JPH0732222B2 - Integrated circuit cooling structure - Google Patents
Integrated circuit cooling structureInfo
- Publication number
- JPH0732222B2 JPH0732222B2 JP63253539A JP25353988A JPH0732222B2 JP H0732222 B2 JPH0732222 B2 JP H0732222B2 JP 63253539 A JP63253539 A JP 63253539A JP 25353988 A JP25353988 A JP 25353988A JP H0732222 B2 JPH0732222 B2 JP H0732222B2
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- refrigerant
- counterbore
- substrate
- circuit element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は集積回路の冷却構造、特に集積回路素子で発生
した熱を集積回路素子の近傍に流す液体に効率的に伝播
させる集積回路の冷却構造に関する。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling structure for an integrated circuit, and more particularly to cooling an integrated circuit that efficiently transfers heat generated in the integrated circuit element to a liquid flowing in the vicinity of the integrated circuit element. Regarding the structure.
従来、この種の集積回路の冷却構造は、例えば特許公開
番号62−122156に示されているように、集積回路素子と
微小間隔を保って固定され、充填された熱伝導性コンパ
ウンドを介して熱伝導がはかられる伝熱板と、この伝熱
板に密着して設けられ、内部に冷媒を流す冷却容器とを
有している。Conventionally, this kind of integrated circuit cooling structure is fixed to an integrated circuit element with a minute gap, as shown in, for example, Japanese Patent Publication No. 62-122156, and is cooled by a heat-conductive compound filled therein. It has a heat transfer plate that conducts heat and a cooling container that is provided in close contact with the heat transfer plate and allows a refrigerant to flow inside.
上述した従来の冷却構造は、集積回路素子から発生する
熱が多くなる程、冷媒の流量を増大させて対応しなけれ
ばならないため、冷媒の供給装置が大型化し、また伝熱
板と冷媒を流す冷却容器とが別であるため、集積回路素
子と冷媒との熱抵抗を低くしにくいという欠点がある。In the conventional cooling structure described above, as the heat generated from the integrated circuit element increases, the flow rate of the refrigerant has to be increased to cope with the increase in the size of the refrigerant supply device, and the heat transfer plate and the refrigerant flow. Since it is separate from the cooling container, there is a drawback that it is difficult to reduce the thermal resistance between the integrated circuit element and the refrigerant.
本発明の集積回路の冷却構造は、複数の集積回路素子を
基板に実装した集積回路と、前記基板を保持する基板枠
と、この基板枠に密着して前記複数の集積回路素子と微
小間隔を保って対向する外面を有し、前記集積回路素子
と対向する反対面にざぐり穴を有し、かつこのざぐり穴
の底面にこの底面の中心から偏位した点を中心に扇状に
設けたフィンを有する冷却板と、前記ざぐり穴に冷媒を
供給する吸入口とこの吸入口に取付けられこのざぐり穴
の底面に設けられた扇状のフィンの中心に冷媒を噴出す
るノズルとこのざぐり穴から冷媒を排出するための流路
とを有して前記冷却板に密着して設けられた冷媒誘導器
とを有することにより構成される。An integrated circuit cooling structure of the present invention is an integrated circuit in which a plurality of integrated circuit elements are mounted on a substrate, a substrate frame that holds the substrate, and a minute gap between the plurality of integrated circuit elements that are closely attached to the substrate frame. A fin provided in a fan shape around the point deviated from the center of the bottom face of the counterbore hole, and having a countersink hole on the opposite face facing the integrated circuit element. The cooling plate, the inlet for supplying the coolant to the counterbore, the nozzle for ejecting the coolant to the center of the fan-shaped fin attached to the inlet and provided on the bottom of the counterbore, and the coolant discharged from the counterbore And a cooling medium inductor provided in close contact with the cooling plate.
次に、本発明の実施例について図面を参照して説明す
る。Next, embodiments of the present invention will be described with reference to the drawings.
第１図は本発明の一実施例の断面図、第２図は第１図の
冷媒の噴流衝突するざぐり穴の底部の平面図である。第
１図および第２図において、基板１には複数の集積回路
素子２が実装されて集積回路を構成している。基板１の
外周部は基板枠３に強固に固定されている。集積回路素
子２の上面には、集積回路素子２と反対方向の面にそれ
ぞれの集積回路素子２に対応してざぐり穴５を有する冷
却板６が熱伝導性コンパウンド４を介して設けられ、冷
却板６は基板枠３に固定されている。またざぐり穴５の
底面には、ざぐり穴５の中心から偏位した点７を中心に
広がる扇状のフィン８が形成されている。冷却板６の上
には、冷媒９を各ざぐり穴５に供給する吸入口10と、各
ざぐり穴５に供給された冷媒９を排出し、更に次のざぐ
り穴５の吸入口へ導き、冷媒９の流れを連続させる流路
11を有する冷媒誘導器12が密着されている。また吸入口
10には供給された冷媒９をざぐり穴５の底部に形成され
た扇状のフィン８の中心７に向って噴出させるノズル13
が取付けられている。FIG. 1 is a cross-sectional view of an embodiment of the present invention, and FIG. 2 is a plan view of the bottom portion of a counterbore hole against which the refrigerant jet flow of FIG. 1 collides. In FIGS. 1 and 2, a plurality of integrated circuit elements 2 are mounted on a substrate 1 to form an integrated circuit. The outer peripheral portion of the substrate 1 is firmly fixed to the substrate frame 3. On the upper surface of the integrated circuit element 2, a cooling plate 6 having counterbores 5 corresponding to each integrated circuit element 2 on the surface opposite to the integrated circuit element 2 is provided via a heat conductive compound 4 for cooling. The plate 6 is fixed to the substrate frame 3. Further, on the bottom surface of the countersunk hole 5, a fan-shaped fin 8 is formed which spreads around a point 7 deviated from the center of the countersunk hole 5. On the cooling plate 6, the suction port 10 for supplying the refrigerant 9 to each countersunk hole 5 and the coolant 9 supplied to each countersunk hole 5 are discharged and further guided to the suction port of the next countersunk hole 5, Flow path for continuous flow of 9
A refrigerant inductor 12 having 11 is in close contact. Also suction port
A nozzle 13 for ejecting the supplied coolant 9 toward a center 7 of a fan-shaped fin 8 formed at the bottom of the counterbore 5
Is installed.
以上の構造において冷媒９は、冷媒誘導器12の吸入口10
からノズル13に流れ、ノズル13から噴出してざぐり穴５
の底部に衝突して底面を冷却し、さらに扇状のフィン８
の熱を奪いながら、矢印14に示すようにフィンに沿って
流れ、排出口となる流路11へ流れ込む。流路11に入った
冷媒は次のざぐり穴５の吸入口10へ流れ、再び次のノズ
ル13から噴出する。冷媒９はこのような流れを繰返して
最後に外部へ排出される。In the above structure, the refrigerant 9 is the suction port 10 of the refrigerant inductor 12.
From the nozzle 13 to the nozzle 13 and jet from the nozzle 13
Collides with the bottom of the fan to cool the bottom surface, and the fan-shaped fins 8
While taking away the heat of the above, it flows along the fins as shown by the arrow 14 and flows into the flow path 11 serving as the discharge port. The refrigerant having entered the flow path 11 flows to the suction port 10 of the next counterbore 5 and is jetted again from the next nozzle 13. The refrigerant 9 repeats such a flow and is finally discharged to the outside.
以上説明したように本発明は、集積回路素子から発生す
る熱を冷却板に設けた扇状のフィンに導き、冷媒に接す
る面積を広げたことと、冷媒の流れの連続性を改善した
ことにより、集積回路素子と冷媒との間の熱抵抗が低く
押えられ、冷媒の流量を少なくして効率的に熱を機器の
外部へ排出できる効果がある。As described above, the present invention guides the heat generated from the integrated circuit element to the fan-shaped fins provided on the cooling plate, widens the area in contact with the refrigerant, and improves the continuity of the refrigerant flow, The thermal resistance between the integrated circuit element and the refrigerant is kept low, and the flow rate of the refrigerant is reduced, so that heat can be efficiently discharged to the outside of the device.
第１図は本発明の一実施例の断面図、第２図は第１図の
ざぐり穴の底部の平面図である。 １…基板、２…集積回路素子、３…基板枠、４…熱伝導
性コンパウンド、５…ざぐり穴、６…冷却板、８…フィ
ン、９…冷媒、10…吸入口、11…流路、12…冷媒誘導
器、13…ノズル。FIG. 1 is a sectional view of an embodiment of the present invention, and FIG. 2 is a plan view of the bottom portion of the counterbore hole of FIG. DESCRIPTION OF SYMBOLS 1 ... Substrate, 2 ... Integrated circuit element, 3 ... Substrate frame, 4 ... Thermally conductive compound, 5 ... Counterbore, 6 ... Cooling plate, 8 ... Fin, 9 ... Refrigerant, 10 ... Suction port, 11 ... Flow path, 12 ... Refrigerant inductor, 13 ... Nozzle.
Claims (1)
回路と、前記基板を保持する基板枠と、この基板枠に密
着して前記複数の集積回路素子と微小間隔を保って対向
する外面を有し、前記集積回路素子と対向する反対面に
ざぐり穴を有し、かつこのざぐり穴の底面にこの底面の
中心から偏位した点を中心に扇状に設けたフィンを有す
る冷却板と、前記ざぐり穴に冷媒を供給する吸入口とこ
の吸入口に取付けられこのざぐり穴の底面に設けられた
扇状のフィンの中心に冷媒を噴出するノズルとこのざぐ
り穴から冷媒を排出するための流路とを有して前記冷却
板に密着して設けられた冷媒誘導器とを有することを特
徴とする集積回路の冷却構造。1. An integrated circuit in which a plurality of integrated circuit devices are mounted on a substrate, a substrate frame for holding the substrate, and an outer surface which is in close contact with the substrate frame and faces the plurality of integrated circuit devices with a minute gap therebetween. A cooling plate having a countersink hole on the opposite surface facing the integrated circuit element, and a fin provided in a fan shape around the point deviated from the center of the bottom surface on the bottom surface of the countersink hole, An inlet for supplying the refrigerant to the counterbore, a nozzle for ejecting the refrigerant to the center of a fan-shaped fin provided on the bottom of the counterbore attached to the inlet, and a flow path for discharging the refrigerant from the counterbore And a cooling medium inductor provided in close contact with the cooling plate.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63253539A JPH0732222B2 (en) | 1988-10-06 | 1988-10-06 | Integrated circuit cooling structure |
| DE68918156T DE68918156T2 (en) | 1988-05-09 | 1989-05-08 | Flat cooling structure for integrated circuit. |
| EP89304623A EP0341950B1 (en) | 1988-05-09 | 1989-05-08 | Flat cooling structure of integrated circuit |
| CA000599031A CA1303238C (en) | 1988-05-09 | 1989-05-08 | Flat cooling structure of integrated circuit |
| US07/349,411 US5023695A (en) | 1988-05-09 | 1989-05-08 | Flat cooling structure of integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63253539A JPH0732222B2 (en) | 1988-10-06 | 1988-10-06 | Integrated circuit cooling structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02100350A JPH02100350A (en) | 1990-04-12 |
| JPH0732222B2 true JPH0732222B2 (en) | 1995-04-10 |
Family
ID=17252777
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63253539A Expired - Lifetime JPH0732222B2 (en) | 1988-05-09 | 1988-10-06 | Integrated circuit cooling structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0732222B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2088821C (en) * | 1992-02-05 | 1999-09-07 | Hironobu Ikeda | Cooling structure for integrated circuit |
| JP4382445B2 (en) * | 2003-11-18 | 2009-12-16 | トヨタ自動車株式会社 | Cooling structure for electrical equipment |
| JP4649359B2 (en) | 2006-04-06 | 2011-03-09 | トヨタ自動車株式会社 | Cooler |
| JP5099431B2 (en) | 2008-02-15 | 2012-12-19 | アイシン・エィ・ダブリュ株式会社 | Inverter unit |
-
1988
- 1988-10-06 JP JP63253539A patent/JPH0732222B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02100350A (en) | 1990-04-12 |
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