃ 母基板ラ
ンド ７，７ａ，７ｂ，７ｃ 子基板位
置決め部 ８，８ａ，８ｂ，８ｃ 母基板位
置決め部 ９，９ａ，９ｂ 差し込み
穴 １０ 半田付
け部1, 1a, 1b, 1c, 1d, 1e Mother board 2, 2a, 2b, 2c, 2d, 2e Child board 3 Terminal 4 Socket 5, 5a, 5b, 5c, 5d, 5e Child board land 6, 6a, 6b, 6c Mother board land 7, 7a, 7b, 7c Mother board positioning part 8, 8a, 8b, 8c Mother board positioning part 9, 9a, 9b Insert hole 10 Soldering part
Claims (2)
回路接続用のランドを形成し、同じく長手方向両端の下
端部に位置決め用のボス部を形成した子基板と、この子
基板の下端部を受け入れる細長い差し込み穴を有し、こ
の差し込み穴の長手方向と直交する内周壁に前記子基板
のランドと対応する回路接続用のランドを形成し、差し
込み穴の長手方向の両端エッジに前記子基板のボス部を
嵌合する位置決め用の嵌合孔を形成した母基板と、母子
両基板のランド間の空隙に充填される半田部とよりな
り、前記母基板の嵌合孔は差し込み穴の長手方向のセン
タ−位置にあり、且つ、前記子基板のボス部は子基板の
長手方向のセンタ−位置と一致するようされる子基板実
装構造。1. A sub-board in which lands for circuit connection are formed on the outer peripheral wall of the lower end orthogonal to the longitudinal direction, and positioning bosses are formed at the lower ends of both ends in the longitudinal direction, and a lower end of the sub-board. Has an elongated insertion hole for receiving a portion, and a land for circuit connection corresponding to the land of the child board is formed on an inner peripheral wall orthogonal to the longitudinal direction of the insertion hole, and the child is formed at both end edges in the longitudinal direction of the insertion hole. The mother board is formed with a fitting hole for positioning to fit the boss portion of the board, and the solder portion is filled in the space between the lands of the mother board and the mother board. A sub-board mounting structure, which is at a center position in the longitudinal direction and in which the boss portion of the sub-board is aligned with the center position in the longitudinal direction of the sub-board.
複数の回路接続用のランドを形成し、ランド形成部の間
は切り込み部によって区画されて角柱形状とされ、同じ
く長手方向両端の下端部に位置決め用のボス部を形成し
た子基板と、この子基板の各角柱形状のランド部を受け
入れる複数の差し込み穴を有し、この差し込み穴の整列
方向と直交する内周壁に前記子基板のランド部と対応す
る回路接続用のランドを形成し、差し込み穴の整列方向
の両端エッジに前記子基板のボス部を嵌合する位置決め
用の嵌合孔を形成した母基板と、母子両基板のランド間
の空隙に充填される半田部とよりなり、前記母基板の嵌
合孔は差し込み穴の整列方向のセンタ−位置に有り、且
つ、前記子基板のボス部は子基板の長手方向のセンタ−
位置と一致するようされる子基板実装構造。2. A plurality of lands for circuit connection are formed on an outer peripheral wall of a lower end portion orthogonal to the longitudinal direction, and the land forming portions are partitioned by notches to form a prismatic shape. And a plurality of insertion holes for receiving each prism-shaped land portion of the child board, and the child board on the inner peripheral wall orthogonal to the alignment direction of the insertion holes. A mother board in which a land for circuit connection corresponding to the land portion is formed, and a fitting hole for positioning to fit the boss portion of the daughter board is formed at both end edges of the insertion hole in the alignment direction, and a mother board and a mother board. The fitting hole of the mother board is located at the center position in the alignment direction of the insertion holes, and the boss portion of the daughter board is the center of the daughter board in the longitudinal direction. −
Sub-board mounting structure adapted to match position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3503993U JPH077166U (en) | 1993-06-28 | 1993-06-28 | Sub board mounting structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3503993U JPH077166U (en) | 1993-06-28 | 1993-06-28 | Sub board mounting structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH077166U true JPH077166U (en) | 1995-01-31 |
Family
ID=12430910
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3503993U Pending JPH077166U (en) | 1993-06-28 | 1993-06-28 | Sub board mounting structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH077166U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52138919U (en) * | 1976-04-13 | 1977-10-21 | ||
| WO2019116930A1 (en) * | 2017-12-11 | 2019-06-20 | 三菱電機株式会社 | Printed wiring board |
-
1993
- 1993-06-28 JP JP3503993U patent/JPH077166U/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52138919U (en) * | 1976-04-13 | 1977-10-21 | ||
| WO2019116930A1 (en) * | 2017-12-11 | 2019-06-20 | 三菱電機株式会社 | Printed wiring board |
| JPWO2019116930A1 (en) * | 2017-12-11 | 2020-11-26 | 三菱電機株式会社 | Printed wiring board |
| US11122687B2 (en) | 2017-12-11 | 2021-09-14 | Mitsubishi Electric Corporation | Printed wiring board |
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