JPH07249842A - Low noise high frequency amplifier - Google Patents

Low noise high frequency amplifier

Info

Publication number
JPH07249842A
JPH07249842A JP3716994A JP3716994A JPH07249842A JP H07249842 A JPH07249842 A JP H07249842A JP 3716994 A JP3716994 A JP 3716994A JP 3716994 A JP3716994 A JP 3716994A JP H07249842 A JPH07249842 A JP H07249842A
Authority
JP
Japan
Prior art keywords
substrate
housing
hole
resist layer
back surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3716994A
Other languages
Japanese (ja)
Other versions
JP2731719B2 (en
Inventor
Ryotaro Manabe
良太郎 真鍋
Norio Ecchu
範夫 越中
Narikazu Ahiko
成和 阿彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yagi Antenna Co Ltd
Original Assignee
Yagi Antenna Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yagi Antenna Co Ltd filed Critical Yagi Antenna Co Ltd
Priority to JP6037169A priority Critical patent/JP2731719B2/en
Publication of JPH07249842A publication Critical patent/JPH07249842A/en
Application granted granted Critical
Publication of JP2731719B2 publication Critical patent/JP2731719B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Landscapes

  • Structure Of Printed Boards (AREA)
  • Amplifiers (AREA)

Abstract

PURPOSE:To securely conduct earth connection between a substrate and a housing, and also to stabilize noise factor characteristics. CONSTITUTION:A resist layer 11 is formed on the inside wall surface of the through hole 4 formed on a substrate. Then, an electronic part 2 is arranged on a printed substrate, its terminal 3 is soldered and connected to a circuit pattern. After the mounting of the electronic part 2 on the substrate has been completed, they are housed in a housing 6, the earth pattern formed on the back side of the substrate is brought into contact with the inside surface of the housing 6, and it is fixed by screwing. By the formation of the resist layer 11 in the through hole 4 in advance as above-mentioned, the protrusion of solder 5 to the back side passing through the through hole 4 can be prevented completely, the earth connection between the earth pattern of the substrate and the housing 6 can be conducted without fail, and noise factor characteristics can also be maintained in a stable manner.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明は、衛星放送受信用ＬＮＢ
（ローノイズブロックコンバータ）等の低雑音高周波増
幅装置に関する。BACKGROUND OF THE INVENTION The present invention relates to a satellite broadcast receiving LNB.
The present invention relates to a low noise high frequency amplifier such as a (low noise block converter).

【０００２】[0002]

【従来の技術】従来の低雑音高周波増幅装置、例えば衛
星放送受信用ＬＮＢでは、図２に示すようにプリント基
板１上に電子部品２を配置して、電子部品２の端子３を
半田付けし、その半田５により端子３を回路パターンに
接続している。この場合、端子３がアース端子であれ
ば、基板１に設けられているスルーホール４部分で半田
付けし、アース端子３をスルーホール４を介して基板１
の裏面に形成されているアースパターン（図示せず）に
接続する。そして、基板１に対して電子部品２の実装を
完了した後、基板１を筐体６内に収納し、ネジ止めによ
り筐体６に固定している。このネジ止めにより、基板１
の下面を矢印で示すように筐体６の内側面に圧接し、基
板１の裏面に形成されているアースパターンを筐体６に
アース接続している。2. Description of the Related Art In a conventional low-noise high-frequency amplifier, for example, an LNB for satellite broadcasting reception, an electronic component 2 is arranged on a printed circuit board 1 as shown in FIG. 2, and a terminal 3 of the electronic component 2 is soldered. The terminal 3 is connected to the circuit pattern by the solder 5. In this case, if the terminal 3 is a ground terminal, it is soldered at the through hole 4 portion provided in the substrate 1, and the ground terminal 3 is connected to the substrate 1 through the through hole 4.
Connected to a ground pattern (not shown) formed on the back surface of the. Then, after mounting the electronic component 2 on the board 1, the board 1 is housed in the housing 6 and fixed to the housing 6 by screwing. By this screwing, substrate 1
The lower surface of is grounded to the inner surface of the housing 6 as indicated by the arrow, and the ground pattern formed on the back surface of the substrate 1 is grounded to the housing 6.

【０００３】[0003]

【発明が解決しようとする課題】上記のように構成され
た従来の低雑音高周波増幅装置は、アース端子３を半田
付けする際、その半田５がスルーホール４より基板１の
裏面側に流れ込み、基板１の裏面より突出して凸部７を
形成する。この結果、基板１の裏面側に凹凸を生じ、基
板１の裏面を筐体６に圧接しても、アースパターンと筐
体６とのアース接続が一定とならず、雑音指数特性が不
安定になるという問題があった。In the conventional low noise high frequency amplifying apparatus constructed as described above, when the ground terminal 3 is soldered, the solder 5 flows from the through hole 4 to the back surface side of the substrate 1, The convex portion 7 is formed so as to project from the back surface of the substrate 1. As a result, unevenness is generated on the back surface side of the substrate 1, and even if the back surface of the substrate 1 is pressed against the housing 6, the ground connection between the ground pattern and the housing 6 is not constant and the noise figure characteristic becomes unstable. There was a problem of becoming.

【０００４】本発明は上記実情に鑑みてなされたもの
で、基板と筐体とのアース接続を確実に行ない得、雑音
指数特性を安定化することができる低雑音高周波増幅装
置を提供することを目的とする。The present invention has been made in view of the above circumstances, and it is an object of the present invention to provide a low noise high frequency amplifying device capable of reliably grounding the substrate and the housing and stabilizing the noise figure characteristic. To aim.

【０００５】[0005]

【課題を解決するための手段】本発明に係る低雑音高周
波増幅装置は、上面に回路パターン、裏面にアースパタ
ーンが形成され、このアースパターンと上記回路パター
ンとを選択的に接続するスルーホールを備えたプリント
基板と、上記スルーホールの内壁面に予め形成したレジ
スト層と、上記基板上面に配設され、半田付けにより上
記回路パターンに接続される電子部品と、上記基板を収
納する筐体と、上記基板のアースパターンを上記筐体の
内側面に当接させてアース接続する手段とを具備し、上
記スルーホールの内壁面に形成したレジスト層により、
上記半田付け時に上記スルーホールの裏面側への半田の
突出を阻止することを特徴とする。A low noise high frequency amplifying apparatus according to the present invention has a circuit pattern formed on an upper surface and a ground pattern on a back surface, and a through hole for selectively connecting the ground pattern and the circuit pattern to each other. A printed circuit board, a resist layer formed in advance on the inner wall surface of the through hole, an electronic component disposed on the upper surface of the circuit board and connected to the circuit pattern by soldering, and a housing for housing the circuit board. A means for connecting the ground pattern of the substrate to the inner side surface of the housing to connect to the ground, and a resist layer formed on the inner wall surface of the through hole,
It is characterized in that the solder is prevented from protruding toward the back surface of the through hole during the soldering.

【０００６】[0006]

【作用】上記のように基板に設けられる電子部品装着用
のスルーホールの内壁面に予めレジスト層を形成してお
くことにより、電子部品を半田付けする際、スルーホー
ル内を電子部品の実装面側から裏面方向に向かう半田
は、レジスト層で抵抗を受け、そこで停止する。従っ
て、半田が基板の裏面側に突出することを確実に防止で
き、基板の裏面に半田による凹凸を生ずることなく、基
板のアースパターンと筐体との接続が確実となり、雑音
指数特性を安定に保持することが可能となる。By forming the resist layer in advance on the inner wall surface of the through hole for mounting the electronic component provided on the substrate as described above, when the electronic component is soldered, the mounting surface of the electronic component is mounted inside the through hole. The solder from the side toward the back surface receives resistance at the resist layer and stops there. Therefore, it is possible to reliably prevent the solder from protruding to the back surface side of the board, to ensure the connection between the ground pattern of the board and the housing without causing unevenness due to the solder on the back surface of the board, and to stabilize the noise figure characteristic. It becomes possible to hold.

【０００７】[0007]

【実施例】以下、図面を参照して本発明の一実施例を説
明する。図１は、本発明の一実施例に係る低雑音高周波
増幅装置の構成を示す断面図である。図１において、１
は基板で、その上面には図示しないが回路パターンが形
成され、裏面には全面的にアースパターンが形成され
る。基板１の裏面に形成されたアースパターンは、スル
ーホール４を介して基板上面のアースパターンに接続さ
れる。スルーホール４の内壁面には、上記両アースパタ
ーンを接続するためのメッキが施されているが、更に、
そのメッキ面に対して、一部あるいは全部に予め基板１
の裏面側よりレジスト加工を施してレジスト層１１を形
成する。例えばスルーホール４の内壁面にレジスト用イ
ンクを塗布し、赤外線加熱により焼き付けてレジスト層
１１を形成する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a sectional view showing the configuration of a low noise high frequency amplifier according to an embodiment of the present invention. In FIG. 1, 1
Is a substrate, a circuit pattern (not shown) is formed on the upper surface thereof, and an earth pattern is formed on the entire rear surface thereof. The ground pattern formed on the back surface of the substrate 1 is connected to the ground pattern on the top surface of the substrate via the through holes 4. The inner wall surface of the through hole 4 is plated to connect the above two ground patterns.
A part or all of the substrate 1 is previously plated with respect to the plated surface.
A resist layer 11 is formed by performing resist processing from the back surface side. For example, resist ink is applied to the inner wall surface of the through hole 4 and baked by infrared heating to form the resist layer 11.

【０００８】その後、プリント基板１上に半導体増幅素
子等の電子部品２を配置して、電子部品２の端子３を半
田付けし、その半田５により端子３を回路パターンに接
続する。この場合、端子３がアース端子であれば、基板
１に設けられているスルーホール４部分で半田付けし、
アース端子３をスルーホール４を介して基板１の裏面に
形成されているアースパターン（図示せず）に接続す
る。After that, the electronic component 2 such as a semiconductor amplifying element is arranged on the printed board 1, the terminal 3 of the electronic component 2 is soldered, and the solder 5 connects the terminal 3 to the circuit pattern. In this case, if the terminal 3 is a ground terminal, it is soldered at the through hole 4 provided in the substrate 1,
The ground terminal 3 is connected to a ground pattern (not shown) formed on the back surface of the substrate 1 through the through hole 4.

【０００９】そして、基板１に対して電子部品２の実装
を完了した後、基板１を筐体６内に収納し、基板１の裏
面に形成されているアースパターンを筐体６の内側面に
当接させ、ネジ止めにより筐体６に固定する。これによ
り基板１の裏面に形成されているアースパターンを筐体
６にアース接続する。After mounting the electronic component 2 on the board 1, the board 1 is housed in the housing 6, and the ground pattern formed on the back surface of the board 1 is mounted on the inner surface of the housing 6. They are brought into contact with each other and fixed to the housing 6 with screws. As a result, the ground pattern formed on the back surface of the substrate 1 is grounded to the housing 6.

【００１０】上記のようにスルーホール４の内壁面に予
めレジスト層１１を形成しておくことにより、電子部品
２を半田付けする際、スルーホール４内を電子部品２の
実装面側から裏面方向に向かう半田５はレジスト層１１
部分で流れ難くなり、そこで停止する。従って、半田５
が基板１の裏面側に突出することを確実に防止できる。
この結果、基板１の裏面に凹凸を生ずることなく、基板
１のアースパターンと筐体６との接続を確実に行なうこ
とができ、雑音指数特性の劣化を確実に防止することが
できる。By forming the resist layer 11 on the inner wall surface of the through hole 4 in advance as described above, when the electronic component 2 is soldered, the inside of the through hole 4 is directed from the mounting surface side of the electronic component 2 to the back surface side. Solder 5 toward the resist layer 11
It becomes difficult to flow in a part and stops there. Therefore, solder 5
Can surely be prevented from protruding to the back surface side of the substrate 1.
As a result, the ground pattern of the substrate 1 can be reliably connected to the housing 6 without producing irregularities on the back surface of the substrate 1, and deterioration of the noise figure characteristic can be reliably prevented.

【００１１】[0011]

【発明の効果】以上詳記したように本発明によれば、基
板に設けられるスルーホールの内壁面に予めレジスト層
を形成しておき、その後、電子部品を半田付けするよう
にしたので、半田がスルーホール内を通って裏面側に突
出することを確実に防止できる。従って、基板の裏面を
平面状に保持して基板のアースパターンと筐体とのアー
ス接続を確実に行なうことができ、雑音指数特性を安定
に保持することができる。As described in detail above, according to the present invention, a resist layer is formed in advance on the inner wall surface of the through hole provided in the substrate, and then the electronic component is soldered. Can be reliably prevented from passing through the inside of the through hole and projecting to the back surface side. Therefore, the back surface of the substrate can be held flat to securely connect the ground pattern of the substrate to the ground, and the noise figure characteristic can be stably maintained.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明の一実施例に係る低雑音高周波増幅装置
の構成を示す断面図。FIG. 1 is a cross-sectional view showing a configuration of a low noise high frequency amplifier according to an embodiment of the present invention.

【図２】従来の低雑音高周波増幅装置の構成を示す断面
図。FIG. 2 is a cross-sectional view showing the configuration of a conventional low noise high frequency amplifier.

【符号の説明】[Explanation of symbols]

１ プリント基板 ２ 電子部品 ３ 端子 ４ スルーホール ５ 半田 ６ 筐体 ７ 凸部 １１ レジスト層 1 Printed Circuit Board 2 Electronic Component 3 Terminal 4 Through Hole 5 Solder 6 Housing 7 Convex Part 11 Resist Layer

Claims (1)

【特許請求の範囲】[Claims] 【請求項１】 上面に回路パターン、裏面にアースパタ
ーンが形成され、このアースパターンと上記回路パター
ンとを選択的に接続するスルーホールを備えたプリント
基板と、上記スルーホールの内壁面に予め形成したレジ
スト層と、上記基板上面に配設され、半田付けにより上
記回路パターンに接続される電子部品と、上記基板を収
納する筐体と、上記基板のアースパターンを上記筐体の
内側面に当接させてアース接続する手段とを具備し、上
記スルーホールの内壁面に形成したレジスト層により、
上記半田付け時に上記スルーホールの裏面側への半田の
突出を阻止することを特徴とする低雑音高周波増幅装
置。1. A printed circuit board having a circuit pattern on the top surface and a ground pattern on the back surface, and a through hole for selectively connecting the ground pattern and the circuit pattern, and an inner wall surface of the through hole. The resist layer, the electronic components disposed on the upper surface of the substrate and connected to the circuit pattern by soldering, the housing that houses the substrate, and the ground pattern of the substrate on the inner surface of the housing. A means for contacting and grounding is provided, and by the resist layer formed on the inner wall surface of the through hole,
A low-noise high-frequency amplifier device, characterized in that it prevents the solder from protruding to the back surface side of the through hole during the soldering.
JP6037169A 1994-03-08 1994-03-08 Low noise high frequency amplifier Expired - Fee Related JP2731719B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6037169A JP2731719B2 (en) 1994-03-08 1994-03-08 Low noise high frequency amplifier

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6037169A JP2731719B2 (en) 1994-03-08 1994-03-08 Low noise high frequency amplifier

Publications (2)

Publication Number Publication Date
JPH07249842A true JPH07249842A (en) 1995-09-26
JP2731719B2 JP2731719B2 (en) 1998-03-25

Family

ID=12490101

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6037169A Expired - Fee Related JP2731719B2 (en) 1994-03-08 1994-03-08 Low noise high frequency amplifier

Country Status (1)

Country Link
JP (1) JP2731719B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0876088A2 (en) * 1997-05-02 1998-11-04 NEC Corporation Semiconductor microwave amplifier
JP2016219727A (en) * 2015-05-26 2016-12-22 日立オートモティブシステムズ株式会社 Semiconductor device and manufacturing method of the same

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS631099A (en) * 1986-06-20 1988-01-06 松下電器産業株式会社 Shielding device
JPS63262892A (en) * 1987-04-21 1988-10-31 沖電気工業株式会社 Method of printing resist on printed board
JPH0353586A (en) * 1989-07-21 1991-03-07 Canon Inc Printed wiring board
JPH0492496A (en) * 1990-08-08 1992-03-25 Hitachi Ltd Manufacture of printed board and mounting method for electronic component
JPH04291988A (en) * 1991-03-20 1992-10-16 Fujitsu Ltd Double-sided smt printed board structure and reflow-soldering method in double-sided smt printed board
JPH04302193A (en) * 1991-03-29 1992-10-26 Canon Inc Printed board
JPH05206601A (en) * 1992-01-28 1993-08-13 Fujitsu Isotec Ltd Printed circuit board and grounding method thereof

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS631099A (en) * 1986-06-20 1988-01-06 松下電器産業株式会社 Shielding device
JPS63262892A (en) * 1987-04-21 1988-10-31 沖電気工業株式会社 Method of printing resist on printed board
JPH0353586A (en) * 1989-07-21 1991-03-07 Canon Inc Printed wiring board
JPH0492496A (en) * 1990-08-08 1992-03-25 Hitachi Ltd Manufacture of printed board and mounting method for electronic component
JPH04291988A (en) * 1991-03-20 1992-10-16 Fujitsu Ltd Double-sided smt printed board structure and reflow-soldering method in double-sided smt printed board
JPH04302193A (en) * 1991-03-29 1992-10-26 Canon Inc Printed board
JPH05206601A (en) * 1992-01-28 1993-08-13 Fujitsu Isotec Ltd Printed circuit board and grounding method thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0876088A2 (en) * 1997-05-02 1998-11-04 NEC Corporation Semiconductor microwave amplifier
EP0876088A3 (en) * 1997-05-02 1999-10-27 NEC Corporation Semiconductor microwave amplifier
JP2016219727A (en) * 2015-05-26 2016-12-22 日立オートモティブシステムズ株式会社 Semiconductor device and manufacturing method of the same

Also Published As

Publication number Publication date
JP2731719B2 (en) 1998-03-25

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