JPH07254781A - Mounting of electronic component - Google Patents
Mounting of electronic componentInfo
- Publication number
- JPH07254781A JPH07254781A JP4568494A JP4568494A JPH07254781A JP H07254781 A JPH07254781 A JP H07254781A JP 4568494 A JP4568494 A JP 4568494A JP 4568494 A JP4568494 A JP 4568494A JP H07254781 A JPH07254781 A JP H07254781A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- substrate
- land
- solder portion
- bond
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、電子部品の電極を基板
のランドにハンダ付けする電子部品の実装方法に関する
ものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of mounting an electronic component by soldering an electrode of the electronic component to a land of a board.
【０００２】[0002]
【従来の技術】電子部品として、電極にバンプ（突出電
極）を突設したものがフリップチップなどとして知られ
ている。このようなバンプ付電子部品は小型化が可能で
あることから、近年、次第にその需要が増大している。2. Description of the Related Art As an electronic component, a bump (protruding electrode) provided on an electrode is known as a flip chip. Since such a bumped electronic component can be miniaturized, the demand for it is gradually increasing in recent years.
【０００３】図６は従来の基板に搭載されたバンプ付電
子部品の正面図、図７は従来の基板にハンダ付けされた
電子部品の部分拡大断面図である。図６に示すように、
バンプ付電子部品１は、本体２の下面の電極３に突設さ
れたバンプ４を基板５のランド６に着地させた後、バン
プ４を加熱炉などで加熱して溶融し、次いで冷却して固
化させることにより、基板５に実装される。バンプ４の
加熱溶融時には自重およびハンダの表面張力によりバン
プ付電子部品１は沈み込むことから、図７に示すように
バンプ４は側方に膨出して略球状になっている。FIG. 6 is a front view of an electronic component with bumps mounted on a conventional substrate, and FIG. 7 is a partially enlarged sectional view of an electronic component soldered on a conventional substrate. As shown in FIG.
In the electronic component with bumps 1, the bumps 4 protruding from the electrodes 3 on the lower surface of the main body 2 are landed on the lands 6 of the substrate 5, and then the bumps 4 are heated in a heating furnace or the like to melt and then cooled. It is mounted on the substrate 5 by being solidified. When the bumps 4 are melted by heating, the electronic component 1 with bumps sinks due to its own weight and the surface tension of the solder, so that the bumps 4 bulge laterally and have a substantially spherical shape, as shown in FIG.
【０００４】[0004]
【発明が解決しようとする課題】基板５は電子機器に組
み込まれるが、バンプ付電子部品１は駆動の際に自己発
熱し、また駆動が停止すると自然冷却することから、バ
ンプ４には発熱負荷と冷却負荷が繰り返し付与され、そ
の結果、バンプ４には図７に示すようにクラック７が生
じやすいという問題点があった。一方、バンプ４の形状
を胴細のつづみ形にすると、クラック７の発生を解消で
きることが知られている。Although the substrate 5 is incorporated into an electronic device, the bumped electronic component 1 self-heats when driven and naturally cools when the driving is stopped. The cooling load is repeatedly applied, and as a result, there is a problem that cracks 7 are likely to occur on the bumps 4 as shown in FIG. On the other hand, it is known that the formation of the crack 7 can be eliminated by forming the bump 4 in the shape of a thin body.
【０００５】また図６に示すように、バンプ４の形状は
略球形であるが、このような略球形のバンプ４を本体２
の下面に多数個形成することは技術的にかなり難しく、
特別のバンプ形成装置が必要なこともあって、コストア
ップになりやすいという問題点があった。またバンプ４
の形状や体積（量）の管理も難しく、形状や体積、殊に
高さがばらつきやすいことから、加熱炉でバンプ４を加
熱溶融させると、ハンダブリッジを生じたり、あるいは
ランド６との接着不良が発生しやすいなどの問題点があ
った。Further, as shown in FIG. 6, the bump 4 has a substantially spherical shape.
It is technically difficult to form a large number on the underside of
There is a problem that the cost tends to increase because a special bump forming device is required. Bump 4 again
Since it is difficult to control the shape and volume (quantity) of the metal, and the shape and volume, especially the height, are likely to vary, when the bumps 4 are heated and melted in a heating furnace, solder bridges occur or adhesion failure with the lands 6 occurs. There was a problem that it was easy to occur.
【０００６】そこで本発明は、上記従来技術の問題点を
解消し、溶融固化後のハンダ部の断面形状をクラックが
生じにくいつづみ形にすることができる電子部品の実装
方法を提供することを第１の目的とする。また低コスト
で、しかもハンダブリッジや基板のランドとの接着不良
を生じにくい電子部品の実装方法を提供することを第２
の目的とする。Therefore, the present invention solves the above-mentioned problems of the prior art and provides a mounting method of an electronic component capable of making the cross-sectional shape of a solder portion after melting and solidification into a stub shape in which cracks are less likely to occur. The first purpose. A second object is to provide a method for mounting electronic components at low cost, which is less likely to cause poor adhesion to a solder bridge or a land of a substrate.
The purpose of.
【０００７】[0007]
【課題を解決するための手段】このために本発明は、電
子部品の電極の下面に板状のハンダ部を予め形成すると
ともに、ハンダ部の溶融温度よりも低い温度で熱硬化す
る熱硬化樹脂から成るボンドを、電極とハンダ部とラン
ドの厚さの総和よりも高い高さでランドの近傍に塗布
し、ハンダ部をランド上に合致させるとともに、電子部
品の下面をボンドに着地させて電子部品を基板に搭載
し、次いで基板を加熱炉で加熱することにより、まずボ
ンドを熱硬化させ、更に基板を加熱することによりハン
ダ部を溶融した後、溶融したハンダ部を固化させて、電
子部品を基板にハンダ付けするようにしたものである。
さらには、電子部品の電極の下面および基板のランドの
上面、あるいは基板のランドの上面のみにも板状のハン
ダ部を予め形成するようにしたものである。To this end, the present invention provides a thermosetting resin in which a plate-shaped solder portion is preliminarily formed on the lower surface of an electrode of an electronic component and which is heat-cured at a temperature lower than the melting temperature of the solder portion. A bond consisting of the above is applied to the vicinity of the land at a height higher than the total thickness of the electrode, the solder and the land, the solder is aligned with the land, and the bottom surface of the electronic component is landed on the bond. By mounting the components on the board and then heating the board in a heating furnace, the bond is first thermoset, and the board is further heated to melt the solder part, and then the melted solder part is solidified to produce an electronic component. Is soldered to the substrate.
Further, a plate-shaped solder portion is formed in advance only on the lower surface of the electrode of the electronic component and the upper surface of the land of the substrate, or only the upper surface of the land of the substrate.
【０００８】[0008]
【作用】上記構成によれば、電子部品を基板に搭載する
と、ボンドは未硬化であるので板状のハンダ部の平坦な
面が基板のランドの上面に接触した状態で仮止めされ
る。次に加熱炉で加熱すると、まずボンドが熱硬化する
ので、電子部品が自重により沈み込むのは硬化したボン
ドにより阻止され、電子部品と基板のギャップは所定の
間隔に固定される。したがって溶融したハンダ部は形状
のよい略つづみ形となって固化し、電極はランドにしっ
かりハンダ付けされる。According to the above construction, when the electronic component is mounted on the substrate, the bond is uncured, so that the flat surface of the plate-shaped solder portion is temporarily fixed in contact with the upper surface of the land of the substrate. Next, when the bond is heated in a heating furnace, the bond is thermally cured first, so that the electronic component is prevented from sinking due to its own weight by the cured bond, and the gap between the electronic component and the substrate is fixed at a predetermined interval. Therefore, the molten solder portion is solidified into a substantially staggered shape, and the electrode is firmly soldered to the land.
【０００９】また板状のハンダ部は、メッキ手段により
従来の球形のバンプよりもはるかに容易に形成でき、ま
たその厚さや体積（量）の管理も容易かつ正確に行える
ので、ハンダブリッジや基板のランドとの接着不良の発
生も解消できる。Further, the plate-shaped solder portion can be formed by plating means much more easily than the conventional spherical bump, and the thickness and volume (quantity) thereof can be easily and accurately controlled. It is possible to eliminate the occurrence of adhesion failure with the land.
【００１０】[0010]
【実施例】次に、図面を参照しながら本発明の実施例を
説明する。図１（ａ），（ｂ），（ｃ），（ｄ）は本発
明の第一実施例の電子部品の実装工程図、図２は図１
（ｄ）のＡ部分の拡大図である。まず図１（ａ），
（ｂ），（ｃ），（ｄ）を参照しながら、電子部品を基
板にハンダ付けする方法を説明する。図１（ａ）におい
て、１１は電子部品であり、本体１２をサブ基板１３に
搭載して構成されている。サブ基板１３の下面には電極
１４がマトリクス状に多数個形成されており、電極１４
の下面にはハンダ部１５が形成されている。このハンダ
部１５は、メッキ手段により一様な厚さで板状に形成さ
れている。なお電子部品１１としては、本体１２の下面
に直接電極１４を形成したサブ基板１３を有しないもの
でもよい。Embodiments of the present invention will now be described with reference to the drawings. 1 (a), 1 (b), 1 (c), and 1 (d) are electronic component mounting process diagrams of the first embodiment of the present invention, and FIG.
It is an enlarged view of the A section of (d). First, as shown in FIG.
A method of soldering an electronic component to a substrate will be described with reference to (b), (c) and (d). In FIG. 1A, 11 is an electronic component, which is configured by mounting a main body 12 on a sub-board 13. A large number of electrodes 14 are formed in a matrix on the lower surface of the sub-board 13.
A solder portion 15 is formed on the lower surface of the. The solder portion 15 is formed in a plate shape with a uniform thickness by plating means. Note that the electronic component 11 may not have the sub-board 13 in which the electrode 14 is directly formed on the lower surface of the main body 12.
【００１１】１６は基板であって、その上面にはランド
（電極）１７がマトリクス状に多数個形成されている。
またランド１７の近傍にはボンド１８が山形状に塗布さ
れている。このボンド１８は熱硬化性樹脂であり、ハン
ダ部１５の溶融温度（一般に１８３℃程度）よりも低い
温度（例えば１５０℃程度）で熱硬化する。このボンド
１８は、ディスペンサにより滴下するなどして塗布され
る。なお図示しないが、ランド１７上にはフラックスが
塗布されている。Reference numeral 16 is a substrate, and a large number of lands (electrodes) 17 are formed in a matrix on the upper surface thereof.
The bond 18 is applied in the shape of a mountain in the vicinity of the land 17. The bond 18 is a thermosetting resin, and is thermoset at a temperature (eg, about 150 ° C.) lower than the melting temperature of the solder part 15 (generally about 183 ° C.). The bond 18 is applied by dropping it with a dispenser. Although not shown, the land 17 is coated with flux.
【００１２】この電子部品１１を、自動搭載機（図示せ
ず）により、図１（ｂ）に示すように電極１４をランド
１７に合致させて基板１６に搭載する。この場合、ハン
ダ部１５がランド１７の上面に着地もしくはわずかなギ
ャップをおいて近接するように、サブ基板１３でボンド
１８の頂部を押し潰しながら、電子部品１１を基板１６
に搭載する。The electronic component 11 is mounted on the substrate 16 by an automatic mounting machine (not shown) with the electrodes 14 aligned with the lands 17 as shown in FIG. 1B. In this case, the electronic component 11 is mounted on the substrate 16 while the top of the bond 18 is crushed by the sub-board 13 so that the solder part 15 lands on the land 17 or approaches the land 17 with a slight gap.
To be installed on.
【００１３】図１（ｂ）に示すように、電子部品１１を
基板１６上に搭載した状態で、サブ基板１３がボンド１
８の頂部に確実に着地できるように、ボンド１８の高さ
Ｈは、電極１４とハンダ部１５とランド１７の厚さの総
和よりも高くなるように設定されている。このようにし
て電子部品１１を基板１６に搭載すれば、電子部品１１
と基板１６のギャップＧは、電極１４とハンダ部１５と
ランド１７の厚さの総和で決定される。したがってハン
ダ部１５の厚さを一定にすれば、すべての電子部品１１
についてギャップＧを等しくすることができる。またハ
ンダ部１５の厚さおよび面積を調整することにより、ギ
ャップＧの間隔を加熱炉で加熱されて溶融したハンダ部
１５の断面形状が略つづみ形になるような寸法にし、後
述するような断面形状が略つづみ形の形状のよいハンダ
部１５’を生成することができる。ここで、このハンダ
部１５は単純な板状であり、メッキ手段などにより厳密
な厚さ管理を行って、一定の厚さとなるように容易に形
成することができる。また電子部品１１をボンド１８に
接着することにより、基板１６をコンベヤにより搬送し
ながら、加熱炉などの実装工程を搬送する際に、基板１
６ががたついても、電子部品１１が位置ずれして、ハン
ダ部１５がランド１７から脱落するのを防止できる。As shown in FIG. 1B, when the electronic component 11 is mounted on the substrate 16, the sub-substrate 13 is bonded to the bond 1.
The height H of the bond 18 is set to be higher than the total thickness of the electrode 14, the solder portion 15 and the land 17 so that the land 18 can be reliably landed on the top portion. If the electronic component 11 is mounted on the substrate 16 in this manner, the electronic component 11
The gap G between the substrate 16 and the substrate 16 is determined by the total thickness of the electrode 14, the solder portion 15 and the land 17. Therefore, if the thickness of the solder portion 15 is constant, all the electronic components 11
The gap G can be made equal. By adjusting the thickness and area of the solder portion 15, the gap G is sized so that the cross-sectional shape of the solder portion 15 which is heated and melted in the heating furnace becomes a substantially zigzag shape. It is possible to generate the solder part 15 ′ having a good cross-sectional shape that is substantially stepped. Here, the solder portion 15 has a simple plate shape, and can be easily formed to have a constant thickness by strictly controlling the thickness by a plating means or the like. Further, by bonding the electronic component 11 to the bond 18, the substrate 16 is conveyed by a conveyor while the substrate 16 is conveyed by a mounting process such as a heating furnace.
Even if the backlash 6 occurs, the electronic component 11 can be prevented from being displaced and the solder portion 15 from falling off the land 17.
【００１４】次にこの基板１６を加熱炉（図外）へ送
り、加熱する。加熱炉において、基板１６は常温からハ
ンダ部１５の溶融温度（上述のように、一般には１８３
℃程度）よりも高い２２３℃程度まで徐々に加熱され
る。ボンド１８の硬化温度は、ハンダ部１５の溶融温度
よりも低い１５０℃程度であり、したがってハンダ部１
５が溶融する前に、ボンド１８は熱硬化する。図１
（ｃ）はボンド１８が硬化した状態を示しており、ボン
ド１８が熱硬化したことにより、電子部品１１と基板１
６のギャップＧは固定される。Next, the substrate 16 is sent to a heating furnace (not shown) and heated. In the heating furnace, the substrate 16 is heated from room temperature to the melting temperature of the solder portion 15 (as described above, generally 183
The temperature is gradually heated to about 223 ° C, which is higher than the temperature (about ° C). The curing temperature of the bond 18 is about 150 ° C., which is lower than the melting temperature of the solder portion 15, and therefore the solder portion 1
The bond 18 is thermoset before the 5 melts. Figure 1
(C) shows a state in which the bond 18 is cured, and the bond 18 is thermally cured, so that the electronic component 11 and the substrate 1 are
The gap G of 6 is fixed.
【００１５】加熱炉において、更に基板１６を加熱する
と、ハンダ部１５は溶融する。ハンダ部１５が溶融する
と、電子部品１１は自重により沈み込もうとするが、こ
の沈み込みは、すでに硬化したボンド１８により阻止さ
れる。したがって溶融したハンダ部１５が側方に膨出す
ることはなく、続いて溶融したハンダ部１５を冷却して
固化させれば、図２に示すように断面形状が略つづみ形
の形状のよいハンダ部１５’が得られる。このような胴
細のつづみ形の断面を有するハンダ部１５’は、電子部
品１１の駆動にともなう発熱負荷と冷却負荷が繰り返し
付与されても、図７に示すようなクラック７はきわめて
生じにくいものである。以上のように本方法によれば、
電子部品１１と基板１６のギャップＧを一定に保持しな
がら、略つづみ形のハンダ部１５’により、電子部品１
１の電極１４を基板１６のランド１７にしっかりハンダ
付けすることができる。When the substrate 16 is further heated in the heating furnace, the solder portion 15 is melted. When the solder portion 15 melts, the electronic component 11 tries to sink due to its own weight, but this sinking is blocked by the already cured bond 18. Therefore, the melted solder portion 15 does not bulge laterally, and if the melted solder portion 15 is subsequently cooled and solidified, the cross-sectional shape is good as shown in FIG. The solder portion 15 'is obtained. In the solder portion 15 ′ having such a thin, rugged cross section, the crack 7 as shown in FIG. 7 is extremely unlikely to occur even when the heat generation load and the cooling load accompanying the driving of the electronic component 11 are repeatedly applied. It is a thing. As described above, according to this method,
While the gap G between the electronic component 11 and the substrate 16 is kept constant, the electronic component 1 is formed by the substantially staggered solder portion 15 '.
The one electrode 14 can be firmly soldered to the land 17 of the substrate 16.
【００１６】また図３（ａ），（ｂ）は、本発明の第一
実施例の基板に反りがある場合の電子部品の実装工程図
を示している。図３（ａ）は図１（ｂ）と同じ工程であ
り、図３（ｂ）は図１（ｄ）と同じ工程である。図３
（ａ）において、この基板１６は図示するように反りが
あり、したがって基板１６に搭載された電子部品１１の
ハンダ部１５の一部（特に中央部のハンダ部１５）は基
板１６のランド１７に着地できず、ハンダ部１５とラン
ド１７の間には若干のギャップＧａがある。3 (a) and 3 (b) show a mounting process diagram of an electronic component when the substrate of the first embodiment of the present invention has a warp. 3A is the same step as FIG. 1B, and FIG. 3B is the same step as FIG. 1D. Figure 3
In (a), the board 16 has a warp as shown in the figure, and therefore, a part of the solder part 15 of the electronic component 11 mounted on the board 16 (in particular, the solder part 15 at the center) is attached to the land 17 of the board 16. It cannot land, and there is a slight gap Ga between the solder part 15 and the land 17.
【００１７】この基板１６を加熱炉で加熱してハンダ部
１５を溶融させると、溶融したハンダ部１５は自重によ
り垂下し、また表面張力により球状になり厚みを増し、
下方のランド１７に接触し、ヌレ性のよいランド１７に
吸い寄せられる。次いで基板１６を冷却してハンダ部１
５を固化させれば、図３（ｂ）に示すように電極１４と
ランド１７は略つづみ形のハンダ部１５’により接続さ
れる。このように本方法によれば、基板１６に反りがあ
ってハンダ部１５がランド１７に着地できない場合で
も、ハンダ部１５の表面を平坦にしておけばギャップＧ
ａを吸収して、電子部品１１の電極１４を基板１６のラ
ンド１７にしっかりハンダ付けできる。When the solder portion 15 is melted by heating the substrate 16 in a heating furnace, the melted solder portion 15 hangs down by its own weight and becomes spherical due to surface tension to increase the thickness.
It comes into contact with the lower land 17 and is attracted to the land 17 having a good wetting property. Next, the board 16 is cooled to cool the solder part 1.
When 5 is solidified, the electrodes 14 and the lands 17 are connected by a substantially staggered solder portion 15 'as shown in FIG. 3 (b). As described above, according to this method, even if the solder portion 15 cannot land on the land 17 due to the warp of the substrate 16, if the surface of the solder portion 15 is made flat, the gap G
By absorbing a, the electrode 14 of the electronic component 11 can be firmly soldered to the land 17 of the substrate 16.
【００１８】次に本発明の第二実施例を説明する。図４
（ａ），（ｂ），（ｃ），（ｄ）は本発明の第二実施例
の電子部品の実装工程図である。この第二実施例では、
板状のハンダ部１５ａ，１５ｂを電極１４の下面とラン
ド１７の上面に形成している点において第一実施例と異
なっている。この２つのハンダ部１５ａ，１５ｂの厚さ
の和は、図１（ａ）に示すハンダ部１５の厚さに等し
い。この実装方法は第一実施例と同様であって、電子部
品１１を基板１６に搭載し（図４（ｂ））、次に基板１
６を加熱炉で加熱してボンド１８を熱硬化させ（図４
（ｃ））、さらに基板１６を加熱してハンダ部１５ａ，
１５ｂを溶融・固化させることによりハンダ付けする
（図４（ｄ））。Next, a second embodiment of the present invention will be described. Figure 4
(A), (b), (c), (d) is a mounting process drawing of the electronic component of the second embodiment of the present invention. In this second embodiment,
This is different from the first embodiment in that plate-shaped solder portions 15a and 15b are formed on the lower surface of the electrode 14 and the upper surface of the land 17. The sum of the thicknesses of the two solder portions 15a and 15b is equal to the thickness of the solder portion 15 shown in FIG. This mounting method is the same as in the first embodiment, the electronic component 11 is mounted on the substrate 16 (FIG. 4B), and then the substrate 1
6 is heated in a heating furnace to thermally cure the bond 18 (see FIG.
(C)), the substrate 16 is further heated to heat the solder parts 15a,
Solder by melting and solidifying 15b (FIG. 4 (d)).
【００１９】図５（ａ），（ｂ），（ｃ），（ｄ）は本
発明の第三実施例の電子部品の実装工程図である。この
第三実施例では、板状のハンダ部１５は基板１６のラン
ド１７の上面にのみ形成されている。その実装方法は第
一実施例と同様であって、電子部品１１を基板１６に搭
載し（図５（ｂ））、次に基板１６を加熱してボンド１
８を熱硬化させ（図５（ｃ））、さらに基板１６を加熱
してハンダ部１５を溶融・固化させることによりハンダ
付けする（図５（ｄ））。5 (a), (b), (c) and (d) are mounting process diagrams of the electronic component of the third embodiment of the present invention. In the third embodiment, the plate-shaped solder portion 15 is formed only on the upper surface of the land 17 of the substrate 16. The mounting method is the same as in the first embodiment, the electronic component 11 is mounted on the substrate 16 (FIG. 5B), and then the substrate 16 is heated to bond 1
8 is heat-cured (FIG. 5C), and the substrate 16 is further heated to melt and solidify the solder portion 15 for soldering (FIG. 5D).
【００２０】[0020]
【発明の効果】以上説明したように本発明によれば、電
子部品の電極の下面や基板のランドの上面に所定の厚さ
を有する板状のハンダ部を形成することにより、電子部
品と基板のギャップを一定に保持し、ハンダ部が加熱さ
れて溶融する際に、先に熱硬化したボンドによって電子
部品が自重により沈み込むのを防止しながら、略つづみ
形の形状のよいハンダ部を生成し、電子部品の電極を基
板のランドにしっかりハンダ付けできる。しかも板状の
ハンダ部は、メッキ手段などにより、正確な厚さ管理を
行いながら、低コストで大量形成できるので、実装コス
トを大幅に低減できる。As described above, according to the present invention, by forming a plate-shaped solder portion having a predetermined thickness on the lower surface of the electrode of the electronic component and the upper surface of the land of the substrate, the electronic component and the substrate can be formed. When the solder part is heated and melted, the gap between the parts is kept constant, and while the thermosetting bond prevents the electronic parts from sinking due to their own weight, The electrodes of the electronic components can be produced and firmly soldered to the lands of the substrate. Moreover, since the plate-shaped solder portions can be formed in large quantities at low cost while accurately controlling the thickness by a plating means or the like, the mounting cost can be significantly reduced.
【図１】（ａ）本発明の第一実施例の電子部品の実装工
程図 （ｂ）本発明の第一実施例の電子部品の実装工程図 （ｃ）本発明の第一実施例の電子部品の実装工程図 （ｄ）本発明の第一実施例の電子部品の実装工程図1A is a mounting process diagram of an electronic component according to a first embodiment of the present invention, FIG. 1B is a mounting process diagram of an electronic component according to a first embodiment of the present invention, and FIG. 1C is an electronic component according to a first embodiment of the present invention. Component mounting process diagram (d) Electronic component mounting process diagram of the first embodiment of the present invention
【図２】本発明の第一実施例の図１（ｄ）のＡ部分の拡
大図FIG. 2 is an enlarged view of portion A of FIG. 1 (d) of the first embodiment of the present invention.
【図３】（ａ）本発明の第一実施例の基板に反りがある
場合の電子部品の実装工程図 （ｂ）本発明の第一実施例の基板に反りがある場合の電
子部品の実装工程図3A is a mounting process diagram of an electronic component when the substrate of the first embodiment of the present invention has a warp. FIG. 3B is a mounting process diagram of electronic component when the substrate of the first embodiment of the present invention has a warp. Process chart
【図４】（ａ）本発明の第二実施例の電子部品の実装工
程図 （ｂ）本発明の第二実施例の電子部品の実装工程図 （ｃ）本発明の第二実施例の電子部品の実装工程図 （ｄ）本発明の第二実施例の電子部品の実装工程図4A is a mounting process diagram of an electronic component according to a second embodiment of the present invention. FIG. 4B is a mounting process diagram of an electronic component according to a second embodiment of the present invention. Component mounting process diagram (d) Electronic component mounting process diagram of the second embodiment of the present invention
【図５】（ａ）本発明の第三実施例の電子部品の実装工
程図 （ｂ）本発明の第三実施例の電子部品の実装工程図 （ｃ）本発明の第三実施例の電子部品の実装工程図 （ｄ）本発明の第三実施例の電子部品の実装工程図5A is a mounting process drawing of an electronic component of a third embodiment of the present invention. FIG. 5B is a mounting process drawing of an electronic component of a third embodiment of the present invention. FIG. 5C is an electronic device of a third embodiment of the present invention. Component mounting process diagram (d) Electronic component mounting process diagram of the third embodiment of the present invention
【図６】従来の基板に搭載されたバンプ付電子部品の正
面図FIG. 6 is a front view of a conventional electronic component with bumps mounted on a substrate.
【図７】従来の基板にハンダ付けされた電子部品の部分
拡大断面図FIG. 7 is a partially enlarged sectional view of an electronic component soldered to a conventional board.
１１ 電子部品 １４ 電極 １５，１５’，１５ａ，１５ｂ ハンダ部 １６ 基板 １７ ランド １８ ボンド 11 electronic parts 14 electrodes 15, 15 ', 15a, 15b solder part 16 substrate 17 land 18 bond
Claims (3)
の上面に形成されたランドにハンダ付けする電子部品の
実装方法であって、前記電極の下面に板状のハンダ部を
予め形成するとともに、前記ハンダ部の溶融温度よりも
低い温度で熱硬化する熱硬化樹脂から成るボンドを、前
記電極と前記ハンダ部と前記ランドの厚さの総和よりも
高い高さで前記ランドの近傍に塗布し、前記ハンダ部を
前記ランドに合致させるとともに、前記電子部品の下面
を前記ボンドに着地させて前記電子部品を前記基板に搭
載し、次いで前記基板を加熱炉で加熱することにより、
まず前記ボンドを熱硬化させ、更に前記基板を加熱する
ことにより前記ハンダ部を溶融した後、溶融した前記ハ
ンダ部を固化させて、前記電子部品を前記基板にハンダ
付けすることを特徴とする電子部品の実装方法。1. A method of mounting an electronic component, wherein an electrode formed on a lower surface of an electronic component is soldered to a land formed on an upper surface of a substrate, and a plate-shaped solder portion is previously formed on a lower surface of the electrode. In addition, a bond made of a thermosetting resin that is thermoset at a temperature lower than the melting temperature of the solder portion is provided in the vicinity of the land at a height higher than the total thickness of the electrode, the solder portion, and the land. By applying and matching the solder portion to the land, the lower surface of the electronic component is landed on the bond to mount the electronic component on the substrate, and then by heating the substrate in a heating furnace,
First, the bond is thermoset, and the solder portion is melted by further heating the substrate, and then the melted solder portion is solidified, and the electronic component is soldered to the substrate. How to mount parts.
ダ部を予め形成したことを特徴とする請求項１記載の電
子部品の実装方法。2. The method of mounting an electronic component according to claim 1, wherein a plate-shaped solder portion is also formed in advance on the upper surface of the land of the substrate.
の上面に形成されたランドにハンダ付けする電子部品の
実装方法であって、前記ランドの上面に板状のハンダ部
を予め形成するとともに、前記ハンダ部の溶融温度より
も低い温度で熱硬化する熱硬化樹脂から成るボンドを、
前記電極と前記ハンダ部と前記ランドの厚さの総和より
も高い高さで前記ランドの近傍に塗布し、前記ハンダ部
を前記ランドに合致させるとともに、前記電子部品の下
面を前記ボンドに着地させて前記電子部品を前記基板に
搭載し、次いで前記基板を加熱炉で加熱することによ
り、まず前記ボンドを熱硬化させ、更に前記基板を加熱
することにより前記ハンダ部を溶融した後、溶融した前
記ハンダ部を固化させて、前記電子部品を前記基板にハ
ンダ付けすることを特徴とする電子部品の実装方法。3. A method of mounting an electronic component, wherein an electrode formed on the lower surface of the electronic component is soldered to a land formed on the upper surface of a substrate, and a plate-shaped solder portion is previously formed on the upper surface of the land. Along with, a bond composed of a thermosetting resin that is thermoset at a temperature lower than the melting temperature of the solder portion,
The vicinity of the land is applied at a height higher than the total thickness of the electrodes, the solder portion, and the land, and the solder portion is aligned with the land, and the lower surface of the electronic component is landed on the bond. By mounting the electronic component on the substrate, then heating the substrate in a heating furnace to thermally cure the bond first, and further heat the substrate to melt the solder portion, A method of mounting an electronic component, comprising: solidifying a solder portion and soldering the electronic component to the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4568494A JPH07254781A (en) | 1994-03-16 | 1994-03-16 | Mounting of electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4568494A JPH07254781A (en) | 1994-03-16 | 1994-03-16 | Mounting of electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07254781A true JPH07254781A (en) | 1995-10-03 |
Family
ID=12726226
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4568494A Pending JPH07254781A (en) | 1994-03-16 | 1994-03-16 | Mounting of electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07254781A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5727727A (en) * | 1995-02-02 | 1998-03-17 | Vlt Corporation | Flowing solder in a gap |
| US5808358A (en) * | 1994-11-10 | 1998-09-15 | Vlt Corporation | Packaging electrical circuits |
| WO2002005999A1 (en) * | 2000-07-19 | 2002-01-24 | Societe Novatec | Conduction-convection atmosphere reflowing or polymerisation method and device therefor |
| FR2812079A1 (en) * | 2000-07-19 | 2002-01-25 | Novatec Sa Soc | Solder cream re flowing or glue polymerisation for fixing surface mounted components on electronic cards using a gas with high conducting power and high heat capacity |
| US6819191B2 (en) | 1999-12-15 | 2004-11-16 | Murata Manufacturing Co., Ltd. | Piezoelectric oscillator unit |
| DE102004055511B3 (en) * | 2004-11-17 | 2006-02-09 | Danfoss Silicon Power Gmbh | Production process for a power semiconductor module forms solder layer between two partner layers then three hard fixing bridges and melts solder to give exact thickness |
| EP4387403A1 (en) * | 2022-12-14 | 2024-06-19 | Infineon Technologies Austria AG | Soldering a surface mount device to an application board |
-
1994
- 1994-03-16 JP JP4568494A patent/JPH07254781A/en active Pending
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6159772A (en) * | 1994-11-10 | 2000-12-12 | Vlt Corporation | Packaging electrical circuits |
| US5808358A (en) * | 1994-11-10 | 1998-09-15 | Vlt Corporation | Packaging electrical circuits |
| JPH10303542A (en) * | 1994-11-10 | 1998-11-13 | Vlt Corp | Method for soldering electrical circuit |
| US5906310A (en) * | 1994-11-10 | 1999-05-25 | Vlt Corporation | Packaging electrical circuits |
| US6096981A (en) * | 1994-11-10 | 2000-08-01 | Vlt Corporation | Packaging electrical circuits |
| US6119923A (en) * | 1994-11-10 | 2000-09-19 | Vlt Corporation | Packaging electrical circuits |
| US5727727A (en) * | 1995-02-02 | 1998-03-17 | Vlt Corporation | Flowing solder in a gap |
| US6819191B2 (en) | 1999-12-15 | 2004-11-16 | Murata Manufacturing Co., Ltd. | Piezoelectric oscillator unit |
| WO2002005999A1 (en) * | 2000-07-19 | 2002-01-24 | Societe Novatec | Conduction-convection atmosphere reflowing or polymerisation method and device therefor |
| FR2812080A1 (en) * | 2000-07-19 | 2002-01-25 | Novatec Sa Soc | CONDUCTIVE-CONVECTIVE ATMOSPHERE REFUSION OR POLYMERIZATION PROCESS AND IMPLEMENTING DEVICE |
| FR2812079A1 (en) * | 2000-07-19 | 2002-01-25 | Novatec Sa Soc | Solder cream re flowing or glue polymerisation for fixing surface mounted components on electronic cards using a gas with high conducting power and high heat capacity |
| DE102004055511B3 (en) * | 2004-11-17 | 2006-02-09 | Danfoss Silicon Power Gmbh | Production process for a power semiconductor module forms solder layer between two partner layers then three hard fixing bridges and melts solder to give exact thickness |
| EP4387403A1 (en) * | 2022-12-14 | 2024-06-19 | Infineon Technologies Austria AG | Soldering a surface mount device to an application board |
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