JPH0738287A - Electronic component supplying device - Google Patents
Electronic component supplying deviceInfo
- Publication number
- JPH0738287A JPH0738287A JP5179001A JP17900193A JPH0738287A JP H0738287 A JPH0738287 A JP H0738287A JP 5179001 A JP5179001 A JP 5179001A JP 17900193 A JP17900193 A JP 17900193A JP H0738287 A JPH0738287 A JP H0738287A
- Authority
- JP
- Japan
- Prior art keywords
- tray
- electronic component
- magazine
- base material
- head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、コンパクトな構成にな
し得る電子部品供給装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component supply device which can be made compact.
【０００２】[0002]
【従来の技術】チップマウンタなどの電子部品実装装置
に、電子部品を供給する装置として、トレイが載置され
たベース材をマガジンに多段に収納し、このマガジンか
ら所望のトレイを載置するベース材を引き出し、このト
レイから電子部品を取出して、電子部品実装装置へ受渡
すものが多用されている。2. Description of the Related Art As a device for supplying electronic components to an electronic component mounting device such as a chip mounter, a base on which trays are placed is stored in a magazine in multiple stages, and a desired tray is placed from the magazine. It is often used to pull out a material, take out an electronic component from this tray, and deliver it to an electronic component mounting apparatus.
【０００３】さてトレイには、電子部品がマトリックス
状に収納されており、従来の電子部品供給装置では、部
品を取出す取出ヘッドがＸＹ方向へ移動して、トレイの
所定ポケットから必要な電子部品を取出すようになって
いた。Electronic components are stored in a matrix in the tray. In the conventional electronic component supply apparatus, the take-out head for taking out the components moves in the XY directions, and the required electronic components are taken out from the predetermined pockets of the tray. It was supposed to be taken out.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、このよ
うな構成では、取出ヘッドのための２方向の移動手段
と、マガジンからベース材を引き出すための移動手段と
を必須のものとし、移動手段が多く、構造が複雑で移動
手段のための移動空間を確保するため規模が大きくなら
ざるを得ず、またコスト高となるという問題点があっ
た。However, in such a structure, the moving means for the take-out head in two directions and the moving means for pulling out the base material from the magazine are indispensable, and many moving means are required. However, there is a problem that the structure is complicated and the scale is inevitably increased to secure a moving space for the moving means, and the cost is increased.
【０００５】そこで本発明は、コンパクトでかつ安価に
構成できる電子部品供給装置を提供することを目的とす
る。Therefore, an object of the present invention is to provide an electronic component supply device which is compact and can be constructed at low cost.
【０００６】[0006]
【課題を解決するための手段】本発明の電子部品供給装
置は、電子部品を収納するトレイが載置されるベース材
と、このベース材上のトレイから電子部品を取り出して
電子部品実装装置へ受渡す取出ヘッドと、ベース材を収
納するマガジンと、マガジンから取出ヘッドの直下に取
出すべき電子部品が位置するようにベース材を引き出す
引出手段とを有するものである。According to the present invention, there is provided an electronic component supply apparatus, wherein a base material on which a tray for storing electronic components is placed, and an electronic component is taken out from the tray on the base material to an electronic component mounting apparatus. The delivery head has a delivery head, a magazine for accommodating the base material, and withdrawing means for withdrawing the base material from the magazine so that electronic components to be taken out are located directly below the ejection head.
【０００７】[0007]
【作用】上記構成により、引出手段に、トレイと取出ヘ
ッドとの相対的移動手段としての役割を兼任させること
ができ、移動手段を減らしてコンパクト化及びコストダ
ウンを図ることができる。With the above construction, the pulling-out means can also serve as the relative moving means for the tray and the take-out head, and the moving means can be reduced to achieve compactness and cost reduction.
【０００８】[0008]
【実施例】次に、図面を参照しながら本発明の実施例を
説明する。Embodiments of the present invention will now be described with reference to the drawings.
【０００９】図１は本発明の一実施例に係る電子部品供
給装置の斜視図である。図１中、１は本体ボックス、２
は本体ボックス１内においてＺ方向昇降自在に支持され
るマガジン、３は本体ボックス１に垂直に軸支される送
りねじ、４はマガジン２の側部に連結されると共に、送
りねじ３に螺合する送りナット部、５は送りねじ３を駆
動するＺモータである。また、マガジン２には、電子部
品をマトリックス状に収納するトレイ７が積層状態で載
置されたベース材６が、上下方向に多段に収納されてい
る。FIG. 1 is a perspective view of an electronic component supply apparatus according to an embodiment of the present invention. In FIG. 1, 1 is a main body box, 2
Is a magazine supported in the main body box 1 so as to be vertically movable in the Z direction, 3 is a feed screw vertically supported by the main body box 1, 4 is connected to a side portion of the magazine 2, and is screwed to the feed screw 3. The feed nuts 5 and 5 are Z motors for driving the feed screw 3. Further, in the magazine 2, base materials 6 on which trays 7 for accommodating electronic components in a matrix are placed in a stacked state are accommodated in a vertical direction in multiple stages.
【００１０】８は本体ボックス１の前部に設けられるト
レイの回収ボックスであり、図１Ａ−Ａ線矢視図である
図２に示すように、この回収ボックス８の側部には、ベ
ース材６の引出手段としてのＸ方向の送りねじ９、この
送りねじ９を駆動するＸモータ１０、送りねじ９に螺合
する送りナット部１１、送りナット部１１に連結されて
Ｙ方向に延びるアーム１２及びこのアーム１２の先端部
にベース材６の挟着爪１３（Ｘ方向を向く）が、それぞ
れ設けられている。なお挟着爪１３は、アーム１２に内
蔵されるシリンダ（図示せず）により開閉する。Reference numeral 8 denotes a tray recovery box provided in the front part of the main body box 1. As shown in FIG. 2 which is a view taken along the line AA of FIG. 6, an X-direction feed screw 9 as a pull-out means, an X motor 10 for driving the feed screw 9, a feed nut portion 11 screwed to the feed screw 9, and an arm 12 connected to the feed nut portion 11 and extending in the Y direction. Further, a sandwiching claw 13 (facing the X direction) of the base material 6 is provided at the tip of the arm 12. The sandwiching claw 13 is opened and closed by a cylinder (not shown) built in the arm 12.
【００１１】ここで、Ｚモータ５を駆動して、マガジン
２を昇降させることにより、マカジン２に多段に収納さ
れたベース材６のうち、電子部品を取出すべきトレイ７
を載置したベース材６を挟着爪１３が位置する高さへ移
動させることができ、このベース材６の縁部を挟着爪１
３で挟着して、Ｘモータ１０を駆動すると、図１または
図２に示すようにマガジン２から引き出すことができ
る。なお図示の例では、ベース材６に複数枚のトレイ７
を載置しているが、ベース材６に１枚のトレイ７を載置
してもよい。Here, by driving the Z motor 5 to move the magazine 2 up and down, the tray 7 from which the electronic parts are to be taken out of the base material 6 stored in the makajin 2 in multiple stages.
The base material 6 on which is mounted can be moved to a height at which the sandwiching claw 13 is positioned, and the edge portion of the base material 6 can be moved to the sandwiching claw 1
When sandwiched by 3, and the X motor 10 is driven, it can be pulled out from the magazine 2 as shown in FIG. 1 or 2. In the illustrated example, the base material 6 has a plurality of trays 7
However, one tray 7 may be placed on the base material 6.
【００１２】さて図１中、Ｈは本手段の電子部品供給装
置の脇に設置される電子部品実装装置の移載ヘッドであ
り、Ｎはそのノズルである。ここで、取出ヘッド１８は
Ｙ方向にのみ移動すればよいようになっている。また、
Ｃは電子部品実装装置のコンベアであり、このコンベア
Ｃは基板ＤをＸ方向に搬送するものである。In FIG. 1, H is a transfer head of an electronic component mounting apparatus installed beside the electronic component supply apparatus of this means, and N is its nozzle. Here, the take-out head 18 needs to move only in the Y direction. Also,
C is a conveyor of the electronic component mounting apparatus, and this conveyor C conveys the substrate D in the X direction.
【００１３】さらに本手段の電子部品供給装置におい
て、１４は回収ボックス８の上部にＹ方向に沿って、し
かもＸＺ方向に不動に設けられるＹ軸アームである。こ
のＹ軸アーム１４には、図２に示すように、Ｙ方向の送
りねじ１５、この送りねじ１５に螺合する送りナット部
１６及び送りねじ１５を駆動するＹモータ１７が設けら
れており、１８は送りナット部１６のマガジン２に対面
する側面に連結され、上述のように引き出されたベース
材６上のトレイ７から電子部品を取出す取出ヘッドであ
り、この取出ヘッド１８の下部には、図１に示すよう
に、ＳＯＰやＱＦＰなどの微細なリードを有する電子部
品を吸着する第１ノズル１９と、異形部品などを吸着す
る第２ノズル２０とが装着され、第１ノズル１９及び第
２ノズル２０は取出ヘッド１８内の駆動手段により昇降
動作を行うようになっている。また、２１は電子部品の
品種に応じて交換されるべきノズルや予備のノズルなど
を収納するノズルホルダであり、２２は異形部品などを
位置決め爪などで位置ずれ修正を行う部品の位置決めユ
ニット、２３はＳＯＰやＱＦＰなどの微細なリードを有
する電子部品の位置や姿勢などを観察するカメラが内蔵
されたカメラステージである。ここで、第１ノズル１９
と第２ノズル２０、部品位置決めユニット２２とカメラ
ステージ２３は、部品の品種により使い分けられるもの
であり、例えばＱＦＰを取り出す際には、Ｙモータ１７
を駆動して取出ヘッド１８の第１ノズル１９でトレイ７
からＱＦＰをピックアップし、Ｙモータ１７を駆動して
ピックアップしたＱＦＰをカメラステージ２３へ載置す
る。すると、移載ヘッドＨのノズルＮが、矢印Ｎ１で示
すようにカメラステージ２３からＱＦＰをピックアップ
し、カメラステージ２３における観察結果を反映して所
要修正を行った上で、基板ＤへＱＦＰを搭載する。一
方、異形部品を取出す際には、第２ノズル２０が上記と
同様にピックアップした異形部品を部品位置決めユニッ
ト２２へ載置する。そして、部品位置決めユニット２２
が位置修正した後、移載ヘッドＨが矢印Ｎ２で示すよう
に、搭載動作を行うものである。なお、２４はＹ軸アー
ム１４の取出ヘッド１８の反対側に固定されるトレイ回
収ヘッド、２５はトレイ回収ノズルであり、トレイ回収
ヘッド内の駆動手段により昇降動作をする。Further, in the electronic component supplying apparatus of the present means, 14 is a Y-axis arm which is fixedly provided in the upper part of the recovery box 8 along the Y direction and in the XZ direction. As shown in FIG. 2, the Y-axis arm 14 is provided with a Y-direction feed screw 15, a feed nut portion 16 screwed to the feed screw 15, and a Y motor 17 for driving the feed screw 15. Reference numeral 18 denotes a take-out head which is connected to a side surface of the feed nut portion 16 facing the magazine 2 and takes out electronic components from the tray 7 on the base material 6 pulled out as described above. As shown in FIG. 1, a first nozzle 19 for adsorbing an electronic component having a fine lead such as SOP or QFP and a second nozzle 20 for adsorbing a deformed component are mounted, and the first nozzle 19 and the second nozzle 19 are attached. The nozzle 20 is adapted to be moved up and down by the driving means in the take-out head 18. Reference numeral 21 is a nozzle holder for accommodating nozzles or spare nozzles that should be replaced according to the type of electronic component, 22 is a component positioning unit for correcting misalignment of a deformed component, etc. with a positioning claw, and 23. Is a camera stage with a built-in camera for observing the position, orientation, etc. of electronic components having fine leads such as SOP and QFP. Here, the first nozzle 19
The second nozzle 20, the component positioning unit 22, and the camera stage 23 are used properly according to the type of component. For example, when the QFP is taken out, the Y motor 17 is used.
Drive the tray 7 with the first nozzle 19 of the take-out head 18.
To pick up the QFP and drive the Y motor 17 to place the picked up QFP on the camera stage 23. Then, the nozzle N of the transfer head H picks up the QFP from the camera stage 23 as shown by the arrow N1, makes a necessary correction by reflecting the observation result on the camera stage 23, and then mounts the QFP on the substrate D. To do. On the other hand, when taking out the irregularly shaped component, the irregularly shaped component picked up by the second nozzle 20 in the same manner as described above is placed on the component positioning unit 22. Then, the component positioning unit 22
After the position is corrected, the transfer head H performs the mounting operation as shown by the arrow N2. Incidentally, 24 is a tray collecting head fixed to the opposite side of the take-out head 18 of the Y-axis arm 14, and 25 is a tray collecting nozzle, which is moved up and down by a driving means in the tray collecting head.
【００１４】ここで、図２に示すように、本実施例の電
子部品供給装置では、移動線Ｌ上を、取出ヘッド１８の
第１ノズル１９、第２ノズル２０が移動し、しかもノズ
ルホルダ２１、部品位置決めユニット２２及びカメラス
テージ２３がこの移動線Ｌ上に配設されている。また、
ベース材６の引出手段としての挟着爪１３、Ｘモータ１
０はトレイ７のうち取出すべき電子部品Ｐを収納するポ
ケット７ａ（図２参照）がこの移動線Ｌ上に位置するよ
うに、ベース材６を引き出すものである。このように、
ベース材６の引出手段に取出ヘッド１８に対する相対的
なＸ方向の移動手段としての役割を兼務させ、取出ヘッ
ド１８の移動線Ｌ上に、ノズルホルダ２１、部品位置決
めユニット２２、カメラステージ２３を配置したことに
より、移動軸を減少させることができるので、コストダ
ウンとコンパクト化を一度に達成できるものである。Here, as shown in FIG. 2, in the electronic component supply apparatus of this embodiment, the first nozzle 19 and the second nozzle 20 of the take-out head 18 move along the moving line L, and the nozzle holder 21 also. The component positioning unit 22 and the camera stage 23 are arranged on the moving line L. Also,
Clamp 13 for pulling out base material 6, X motor 1
Reference numeral 0 indicates that the base member 6 is pulled out so that the pocket 7a (see FIG. 2) for storing the electronic component P to be taken out of the tray 7 is located on the moving line L. in this way,
The nozzle holder 21, the component positioning unit 22, and the camera stage 23 are arranged on the moving line L of the take-out head 18 by making the pull-out means of the base material 6 also serve as a moving means in the X direction relative to the take-out head 18. By doing so, the number of movement axes can be reduced, so that cost reduction and compactness can be achieved at the same time.
【００１５】本実施例の電子部品供給装置は上記のよう
な構成よりなり、次に図３を参照しながら、その動作を
説明する。The electronic component supply apparatus of this embodiment has the above-mentioned structure, and its operation will be described below with reference to FIG.
【００１６】まず図３（ａ）に示すように、挟着爪１３
でベース材６の縁部を挟着し、Ｘモータ１０を駆動し
て、ベース材６を矢印Ｎ３方向に移動して、上記移動線
Ｌの直下に、取出すべき電子部品Ｐを収納するトレイ７
ｘのポケットを合わせる。それと共に、Ｙモータ１７を
駆動して、取出ヘッド１８をＹ方向に移動し、このポケ
ットから第１ノズル１９により電子部品Ｐをピックアッ
プする。そして、上述のようにカメラステージ２３へ移
載し、移載ヘッドＨへ電子部品Ｐを受渡す。なお、異形
部品をピックアップする際には、上述のように第２ノズ
ル２０により部品位置決めユニット２２へ移載するが、
以下簡単のため、第１ノズル１９を用いる場合のみ説明
する。First, as shown in FIG. 3A, the sandwiching claw 13
The edge portion of the base material 6 is sandwiched by, and the X motor 10 is driven to move the base material 6 in the direction of the arrow N3, and the tray 7 for storing the electronic component P to be taken out is located immediately below the movement line L.
Match the x pocket. At the same time, the Y motor 17 is driven to move the ejection head 18 in the Y direction, and the electronic component P is picked up from this pocket by the first nozzle 19. Then, it is transferred to the camera stage 23 as described above, and the electronic component P is delivered to the transfer head H. When picking up the odd-shaped component, it is transferred to the component positioning unit 22 by the second nozzle 20 as described above.
For simplicity, only the case of using the first nozzle 19 will be described below.
【００１７】そして、図３（ａ）における最上段のトレ
イ７ｘからの電子部品の取出しを続けた結果、このトレ
イ７ｘの電子部品が品切れになったならば、図３（ｂ）
に示すように、挟着爪１３を矢印Ｎ４のように移動さ
せ、最上段のトレイ７ｘをトレイ回収ノズル２５により
吸着してピックアップして、最上段のトレイ７ｘを次段
のトレイ７ｙ以下から分離させる。If the electronic components on this tray 7x are out of stock as a result of continuing the taking-out of the electronic components from the uppermost tray 7x in FIG. 3 (a), FIG.
As shown in FIG. 5, the sandwiching claw 13 is moved as shown by an arrow N4, the uppermost tray 7x is adsorbed and picked up by the tray recovery nozzle 25, and the uppermost tray 7x is separated from the next tray 7y and below. Let
【００１８】次に図３（ｃ）で示すように、挟着爪１３
を矢印Ｎ５で示すように移動させて、ベース材６を全て
マガジン２内に収納する。そして、図３（ｄ）で示すよ
うにトレイ回収ノズル２５の吸着を解除することによ
り、使用済のトレイ７ｘを真下の回収ボックス８へ自由
落下させることにより、回収する。Next, as shown in FIG. 3 (c), the sandwiching claw 13
Is moved as indicated by an arrow N5, and all the base material 6 is stored in the magazine 2. Then, as shown in FIG. 3 (d), the suction of the tray recovery nozzle 25 is released, and the used tray 7x is freely dropped into the recovery box 8 directly below and recovered.
【００１９】次に、図３（ｅ）の矢印Ｎ６で示すよう
に、ベース材６を再び引き出して、新たに最上段に位置
することとなったトレイ７ｙから電子部品の取出しを行
うものである。Next, as shown by the arrow N6 in FIG. 3 (e), the base material 6 is pulled out again, and the electronic parts are taken out from the tray 7y which is to be newly located at the uppermost stage. .
【００２０】このように、本実施例では、回収ステージ
としての回収ボックス８の上方にトレイ回収ヘッド２４
を設け、回収ヘッド２４と回収ボックス８との中間位置
において、挟着爪１３などの引出手段により、ベース材
６を出入れし、ベース材６をマガジン２へ収納したうえ
で、トレイ回収ヘッド２４のトレイ回収ノズル２５がト
レイ７を解放し、単にトレイ７を自由落下させるだけの
動作により、トレイ７を極めて簡単に回収することがで
きる。なお回収ステージとしては、図示の回収ボックス
８の他、回収コンベアなど種々変更できる。As described above, in this embodiment, the tray collecting head 24 is provided above the collecting box 8 as the collecting stage.
Is provided, and at a middle position between the collection head 24 and the collection box 8, the base material 6 is put in and taken out by the pulling-out means such as the sandwiching claw 13 and the base material 6 is stored in the magazine 2, and then the tray collection head 24 The tray collecting nozzle 25 releases the tray 7 and simply drops the tray 7 so that the tray 7 can be collected very easily. The collection stage may be modified in various ways such as the collection box 8 shown in the figure and a collection conveyor.
【００２１】[0021]
【発明の効果】本発明は、上述のように構成したので、
移動手段を減らして、コンパクトで安価な電子部品供給
装置を提供できる。Since the present invention is configured as described above,
It is possible to provide a compact and inexpensive electronic component supply device by reducing the moving means.
【図１】本発明の一実施例に係る電子部品供給装置の斜
視図FIG. 1 is a perspective view of an electronic component supply device according to an embodiment of the present invention.
【図２】同図１Ａ−Ａ線矢視図FIG. 2 is a view taken along the line AA in FIG.
【図３】（ａ）本発明の一実施例に係る電子部品供給装
置の動作説明図 （ｂ）本発明の一実施例に係る電子部品供給装置の動作
説明図 （ｃ）本発明の一実施例に係る電子部品供給装置の動作
説明図 （ｄ）本発明の一実施例に係る電子部品供給装置の動作
説明図 （ｅ）本発明の一実施例に係る電子部品供給装置の動作
説明図FIG. 3A is an operation explanatory diagram of the electronic component supply device according to the embodiment of the present invention. FIG. 3B is an operation explanatory diagram of the electronic component supply device according to the embodiment of the present invention. Operation explanatory view of the electronic component supply apparatus according to the example (d) Operation explanatory view of the electronic component supply apparatus according to one embodiment of the present invention (e) Operation explanatory view of the electronic component supply apparatus according to one embodiment of the present invention
【符号の説明】 ２ マガジン ６ ベース材 ７ トレイ ８ 回収ボックス（回収ステージ） １０ Ｘモータ（引出手段） １３ 挟着爪（引出手段） １８ 取出ヘッド[Explanation of Codes] 2 Magazine 6 Base Material 7 Tray 8 Recovery Box (Recovery Stage) 10 X Motor (Drawout Means) 13 Clamping Claw (Drawout Means) 18 Extraction Head
Claims (2)
ース材と、このベース材上のトレイから電子部品を取り
出して電子部品実装装置へ受渡す取出ヘッドと、前記ベ
ース材を収納するマガジンと、前記マガジンから前記取
出ヘッドの直下に取出すべき電子部品が位置するように
ベース材を引き出す引出手段とを有することを特徴とす
る電子部品供給装置。1. A base material on which a tray for storing electronic components is placed, a take-out head for taking out electronic components from the tray on the base material and delivering them to an electronic component mounting apparatus, and a magazine for storing the base materials. And an withdrawing means for withdrawing the base material so that the electronic component to be extracted from the magazine is located directly below the extraction head.
収ステージの上方に配設されるトレイ回収ヘッドと、こ
の回収ステージとこのトレイ回収ヘッドとの中間高さに
おいて前記マガジンからベース材を引き出す引出手段と
を有することを特徴とする電子部品供給装置。2. A recovery stage for recovering a tray, a tray recovery head disposed above the recovery stage, and a drawer for withdrawing a base material from the magazine at an intermediate height between the recovery stage and the tray recovery head. An electronic component supply device comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP05179001A JP3119040B2 (en) | 1993-07-20 | 1993-07-20 | Electronic component supply device and electronic component supply method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP05179001A JP3119040B2 (en) | 1993-07-20 | 1993-07-20 | Electronic component supply device and electronic component supply method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0738287A true JPH0738287A (en) | 1995-02-07 |
| JP3119040B2 JP3119040B2 (en) | 2000-12-18 |
Family
ID=16058386
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP05179001A Expired - Lifetime JP3119040B2 (en) | 1993-07-20 | 1993-07-20 | Electronic component supply device and electronic component supply method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3119040B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0883333A2 (en) * | 1997-06-05 | 1998-12-09 | Sanyo Electric Co., Ltd. | Electronic component-mounting apparatus and component-feeding device therefor |
| JPH11289191A (en) * | 1998-04-02 | 1999-10-19 | Matsushita Electric Ind Co Ltd | Device for supplying electronic component and method for the supplying electronic component |
| WO2008090976A1 (en) * | 2007-01-25 | 2008-07-31 | Panasonic Corporation | Apparatus and method for supplying piling tray and apparatus and method for mounting component |
| CN116133278A (en) * | 2023-04-13 | 2023-05-16 | 南京农业大学 | Tray-mounted material supply device for chip mounter |
-
1993
- 1993-07-20 JP JP05179001A patent/JP3119040B2/en not_active Expired - Lifetime
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0883333A2 (en) * | 1997-06-05 | 1998-12-09 | Sanyo Electric Co., Ltd. | Electronic component-mounting apparatus and component-feeding device therefor |
| EP0883333A3 (en) * | 1997-06-05 | 2000-02-23 | Sanyo Electric Co., Ltd. | Electronic component-mounting apparatus and component-feeding device therefor |
| JPH11289191A (en) * | 1998-04-02 | 1999-10-19 | Matsushita Electric Ind Co Ltd | Device for supplying electronic component and method for the supplying electronic component |
| WO2008090976A1 (en) * | 2007-01-25 | 2008-07-31 | Panasonic Corporation | Apparatus and method for supplying piling tray and apparatus and method for mounting component |
| US8328498B2 (en) | 2007-01-25 | 2012-12-11 | Panasonic Corporation | Component feeding unit and method, and component mounting apparatus and method |
| CN116133278A (en) * | 2023-04-13 | 2023-05-16 | 南京农业大学 | Tray-mounted material supply device for chip mounter |
| CN116133278B (en) * | 2023-04-13 | 2023-06-09 | 南京农业大学 | Tray-mounted material supply device for chip mounter |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3119040B2 (en) | 2000-12-18 |
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