JPH07231150A - Printed wiring board - Google Patents
Printed wiring boardInfo
- Publication number
- JPH07231150A JPH07231150A JP1949994A JP1949994A JPH07231150A JP H07231150 A JPH07231150 A JP H07231150A JP 1949994 A JP1949994 A JP 1949994A JP 1949994 A JP1949994 A JP 1949994A JP H07231150 A JPH07231150 A JP H07231150A
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- wiring board
- printed wiring
- mounting
- circuit part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】この発明は、電子回路部品が実装
されるプリント配線基板に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board on which electronic circuit parts are mounted.
【0002】[0002]
【従来の技術】従来より、同一のプリント配線基板を使
用し、回路部品の実装を変えることによって、機能が変
更できるように設計することが行われている。例えば、
図2に示すようなLSIを用いた制御回路1、選択的に
用いられる二つのトランシーバ2a,2b、及び外部出
力用のコネクタ3を有した電子回路をプリント配線基板
上に構成する場合、図3に示すようなレイアウトとなっ
ている。2. Description of the Related Art Conventionally, it has been designed to use the same printed wiring board and change the function by changing the mounting of circuit components. For example,
When an electronic circuit having a control circuit 1 using an LSI as shown in FIG. 2, two transceivers 2a and 2b that are selectively used, and a connector 3 for external output is formed on a printed wiring board, The layout is as shown in.
【0003】すなわち、プリント配線基板4上で、上記
選択的に使用される二つのトランシーバ2a,2bの回
路部品A,Bの実装位置は互いに異なっており、使用す
る機能に応じて何れかの回路部品A,Bをプリント配線
基板4に実装することになる。That is, the mounting positions of the circuit components A and B of the two transceivers 2a and 2b which are selectively used on the printed wiring board 4 are different from each other, and one of the circuits is selected depending on the function to be used. The components A and B will be mounted on the printed wiring board 4.
【0004】[0004]
【発明が解決しようとする課題】しかしながら、上記の
ような従来のプリント配線基板にあっては、選択的に使
用する回路部品が二つ以上ある場合でもその実装位置が
互いに異なっており、このため、使用しない回路部品を
誤って実装してしまう恐れがあり、その場合、回路が誤
動作したり、回路部品の破壊を招くなどの問題点があっ
た。However, in the conventional printed wiring board as described above, the mounting positions are different from each other even when there are two or more circuit components to be selectively used. However, there is a possibility that an unused circuit component may be erroneously mounted, in which case there is a problem that the circuit malfunctions or the circuit component is destroyed.
【0005】この発明は、上記のような問題点に着目し
てなされたもので、回路部品の誤実装を防止でき、回路
の誤動作や回路部品の破壊を防止可能なプリント配線基
板を提供することを目的としている。The present invention has been made in view of the above problems, and provides a printed wiring board capable of preventing erroneous mounting of circuit components and preventing malfunction of circuits and destruction of circuit components. It is an object.
【0006】[0006]
【課題を解決するための手段】この発明のプリント配線
基板は、選択的に実装される2種類以上の回路部品の実
装位置をオーバーラップさせてレイアウトしたものであ
る。The printed wiring board according to the present invention is laid out so that the mounting positions of two or more types of circuit components that are selectively mounted overlap each other.
【0007】[0007]
【作用】この発明のプリント配線基板においては、選択
すべき回路部品の実装位置がオーバーラップしているの
で、何れかの回路部品しか実装されない。In the printed wiring board of the present invention, since the mounting positions of the circuit components to be selected overlap, only one of the circuit components is mounted.
【0008】[0008]
【実施例】図1はこの発明の一実施例を示すプリント配
線基板4の平面図であり、図2の回路のトランシーバ2
a,2bを構成する回路部品A,Bの実装位置を示して
いる。図示のように、選択的に実装される2種の回路部
品A,Bの実装位置がオーバーラップしてレイアウトさ
れている。このため、回路部品A,Bのうち何れか一方
しか実装されることはない。1 is a plan view of a printed wiring board 4 showing an embodiment of the present invention. The transceiver 2 of the circuit shown in FIG.
The mounting positions of the circuit components A and B forming a and 2b are shown. As shown in the drawing, the mounting positions of the two types of circuit components A and B that are selectively mounted are laid out so as to overlap each other. Therefore, only one of the circuit components A and B is mounted.
【0009】このように、実装部品の変更により機能が
変更されるように設計したプリント配線基板4におい
て、同時実装による不具合が発生する恐れのある回路部
品A,Bの実装位置を互いにオーバーラップさせている
ので、何れか一方の部品しか実装することができず、確
実に回路部品の誤実装を防止することができる。したが
って、回路の誤動作や回路部品の破壊なども防止するこ
とができる。As described above, in the printed wiring board 4 designed so that the function is changed by changing the mounting parts, the mounting positions of the circuit parts A and B which may cause a failure due to simultaneous mounting are made to overlap each other. Therefore, only one of the components can be mounted, and the erroneous mounting of the circuit component can be reliably prevented. Therefore, it is possible to prevent malfunction of the circuit and destruction of circuit components.
【0010】なお、上記実施例では選択すべき2種の回
路部品A,Bの実装位置の一部をオーバーラップさせて
いるが、全体の位置をオーバーラップさせても良く、要
は同時実装できないようにすれば良い。In the above embodiment, the mounting positions of the two types of circuit components A and B to be selected are partially overlapped, but the entire positions may be overlapped, and in short, simultaneous mounting is not possible. Just do it.
【0011】また、選択的に使用する回路部品は2つと
して説明したが、それ以上つまり3種以上の回路部品を
選択する場合でも、それらの実装位置をオーバーラップ
してレイアウトすれば良く、同様に同時実装防止するこ
とで、回路の誤動作や回路部品の破壊を防ぐことができ
る。Further, although the description has been given assuming that there are two circuit components to be selectively used, even when more than three types of circuit components are selected, the mounting positions thereof may be overlapped and laid out. By preventing simultaneous mounting on the circuit, it is possible to prevent malfunction of the circuit and destruction of circuit components.
【0012】[0012]
【発明の効果】以上のように、この発明によれば、選択
的に実装すべき2種以上の回路部品の実装位置を互いに
オーバーラップさせてレイアウトしたため、回路部品の
誤実装を確実に防止でき、回路の誤動作や回路部品の破
壊を防止することができるという効果がある。As described above, according to the present invention, since the mounting positions of the two or more types of circuit components to be selectively mounted are laid out so as to overlap each other, erroneous mounting of the circuit components can be reliably prevented. There is an effect that it is possible to prevent the malfunction of the circuit and the destruction of the circuit component.
【図1】 この発明の一実施例を示す平面図FIG. 1 is a plan view showing an embodiment of the present invention.
【図2】 プリント配線基板上に構成する回路の一例を
示すブロック図FIG. 2 is a block diagram showing an example of a circuit formed on a printed wiring board.
【図3】 従来例を示す平面図FIG. 3 is a plan view showing a conventional example.
4 プリント配線基板 A 回路部品 B 回路部品 4 Printed wiring board A circuit parts B circuit parts
Claims (1)
において、選択的に実装される2種以上の回路部品の実
装位置をオーバーラップさせてレイアウトしたことを特
徴とするプリント配線基板。1. A printed wiring board on which circuit components are mounted, wherein two or more types of circuit components to be selectively mounted are laid out such that their mounting positions overlap.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1949994A JPH07231150A (en) | 1994-02-16 | 1994-02-16 | Printed wiring board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1949994A JPH07231150A (en) | 1994-02-16 | 1994-02-16 | Printed wiring board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH07231150A true JPH07231150A (en) | 1995-08-29 |
Family
ID=12001071
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1949994A Pending JPH07231150A (en) | 1994-02-16 | 1994-02-16 | Printed wiring board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH07231150A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2021153476A1 (en) * | 2020-01-31 | 2021-08-05 |
-
1994
- 1994-02-16 JP JP1949994A patent/JPH07231150A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2021153476A1 (en) * | 2020-01-31 | 2021-08-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A02 | Decision of refusal |
Effective date: 20040601 Free format text: JAPANESE INTERMEDIATE CODE: A02 |