JPH07224265A - Adhesive containing plastic particle and adhesive film using the adhesive containing plastic particle - Google Patents
Adhesive containing plastic particle and adhesive film using the adhesive containing plastic particleInfo
- Publication number
- JPH07224265A JPH07224265A JP1650094A JP1650094A JPH07224265A JP H07224265 A JPH07224265 A JP H07224265A JP 1650094 A JP1650094 A JP 1650094A JP 1650094 A JP1650094 A JP 1650094A JP H07224265 A JPH07224265 A JP H07224265A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- plastic particles
- dispersed
- particles
- specific gravity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
Landscapes
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、フィラーとして中空プ
ラスチック粒子を接着剤中に分散させた接着接着剤及び
該プラスチック粒子入り接着剤を使用した接着フィルム
に関する。TECHNICAL FIELD The present invention relates to an adhesive adhesive in which hollow plastic particles are dispersed as an filler in an adhesive, and an adhesive film using the adhesive containing the plastic particles.
【０００２】[0002]
【従来の技術】従来のプラスチック粒子入り接着フィル
ムは、プラスチック粒子を接着剤溶液中に分散させ、そ
れを乾燥後フィルム化して製造していた。2. Description of the Related Art A conventional adhesive film containing plastic particles has been manufactured by dispersing plastic particles in an adhesive solution, drying it, and forming a film.
【０００３】また、接着剤溶液中での分散工程でサンド
グラインダー、ミル等の分散装置を用いる方法もあっ
た。There is also a method of using a dispersing machine such as a sand grinder or a mill in the dispersing step in the adhesive solution.
【０００４】[0004]
【発明が解決しようとする課題】しかし、プラスチック
粒子を接着剤溶液中に分散させ、乾燥後フィルム化した
従来のプラスチック粒子入り接着フィルムでは、プラス
チック粒子を接着剤溶液中に分散させる工程でプラスチ
ック粒子の凝集が発生し、十分な分散状態を確保するこ
とが困難であった。However, in the conventional adhesive film containing plastic particles, in which the plastic particles are dispersed in the adhesive solution, dried and formed into a film, the plastic particles are dispersed in the adhesive solution in the step of dispersing them. However, it was difficult to secure a sufficient dispersed state.
【０００５】また、分散工程でサンドグラインダー、ミ
ル等の分散装置を用いた場合でも、その後２次凝集が発
生して、良好な分散状態を最終の乾燥後のフィルム状態
まで保持することが困難であった。特に、プラスチック
粒子に金属メッキを施す場合には、２次凝集の発生頻度
が高く、十分な分散状態を確保することが非常に困難で
あった。この原因は、主に配合液とプラスチック粒子と
比重または接着剤比重差により配合溶液中でフィラーの
沈降が発生して、２次凝集が引き起こされると考えられ
ている。Even when a dispersing machine such as a sand grinder or a mill is used in the dispersing step, secondary agglomeration occurs after that, and it is difficult to maintain a good dispersed state up to the final dried film state. there were. Particularly, when metal plating is applied to the plastic particles, secondary aggregation frequently occurs, and it is very difficult to secure a sufficient dispersed state. It is considered that this is caused mainly by the difference in the specific gravity between the compounding liquid and the plastic particles or the difference in the specific gravity of the adhesive, causing the sedimentation of the filler in the compounding solution to cause secondary aggregation.
【０００６】さらに、液状接着剤でも同様に粒子の沈降
及び凝集が発生し、粒子の良好な分散状態を確保するこ
とが困難であった。Further, even with the liquid adhesive, settling and agglomeration of particles similarly occur, and it is difficult to secure a good dispersed state of the particles.
【０００７】そこで、本発明は、液状接着剤とプラスチ
ック粒子の比重差による接着剤中でのプラスチック粒子
の沈降を防ぐことにより、２次凝集の発生を防止して、
プラスチック粒子を均一に分散できるプラスチック粒子
入り接着剤、及び該プラスチック粒子入り接着フィルム
を提供することを目的とする。Therefore, the present invention prevents the secondary aggregation from occurring by preventing the sedimentation of the plastic particles in the adhesive due to the difference in specific gravity between the liquid adhesive and the plastic particles.
An object of the present invention is to provide an adhesive containing plastic particles in which plastic particles can be uniformly dispersed, and an adhesive film containing the plastic particles.
【０００８】[0008]
【課題を解決するための手段】上記目的を達成するた
め、請求項１記載の発明では、接着剤中にプラスチック
粒子を分散させたプラスチック粒子入り接着剤または該
プラスチック粒子入り接着剤を使用した接着フィルムに
おいて、接着剤中に中空プラスチック粒子を分散させた
ことを特徴とする。In order to achieve the above object, in the invention according to claim 1, an adhesive containing plastic particles in which plastic particles are dispersed in an adhesive or an adhesive using the adhesive containing plastic particles is used. The film is characterized in that hollow plastic particles are dispersed in the adhesive.
【０００９】また、請求項２記載の発明では、接着剤中
にプラスチック粒子を分散させたプラスチック粒子入り
接着剤または該プラスチック粒子入り接着剤を使用した
接着フィルムにおいて、接着剤中に金属メッキが施され
た中空プラスチック粒子を分散させたことを特徴とす
る。According to the second aspect of the present invention, in an adhesive containing plastic particles in which plastic particles are dispersed in an adhesive or an adhesive film using the adhesive containing the plastic particles, metal plating is applied to the adhesive. Hollow plastic particles are dispersed.
【００１０】また、請求項３記載の発明では、接着剤中
にプラスチック粒子を分散させたプラスチック粒子入り
接着剤または該プラスチック粒子入り接着剤を使用した
接着フィルムにおいて、接着剤中に当該接着剤溶液比重
または接着剤比重に近い比重をもつ中空プラスチック粒
子を分散させたことを特徴とする。Further, in the invention according to claim 3, in an adhesive containing plastic particles in which plastic particles are dispersed in an adhesive, or an adhesive film using the adhesive containing the plastic particles, the adhesive solution in the adhesive is used. The hollow plastic particles having a specific gravity or a specific gravity close to that of the adhesive are dispersed.
【００１１】さらに、請求項４記載の発明では、接着剤
中にプラスチック粒子を分散させたプラスチック粒子入
り接着剤または該プラスチック粒子入り接着剤を使用し
た接着フィルムにおいて、接着剤中に当該接着剤溶液比
重または接着剤比重に近い比重をもつ金属メッキが施さ
れた中空プラスチック粒子を分散させたことを特徴とす
る。Further, in the invention according to claim 4, in an adhesive containing plastic particles in which plastic particles are dispersed in an adhesive or an adhesive film using the adhesive containing the plastic particles, the adhesive solution is contained in the adhesive. It is characterized in that hollow plastic particles plated with metal having a specific gravity or a specific gravity close to that of the adhesive are dispersed.
【００１２】[0012]
【作用】プラスチック粒子を中空にして、プラスチック
粒子の比重を接着剤溶液比重または接着剤比重に近付け
る。そして、その接着剤溶液比重等に近い比重をもった
中空プラスチック粒子または金属メッキの中空プラスチ
ック粒子を接着剤中に分散させると、その粒子の比重が
接着剤の比重と近いため、中空プラスチック粒子または
金属被覆中空プラスチック粒子は沈降しない。従って、
粒子同士の接触確率が低くなり、沈降による２次凝集の
発生確率が低くなるため、２次凝集が発生しなくなり、
粒子が均一に分散された液状接着剤または接着フィルム
となる。Function: The plastic particles are made hollow so that the specific gravity of the plastic particles approaches the specific gravity of the adhesive solution or the specific gravity of the adhesive. Then, when the hollow plastic particles having a specific gravity close to that of the adhesive solution or the hollow plastic particles of metal plating are dispersed in the adhesive, the specific gravity of the particles is close to the specific gravity of the adhesive, so that the hollow plastic particles or The metal-coated hollow plastic particles do not settle. Therefore,
Since the probability of contact between particles is low and the probability of secondary aggregation due to sedimentation is low, secondary aggregation does not occur,
It becomes a liquid adhesive or an adhesive film in which particles are uniformly dispersed.
【００１３】[0013]
【実施例】以下、本発明の実施例を説明する。EXAMPLES Examples of the present invention will be described below.
【００１４】まず、本発明の第１実施例を説明する。First, a first embodiment of the present invention will be described.
【００１５】第１実施例では、中空プラスチック粒子と
して粒子径２０μｍであり粒子内部に１４．３μｍの球
状の中空部を有する単分散ポリスチレン粒子（日立化成
工業株式会社試作品）を使用した。この中空粒子に１５
００オングストロームのＮｉメッキを施した。この粒子
比重または接着剤比重は測定値で１．１ｇ／ｃｍ2 であ
った。In the first embodiment, monodisperse polystyrene particles (prototype manufactured by Hitachi Chemical Co., Ltd.) having a particle diameter of 20 μm and a spherical hollow portion of 14.3 μm inside the particles were used as the hollow plastic particles. 15 in this hollow particle
Ni plating of 00 angstrom was applied. The specific gravity of the particles or the specific gravity of the adhesive was 1.1 g / cm 2 as a measured value.
【００１６】この粒子をＳＢＳ樹脂（ＴＲ−１１０１
ジェイエスアールシェルエラストマー株式会社製）のト
ルエン溶液（２０ｗｔ％）に２ｖｏ１％混合しベースフ
ィルムに塗布後、乾燥を行い粒子の分散状態を画像解析
により測定した。ＳＢＳ樹脂溶液比重または接着剤比重
は約１であった。測定値は凝集粒子径とし最大長さ（Ｍ
Ｌ値）を測定した。尚、塗布厚みは２５μｍとした。These particles were mixed with SBS resin (TR-1101
2 vo1% was mixed with a toluene solution (20 wt%) of JSR Shell Elastomer Co., Ltd., applied on the base film, dried and the dispersed state of the particles was measured by image analysis. The SBS resin solution specific gravity or the adhesive specific gravity was about 1. The measured value is the aggregate particle size and the maximum length (M
L value) was measured. The coating thickness was 25 μm.
【００１７】また、比較例として、粒子径２０μｍであ
り粒子内部に中空部のない単分数プラスチック粒子を使
用し、この粒子に１５００オングストロームのＮｉメッ
キを施した粒子を使用した。この比較例の比重測定値は
１．６ｇ／ｃｍ2 あった。As a comparative example, a fractional plastic particle having a particle diameter of 20 μm and having no hollow portion inside the particle was used, and the particle was plated with 1500 Å of Ni. The measured specific gravity of this comparative example was 1.6 g / cm 2 .
【００１８】表１に、第１実施例の中空プラスチック粒
子のメッキ品と、比較例の中空なしプラスチック粒子の
メッキ品との測定結果を示す。Table 1 shows the measurement results of the plated product of hollow plastic particles of the first embodiment and the plated product of hollow plastic particles of the comparative example.
【００１９】[0019]
【表１】 この表１から、中空プラスチック粒子を使用した系では
粒子分散状態が改善されていることが確認できる。[Table 1] From this Table 1, it can be confirmed that the particle dispersion state is improved in the system using the hollow plastic particles.
【００２０】次に、本発明の第２実施例を説明する。Next, a second embodiment of the present invention will be described.
【００２１】第２実施例では、中空プラスチック粒子と
して粒子径が１０μｍで、粒子内部に６．６μｍの球状
の中空部を有する単分散ポリスチレン（日立化成工業株
式会社試作品）を使用し、本実施例では、この中空プラ
スチック粒子に５００オングストロームのＮｉメッキを
施した。In the second embodiment, as the hollow plastic particles, a monodisperse polystyrene having a particle diameter of 10 μm and a spherical hollow portion of 6.6 μm inside the particles (Hitachi Chemical Co., Ltd. prototype) is used. In the example, the hollow plastic particles were plated with 500 Angstroms of Ni.
【００２２】そして、この粒子比重または接着剤比重は
測定値で１．０ｇ／ｃｍ2 であった。The specific gravity of the particles or the specific gravity of the adhesive was 1.0 g / cm 2 as a measured value.
【００２３】この粒子をエポキシ樹脂（ＥＰ−１００４
油化シェルエポキシ社製）８０部と、イミダゾール硬
化剤（キュアゾール ２ＭＡ−ＯＫ 四国化成工業株式
会社製）２０部を混合した３０ｗｔ％ＭＥＫ溶液中に混
合し、ベースフィルムに塗布後乾燥した。その結果、樹
脂溶液の比重は約１となり、乾燥後の塗布厚みは２５μ
ｍとなった。The particles are mixed with an epoxy resin (EP-1004).
80 parts of Yuka Shell Epoxy Co., Ltd. and 20 parts of an imidazole curing agent (CUREZOL 2MA-OK, Shikoku Chemicals Co., Ltd.) were mixed in a 30 wt% MEK solution, and the mixture was applied to a base film and dried. As a result, the specific gravity of the resin solution was about 1, and the coating thickness after drying was 25μ.
It became m.
【００２４】また、比較例として、中空なしの１０μｍ
単分散プラスチック粒子を使用した。Further, as a comparative example, 10 μm without hollow
Monodisperse plastic particles were used.
【００２５】表２に、フィルム中の粒子の分散状態を示
す。Table 2 shows the dispersed state of the particles in the film.
【００２６】[0026]
【表２】 この表２から明らかなように、フィルム中の粒子の分散
状態は、中空プラスチック粒子の使用品で良好な結果が
得られることがわかる。また、このフィルムは熱硬化型
異方導電フィルムとしても十分な特性を示すこともわか
った。[Table 2] As is clear from Table 2, the particle dispersion state in the film shows that good results can be obtained by using hollow plastic particles. It was also found that this film exhibits sufficient characteristics as a thermosetting anisotropic conductive film.
【００２７】次に、本発明の第３実施例を説明する。Next, a third embodiment of the present invention will be described.
【００２８】第３実施例では、中空プラスチック粒子と
して粒子径２０μｍであり粒子内部に１４．３μｍ，１
０μｍ，５μｍ，０μｍの中空部を有する単分散粒子を
使用し、これらの粒子にそれぞれ１５００オングストロ
ームのＮｉメッキを施している。In the third embodiment, the hollow plastic particles have a particle diameter of 20 μm, and inside the particles are 14.3 μm, 1
Monodisperse particles having hollows of 0 μm, 5 μm, and 0 μm were used, and these particles were each plated with 1500 angstroms of Ni.
【００２９】これらを実施例２と同様にフィルム化し
て、それぞれの粒子の分散状態を確認した。These were formed into a film in the same manner as in Example 2, and the dispersed state of each particle was confirmed.
【００３０】表３にその結果を示す。Table 3 shows the results.
【００３１】[0031]
【表３】 [Table 3]
【００３２】この表３から明らかなように、粒子比重が
１に近くなるにつれ粒子の分散状態が良好になることが
確認された。また、このフィルムは熱硬化型異方導電フ
ィルムとしても十分な特性を示した。次に、本発明の第
４実施例を説明する。As is clear from Table 3, it was confirmed that the closer the particle specific gravity was to 1, the better the dispersed state of the particles. This film also showed sufficient properties as a thermosetting anisotropic conductive film. Next, a fourth embodiment of the present invention will be described.
【００３３】第４実施例では、中空プラスチック粒子と
して粒子径が１０μｍで、粒子内部に６．６μｍの球状
の中空部を有する単分散ポリスチレン粒子（日立化成工
業株式会社試作品）を使用し、この中空プラスチック粒
子に１００オングストロームのＮｉメッキを施してい
る。この粒子比重または接着剤比重は、測定値で１．２
ｇ／ｃｍ2 である。In the fourth embodiment, as the hollow plastic particles, monodisperse polystyrene particles having a particle diameter of 10 μm and having a spherical hollow portion of 6.6 μm inside the particles (Hitachi Chemical Co., Ltd. prototype) are used. Hollow plastic particles are plated with 100 Å of Ni. This particle specific gravity or adhesive specific gravity is 1.2 in the measured value.
It is g / cm 2 .
【００３４】この粒子を液状エポキシ樹脂（ＥＰ−８２
８ 油化シェルエポキシ社製）８０部とイミダゾール硬
化剤（キュアゾール ２Ｐ４ＭＨＺ 四国化成工業株式
会社製）２０部の接着剤中に２ｖｏｌ％配合し液状の異
方導電性ペーストとした。尚、液状接着剤の比重は約
１．２であった。The particles are mixed with a liquid epoxy resin (EP-82).
8 vol. 8 made by Yuka Shell Epoxy Co., Ltd. and 20 parts of an imidazole curing agent (Curesol 2P4MHZ manufactured by Shikoku Chemicals Co., Ltd.) were mixed in an amount of 2 vol% to obtain a liquid anisotropic conductive paste. The specific gravity of the liquid adhesive was about 1.2.
【００３５】また、比較例として、中空部の無い１０μ
ｍ単分散プラスチック粒子を使用する。メッキ後比重ま
たは接着剤比重は測定値で１．６である。これらの異方
導電ペーストを２５℃で１ヶ月放置した。Further, as a comparative example, 10 μ having no hollow portion.
m monodisperse plastic particles are used. The specific gravity after plating or the adhesive specific gravity is 1.6 as a measured value. These anisotropic conductive pastes were left at 25 ° C. for 1 month.
【００３６】その結果、中空プラスチック粒子を使用し
た系では、１ヶ月後も粒子の分散状態が良好であり、液
状異方導電性接着剤としての十分な特性を満足した。そ
れに対して、中空部の無い粒子を使用した系では、粒子
の沈降、凝集が発生し異方導電性接着剤として使用する
ことができなかった。As a result, in the system using the hollow plastic particles, the dispersed state of the particles was good even after one month, and the properties sufficient as the liquid anisotropic conductive adhesive were satisfied. On the other hand, in a system using particles having no hollow portion, the particles could be settled and aggregated, and thus could not be used as an anisotropic conductive adhesive.
【００３７】[0037]
【発明の効果】以上説明したように、本発明によれば、
接着剤溶液比重または接着剤比重に近い比重をもった中
空プラスチック粒子または金属でメッキ被覆された中空
プラスチック粒子を、接着剤中に分散させるようにした
ため、中空プラスチック粒子または金属被覆中空プラス
チック粒子は沈降しない。As described above, according to the present invention,
Since hollow plastic particles having a specific gravity of the adhesive solution or a specific gravity close to that of the adhesive or hollow plastic particles coated with a metal are dispersed in the adhesive, the hollow plastic particles or the metal-coated hollow plastic particles are precipitated. do not do.
【００３８】このため、粒子同士の接触確率が低くな
り、沈降による２次凝集の発生確率が低くなるため、２
次凝集が発生しなくなり、粒子が均一に分散された液状
接着剤または接着フィルムを作成することができる。As a result, the probability of contact between particles is reduced, and the probability of occurrence of secondary aggregation due to sedimentation is reduced.
It is possible to prepare a liquid adhesive or an adhesive film in which secondary aggregation does not occur and particles are uniformly dispersed.
Claims (5)
たプラスチック粒子入り接着剤において、 接着剤中に中空プラスチック粒子を分散させたことを特
徴とするプラスチック粒子入り接着剤。1. An adhesive containing plastic particles, wherein plastic particles are dispersed in the adhesive, wherein hollow plastic particles are dispersed in the adhesive.
たプラスチック粒子入り接着剤において、 接着剤中に金属メッキが施された中空プラスチック粒子
を分散させたことを特徴とするプラスチック粒子入り接
着剤。2. An adhesive containing plastic particles, wherein plastic particles are dispersed in the adhesive, wherein hollow plastic particles plated with metal are dispersed in the adhesive.
たプラスチック粒子入り接着剤において、 接着剤中に当該接着剤溶液比重または接着剤比重に近い
比重をもつ中空プラスチック粒子を分散させたことを特
徴とするプラスチック粒子入り接着剤。3. An adhesive containing plastic particles in which plastic particles are dispersed in an adhesive, wherein hollow plastic particles having a specific gravity of the adhesive solution or a specific gravity close to the specific gravity of the adhesive are dispersed in the adhesive. An adhesive containing plastic particles.
たプラスチック粒子入り接着剤において、 接着剤中に当該接着剤溶液比重または接着剤比重に近い
比重をもつ金属メッキが施された中空プラスチック粒子
を分散させたことを特徴とするプラスチック粒子入り接
着剤。4. An adhesive containing plastic particles in which plastic particles are dispersed, wherein hollow plastic particles plated with metal having a specific gravity of the adhesive solution or a specific gravity close to the specific gravity of the adhesive are contained in the adhesive. An adhesive containing plastic particles, which is characterized by being dispersed.
ラスチック粒子入り接着剤を使用した接着フィルム。5. An adhesive film using the adhesive containing plastic particles according to any one of claims 1 to 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1650094A JPH07224265A (en) | 1994-02-10 | 1994-02-10 | Adhesive containing plastic particle and adhesive film using the adhesive containing plastic particle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1650094A JPH07224265A (en) | 1994-02-10 | 1994-02-10 | Adhesive containing plastic particle and adhesive film using the adhesive containing plastic particle |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07224265A true JPH07224265A (en) | 1995-08-22 |
Family
ID=11918003
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1650094A Pending JPH07224265A (en) | 1994-02-10 | 1994-02-10 | Adhesive containing plastic particle and adhesive film using the adhesive containing plastic particle |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07224265A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006335926A (en) * | 2005-06-03 | 2006-12-14 | Shin Etsu Chem Co Ltd | Pressure-bonding anisotropic conductive resin composition and elastic anisotropic conductive member |
| JP2012253088A (en) * | 2011-05-31 | 2012-12-20 | Sumitomo Bakelite Co Ltd | Semiconductor device |
-
1994
- 1994-02-10 JP JP1650094A patent/JPH07224265A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006335926A (en) * | 2005-06-03 | 2006-12-14 | Shin Etsu Chem Co Ltd | Pressure-bonding anisotropic conductive resin composition and elastic anisotropic conductive member |
| JP2012253088A (en) * | 2011-05-31 | 2012-12-20 | Sumitomo Bakelite Co Ltd | Semiconductor device |
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