JPH07297534A - Method and device for supplying connection material to wiring substrate - Google Patents
Method and device for supplying connection material to wiring substrateInfo
- Publication number
- JPH07297534A JPH07297534A JP8926794A JP8926794A JPH07297534A JP H07297534 A JPH07297534 A JP H07297534A JP 8926794 A JP8926794 A JP 8926794A JP 8926794 A JP8926794 A JP 8926794A JP H07297534 A JPH07297534 A JP H07297534A
- Authority
- JP
- Japan
- Prior art keywords
- mask
- wiring
- wiring board
- connecting material
- solder paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、半導体装置を配線基板
へ接続するに際し、前記配線基板上の配線電極へ半田ペ
ーストなどの接続材料を供給する方法及び装置に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and apparatus for supplying a connecting material such as solder paste to wiring electrodes on a wiring board when connecting a semiconductor device to the wiring board.
【0002】[0002]
【従来の技術】従来、配線基板上への半田ペースト5の
供給には、スクリーン印刷法が採用されている。図8
(a)はこのスクリーン印刷法により配線基板に半田ペ
ーストを供給する装置の斜視図である。載置台23は前
後方向に移動し、スキージ22はレバー25の操作で上
下及び前後の動きをする。ガラスエポキシ基板などの配
線基板3を載置台23上の所定の位置に置き、載置台2
3を移動させて配線基板3を所望の印刷パターンが形成
されているスクリーンマスク21の下に配置し、そのス
クリーンマスク21上に半田ペースト5を載せ、図8
(b)の断面図に示すようにスキージ22を一定の圧力
をかけてスクリーンマスク21を介して配線基板3に押
しつけて移動させて謄写印刷の要領で配線基板3上に半
田ペースト5のパターン13を形成する。半田ペースト
5の代わりに導電性ペーストのパターンを配線基板に形
成する場合も同一の装置を使用し、手順も同様である。2. Description of the Related Art Conventionally, a screen printing method has been used to supply the solder paste 5 onto a wiring board. Figure 8
(A) is a perspective view of an apparatus for supplying a solder paste to a wiring board by this screen printing method. The mounting table 23 moves in the front-rear direction, and the squeegee 22 moves up and down and back and forth by operating the lever 25. The wiring board 3 such as a glass epoxy board is placed at a predetermined position on the mounting table 23, and the mounting table 2
3 is moved to dispose the wiring board 3 under the screen mask 21 on which a desired print pattern is formed, and the solder paste 5 is placed on the screen mask 21.
As shown in the sectional view of (b), the squeegee 22 is pressed against the wiring board 3 through the screen mask 21 with a certain pressure to move the squeegee 22, and the pattern 13 of the solder paste 5 is printed on the wiring board 3 in the manner of the transcription printing. To form. The same apparatus is used when the pattern of the conductive paste is formed on the wiring board instead of the solder paste 5, and the procedure is the same.
【0003】また半田ペーストを配線基板上に印刷する
他の方法として特開昭58−102533号公報に記載
された様な方法がある。この方法は配線基板上の図9
(a)に示す一定ピッチで列設された配線電極7の形状
よりも、ピッチ方向の開口幅が小さく、ピッチ方向と垂
直方向の開校幅は大きくした図9(b)に示すように開
口部6を設けたメタルマスクを使用して印刷を行ってい
る。Another method for printing a solder paste on a wiring board is disclosed in Japanese Patent Laid-Open No. 58-102533. This method is shown in FIG.
As shown in FIG. 9B, the opening width in the pitch direction is smaller and the opening width in the direction perpendicular to the pitch direction is larger than the shape of the wiring electrodes 7 arranged in a row at a constant pitch shown in FIG. Printing is performed using the metal mask provided with 6.
【0004】[0004]
【発明が解決しようとする課題】図8に示す従来のスク
リーン印刷法はパターンが微細化するに伴って、半田ペ
ーストのスクリーンマスクからの抜け性が悪くなり、微
細パターンの印刷は難しいといった問題点があった。ま
た、所望のパターンどうりに開口部を精度良く形成する
必要があり、スクリーンマスクの設計制作に費用、時間
ともにかかっていた。さらにスキージやスクリーンマス
クに付着して廃棄される半田ペーストの量が多く不経済
であるといった問題点があった。The conventional screen printing method shown in FIG. 8 has a problem that it is difficult to print a fine pattern as the pattern becomes finer so that the solder paste cannot be easily removed from the screen mask. was there. In addition, it is necessary to accurately form the openings in a desired pattern, and it takes both cost and time to design and manufacture the screen mask. Further, there is a problem that it is uneconomical because the amount of the solder paste attached to the squeegee or the screen mask and discarded is large.
【0005】また図9に示す印刷方法も印刷後のブリッ
ジは減少するが、パターンが微細化すると上述した点が
問題となってくる。The printing method shown in FIG. 9 also reduces the number of bridges after printing, but the problem described above becomes a problem when the pattern is miniaturized.
【0006】[0006]
【課題を解決するための手段】本発明の配線基板上への
接続材料供給方法は、配線基板上の配線電極に対応して
開口部を設けたマスクを前記配線基板上に載置し、吐出
器を前記開口部上を横切るように移動させ、前記吐出器
から連続して吐出される接続材料による前記吐出器の横
切る方向と垂直な方向の前記開口部の幅より狭い線幅の
線状の軸跡を前記開口部を横切って描かせた後に前記マ
スクを前記配線基板から除去し、前記吐出器から吐出さ
れた接続材料を前記開口部を通して前記配線電極上に塗
布することを特徴とする。A method of supplying a connecting material onto a wiring board according to the present invention is to place a mask having openings corresponding to the wiring electrodes on the wiring board on the wiring board, and eject the mask. By moving the container across the opening so that the connecting material continuously discharged from the discharger has a linear width narrower than the width of the opening in a direction perpendicular to the crossing direction of the discharger. The mask may be removed from the wiring substrate after an axial trace is drawn across the opening, and the connection material discharged from the discharger may be applied onto the wiring electrode through the opening.
【0007】[0007]
【作用】本発明では、接続材料が描く線と垂直な方向の
マスクの開口部の幅よりその線の幅を狭くしているた
め、線状に連続してマスク及び開口部に位置する配線基
板の配線電極に塗布された接続材料がマスクを配線基板
から除去する時に切断されるのは開口部の2方向の辺の
部分のみとなる。これにより配線電極に塗布するパター
ンが微小であっても接続材料のマスク開口部の抜け性が
良好になる。According to the present invention, since the width of the line is narrower than the width of the opening of the mask in the direction perpendicular to the line drawn by the connecting material, the wiring board which is continuously positioned linearly in the mask and the opening. When the mask is removed from the wiring board, the connecting material applied to the wiring electrode is cut only at the two sides of the opening. As a result, even if the pattern applied to the wiring electrode is minute, the removal of the connecting material through the mask opening is improved.
【0008】また、吐出器から吐出される接続材料の軸
跡の線幅を前記吐出器の横切る方向の開口部の幅より狭
くすることにより、接続材料の開口部の抜け性をさらに
良好にできる。Further, by making the line width of the axial trace of the connecting material discharged from the discharging device narrower than the width of the opening in the transverse direction of the discharging device, the detachability of the connecting material opening can be further improved. .
【0009】通常配線基板には複数の配線電極が一定の
ピッチで配列されているが、このような場合は配線電極
に対応してマスクに複数の開口部を一定のピッチで配列
し、吐出器を前記配線電極が配列された方向に移動させ
て前記マスク上に接続材料による線状の軸跡を描かせば
よい。Usually, a plurality of wiring electrodes are arranged on the wiring board at a constant pitch. In such a case, a plurality of openings are arranged on the mask at a constant pitch corresponding to the wiring electrodes, and the ejector is arranged. May be moved in the direction in which the wiring electrodes are arranged to draw a linear axis trace of the connecting material on the mask.
【0010】[0010]
【実施例】次に、本発明の実施例について、図面を参照
して詳細に説明する。Embodiments of the present invention will now be described in detail with reference to the drawings.
【0011】図1は本発明の一実施例の接続材料供給装
置の斜視図である。FIG. 1 is a perspective view of a connecting material supplying apparatus according to an embodiment of the present invention.
【0012】基台1上にはX方向(左右方向)、Y方向
(前後方向)それぞれに移動可能なXYテーブルが配置
されている。XYテーブル2の上面にガラスエポキシ等
の配線基板3が配置固定される。配線基板3の材質とし
てはガラスエポシキの他にアルミナ、窒化アルミニウム
(ALN)、ガラスセラミック、ガラス等も使用でき
る。配線基板3上にマスク4が位置合わせされたうえ固
定配置される。An XY table is arranged on the base 1 so as to be movable in the X direction (left-right direction) and the Y direction (front-back direction). A wiring board 3 made of glass epoxy or the like is arranged and fixed on the upper surface of the XY table 2. As the material of the wiring board 3, besides glass epoxy, alumina, aluminum nitride (ALN), glass ceramic, glass or the like can be used. The mask 4 is aligned and fixedly arranged on the wiring board 3.
【0013】図2の平面図に示すようにマスク4の開口
部6は、半田ペーストが供給されるべきパターンの配列
方向Aは配線基板3上の配線電極7(図3参照)と同ピ
ッチpの配列を有して配線電極7上に位置し、配列方向
Aの開口幅aは配線電極7の幅よりも小さい寸法になっ
ており、パターンの配列方向Aと垂直な方向の開口幅b
は配線電極7の幅よりも大きくなっている。As shown in the plan view of FIG. 2, the openings 6 of the mask 4 have the same pitch p as the wiring electrodes 7 (see FIG. 3) on the wiring substrate 3 in the arrangement direction A of the pattern to which the solder paste is to be supplied. Are arranged on the wiring electrode 7 in the arrangement direction A, the opening width a in the arrangement direction A is smaller than the width of the wiring electrode 7, and the opening width b in the direction perpendicular to the pattern arrangement direction A.
Is larger than the width of the wiring electrode 7.
【0014】配線基板3およびマスク4の上方には、基
台1から吐出器8の支持用アーム9が延設されており、
アーム9の先端部にはパターン形成用の半田ペースト5
を蓄えるシリンジを備えた吐出器8がXYテーブル2に
相対するように鉛直下向きに固定されている。この吐出
器8はマイクロコンピュータ10によりその吐出動作を
制御され、シリンジ内の半田ペースト5を配線基板3上
に空気圧によって吐出させる。吐出器8の先端ノズル1
の内径は半田ペースト5のパターンの幅cと同寸法にな
っている。Above the wiring board 3 and the mask 4, an arm 9 for supporting the ejector 8 is extended from the base 1.
Solder paste 5 for pattern formation is formed on the tip of arm 9.
A dispenser 8 equipped with a syringe for storing is fixed vertically downward so as to face the XY table 2. The discharging operation of the discharging device 8 is controlled by the microcomputer 10, and the solder paste 5 in the syringe is discharged onto the wiring board 3 by air pressure. Discharge device 8 tip nozzle 1
The inner diameter of is the same as the width c of the pattern of the solder paste 5.
【0015】マイクロコンピュータ10は吐出器8を吐
出動作させるとともにXYテーブル2の駆動用のサーボ
モータ12a、12bを同時に動作させることにより、
配線基板3およびマスク4上に半田ペースト5を任意の
軸跡を描く線状に供給する。この状態を図3(a)の平
面図及び図4(a)の断面図に示す。The microcomputer 10 discharges the discharger 8 and simultaneously operates the servomotors 12a and 12b for driving the XY table 2,
The solder paste 5 is linearly drawn on the wiring board 3 and the mask 4 to draw an arbitrary axis trace. This state is shown in the plan view of FIG. 3A and the sectional view of FIG.
【0016】吐出動作完了後、マスク4を配線基板3上
より取り去ることにより、配線基板3上には所用の矩形
(a×c)の半田ペーストパターン13が形成される。
この状態を図3(b)の平面図及び図4(b)の断面図
に示す。After the discharge operation is completed, the mask 4 is removed from the wiring board 3 to form a desired rectangular (a × c) solder paste pattern 13 on the wiring board 3.
This state is shown in the plan view of FIG. 3B and the sectional view of FIG.
【0017】吐出器8の先端ノズル11は交換可能であ
り、先端ノズル11の内径を変化させることにより、半
田ペースト5の幅を変更することができる。配線電極7
上に供給される半田ペーストパターン13の形状を矩形
にする場合に半田ペースト5の供給幅cを開口部6の配
列方向の開口幅aよりも小さくすることによって、半田
ペースト5のマスク4からの抜け性がよくなり、微細パ
ターンの形成が容易になる。The tip nozzle 11 of the ejector 8 is replaceable, and the width of the solder paste 5 can be changed by changing the inner diameter of the tip nozzle 11. Wiring electrode 7
When the shape of the solder paste pattern 13 supplied above is made rectangular, the supply width c of the solder paste 5 is made smaller than the opening width a in the arrangement direction of the openings 6, so that the solder paste 5 from the mask 4 is removed. The release property is improved and the fine pattern is easily formed.
【0018】また図5に示すように、配線基板3の配線
電極7上へ半田ペーストパターン13をなす半田ペース
トを供給し、バンプ14を形成済みのSiチップ15を
位置合わせした後にフェイスダウンで搭載することによ
り、フリプチップ接続を行うことができる。Further, as shown in FIG. 5, the solder paste forming the solder paste pattern 13 is supplied onto the wiring electrodes 7 of the wiring board 3, the Si chips 15 on which the bumps 14 are formed are aligned, and then mounted face down. By doing so, flip chip connection can be performed.
【0019】このような接続材料の供給装置により、図
6に示すように放射状に開口部6を設け円弧状に吐出器
8と配線基板3およびマスク4とを相対移動させること
により(図中B方向)、円弧状に配列された半田ペース
トのパターンを形成することができる。With such a connecting material supply device, as shown in FIG. 6, the openings 6 are radially provided and the ejector 8 and the wiring board 3 and the mask 4 are moved relative to each other in an arc shape (B in the figure). Direction), it is possible to form a solder paste pattern arranged in an arc shape.
【0020】図7(a),(b)は配線基板上に配列さ
れた配線電極7のピッチの1/2のピッチでマスクの開
口部6を配列し、1つの配線電極7に2つの開口部6が
位置するようにし、開口部6の配列方向と直角な方向の
幅を配線電極7の幅より充分に大きくし、吐出器8によ
る半田ペースト5の供給軸跡を各配線電極7上に2本の
線を描くようにしたもので、各配線電極7上に4つずつ
の半田ペーストパターン13が形成される。この図7
(a),(b)に示す例のように、配線基板の1つの配
線電極7に対してマスクに複数個の開口部6を設けてお
き、1つの配線電極7上に、複数個のパターンを設ける
こともできる。7A and 7B, the openings 6 of the mask are arranged at a pitch of 1/2 of the pitch of the wiring electrodes 7 arranged on the wiring board, and two openings are formed in one wiring electrode 7. The portion 6 is positioned so that the width of the opening 6 in the direction perpendicular to the arrangement direction is sufficiently larger than the width of the wiring electrode 7, and the trace of the supply axis of the solder paste 5 by the ejector 8 is placed on each wiring electrode 7. Two lines are drawn so that four solder paste patterns 13 are formed on each wiring electrode 7. This Figure 7
As in the examples shown in (a) and (b), a plurality of openings 6 are provided in the mask for one wiring electrode 7 of the wiring board, and a plurality of patterns are formed on one wiring electrode 7. Can be provided.
【0021】マスク4の開口部の形状は矩形だけでな
く、三角形、その他多角形、または曲線にて囲まれた形
状とすることもでき、それによりパターンの形状を変更
することもできる。The shape of the opening of the mask 4 is not limited to a rectangle, but may be a triangle, other polygon, or a shape surrounded by a curve, and the shape of the pattern can be changed accordingly.
【0022】接続材料には半田ペーストのほか金属粒子
を樹脂に分散させた導電性ペーストなども使用可能であ
る。また、複数の配線電極及び開口部が配列された場合
のみならず、本発明は配線基板上に他の配線電極から離
れて設けられた1つの配線電極に1つの開口部を通して
接続材料を供給する場合にも適用できるのは勿論であ
る。Besides the solder paste, a conductive paste in which metal particles are dispersed in a resin can be used as the connecting material. In addition to the case where a plurality of wiring electrodes and openings are arranged, the present invention supplies the connection material to one wiring electrode provided on the wiring board and apart from other wiring electrodes through one opening. Of course, it can be applied to cases.
【0023】[0023]
【発明の効果】以上説明したように本発明の接続材料の
供給方法は、従来のスクリーン印刷法により印刷された
接続材料のパターンはスクリーンマスクの開口部の四方
向の辺で接続材料を切断して開口部を抜かなければなら
なかったなのに対し、本発明では、接続材料を線状に塗
布し、マスクの開口部の二方向はあらかじめマスク4の
開口部6を接続材料の線幅よりも大きく形成しているた
めに、残りの二方向のみについて接続材料を切断して抜
けばよいため、配線電極及びマスクの開口部が微細なパ
ターンになっても良好に半田ペースト等の接続材料をマ
スクの開口部を通して供給することができ、配線電極上
に接続材料の微細なパターンの形成を行うことができる
という効果を有する。As described above, in the method of supplying the connecting material of the present invention, the connecting material pattern printed by the conventional screen printing method cuts the connecting material at the four sides of the opening of the screen mask. However, in the present invention, the connecting material is linearly applied, and the opening 6 of the mask 4 is made larger than the line width of the connecting material in advance in two directions of the opening of the mask. Since the connecting material only needs to be cut and removed in the remaining two directions because it is formed, the connecting material such as the solder paste can be satisfactorily attached to the mask even if the wiring electrode and the opening of the mask have a fine pattern. It has an effect that it can be supplied through the opening and a fine pattern of the connection material can be formed on the wiring electrode.
【0024】また、マスクの開口部のパターンも吐出器
が横切って移動する方向の位置、寸法を精度良く加工す
れば良いため、設計制作の費用、時間ともに節約するこ
とができる。さらにマスクの全面にスキージを用いて接
続材料を塗り込むことなく、接続材料をマスク上に線状
に描かせるだけなので、スキージやマスクに付着して廃
棄されてしまう半田ペースト等の接続材料の量も減らす
ことができるといった効果を有する。Further, since the pattern of the opening portion of the mask may be processed with high precision in the position and dimensions in the direction in which the ejector moves across, the cost and time for design and production can be saved. Furthermore, the amount of connecting material such as solder paste that adheres to the squeegee or mask and is discarded because the connecting material is drawn linearly on the mask without applying the connecting material to the entire surface of the mask with a squeegee. It also has the effect that it can be reduced.
【図1】本発明の一実施例の接続材料の供給装置の斜視
図である。FIG. 1 is a perspective view of a connection material supply device according to an embodiment of the present invention.
【図2】図1に示す配線基板3上に載置されたマスク4
の平面図である。FIG. 2 is a mask 4 placed on the wiring board 3 shown in FIG.
FIG.
【図3】(a)は半田ペーストが供給されたマスク4の
開口部6及びその下の配線基板3の配線電極7を示す拡
大平面図、(b)は(a)の状態からマスクを取り去っ
た後の配線電極7上の半田ペーストパターンを示す拡大
平面図である。3A is an enlarged plan view showing an opening 6 of a mask 4 to which a solder paste is supplied and a wiring electrode 7 of a wiring substrate 3 below the opening 6; FIG. 3B is a state in which the mask is removed from the state of FIG. FIG. 6 is an enlarged plan view showing a solder paste pattern on the wiring electrode 7 after being bent.
【図4】(a)は図3(a)の側断面図、(b)は図3
(b)の側断面図である。4A is a side sectional view of FIG. 3A, and FIG.
It is a sectional side view of (b).
【図5】図4(b)の配線電極に半田ペーストパターン
が形成された配線基板3にSiチップをフリップチップ
マウントした状態を示す側断面図である。FIG. 5 is a side sectional view showing a state in which a Si chip is flip-chip mounted on the wiring board 3 in which the solder paste pattern is formed on the wiring electrodes of FIG. 4B.
【図6】本実施例により放射状に配列された複数の開口
部に半田ペーストを円弧状に塗布したものの平面図であ
る。FIG. 6 is a plan view of a circular arc-shaped solder paste applied to a plurality of openings arranged radially according to the present embodiment.
【図7】(a)は本実施例により各配線電極7に対し複
数の開口部6を設けたマスク6上に各配線電極7に2本
の軸跡を描くように吐出器から半田ペーストを供給した
状態を示す平面図であり、(b)は(a)の状態からマ
スクを除去した状態の配線電極7を示す平面図である。FIG. 7A shows solder paste from an ejector so that two wiring traces are drawn on each wiring electrode 7 on a mask 6 having a plurality of openings 6 for each wiring electrode 7 according to this embodiment. FIG. 7 is a plan view showing a state where the wiring electrode 7 is supplied, and FIG. 6B is a plan view showing the wiring electrode 7 in a state where the mask is removed from the state of FIG.
【図8】(a)及び(b)はそれぞれ従来の接続材料の
供給方法に用いられているスクリーン印刷機を示す斜視
図及びスクリーンマスク21等のその主要部を示す断面
図である。8A and 8B are respectively a perspective view showing a screen printing machine used in a conventional method of supplying a connecting material and a cross-sectional view showing a main part of a screen mask 21 and the like.
【図9】従来の他の接続材料の供給方法を示す図で、
(a)は配線基板上の配線電極を示す平面図、(b)は
マスクの開口部を示す平面図である。FIG. 9 is a diagram showing another conventional method of supplying a connecting material,
(A) is a plan view showing a wiring electrode on a wiring substrate, and (b) is a plan view showing an opening of a mask.
1 基台 2 XYテーブル 3 配線基板 4 マスク 5 半田ペースト 6 開口部 7 配線電極 8 吐出器 9 アーム 10 マイクロコンピュータ 11 先端ノズル 12a,b サーボモーター 13 半田ペーストパターン 14 バンプ 15 Siチップ 21 スクリーンマスク 22 スキージ 1 Base 2 XY Table 3 Wiring Board 4 Mask 5 Solder Paste 6 Opening 7 Wiring Electrode 8 Discharger 9 Arm 10 Microcomputer 11 Tip Nozzle 12a, b Servo Motor 13 Solder Paste Pattern 14 Bump 15 Si Chip 21 Screen Mask 22 Squeegee 22
Claims (6)
を設けたマスクを前記配線基板上に載置し、吐出器を前
記開口部上を横切るように移動させ、前記吐出器から連
続して吐出される接続材料による前記吐出器の横切る方
向と垂直な方向の前記開口部の幅より狭い線幅の線状の
軸跡を前記開口部を横切って描かせた後に前記マスクを
前記配線基板から除去し、前記吐出器から吐出された接
続材料を前記開口部を通して前記配線電極上に塗布する
ことを特徴とする配線基板上への接続材料の供給方法。1. A mask having an opening corresponding to a wiring electrode on a wiring board is placed on the wiring board, and an ejector is moved across the opening so as to be continuous from the ejector. The mask is wired after the linear axis trace having a line width narrower than the width of the opening in the direction perpendicular to the crossing direction of the discharger is drawn by the connecting material discharged by the crossing of the opening. A method for supplying a connection material onto a wiring board, which comprises removing the connection material from the substrate and applying the connection material discharged from the discharger onto the wiring electrode through the opening.
線幅が前記吐出器の横切る方向の開口部の幅より狭い請
求項1記載の配線基板上への接続材料の供給方法。2. The method of supplying a connecting material onto a wiring board according to claim 1, wherein the line width of the axial trace of the connecting material discharged from the discharger is narrower than the width of the opening in the transverse direction of the discharger.
複数の配線電極に対応してマスクに複数の開口部が一定
のピッチで配列され吐出器を前記配線電極が配列された
方向に移動させて前記マスク上に接続材料による線状の
軸跡を描かせる請求項1又は2記載の配線基板上への接
続材料の供給方法。3. A plurality of openings are arranged in a mask at a constant pitch corresponding to a plurality of wiring electrodes arranged at a constant pitch on a wiring board, and an ejector is moved in a direction in which the wiring electrodes are arranged. The method of supplying a connecting material onto a wiring board according to claim 1 or 2, wherein a linear axis trace of the connecting material is drawn on the mask.
スクに複数の開口部を設け、前記1つの配線電極に複数
のパターンからなる接続材料を塗布する請求項1,2又
は3記載の配線基板上への接続材料の供給方法。4. The wiring material according to claim 1, wherein a plurality of openings are provided in a mask for one wiring electrode on the wiring substrate, and a connection material having a plurality of patterns is applied to the one wiring electrode. A method of supplying a connecting material onto a wiring board.
樹脂内に分散させた導電性ペーストである請求項1乃至
4記載の配線基板上への接続材料の供給方法。5. The method for supplying a connecting material onto a wiring board according to claim 1, wherein the connecting material is a solder paste or a conductive paste in which metal particles are dispersed in a resin.
線基板上の配線電極に対応して開口部が設けられ前記配
線基板に載置されるマスクと、前記マスク上に接続材料
を吐出する吐出器と、前記吐出器に対し前記テーブルを
相対的に移動させて前記吐出器から連続して吐出される
前記接続材料による線状の基跡を描かせる移動手段と、
前記吐出器による前記接続材料の吐出動作を制御する制
御手段とを含むことを特徴とする接続材料の供給装置。6. A table on which a wiring board is placed, a mask which has openings corresponding to wiring electrodes on the wiring board and is placed on the wiring board, and a connecting material is discharged onto the mask. An ejector, and a moving means that moves the table relative to the ejector and draws a linear trace of the connecting material continuously ejected from the ejector,
A connection material supply device, comprising: a control unit that controls a discharge operation of the connection material by the discharger.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6089267A JP2540778B2 (en) | 1994-04-27 | 1994-04-27 | Method and apparatus for supplying connection material onto wiring board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6089267A JP2540778B2 (en) | 1994-04-27 | 1994-04-27 | Method and apparatus for supplying connection material onto wiring board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH07297534A true JPH07297534A (en) | 1995-11-10 |
JP2540778B2 JP2540778B2 (en) | 1996-10-09 |
Family
ID=13965984
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6089267A Expired - Lifetime JP2540778B2 (en) | 1994-04-27 | 1994-04-27 | Method and apparatus for supplying connection material onto wiring board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2540778B2 (en) |
-
1994
- 1994-04-27 JP JP6089267A patent/JP2540778B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP2540778B2 (en) | 1996-10-09 |
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