JPH0729827U - Surface mount components - Google Patents
Surface mount componentsInfo
- Publication number
- JPH0729827U JPH0729827U JP6272493U JP6272493U JPH0729827U JP H0729827 U JPH0729827 U JP H0729827U JP 6272493 U JP6272493 U JP 6272493U JP 6272493 U JP6272493 U JP 6272493U JP H0729827 U JPH0729827 U JP H0729827U
- Authority
- JP
- Japan
- Prior art keywords
- surface mount
- mount component
- adhesive
- printed circuit
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】
【目的】 プリント基板Ｓに固定した後は、後加工を一
切必要としない表面実装部品を提供する。
【構成】 表面実装部品本体のプリント基板に接触させ
て取付ける面に、熱溶融性の固形接着剤を取付けて、端
子をプリントパタ−ンに半田付けすれば、その熱により
固形接着剤が溶融し、冷却されれば接着剤が硬化して、
部品本体の基板への接触面が基板に強固に接着されるよ
うにした。
(57) [Abstract] [Purpose] To provide a surface mount component that does not require any post-processing after being fixed to a printed circuit board S. [Structure] If a heat-melting solid adhesive is attached to the surface of the surface-mounted component body that is to be contacted with the printed circuit board and the terminals are soldered to the print pattern, the heat will melt the solid adhesive. , The adhesive hardens when cooled,
The contact surface of the component body with respect to the substrate is firmly adhered to the substrate.
Description
【０００１】[0001]
本考案は、プリント基板に取付けた後で、剥離するおそれのない表面実装部品 に関するものである。 The present invention relates to a surface mount component that does not peel off after being mounted on a printed circuit board.
【０００２】[0002]
プリント基板に取付けて使用する接続部品である表面実装部品は、従来、図４ に示すように、その本体11に設けた端子12をプリント基板Ｓに設けられたプリン トパタ−ンＰに半田付け13により取付けていたが、これではパタ−ンのみに固定 されることになるので、前記基板Ｓへの固定強度が弱く、特にジャック等を頻繁 に挿抜するものにあっては、図５に示すように、パタ−ンＰがプリント基板Ｓか ら剥離して使用不能になることが多いという問題点がある。 Conventionally, as shown in FIG. 4, a surface mount component, which is a connecting component to be mounted on a printed circuit board, solders a terminal 12 provided on its main body 11 to a print pattern P provided on a printed circuit board S. However, since it is fixed only to the pattern, the fixing strength to the board S is weak, and in the case where a jack or the like is frequently inserted and removed, as shown in FIG. In addition, there is a problem that the pattern P is often peeled off from the printed circuit board S and becomes unusable.
【０００３】 そこで、プリント基板Ｓへの固定強度を高めるために、図６に示すように、前 記本体11に補強金具14を被せると共にその脚4aを基板Ｓに貫通させて、ひねり止 め15したり、半田付けする方法や、図７に示すように、セット本体に細工してそ のシャ−シ16等で押えて固定する方法が採られていた。Therefore, in order to increase the fixing strength to the printed board S, as shown in FIG. 6, the main body 11 is covered with the reinforcing metal fittings 14 and the legs 4a thereof are penetrated into the board S to prevent the twist 15 A method of soldering or soldering, or a method of making a work on the set body and pressing and fixing it with the chassis 16 etc. as shown in FIG.
【０００４】 然し乍ら、上記のように補強金具４を後付けしたり、セット本体に加工する方 法は、作業が面倒であるばかりでなく、セット本体の設計に制約を受けるし、ま た、工費が高く付いて、表面実装部品の価格的なメリットが相殺されてしまうと いう新たな問題点を派生しているのが現状である。However, the method of retrofitting the reinforcing metal fittings 4 or processing the set body as described above is not only labor-intensive, but is also restricted by the design of the set body, and the construction cost is high. The current situation is that it comes at a high cost and offsets the price merit of surface mount components.
【０００５】[0005]
本考案は、上記のような従来技術に鑑み、プリント基板に固定した後は、後加 工を一切必要としない表面実装部品を提供することを、その課題とするものであ る。 In view of the above-mentioned conventional technique, the present invention has an object to provide a surface mount component that does not require any post-processing after being fixed to a printed circuit board.
【０００６】[0006]
本考案は上記課題を解決することを目的としてなされたもので、その構成は、 表面実装部品本体のプリント基板に接触させて取付ける面に、熱溶融性の固形接 着剤を取付けたことを特徴とするものである。 The present invention has been made in order to solve the above problems, and is characterized in that a heat-melting solid adhesive is attached to the surface of the body of the surface mount component that is to be brought into contact with the printed board. It is what
【０００７】[0007]
表面実装部品本体の端子をプリントパタ−ンに半田付けにより接続する際にプ リヒ−トするが、このプリヒ−ト熱（約90〜100℃ 50秒）及び半田の熱により、 固形接着剤が溶融して基板との接触面全体に流動し、その後、冷却と共に前記接 着剤は硬化して、前記本体は基板に強固に接着され、その固定強度は極めて高い ものとなる。 When the terminals of the surface mount component are connected to the print pattern by soldering, the preheat is applied (about 90 to 100 ° C for 50 seconds) and the heat of the solder causes the solid adhesive to After melting and flowing over the entire contact surface with the substrate, the adhesive is cured with cooling, and the main body is firmly adhered to the substrate, and its fixing strength becomes extremely high.
【０００８】 尚、上記の接着剤としては、例えば、エポキシ固形封止接着剤が好適である。 この接着剤は、「メルトキュア・エポキシ」の商品名で市販されている未硬化状 態の成形品で、加熱することにより一旦溶融し、所定の部分に流動した後、硬化 し接着するものであるから、これを表面実装部品本体の底面に取付けておけば、 半田付け時のプリヒ−ト熱により溶融して、基板と表面実装部品本体の底面間を 流動し、冷却すれば、硬化し、接着するので、表面実装部品の基板への高い固定 強度を得られる。As the above-mentioned adhesive, for example, an epoxy solid sealing adhesive is suitable. This adhesive is an uncured molded product that is marketed under the trade name of "Melt Cure Epoxy". It melts once by heating, flows into a prescribed part, and then cures and bonds. Therefore, if this is attached to the bottom surface of the surface mount component body, it melts due to preheat heat during soldering, flows between the board and the bottom surface of the surface mount component body, and when cooled, it hardens and adheres. Therefore, high fixing strength of the surface mount component to the substrate can be obtained.
【０００９】[0009]
次に、本考案の実施例を図により説明する。図１は本考案の一例の表面実装部 品の正面図、図２はプリント基板に取り付ける半田付け時に接着剤が溶融してい る状態の正面図、図３は図２の状態から接着剤が硬化してプリント基板に固定さ れた状態の正面図である。 Next, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a front view of a surface mount component according to an example of the present invention, FIG. 2 is a front view of a state in which an adhesive is melted during soldering for mounting on a printed circuit board, and FIG. 3 is a state in which the adhesive is cured from the state of FIG. FIG. 6 is a front view of the state in which the printed circuit board is fixed to the printed circuit board.
【００１０】 図１において、１は表面実装部品本体、２は該本体１に設けられた端子、３は 前記本体１のプリント基板Ｓに接触させて取り付ける面（この例では底面）にボ ス４により固定させて取付けた固形接着剤であり、以上により本考案の一例の表 面実装部品を構成する。尚、前記ボス４は前記本体１の位置決め用を兼ねるもの とする。In FIG. 1, reference numeral 1 is a surface mount component body, 2 is a terminal provided on the body 1, and 3 is a box 4 on a surface (bottom surface in this example) of the body 1 which is attached to the printed board S in contact therewith. It is a solid adhesive fixed and attached by the above, and the above constitutes the surface mount component of an example of the present invention. The boss 4 also serves to position the main body 1.
【００１１】 上記部品をプリント基板Ｓに取付けるには、図２に示すように、端子２を基板 Ｓの所望のプリントパタ−ンＰ上に配して、従来と同様に、該端子２を前記パタ −ンＰに半田付け５すればよい。こうすることにより、前記固形接着剤３は半田 付け時のプリヒ−ト熱及び半田の熱により溶融して、本体１の底面と基板Ｓとの 間で流動し、半田付けが終わって冷却されると、図３に示すように、接着剤３は 硬化して、本体１の底面は基板Ｓ上に強固に接着されるのである。In order to attach the above components to the printed board S, as shown in FIG. 2, the terminal 2 is arranged on the desired printed pattern P of the board S, and the terminal 2 is mounted in the same manner as in the conventional case. It is sufficient to solder 5 to the pattern P. By doing so, the solid adhesive 3 is melted by the preheat heat and the heat of the solder at the time of soldering, flows between the bottom surface of the main body 1 and the substrate S, and is cooled after the soldering. Then, as shown in FIG. 3, the adhesive 3 is cured and the bottom surface of the main body 1 is firmly adhered to the substrate S.
【００１２】 上記のようにして基板Ｓに取付けられた本考案表面実装部品は、本体の底面及 びプリントパタ−ンＰに固定されるから、その固定強度は高く、ジャック等を頻 繁に挿抜するものであっても、基板Ｓから剥離するおそれはおよそ皆無で、表面 実装部品として長所を充分に生かすことができる。Since the surface mount device of the present invention mounted on the board S as described above is fixed to the bottom surface of the main body and the print pattern P, its fixing strength is high and a jack or the like is frequently inserted and removed. However, there is almost no risk of peeling from the substrate S, and the advantages as a surface mount component can be fully utilized.
【００１３】[0013]
本考案は上述のとおりであって、本考案表面実装部品は、通常の表面実装及び 半田付け工程のみで、基板に強固に固定され、後加工の必要は全くなく、また、 セット本体での細工も不必要なため、セット本体における設計上の制約もなくな るので、表面実装部品としての長所を充分に発揮できる。 The present invention is as described above. The surface mount component of the present invention is firmly fixed to the board only by the normal surface mounting and soldering process, no post-processing is required, and the work on the set body is not necessary. Since it is unnecessary, there are no restrictions on the design of the set body, so the advantages as a surface mount component can be fully exerted.
【図１】本考案の一例の表面実装部品の正面図。FIG. 1 is a front view of an example of surface mount components of the present invention.
【図２】プリント基板に取り付ける半田付け時に接着剤
が溶融している状態の正面図。FIG. 2 is a front view of a state in which an adhesive is melted during soldering for mounting on a printed circuit board.
【図３】図２の状態から接着剤が硬化してプリント基板
に固定された状態の正面図。FIG. 3 is a front view of the state in which the adhesive is cured and fixed to the printed board from the state of FIG.
【図４】従来の表面実装部品をプリント基板に取付けた
状態の正面図。FIG. 4 is a front view of a conventional surface mount component mounted on a printed circuit board.
【図５】図４の部品がコジリ等の力により、プリントパ
タ−ンが剥離した状態の正面図。FIG. 5 is a front view of the component of FIG. 4 in a state where the print pattern is peeled off due to a force such as bending.
【図６】補強金具を用いて部品をプリント基板に固定す
る例の正面図。FIG. 6 is a front view of an example of fixing a component to a printed circuit board using a reinforcing metal member.
【図７】セット本体のシャ−シ等により部品を押えて固
定した状態の正面図。FIG. 7 is a front view showing a state in which components are pressed and fixed by a chassis or the like of the set main body.
１ 表面実装部品本体 ２ 端子 ３ 固形接着剤 ４ ボス ５ 半田付け Ｓ プリント基板 Ｐ プリントパタ−ン 1 Surface Mount Component Main Body 2 Terminal 3 Solid Adhesive 4 Boss 5 Soldering S Printed Circuit Board P Printed Pattern
Claims (3)
させて取付ける面に、熱溶融性の固形接着剤を取付けた
ことを特徴とする表面実装部品。1. A surface mount component, characterized in that a heat-melting solid adhesive is attached to the surface of the surface mount component body that is in contact with and attached to a printed circuit board.
決めを兼ねる仮止め用のボスにより固定した請求項１に
記載の表面実装部品。2. The surface mount component according to claim 1, wherein the solid adhesive is fixed by a temporary fixing boss that also serves as positioning of the surface mount component main body.
より一旦溶融し、冷却により硬化すると共に、接着する
タイプのものである請求項１に記載の表面実装部品。3. The surface-mounted component according to claim 1, wherein the adhesive is a molded product in an uncured state, which is of a type that is once melted by heating, hardened by cooling, and bonded together.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6272493U JPH0729827U (en) | 1993-10-29 | 1993-10-29 | Surface mount components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6272493U JPH0729827U (en) | 1993-10-29 | 1993-10-29 | Surface mount components |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0729827U true JPH0729827U (en) | 1995-06-02 |
Family
ID=13208605
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6272493U Pending JPH0729827U (en) | 1993-10-29 | 1993-10-29 | Surface mount components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0729827U (en) |
-
1993
- 1993-10-29 JP JP6272493U patent/JPH0729827U/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3219793B2 (en) | Method for mounting SMD components on a substrate | |
| JPH06232186A (en) | Adhesion of electronic parts | |
| JPH0729827U (en) | Surface mount components | |
| JP2000208547A (en) | Bump reinforcing structure and its forming method in semiconductor device | |
| JP2731383B2 (en) | Component mounting structure and component mounting method | |
| JP3072602U (en) | Flexible PCB connection structure | |
| JPH01230292A (en) | Soldering method for surface mounting parts | |
| JPS5834993A (en) | Method of mounting electronic part | |
| JP3430096B2 (en) | Semiconductor device mounting method | |
| JPS63296391A (en) | Method for mounting part on printed circuit board | |
| JP3233022B2 (en) | Electronic component joining method | |
| JP2501668Y2 (en) | Surface mount electrical components | |
| JPH02192792A (en) | Method of soldering electronic component with low thermal resistance | |
| JP2602389B2 (en) | Component mounting method | |
| JPH0726860Y2 (en) | Printed wiring board connection structure | |
| EP0851723A1 (en) | Method for mounting electronic parts | |
| JPH07170048A (en) | Component mounting structure of flexible printed-wiring board and mounting of component | |
| JP4023093B2 (en) | How to fix electronic components | |
| JPH034044Y2 (en) | ||
| JPH07201894A (en) | Manufacture of electronic parts mounting device | |
| JP3040682U (en) | Printed circuit | |
| JPS61287197A (en) | Manufacture of electronic component | |
| JPS63177584A (en) | Assembly of hybrid integrated circuit | |
| JP2001007508A (en) | Method for removing parts and method for fitting the same | |
| JP3284890B2 (en) | Bonding method of work with bump |