JPH07335505A - Mounting structure of electrolytic capacitor - Google Patents
Mounting structure of electrolytic capacitorInfo
- Publication number
- JPH07335505A JPH07335505A JP13282494A JP13282494A JPH07335505A JP H07335505 A JPH07335505 A JP H07335505A JP 13282494 A JP13282494 A JP 13282494A JP 13282494 A JP13282494 A JP 13282494A JP H07335505 A JPH07335505 A JP H07335505A
- Authority
- JP
- Japan
- Prior art keywords
- electrolytic capacitor
- sealing member
- terminal
- capacitor
- external terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、電解コンデンサの実装
構造に関し、特に、オープンモードの保安機構を備えた
電解コンデンサの実装構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting structure for an electrolytic capacitor, and more particularly to a mounting structure for an electrolytic capacitor having an open mode security mechanism.
【０００２】[0002]
【従来の技術】電解コンデンサ（アルミニウム電解コン
デンサ）では、不具合が発生したときにオープンモード
となる保安機構として、コンデンサケースの開放端側に
固定された封口部材がコンデンサケース内の圧力上昇に
よって外側に向かって変形し、この封口部材の変形に基
づいて、コンデンサ内の電気的接続が絶たれるものが案
出されている。このような保安機構を内蔵した電解コン
デンサでも、基板への実装方法は、従来の電解コンデン
サと同様であり、封口部材の外部端子をブスバーなどに
直接ねじ止めする方法、または、外部端子を回路基板に
直接はんだ付けする方法が行なわれている。2. Description of the Related Art In an electrolytic capacitor (aluminum electrolytic capacitor), a sealing mechanism fixed to the open end side of the capacitor case is opened to the outside by a pressure increase in the capacitor case as a safety mechanism that is in open mode when a failure occurs. It has been devised that the electrical connection in the capacitor is broken based on the deformation of the sealing member. An electrolytic capacitor with such a built-in safety mechanism can be mounted on the board in the same way as a conventional electrolytic capacitor, by directly screwing the external terminal of the sealing member to a bus bar, or by mounting the external terminal on a circuit board. Direct soldering method is used.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、従来の
ように、外部端子と基板側とを直接固定すると、封口部
材と基板とが外部端子を介して完全に固定された状態に
あるため、保安機構の作動時に封口部材の変形が妨げら
れるという問題点がある。However, when the external terminal and the board side are directly fixed as in the conventional case, the sealing member and the board are completely fixed via the external terminal, and therefore the security mechanism is provided. There is a problem that the sealing member is prevented from being deformed during the operation of.
【０００４】以上の問題点に鑑みて、本発明の課題は、
封口部材の変形を利用したオープンモードの保安機構の
作動を妨げることなく、基板側との電気的接続を可能と
する電解コンデンサの実装構造を提供することにある。In view of the above problems, the object of the present invention is to
An object of the present invention is to provide a mounting structure of an electrolytic capacitor that enables an electrical connection with a substrate side without hindering the operation of an open mode security mechanism that utilizes deformation of a sealing member.
【０００５】[0005]
【課題を解決するための手段】上記の課題を解決するた
めに、本発明では、ケースの開放端側に固定された封口
部材がケース内圧の過上昇によって外側に向かって変形
し、この変形に基づいてコンデンサ内部の電気的接続が
絶たれる保安機構を有する電解コンデンサと、この電解
コンデンサの封口部材側で実装される回路基板、シャー
シなどの基板との間には、封口部材の変形を可能とする
隙間を封口部材の表面側に確保しながら、電解コンデン
サを基板側に固定するコネクタ部材と、封口部材に固着
されている外部端子と基板側とを電気的接続し、封口部
材の変形に基づくコネクタ部材に対する外部端子の変位
を可能とする接続手段とを設けたことに特徴を有する。In order to solve the above-mentioned problems, according to the present invention, the sealing member fixed to the open end side of the case is deformed outward due to the excessive rise of the internal pressure of the case. Based on this, it is possible to deform the sealing member between the electrolytic capacitor having a safety mechanism that cuts off the electrical connection inside the capacitor and the circuit board, chassis, etc. mounted on the sealing member side of this electrolytic capacitor. Based on the deformation of the sealing member, a connector member for fixing the electrolytic capacitor to the substrate side and an external terminal fixed to the sealing member are electrically connected to the substrate side while ensuring a gap on the front surface side of the sealing member. The present invention is characterized in that a connecting means that enables displacement of the external terminal with respect to the connector member is provided.
【０００６】本発明において、コネクタ部材には、電解
コンデンサが装着されるコンデンサ装着部と、このコン
デンサ装着部に封口部材側から挿入された電解コンデン
サの横カール部に係合してそれを保持する突起と、コン
デンサ装着部の先端側において、外部端子との間に封口
部材の変形を可能とする隙間を隔てた位置に形成され、
基板側に電気的接続しながら固着された固定用端子とを
設け、接続手段には、固定用端子と外部端子とを電気的
接続する変形自在な線材を用いることが好ましい。In the present invention, the connector member is engaged with and holds the capacitor mounting portion to which the electrolytic capacitor is mounted and the lateral curl portion of the electrolytic capacitor inserted into the capacitor mounting portion from the sealing member side. The protrusion is formed at a position on the tip side of the capacitor mounting portion with a gap between the external terminal and the external terminal, which enables deformation of the sealing member,
It is preferable to provide a fixing terminal that is fixedly connected to the substrate side while being electrically connected, and use a deformable wire that electrically connects the fixing terminal and the external terminal as the connecting means.
【０００７】本発明の別の形態では、コネクタ部材に対
し、電解コンデンサが装着されるコンデンサ装着部と、
このコンデンサ装着部に封口部材側から挿入された電解
コンデンサの横カール部に係合してそれを保持する突起
と、コンデンサ装着部の先端側において、外部端子との
間に封口部材の変形を可能とする隙間を隔てた位置に形
成され、基板側に電気的接続しながら固着された固定用
端子と、この固定用端子に電気的接続しながら、コンデ
ンサ装着部に向けて固定された中継端子とを設け、外部
端子と中継端子とは、一方側の端子が他方側の端子に対
して変位可能な状態でばね性をもって保持することによ
り、外部端子の基板に対する変位を可能にする前記の配
線手段を構成していることが好ましい。According to another aspect of the present invention, a capacitor mounting portion to which an electrolytic capacitor is mounted is attached to a connector member,
The sealing member can be deformed between the protrusion that engages with and holds the lateral curl portion of the electrolytic capacitor that is inserted into the capacitor mounting portion from the sealing member side and the external terminal on the tip side of the capacitor mounting portion. A fixing terminal that is formed at a position separated by a gap and that is electrically connected to the board side while being fixed, and a relay terminal that is electrically connected to the fixing terminal and is fixed toward the capacitor mounting portion. The wiring means for disposing the external terminal and the relay terminal, which allows the external terminal to be displaced with respect to the substrate by holding the external terminal with the spring property in a state in which the terminal on one side is displaceable with respect to the terminal on the other side. Is preferably configured.
【０００８】[0008]
【作用】本発明において、電解コンデンサをコネクタ部
材を介して基板に実装すると、電解コンデンサと基板と
の間において、封口部材の表面側には、保安機構の作動
時に生じる封口部材の変形を可能とする隙間が確保され
た状態にある。従って、保安機構の作動時には、封口部
材の変形が可能である。しかも、電解コンデンサと基板
側との間には、封口部材の変形に基づく外部端子の変位
を可能とする接続手段が介在している。従って、通常時
には、電解コンデンサの電気的な動作に支障がないとと
もに、保安機構の作動時にも、接続部材は、封口部材の
変形を妨げない。それ故、封口部材の変形を利用したオ
ープンモードの保安機構の作動を妨げることなく、電解
コンデンサを基板に実装できる。In the present invention, when the electrolytic capacitor is mounted on the substrate through the connector member, the sealing member can be deformed on the surface side of the sealing member between the electrolytic capacitor and the substrate, which occurs when the safety mechanism operates. There is a gap secured. Therefore, when the security mechanism is activated, the sealing member can be deformed. Moreover, the connecting means that allows displacement of the external terminal due to the deformation of the sealing member is interposed between the electrolytic capacitor and the substrate side. Therefore, normally, the electrical operation of the electrolytic capacitor is not hindered, and the connecting member does not hinder the deformation of the sealing member even when the safety mechanism operates. Therefore, the electrolytic capacitor can be mounted on the substrate without hindering the operation of the open mode security mechanism that utilizes the deformation of the sealing member.
【０００９】[0009]
【実施例】以下本発明を図１〜図７に示す実施例につい
て説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the embodiments shown in FIGS.
【００１０】〔実施例１〕図１は、実施例１に係る電解
コンデンサの基板への実装構造を示す部分断面図であ
る。[First Embodiment] FIG. 1 is a partial cross-sectional view showing a mounting structure of an electrolytic capacitor according to a first embodiment on a substrate.
【００１１】図１において、電解コンデンサ２１（アル
ミニウム電解コンデンサ）は、コンデンサ素子２２が収
容されたケース２３、このケース２３の内部を密封状態
とするために、その開放端側に固定された封口部材２
４、封口部材２４の外側に突出する外部端子２５、コン
デンサ素子２２から引き出されたリード２７を備えてい
る。封口部材２４は、ケース２３の内部に向いた内蓋１
と、ケース２３の外部に向いた外蓋２とによって構成さ
れている。内蓋１は樹脂製で、ケース２３の内面と略接
触するようなディスク状である。In FIG. 1, an electrolytic capacitor 21 (aluminum electrolytic capacitor) is a case 23 in which a capacitor element 22 is housed, and a sealing member fixed to the open end side of the case 23 to keep the inside of the case 23 in a sealed state. Two
4, an external terminal 25 protruding to the outside of the sealing member 24, and a lead 27 drawn from the capacitor element 22. The sealing member 24 is the inner lid 1 facing the inside of the case 23.
And the outer lid 2 facing the outside of the case 23. The inner lid 1 is made of resin, and has a disk shape that substantially contacts the inner surface of the case 23.
【００１２】図２に内蓋１の裏面側の構造を示すよう
に、内蓋１には、その中心を対称の中心とする１対のリ
ベット端子孔３および圧力伝達孔４が形成されており、
対峙する孔同士を結んだ線が略直角に交わるようになっ
ている。As shown in the structure of the back surface side of the inner lid 1 in FIG. 2, the inner lid 1 is formed with a pair of rivet terminal holes 3 and pressure transmission holes 4 whose centers are symmetrical to each other. ,
The lines connecting the facing holes intersect at a right angle.
【００１３】再び、図１において、ケース２３の内部に
は、リベット端子孔３を通ってリベット３０がケース２
３の内部に突出しており、この突出した接続端３１にリ
ード２７が接続している。リベット端子孔３は、接続端
３１を通すには十分な大きさであるが、リード２７は進
入できない大きさの孔である。Referring again to FIG. 1, inside the case 23, the rivet 30 passes through the rivet terminal hole 3 and the rivet 30 passes through the case 2.
3, the lead 27 is connected to the protruding connection end 31. The rivet terminal hole 3 has a size large enough to allow the connection end 31 to pass therethrough, but the size of the lead 27 is small.
【００１４】従って、接続端３１がリベット端子孔３内
に引っ込んだ場合でも、リード２７はこれに追従してリ
ベット端子孔３の内部に進入することはなく、接続端３
１とリード２７との接続が破壊されるようになってい
る。この際に、接続端３１とリード２７との接続部分
は、破壊位置を規定する弱点部分になる。なお、コンデ
ンサ素子２２側の圧力は、圧力伝達孔４を介して外蓋２
に伝達されるようになっている。Therefore, even when the connecting end 31 is retracted into the rivet terminal hole 3, the lead 27 does not follow the recess and enter the inside of the rivet terminal hole 3, and the connecting end 3
The connection between 1 and the lead 27 is destroyed. At this time, the connecting portion between the connecting end 31 and the lead 27 becomes a weak point portion that defines the breaking position. It should be noted that the pressure on the side of the capacitor element 22 is applied to the outer lid 2 via the pressure transmission hole 4.
To be transmitted to.
【００１５】本例では、内蓋１のケース２３の内部に面
した側１ａに１対の補強用突起５が形成されている。こ
の補強用突起５は、リベット端子孔３の外側に配置さ
れ、リード２７を接続端３１に導き、所定の位置に保持
する役割も果たしている。補強用突起５は、ケース２３
内の圧力の上昇により、内蓋１の変形を最小限に止める
ためのものであり、内蓋１の外面等に設置しても良いこ
とはもちろんである。In this example, a pair of reinforcing protrusions 5 is formed on the side 1a of the inner lid 1 facing the inside of the case 23. The reinforcing protrusion 5 is arranged outside the rivet terminal hole 3 and also serves to guide the lead 27 to the connection end 31 and hold it at a predetermined position. The reinforcing protrusion 5 is provided in the case 23.
This is for minimizing the deformation of the inner lid 1 due to the increase of the internal pressure, and it goes without saying that it may be installed on the outer surface of the inner lid 1 or the like.
【００１６】図３に外蓋２の表面側を示すように、外蓋
２は、金属製で、ケース２３の内周に合致した略ディス
ク状である。そして、その外周部には立ち上がった形状
のつば１１が形成されており、このつば１１の内側に
は、外周に沿って溝１２が形成されている。従って、図
１に示すように、内蓋１に引き続き外蓋２をケース２３
の開放端に挿入したのち、溝１２にシリコンゴム等のパ
ッキン９を挿入し、ケース２３の開放端の端部をパッキ
ン９に向かって折り返して、上カール部２８ａを形成す
ると、封口部材２４は、上カール部２８ａと横カール部
２８ｂとに挟まれてそこに固定され、耐圧性のあるシー
ルが完了する。As shown in the front side of the outer lid 2 in FIG. 3, the outer lid 2 is made of metal and has a substantially disc shape that matches the inner circumference of the case 23. A rim 11 having a raised shape is formed on the outer peripheral portion thereof, and a groove 12 is formed inside the rim 11 along the outer periphery. Therefore, as shown in FIG. 1, the outer lid 2 is continuously attached to the case 23 after the inner lid 1.
After inserting the packing 9 such as silicon rubber into the groove 12 and folding the end of the open end of the case 23 toward the packing 9 to form the upper curl portion 28a, the sealing member 24 is closed. The upper curl portion 28a and the lateral curl portion 28b are sandwiched and fixed there, and the pressure-resistant seal is completed.
【００１７】外蓋２には１対のリベット端子外孔１３が
形成されている。リベット端子外孔１３も、リベット３
０が挿通する孔であり、リベット端子孔３と同様に、外
蓋２の中心が対称の中心となるように形成されている。
リベット端子外孔１３には、そこを通ってケース２３内
の電解液の蒸気や圧力がケース外にリークすることを防
止するため、シリコンゴム製等のブッシュ８が嵌められ
ており、このブッシュ８を介してリベット３０が外蓋２
に固定されている。The outer lid 2 is formed with a pair of rivet terminal outer holes 13. The rivet terminal outer hole 13 is also the rivet 3
0 is a hole to be inserted, and like the rivet terminal hole 3, it is formed so that the center of the outer lid 2 becomes a symmetrical center.
A bush 8 made of silicon rubber or the like is fitted in the rivet terminal outer hole 13 in order to prevent the vapor and pressure of the electrolytic solution in the case 23 from leaking out of the case through the rivet terminal outer hole 13. The rivet 30 through the outer lid 2
It is fixed to.
【００１８】外蓋２は、薄い金属板で形成されている
が、その形状および強度は、ケース２３の内部で通常発
生する圧力に対しては十分な強度を備えている。外蓋２
には、その略中央でリベット端子外孔１３を分断するよ
うに、薄肉部１４が形成されている。従って、ケース２
３内の圧力が上昇すると、その圧力が外蓋２に伝達さ
れ、外蓋２は薄肉部１４を頂点とした山形に変形可能で
ある。Although the outer lid 2 is formed of a thin metal plate, its shape and strength are sufficient for the pressure normally generated inside the case 23. Outer lid 2
The thin-walled portion 14 is formed so as to divide the rivet terminal outer hole 13 at substantially the center thereof. Therefore, case 2
When the pressure in 3 rises, the pressure is transmitted to the outer lid 2, and the outer lid 2 can be deformed into a mountain shape with the thin portion 14 as the apex.
【００１９】外蓋２の外面２ｂには、さらに、樹脂製の
絶縁体であるスペーサー１５が配置されており、リベッ
ト端子外孔１３を貫通して外面２ｂに突出したリベット
３０は、外部端子２５と接続されている。スペーサー１
５は、外部端子２５の配置位置を結ぶように連続的に成
形されており、その連結部、すなわち、中心には、外蓋
２の変形を阻害しないように薄肉部１６が形成されてい
る。従って、外蓋２が内圧の上昇によって山形に変形す
ると、これに応じてスペーサー１５も山形に変形する。The outer surface 2b of the outer lid 2 is further provided with a spacer 15 which is an insulator made of resin, and the rivet 30 which penetrates the rivet terminal outer hole 13 and projects to the outer surface 2b has the external terminal 25. Connected with. Spacer 1
5 is continuously formed so as to connect the positions where the external terminals 25 are arranged, and a thin portion 16 is formed at the connecting portion, that is, in the center thereof so as not to hinder the deformation of the outer lid 2. Therefore, when the outer lid 2 is deformed into a chevron shape due to an increase in internal pressure, the spacer 15 is also deformed into a chevron shape accordingly.
【００２０】本例では、電解コンデンサ２１を基板Ｂに
実装する場合には、図４のように外蓋２の外側に向けて
の変形を可能とする隙間Ｓを封口部材２４の表面側に確
保しながら、電解コンデンサ２１を基板Ｂに固定するコ
ネクタ部材４０を用いている。また、外部端子２５と基
板Ｂの側との電気的接続は、外蓋２の変形に基づいて変
形自在な線材からなる接続部材５１を用いてある。In this example, when the electrolytic capacitor 21 is mounted on the substrate B, a gap S that allows deformation toward the outside of the outer lid 2 is secured on the front surface side of the sealing member 24 as shown in FIG. However, the connector member 40 for fixing the electrolytic capacitor 21 to the substrate B is used. Further, the electrical connection between the external terminal 25 and the substrate B side is performed by using the connecting member 51 made of a wire material that is deformable based on the deformation of the outer lid 2.
【００２１】すなわち、コネクタ部材４０は、電解コン
デンサ２１が装着されるコンデンサ装着部４１と、この
コンデンサ装着部４１に封口部材２４側から挿入された
電解コンデンサ２１の横カール部２８ｂに係合してそれ
を保持する突起４０ｂとが形成されている。また、コン
デンサ装着部４１の先端側では、外部端子２５から蓋材
２の変形を可能とする隙間Ｓを隔てた位置で底部４３に
固定された固定用端子４４を有している。固定用端子４
４は、基板ＢのホールＨに嵌め込んだ後にはんだ付け可
能な爪状の端子である。また、底部４３には、固定用端
子４４の近傍位置に貫通孔４５が形成されている。That is, the connector member 40 engages with the capacitor mounting portion 41 to which the electrolytic capacitor 21 is mounted, and the lateral curl portion 28b of the electrolytic capacitor 21 inserted into the capacitor mounting portion 41 from the sealing member 24 side. A protrusion 40b for holding it is formed. Further, on the tip end side of the capacitor mounting portion 41, there is a fixing terminal 44 fixed to the bottom portion 43 at a position separated from the external terminal 25 by a gap S that allows the lid material 2 to be deformed. Fixing terminal 4
Reference numeral 4 denotes a claw-shaped terminal which can be soldered after being fitted into the hole H of the board B. Further, a through hole 45 is formed in the bottom portion 43 near the fixing terminal 44.
【００２２】このような構成のコネクタ部材４０には、
以下のようにして、電解コンデンサ２１が固定される。
まず、外部端子２５に配線部材５１をはんだ付けしてお
き、この配線部材５１の先端側を貫通孔４５から外部に
引き出しておく。ここで、外部端子２５に配線部材５１
を圧着により接続する場合もある。この状態から、コン
デンサ装着部４１に封口部材２４の側から電解コンデン
サ２１を挿入すると、その横カール部２８ｂに突起４０
ｂが嵌合して、コネクタ部材４０に電解コンデンサ２１
が固定される。この状態で、外部端子２５および封口部
材２４の表面側には、保安機構の作動時に、封口部材２
４が外側に向けて変形できる隙間Ｓが形成される。次
に、配線部材５１の先端側を固定用端子４４の基部４４
１にはんだ付けする。しかる後に、電解コンデンサ２１
と一体化したコネクタ部材４０を基板Ｂに実装する。す
なわち、固定用端子４４を基板ＢのホールＨに挿入した
後に、基板Ｂの回路パターンと固定用端子４４とをはん
だ付けする。その結果、電解コンデンサ２１と一体化し
たコネクタ部材４０は、固定用端子４４を介して基板Ｂ
に固定されるので、電解コンデンサ２１が基板Ｂに実装
されたことになる。The connector member 40 having such a structure includes
The electrolytic capacitor 21 is fixed as follows.
First, the wiring member 51 is soldered to the external terminal 25, and the tip end side of the wiring member 51 is pulled out from the through hole 45 to the outside. Here, the wiring member 51 is connected to the external terminal 25.
May be connected by crimping. From this state, when the electrolytic capacitor 21 is inserted into the capacitor mounting portion 41 from the sealing member 24 side, the projection 40 is formed on the lateral curl portion 28b.
b is fitted, and the electrolytic capacitor 21 is attached to the connector member 40.
Is fixed. In this state, the surface of the external terminal 25 and the sealing member 24 is covered with the sealing member 2 when the safety mechanism is activated.
A gap S is formed so that 4 can be deformed outward. Next, the front end side of the wiring member 51 is attached to the base portion 44 of the fixing terminal 44.
Solder to 1. After that, the electrolytic capacitor 21
The connector member 40 integrated with is mounted on the board B. That is, after inserting the fixing terminal 44 into the hole H of the board B, the circuit pattern of the board B and the fixing terminal 44 are soldered. As a result, the connector member 40 integrated with the electrolytic capacitor 21 is connected to the board B via the fixing terminal 44.
Therefore, the electrolytic capacitor 21 is mounted on the board B.
【００２３】このように電解コンデンサ２１を実装して
おけば、以下のように、保安機構が作動するのに支障が
ない。すなわち、図４に示すように、ケース２３内の圧
力が過上昇すると、その圧力が圧力伝達孔４を介して外
蓋２に伝達される。外蓋２は、伝達された圧力の上昇に
呼応して、中心の薄肉部１４に沿って外側に向けて変形
し、薄肉部１４を頂点として山形となる。従って、外蓋
２に固定されたリベット３０は、外蓋２の変形に引っ張
られて外側へ移動する。この移動が進むと、リード２７
と接続していたリベット３０の接続端３１は、リベット
端子孔３の内部に引き込まれる。ここで、リード２７
は、リベット端子孔３の内部に進入できないため、リー
ド２７と接続端３１との接続が破壊され、このコンデン
サ２１はオープン状態となる。By mounting the electrolytic capacitor 21 in this way, there is no problem in operating the safety mechanism as follows. That is, as shown in FIG. 4, when the pressure in the case 23 excessively rises, the pressure is transmitted to the outer lid 2 via the pressure transmission hole 4. In response to the increase in the transmitted pressure, the outer lid 2 deforms outward along the thin portion 14 at the center, and becomes a mountain shape with the thin portion 14 as the apex. Therefore, the rivet 30 fixed to the outer lid 2 is pulled by the deformation of the outer lid 2 and moves to the outside. As this movement progresses, the lead 27
The connection end 31 of the rivet 30 that has been connected to is drawn into the rivet terminal hole 3. Where lead 27
Cannot enter the inside of the rivet terminal hole 3, the connection between the lead 27 and the connection end 31 is destroyed, and the capacitor 21 is opened.
【００２４】このようにして、保安機構が作動すると、
外蓋２が外側に向けて変形するが、本例では、封口部材
２４および外部端子２５の表面側には、保安機構の作動
時に生じる外蓋２の変形および外部端子２５の変位を可
能とする隙間Ｓを確保してあるため、保安機構の作動に
支障がない。また、電解コンデンサ２１と基板Ｂとの間
では、保安機構の作動時に外蓋２の変形に基づいて変形
自在な配線部材５１が介在しているため、配線部材５１
は、外蓋２の変形を妨げない。それ故、封口部材２４の
変形を利用したオープンモードの保安機構の作動を妨げ
ることなく、電解コンデンサ２１を基板Ｂに実装でき
る。When the security mechanism operates in this way,
Although the outer lid 2 is deformed toward the outside, in this example, the outer lid 2 can be deformed and the external terminal 25 can be displaced on the front surface side of the sealing member 24 and the external terminal 25 when the safety mechanism operates. Since the gap S is secured, there is no hindrance to the operation of the safety mechanism. Further, between the electrolytic capacitor 21 and the substrate B, the wiring member 51, which is deformable based on the deformation of the outer lid 2 when the safety mechanism is operated, is interposed.
Does not hinder the deformation of the outer lid 2. Therefore, the electrolytic capacitor 21 can be mounted on the substrate B without hindering the operation of the open mode security mechanism utilizing the deformation of the sealing member 24.
【００２５】〔実施例１の変形例〕実施例１において、
コネクタ部材４０の固定用端子４４と、電解コンデンサ
２１の外部端子２５とをリード線などの変形可能な配線
部材５１をはんだ付けなどで電気的接続している。そこ
で、外部端子２５の形状については、はんだ付けしやす
いように、図５（ａ）に示す丸棒状の比較的長い外部端
子２５ａ、または、図５（ｂ）に示す角棒状の比較的長
い外部端子２５ｂを用いることが好ましい。[Modification of First Embodiment] In the first embodiment,
The fixing terminal 44 of the connector member 40 and the external terminal 25 of the electrolytic capacitor 21 are electrically connected to a deformable wiring member 51 such as a lead wire by soldering or the like. Therefore, as for the shape of the external terminal 25, the round bar-shaped relatively long external terminal 25a shown in FIG. 5A or the square bar-shaped relatively long external terminal shown in FIG. It is preferable to use the terminal 25b.
【００２６】また、封口部材２４の構成については、上
記実施例の構成に限定されず、封口部材２４がケース内
圧の過上昇によって外側に向かって変形し、この変形に
基づいて、コンデンサ内部の電気的接続を絶つ保安機構
を構成できれば、同様な効果が得られその封口部の構成
を限定するものではない。Further, the structure of the sealing member 24 is not limited to the structure of the above-mentioned embodiment, and the sealing member 24 is deformed outward due to the excessive rise of the internal pressure of the case, and based on this deformation, the electricity inside the capacitor is changed. If the security mechanism that breaks the physical connection can be configured, the same effect can be obtained and the configuration of the sealing portion is not limited.
【００２７】さらに、コネクタ部材４０については、図
１に示すように、コンデンサ装着部４１を構成する筒部
分と、その底部４３とを一体に成型したものに限らず、
別体で構成しておき、配線部材５１のはんだ付けなどを
終えた後に、筒部分の内面に形成した突起４０ｂなどを
利用して、筒部分の所定の位置に底部４３を位置決めし
た後に、それらを一体化してもよい。Further, as shown in FIG. 1, the connector member 40 is not limited to the one in which the cylindrical portion which constitutes the capacitor mounting portion 41 and the bottom portion 43 are integrally molded.
After the wiring member 51 is formed as a separate body and the soldering of the wiring member 51 is completed, the protrusions 40b formed on the inner surface of the tubular portion are used to position the bottom portion 43 at a predetermined position of the tubular portion, and then the May be integrated.
【００２８】〔実施例２〕図６は、実施例２に係る電解
コンデンサの実装構造を示す説明図である。本例の実装
構造でも、基本的には、実施例１と同様に、ケースの開
放端側に固定された封口部材がケース内圧の過上昇によ
って外側に向かって変形し、この変形に基づいて、コン
デンサ内部の電気的接続が絶たれる保安機構を有する電
解コンデンサを基板に実装しており、電解コンデンサ本
体、それに内蔵された保安機構、および基板などの構成
が共通している。従って、以下の説明では、同じ機能を
有する部分には、同じ符号を付して、それらの図示およ
び詳細な説明を省略するとともに、図６には、本例の実
装構造の要部のみを図示してある。[Second Embodiment] FIG. 6 is an explanatory view showing a mounting structure of an electrolytic capacitor according to a second embodiment. Also in the mounting structure of the present example, basically, as in the case of the first embodiment, the sealing member fixed to the open end side of the case is deformed outward due to the excessive rise of the case internal pressure, and based on this deformation, An electrolytic capacitor having a safety mechanism that cuts off the electrical connection inside the capacitor is mounted on a substrate, and the configuration of the electrolytic capacitor body, the safety mechanism built therein, and the substrate are common. Therefore, in the following description, parts having the same function are denoted by the same reference numerals, and illustration and detailed description thereof are omitted, and FIG. 6 illustrates only a main part of the mounting structure of this example. It is shown.
【００２９】図６において、電解コンデンサ２１を基板
Ｂに実装するにあたって、本例では、基板Ｂの側に電気
的接続しながら固定される固定用端子６１が一方面側に
固着され、この固定用端子６１に電気的接続する中継端
子６２が他方面側に突出する状態に固着されたコネクタ
部材６０を用いている。In FIG. 6, when mounting the electrolytic capacitor 21 on the board B, in this example, a fixing terminal 61, which is fixed while being electrically connected to the side of the board B, is fixed on one surface side. The connector member 60 is used in which the relay terminal 62 electrically connected to the terminal 61 is fixed so as to project to the other surface side.
【００３０】ここで、中継端子６２は、固定用端子６１
に接続する基部６２１の側の径が太く、先端側が薄くて
径の細い形状になっている。Here, the relay terminal 62 is the fixing terminal 61.
The diameter of the side of the base portion 621 connected to is large, and the thickness of the tip side is thin and thin.
【００３１】これに対して、電解コンデンサ２１の封口
部材２４の側にビス７５で固着されている外部端子７０
は、金属板を折り返した構造になっており、その折り返
し部分に相当するばね部７１と、それに対峙する受け部
７２とが形成されている。ここで、ばね部７１は、受け
部７２に押圧する状態にある。On the other hand, the external terminal 70 fixed to the sealing member 24 side of the electrolytic capacitor 21 with the screw 75.
Has a structure in which a metal plate is folded back, and a spring portion 71 corresponding to the folded back portion and a receiving portion 72 facing the spring portion 71 are formed. Here, the spring portion 71 is in a state of being pressed against the receiving portion 72.
【００３２】このように構成した外部端子７０およびコ
ネクタ部材６０を用いて、電解コンデンサ２１は、図７
（ａ）に示すように、基板Ｂに実装される。By using the external terminal 70 and the connector member 60 thus constructed, the electrolytic capacitor 21 can be formed as shown in FIG.
As shown in (a), it is mounted on the board B.
【００３３】まず、基板ＢのホールＨに対して、コネク
タ部材６０の固定用端子６１を挿入した後に、固定用端
子６１をはんだ付けにより基板Ｂの側に電気的接続しな
がら固定する。ここで、はんだフラックスを除去する必
要がある場合には、この状態のうちに基板洗浄を行なっ
ておく。基板洗浄用の溶剤によっては、電解コンデンサ
に支障をもたらすことがあるからである。First, after inserting the fixing terminal 61 of the connector member 60 into the hole H of the board B, the fixing terminal 61 is fixed by soldering to the board B side while being electrically connected. If it is necessary to remove the solder flux, the substrate is cleaned in this state. This is because the solvent for cleaning the substrate may cause a problem in the electrolytic capacitor.
【００３４】次に、コネクタ部材６０の内部に対して、
電解コンデンサ２１を封口部材２４の側から装着する。
この装着にあたっては、外部端子７０のばね部７１と受
け部７２との間に中継端子６２を差し込むようにして、
コネクタ部材６０に電解コンデンサ２１を装着する。こ
の装着を行うだけで、外部端子７０と中継端子６２と
は、その表面側に封口部材２４の変形を可能とする隙間
Ｓを確保しながら、外部端子７０（一方側の端子）が中
継端子６２（他方側の端子）をばね性をもって保持す
る。その結果、電解コンデンサ２１は、コネクタ部材６
０を介して基板Ｂに実装されたことになる。Next, with respect to the inside of the connector member 60,
The electrolytic capacitor 21 is attached from the sealing member 24 side.
In this mounting, the relay terminal 62 is inserted between the spring portion 71 of the external terminal 70 and the receiving portion 72,
The electrolytic capacitor 21 is attached to the connector member 60. Only by this mounting, the external terminal 70 (the terminal on one side) is connected to the external terminal 70 and the relay terminal 62 while the space S allowing the deformation of the sealing member 24 is secured on the surface side thereof. Hold (the other terminal) with a spring property. As a result, the electrolytic capacitor 21 has the connector member 6
This means that it is mounted on the board B through 0.
【００３５】この状態から、電解コンデンサ２１の内圧
が上昇すると、保安機構が作動して、図７（ｂ）に示す
ように、封口部材２４が外側に向けて膨らみ、この変形
により、コンデンサ内の電気的接続が絶たれる。この
間、封口部材２４の表面側には、隙間Ｓが確保されてい
るため、封口部材２４の変形は、妨げられない。When the internal pressure of the electrolytic capacitor 21 rises from this state, the safety mechanism operates and the sealing member 24 bulges outward as shown in FIG. 7 (b). The electrical connection is broken. During this time, since the gap S is secured on the front surface side of the sealing member 24, the deformation of the sealing member 24 is not hindered.
【００３６】また、封口部材２４が変形すると、この変
形に基づいて、外部端子７０は、封口部材２４に向けて
浮き上がり気味に、かつ側方に移動しようとする。ここ
で、外部端子７０は、ばね部７１のばね性で中継端子６
２を保持しているだけであるため、中継端子６２は、ば
ね部７１と受け部７２との接合面に沿って相対的に変位
する。従って、外部端子７０の変位が妨げられない。そ
れ故、本例でも、封口部材２４の変形を利用したオープ
ンモードの保安機構の作動を妨げることなく、電解コン
デンサ２１を基板Ｂに実装できる。Further, when the sealing member 24 is deformed, the external terminal 70 tries to move to the sealing member 24 sideways and slightly upward based on this deformation. Here, the external terminal 70 is connected to the relay terminal 6 by the spring property of the spring portion 71.
The relay terminal 62 is relatively displaced along the joint surface between the spring portion 71 and the receiving portion 72 because only the second terminal 2 is held. Therefore, the displacement of the external terminal 70 is not hindered. Therefore, also in this example, the electrolytic capacitor 21 can be mounted on the substrate B without interfering with the operation of the open mode security mechanism utilizing the deformation of the sealing member 24.
【００３７】〔実施例２の改良例〕なお、実施例２で
は、封口部材２４に固着されている一対の外部端子７０
が対称に配置されているが、図８に示すように、外部端
子７０を非対称に配置することによって、極性を容易に
判別できるようにし、誤挿入を防止してもよい。[Modification of Second Embodiment] In the second embodiment, the pair of external terminals 70 fixed to the sealing member 24 is used.
Although they are symmetrically arranged, as shown in FIG. 8, by arranging the external terminals 70 asymmetrically, the polarity can be easily discriminated and erroneous insertion may be prevented.
【００３８】外部端子７０の形状と、中継端子６２の形
状を逆にして、中継端子６２がばね性をもって、外部端
子７０を保持するようにしてもよい。図９は、本発明の
他の実施例で、上述の図１の実施例において、底部４
３、固定用端子４４を用いず、コネクタ部材４０を基板
Ｂに固定し、配線部材５１を基板Ｂの配線と接続しても
よい。The shape of the external terminal 70 and the shape of the relay terminal 62 may be reversed so that the relay terminal 62 has a spring property and holds the external terminal 70. FIG. 9 shows another embodiment of the present invention, which is different from the embodiment of FIG.
3. Instead of using the fixing terminal 44, the connector member 40 may be fixed to the board B and the wiring member 51 may be connected to the wiring of the board B.
【００３９】[0039]
【発明の効果】以上のとおり、本発明では、封口部材の
表面側には、保安機構の作動時に生じる封口部材の変形
を可能とする隙間を確保した状態で電解コンデンサを基
板に実装し、しかも、電解コンデンサと基板側との間に
は、保安機構の作動時に封口部材の変形に基づいて変形
自在な接続手段が介在している。従って、本発明によれ
ば、封口部材の変形を利用したオープンモードの保安機
構の作動を妨げることなく、電解コンデンサを基板に実
装できる。As described above, according to the present invention, the electrolytic capacitor is mounted on the substrate on the front surface side of the sealing member in a state in which a gap that allows the sealing member to be deformed when the safety mechanism is operated is secured. Between the electrolytic capacitor and the substrate side, there is interposed connecting means that is deformable based on the deformation of the sealing member when the safety mechanism is activated. Therefore, according to the present invention, the electrolytic capacitor can be mounted on the substrate without hindering the operation of the open mode security mechanism utilizing the deformation of the sealing member.
【図１】本発明の実施例１に係る電解コンデンサの実装
構造を示す断面図である。FIG. 1 is a sectional view showing a mounting structure of an electrolytic capacitor according to a first embodiment of the present invention.
【図２】図１に示す電解コンデンサの封口部材（内蓋）
の底面図である。FIG. 2 is a sealing member (inner lid) of the electrolytic capacitor shown in FIG.
FIG.
【図３】図１に示す電解コンデンサの封口部材（外蓋）
の平面図である。FIG. 3 is a sealing member (outer lid) of the electrolytic capacitor shown in FIG.
FIG.
【図４】図１に示す電解コンデンサ内の圧力が上昇した
ときの保安機構の動作を示す説明図である。FIG. 4 is an explanatory view showing the operation of the safety mechanism when the pressure inside the electrolytic capacitor shown in FIG. 1 rises.
【図５】（ａ）、（ｂ）は、実施例１に係る電解コンデ
ンサの外部端子の変形例を示す斜視図である。5A and 5B are perspective views showing modifications of the external terminals of the electrolytic capacitor according to the first embodiment.
【図６】本発明の実施例２に係る電解コンデンサ要部の
構造を示す説明図である。FIG. 6 is an explanatory diagram showing a structure of a main part of an electrolytic capacitor according to a second embodiment of the present invention.
【図７】（ａ）は、図６に示す電解コンデンサをコネク
タ部材を介して基板に実装した状態を示す説明図、
（ｂ）は、図６に示す電解コンデンサの保安機構が作動
した状態を示す説明図である。7A is an explanatory view showing a state in which the electrolytic capacitor shown in FIG. 6 is mounted on a substrate via a connector member;
FIG. 7B is an explanatory diagram showing a state where the safety mechanism of the electrolytic capacitor shown in FIG. 6 has operated.
【図８】本発明の実施例２の改良例に係る電解コンデン
サの外部端子の構造を示す斜視図である。FIG. 8 is a perspective view showing a structure of an external terminal of an electrolytic capacitor according to an improved example of the second embodiment of the present invention.
【図９】本発明のその他の実施例に係る電解コンデンサ
の実装構造を示す断面図である。FIG. 9 is a sectional view showing a mounting structure of an electrolytic capacitor according to another embodiment of the present invention.
２１・・電解コンデンサ ２２・・コンデンサ素子 ２３・・ケース ２４・・封口部材 ２５、７０・・外部端子 ２８ｂ・・横カール部 ４０、６０・・・コネクタ部材 ４０ｂ・・突起 ４４、６１・・・固定用端子 ５１・・・配線部材 ６２・・・中継端子 ７１・・・ばね部 ７２・・・受け部 Ｓ・・隙間 Ｂ・・基板 21 ... Electrolytic capacitor 22 ... Capacitor element 23 ... Case 24 ... Sealing member 25, 70 ... External terminal 28b ... Horizontal curl portion 40, 60 ... Connector member 40b ... Protrusion 44, 61 ... Fixing terminal 51 ... Wiring member 62 ... Relay terminal 71 ... Spring portion 72 ... Receiving portion S ... Gap B ... Board
フロントページの続き (72)発明者 村橋 秀樹 京都府京都市中京区御池通烏丸東入一筋目 仲保利町191番地の４ 上原ビル３階 ニ チコン株式会社内Front page continued (72) Hideki Murahashi Inventor Hideki Murahashi Oike Dori, Nakagyo-Ku, Kyoto Prefecture 1st Line Karasuma Higashiiri Line 4 191 Nakaboricho Uehara Building 3rd Floor Nichicon Corporation
Claims (3)
がケース内圧の過上昇によって外側に向かって変形し、
この変形に基づいてコンデンサ内部の電気的接続が絶た
れる保安機構を有する電解コンデンサと、この電解コン
デンサの封口部材側で実装される基板との間には、 前記封口部材の変形を可能とする隙間を前記封口部材の
表面側に確保しながら、前記電解コンデンサを固定する
接続手段を設けたことを特徴とする電解コンデンサの実
装構造。1. A sealing member fixed to an open end side of a case is deformed outward due to an excessive rise in internal pressure of the case,
A gap that allows the sealing member to be deformed between an electrolytic capacitor having a safety mechanism that cuts off the electrical connection inside the capacitor based on this deformation and a substrate mounted on the sealing member side of the electrolytic capacitor. A mounting structure for an electrolytic capacitor, characterized in that a connecting means for fixing the electrolytic capacitor is provided while securing the sealing member on the front surface side of the sealing member.
は、前記電解コンデンサが装着されるコンデンサ装着部
と、このコンデンサ装着部に前記封口部材側から挿入さ
れた前記電解コンデンサの横カール部に係合してそれを
保持する突起と、前記コンデンサ装着部の先端側におい
て、前記外部端子との間に前記封口部材の変形を可能と
する隙間を隔てた位置に形成され、前記基板側に電気的
接続しながら固着された固定用端子とを有し、 前記接続手段は、前記固定用端子と前記外部端子とを電
気的接続する変形自在な線材であることを特徴とする電
解コンデンサの実装構造。2. The connector member according to claim 1, wherein the connector member is engaged with a capacitor mounting portion to which the electrolytic capacitor is mounted, and a lateral curl portion of the electrolytic capacitor inserted into the capacitor mounting portion from the sealing member side. Then, a protrusion for holding the protrusion and the tip of the capacitor mounting portion are formed at a position separated from the external terminal by a gap that allows the sealing member to be deformed, and electrically connected to the substrate side. A mounting structure for an electrolytic capacitor, characterized in that the connecting means is a deformable wire that electrically connects the fixing terminal and the external terminal.
は、前記電解コンデンサが装着されるコンデンサ装着部
と、このコンデンサ装着部に前記封口部材側から挿入さ
れた前記電解コンデンサの横カール部に係合してそれを
保持する突起と、前記コンデンサ装着部の先端側におい
て前記外部端子との間に前記封口部材の変形を可能とす
る隙間を隔てた位置に形成され、前記基板側に電気的接
続しながら固着された固定用端子と、この固定用端子に
電気的接続しながら、前記コンデンサ装着部に向けて固
定された中継端子とを有し、 前記外部端子と前記中継端子とは、一方側の端子が他方
側の端子に対して変位可能な状態でばね性をもって保持
することにより、前記外部端子の前記基板に対する変位
を可能とする前記配線手段を構成していることを特徴と
する電解コンデンサの実装構造。3. The connector member according to claim 1, wherein the connector member is engaged with a capacitor mounting portion to which the electrolytic capacitor is mounted, and a lateral curl portion of the electrolytic capacitor inserted into the capacitor mounting portion from the sealing member side. Then, a projection for holding it and the external terminal at the tip side of the capacitor mounting portion are formed at a position separated by a gap that allows the sealing member to be deformed, and are electrically connected to the substrate side. While having a fixed fixing terminal and a relay terminal electrically connected to the fixing terminal while being fixed toward the capacitor mounting portion, the external terminal and the relay terminal are provided on one side. The wiring means is configured to enable displacement of the external terminal with respect to the substrate by holding the terminal with a spring property in a displaceable manner with respect to the other terminal. Mounting structure of the electrolytic capacitor according to claim.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13282494A JP3497242B2 (en) | 1994-06-15 | 1994-06-15 | Mounting structure of electrolytic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13282494A JP3497242B2 (en) | 1994-06-15 | 1994-06-15 | Mounting structure of electrolytic capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07335505A true JPH07335505A (en) | 1995-12-22 |
| JP3497242B2 JP3497242B2 (en) | 2004-02-16 |
Family
ID=15090415
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13282494A Expired - Fee Related JP3497242B2 (en) | 1994-06-15 | 1994-06-15 | Mounting structure of electrolytic capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3497242B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102004037843A1 (en) * | 2004-08-04 | 2006-02-23 | Epcos Ag | Electrical housing has a feature with a weakened cross sectional thickness providing a burst action at high pressure |
| WO2012042937A1 (en) * | 2010-09-30 | 2012-04-05 | オムロン株式会社 | Surface mount socket for electrolytic capacitor and surface mount method for electrolytic capacitor |
| WO2012042936A1 (en) * | 2010-09-29 | 2012-04-05 | オムロン株式会社 | Electrolytic capacitor socket |
| CN113555223A (en) * | 2020-04-25 | 2021-10-26 | 四川艾华电子有限公司 | Aluminum electrolytic capacitor capper seals swager constructs |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102019119538A1 (en) * | 2019-07-18 | 2021-01-21 | Tdk Electronics Ag | capacitor |
-
1994
- 1994-06-15 JP JP13282494A patent/JP3497242B2/en not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102004037843A1 (en) * | 2004-08-04 | 2006-02-23 | Epcos Ag | Electrical housing has a feature with a weakened cross sectional thickness providing a burst action at high pressure |
| WO2012042936A1 (en) * | 2010-09-29 | 2012-04-05 | オムロン株式会社 | Electrolytic capacitor socket |
| JP2012074561A (en) * | 2010-09-29 | 2012-04-12 | Omron Corp | Socket for electrolytic capacitor |
| CN102598171A (en) * | 2010-09-29 | 2012-07-18 | 欧姆龙株式会社 | Electrolytic Capacitor Socket |
| WO2012042937A1 (en) * | 2010-09-30 | 2012-04-05 | オムロン株式会社 | Surface mount socket for electrolytic capacitor and surface mount method for electrolytic capacitor |
| JP2012079756A (en) * | 2010-09-30 | 2012-04-19 | Omron Corp | Surface mounting socket for electrolytic capacitor, and method for surface mounting of electrolytic capacitor |
| CN102598172A (en) * | 2010-09-30 | 2012-07-18 | 欧姆龙株式会社 | Surface mount socket for electrolytic capacitor and surface mount method for electrolytic capacitor |
| CN113555223A (en) * | 2020-04-25 | 2021-10-26 | 四川艾华电子有限公司 | Aluminum electrolytic capacitor capper seals swager constructs |
| CN113555223B (en) * | 2020-04-25 | 2024-05-03 | 四川艾华电子有限公司 | Sealing and pressing mechanism of aluminum electrolytic capacitor sealing machine |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3497242B2 (en) | 2004-02-16 |
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