JPH07297231A - Jig and method for mounting chip on board - Google Patents
Jig and method for mounting chip on boardInfo
- Publication number
- JPH07297231A JPH07297231A JP8666794A JP8666794A JPH07297231A JP H07297231 A JPH07297231 A JP H07297231A JP 8666794 A JP8666794 A JP 8666794A JP 8666794 A JP8666794 A JP 8666794A JP H07297231 A JPH07297231 A JP H07297231A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- circuit board
- printed circuit
- cover body
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/751—Means for controlling the bonding environment, e.g. valves, vacuum pumps
- H01L2224/75101—Chamber
- H01L2224/75102—Vacuum chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/75301—Bonding head
- H01L2224/75302—Shape
- H01L2224/75303—Shape of the pressing surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/757—Means for aligning
- H01L2224/75743—Suction holding means
- H01L2224/75745—Suction holding means in the upper part of the bonding apparatus, e.g. in the bonding head
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/812—Applying energy for connecting
- H01L2224/81201—Compression bonding
- H01L2224/81209—Compression bonding applying isostatic pressure, e.g. degassing using vacuum or a pressurised liquid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、チップをプリント基板
に実装するためのチップの実装用治具および実装方法に
関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip mounting jig and a mounting method for mounting a chip on a printed circuit board.
【０００２】[0002]
【従来の技術】半導体から成るチップには様々な品種が
あるが、何れもその表面に形成された電極をプリント基
板の回路パターンのランド（電極）に接続することによ
りプリント基板に実装するようになっている。以下、従
来のチップの実装方法について説明する。2. Description of the Related Art There are various types of chips made of semiconductors, and all of them are mounted on a printed circuit board by connecting electrodes formed on the surface to lands (electrodes) of a circuit pattern of the printed circuit board. Has become. Hereinafter, a conventional chip mounting method will be described.
【０００３】図１１（ａ）（ｂ）（ｃ）は従来のチップ
の実装方法の説明図である。図１１（ａ）において、チ
ップ１の下面に形成された電極２にはハンダ材料から成
るバンプ（突出電極）３が形成されている。またプリン
ト基板４の上面には回路パターンのランド（電極）５が
形成されている。まず図１１（ａ）に示すように、プリ
ント基板４の上面にエポキシ樹脂などの仮止め用のボン
ド６をディスペンサなどにより塗布し、次に図１１
（ｂ）に示すようにバンプ３をランド５に接地させてチ
ップ１をプリント基板４に搭載する。この搭載は、チッ
プの自動搭載装置により行われる。このとき、ボンド６
はチップ１の下面に付着し、チップ１が位置ずれしない
ようにプリント基板４に仮止めする。11 (a), 11 (b) and 11 (c) are explanatory views of a conventional chip mounting method. In FIG. 11A, bumps (protruding electrodes) 3 made of a solder material are formed on the electrodes 2 formed on the lower surface of the chip 1. A land (electrode) 5 having a circuit pattern is formed on the upper surface of the printed board 4. First, as shown in FIG. 11A, a temporary bond 6 such as an epoxy resin is applied to the upper surface of the printed board 4 by a dispenser or the like, and then, as shown in FIG.
As shown in (b), the bump 3 is grounded to the land 5, and the chip 1 is mounted on the printed board 4. This mounting is performed by an automatic chip mounting device. At this time, bond 6
Adheres to the lower surface of the chip 1 and is temporarily fixed to the printed board 4 so that the chip 1 is not displaced.
【０００４】次にこのようにしてチップ１が搭載された
プリント基板４をリフロー装置の加熱炉（図外）へ送
り、２００℃以上に加熱することによりバンプ３を溶融
固化させてハンダ付けする。図１１（ｃ）はハンダ付け
が終了したものを示している。図示するようにバンプ３
が溶融固化してハンダ部３’となり、チップ１の電極２
はプリント基板４のランド５に接着されている。Next, the printed board 4 on which the chip 1 is mounted in this way is sent to a heating furnace (not shown) of the reflow apparatus and heated to 200 ° C. or higher to melt and solidify the bumps 3 for soldering. FIG. 11C shows that the soldering has been completed. Bump 3 as shown
Melts and solidifies to become the solder part 3'and the electrode 2 of the chip 1
Are bonded to the lands 5 of the printed circuit board 4.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら上記従来
の実装方法では、チップ１が搭載されたプリント基板４
をリフロー装置の加熱炉へ送って加熱し、バンプ３を溶
融させるハンダ付け工程が必要であるため、工程数が多
いという問題点があった。またバンプ３を溶融させてハ
ンダ付けすると、溶融したハンダが流動して短絡の原因
となるブリッジを生じたり、あるいは加熱不十分による
接着不良が発生するなど、ハンダ付けの不良品が発生し
やすいものであった。However, in the above-mentioned conventional mounting method, the printed circuit board 4 on which the chip 1 is mounted is mounted.
However, there is a problem in that the number of steps is large because a soldering step of sending the solder to a heating furnace of the reflow device to heat the bumps 3 is required. In addition, when the bumps 3 are melted and soldered, the melted solder flows to form a bridge that causes a short circuit, or defective adhesion due to insufficient heating occurs, and thus defective soldering products are likely to occur. Met.
【０００６】またバンプ３を加熱して溶融させてハンダ
付けする際に、バンプ３とランド５の接合部に合金が発
生・成長し、この合金のために接合部が破壊されやすい
という問題点があった。また図１１（ｃ）に示すように
チップ１をプリント基板４に実装した後、ハンダ付け状
態の良否判定などの製品検査が行われ、不良と判定され
た場合には、チップ１をプリント基板４から取り除い
て、再度チップ１を実装し直すリペア作業が行われる
が、この場合、バンプ３は溶融してハンダ部３’とな
り、電極２をランド５にしっかり接着しているため、チ
ップ１をプリント基板４から取り除く作業をきわめて行
いにくく、またその場合プリント基板４のランド５など
を損傷しやすいという問題点があった。Further, when the bumps 3 are heated and melted to be soldered, an alloy is generated and grows at the joints between the bumps 3 and the lands 5, and the joints are apt to be broken due to this alloy. there were. After mounting the chip 1 on the printed circuit board 4 as shown in FIG. 11C, product inspection such as quality determination of the soldering state is performed, and if it is determined to be defective, the chip 1 is mounted on the printed circuit board 4. After that, the repair work is carried out to remount the chip 1 again, but in this case, the bump 3 is melted and becomes the solder part 3 ′, and the electrode 2 is firmly adhered to the land 5, so the chip 1 is printed. There is a problem that the work of removing from the substrate 4 is extremely difficult to perform, and in that case, the land 5 and the like of the printed substrate 4 are easily damaged.
【０００７】また上述のようにしてチップ１が実装され
たプリント基板４は、各種の電子機器に組み付けられる
が、長時間の間に金属部分であるプリント基板４の回路
パターンやハンダ部３’は空気中の酸素に触れることに
より腐食しやすく、またボンド６も腐食・変質しやす
く、製品寿命が短くなるという問題点があった。The printed circuit board 4 on which the chip 1 is mounted as described above is assembled in various electronic devices, but the circuit pattern of the printed circuit board 4 which is a metal part and the solder part 3'can be assembled for a long time. There is a problem in that the product is easily corroded by contacting oxygen in the air, and the bond 6 is also easily corroded / altered, which shortens the product life.
【０００８】以上のように従来のチップの実装方法には
多くの問題点があった。また従来のチップの実装方法と
しては、プリント基板のランドにハンダを予め形成して
チップのバンプレスの電極をハンダ付けすることにより
実装する方法、チップの電極とプリント基板のランドの
間に導電シートを介在させて実装する方法など様々な方
法があるが、何れの方法もプリント基板を加熱する工程
が必要なことから、上述と同様の多くの問題点があっ
た。As described above, the conventional chip mounting method has many problems. Further, as a conventional chip mounting method, a method of mounting by previously forming solder on the land of the printed circuit board and soldering bump bump electrodes of the chip, or a conductive sheet between the chip electrode and the land of the printed circuit board is used. Although there are various methods such as a method of mounting with the interposition of, there are many problems similar to the above because each method requires a step of heating the printed board.
【０００９】そこで本発明は、上記従来方法の問題点を
解消し、チップを簡単にプリント基板に実装でき、また
リペア作業を容易に行うことができ、更には金属部分や
ボンドの腐食を抑制できるチップの実装用治具および実
装方法を提供することを目的とする。Therefore, the present invention solves the above-mentioned problems of the conventional method, can easily mount a chip on a printed circuit board, can easily perform repair work, and can suppress corrosion of metal parts and bonds. An object is to provide a jig for mounting a chip and a mounting method.
【００１０】[0010]
【課題を解決するための手段】このために本発明は、チ
ップを覆うようにチップに被蓋されてその下端部がプリ
ント基板の表面に固着されるカバー体からチップの実装
用治具を構成し、このカバー体をその内部の真空圧によ
って内方へ屈曲する屈曲可能な素材により形成したもの
である。To this end, the present invention constitutes a chip mounting jig from a cover body which is covered with a chip so as to cover the chip and whose lower end is fixed to the surface of a printed circuit board. However, the cover body is formed of a bendable material that bends inward by the vacuum pressure inside the cover body.
【００１１】[0011]
【作用】上記構成によれば、カバー体を真空圧によって
内方へ屈曲させることにより、チップの電極をプリント
基板のランドに押し付けて、チップをカバー体によりプ
リント基板に固定できるので、ハンダ付け工程が不要と
なり、チップをプリント基板に簡単に実装できる。According to the above structure, by bending the cover body inward by vacuum pressure, the electrodes of the chip can be pressed against the land of the printed circuit board and the chip can be fixed to the printed circuit board by the cover body. Is unnecessary, and the chip can be easily mounted on the printed circuit board.
【００１２】[0012]
【実施例】次に、図面を参照しながら本発明の実施例を
説明する。図１は本発明の第一実施例のチップの実装用
治具の斜視図、図２（ａ）（ｂ）（ｃ）、図３（ａ）
（ｂ）、図４（ａ）（ｂ）は同チップの実装方法の説明
図である。図１において、１０はチップの実装用治具で
あり、箱形のカバー体１１の上面側部に真空吸引用のパ
イプ状の吸込部１２を突設して形成されている。この実
装用治具１０は、熱可塑性合成樹脂などの屈曲可能な素
材により形成されている。Embodiments of the present invention will now be described with reference to the drawings. FIG. 1 is a perspective view of a jig for mounting a chip according to a first embodiment of the present invention, FIG. 2 (a) (b) (c), and FIG. 3 (a).
4B and FIG. 4A and FIG. 4B are explanatory views of a mounting method of the same chip. In FIG. 1, reference numeral 10 denotes a chip mounting jig, which is formed by projecting a pipe-shaped suction portion 12 for vacuum suction on the upper surface side portion of a box-shaped cover body 11. The mounting jig 10 is formed of a bendable material such as a thermoplastic synthetic resin.
【００１３】次に図２〜図４を参照しながら、チップの
実装方法を説明する。図２（ａ）（ｂ）（ｃ）はチップ
１をプリント基板４に搭載する工程を工程順に示してい
る。まず図２（ａ）（ｂ）に示すように、ディスペンサ
などによりプリント基板４の上面に仮止め用のボンド６
を塗布し、バンプ３をランド５に合致させてチップ１を
自動搭載装置によりプリント基板４に搭載する。なお各
図において、図１１に示す従来と同一の部分には同一符
号を付している。Next, a chip mounting method will be described with reference to FIGS. 2A, 2 </ b> B, and 2 </ b> C show the steps of mounting the chip 1 on the printed board 4 in the order of steps. First, as shown in FIGS. 2A and 2B, a bond 6 for temporary fixing is attached to the upper surface of the printed circuit board 4 by a dispenser or the like.
Is applied, the bumps 3 are aligned with the lands 5, and the chip 1 is mounted on the printed circuit board 4 by an automatic mounting device. In each figure, the same parts as those of the prior art shown in FIG. 11 are designated by the same reference numerals.
【００１４】次に図２（ｂ）（ｃ）に示すように、実装
用治具１０のカバー体１１の上面をノズル７の下端部に
真空吸着して保持し、カバー体１１をチップ１を覆うよ
うに被蓋する。８はノズル７の下端部に装着された気密
用Ｏリングである。これに先立って、カバー体１１の下
面には瞬間接着剤などのボンド９が塗布されており、こ
のボンド９により、カバー体１１はプリント基板４に接
着される。なおカバー体１１をノズル７に真空吸着した
状態で、カバー体１１の下端部を容器に貯溜されたボン
ド９にわずかに浸漬するなどすれば、ボンド９をカバー
体１１の下面に容易に塗布できる。Next, as shown in FIGS. 2B and 2C, the upper surface of the cover body 11 of the mounting jig 10 is vacuum-sucked and held on the lower end portion of the nozzle 7, and the cover body 11 is attached to the chip 1. Cover to cover. Reference numeral 8 is an airtight O-ring mounted on the lower end of the nozzle 7. Prior to this, a bond 9 such as an instant adhesive is applied to the lower surface of the cover body 11, and the bond body 9 bonds the cover body 11 to the printed circuit board 4. The bond 9 can be easily applied to the lower surface of the cover body 11 by slightly immersing the lower end portion of the cover body 11 in the bond 9 stored in the container while the cover body 11 is vacuum-adsorbed to the nozzle 7. .
【００１５】図３（ａ）（ｂ）および図４（ａ）（ｂ）
は、次に行われる一連の真空吸引工程を工程順に示して
いる。図３（ａ）において、１５は内部に吸引孔１６が
形成されたノズルであり、その下端部近くの内部にはヒ
ータ１７が内蔵されている。１８は気密用Ｏリングであ
る。このノズル１５は、真空吸引装置（図外）に接続さ
れている。図示するようにノズル１５を吸込部１２に接
続し、カバー体１１内の空気を真空吸引する。すると図
３（ｂ）に示すようにカバー体１１の上面は大気圧に押
されて内方へ屈曲し、チップ１をプリント基板４に押し
付け、バンプ３もランド５に強く押し付けられる。また
これと同時にヒータ１７は駆動して吸込部１２を加熱す
る。3A and 3B and FIGS. 4A and 4B.
Shows a series of vacuum suction steps to be performed next in the order of steps. In FIG. 3A, reference numeral 15 is a nozzle having a suction hole 16 formed therein, and a heater 17 is built in near the lower end thereof. Reference numeral 18 is an airtight O-ring. The nozzle 15 is connected to a vacuum suction device (not shown). As shown in the figure, the nozzle 15 is connected to the suction portion 12, and the air in the cover body 11 is vacuum-sucked. Then, as shown in FIG. 3B, the upper surface of the cover body 11 is pressed by the atmospheric pressure to bend inward, the chip 1 is pressed against the printed board 4, and the bump 3 is strongly pressed against the land 5. At the same time, the heater 17 is driven to heat the suction section 12.
【００１６】すると図４（ａ）に示すように、吸込部１
２は軟化し、また吸込部１２は真空圧により内側へ吸引
されることにより押し潰されて盲となり、さらにノズル
１５が真空吸引することにより押し潰された首細部から
吸込部１２の上部１２ａは吸いちぎられる。次にノズル
１５は上昇して吸込部１２から離れ、図４（ｂ）に示す
ように側方へ移動し、そこで真空吸引を停止すると吸い
ちぎられた上部１２ａは自然落下し、回収箱（図外）に
回収される。以上のようにして、一連の実装工程は終了
する。Then, as shown in FIG. 4A, the suction portion 1
2 is softened, and the suction portion 12 is crushed by being sucked inward by vacuum pressure and becomes blind. Further, the upper portion 12a of the suction portion 12 is crushed by vacuum suction of the nozzle 15 from the neck portion. Being sucked off. Next, the nozzle 15 rises and separates from the suction part 12, moves laterally as shown in FIG. 4B, and when vacuum suction is stopped there, the sucked upper part 12a falls naturally and the collection box (see FIG. Outside). As described above, the series of mounting steps is completed.
【００１７】図４（ｂ）に示す実装状態において、カバ
ー体１１の内部は真空状態（厳密には真空に近い状態）
であるため、カバー体１１の上面は大気圧に押され、チ
ップ１はプリント基板４に強く押し付けられて、バンプ
３はランド５にしっかり密着する。したがって従来方法
のようにプリント基板１をリフロー装置の加熱炉へ送っ
てハンダ付けする工程を不要にできる。In the mounted state shown in FIG. 4B, the inside of the cover body 11 is in a vacuum state (strictly, a state close to a vacuum).
Therefore, the upper surface of the cover body 11 is pressed by the atmospheric pressure, the chip 1 is strongly pressed against the printed circuit board 4, and the bumps 3 are firmly attached to the lands 5. Therefore, the step of sending the printed circuit board 1 to the heating furnace of the reflow apparatus and soldering it unlike the conventional method can be eliminated.
【００１８】またカバー体１１の内部の空気は吸い出さ
れて真空になっているため、チップ１は実質的に真空封
止されることとなり、電極２、バンプ３、ランド５など
の金属部分が酸化して腐食することもなく、またボンド
６も腐食・変質しにくく、したがって製品寿命は著しく
長命化し、信頼性の高い製品を得ることができる。バン
プ３がランド５から位置ずれするなどして実装状態が不
良の場合には、リペア作業が行われる。そこで、次にリ
ペア作業について説明する。Further, since the air inside the cover body 11 is sucked out to be a vacuum, the chip 1 is substantially vacuum-sealed, and the metal parts such as the electrodes 2, the bumps 3, and the lands 5 are removed. It does not oxidize and corrode, and the bond 6 is unlikely to corrode or change in quality, so that the product life is significantly extended and a highly reliable product can be obtained. When the mounting state is bad due to the bump 3 being displaced from the land 5, the repair work is performed. Therefore, the repair work will be described next.
【００１９】図５（ａ）（ｂ）（ｃ）は本発明の第一実
施例のチップのリペア作業の説明図である。まず図５
（ａ）に示すように、針状の加熱ツール１９をカバー体
１１の適所に差し込んで穴あけする。すると図５（ｂ）
に示すように開けられた孔部１４からカバー体１１内に
外気が吸入され、カバー体１１の上面は自身の弾性によ
りフラットな形状に復帰する。またボンド９を電気こて
で加熱して軟化させるなどして取り除き、カバー体１１
をプリント基板４から分離する。ここで、チップ１のバ
ンプ３はプリント基板４のランド５上に単に載っている
だけであるので、カバー体１１を取り除けばチップ１も
難なく取り除ける。またチップ１を取り除いてもランド
５は無傷であるから、上記工程を再度繰り返すことによ
り、新たなチップ１とカバー体１１をプリント基板４に
実装することができる。5 (a), 5 (b) and 5 (c) are explanatory views of the repair work of the chip of the first embodiment of the present invention. Figure 5
As shown in (a), the needle-shaped heating tool 19 is inserted into an appropriate place of the cover body 11 to make a hole. Then, Fig. 5 (b)
Outside air is sucked into the cover body 11 through the hole 14 opened as shown in FIG. 3, and the upper surface of the cover body 11 returns to a flat shape by its elasticity. Further, the bond 9 is removed by heating with an electric iron to soften it, and the cover body 11
Is separated from the printed circuit board 4. Here, since the bumps 3 of the chip 1 are simply mounted on the lands 5 of the printed board 4, the chip 1 can be easily removed by removing the cover body 11. Further, since the land 5 is intact even if the chip 1 is removed, a new chip 1 and a cover body 11 can be mounted on the printed board 4 by repeating the above steps.
【００２０】図６（ａ）（ｂ）（ｃ）は本発明の第二実
施例のチップの実装方法の説明図である。この方法で
は、図６（ａ）に示すようにチップ１と実装用治具１０
を上下反転させ、またカバー体１１の内面にボンド６を
塗布し、チップ１をカバー体１１の内部にボンド６で仮
付けする。次に図６（ｂ）（ｃ）に示すように実装用治
具１０を上下反転させ、ノズル７に真空吸着してプリン
ト基板４に搭載する。この場合、プリント基板４にも仮
止め用のボンド６が塗布されている。これ以後の工程は
図３に示す第一実施例と同様であって、カバー体１１の
内部を真空吸引してカバー体１１を内方へ屈曲させ、チ
ップ１をプリント基板４に押し付ける。FIGS. 6A, 6B and 6C are explanatory views of a chip mounting method according to the second embodiment of the present invention. In this method, as shown in FIG. 6A, the chip 1 and the mounting jig 10 are
Is turned upside down, the bond 6 is applied to the inner surface of the cover body 11, and the chip 1 is temporarily attached to the inside of the cover body 11 with the bond 6. Next, as shown in FIGS. 6B and 6C, the mounting jig 10 is turned upside down, and the nozzle 7 is vacuum-sucked and mounted on the printed board 4. In this case, the printed board 4 is also coated with the bond 6 for temporary fixing. The subsequent steps are similar to those of the first embodiment shown in FIG. 3, and the inside of the cover body 11 is vacuum-sucked to bend the cover body 11 inward, and the chip 1 is pressed against the printed board 4.
【００２１】図７（ａ）（ｂ）および図８（ａ）（ｂ）
（ｃ）は本発明の第三実施例のチップの実装方法の説明
図である。本方法は複数個のチップを同時にプリント基
板に一括実装する方法である。プリント基板４Ａは第一
実施例のプリント基板４よりも大形であり、第一実施例
と同様の手法により２個のチップ１が搭載されており、
各々のチップ１には実装用治具１０が被蓋されている。FIGS. 7A and 7B and FIGS. 8A and 8B.
(C) is an explanatory view of a chip mounting method of the third embodiment of the present invention. This method is a method of collectively mounting a plurality of chips on a printed circuit board at the same time. The printed board 4A is larger than the printed board 4 of the first embodiment, and two chips 1 are mounted by the same method as in the first embodiment.
A mounting jig 10 is covered on each chip 1.
【００２２】図７（ａ）に示すように、このプリント基
板４Ａをケーシング２０の内部に収納し、その側面に設
けられた排気部２１から真空吸引装置（図外）により真
空吸引する。するとカバー体１１の内部の空気も吸込部
１２から真空吸引される。次にケーシング２０の内部の
上部に設けられたヒータ２２を図外の上下動手段によっ
て下降させ、吸込部１２に押し付ける（図７（ｂ））。
すると吸込部１２は加熱されて軟化し、押し潰されて盲
となる。このとき、排気部２１からの真空吸引は継続し
ている。As shown in FIG. 7 (a), this printed circuit board 4A is housed inside a casing 20 and is vacuum-sucked by a vacuum suction device (not shown) from an exhaust portion 21 provided on the side surface thereof. Then, the air inside the cover body 11 is also vacuum-sucked from the suction section 12. Next, the heater 22 provided in the upper portion inside the casing 20 is lowered by the vertical moving means (not shown) and pressed against the suction portion 12 (FIG. 7B).
Then, the suction part 12 is heated and softened, and is crushed and becomes blind. At this time, vacuum suction from the exhaust unit 21 continues.
【００２３】次に図８（ａ）に示すようにヒータ２２を
上昇させ、続いて排気部２１からの真空吸引を停止して
排気部２１から外気をリークする（図８（ｂ））。する
とケーシング２０の内部は大気圧となり、カバー体１１
は大気圧に押されて内方へ屈曲してチップ１をプリント
基板４Ａに押し付ける。次にプリント基板４Ａをケーシ
ング２０から取り出すことにより、一連の実装工程は終
了する（図８（ｃ））。本方法によれば、第一実施例と
同様の効果が得られるとともに、複数個のチップ１を同
時にプリント基板４Ａに一括実装できるので、作業能率
が向上する。Next, as shown in FIG. 8A, the heater 22 is raised, and then vacuum suction from the exhaust unit 21 is stopped to leak outside air from the exhaust unit 21 (FIG. 8B). Then, the inside of the casing 20 becomes atmospheric pressure, and the cover body 11
Is pressed by the atmospheric pressure and bent inward to press the chip 1 against the printed circuit board 4A. Next, the printed circuit board 4A is taken out from the casing 20 to complete a series of mounting steps (FIG. 8C). According to this method, the same effect as in the first embodiment can be obtained, and a plurality of chips 1 can be simultaneously mounted on the printed circuit board 4A at the same time, so that the work efficiency is improved.
【００２４】図９（ａ）（ｂ）（ｃ）および図１０
（ａ）（ｂ）は本発明の第四実施例のチップの実装方法
の説明図である。この実装用治具１０Ａの形状は、図１
に示す実装用治具１０と同様に箱形のカバー体から成っ
ているが、吸込部１２は有していない。ケーシング２０
などの他の構成は第三実施例と同様である。9 (a) (b) (c) and FIG.
(A) (b) is explanatory drawing of the mounting method of the chip | tip of the 4th Example of this invention. The shape of this mounting jig 10A is shown in FIG.
Like the mounting jig 10 shown in FIG. 1, it is made of a box-shaped cover body, but does not have the suction portion 12. Casing 20
Other configurations such as are similar to those of the third embodiment.
【００２５】次に動作を説明する。図９（ａ）に示すよ
うに、まずチップ１のバンプ３をプリント基板４Ａのラ
ンド５に合致させてチップ１をプリント基板４Ａに搭載
する。このとき実装用治具１０Ａは加熱装置を備えたク
ランパ２３にクランプされてチップ１の上方に位置して
いる。この状態で、排気部２１からケーシング２０内の
空気を真空吸引する。なおクランパ２３のクランプ機構
は図では省略している。またクランパ２３はこの状態で
は加熱されていない。Next, the operation will be described. As shown in FIG. 9A, first, the bumps 3 of the chip 1 are aligned with the lands 5 of the printed board 4A, and the chip 1 is mounted on the printed board 4A. At this time, the mounting jig 10A is clamped by the clamper 23 having a heating device and is positioned above the chip 1. In this state, the air in the casing 20 is vacuumed from the exhaust unit 21. The clamp mechanism of the clamper 23 is omitted in the figure. The clamper 23 is not heated in this state.
【００２６】次に図９（ｂ）に示すようにクランパ２３
を下降させ、実装用治具１０Ａの下端部のボンド９Ａを
プリント基板４Ａに付着させて、実装用治具１０Ａをチ
ップ１に被蓋する。被蓋した状態で加熱し、ボンド９Ａ
を硬化させる。なおこのボンド９Ａは熱硬化性樹脂であ
る。次にクランパ２３による実装用治具１０Ａのクラン
プ状態を解除してクランパ２３を上昇させ、またクラン
パ２３の加熱を停止する（図９（ｃ））。このとき、排
気部２１からの真空吸引は継続している。なおこの実施
例では、クランパ２３が加熱装置を備えているが、加熱
装置はクランパ２３と別体にして、ケーシング２０内に
設けてもよい。Next, as shown in FIG. 9B, the clamper 23
Is lowered, the bond 9A at the lower end of the mounting jig 10A is attached to the printed board 4A, and the mounting jig 10A is covered on the chip 1. Heat with the lid on, bond 9A
Cure. The bond 9A is a thermosetting resin. Next, the clamped state of the mounting jig 10A by the clamper 23 is released to raise the clamper 23, and the heating of the clamper 23 is stopped (FIG. 9C). At this time, vacuum suction from the exhaust unit 21 continues. Although the clamper 23 is provided with the heating device in this embodiment, the heating device may be provided separately from the clamper 23 in the casing 20.
【００２７】次に排気部２１をリークして外気をケーシ
ング２０に導入する（図１０（ａ））。すると実装用治
具１０Ａは大気圧に押されて内方へ屈曲し、チップ１を
プリント基板４Ａに押し付ける。次にプリント基板４Ａ
をケーシング２０から取り出すことにより、一連の工程
は終了する（図１０（ｂ））。この第四実施例も第三実
施例と同様の効果が得られる他、実装用治具１０Ａの溶
融の必要がないことから、高融点材料の使用も可能であ
る。また実装用治具を熱伝導性のよい金属板にて形成す
れば、プリント基板が電子機器に組み付けられてチップ
に電流が流れる際に発生するチップの自己発熱を、チッ
プの上面に密着する実装用治具を通して熱効率よく外界
へ放出でき、すぐれたヒートシンクとしての作用効果も
得られる。上記各実施例から明らかなように、本発明は
様々な設計変更が可能である。またバンプを有しないチ
ップや、導電シートを介してプリント基板に実装される
チップなど、様々なチップの実装手段にも適用できる。Next, the exhaust part 21 is leaked to introduce the outside air into the casing 20 (FIG. 10 (a)). Then, the mounting jig 10A is pressed by the atmospheric pressure and bent inward, and the chip 1 is pressed against the printed board 4A. Next, printed circuit board 4A
The series of steps is completed by taking out the product from the casing 20 (FIG. 10B). In the fourth embodiment, the same effect as in the third embodiment can be obtained, and since it is not necessary to melt the mounting jig 10A, it is possible to use a high melting point material. If the mounting jig is made of a metal plate with good thermal conductivity, the self-heating of the chip, which occurs when the printed circuit board is assembled in an electronic device and a current flows through the chip, is closely attached to the upper surface of the chip. It can be efficiently released to the outside world through a jig for heat treatment, and it also has an excellent effect as a heat sink. As is apparent from the above embodiments, the present invention can be modified in various ways. Further, it can be applied to various chip mounting means such as a chip having no bumps and a chip mounted on a printed circuit board via a conductive sheet.
【００２８】[0028]
【発明の効果】以上説明したように本発明によれば、リ
フロー装置によるハンダ付けを不要にでき、したがって
チップをプリント基板に実装する工程を著しく簡単・高
速化でき、またハンダ付け不良による不良品の発生を解
消できる。また実装用治具の内部を真空状態にすること
により、チップの電極や基板のランドなどの金属部分が
酸化して腐食するのを防止でき、製品を著しく長寿命化
できる。さらにはチップの実装不良の場合には簡単迅速
にリペア作業を行うことができ、またリペアを行っても
プリント基板のランドを損傷することもないので歩留り
が向上する。また複数のチップを一括してプリント基板
に実装することも可能であり、チップの実装作業能率を
著しく向上できる。As described above, according to the present invention, it is possible to eliminate the need for soldering by a reflow device, and therefore the process of mounting a chip on a printed circuit board can be significantly simplified and speeded up, and defective products due to defective soldering can be obtained. Can be eliminated. Further, by making the inside of the mounting jig in a vacuum state, it is possible to prevent the metal parts such as the electrodes of the chip and the lands of the substrate from being oxidized and corroded, and the life of the product can be remarkably extended. Further, in the case of chip mounting failure, repair work can be performed easily and quickly, and even if repair is performed, the land of the printed circuit board is not damaged, so the yield is improved. It is also possible to mount a plurality of chips on the printed circuit board at a time, and the mounting work efficiency of the chips can be significantly improved.
【図１】本発明の第一実施例のチップの実装用治具の斜
視図FIG. 1 is a perspective view of a chip mounting jig according to a first embodiment of the present invention.
【図２】（ａ）本発明の第一実施例のチップの実装方法
の説明図 （ｂ）本発明の第一実施例のチップの実装方法の説明図 （ｃ）本発明の第一実施例のチップの実装方法の説明図2A is an explanatory diagram of a chip mounting method according to a first embodiment of the present invention; FIG. 2B is an explanatory diagram of a chip mounting method according to a first embodiment of the present invention; and FIG. 2C is a first embodiment of the present invention. Of the chip mounting method
【図３】（ａ）本発明の第一実施例のチップの実装方法
の説明図 （ｂ）本発明の第一実施例のチップの実装方法の説明図3A is an explanatory diagram of a chip mounting method according to a first embodiment of the present invention; FIG. 3B is an explanatory diagram of a chip mounting method according to a first embodiment of the present invention.
【図４】（ａ）本発明の第一実施例のチップの実装方法
の説明図 （ｂ）本発明の第一実施例のチップの実装方法の説明図4A is an explanatory diagram of a chip mounting method according to a first embodiment of the present invention; FIG. 4B is an explanatory diagram of a chip mounting method according to a first embodiment of the present invention;
【図５】（ａ）本発明の第一実施例のチップのリペア作
業の説明図 （ｂ）本発明の第一実施例のチップのリペア作業の説明
図 （ｃ）本発明の第一実施例のチップのリペア作業の説明
図FIG. 5 (a) is an explanatory view of a tip repairing work of the first embodiment of the present invention (b) is an explanatory view of a tip repairing work of the first embodiment of the present invention; and (c) is a first embodiment of the present invention. Of tip repair work
【図６】（ａ）本発明の第二実施例のチップの実装方法
の説明図 （ｂ）本発明の第二実施例のチップの実装方法の説明図 （ｃ）本発明の第二実施例のチップの実装方法の説明図6A is an explanatory view of a chip mounting method according to a second embodiment of the present invention; FIG. 6B is an explanatory view of a chip mounting method according to a second embodiment of the present invention; and FIG. 6C is a second embodiment of the present invention. Of the chip mounting method
【図７】（ａ）本発明の第三実施例のチップの実装方法
の説明図 （ｂ）本発明の第三実施例のチップの実装方法の説明図7A is an explanatory diagram of a chip mounting method according to a third embodiment of the present invention. FIG. 7B is an explanatory diagram of a chip mounting method according to a third embodiment of the present invention.
【図８】（ａ）本発明の第三実施例のチップの実装方法
の説明図 （ｂ）本発明の第三実施例のチップの実装方法の説明図 （ｃ）本発明の第三実施例のチップの実装方法の説明図8A is an explanatory diagram of a chip mounting method according to a third embodiment of the present invention; FIG. 8B is an explanatory diagram of a chip mounting method according to a third embodiment of the present invention; and FIG. 8C is a third embodiment of the present invention. Of the chip mounting method
【図９】（ａ）本発明の第四実施例のチップの実装方法
の説明図 （ｂ）本発明の第四実施例のチップの実装方法の説明図 （ｃ）本発明の第四実施例のチップの実装方法の説明図9A is an explanatory diagram of a chip mounting method of a fourth embodiment of the present invention. FIG. 9B is an explanatory diagram of a chip mounting method of a fourth embodiment of the present invention. FIG. 9C is a fourth embodiment of the present invention. Of the chip mounting method
【図１０】（ａ）本発明の第四実施例のチップの実装方
法の説明図 （ｂ）本発明の第四実施例のチップの実装方法の説明図10A is an explanatory diagram of a chip mounting method according to a fourth embodiment of the present invention. FIG. 10B is an explanatory diagram of a chip mounting method according to a fourth embodiment of the present invention.
【図１１】（ａ）従来のチップの実装方法の説明図 （ｂ）従来のチップの実装方法の説明図 （ｃ）従来のチップの実装方法の説明図11A is an explanatory diagram of a conventional chip mounting method, FIG. 11B is an explanatory diagram of a conventional chip mounting method, and FIG. 11C is an explanatory diagram of a conventional chip mounting method.
１ チップ ２ 電極 ３ バンプ ４，４Ａ プリント基板 ５ ランド １０，１０Ａ 実装用治具 1 chip 2 electrode 3 bump 4, 4A printed circuit board 5 land 10, 10A mounting jig
Claims (3)
致させて実装するチップの実装用治具であって、チップ
を覆うようにチップに被蓋されてその下端部がプリント
基板の表面に固着されるカバー体から成り、且つこのカ
バー体をその内部の真空圧によって内方へ屈曲する屈曲
可能な素材により形成したことを特徴とするチップの実
装用治具。1. A chip mounting jig for mounting a chip electrode on a land of a printed circuit board, the lower end of which is fixed to the surface of the printed circuit board so as to cover the chip. A jig for mounting a chip, characterized in that the cover body is formed of a bendable material that bends inward by a vacuum pressure inside the cover body.
致させてチップをプリント基板に搭載する工程と、 前記チップを覆うカバー体から成る実装用治具を前記チ
ップに被蓋し、かつその下端部を前記プリント基板に固
着する工程と、 前記カバー体の内部を真空吸引することにより前記カバ
ー体を内方へ屈曲させて前記チップの電極を前記基板の
ランドに押し付ける工程と、 を含むことを特徴とするチップの実装方法。2. A step of mounting a chip on a printed circuit board by matching a chip electrode with a land of the printed circuit board, and a mounting jig composed of a cover body for covering the chip, which is covered with the lower end of the mounting jig. A part of the cover body is fixed to the printed circuit board, and the inside of the cover body is vacuum-sucked to bend the cover body inward to press the electrode of the chip against the land of the substrate. Characteristic chip mounting method.
と、 プリント基板のランドに前記チップの電極を合致させて
前記チップおよび前記カバー体を前記プリント基板に搭
載し、かつ前記カバー体を前記プリント基板に固着する
工程と、 前記カバー体の内部を真空吸引することにより前記カバ
ー体を内方へ屈曲させて前記チップの電極を前記基板の
ランドに押し付ける工程と、 を含むことを特徴とするチップの実装方法。3. A step of accommodating a chip inside a cover body, and mounting the chip and the cover body on the printed circuit board by matching electrodes of the chip with lands of the printed circuit board, and the cover body A step of adhering to the printed circuit board; a step of bending the cover body inward by vacuum suction of the inside of the cover body to press the electrode of the chip against the land of the substrate. Chip mounting method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8666794A JPH07297231A (en) | 1994-04-25 | 1994-04-25 | Jig and method for mounting chip on board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8666794A JPH07297231A (en) | 1994-04-25 | 1994-04-25 | Jig and method for mounting chip on board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07297231A true JPH07297231A (en) | 1995-11-10 |
Family
ID=13893391
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8666794A Pending JPH07297231A (en) | 1994-04-25 | 1994-04-25 | Jig and method for mounting chip on board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07297231A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6513236B2 (en) | 2000-02-18 | 2003-02-04 | Matsushita Electric Industrial Co., Ltd. | Method of manufacturing bump-component mounted body and device for manufacturing the same |
-
1994
- 1994-04-25 JP JP8666794A patent/JPH07297231A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6513236B2 (en) | 2000-02-18 | 2003-02-04 | Matsushita Electric Industrial Co., Ltd. | Method of manufacturing bump-component mounted body and device for manufacturing the same |
| EP1139410A3 (en) * | 2000-02-18 | 2003-09-24 | Matsushita Electric Industrial Co., Ltd. | Method of manufacturing bump-component mounted body and device for manufacturing the same |
| KR100552095B1 (en) * | 2000-02-18 | 2006-02-13 | 마쯔시다덴기산교 가부시키가이샤 | Method for fabricating bump-mounted unit and apparatus for fabricating the same |
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