JPH0724839A - Plastic mold - Google Patents
Plastic moldInfo
- Publication number
- JPH0724839A JPH0724839A JP19535693A JP19535693A JPH0724839A JP H0724839 A JPH0724839 A JP H0724839A JP 19535693 A JP19535693 A JP 19535693A JP 19535693 A JP19535693 A JP 19535693A JP H0724839 A JPH0724839 A JP H0724839A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- mold
- resin mold
- plating
- aggregates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は耐久性に優れたプラスチ
ック成形型に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plastic molding die having excellent durability.
【０００２】[0002]
【従来の技術】従来、他の方法では製作できないような
アンダーカットのある金型、あるいは皮絞のような自然
の模様や彫刻などの微妙な表面状態を金型に模写するた
めに、電鋳という金型の作製方法が知られている。電鋳
は通常剥離膜を表面につけた母型に金属を金属塩から電
着させて後に析出金属を母型から剥離して母型と表面の
凹凸が反対の製品を得るか、またはその製品上に剥離皮
膜を付けて後、その上に金属を電着させて母型と同じ凹
凸のある製品を得る方法である。2. Description of the Related Art Conventionally, electroforming is used to copy a die with an undercut that cannot be produced by other methods, or a natural pattern such as a leather diaphragm or a delicate surface condition such as engraving, to the die. There is known a method of making a die. Electroforming usually involves depositing a metal from a metal salt on a mother die with a release film on the surface, and then peeling the deposited metal from the mother die to obtain a product whose surface unevenness is opposite to that of the mother die. It is a method of obtaining a product having the same unevenness as that of the mother die by applying a release coating to the above and then electrodepositing a metal on it.
【０００３】この電鋳金型はプラスチック成形型として
多用されているが、かなりの製作期間と費用がかかるの
で、短期間で製作を要求されるもの、あるいはコスト的
に合わない型については、それに代わるものとして樹脂
型あるいは樹脂型に無電界めっきを施して樹脂表面を保
護したプラスチック成形型が用いられている。This electroforming mold is often used as a plastic mold, but it takes a considerable amount of time and cost to manufacture, so that a mold that requires a short period of time or a mold that does not meet the cost is replaced by it. As a resin mold, a plastic mold in which electroless plating is applied to the resin mold to protect the resin surface is used.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、樹脂型
では表面硬度が低く耐摩耗性に劣るため表面が擦り減
り、必要期間の寿命が得られず、耐久性に問題があっ
た。However, since the resin mold has a low surface hardness and poor wear resistance, the surface is worn away, the required life cannot be obtained, and there is a problem in durability.
【０００５】一方、樹脂型にめっき層を形成したものに
あっては、樹脂型に化学処理で樹脂を傷めることなく溶
かすことのできる物質、例えばアルミニウム、鉄、ブタ
ジエン等の粒子を混入し樹脂型を形成し、表面にあるそ
れらの物質を溶解してできた微小な穴に、めっき層を入
り込ませてアンカー効果を持たせているものであった。On the other hand, in the case where the resin mold is provided with a plating layer, a resin mold is prepared by mixing a substance capable of melting the resin by chemical treatment without damaging the resin, such as particles of aluminum, iron or butadiene. , And the plating layer was made to enter into the minute holes formed by melting those substances on the surface to give the anchor effect.
【０００６】そのため、アンカー部が浅いためにめっき
皮膜を厚くすると反ってしまって剥離するので、めっき
層は２０〜５０μｍ程度に薄くする必要があり、耐久性
に問題があり、さらにめっき金属と接する樹脂部分の強
度が小さくなり、めっき層の剥離のため長期の使用に耐
えられないものであった。Therefore, since the anchor portion is shallow, if the plating film is thickened, it will warp and peel off. Therefore, the plating layer needs to be thinned to about 20 to 50 μm, and there is a problem in durability, and further contact with the plating metal. The strength of the resin portion was reduced and the plating layer was peeled off, so that it could not withstand long-term use.
【０００７】本発明は樹脂型にめっき層を施したプラス
チック成形型の前記のごとき問題点を解決するためにな
されたものであって、樹脂部分を傷めることなくアンカ
ー部を深くしかつめっき層が厚く耐久性に優れたプラス
チック成形型を提供することを目的とする。The present invention has been made in order to solve the above problems of a plastic molding die in which a resin layer is provided with a plating layer. The anchor portion is deepened without damaging the resin portion and the plating layer is formed. It is an object of the present invention to provide a thick plastic mold having excellent durability.
【０００８】[0008]
【課題を解決するための手段】発明者は前記問題点を解
決するため、最初からアンカー部の入り込む空隙を有す
る樹脂型を製作することを着想した。その着想に下にさ
らに研究を進めた結果、顆粒状骨材を樹脂バインダで接
着した接合体により、適度の多孔質体が形成されること
を見出し、これにめっきを施すと、強固なアンカー部と
一体になっためっき層が形成されることを見出して本発
明を完成するに到った。In order to solve the above problems, the inventor has conceived from the beginning to manufacture a resin mold having a void into which the anchor portion enters. As a result of further research based on that idea, it was found that a moderately porous body was formed by a bonded body in which granular aggregate was bonded with a resin binder, and when this was plated, a strong anchor part was formed. The present invention has been completed by finding that a plating layer integrated with the above is formed.
【０００９】本発明のプラスチック成形型は、顆粒状骨
材の表面にバインダ樹脂を被覆し該顆粒状骨材を相互に
接着して所望の形状に固めた樹脂型と、前記樹脂型の表
面から前記顆粒状骨材間の空隙に食い込むアンカー部と
一体になるように前記樹脂型表面に形成されためっき層
からなることを要旨とする。The plastic molding die of the present invention comprises a resin mold in which a binder resin is coated on the surface of a granular aggregate, and the granular aggregate is adhered to each other to harden it into a desired shape. The gist of the present invention is that it is composed of a plating layer formed on the surface of the resin mold so as to be integrated with an anchor portion that digs into the space between the granular aggregates.
【００１０】樹脂型を構成する顆粒状骨材の材質は、ガ
ラス、セラミック、金属等その種類を問わないが、プラ
スチック成形型として、その強度と耐熱性を有するもの
であれば良い。また、顆粒状骨材の形状は多面体、楕円
体、球体のいずれでも構わないが、骨材間の間隙を十分
に保つためには球体であることが好ましい。The material of the granular aggregate constituting the resin mold may be glass, ceramic, metal or the like, as long as it is a plastic molding mold having strength and heat resistance. The shape of the granular aggregate may be any of a polyhedron, an ellipsoid, and a sphere, but the sphere is preferable in order to sufficiently maintain the gap between the aggregates.
【００１１】バインダとなる樹脂は、熱硬化性樹脂であ
れば良く、エポキシ樹脂、ポリエステル樹脂等を用いる
ことができる。The binder resin may be a thermosetting resin, such as an epoxy resin or a polyester resin.
【００１２】めっき層の形成には、無電解めっきを用い
てもよく、また電解めっきを用いても良い。無電解めっ
きの場合所定の前処理を行って後めっき層を形成する
が、電解めっきの場合は、樹脂型に銀鏡反応によりＡｇ
の導電層を形成してからめっきする。めっき金属および
浴の種類は使用目的によって、ニッケルめっき、銅めっ
き、合金めっき等を適宜に選択できる。Electroless plating may be used for forming the plating layer, or electrolytic plating may be used. In the case of electroless plating, a predetermined pretreatment is carried out to form a post-plated layer. In the case of electrolytic plating, Ag is formed on the resin mold by silver mirror reaction.
After forming the conductive layer of, the plating is performed. Nickel plating, copper plating, alloy plating, and the like can be appropriately selected as the plating metal and the type of bath depending on the purpose of use.
【００１３】[0013]
【作用】本発明の樹脂型は、顆粒状骨材の表面にバイン
ダ樹脂を被覆し該顆粒状骨材を相互に接着して所望の形
状に固めたものであるため、樹脂は薄いバインダ樹脂皮
膜でもって骨材を包み込み、骨材同志はその形状によっ
て、各々点接触するものの接触点以外では空間を保持し
て積層されるため多孔質となり、表面および内部に微細
な孔と空隙が設けられる。In the resin mold of the present invention, the surface of the granular aggregate is coated with the binder resin, and the granular aggregates are adhered to each other to be hardened into a desired shape. Therefore, the resin is a thin binder resin film. Due to the shape of the aggregates, the aggregates are point-contacted with each other, but are laminated while holding a space other than the contact points, so that the aggregates are porous, and fine pores and voids are provided on the surface and inside.
【００１４】この樹脂型の表面にめっき層を形成する
と、樹脂型の表面から顆粒状骨材の空隙に食い込むアン
カー部が形成されこのアンカー部と一体になるようにめ
っき層が樹脂型表面に形成されるので、樹脂層と強固に
密着しためっき金属の皮膜が得られ、プラスチック成形
型の強度と寿命を著しく向上することができる。When a plating layer is formed on the surface of the resin mold, an anchor portion that digs into the void of the granular aggregate is formed from the surface of the resin mold, and the plating layer is formed on the surface of the resin mold so as to be integrated with the anchor portion. As a result, a plating metal film firmly adhered to the resin layer can be obtained, and the strength and life of the plastic molding die can be significantly improved.
【００１５】[0015]
【実施例】本発明の実施例を従来例と比較して説明す
る。本発明の実施例として、エポキシ樹脂１に対して粒
径０．３ｍｍのガラスビーズ１０の比率で混合し、この
混合体を所望の形状に固め、焼成して樹脂型を作製し
た。図１（ａ）はこの樹脂型を切断して観察した結果を
模写した部分拡大断面図であるが、樹脂１０は薄いバイ
ンダ樹脂皮膜１１でもって骨材１２を包み込み、骨材１
２同志はその形状によって、各々点接触するものの接触
点以外では空隙１４を保持して積層されるため多孔質と
なっている。EXAMPLES Examples of the present invention will be described in comparison with conventional examples. As an example of the present invention, a resin mold was prepared by mixing epoxy resin 1 with glass beads 10 having a particle diameter of 0.3 mm, hardening the mixture into a desired shape, and baking the mixture. FIG. 1A is a partially enlarged cross-sectional view showing a result obtained by cutting and observing the resin mold, and the resin 10 wraps the aggregate 12 with a thin binder resin film 11 to form an aggregate 1.
Depending on their shapes, the two members are in point contact with each other, but are porous because they are laminated while holding the voids 14 except at the contact points.
【００１６】次に、従来例として、エポキシ樹脂に対し
てアルミニウム粉末を混合し、この混合体を所望の形状
に固め、焼成して樹脂型を作製した。次いで、この樹脂
型の表面を酸で腐食し、表面付近に分散するアルミニウ
ム粒子を溶解した。図２（ａ）はこの樹脂型を切断して
観察した結果を模写した部分拡大断面図であるが、樹脂
型１０に分散されたアルミニウム粒子１６のうち、表面
付近のアルミニウム粒子が溶解されてピット１８が形成
されている。Next, as a conventional example, an aluminum powder was mixed with an epoxy resin, the mixture was solidified into a desired shape, and fired to prepare a resin mold. Next, the surface of this resin mold was corroded with an acid to dissolve the aluminum particles dispersed near the surface. FIG. 2A is a partially enlarged cross-sectional view showing a result obtained by cutting and observing the resin mold. Of the aluminum particles 16 dispersed in the resin mold 10, aluminum particles near the surface are melted to form a pit. 18 is formed.
【００１７】続いて、本実施例の樹脂型および従来例の
樹脂型に銀鏡反応により樹脂型表面に導電性を持たせた
後、めっき槽に沈めてニッケル電気めっきを行った。ニ
ッケルめっきとしてスルファミン酸ニッケルめっき浴
で、本実施例の樹脂型については電流密度１Ａ／ｄｍ2
で２０時間のめっきを行い、０．２５ｍｍのめっき皮膜
を得た。Subsequently, the resin mold of this example and the resin mold of the conventional example were made to have conductivity on the surface of the resin mold by silver mirror reaction, and then immersed in a plating bath for nickel electroplating. Nickel sulfamate plating bath for nickel plating, current density 1 A / dm 2 for resin mold of this example
Plating was performed for 20 hours to obtain a 0.25 mm plating film.
【００１８】一方、従来例の樹脂型ではアンカー部分の
深さが浅いため、めっき金属と樹脂との密着性が良くな
く、電解めっきには不適当であった。そこで、無電解ニ
ッケルめっきを施したところ、３０μｍの厚さのめっき
皮膜しか得られなかった。On the other hand, in the resin type of the conventional example, since the anchor portion has a shallow depth, the adhesion between the plating metal and the resin is not good and it is not suitable for electrolytic plating. Then, when electroless nickel plating was applied, only a plating film having a thickness of 30 μm was obtained.
【００１９】図２（ｂ）は、めっき層を施した後の比較
例の樹脂型を切断して観察した結果を模写した部分拡大
図であるが、樹脂型１０の表面のピットが浅かったた
め、アンカー部２２が浅く、めっき層２０も薄いもので
あった。これに対して、図１（ｂ）は、めっき層を施し
た後の本実施例の樹脂型を切断して観察した結果を模写
した部分拡大図であるが、骨材１２の間の空隙１４に食
い込むアンカー部２２が形成され、これと一体になるよ
うにめっき層２０が樹脂型１０表面に形成されており、
アンカー部が深く、しかもめっき層が厚く耐久性に優れ
たプラスチック成形型であることが確認された。FIG. 2 (b) is a partially enlarged view showing a result obtained by cutting and observing the resin mold of the comparative example after applying the plating layer. However, since the pits on the surface of the resin mold 10 were shallow, The anchor portion 22 was shallow and the plating layer 20 was thin. On the other hand, FIG. 1B is a partially enlarged view showing a result of cutting and observing the resin mold of this embodiment after the plating layer is applied. An anchor portion 22 that digs into is formed, and the plating layer 20 is formed on the surface of the resin mold 10 so as to be integrated with the anchor portion 22.
It was confirmed that the anchor mold was deep and the plating layer was thick, and the mold was a plastic mold excellent in durability.
【００２０】すなわち、めっき後のニッケル金属皮膜と
樹脂との密着性は充分な強度があり、表面の硬度・耐食
性・耐摩耗性など各機能も通常の電鋳で得られたニッケ
ル金属皮膜と何ら変わることがなかった。また、無電解
ニッケルめっきでは、通常センシタイザー・アクチベー
ターなどの前処理が必要であるが、本発明の樹脂型にめ
っきする場合は、電気めっきと同様に銀鏡反応による導
電性付与のみで充分密着性のあるめっきが得られた。That is, the adhesion between the nickel metal film after plating and the resin has sufficient strength, and each function such as surface hardness, corrosion resistance, and abrasion resistance is the same as that obtained by ordinary electroforming. It never changed. In addition, electroless nickel plating usually requires pretreatment such as a sensitizer / activator, but when plating on the resin mold of the present invention, it is sufficient adhesion only by giving conductivity by silver mirror reaction as in electroplating. A good plating was obtained.
【００２１】[0021]
【発明の効果】本発明のプラスチック成形型は以上説明
したように、顆粒状骨材の表面にバインダ樹脂を被覆し
該顆粒状骨材を相互に接着して所望の形状に固めた樹脂
型と、前記樹脂型の表面から前記顆粒状骨材間の空隙に
食い込むアンカー部と一体になるように前記樹脂型表面
に形成されためっき層とからなることを特徴とするもの
であって、樹脂型の表面から顆粒状骨材の空隙に食い込
むアンカー部と一体になるようにめっき層が樹脂型表面
に形成されるので、樹脂層と強固に密着しためっき金属
の皮膜が得られ、プラスチック成形型の強度と寿命を著
しく向上することができる。As described above, the plastic mold of the present invention is a resin mold in which the surface of the granular aggregate is coated with the binder resin and the granular aggregate is adhered to each other to be hardened into a desired shape. And a plating layer formed on the surface of the resin mold so as to be integrated with an anchor part that digs into the space between the granular aggregates from the surface of the resin mold. Since the plating layer is formed on the resin mold surface so as to be integrated with the anchor part that digs into the voids of the granular aggregate from the surface of the resin mold, a plating metal film firmly adhered to the resin layer is obtained, The strength and life can be remarkably improved.
【図１】本発明の実施例の部分拡大断面模写図である。FIG. 1 is a partially enlarged cross-sectional copy drawing of an embodiment of the present invention.
【図２】従来例の部分拡大断面模写図である。FIG. 2 is a partially enlarged cross-sectional copy diagram of a conventional example.
１０ 樹脂型 １１ バインダ樹
脂皮膜 １２ 顆粒状骨材 １４ 空隙 １６ アルミニウム粒子 １８ ピット ２０ めっき層 ２２ アンカー部10 Resin Type 11 Binder Resin Film 12 Granular Aggregate 14 Voids 16 Aluminum Particles 18 Pits 20 Plating Layer 22 Anchor Section
Claims (1)
し該顆粒状骨材を相互に接着して所望の形状に固めた樹
脂型と、前記樹脂型の表面から前記顆粒状骨材間の空隙
に食い込むアンカー部と一体になるように前記樹脂型表
面に形成されためっき層とからなることを特徴とするプ
ラスチック成形型。1. A resin mold in which a binder resin is coated on the surface of a granular aggregate and the granular aggregates are adhered to each other to be hardened into a desired shape, and between the surface of the resin mold and the granular aggregate. And a plating layer formed on the surface of the resin mold so as to be integrated with the anchor part that digs into the void.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19535693A JPH0724839A (en) | 1993-07-12 | 1993-07-12 | Plastic mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19535693A JPH0724839A (en) | 1993-07-12 | 1993-07-12 | Plastic mold |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0724839A true JPH0724839A (en) | 1995-01-27 |
Family
ID=16339815
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19535693A Pending JPH0724839A (en) | 1993-07-12 | 1993-07-12 | Plastic mold |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0724839A (en) |
-
1993
- 1993-07-12 JP JP19535693A patent/JPH0724839A/en active Pending
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