JPH0729649A - Butt joint connector - Google Patents
Butt joint connectorInfo
- Publication number
- JPH0729649A JPH0729649A JP19515493A JP19515493A JPH0729649A JP H0729649 A JPH0729649 A JP H0729649A JP 19515493 A JP19515493 A JP 19515493A JP 19515493 A JP19515493 A JP 19515493A JP H0729649 A JPH0729649 A JP H0729649A
- Authority
- JP
- Japan
- Prior art keywords
- contact
- male
- female
- film
- butt joint
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、一端に接触部を有した
複数の導電パターンを絶縁フィルム上に形成してなるフ
ィルムコンタクトを用いて構成されるバットジョイント
コネクタに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a butt joint connector constructed by using a film contact formed by forming a plurality of conductive patterns having a contact portion at one end on an insulating film.
【0002】[0002]
【従来の技術】絶縁フィルム上に複数の導電パターンを
形成してなるフィルムコンタクト(フレキシブルケーブ
ルコンタクト)を用いてコネクタを構成することは、例
えば、本出願人の出願による特開平4−368790号
公報に開示されている。このコネクタは、フィルムコン
タクトを導電パターンが内方を向いたU字状になるよう
にしてハウジング内に配設したレセプタクルコネクタ
と、フィルムコンタクトを外方を向けた凸状に保持して
なるプラグコネクタとから構成され、プラグコネクタの
凸状のフィルムコンタクトをレセプタクルコネクタのU
字状フィルムコンタクト内に挿入し、両フィルムコンタ
クトの導電パターン同士を当接接触させるように構成さ
れている。2. Description of the Related Art The construction of a connector using a film contact (flexible cable contact) formed by forming a plurality of conductive patterns on an insulating film is disclosed in, for example, Japanese Patent Application Laid-Open No. 4-368790 filed by the present applicant. Is disclosed in. This connector includes a receptacle connector in which a film contact is arranged in a housing so that a conductive pattern has a U shape with an inward conductive pattern, and a plug connector in which a film contact is held in a convex shape with an outward direction. And the convex film contact of the plug connector to the U of the receptacle connector.
It is configured to be inserted into the character film contact so that the conductive patterns of both film contacts come into contact with each other.
【0003】[0003]
【発明が解決しようとする課題】このような構成のコネ
クタでは、プラグコネクタをレセプタクルに挿入すると
きと、これを抜去するときに、両フィルムコンタクトの
導電パターン同士がをこすり合わされるため、導電パタ
ーンが摩耗するおそれがあるという問題があった。ま
た、複数の導電パターンの配設ピッチが小さいことが多
く、対応パターン同士を正確に当接させるためには両コ
ネクタの係合位置決めに高精度が要求され、正確な位置
決めガイドが必要となるため、構成が複雑化しやすいと
いう問題もあった。In the connector having such a structure, the conductive patterns of the film contacts are rubbed against each other when the plug connector is inserted into the receptacle and when the plug connector is removed. There was a problem that there is a risk of wear. In addition, the arrangement pitch of the plurality of conductive patterns is often small, and in order to accurately bring the corresponding patterns into contact with each other, high accuracy is required for engagement and positioning of both connectors, and an accurate positioning guide is required. However, there is also a problem that the configuration tends to be complicated.
【0004】本発明はこのような問題に鑑みたもので、
接触部の摩耗の問題がほとんどなく、また、各当接部同
士を正確に当接させるための位置決め構造が簡単となる
ような構成のバットジョイントコネクタを提供すること
を目的とする。The present invention has been made in view of these problems.
It is an object of the present invention to provide a butt joint connector having a configuration in which there is almost no problem of wear of the contact portion and the positioning structure for accurately bringing the contact portions into contact with each other is simple.
【0005】[0005]
【課題を解決するための手段および作用】このような目
的達成のため、本発明においては、互いに係合可能な一
対のハウジングに、それぞれ接触部を相手ハウジングに
向けて雌雄フィルムコンタクトを取り付け、ハウジング
を互いに係合させた状態で雌雄フィルムコンタクトの接
触部同士を当接接触させるようにバットジョイントコネ
クタが構成される。なお、雄フィルムコンタクトの接触
部は相手接触部の方に突出する球面状バンプにより形成
され、雌フィルムコンタクトの接触部は絶縁フィルム層
に形成されて球面状バンプを受容する受容開口と絶縁フ
ィルム層の裏面から受容開口を覆う接触導電層とから形
成される。In order to achieve such an object, according to the present invention, a male and female film contact is attached to a pair of housings that can be engaged with each other with their contact portions facing the mating housings. The butt joint connector is configured to bring the contact portions of the male and female film contacts into abutting contact with each other in a state where they are engaged with each other. The contact part of the male film contact is formed by a spherical bump projecting toward the mating contact part, and the contact part of the female film contact is formed on the insulating film layer to receive the spherical bump and the insulating film layer. And a contact conductive layer covering the receiving opening from the back surface of the.
【0006】このような構成のバットジョイントコネク
タでは、ハウジングを互いに係合させると雄フィルムコ
ンタクトの球面状バンプが雌フィルムコンタクトの受容
開口内に受容されて接触導電層と当接接触し、導電パタ
ーン同士が電気接続される。この場合、接触部同士は、
互いに押し付け合うようにして当接するだけなので、こ
すり合うことがなく、接触部の摩耗のおそれがない。ま
た、球面状バンプが受容開口に受容されて接触導電層と
接触するようになっているため、球面状バンプを受容開
口によりガイドして位置決めすることができ、接触部同
士が正確に位置決めされて接触する。In the butt joint connector having such a structure, when the housings are engaged with each other, the spherical bumps of the male film contact are received in the receiving openings of the female film contact and come into abutting contact with the contact conductive layer, so that the conductive pattern is formed. The two are electrically connected. In this case, the contact parts are
Since they are merely pressed against each other and abutted against each other, they do not rub against each other, and there is no fear of abrasion of the contact portion. Further, since the spherical bump is received in the receiving opening and comes into contact with the contact conductive layer, the spherical bump can be guided and positioned by the receiving opening, and the contact portions are accurately positioned. Contact.
【0007】[0007]
【実施例】以下、図面を参照して本発明の好ましい実施
例について説明する。本発明に係るバットジョイントコ
ネクタの一例を図1から図3に示しており、このコネク
タは、雄コネクタ1と雌コネクタ3とから構成される。
雄コネクタ1は、左右端部10a,10b間に架け渡さ
れて平行に延びた一対の保持アーム11,12を有して
なる絶縁材料製の雄ハウジング10と、これら保持アー
ム11,12に巻き付けられるようにして取り付けられ
る一対の雄フィルムコンタクト20と、これら雄フィル
ムコンタクト20を保持アーム11,12に押さえ付け
る保持部材15とから構成される。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of the present invention will be described below with reference to the drawings. An example of a butt joint connector according to the present invention is shown in FIGS. 1 to 3, and this connector is composed of a male connector 1 and a female connector 3.
The male connector 1 includes a male housing 10 made of an insulating material, which has a pair of holding arms 11 and 12 that are extended between the left and right end portions 10a and 10b and extend in parallel, and is wound around these holding arms 11 and 12. The pair of male film contacts 20 attached as described above and the holding member 15 for pressing the male film contacts 20 against the holding arms 11 and 12.
【0008】左右一対の保持アーム11,12は所定間
隔を有して平行に延びており、その下面(雌コネクタ3
と対向する面)には断面矩形状の長手方向に延びる溝1
1a,12aが形成され、この溝11a,12a内にそ
れぞれゴム性の長尺状の受圧部材18が配設されてい
る。保持アーム11,12の下面には係止溝11b,1
2bも形成されており、雄フィルムコンタクト20の先
端部20aがそれぞれ係止溝11b,12bに挿入され
て係止されるとともに両保持アーム11,12の間を通
ってこれら保持アーム11,12に巻き付くようにして
配設される。このように配設された状態で、両フィルム
コンタクト20を上方から押さえつけるようにして保持
部材15が取り付けられる。このとき保持部材15の先
端部16は保持アーム11,12の間に入り込んで両フ
ィルムコンタクト20を左右保持アーム11,12の内
側面に押さえ付け、この状態で保持部材15は雄ハウジ
ング10と図示しない係合手段により結合される。The pair of left and right holding arms 11 and 12 extend in parallel at a predetermined interval, and their lower surfaces (female connector 3).
A groove 1 having a rectangular cross section and extending in the longitudinal direction
1a and 12a are formed, and a long rubber pressure-receiving member 18 is disposed in each of the grooves 11a and 12a. Locking grooves 11b, 1 are formed on the lower surfaces of the holding arms 11, 12.
2b is also formed, and the front end portion 20a of the male film contact 20 is inserted into and locked by the locking grooves 11b and 12b, respectively, and passes between the holding arms 11 and 12 to the holding arms 11 and 12. It is arranged so as to be wrapped around. The holding member 15 is attached so as to press both film contacts 20 from above in the state of being arranged in this way. At this time, the tip portion 16 of the holding member 15 enters between the holding arms 11 and 12 to press both film contacts 20 against the inner side surfaces of the left and right holding arms 11 and 12, and in this state, the holding member 15 is illustrated as the male housing 10. Not by the engagement means.
【0009】なお、保持部材15の先端部16には嵌合
溝16aが形成されており、この嵌合溝16aは両保持
アーム11,12の間から下方に開放されている。雄ハ
ウジング10の左右端部10a,10bには上方に突出
する取付ボス13が形成されており、さらに、左右端部
10a,10bの側面にはL字状プレートからなる取付
金具17が取り付けられている。これらはプリント基板
への取付に使用されるものであり、例えば、取付ボス1
3をプリント基板の取付孔に挿入して取付位置決めを行
い、取付金具17をプリント基板にサーフェスマウント
してコネクタ3を所定位置に取り付けることができる。A fitting groove 16a is formed in the tip portion 16 of the holding member 15, and the fitting groove 16a is opened downward between the holding arms 11 and 12. Mounting bosses 13 projecting upward are formed on the left and right ends 10a, 10b of the male housing 10, and mounting brackets 17 made of L-shaped plates are mounted on the side surfaces of the left and right ends 10a, 10b. There is. These are used for mounting on a printed circuit board. For example, mounting boss 1
It is possible to insert the connector 3 into the mounting hole of the printed circuit board for positioning and to mount the mounting bracket 17 on the printed circuit board to mount the connector 3 at a predetermined position.
【0010】雄フィルムコンタクト20は、図4に示す
ように、ポリイミド等の絶縁フィルム21aの上(図に
おける下面)に導電性の配線パターン21bが複数形成
されて作られており、先端20a側に各配線パターン毎
に各一個の球面状接触バンプ23が形成され、後端20
b側に各配線パターン毎に各一個のハンダバンプ25が
形成されている。なお、球面状接触バンプ23は絶縁フ
ィルム21aの上面側にのみ突出するが、ハンダバンプ
25は上下両面に突出する。上記のように雄フィルムコ
ンタクト20が雄ハウジング10に取り付けられた状態
で、球面状接触バンプ23は各保持アーム11,12の
下面における受圧部材18の上に位置して所定ピッチで
整列するとともに下方に突出し、ハンダバンプ25は、
雄ハウジング10の上面から僅かに突出する。ハンダパ
ンプ25はプリント基板へのサーフェスマウントのため
に用いられる。As shown in FIG. 4, the male film contact 20 is made by forming a plurality of conductive wiring patterns 21b on an insulating film 21a (lower surface in the figure) made of polyimide or the like, and is formed on the tip 20a side. One spherical contact bump 23 is formed for each wiring pattern, and the rear end 20
One solder bump 25 is formed for each wiring pattern on the b side. The spherical contact bumps 23 project only on the upper surface side of the insulating film 21a, but the solder bumps 25 project on both upper and lower surfaces. With the male film contacts 20 attached to the male housing 10 as described above, the spherical contact bumps 23 are located on the pressure receiving members 18 on the lower surfaces of the holding arms 11 and 12 and are aligned at a predetermined pitch and downward. And the solder bumps 25
It slightly projects from the upper surface of the male housing 10. The solder pump 25 is used for surface mounting on a printed circuit board.
【0011】一方、雌コネクタ3は上記雄コネクタ1と
類似する構成をしており、左右端部30a,30b間に
平行に延びた一対の保持アーム31,32を有した雌ハ
ウジング30と、保持アーム31,32に取り付けられ
る一対の雌フィルムコンタクト40と、保持部材35と
から構成される。これら保持アーム31,32の上面
(雄コネクタ1と対向する面)には断面矩形状の溝31
a,32aが形成され、この溝31a,32a内にゴム
製の受圧部材38が配設されている。On the other hand, the female connector 3 has a structure similar to that of the male connector 1, and includes a female housing 30 having a pair of holding arms 31 and 32 extending in parallel between the left and right ends 30a and 30b, and a female housing 30. It is composed of a pair of female film contacts 40 attached to the arms 31 and 32, and a holding member 35. Grooves 31 having a rectangular cross section are formed on the upper surfaces of the holding arms 31 and 32 (the surfaces facing the male connector 1).
a and 32a are formed, and a rubber pressure receiving member 38 is disposed in the grooves 31a and 32a.
【0012】雌フィルムコンタクト40は、その先端部
40aが保持アーム31,32の上面の係止溝31b,
32bに係止されるとともに両保持アーム31,32の
間を通って巻き付くようにして配設され、この状態で保
持部材35により押圧されて取り付けられている。な
お、保持部材35の先端部36は保持アーム31,32
の間を通って両フィルムコンタクト20を左右保持アー
ム11,12の内側面に押さえ付けるとともに、雌ハウ
ジング30と図示しない係合手段により結合される。保
持部材35の先端部36に形成された嵌合突起36aは
両保持アーム31,32の間から上方に突出する。な
お、雌ハウジング30の左右端部30a,30bにも下
方に突出する取付ボス33が形成され、側面に取付金具
37がとりつけられている。The female film contact 40 has a tip end portion 40a having a locking groove 31b on the upper surface of the holding arms 31 and 32.
It is arranged so as to be wound around the holding arms 31 and 32 while being locked by the holding arm 32b, and is pressed and attached by the holding member 35 in this state. The tip 36 of the holding member 35 has the holding arms 31, 32.
Both film contacts 20 are pressed against the inner side surfaces of the left and right holding arms 11 and 12 through the space between them, and are connected to the female housing 30 by engaging means (not shown). The fitting protrusion 36a formed on the tip portion 36 of the holding member 35 projects upward from between the holding arms 31 and 32. Incidentally, mounting bosses 33 projecting downward are also formed on the left and right end portions 30a, 30b of the female housing 30, and mounting brackets 37 are mounted on the side surfaces.
【0013】この雌フィルムコンタクト40は雄フィル
ムコンタクト20と類似する構成であり、図5に示すよ
うに、ポリイミド等の絶縁フィルム41aの上に導電性
の配線パターン41bが複数形成されて作られている。
その先端40a側における絶縁フィルム41aには、各
配線パターン41bに対応して四角状の受容開口43が
形成され、この受容開口43の下面側にこの開口43を
覆うようにして配線パターン41bが位置している。な
お、雌フィルムコンタクト40の後端40b側に各配線
パターン41毎にハンダバンプ45が形成されている。
雌フィルムコンタクト40が雌ハウジング30に取り付
けられた状態で、受容開口43は各保持アーム31,3
2の上面における受圧部材38の上に位置して所定ピッ
チで整列し、ハンダバンプ45は、雌ハウジング30の
下面から僅かに突出する。ハンダパンプ45もプリント
基板へのサーフェスマウントのために用いられる。The female film contact 40 has a structure similar to that of the male film contact 20, and is formed by forming a plurality of conductive wiring patterns 41b on an insulating film 41a such as polyimide as shown in FIG. There is.
A rectangular receiving opening 43 is formed in the insulating film 41a on the tip 40a side so as to correspond to each wiring pattern 41b, and the wiring pattern 41b is positioned on the lower surface side of the receiving opening 43 so as to cover the opening 43. is doing. A solder bump 45 is formed for each wiring pattern 41 on the rear end 40b side of the female film contact 40.
With the female film contact 40 attached to the female housing 30, the receiving opening 43 is inserted into each of the holding arms 31, 3.
The solder bumps 45 are located on the pressure receiving member 38 on the upper surface of the second member 2 and are aligned at a predetermined pitch, and the solder bumps 45 slightly project from the lower surface of the female housing 30. The solder pump 45 is also used for surface mounting on the printed circuit board.
【0014】なお、上記雄フィルムコンタクト20は、
例えば、日東電工(株)製のASMATと称される基材
により作られる。この基材に製造について、図6を参照
して簡単に説明する。まず、図6(A)に示すように、
銅箔95の上にポリイミド等からなる絶縁フィルム層9
0をキャスティング形成し、ついで、図6(B)に示す
ように銅箔95をエッチングして複数の配線パターン層
96を残留形成させる。そして、図6(C)に示すよう
に所定位置(各配線パターン96に対向する位置)にお
いて絶縁フィルム層90に小孔91を形成する。この
後、図6(D)に示すように、各小孔91内に金属93
を充填するとともに、さらにこれを盛り上げてバンプ9
4を形成する。このため、各バンプ94は、絶縁フィル
ム層90に対して配線パターン層96とは反対側に突出
するとともに、充填金属93を介して配線パターン層9
6と接続される。The male film contact 20 is
For example, it is made of a base material called ASMAT manufactured by Nitto Denko Corporation. Manufacturing of this base material will be briefly described with reference to FIG. First, as shown in FIG.
Insulating film layer 9 made of polyimide or the like on the copper foil 95
0 is cast, and then the copper foil 95 is etched to form a plurality of wiring pattern layers 96, as shown in FIG. 6B. Then, as shown in FIG. 6C, a small hole 91 is formed in the insulating film layer 90 at a predetermined position (a position facing each wiring pattern 96). Thereafter, as shown in FIG. 6D, the metal 93 is placed in each small hole 91.
And fill it with bumps 9
4 is formed. Therefore, each bump 94 projects toward the side opposite to the wiring pattern layer 96 with respect to the insulating film layer 90, and the wiring pattern layer 9 is interposed via the filling metal 93.
6 is connected.
【0015】上記のような構成の雌雄コネクタ1,3
は、図2において矢印Aで示すように、雌雄ハウジング
10,30が組み合わされて、図3に示すように一体に
結合される。このとき、雌ハウジング30の嵌合突起3
6aが雄ハウジング10の嵌合溝16a内に嵌入され、
両ハウジング10,30が位置決めされて結合される。
このように結合された状態で、球面状接触バンプ23が
受容開口43内に受容され、受容開口43の底面を構成
する配線パターン(以下、接触導電層と称する)41b
に当接する。ここで、球面状接触バンプ23および接触
導電層41bの下側には受圧部材18,38が配設され
ているため、これら受圧部材18,38が弾性変形する
ことにより、この当接接触部に所定の当接力を付与す
る。Male and female connectors 1 and 3 having the above-mentioned structure
2, the male and female housings 10 and 30 are combined as shown by an arrow A in FIG. 2 and are integrally connected as shown in FIG. At this time, the fitting protrusion 3 of the female housing 30
6a is fitted into the fitting groove 16a of the male housing 10,
Both housings 10 and 30 are positioned and coupled.
In this combined state, the spherical contact bump 23 is received in the receiving opening 43, and a wiring pattern (hereinafter referred to as a contact conductive layer) 41b forming the bottom surface of the receiving opening 43.
Abut. Here, since the pressure receiving members 18 and 38 are disposed below the spherical contact bumps 23 and the contact conductive layer 41b, the pressure receiving members 18 and 38 are elastically deformed, so that the contact contact portions are Apply a predetermined contact force.
【0016】このように互いに当接する雌球面状接触バ
ンプ23および受容開口43は、上述したようにそれぞ
れ図7(A),(B)に示すような形状にに形成されて
いる。このため、雌雄コネクタ1,3が結合されたとき
に、図7(A)において2点鎖線で示すように、球面状
接触バンプ23は受容開口43内に受容されて図7
(C)に示すようにこの受容開口43の底面となる接触
導電層41bに当接する。このため、球面状接触バンプ
23は確実に接触導電層41bと当接接続される。The female spherical contact bumps 23 and the receiving openings 43 that come into contact with each other are formed in the shapes shown in FIGS. 7A and 7B, respectively, as described above. Therefore, when the male and female connectors 1 and 3 are coupled, the spherical contact bump 23 is received in the receiving opening 43 as shown by the chain double-dashed line in FIG.
As shown in (C), it abuts on the contact conductive layer 41b which is the bottom surface of the receiving opening 43. Therefore, the spherical contact bump 23 is surely brought into contact with the contact conductive layer 41b.
【0017】この場合に、球面状接触バンプ23の位置
が受容開口43から若干ずれて当接するような場合で
も、球面状接触バンプ23は受容開口43により案内さ
れて中央に移動して接触する。このため、雌雄コネクタ
1,3の結合時に球面状接触バンプ23と受容開口43
との当接位置に若干の位置ずれがあっても自己位置調整
がなされ、自動的に位置決めされて正確に当接する。こ
のため、例えば、雌雄ハウジング10,30への雌雄フ
ィルムコンタクト20,40の取付位置決め誤差の許容
精度に余裕ができ、これらの製造が容易となる。In this case, even if the position of the spherical contact bump 23 is slightly displaced from the receiving opening 43 and comes into contact with the spherical contact bump 23, the spherical contact bump 23 is guided by the receiving opening 43 and moves to the center to make contact. Therefore, when the male and female connectors 1 and 3 are connected, the spherical contact bump 23 and the receiving opening 43 are formed.
Even if there is a slight misalignment between the contact positions with and, self-position adjustment is performed, and they are automatically positioned and accurately contact. For this reason, for example, there is a margin in the allowable accuracy of the mounting and positioning error of the male and female film contacts 20 and 40 to the male and female housings 10 and 30, and the manufacture of these is facilitated.
【0018】[0018]
【発明の効果】以上説明したように、本発明によれば、
ハウジングを互いに係合させた状態で雌雄フィルムコン
タクトの接触部同士を当接接触させるようにバットジョ
イントコネクタが構成され、雄フィルムコンタクトの接
触部は相手接触部の方に突出する球面状バンプにより形
成され、雌フィルムコンタクトの接触部は絶縁フィルム
層に形成されて球面状バンプを受容する受容開口と絶縁
フィルム層の裏面から受容開口を覆う接触導電層とから
形成されているので、ハウジングを互いに係合させる
と、球面状バンプが雌フィルムコンタクトの受容開口内
に受容されて接触導電層と当接接触し、導電パターン同
士が電気接続される。この場合、接触部同士は、互いに
押し付け合うようにして当接するだけなので、こすり合
うことがなく、接触部の摩耗のおそれがない。また、球
面状バンプが受容開口に受容されて接触導電層と接触す
るようになっているため、球面状バンプを受容開口によ
りガイドして位置決めさせることができ、接触部同士を
正確に位置決めして接触させることができる。As described above, according to the present invention,
The butt joint connector is configured to bring the contact portions of the male and female film contacts into contact with each other while the housings are engaged with each other, and the contact portion of the male film contact is formed by a spherical bump protruding toward the mating contact portion. Since the contact portion of the female film contact is formed of the receiving opening formed in the insulating film layer to receive the spherical bump and the contact conductive layer covering the receiving opening from the back surface of the insulating film layer, the housing is engaged with each other. When combined, the spherical bumps are received in the receiving openings of the female film contact and come into abutting contact with the contact conductive layer to electrically connect the conductive patterns. In this case, the contact portions are simply pressed against each other and abutted against each other, so that the contact portions do not rub against each other, and there is no fear of abrasion of the contact portions. Further, since the spherical bump is received by the receiving opening and comes into contact with the contact conductive layer, the spherical bump can be guided and positioned by the receiving opening, and the contact portions can be accurately positioned. Can be contacted.
【図1】本発明に係るバットジョイントコネクタを示す
斜視図である。FIG. 1 is a perspective view showing a butt joint connector according to the present invention.
【図2】本発明に係るバットジョイントコネクタを雌雄
コネクタに分解した状態で示す断面図である。FIG. 2 is a cross-sectional view showing a butt joint connector according to the present invention in a disassembled state into a male and female connector.
【図3】本発明に係るバットジョイントコネクタを雌雄
コネクタを結合した状態で示す断面図である。FIG. 3 is a cross-sectional view showing a butt joint connector according to the present invention in a state in which male and female connectors are connected.
【図4】このバットジョイントコネクタに用いられる雄
フィルムコンタクトを示す斜視図である。FIG. 4 is a perspective view showing a male film contact used in this butt joint connector.
【図5】このバットジョイントコネクタに用いられる雌
フィルムコンタクトを示す斜視図である。FIG. 5 is a perspective view showing a female film contact used in this butt joint connector.
【図6】フィルムコンタクトの製造行程を示す断面図で
ある。FIG. 6 is a cross-sectional view showing a manufacturing process of the film contact.
【図7】本発明のバットジョイントコネクタにおける球
面状接触バンプおよび受容開口を示す平面図および正面
図である。FIG. 7 is a plan view and a front view showing a spherical contact bump and a receiving opening in the butt joint connector of the present invention.
1 雄コネクタ 3 雌コネクタ 10 雄ハウジング 20 雄フィルムコンタクト 23 球面状接触バンプ 30 雌ハウジング 40 雌フィルムコンタクト 43 受容開口 1 Male Connector 3 Female Connector 10 Male Housing 20 Male Film Contact 23 Spherical Contact Bump 30 Female Housing 40 Female Film Contact 43 Receiving Opening
Claims (1)
一端に接触部を有した複数の導電パターンを絶縁フィル
ム表面に形成してなる雌雄フィルムコンタクトとからな
り、 前記ハウジングに、それぞれ前記接触部を相手ハウジン
グに向けて前記雌雄フィルムコンタクトが取り付けら
れ、前記ハウジングを互いに係合させた状態で前記雌雄
フィルムコンタクトの接触部同士が当接接触するように
構成されており、 前記雄フィルムコンタクトの接触部が相手接触部の方に
突出する球面状バンプにより形成され、前記雌フィルム
コンタクトの接触部が前記絶縁フィルム層に形成されて
前記球面状バンプを受容する受容開口と前記絶縁フィル
ム層の裏面から前記受容開口を覆う接触導電層とから形
成されていることを特徴とするバットジョイントコネク
タ。1. A pair of housings engageable with each other,
And a male and female film contact formed by forming a plurality of conductive patterns having a contact portion at one end on the surface of the insulating film, the housing, the female and male film contacts are attached with the contact portions facing the mating housing, respectively, The contact portions of the male and female film contacts are configured to come into contact with each other in a state where the housings are engaged with each other, and the contact portion of the male film contact is formed by a spherical bump protruding toward the mating contact portion. The contact portion of the female film contact is formed of a receiving opening formed in the insulating film layer to receive the spherical bump and a contact conductive layer covering the receiving opening from the back surface of the insulating film layer. Butt joint connector.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19515493A JPH0729649A (en) | 1993-07-12 | 1993-07-12 | Butt joint connector |
US08/273,057 US5499924A (en) | 1993-07-12 | 1994-07-11 | Butt joint connector assembly |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19515493A JPH0729649A (en) | 1993-07-12 | 1993-07-12 | Butt joint connector |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0729649A true JPH0729649A (en) | 1995-01-31 |
Family
ID=16336334
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19515493A Pending JPH0729649A (en) | 1993-07-12 | 1993-07-12 | Butt joint connector |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0729649A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1174041A (en) * | 1997-09-01 | 1999-03-16 | Kel Corp | Array type connector |
US7568449B2 (en) | 2004-11-24 | 2009-08-04 | Richell U.S.A., Inc. | Freestanding pet barrier |
US7978787B2 (en) | 2005-05-27 | 2011-07-12 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
WO2021140918A1 (en) * | 2020-01-09 | 2021-07-15 | 株式会社村田製作所 | Electrical connector set and circuit board on which electrical connector set is mounted |
-
1993
- 1993-07-12 JP JP19515493A patent/JPH0729649A/en active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1174041A (en) * | 1997-09-01 | 1999-03-16 | Kel Corp | Array type connector |
US7568449B2 (en) | 2004-11-24 | 2009-08-04 | Richell U.S.A., Inc. | Freestanding pet barrier |
US7954456B2 (en) | 2004-11-24 | 2011-06-07 | Richell U.S.A., Inc. | Freestanding pet barrier |
US7978787B2 (en) | 2005-05-27 | 2011-07-12 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
WO2021140918A1 (en) * | 2020-01-09 | 2021-07-15 | 株式会社村田製作所 | Electrical connector set and circuit board on which electrical connector set is mounted |
JPWO2021140918A1 (en) * | 2020-01-09 | 2021-07-15 |
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