JPH0751223A - Endoscope image pick-up device - Google Patents
Endoscope image pick-up deviceInfo
- Publication number
- JPH0751223A JPH0751223A JP5197530A JP19753093A JPH0751223A JP H0751223 A JPH0751223 A JP H0751223A JP 5197530 A JP5197530 A JP 5197530A JP 19753093 A JP19753093 A JP 19753093A JP H0751223 A JPH0751223 A JP H0751223A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- cover glass
- camera head
- metal layer
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Endoscopes (AREA)
- Closed-Circuit Television Systems (AREA)
- Instruments For Viewing The Inside Of Hollow Bodies (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、熱滅菌処理される内視
鏡撮像装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an endoscope image pickup device which is subjected to heat sterilization.
【０００２】[0002]
【従来の技術】体腔内等に挿入することによって、体腔
内の深部等を観察したり、必要に応じて処置具を用いる
ことにより、治療処置等も行うことのできる内視鏡が医
療分野において広く用いられるようになった。また、工
業分野においても、ジェットエンジン内部とかプラント
内部等の検査に内視鏡が広く使用されている。特に医療
用内視鏡の場合、使用した内視鏡を確実に滅菌処理する
ことが、感染症等を防止するために必要不可欠になる。2. Description of the Related Art In the medical field, an endoscope that can be used for observing a deep part in a body cavity by inserting it into the body cavity or the like and also performing a medical treatment by using a treatment tool if necessary It has become widely used. Further, also in the industrial field, endoscopes are widely used for inspecting the inside of jet engines, the inside of plants and the like. Particularly in the case of a medical endoscope, it is essential to surely sterilize the used endoscope in order to prevent infectious diseases and the like.
【０００３】従来では、この滅菌処理はＥＯＧ等のガス
とか洗浄液に頼っていたが、周知のように滅菌ガス類は
猛毒であり、滅菌作業の安全性確保の上で滅菌作業は煩
雑である。また、洗浄液の場合は、洗浄液の管理が煩雑
であり、洗浄液の廃棄処理に多大な費用が必要となると
いった欠点がある。Conventionally, this sterilization treatment has relied on a gas such as EOG or a cleaning liquid, but as is well known, sterilization gases are extremely toxic and the sterilization work is complicated in order to ensure the safety of the sterilization work. Further, in the case of the cleaning liquid, there is a drawback that the management of the cleaning liquid is complicated and a great deal of cost is required for the disposal of the cleaning liquid.
【０００４】そこで、最近では上記のごとく煩雑な作業
を伴わない熱滅菌（オートクレーブ等）が内視鏡機器で
は主流になりつつある。Therefore, recently, heat sterilization (autoclave, etc.) which does not involve complicated work as described above is becoming mainstream in endoscopic equipment.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、例えば
内視鏡の接眼部に着脱自在に取り付けて内視鏡像を撮像
する内視鏡外付けカメラでは、その内部に撮像素子等、
半導体に代表される電子部品を具備しており、これらの
電子部品は耐熱性が低いため、熱滅菌処理時、必要とさ
れる温度に耐えられないのが現状である。However, for example, in an endoscope external camera which detachably attaches to an eyepiece portion of an endoscope and picks up an endoscopic image, an image pickup device or the like is provided inside the camera.
It is equipped with electronic parts typified by semiconductors, and since these electronic parts have low heat resistance, they cannot withstand the required temperature during the heat sterilization process.
【０００６】本発明は、上記事情に鑑みてなされたもの
であり、電子部品等から構成される撮像手段の耐熱性を
向上させ、熱滅菌処理を可能とする内視鏡撮像装置を提
供することを目的としている。The present invention has been made in view of the above circumstances, and provides an endoscope image pickup apparatus capable of performing heat sterilization by improving the heat resistance of the image pickup means composed of electronic parts and the like. It is an object.
【０００７】[0007]
【課題を解決するための手段及び作用】本発明の内視鏡
撮像装置は、内視鏡像を撮像手段により撮像する内視鏡
撮像装置において、前記撮像手段を覆う第１の被覆層と
前記第１の被覆層を覆う第２の被覆層と、前記第２の被
覆層を覆う第３の被覆層とからなる少なくとも３つの層
から構成される多層被覆を備え、前記多層被覆により熱
伝達を劣化させ、前記撮像手段の耐熱性の向上を可能と
する。The endoscope image pickup apparatus of the present invention is an endoscope image pickup apparatus for picking up an endoscopic image by the image pickup means, and a first coating layer for covering the image pickup means and the first covering layer. A multi-layer coating including at least three layers including a second coating layer that covers one coating layer and a third coating layer that covers the second coating layer, and heat transfer is deteriorated by the multi-layer coating. Thus, the heat resistance of the image pickup means can be improved.
【０００８】[0008]
【実施例】以下、図面を参照しながら本発明の実施例に
ついて述べる。図１ないし図４は本発明の第１実施例に
係わり、図１はカメラヘッドの構成を示す断面図、図２
は図１の外装各層とカバーガラスとの接続を示す断面
図、図３は図１の金属層とカバーガラスとの接続の変形
例を示す断面図、図４はカメラヘッドの変形例の構成を
示す断面図である。Embodiments of the present invention will be described below with reference to the drawings. 1 to 4 relate to a first embodiment of the present invention, and FIG. 1 is a cross-sectional view showing the structure of a camera head.
1 is a cross-sectional view showing the connection between each exterior layer and the cover glass in FIG. 1, FIG. 3 is a cross-sectional view showing a modified example of the connection between the metal layer and the cover glass in FIG. 1, and FIG. 4 is a structure of a modified example of the camera head. It is sectional drawing shown.
【０００９】図１に示すように、本実施例の内視鏡撮像
装置としてのカメラヘッド１は、カメラアダプタ２を介
して、例えば硬性鏡４の接眼部５に着脱自在に取り付け
られるようになっている。前記硬性鏡４はＬＧ口金部６
より図示しない光源からの照明光を該硬性鏡４内を挿通
する図示しないライトガイドに供給し、硬性鏡４の先端
前方に照明光を伝送する。そして、この照明光により得
られた内視鏡像を硬性鏡４内を挿通する図示しない像伝
送手段（例えば、リレーレンズ系あるいはイメージガイ
ド等）で内視鏡像を接眼部に伝送する。As shown in FIG. 1, a camera head 1 as an endoscope image pickup apparatus of this embodiment is detachably attached to, for example, an eyepiece portion 5 of a rigid endoscope 4 via a camera adapter 2. Has become. The rigid endoscope 4 has an LG base 6
Illumination light from a light source (not shown) is supplied to a light guide (not shown) that is inserted through the rigid endoscope 4, and the illumination light is transmitted to the front of the tip of the rigid endoscope 4. Then, the endoscopic image obtained by this illumination light is transmitted to the eyepiece section by an image transmitting means (not shown) (for example, a relay lens system or an image guide) which is inserted through the rigid endoscope 4.
【００１０】このように伝送された内視鏡像はカメラア
ダプタ２内の図示しない光学系を介して前記カメラヘッ
ド１内の固体撮像素子、例えばＣＣＤ７の撮像面に結像
するようになっている。The thus transmitted endoscopic image is formed on the image pickup surface of a solid-state image pickup device, for example, CCD 7 in the camera head 1 through an optical system (not shown) in the camera adapter 2.
【００１１】前記カメラヘッド１では、入射した内視鏡
像は、カメラヘッド１前面に設けられた第１カバーガラ
ス１１、第１空気層１２、第２カバーガラス１３、第２
空気層１４及び第３カバーガラス１５を順次透過して前
記ＣＣＤ７の撮像面に結像する。そしてＣＣＤ７により
内視鏡像が電気信号に変換され、プリアンプ等を実装し
た回路基板１６を介して信号ケーブル１７によりを画像
情報として図示しないビデオプロセッサに出力されるよ
うになっている。In the camera head 1, the incident endoscopic image has a first cover glass 11, a first air layer 12, a second cover glass 13, and a second cover glass 11 provided on the front surface of the camera head 1.
An image is formed on the image pickup surface of the CCD 7 by sequentially passing through the air layer 14 and the third cover glass 15. Then, the CCD 7 converts the endoscopic image into an electric signal, and the signal cable 17 outputs it as image information to a video processor (not shown) through a circuit board 16 on which a preamplifier or the like is mounted.
【００１２】前記カメラヘッド１の外装は、内側より導
電層（例えば円筒系部材に金属シースを被覆したもの、
あるいは表面に金属を蒸着したもの、さらには表面に導
電塗料を塗したもの等）２１、絶縁層２２、金属層２３
の３層構造になっている。前記導電層２１は、一端が前
記信号ケーブル１７に固定され、回路基板１６、ＣＣＤ
７及び第３カバーガラス１５を覆っており、前記信号ケ
ーブル１７の接地ラインにより回路基板１６、ＣＣＤ７
をシールドしている。また、前記絶縁層２２は前記導電
層２１及び第２カバーガラス１３を覆い、基端は前記信
号ケーブル１７にＯリング２４を介して水密に固定され
ている。また、金属層２３は前記絶縁層２２及び第１カ
バーガラス１１を覆い、基端は前記信号ケーブルにＯリ
ング２４を介して水密に固定されている。この金属層２
３の先端外周にはネジマウント部２５が設けられてお
り、このネジマウント部２５によりカメラアダプタ２に
取り付けられている。The exterior of the camera head 1 has a conductive layer (for example, a cylindrical member coated with a metal sheath from the inside,
Alternatively, the surface of which a metal is vapor-deposited, the surface of which is coated with a conductive paint, etc.) 21, the insulating layer 22, the metal layer 23.
It has a three-layer structure. One end of the conductive layer 21 is fixed to the signal cable 17, the circuit board 16, the CCD
7 and the third cover glass 15, and the circuit board 16 and CCD 7 are connected by the ground line of the signal cable 17.
Is shielded. The insulating layer 22 covers the conductive layer 21 and the second cover glass 13, and the base end is watertightly fixed to the signal cable 17 via an O-ring 24. The metal layer 23 covers the insulating layer 22 and the first cover glass 11, and the base end is watertightly fixed to the signal cable via an O-ring 24. This metal layer 2
A screw mount portion 25 is provided on the outer circumference of the tip of the camera 3, and is attached to the camera adapter 2 by the screw mount portion 25.
【００１３】そして前記絶縁層２２により前記導電層２
１と前記金属層２３との絶縁状態を確保するとともに熱
伝導率の低い材質で絶縁層２２を構成しているので、金
属層２３からの熱が導電層２１に伝達しにくい構造とな
っている。The conductive layer 2 is formed by the insulating layer 22.
1 and the metal layer 23 are secured to each other and the insulating layer 22 is made of a material having a low thermal conductivity, the heat from the metal layer 23 is difficult to be transferred to the conductive layer 21. .
【００１４】カバーガラスと各層との接続は、図２
（ａ）に示すように、例えば金属層２３と第１カバーガ
ラス１１との接続は、金属層２３の先端が内側にわずか
に折り曲げられ折り曲げ部分に第１環状弾性部材３１が
設けられ、この第１環状弾性部材３１に第１カバーガラ
ス１１の先端面が接している。そして第１カバーガラス
１１の反対側の面には第２環状弾性部材３２が設けられ
ており、この第２環状弾性部材３２を枠部材３３で先端
方向（図中の矢印方向）に締め込むことにより、第１環
状弾性部材３１及び第２環状弾性部材３２により密閉性
を確保し、前記第１空気層１２の密閉状態を維持するよ
うになっている。その他の各層とカバーガラスとの接続
も同様にして密閉性を確保した接続を実現している。The connection between the cover glass and each layer is shown in FIG.
As shown in (a), for example, the connection between the metal layer 23 and the first cover glass 11 is such that the tip of the metal layer 23 is slightly bent inward and the first annular elastic member 31 is provided at the bent portion. The tip end surface of the first cover glass 11 is in contact with the first annular elastic member 31. A second annular elastic member 32 is provided on the opposite surface of the first cover glass 11, and the second annular elastic member 32 is fastened by the frame member 33 in the tip direction (arrow direction in the figure). Thus, the first annular elastic member 31 and the second annular elastic member 32 ensure hermeticity, and maintain the hermetically sealed state of the first air layer 12. Similarly, the other layers and the cover glass are connected to each other in a sealed manner.
【００１５】このように構成された本実施例のカメラヘ
ッド１によれば、絶縁層２２により導電層２１と金属層
２３との絶縁状態を確保するとともに、熱伝導率を低い
材質で絶縁層２２を構成しているので、金属層２３から
の熱が導電層２１に伝達しにくく、その結果ＣＣＤ７や
回路基板１６の温度上昇を防止でき、熱滅菌処理により
カメラヘッド１を滅菌してもカメラヘッド１内の電子部
品が損傷するということがない。According to the camera head 1 of this embodiment having such a structure, the insulating layer 22 ensures the insulation between the conductive layer 21 and the metal layer 23, and the insulating layer 22 is made of a material having a low thermal conductivity. Therefore, the heat from the metal layer 23 is difficult to be transferred to the conductive layer 21, and as a result, the temperature rise of the CCD 7 and the circuit board 16 can be prevented, and even if the camera head 1 is sterilized by the heat sterilization process. The electronic components in 1 are not damaged.
【００１６】なお、各層間に層間空気層を形成する場合
は、図２（ｂ）に示すように、各層とカバーガラスの接
続を行っても良い。すなわち、例えば金属層２３と絶縁
層２２との間に層間空気層３５を形成する場合、第１カ
バーガラス１１と金属層２３の接続は、図２（ａ）の枠
部材３３の代わりに絶縁層２２を延長して第２環状弾性
部材３２を押しつけて密閉性を確保して接続固定しても
良い。そして第２カバーガラスに関しては絶縁層２２の
所定の位置に段差を設けこの段差に第２カバーガラスを
封止樹脂３６により固定すれば良い。When an interlayer air layer is formed between the layers, the layers may be connected to the cover glass as shown in FIG. 2 (b). That is, for example, when the interlayer air layer 35 is formed between the metal layer 23 and the insulating layer 22, the connection between the first cover glass 11 and the metal layer 23 is performed by using the insulating layer instead of the frame member 33 of FIG. 22 may be extended and the second annular elastic member 32 may be pressed to secure the airtightness and connect and fix. The second cover glass may be provided with a step at a predetermined position on the insulating layer 22, and the second cover glass may be fixed to the step with the sealing resin 36.
【００１７】また、第１カバーガラス１１と金属層２３
との接続を図２（ａ）に示すようにするとしたが、これ
に限らず、図３に示すように接続しても良い。すなわ
ち、金属層２３の先端に段差を設け、この段差に第２環
状弾性部材３２を設けて第１カバーガラス１１を接触さ
せ、金属層２３の先端側に枠部材３３ａを設けると共に
第１カバーガラス１１の先端面周辺に切り欠きを設けこ
の切り欠きと枠部材３３ａとの間に第１環状弾性部材３
１を設けて、枠部材３３ａを先端側から締め付けること
により密閉性を確保して接続固定しても良い。このよう
に枠部材３３ａを第１カバーガラス１１の先端面側に設
けて構成することにより組立が容易になる。ここで、切
り欠きを第１カバーガラス１１に設けるとしたが、勿論
枠部材３３ａに設けて構成しても良いことはいうまでも
ない。Further, the first cover glass 11 and the metal layer 23
Although the connection to and is made as shown in FIG. 2A, the connection is not limited to this, and the connection may be made as shown in FIG. That is, a step is provided at the tip of the metal layer 23, the second annular elastic member 32 is provided at this step to contact the first cover glass 11, and the frame member 33a is provided at the tip side of the metal layer 23 and the first cover glass is provided. A notch is provided around the tip end surface of the first annular elastic member 3 between the notch and the frame member 33a.
1 may be provided, and the frame member 33a may be connected and fixed while securing hermeticity by tightening from the tip side. As described above, the frame member 33a is provided on the front end surface side of the first cover glass 11 to configure the assembly, which facilitates the assembly. Although the notch is provided in the first cover glass 11 here, it goes without saying that the notch may be provided in the frame member 33a.
【００１８】また、第１環状弾性部材３１を耐薬性部材
で構成し、第２環状弾性部材３２を防湿性部材で構成す
ることにより、より耐久性の優れたカメラヘッドが実現
できる。Further, by forming the first annular elastic member 31 with a chemical resistant member and the second annular elastic member 32 with a moisture-proof member, a camera head with more excellent durability can be realized.
【００１９】さらに上記第１実施例では、ＣＣＤ７と回
路基板１６をカメラヘッド１内の同一空間内に配置する
としたが、これに限らず、図４（ａ）に示すように、カ
メラヘッドに対して回路基板を着脱自在に接続すること
によりカメラヘッドのみ滅菌処理し回路基板１６及び信
号ケーブルを１７を使い捨てとする構成でも良い。ま
た、図４（ｂ）に示すように、回路基板１６単体を３層
の外装で密閉するようにしても良く、この場合回路基板
側は完全密閉構造となるため回路基板１６は完全防湿と
なり信頼性が向上する。Further, in the first embodiment described above, the CCD 7 and the circuit board 16 are arranged in the same space in the camera head 1, but the present invention is not limited to this, and as shown in FIG. Alternatively, the circuit board 16 and the signal cable 17 may be made disposable by sterilizing only the camera head by detachably connecting the circuit board. Alternatively, as shown in FIG. 4B, the circuit board 16 may be hermetically sealed with a three-layer exterior. In this case, since the circuit board side has a completely hermetically sealed structure, the circuit board 16 is completely moisture-proof and reliable. The property is improved.
【００２０】次に第２実施例について説明する。図５な
いし図９は第２実施例に係わり、図５は外装各層の間に
層間空気層を形成したカメラヘッドの構成を示す断面
図、図６は金属層と絶縁層との間に形成された層間空気
層に潜熱蓄熱材を充填した図５のカメラヘッドの変形例
の構成を示す断面図、図７は絶縁層と導電層との間に形
成された層間空気層に断熱材を充填した図６のカメラヘ
ッドの変形例の構成を示す断面図、図８は光透過性に優
れた潜熱蓄熱材を用い第１及び第２カバーガラス間に潜
熱蓄熱材を充填した図７のカメラヘッドの変形例の構成
を示す断面図、図９は潜熱蓄熱材により断熱されるカメ
ラヘッドの変形例の構成を示す断面図である。Next, a second embodiment will be described. 5 to 9 relate to the second embodiment, FIG. 5 is a cross-sectional view showing the structure of a camera head in which an interlayer air layer is formed between outer layers, and FIG. 6 is formed between a metal layer and an insulating layer. FIG. 7 is a cross-sectional view showing the configuration of a modified example of the camera head of FIG. 5 in which the interlayer air layer is filled with a latent heat storage material, and FIG. 7 is a diagram showing the interlayer air layer formed between the insulating layer and the conductive layer filled with a heat insulating material. FIG. 8 is a cross-sectional view showing the configuration of a modified example of the camera head of FIG. 6, and FIG. 8 is a view of the camera head of FIG. 7 in which a latent heat storage material having excellent light transmittance is used and the latent heat storage material is filled between the first and second cover glasses. FIG. 9 is a cross-sectional view showing the structure of a modified example, and FIG. 9 is a cross-sectional view showing the structure of a modified example of a camera head that is thermally insulated by a latent heat storage material.
【００２１】第２実施例は、第１実施例と同様な構成を
有するので、同一構成には同じ符号をつけ説明は省略す
る。Since the second embodiment has the same structure as the first embodiment, the same reference numerals are given to the same structures and the description thereof will be omitted.
【００２２】第２実施例のカメラヘッドでは、図５に示
すように、第１カバーガラス１１は第１枠体４１に固定
され、第２カバーガラス１３は第２枠体４２に固定さ
れ、第３カバーガラス１５は第３枠体４３に固定されて
いる。前記第１枠体４１は金属層２３にＯリング４４に
より密閉接続され、また前記第２枠体４２は絶縁層２２
に接続されると共にＯリング４５により金属層２３に密
閉接続され、金属層２３と絶縁層２２との間に密閉した
層間空気層４６を形成している。そして、第１カバーガ
ラス１１と第２カバーガラス１３との間には独立した空
気層４９が形成される。In the camera head of the second embodiment, as shown in FIG. 5, the first cover glass 11 is fixed to the first frame body 41 and the second cover glass 13 is fixed to the second frame body 42. The 3 cover glass 15 is fixed to the third frame body 43. The first frame body 41 is hermetically connected to the metal layer 23 by an O-ring 44, and the second frame body 42 is connected to the insulating layer 22.
And the O-ring 45 hermetically connects to the metal layer 23 to form a hermetically sealed interlayer air layer 46 between the metal layer 23 and the insulating layer 22. An independent air layer 49 is formed between the first cover glass 11 and the second cover glass 13.
【００２３】同様に第３枠体４３は導電層２１接続され
ており、第２枠体４２と絶縁層２２との接続形状は導電
層２１と絶縁層２２との間に層間空気層４７が形成され
るような形状となっている。Similarly, the third frame 43 is connected to the conductive layer 21, and the connection shape between the second frame 42 and the insulating layer 22 is an interlayer air layer 47 formed between the conductive layer 21 and the insulating layer 22. The shape is as shown.
【００２４】さらに前記金属層と信号ケーブル１７の接
続部には固定部材４８が設けられ、信号ケーブル１７の
たわみにより接続状態が変化しないような構造となって
おり、これにより信号ケーブル１７と金属層２３の密閉
性を確保している。Further, a fixing member 48 is provided at the connecting portion between the metal layer and the signal cable 17, so that the connection state does not change due to the bending of the signal cable 17, and thus the signal cable 17 and the metal layer are formed. The airtightness of 23 is secured.
【００２５】このように構成された第２実施例のカメラ
ヘッドによれば、第１実施例の効果に加え、層間空気層
４６、４７によりＣＣＤ７及び回路基板１６への断熱性
が向上し、熱滅菌処理におけるカメラヘッドの耐熱性能
がより向上する。According to the camera head of the second embodiment constructed as described above, in addition to the effects of the first embodiment, the heat insulation to the CCD 7 and the circuit board 16 is improved by the interlayer air layers 46 and 47, and The heat resistance performance of the camera head in the sterilization process is further improved.
【００２６】ところで、上記第２実施例におけるカメラ
ヘッドの層間空気層４６には、図６に示すように、潜熱
蓄熱材（相変化材料）５１を充填することができる。例
えばオートクレーブを１３５゜Ｃ、５分間とし、ＣＣＤ
７の耐熱温度が８５゜Ｃとすると、層間空気層４６に充
填する潜熱蓄熱材５１は、融点が８０゜Ｃ程度の潜熱蓄
熱材とすれば良い。また、潜熱蓄熱材５１の充填量は、
１３５゜Ｃの水蒸気が５分間に与え得る熱量と潜熱蓄熱
材５１の単位重量当たりの潜熱から容易に決定できる。
この場合、最外層である金属層２３が何゜Ｃまで上昇し
ようと、潜熱蓄熱材５１が完全に（すなわち、充填され
た潜熱蓄熱材５１のすべてが）、例えば固相から液相へ
の相変化が終わるまでは、潜熱蓄熱材５１の温度は融点
以上に上昇しない。従ってＣＣＤ７及び回路基板１６が
配置されている領域の内部温度も潜熱蓄熱材５１の融点
以上にはならないので、熱滅菌処理のカメラヘッドの熱
耐性を飛躍的に改善できる。なお、この潜熱蓄熱材５１
の相変化を固相から液相への相変化としたが、これに限
らず、液相から気相への相変化を起こす潜熱蓄熱材でも
よい。By the way, the interlayer air layer 46 of the camera head in the second embodiment can be filled with a latent heat storage material (phase change material) 51 as shown in FIG. For example, autoclave at 135 ° C for 5 minutes, CCD
When the heat resistant temperature of No. 7 is 85 ° C., the latent heat storage material 51 filled in the interlayer air layer 46 may be a latent heat storage material having a melting point of about 80 ° C. Further, the filling amount of the latent heat storage material 51 is
It can be easily determined from the amount of heat that steam at 135 ° C. can give in 5 minutes and the latent heat per unit weight of the latent heat storage material 51.
In this case, no matter how many degrees C the outermost metal layer 23 rises, the latent heat storage material 51 is completely (that is, all of the filled latent heat storage material 51), for example, the phase from the solid phase to the liquid phase. Until the change ends, the temperature of the latent heat storage material 51 does not rise above the melting point. Therefore, the internal temperature of the area where the CCD 7 and the circuit board 16 are arranged does not exceed the melting point of the latent heat storage material 51, so that the heat resistance of the camera head in the heat sterilization treatment can be dramatically improved. In addition, this latent heat storage material 51
Although the phase change of (1) is the phase change from the solid phase to the liquid phase, it is not limited to this and may be a latent heat storage material that causes the phase change from the liquid phase to the gas phase.
【００２７】また、図６のカメラヘッドにおいて、層間
空気層４７には図７に示すように、断熱材５２を充填す
ることができる。このようにすることにより図６に比べ
さらにカメラヘッドの熱耐性を改善できる。In the camera head of FIG. 6, the interlayer air layer 47 can be filled with a heat insulating material 52 as shown in FIG. By doing so, the heat resistance of the camera head can be further improved as compared with FIG.
【００２８】さらに、熱滅菌処理により第２カバーガラ
ス１３に曇りが生じる虞があるが、例えば図８のカメラ
ヘッドにおいて、第２枠部材４２と第１枠部材４１の接
続をたつことにより空気相４９と層間空気相４６とを同
一空間とし、その中に光透過性の優れた潜熱蓄熱材５１
ａを充填することにより、第２カバーガラス１３の曇り
発生を完全に防止できる。Further, although the second cover glass 13 may be fogged due to the heat sterilization process, for example, in the camera head of FIG. 8, the air phase can be increased by connecting the second frame member 42 and the first frame member 41. 49 and the interlayer air phase 46 are made into the same space, and the latent heat storage material 51 excellent in light transmittance is contained therein.
By filling with a, it is possible to completely prevent the occurrence of fogging on the second cover glass 13.
【００２９】さらにまた、前記潜熱蓄熱材５１を充填し
た使い捨て方式の熱滅菌処理用のカメラヘッドカバーで
カメラヘッドを覆い、熱滅菌処理を行うようにすること
ができる。図９に示すように、カメラヘッド１（この図
９においては、第１実施例のカメラヘッドを用いて説明
するが、本第２実施例及びその変形例及び後述する各実
施例のカメラヘッドであってもよい）を内部に潜熱蓄熱
材５１を充填した熱滅菌処理用のカメラヘッドカバー５
５で覆い熱滅菌処理を行うようにしてもよく、このと
き、例えば潜熱蓄熱材５１が液相から気相への相変化を
起こす潜熱蓄熱材の場合、気相への変化によりカメラヘ
ッドカバー５５の内部圧が異常に上昇することを避ける
ために所定の圧力以上になったならば、内部の気相とな
った潜熱蓄熱材５１を外部に放出する圧力弁５６を設け
ることができる。Furthermore, the camera head can be covered with a disposable type camera head cover for heat sterilization treatment filled with the latent heat storage material 51 to perform heat sterilization treatment. As shown in FIG. 9, a camera head 1 (in this FIG. 9, the camera head of the first embodiment will be described, but the camera head of the second embodiment and its modification and each of the embodiments described later will be described. Camera head cover 5 for heat sterilization treatment in which latent heat storage material 51 is filled
5 may be used to perform heat sterilization treatment. At this time, for example, in the case where the latent heat storage material 51 is a latent heat storage material that causes a phase change from a liquid phase to a gas phase, the change of the camera head cover 55 due to the change to the gas phase. In order to prevent the internal pressure from rising abnormally, it is possible to provide a pressure valve 56 that releases the latent heat storage material 51 in the internal vapor phase to the outside when the internal pressure reaches or exceeds a predetermined pressure.
【００３０】次に第３実施例について説明する。図１０
及び図１１は第３実施例に係わり、図１０はカメラヘッ
ドの構成を示す断面図、図１１は図１０のカメラヘッド
の変形例の構成を示す断面図である。Next, a third embodiment will be described. Figure 10
11 and 12 relate to the third embodiment, FIG. 10 is a sectional view showing the structure of the camera head, and FIG. 11 is a sectional view showing the structure of a modified example of the camera head of FIG.
【００３１】第３実施例は、第１実施例とほとんど同じ
であるので、同一構成には同じ符号をつけ説明は省略す
る。Since the third embodiment is almost the same as the first embodiment, the same components are designated by the same reference numerals and the description thereof will be omitted.
【００３２】第３実施例は、図１の第１実施例に対して
各層間に層間空気層を形成している点と信号ケーブル１
７に支持部材を設けた点が第１実施例と異なる。The third embodiment differs from the first embodiment shown in FIG. 1 in that an interlayer air layer is formed between the layers and the signal cable 1.
7 is different from the first embodiment in that a supporting member is provided.
【００３３】図１０に示すように、信号ケーブル１７は
中心に中空部を有した支持部材６１の該中空部内に嵌合
され固定している。そして、導電層２１、絶縁層２２及
び金属層２３はこの支持部材６１にパッキン６２を介し
てネジ止めされ、各層間には層間空気層６３、６４が形
成されている。その他の構成は第１実施例と同じであ
る。As shown in FIG. 10, the signal cable 17 is fitted and fixed in the hollow portion of the support member 61 having a hollow portion at the center. Then, the conductive layer 21, the insulating layer 22, and the metal layer 23 are screwed to the supporting member 61 via packing 62, and interlayer air layers 63 and 64 are formed between the layers. The other structure is the same as that of the first embodiment.
【００３４】このように構成された第３実施例によれ
ば、第１実施例の効果に加え、層間空気層６３、６４、
６５により断熱効果が高まり、カメラヘッドの熱耐性が
改善される。さらに、導電層２１、絶縁層２２及び金属
層２３の信号ケーブル側の固定は支持部材６１により行
われるので、完全な密閉状態を維持することができる。According to the third embodiment thus constructed, in addition to the effects of the first embodiment, the interlayer air layers 63, 64,
65 enhances the heat insulation effect and improves the heat resistance of the camera head. Further, the fixing of the conductive layer 21, the insulating layer 22, and the metal layer 23 on the signal cable side is performed by the support member 61, so that a completely sealed state can be maintained.
【００３５】なお、上記支持部材６１の構成は図１０に
限らず、図１１に示すように、複数の溝部を備えた中空
部を有する第１支持部材７１の前記溝部にＯリング７２
をはめ込み中空部内に信号ケーブル１７を挿通しＯリン
グ７２により密閉状態を維持して信号ケーブル１７と第
１支持部材７１との接続を行う。一方、第１支持部材７
１の外周は入射側に垂直部を備えるようにＬ字状に切り
欠きされており、パッキン７３を介して垂直部、導電層
２１、絶縁層２２及び金属層２３が順次配置されてい
る。第１支持部材７１の信号ケーブル側（入射側の反対
側）の外周にはにはネジ部７４が形成されており、この
ネジ部７４には第２支持部材７５が螺合している。そし
てこの第２支持部材７５を所定位置にまで螺合させるこ
とにより、パッキン７３によって垂直部、導電層２１、
絶縁層２２及び金属層２３が密閉状態で固定接続される
ようになっている。The structure of the support member 61 is not limited to that shown in FIG. 10, but as shown in FIG. 11, the O-ring 72 is provided in the groove portion of the first support member 71 having a hollow portion having a plurality of groove portions.
The signal cable 17 is inserted into the hollow portion and the hermetically-sealed state is maintained by the O-ring 72 to connect the signal cable 17 and the first support member 71. On the other hand, the first support member 7
The outer periphery of 1 is cut out in an L shape so as to have a vertical portion on the incident side, and the vertical portion, the conductive layer 21, the insulating layer 22 and the metal layer 23 are sequentially arranged via a packing 73. A screw portion 74 is formed on the outer periphery of the first support member 71 on the signal cable side (the side opposite to the incident side), and the second support member 75 is screwed into the screw portion 74. Then, the second support member 75 is screwed to a predetermined position, so that the packing 73 allows the vertical portion, the conductive layer 21,
The insulating layer 22 and the metal layer 23 are fixedly connected in a sealed state.
【００３６】また、この図１１のカメラヘッドのＣＣＤ
７及び回路基板１６の配置される空間は、図１０のカメ
ラヘッドに比べ、断面積は同一であるが、軸方向の長さ
が異なる。すなわち、図１０における長さＬ１に対して
図１１における長さＬ２を比較すると、Ｌ１＜Ｌ２とな
っている。この結果、ＣＣＤ７及び回路基板１６の配置
される空間は、図１１の方は大きいので空間の有する潜
熱が大きくなり、従って図１０に比べＣＣＤ７及び回路
基板１６の周囲温度上昇は緩慢となり、短時間の熱滅菌
処理における耐熱性を向上させることができる。The CCD of the camera head shown in FIG.
The space in which 7 and the circuit board 16 are arranged has the same cross-sectional area as compared with the camera head of FIG. 10, but the length in the axial direction is different. That is, when the length L2 in FIG. 11 is compared with the length L1 in FIG. 10, L1 <L2. As a result, since the space in which the CCD 7 and the circuit board 16 are arranged is larger in FIG. 11, the latent heat in the space is larger, and therefore the ambient temperature rise of the CCD 7 and the circuit board 16 is slower than in FIG. The heat resistance in the heat sterilization treatment can be improved.
【００３７】次に第４実施例について説明する。図１２
は第４実施例に係る多層外装の各層の形状を示す断面図
である。Next, a fourth embodiment will be described. 12
FIG. 8 is a cross-sectional view showing the shape of each layer of the multilayer exterior according to the fourth example.
【００３８】第４実施例は、第２及び第３実施例が各層
とカバーガラスとの接続形状により層間空気層を形成し
ていたのに対し、絶縁層の形状を径方向に立体な突起部
を形成することにより各層間の層間空気層を形成する点
が異なっている。In the fourth embodiment, the interlayer air layer is formed by the connecting shape of each layer and the cover glass in the second and third embodiments, whereas the shape of the insulating layer is a three-dimensional protrusion in the radial direction. Is different in that an interlayer air layer is formed between the layers.
【００３９】カメラヘッドの軸に垂直な断面である図１
２（ａ）に示すように、第３カバーガラス１５の外周に
は導電層２１が密着して覆われており、この導電層２１
の外周もまた樹脂等からなる絶縁層２２ａにより密着し
て覆われている。絶縁層２２ａの外周には複数の突起部
９１が形成されており、その突起部９１の先端に密着し
て金属層２３が覆っている。この突起部９１により絶縁
層２２ａと金属層２３との間には層間空気層９２が形成
されている。FIG. 1 is a cross section perpendicular to the axis of the camera head.
As shown in FIG. 2A, the conductive layer 21 is closely adhered to and covered with the outer periphery of the third cover glass 15.
The outer periphery of is also closely covered with an insulating layer 22a made of resin or the like. A plurality of protrusions 91 are formed on the outer circumference of the insulating layer 22a, and the metal layer 23 covers the tips of the protrusions 91 in close contact with each other. An interlayer air layer 92 is formed between the insulating layer 22 a and the metal layer 23 by the protrusion 91.
【００４０】その他の構成は第２及び第３実施例と同様
である。The other structure is similar to that of the second and third embodiments.
【００４１】このように構成された第４実施例のカメラ
ヘッドによれば、第２及び第３実施例の効果に加え、絶
縁層２２ａは樹脂成形により簡単に成形することができ
るので、容易に層間空気層９２を形成することができ、
安価に耐熱性の優れたカメラヘッドが実現できる。According to the camera head of the fourth embodiment having such a structure, in addition to the effects of the second and third embodiments, the insulating layer 22a can be easily molded by resin molding, so that it can be easily performed. An interlayer air layer 92 can be formed,
A camera head with excellent heat resistance can be realized at low cost.
【００４２】なお、絶縁層２２ａの外周に複数の突起部
９１を設けるとしたが、これに限らず、導電層２１の外
周に複数の突起部を設けることにより導電層２１と絶縁
層２２ａとの間に層間空気層を形成するようにしても良
い。Although a plurality of protrusions 91 are provided on the outer periphery of the insulating layer 22a, the present invention is not limited to this. By providing a plurality of protrusions on the outer periphery of the conductive layer 21, the conductive layer 21 and the insulating layer 22a are separated from each other. An interlayer air layer may be formed between them.
【００４３】また、図１２（ｂ）に示すように、外周だ
けでなく内周にも突起部９５を設けた絶縁層２２ｂによ
り、導電層２１と絶縁層２２ｂとの間に層間空気層９６
及び絶縁層２２ｂと金属層２３との間には層間空気層９
２を形成するように突起部９１を絶縁層２２ａに樹脂成
形しても良い。Further, as shown in FIG. 12B, the insulating layer 22b provided with the protrusions 95 not only on the outer circumference but also on the inner circumference allows the interlayer air layer 96 to be interposed between the conductive layer 21 and the insulating layer 22b.
And an interlayer air layer 9 between the insulating layer 22b and the metal layer 23.
The protrusions 91 may be resin-molded on the insulating layer 22a so as to form No. 2.
【００４４】さらに、図１２（ｃ）に示すように、複数
の突起部９８を成形した絶縁層２２ｃにより層間空気層
９９を形成するようにしてもよい。Further, as shown in FIG. 12C, the interlayer air layer 99 may be formed by the insulating layer 22c having a plurality of protrusions 98 formed therein.
【００４５】なお、上記実施例においては、硬性鏡に用
いられるカメラヘッドについて説明したが、これに限ら
ず、軟性内視鏡に接続されるカメラヘッドも同様に構成
することにより同じ効果を得ることができる。Although the camera head used for the rigid endoscope has been described in the above embodiments, the present invention is not limited to this, and the same effect can be obtained by configuring the camera head connected to the flexible endoscope in the same manner. You can
【００４６】また、各実施例及びその変形例において
は、その他の各実施例に対しても適用可能な実施例及び
変形例であるので（例えば、第２実施例の変形例の第３
実施例の適用等）、各実施例の変形例は記載された実施
例に限らない。さらに、各実施例及びその変形例の組み
合わせにより、上記効果を達成することができることは
いうまでもない。Further, each of the embodiments and its modification is an embodiment and modification applicable to each of the other embodiments (for example, the third modification of the second embodiment).
Modifications of each embodiment are not limited to the described embodiments. Further, it goes without saying that the above effects can be achieved by combining the respective embodiments and their modifications.
【００４７】[0047]
【発明の効果】以上説明したように本発明の内視鏡撮像
装置によれば、内視鏡像を撮像手段により撮像する内視
鏡撮像装置において、前記撮像手段を覆う第１の被覆層
と前記第１の被覆層を覆う第２の被覆層と、前記第２の
被覆層を覆う第３の被覆層とからなる少なくとも３つの
層から構成される多層被覆を備えているので、前記多層
被覆により熱伝達を劣化させることができ、前記撮像手
段の耐熱性を向上させることができるという効果があ
る。As described above, according to the endoscope image pickup apparatus of the present invention, in the endoscope image pickup apparatus for picking up an endoscopic image by the image pickup means, the first coating layer for covering the image pickup means and the Since the multilayer coating includes at least three layers including the second coating layer that covers the first coating layer and the third coating layer that covers the second coating layer, There is an effect that heat transfer can be deteriorated and the heat resistance of the imaging means can be improved.
【図１】第１実施例に係るカメラヘッドの構成を示す断
面図。FIG. 1 is a sectional view showing the configuration of a camera head according to a first embodiment.
【図２】図１の外装各層とカバーガラスとの接続を示す
断面図。FIG. 2 is a cross-sectional view showing a connection between each outer layer of FIG. 1 and a cover glass.
【図３】図１の金属層とカバーガラスとの接続の変形例
を示す断面図。FIG. 3 is a cross-sectional view showing a modified example of the connection between the metal layer and the cover glass in FIG.
【図４】第１実施例に係るカメラヘッドの変形例の構成
を示す断面図。FIG. 4 is a sectional view showing the configuration of a modified example of the camera head according to the first embodiment.
【図５】第２実施例に係る外装各層の間に層間空気層を
形成したカメラヘッドの構成を示す断面図。FIG. 5 is a cross-sectional view showing the configuration of a camera head in which an interlayer air layer is formed between outer layers according to the second embodiment.
【図６】金属層と絶縁層との間に形成された層間空気層
に潜熱蓄熱材を充填した図５のカメラヘッドの変形例の
構成を示す断面図。6 is a cross-sectional view showing a configuration of a modified example of the camera head of FIG. 5 in which an interlayer air layer formed between a metal layer and an insulating layer is filled with a latent heat storage material.
【図７】絶縁層と導電層との間に形成された層間空気層
に断熱材を充填した図６のカメラヘッドの変形例の構成
を示す断面図。7 is a cross-sectional view showing a configuration of a modified example of the camera head of FIG. 6 in which an interlayer air layer formed between an insulating layer and a conductive layer is filled with a heat insulating material.
【図８】光透過性に優れた潜熱蓄熱材を用い第１及び第
２カバーガラス間に潜熱蓄熱材を充填した図７のカメラ
ヘッドの変形例の構成を示す断面図。FIG. 8 is a cross-sectional view showing a configuration of a modified example of the camera head of FIG. 7 in which a latent heat storage material excellent in light transmission is used to fill the latent heat storage material between the first and second cover glasses.
【図９】第２実施例に係る潜熱蓄熱材により断熱される
カメラヘッドの変形例の構成を示す断面図。FIG. 9 is a cross-sectional view showing the configuration of a modified example of the camera head that is thermally insulated by the latent heat storage material according to the second embodiment.
【図１０】第３実施例に係るカメラヘッドの構成を示す
断面図。FIG. 10 is a sectional view showing the structure of a camera head according to a third embodiment.
【図１１】図１０のカメラヘッドの変形例の構成を示す
断面図11 is a sectional view showing a configuration of a modified example of the camera head of FIG.
【図１２】第４実施例に係る多層外装の各層の形状を示
す断面図。FIG. 12 is a cross-sectional view showing the shape of each layer of the multilayer exterior according to the fourth example.
１…カメラヘッド ７…ＣＣＤ １１…第１カバーガラス １３…第２カバーガラス １５…第３カバーガラス １６…回路基板 １７…信号ケーブル ２１…導電層 ２２…絶縁層 ２３…金属層 1 ... Camera head 7 ... CCD 11 ... 1st cover glass 13 ... 2nd cover glass 15 ... 3rd cover glass 16 ... Circuit board 17 ... Signal cable 21 ... Conductive layer 22 ... Insulating layer 23 ... Metal layer
─────────────────────────────────────────────────────
─────────────────────────────────────────────────── ───
【手続補正書】[Procedure amendment]
【提出日】平成６年１月１３日[Submission date] January 13, 1994
【手続補正１】[Procedure Amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００１１[Correction target item name] 0011
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【００１１】前記カメラヘッド１では、入射した内視鏡
像は、カメラヘッド１前面に設けられた第１カバーガラ
ス１１、第１空気層１２、第２カバーガラス１３、第２
空気層１４及び第３カバーガラス１５を順次透過して前
記ＣＣＤ７の撮像面に結像する。そしてＣＣＤ７により
内視鏡像が電気信号に変換され、プリアンプ等を実装し
た回路基板１６を介して信号ケーブル１７により画像情
報として図示しないビデオプロセッサに出力されるよう
になっている。In the camera head 1, the incident endoscopic image has a first cover glass 11, a first air layer 12, a second cover glass 13, and a second cover glass 11 provided on the front surface of the camera head 1.
An image is formed on the image pickup surface of the CCD 7 by sequentially passing through the air layer 14 and the third cover glass 15. The endoscopic image by CCD7 is converted into an electric signal, and is output to a video processor (not shown) as image information by a signal cable 17 via the circuit board 16 mounted with a preamplifier and the like.
【手続補正２】[Procedure Amendment 2]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００１４[Correction target item name] 0014
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【００１４】カバーガラスと各層との接続は、図２
（ａ）に示すように、例えば金属層２３と第１カバーガ
ラス１１との接続は、金属層２３の先端部に内径側への
突出部を設け、突出部分に第１環状弾性部材３１が設け
られ、この第１環状弾性部材３１に第１カバーガラス１
１の先端面が接している。そして第１カバーガラス１１
の反対側の面には第２環状弾性部材３２が設けられてお
り、この第２環状弾性部材３２を枠部材３３で先端方向
（図中の矢印方向）に締め込むことにより、第１環状弾
性部材３１及び第２環状弾性部材３２により密閉性を確
保し、前記第１空気層１２の密閉状態を維持するように
なっている。その他の各層とカバーガラスとの接続も同
様にして密閉性を確保した接続を実現している。The connection between the cover glass and each layer is shown in FIG.
As shown in (a), for example, the connection between the metal layer 23 and the first cover glass 11 is performed by connecting the tip end of the metal layer 23 to the inner diameter side.
The protruding portion is provided, and the first annular elastic member 31 is provided on the protruding portion, and the first cover glass 1 is attached to the first annular elastic member 31.
The tip surface of 1 is in contact. And the first cover glass 11
The second annular elastic member 32 is provided on the surface opposite to the first annular elastic member 32 by tightening the second annular elastic member 32 with the frame member 33 in the tip direction (the direction of the arrow in the figure). The member 31 and the second annular elastic member 32 ensure hermeticity and maintain the hermetically sealed state of the first air layer 12. Similarly, the other layers and the cover glass are connected to each other in a sealed manner.
【手続補正３】[Procedure 3]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００１９[Correction target item name] 0019
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【００１９】さらに上記第１実施例では、ＣＣＤ７と回
路基板１６をカメラヘッド１内の同一空間内に配置する
としたが、これに限らず、図４（ａ）に示すように、カ
メラヘッドに対して回路基板を着脱自在に接続すること
によりカメラヘッドのみ繰り返し滅菌処理可能とし回路
基板１６及び信号ケーブルを１７を使い捨てとする構成
でも良い。また、図４（ｂ）に示すように、回路基板１
６単体を３層の外装で密閉するようにしても良く、この
場合回路基板側は完全密閉構造となるため回路基板１６
は完全防湿となり信頼性が向上する。Further, in the first embodiment described above, the CCD 7 and the circuit board 16 are arranged in the same space in the camera head 1, but the present invention is not limited to this, and as shown in FIG. The circuit board 16 and the signal cable 17 may be disposable so that only the camera head can be repeatedly sterilized by detachably connecting the circuit board. In addition, as shown in FIG.
The 6 unit may be hermetically sealed with a three-layer exterior, in which case the circuit board has a completely hermetically sealed structure.
Is completely moisture-proof and reliability is improved.
【手続補正４】[Procedure amendment 4]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００２２[Name of item to be corrected] 0022
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【００２２】第２実施例のカメラヘッドでは、図５に示
すように、第１カバーガラス１１は第１枠体４１に固定
され、第２カバーガラス１３は第２枠体４２に固定さ
れ、第３カバーガラス１５は第３枠体４３に固定されて
いる。前記第１枠体４１は金属層２３にＯリング４４に
より密閉接続され、また前記第２枠体４２は絶縁層２２
に接続されると共にＯリング４５により第１枠体４１に
密閉接続され、金属層２３と絶縁層２２との間に密閉し
た層間空気層４６を形成している。そして、第１カバー
ガラス１１と第２カバーガラス１３との間には独立した
空気層４９が形成される。In the camera head of the second embodiment, as shown in FIG. 5, the first cover glass 11 is fixed to the first frame body 41 and the second cover glass 13 is fixed to the second frame body 42. The 3 cover glass 15 is fixed to the third frame body 43. The first frame body 41 is hermetically connected to the metal layer 23 by an O-ring 44, and the second frame body 42 is connected to the insulating layer 22.
And the O-ring 45 hermetically connects the first frame 41 to form a hermetically sealed interlayer air layer 46 between the metal layer 23 and the insulating layer 22. An independent air layer 49 is formed between the first cover glass 11 and the second cover glass 13.
【手続補正５】[Procedure Amendment 5]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００３３[Correction target item name] 0033
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【００３３】図１０に示すように、信号ケーブル１７は
中心に中空部を有した支持部材６１の該中空部内に嵌合
され固定している。そして、導電層２１、絶縁層２２及
び金属層２３はこの支持部材６１にネジ止めされ、この
時、金属層２３はパッキン６２を介してネジ止めされ、
各層間には層間空気層６３、６４が形成されている。そ
の他の構成は第１実施例と同じである。As shown in FIG. 10, the signal cable 17 is fitted and fixed in the hollow portion of the support member 61 having a hollow portion at the center. Then, the conductive layer 21, the insulating layer 22 and the metal layer 23 are screwed to the support member 61,
At this time, the metal layer 23 is screwed through the packing 62,
Interlayer air layers 63 and 64 are formed between the layers. The other structure is the same as that of the first embodiment.
【手続補正６】[Procedure correction 6]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００３４[Correction target item name] 0034
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【００３４】このように構成された第３実施例によれ
ば、第１実施例の効果に加え、層間空気層６３、６４に
より断熱効果が高まり、カメラヘッドの熱耐性が改善さ
れる。さらに、導電層２１、絶縁層２２及び金属層２３
の信号ケーブル側の固定は支持部材６１により行われる
ので、完全な密閉状態を維持することができる。According to the third embodiment constructed as described above, in addition to the effect of the first embodiment, the heat insulating effect of the interlayer air layers 63 and 64 is enhanced, and the heat resistance of the camera head is improved. Furthermore, the conductive layer 21, the insulating layer 22, and the metal layer 23.
Since the signal cable side is fixed by the support member 61, it is possible to maintain a completely sealed state.
【手続補正７】[Procedure Amendment 7]
【補正対象書類名】図面[Document name to be corrected] Drawing
【補正対象項目名】図２[Name of item to be corrected] Figure 2
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【図２】 [Fig. 2]
【手続補正８】[Procedure Amendment 8]
【補正対象書類名】図面[Document name to be corrected] Drawing
【補正対象項目名】図５[Name of item to be corrected] Figure 5
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【図５】 [Figure 5]
【手続補正９】[Procedure Amendment 9]
【補正対象書類名】図面[Document name to be corrected] Drawing
【補正対象項目名】図１０[Name of item to be corrected] Fig. 10
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【図１０】 [Figure 10]
───────────────────────────────────────────────────── フロントページの続き (72)発明者 大町 健二 東京都渋谷区幡ヶ谷２丁目43番２号 オリ ンパス光学工業株式会社内 (72)発明者 谷沢 信吉 東京都渋谷区幡ヶ谷２丁目43番２号 オリ ンパス光学工業株式会社内 (72)発明者 上原 政夫 東京都渋谷区幡ヶ谷２丁目43番２号 オリ ンパス光学工業株式会社内 (72)発明者 萩原 雅博 東京都渋谷区幡ヶ谷２丁目43番２号 オリ ンパス光学工業株式会社内 ─────────────────────────────────────────────────── ─── Continuation of front page (72) Kenji Omachi 2-43-2 Hatagaya, Shibuya-ku, Tokyo Inside Olympus Optical Co., Ltd. (72) Inventor Shinkichi Tanizawa 2-43-2 Hatagaya, Shibuya-ku, Tokyo Olympus Optical Co., Ltd. (72) Inventor Masao Uehara 2-43-2 Hatagaya, Shibuya-ku, Tokyo Olympus Optical Co., Ltd. (72) Inventor Masahiro Hagiwara 2-43-2, Hatagaya, Shibuya-ku, Tokyo Olympus Optical Co., Ltd.
Claims (1)
鏡撮像装置において、 前記撮像手段を覆う第１の被覆層と前記第１の被覆層を
覆う第２の被覆層と、前記第２の被覆層を覆う第３の被
覆層とからなる少なくとも３つの層から構成される多層
被覆を備えたことを特徴とする内視鏡撮像装置。1. An endoscopic image pickup apparatus for picking up an endoscopic image by an image pickup means, a first coating layer covering the image pickup means, a second coating layer covering the first coating layer, and the second coating layer. An endoscopic imaging device comprising a multi-layer coating including at least three layers including a third coating layer that covers the coating layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19753093A JP3214762B2 (en) | 1993-08-09 | 1993-08-09 | Endoscope imaging device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19753093A JP3214762B2 (en) | 1993-08-09 | 1993-08-09 | Endoscope imaging device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0751223A true JPH0751223A (en) | 1995-02-28 |
| JP3214762B2 JP3214762B2 (en) | 2001-10-02 |
Family
ID=16376005
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19753093A Expired - Fee Related JP3214762B2 (en) | 1993-08-09 | 1993-08-09 | Endoscope imaging device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3214762B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000083252A (en) * | 1998-09-04 | 2000-03-21 | Olympus Optical Co Ltd | Image pickup device |
| US6547721B1 (en) | 1998-08-07 | 2003-04-15 | Olympus Optical Co., Ltd. | Endoscope capable of being autoclaved |
| WO2019058634A1 (en) * | 2017-09-25 | 2019-03-28 | オリンパス株式会社 | Optical module |
| WO2021156949A1 (en) * | 2020-02-04 | 2021-08-12 | オリンパス株式会社 | Endoscopic device |
-
1993
- 1993-08-09 JP JP19753093A patent/JP3214762B2/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6547721B1 (en) | 1998-08-07 | 2003-04-15 | Olympus Optical Co., Ltd. | Endoscope capable of being autoclaved |
| USRE43281E1 (en) | 1998-08-07 | 2012-03-27 | Masakazu Higuma | Endoscope capable of being autoclaved |
| JP2000083252A (en) * | 1998-09-04 | 2000-03-21 | Olympus Optical Co Ltd | Image pickup device |
| WO2019058634A1 (en) * | 2017-09-25 | 2019-03-28 | オリンパス株式会社 | Optical module |
| US11464392B2 (en) | 2017-09-25 | 2022-10-11 | Olympus Corporation | Optical module and endoscope |
| WO2021156949A1 (en) * | 2020-02-04 | 2021-08-12 | オリンパス株式会社 | Endoscopic device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3214762B2 (en) | 2001-10-02 |
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