JPH0745757A - Semiconductor device and manufacture of heat dissipating device thereof - Google Patents
Semiconductor device and manufacture of heat dissipating device thereofInfo
- Publication number
- JPH0745757A JPH0745757A JP5191142A JP19114293A JPH0745757A JP H0745757 A JPH0745757 A JP H0745757A JP 5191142 A JP5191142 A JP 5191142A JP 19114293 A JP19114293 A JP 19114293A JP H0745757 A JPH0745757 A JP H0745757A
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- fixed
- columnar
- metal wires
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、半導体装置の放熱技術
に関し、特に、ＰＡＧ（Ｐｉｎ ＧｒｉｄＡｒｒａｙ
Ｐａｃｋａｇｅ）形およびＱＦＰ（Ｑｕａｄ Ｆｌａｔ
Ｐａｃｋａｇｅ）形の半導体装置の放熱技術に適用し
て有効な技術に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to heat dissipation technology for semiconductor devices, and more particularly to PAG (Pin Grid Array).
Package) and QFP (Quad Flat)
The present invention relates to a technology effectively applied to a heat dissipation technology of a package type semiconductor device.
【０００２】[0002]
【従来の技術】半導体装置のうち、発熱量の多いものに
ついては、半導体素子からの発熱を放散させるために放
熱手段として放熱装置を設けているものがある。2. Description of the Related Art Among semiconductor devices having a large amount of heat generation, there is a semiconductor device provided with a heat dissipation device as a heat dissipation means for dissipating heat generated from a semiconductor element.
【０００３】この放熱装置は、たとえば、アルミニウム
を金型により加圧し、鍛造することによって所定の形状
に成形している。また、放熱拡散効率の高い放熱装置と
して、多数の細長いピンを固定したピンフィン形の放熱
装置もある。In this heat dissipation device, for example, aluminum is pressed by a die and forged to form a predetermined shape. Further, as a heat dissipation device having high heat dissipation diffusion efficiency, there is also a pin fin type heat dissipation device in which a large number of elongated pins are fixed.
【０００４】このピンフィン形の放熱装置は、前記鍛造
法により成形したものと熱拡散板となる放熱板の上に、
アルミニウム等の細長いピンを銀ろう付け等により固定
したものがある。This pin-fin type heat dissipation device comprises a heat dissipating plate, which is formed by the forging method, and a heat dissipating plate,
There is one in which elongated pins such as aluminum are fixed by silver brazing or the like.
【０００５】[0005]
【発明が解決しようとする課題】ところが、鍛造による
放熱装置の成形では、製造時にフィンが折れてしまった
り、金型が詰まってしまいピンフィンが所定の形状にな
らないという問題がある。However, in the molding of the heat dissipation device by forging, there are problems that the fins are broken at the time of manufacture or the mold is clogged and the pin fins do not have a predetermined shape.
【０００６】また、銀ろう付け等により細長いピンを固
定する場合、各々のピンフィンをすべて作業者が手作業
によって固定しなければならず、さらに、手作業である
ので、ピンフィンを確実に垂直に固定することが困難で
あり、ピンフィンが倒れたり、傾いて固定されてしまう
ことにより、放熱装置の熱拡散効率が悪くなり、かつ、
生産効率が悪いためにコストが非常に上がるという問題
がある。Further, when the elongated pins are fixed by silver brazing or the like, the operator must fix all the pin fins manually, and since it is manual work, the pin fins are securely fixed vertically. It is difficult to do so, and the pin fins fall down or are tilted and fixed, the heat dissipation efficiency of the heat dissipation device deteriorates, and
There is a problem that the production cost is very high due to poor production efficiency.
【０００７】本発明の目的は、柱状の放熱部材を低コス
トで、容易に効率よく固定することができる半導体装置
および放熱装置の製造技術を提供することにある。It is an object of the present invention to provide a semiconductor device and a heat dissipation device manufacturing technique capable of easily and efficiently fixing a columnar heat dissipation member at low cost.
【０００８】本発明の前記ならびにその他の目的と新規
な特徴は、本明細書の記述および添付図面から明らかに
なるであろう。The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.
【０００９】[0009]
【課題を解決するための手段】本願において開示される
発明のうち、代表的なものの概要を簡単に説明すれば、
以下のとおりである。Among the inventions disclosed in the present application, a brief description will be given to the outline of typical ones.
It is as follows.
【００１０】すなわち、本願の請求項１記載の発明は、
複数の柱状の放熱部材の端部が、板状の放熱部材の上面
部に固定された放熱手段を備え、複数の柱状の放熱部材
の長さが、少なくとも２種類以上の組み合わせよりなる
ものである。That is, the invention according to claim 1 of the present application is
The end portions of the plurality of columnar heat dissipation members are provided with heat dissipation means fixed to the upper surface portion of the plate-shaped heat dissipation member, and the lengths of the plurality of columnar heat dissipation members are a combination of at least two types. .
【００１１】また、本願の請求項２記載の発明は、柱状
の第１の放熱部材を所定の間隔で板状の放熱部材の上面
部に固定し、第１の放熱部材よりも長い柱状の第２の放
熱部材を、第１の放熱部材の間のスペースに固定させる
ものである。According to a second aspect of the present invention, the columnar first heat radiating member is fixed to the upper surface of the plate-shaped heat radiating member at a predetermined interval, and the columnar first heat radiating member is longer than the first heat radiating member. The second heat dissipation member is fixed in the space between the first heat dissipation members.
【００１２】さらに、本願の請求項３記載の発明は、所
定の数を束ねた柱状の放熱部材の一端を、板状の放熱部
材の上面部に固定し、柱状の放熱部材の自由端を放射状
に広げるものである。Further, in the invention according to claim 3 of the present application, one end of a columnar heat radiating member which bundles a predetermined number is fixed to the upper surface of the plate-like heat radiating member, and the free end of the columnar heat radiating member is radially formed. It is to spread
【００１３】また、本願の請求項４記載の発明は、板状
の放熱部材の上面部に、柱状の放熱部材を挿入するため
の穴を形成し、その穴に複数の柱状の放熱部材を挿入
し、穴の外周部近傍を加圧することにより、柱状の放熱
部材を圧着固定した後に、柱状の放熱部材の自由端を放
射状に広げるものである。According to a fourth aspect of the present invention, a hole for inserting a columnar heat dissipation member is formed in the upper surface of the plate-shaped heat dissipation member, and a plurality of columnar heat dissipation members are inserted into the holes. Then, the columnar heat dissipation member is pressure-bonded and fixed by pressing the vicinity of the outer peripheral portion of the hole, and then the free end of the columnar heat dissipation member is radially expanded.
【００１４】[0014]
【作用】上記のような構成の放熱装置によれば、放熱装
置の成形時にフィンが折れてしまったり、金型が詰まっ
てしまい柱状の放熱部材が所定の形にならなかったりす
ることがなくなり、柱状の放熱部材を容易に、効率よく
垂直に固定することができる。According to the heat dissipating device having the above-described structure, the fins will not be broken when the heat dissipating device is molded, and the mold will not be clogged to prevent the columnar heat dissipating member from having a predetermined shape. The columnar heat dissipation member can be easily and efficiently fixed vertically.
【００１５】その結果、放熱装置の熱拡散効率が良くな
り、生産効率が向上し、コストも低くすることができ
る。As a result, the heat diffusion efficiency of the heat dissipation device is improved, the production efficiency is improved, and the cost can be reduced.
【００１６】[0016]
【実施例】以下、本発明の実施例を図面に基づいて詳細
に説明する。Embodiments of the present invention will now be described in detail with reference to the drawings.
【００１７】（実施例１）図１は、本発明の実施例１に
よる放熱装置が設けられた半導体装置の断面図、図２
は、本発明の実施例１による放熱装置の平面図である。(Embodiment 1) FIG. 1 is a sectional view of a semiconductor device provided with a heat dissipation device according to Embodiment 1 of the present invention, and FIG.
FIG. 3 is a plan view of the heat dissipation device according to the first embodiment of the present invention.
【００１８】本実施例１において、半導体装置のパッケ
ージ１は、ピングリッドアレイ形のの構造であり、該パ
ッケージ１に軸方向に多数のリードピン２が配設されて
いる。In the first embodiment, the semiconductor device package 1 has a pin grid array type structure, and a large number of lead pins 2 are arranged in the package 1 in the axial direction.
【００１９】また、パッケージ１の中央部には、半導体
素子である半導体チップ３が位置しており、パッケージ
１の導電部と半導体チップ３の導電部とは、ワイヤ４で
電気的に接続されている。さらに、該パッケージ１の導
電部は、リードピン２に電気的に導通されている。A semiconductor chip 3 which is a semiconductor element is located in the center of the package 1, and the conductive portion of the package 1 and the conductive portion of the semiconductor chip 3 are electrically connected by a wire 4. There is. Further, the conductive portion of the package 1 is electrically connected to the lead pin 2.
【００２０】パッケージ１の下部は、キャップ５によっ
て封止されており、また、半導体チップ３上面には、放
熱用のアルミニウムや銅等によって形成された熱拡散板
（板状の放熱部材）６−２が、接着剤７によって固定さ
れている。The lower portion of the package 1 is sealed with a cap 5, and the upper surface of the semiconductor chip 3 has a heat diffusion plate (plate-shaped heat dissipation member) 6-made of aluminum or copper for heat dissipation. 2 is fixed by an adhesive 7.
【００２１】熱拡散板６−２には、放熱板６−１として
アルミニウムや銅等によって形成されたスペーサ用であ
る柱状の金属ワイヤ（第２の放熱部材）８およびピンフ
ィンである柱状の金属ワイヤ（第１の放熱部材）９が、
ロウ材１０によって固定されている。The heat diffusion plate 6-2 includes a columnar metal wire (second heat radiation member) 8 for spacers formed of aluminum, copper or the like as the heat radiation plate 6-1 and a columnar metal wire serving as a pin fin. (First heat dissipation member) 9
It is fixed by the brazing material 10.
【００２２】放熱板６−１および熱拡散板６−２は、シ
ート状の高熱伝導材１２を介して圧接、あるいは固着さ
れている。The heat radiating plate 6-1 and the heat diffusing plate 6-2 are pressed against each other or fixed to each other via a sheet-shaped high thermal conductive material 12.
【００２３】前記放熱板６−１上への金属ワイヤ９の取
り付けは、まず、スペーサ用の金属ワイヤ８を所定の間
隔でロウ材１０によって固定する。次に、金属ワイヤ８
間のスペースに、金属ワイヤ９を固定する。すなわち、
金属ワイヤ８が、スペーサとして金属ワイヤ９間に介在
することによって、金属ワイヤ９が直立するためのガイ
ドとなり、垂直に固定することができる。In mounting the metal wire 9 on the heat dissipation plate 6-1, first, the metal wire 8 for spacers is fixed with the brazing material 10 at a predetermined interval. Next, metal wire 8
The metal wire 9 is fixed in the space therebetween. That is,
By interposing the metal wire 8 between the metal wires 9 as a spacer, it serves as a guide for the metal wire 9 to stand upright, and can be fixed vertically.
【００２４】よって、図２に示すように、金属ワイヤ８
と金属ワイヤ９とは、千鳥配列となって配設され、近傍
の金属ワイヤ９どうしが互いに接触することを防止する
ようになっている。なお、図２の金属ワイヤ８のハッチ
ングは、金属ワイヤ９との区別を行うためのものであ
る。Therefore, as shown in FIG.
The metal wires 9 and the metal wires 9 are arranged in a staggered arrangement so as to prevent adjacent metal wires 9 from contacting each other. The hatching of the metal wire 8 in FIG. 2 is for distinguishing from the metal wire 9.
【００２５】次に、本実施例における作用について説明
する。Next, the operation of this embodiment will be described.
【００２６】半導体チップ３からの発熱が、熱拡散板６
−２を通して金属ワイヤ９に伝えられる。そして、金属
ワイヤ８が介設していることおよび千鳥配列であること
によって、近傍の金属ワイヤ９どうしは互いに接触する
ことなく、充分なピン間隔が確保されるので放熱効率が
良くなる。The heat generated from the semiconductor chip 3 is generated by the heat diffusion plate 6
-2 to the metal wire 9. The interposition of the metal wires 8 and the staggered arrangement ensure a sufficient pin interval without the adjacent metal wires 9 coming into contact with each other, thereby improving heat dissipation efficiency.
【００２７】それにより、本実施例１によれば、放熱効
率の良いピンフィン形の放熱装置を低コストで、容易に
製造することができる。As a result, according to the first embodiment, it is possible to easily manufacture a pin-fin type heat dissipation device with good heat dissipation efficiency at low cost.
【００２８】また、金属ワイヤ８を介在させることによ
って、容易に効率よく、均一に金属ワイヤ９を直立させ
て固定することができる。Also, by interposing the metal wire 8, the metal wire 9 can be fixed upright and easily and efficiently.
【００２９】（実施例２）図３は、本発明の実施例２に
よる放熱装置の断面図である。(Second Embodiment) FIG. 3 is a sectional view of a heat dissipation device according to a second embodiment of the present invention.
【００３０】本実施例２においては、放熱用のアルミニ
ウムや銅等によって形成された放熱板６−１に、所定の
数の金属ワイヤ９を束ねた一端部をロウ材１０により固
定したものである。In the second embodiment, one end of a bundle of a predetermined number of metal wires 9 is fixed by a brazing material 10 to a heat radiating plate 6-1 formed of aluminum or copper for heat radiation. .
【００３１】そして、金属ワイヤ９の自由端部を放射状
に傾かせることにより、それぞれの金属ワイヤの接触を
防止し、放熱面積を大きくさせる。The free ends of the metal wires 9 are tilted radially to prevent the metal wires from contacting with each other and to increase the heat radiation area.
【００３２】それにより、本実施例２によれば、放熱効
率の良いピンフィン形の放熱装置をさらに低コストで、
容易に製造することができる。As a result, according to the second embodiment, the pin fin type heat dissipation device having good heat dissipation efficiency can be manufactured at a lower cost.
It can be easily manufactured.
【００３３】また、金属ワイヤ９を束ねてロウ材１０に
よって固定させるので、容易に効率よく、均一に金属ワ
イヤ９を直立させて固定することができる。Further, since the metal wires 9 are bundled and fixed by the brazing material 10, the metal wires 9 can be fixed upright and easily and efficiently.
【００３４】（実施例３）図４は、本発明の実施例３に
よる放熱装置の要部の断面図である。(Embodiment 3) FIG. 4 is a sectional view of the essential parts of a heat dissipation device according to Embodiment 3 of the present invention.
【００３５】本実施例２においては、アルミニウムや銅
等によって形成された放熱板６−１に、金属ワイヤ挿入
用の穴６ａを設ける。次に、この穴６ａに所定の数が束
ねられた金属ワイヤ９を挿入する。In the second embodiment, the heat dissipation plate 6-1 made of aluminum or copper is provided with a hole 6a for inserting a metal wire. Next, a predetermined number of bundled metal wires 9 are inserted into the holes 6a.
【００３６】そして、穴６ａの外周部６ｂを圧着手段に
よって加圧し、穴６ａの口径を小さくして金属ワイヤ９
を圧着固定する。その後、金属ワイヤ９の自由端部を放
射状に傾かせることにより、それぞれの金属ワイヤ９の
接触を防止し、放熱面積を大きくさせる。Then, the outer peripheral portion 6b of the hole 6a is pressed by the crimping means to reduce the diameter of the hole 6a and the metal wire 9
Crimp and fix. After that, the free ends of the metal wires 9 are tilted radially to prevent contact between the respective metal wires 9 and increase the heat radiation area.
【００３７】それにより、本実施例３においても、放熱
効率の良いピンフィン形の放熱装置をさらに低コスト
で、容易に製造することができる。As a result, also in the third embodiment, it is possible to easily manufacture the pin-fin type heat dissipation device with good heat dissipation efficiency at a lower cost.
【００３８】また、穴６ａに挿入する金属ワイヤ９の数
や穴６ａの数を変化させることにより、冷却効率を任意
にコントロールすることができる。The cooling efficiency can be arbitrarily controlled by changing the number of metal wires 9 inserted into the holes 6a and the number of holes 6a.
【００３９】さらに、金属ワイヤ９を束ねて、放熱板６
−１に圧着固定させるので、容易に効率よく、均一に金
属ワイヤ９を直立させて固定することができる。Further, the metal wires 9 are bundled to form the heat sink 6
Since it is crimped and fixed to -1, the metal wire 9 can be easily and efficiently and uniformly fixed upright.
【００４０】以上、本発明者によってなされた発明を実
施例に基づき説明したが、本発明は前記実施例に限定さ
れるものでなく、その要旨を逸脱しない範囲で種々変更
可能であることはいうまでもない。The invention made by the present inventor has been described above based on the embodiments. However, the present invention is not limited to the above embodiments, and various modifications can be made without departing from the scope of the invention. There is no end.
【００４１】たとえば、金属ワイヤ９は、前記実施例
１、２および３のように均一に配列しなくても良く、図
５に示すように、気体または液体の冷媒を放熱板６−１
の中心に対して垂直に供給するインピンジメント冷却で
は、冷媒供給用の供給ノズル１１付近の冷媒が直接当た
る部分の放熱板６−１上に金属ワイヤ９を密集させ、そ
の他の部分には、金属ワイヤ９を粗に配設してもよい。For example, the metal wires 9 do not have to be arranged uniformly as in the first, second and third embodiments, and as shown in FIG. 5, a gas or liquid refrigerant is used as the heat sink 6-1.
In the impingement cooling which is supplied perpendicularly to the center of the metal wire 9, the metal wire 9 is densely packed on the heat dissipation plate 6-1 in the portion in the vicinity of the supply nozzle 11 for supplying the refrigerant, which is directly contacted by the refrigerant, and in the other portion, the metal wire 9 is formed. The wires 9 may be arranged roughly.
【００４２】また、図６に示すように、側面からの強制
空冷の場合では、冷媒供給側の側面から中心部にかけて
金属ワイヤ９を粗に配設させ、その他の部分を密集させ
て配設することにより、中心部の金属ワイヤ９の粗部分
と密集部分との境界部分で乱気流が発生し、冷却効率を
向上させることもできる。Further, as shown in FIG. 6, in the case of forced air cooling from the side surface, the metal wire 9 is roughly arranged from the side surface on the refrigerant supply side to the central portion, and the other portions are densely arranged. As a result, a turbulent air flow is generated at the boundary between the rough portion and the dense portion of the metal wire 9 in the central portion, and the cooling efficiency can be improved.
【００４３】さらに、金属ワイヤ９の固定は、放熱板６
−１上の穴６ａに所定の数の金属ワイヤ９を挿入し、前
記穴６ａにロウ材１０等を流し込むことによって、金属
ワイヤ９を固定しても良い。Further, the metal wire 9 is fixed by fixing the heat radiation plate 6
The metal wire 9 may be fixed by inserting a predetermined number of metal wires 9 into the hole 6a on the -1 and pouring the brazing material 10 or the like into the hole 6a.
【００４４】また、金属ワイヤ９の固定は、前記実施例
１、２および３を組み合わせて固定するようにしても良
い。The metal wire 9 may be fixed by combining the first, second and third embodiments.
【００４５】[0045]
【発明の効果】本発明によって開示される発明のうち、
代表的なものによって得られる効果を簡単に説明すれ
ば、以下のとおりである。Of the inventions disclosed by the present invention,
The following is a brief description of the effects obtained by the typical ones.
【００４６】（１）本発明によれば、放熱用の金属ワイ
ヤを容易に効率よく直立させることができる。(1) According to the present invention, the metal wire for heat dissipation can be erected easily and efficiently.
【００４７】（２）また、上記（１）により、本発明で
は、生産効率が向上し、コストを低くすることができ
る。(2) Further, according to the above (1), the production efficiency can be improved and the cost can be reduced in the present invention.
【図１】本発明の実施例１による放熱装置が設けられた
半導体装置の断面図である。FIG. 1 is a sectional view of a semiconductor device provided with a heat dissipation device according to a first embodiment of the present invention.
【図２】本発明の実施例１による放熱装置の平面図であ
る。FIG. 2 is a plan view of the heat dissipation device according to the first embodiment of the present invention.
【図３】本発明の実施例２による放熱装置の断面図であ
る。FIG. 3 is a sectional view of a heat dissipation device according to a second embodiment of the present invention.
【図４】本発明の実施例３による放熱装置の要部の断面
図である。FIG. 4 is a sectional view of a main part of a heat dissipation device according to a third embodiment of the present invention.
【図５】本発明の他の実施例による放熱装置の概略側面
図である。FIG. 5 is a schematic side view of a heat dissipation device according to another embodiment of the present invention.
【図６】本発明の他の実施例による放熱装置の平面図で
ある。FIG. 6 is a plan view of a heat dissipation device according to another embodiment of the present invention.
１ パッケージ ２ リードピン ３ 半導体チップ ４ ワイヤ ５ キャップ ６−１ 放熱板 ６−２ 熱拡散板（板状の放熱部材） ６ａ 穴 ６ｂ 外周部 ７ 接着剤 ８ 金属ワイヤ（第２の放熱部材） ９ 金属ワイヤ（第１の放熱部材） １０ ロウ材 １１ 供給ノズル １２ 高熱伝導材 DESCRIPTION OF SYMBOLS 1 package 2 lead pin 3 semiconductor chip 4 wire 5 cap 6-1 heat sink 6-2 heat diffusion plate (plate-shaped heat dissipation member) 6a hole 6b outer peripheral portion 7 adhesive agent 8 metal wire (second heat dissipation member) 9 metal wire (First heat dissipation member) 10 brazing material 11 supply nozzle 12 high thermal conductivity material
フロントページの続き (72)発明者 坪井 敏宏 東京都小平市上水本町５丁目20番１号 日 立超エル・エス・アイ・エンジニアリング 株式会社内 (72)発明者 舘 宏 東京都小平市上水本町５丁目20番１号 日 立超エル・エス・アイ・エンジニアリング 株式会社内 (72)発明者 尾▲ざき▼ 弘 東京都小平市上水本町５丁目20番１号 日 立超エル・エス・アイ・エンジニアリング 株式会社内 (72)発明者 菊池 真之 東京都小平市上水本町５丁目20番１号 日 立超エル・エス・アイ・エンジニアリング 株式会社内 (72)発明者 菊地 哲慈 東京都小平市上水本町５丁目20番１号 日 立超エル・エス・アイ・エンジニアリング 株式会社内 (72)発明者 小作 浩 東京都小平市上水本町５丁目20番１号 日 立超エル・エス・アイ・エンジニアリング 株式会社内 (72)発明者 大塚 寛治 東京都青梅市今井2326番地 株式会社日立 製作所デバイス開発センタ内Front page continuation (72) Toshihiro Tsuboi, Toshihiro Tsuboi, 5-20-1, Josuihonmachi, Kodaira-shi, Tokyo Inside Hitsuritsu Cho-LS Engineering Co., Ltd. (72) Inventor, Hiroshi Tachi, Kodaira-shi, Tokyo 5-20-1 Honmachi Hitsuritsu Super L.S.I Engineering Co., Ltd. (72) Inventor Ou Zaki ▼ Hiro 5-20-1 Kamimizuhoncho, Kodaira-shi, Tokyo Hiritsu Super L.S. I Engineering Co., Ltd. (72) Inventor Masayuki Kikuchi 5-20-1 Kamimizuhonmachi, Kodaira-shi, Tokyo Hiritsu Cho-LS Engineering Co., Ltd. (72) Inventor Tetsuji Kikuchi Tokyo 5-20-1 Kamimizuhoncho, Kodaira-shi Hitsuryu SLS Engineering Co., Ltd. (72) Inventor Hiroshi Kosaku 5-20-1 Kamimizuhoncho, Kodaira-shi, Tokyo Hiritsucho L-S・ I Engineering Co., Ltd. (72) Inventor Kanji Otsuka Kyoto Ome Imai 2326 address Hitachi Seisakusho device within the development center
Claims (4)
放熱部材の上面部に固定された放熱手段を備え、前記複
数の柱状の放熱部材の長さが、少なくとも２種類以上の
組み合わせよりなることを特徴とする半導体装置。1. The end portions of the plurality of columnar heat dissipation members are provided with heat dissipation means fixed to the upper surface of the plate-shaped heat dissipation member, and the lengths of the plurality of columnar heat dissipation members are at least two types. A semiconductor device comprising a combination.
状の放熱部材の上面部に固定し、前記第１の放熱部材よ
りも長い柱状の第２の放熱部材を、前記第１の放熱部材
の間のスペースに固定させることを特徴とする放熱装置
の製造方法。2. A columnar first heat radiating member is fixed to the upper surface of a plate-shaped heat radiating member at predetermined intervals, and a columnar second heat radiating member longer than the first heat radiating member is attached to the first radiant member. A method for manufacturing a heat dissipation device, characterized in that the heat dissipation device is fixed in a space between the heat dissipation members.
を、板状の放熱部材の上面部に固定し、前記柱状の放熱
部材の自由端を放射状に広げることを特徴とする放熱装
置の製造方法。3. A heat dissipation device, characterized in that one end of a columnar heat dissipation member that bundles a predetermined number is fixed to the upper surface of a plate-shaped heat dissipation member, and the free end of the columnar heat dissipation member is radially expanded. Manufacturing method.
部材を挿入するための穴を形成し、前記穴に複数の前記
柱状の放熱部材を挿入し、前記穴の外周部近傍を加圧す
ることにより、前記柱状の放熱部材を圧着固定し、前記
柱状の放熱部材の自由端を放射状に広げることを特徴と
する放熱装置の製造方法。4. A hole for inserting a columnar heat dissipation member is formed in an upper surface portion of a plate-shaped heat dissipation member, a plurality of the columnar heat dissipation members are inserted into the holes, and a vicinity of an outer peripheral portion of the hole is formed. A method for manufacturing a heat dissipation device, characterized in that the columnar heat dissipation member is pressure-bonded and fixed by applying pressure, and the free end of the columnar heat dissipation member is radially expanded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5191142A JPH0745757A (en) | 1993-08-02 | 1993-08-02 | Semiconductor device and manufacture of heat dissipating device thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5191142A JPH0745757A (en) | 1993-08-02 | 1993-08-02 | Semiconductor device and manufacture of heat dissipating device thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0745757A true JPH0745757A (en) | 1995-02-14 |
Family
ID=16269595
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5191142A Withdrawn JPH0745757A (en) | 1993-08-02 | 1993-08-02 | Semiconductor device and manufacture of heat dissipating device thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0745757A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103367273A (en) * | 2013-07-16 | 2013-10-23 | 株洲智热技术有限公司 | Method for manufacturing high-heating-flux radiating fin type radiator and radiator thereof |
| JP2018032744A (en) * | 2016-08-24 | 2018-03-01 | トヨタ自動車株式会社 | Semiconductor device |
-
1993
- 1993-08-02 JP JP5191142A patent/JPH0745757A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103367273A (en) * | 2013-07-16 | 2013-10-23 | 株洲智热技术有限公司 | Method for manufacturing high-heating-flux radiating fin type radiator and radiator thereof |
| JP2018032744A (en) * | 2016-08-24 | 2018-03-01 | トヨタ自動車株式会社 | Semiconductor device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20001003 |