JPH07212017A - Bump-provided circuit board and its manufacture - Google Patents
Bump-provided circuit board and its manufactureInfo
- Publication number
- JPH07212017A JPH07212017A JP1489494A JP1489494A JPH07212017A JP H07212017 A JPH07212017 A JP H07212017A JP 1489494 A JP1489494 A JP 1489494A JP 1489494 A JP1489494 A JP 1489494A JP H07212017 A JPH07212017 A JP H07212017A
- Authority
- JP
- Japan
- Prior art keywords
- wiring pattern
- circuit wiring
- circuit board
- bumps
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、各種の電気・電子部品
や回路と電気的に接続する為のバンプを備えた回路基板
及びその製造法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit board having bumps for electrically connecting to various electric / electronic parts and circuits, and a method for manufacturing the same.
【０００２】更に具体的に云えば、本発明は、電気的に
接続すべき電極にバンプを当接圧接して導通を確保し、
また、圧力の解除により容易に取り外せるような接続個
所に使用したり、或いは各種の回路素子の電気的特性を
検査する為の検査端子として使用することの可能な導電
性球体からなる硬質のバンプを備えた回路基板及びその
製造法に関する。More specifically, according to the present invention, bumps are brought into contact and pressure contact with electrodes to be electrically connected to ensure conduction.
Also, a hard bump made of a conductive sphere that can be used at a connection point that can be easily removed by releasing the pressure or used as an inspection terminal for inspecting the electrical characteristics of various circuit elements is used. The present invention relates to a provided circuit board and a manufacturing method thereof.
【０００３】[0003]
【従来技術とその問題点】この種の各種電気・電子部品
や回路に圧接して電気的に接続すると共に、その圧力の
解除によって容易に取り外しを行えるバンプを備えた回
路基板を製作するには、図５に示すような手法がある。2. Description of the Related Art To manufacture a circuit board having bumps that can be easily removed by releasing the pressure while electrically contacting various kinds of electric and electronic parts and circuits of this kind by pressure contact. There is a method as shown in FIG.
【０００４】この手法は図５の（１）に示すように、先
ず絶縁べ−ス材２１の一方面に所要の回路配線パタ−ン
２２を形成すると共に、その絶縁べ−ス材２１の他方面
には回路配線パタ−ン２２の位置する該当個所に孔２３
を有するメタルマスク２４を形成し、また、回路配線パ
タ−ン２２の上面には接着剤２５により絶縁フィルム２
６を貼着して表面保護層２７を形成する。According to this method, as shown in FIG. 5A, first, a desired circuit wiring pattern 22 is formed on one surface of the insulating base material 21, and the other insulating base material 21 is removed. A hole 23 is provided at the corresponding position where the circuit wiring pattern 22 is located.
Of the insulating film 2 is formed on the upper surface of the circuit wiring pattern 22 with an adhesive 25.
6 is attached to form the surface protective layer 27.
【０００５】次に、同図（２）のように、メタルマスク
２４の側からエキシマレ−ザ−光Ａを照射して絶縁べ−
ス材２１に回路配線パタ−ン２２に達する導通用孔２８
を設け、次いで同図（３）の如くメタルマスク２４のみ
をエッチング除去する。Next, as shown in FIG. 2B, excimer laser light A is irradiated from the side of the metal mask 24 to insulate the insulating base.
Conductive hole 28 reaching the circuit wiring pattern 22 in the material 21
Then, only the metal mask 24 is removed by etching as shown in FIG.
【０００６】そこで、同図（４）に示すように、導通用
孔２８に対して銅等の導電性金属のメッキ手段による充
填処理により、一端が回路配線パタ−ン２２に電気的に
接合すると共に他端が絶縁べ−ス材２１の外部に向かっ
て突出するバンプ２９を形成してこの回路基板を製作す
ることができる。Therefore, as shown in FIG. 4 (4), one end is electrically joined to the circuit wiring pattern 22 by filling the conduction hole 28 with a conductive metal such as copper by a plating means. At the same time, a bump 29 having the other end protruding toward the outside of the insulating base material 21 is formed to manufacture this circuit board.
【０００７】しかし、上記の如き手法により製作される
リベット状の硬質のバンプを有する回路基板は、バンプ
２９の形成手段としてメッキ法を採用しているので、必
要とするバンプ高さに略比例してメッキ処理時間を要
し、従って安価にバンプを構成する際の障害となってい
る。However, since the circuit board having the rivet-shaped hard bumps manufactured by the above-mentioned method uses the plating method as the means for forming the bumps 29, it is substantially proportional to the required bump height. Therefore, it takes a lot of time for the plating process, which is an obstacle to inexpensive bump formation.
【０００８】[0008]
【課題を解決するための手段】本発明はそこでバンプを
導電性球体で安価に構成するようにしたバンプを備えた
回路基板及びその製造法を提供するものである。SUMMARY OF THE INVENTION The present invention therefore provides a circuit board having bumps which are formed of conductive spheres at low cost, and a method of manufacturing the same.
【０００９】その為に本発明のバンプを備えた回路基板
及びその製造法によれば、可撓性又は硬質の絶縁べ−ス
材又は表面保護層に回路配線パタ−ンに達するように形
成した導通用孔に導電性の球体を配置し、この導電性球
体と上記回路配線パタ−ンとを各種の半田部材で電気的
に接合することにより、バンプとなるこの導電性球体の
一端は上記回路配線パタ−ンと電気的に接合されると共
にその他端が上記絶縁べ−ス材又は表面保護層の外部に
突出するように構成される。Therefore, according to the circuit board having bumps of the present invention and the method for manufacturing the same, a flexible or hard insulating base material or a surface protective layer is formed so as to reach the circuit wiring pattern. A conductive sphere is arranged in the hole for conduction, and the conductive sphere and the circuit wiring pattern are electrically joined by various solder members, so that one end of the conductive sphere that becomes a bump is the circuit described above. It is configured to be electrically joined to the wiring pattern and to have the other end projecting to the outside of the insulating base material or the surface protective layer.
【００１０】ここで、導電性球体は、表面に耐腐食性金
属層を有する導電性金属か又は樹脂性部材で構成するか
或いは上記回路配線パタ−ンに接続する為の半田部材よ
りも高い融点温度を有する半田組成物で構成することが
できる。Here, the conductive sphere is composed of a conductive metal having a corrosion resistant metal layer on its surface or a resin member, or has a melting point higher than that of a solder member for connecting to the circuit wiring pattern. It can be composed of a solder composition having a temperature.
【００１１】[0011]
【実施例】以下、図示の実施例を参照しながら本発明を
更に詳述する。図１は本発明の一実施例によるバンプを
備えた回路基板の概念的な要部拡大断面構成図であっ
て、可撓性又は硬質の絶縁べ−ス材１の一方面には回路
配線パタ−ン２が形成されている。そして、この回路配
線パタ−ン２の表面には接着剤４を用いて絶縁フィルム
５が貼着されて表面保護層６を形成してある。The present invention will be described in more detail below with reference to the illustrated embodiments. FIG. 1 is an enlarged cross-sectional view of a conceptual main part of a circuit board having bumps according to an embodiment of the present invention. One side of a flexible or hard insulating base material 1 is a circuit wiring pattern. -N 2 has been formed. An insulating film 5 is attached to the surface of the circuit wiring pattern 2 using an adhesive 4 to form a surface protective layer 6.
【００１２】また、絶縁べ−ス材１の外面からは回路配
線パタ−ン２の所要個所に達するように穿設された導通
用孔３を設け、この導通用孔３には表面にニッケルメッ
キ又は金メッキ等により耐腐食性皮膜７を形成したバン
プとなる導電性球体８を配置し、この導電性球体８と回
路配線パタ−ン２とは各種の半田部材９により電気的に
接合してある。Further, a conducting hole 3 is formed from the outer surface of the insulating base material 1 so as to reach a required portion of the circuit wiring pattern 2, and the conducting hole 3 is nickel-plated on the surface. Alternatively, conductive spheres 8 serving as bumps having a corrosion resistant film 7 formed by gold plating or the like are arranged, and the conductive spheres 8 and the circuit wiring pattern 2 are electrically joined by various solder members 9. .
【００１３】導電性球体８は、表面にニッケルメッキ又
は金メッキ等により耐腐食性皮膜７を形成した導電性金
属か又は樹脂製部材で構成することができるが、上記の
如き耐腐食性皮膜７を有せずその全部を半田部材９によ
りも高い融点温度を有するような半田組成物で構成する
ことも可能である。The conductive sphere 8 can be made of a conductive metal or resin member having a corrosion resistant coating 7 formed on its surface by nickel plating, gold plating or the like. The corrosion resistant coating 7 as described above is used. It is also possible to form the entire solder composition by using the solder composition that does not have the melting point and has a higher melting point temperature than the solder member 9.
【００１４】そして、この導電性球体８の外径は絶縁べ
−ス材１の厚さよりも大きく形成されているので、その
外端部は絶縁べ−ス材１の外部に突出して回路部品や回
路と圧接接続等の手段で任意に接続可能となる。Since the outer diameter of the conductive sphere 8 is formed to be larger than the thickness of the insulating base material 1, the outer end portion of the conductive sphere 8 projects to the outside of the insulating base material 1 to form circuit parts and The circuit can be arbitrarily connected by means such as pressure connection.
【００１５】ここで、導電性球体８と回路配線パタ−ン
２とを電気的に接合する為の半田部材９としては、導通
用孔３の底部に予め形成した半田メッキの溶融によるか
又は付着溶融できるペ−スト状半田の他、加熱溶融によ
り半田組成物を生成するペ−ストの塗布溶融によるもの
を使用することができる。Here, as the solder member 9 for electrically connecting the conductive sphere 8 and the circuit wiring pattern 2 to each other, a solder plating formed in advance at the bottom of the conduction hole 3 is melted or attached. In addition to the paste-like solder that can be melted, it is possible to use a paste in which a solder composition is produced by heating and melting and which is applied and melted.
【００１６】図２は本発明の他の実施例によるバンプを
備えた回路基板の同様な概念的要部拡大断面構成図を示
し、この実施例では導電性球体８を配置させる為の導通
用孔３Ａを表面保護層６Ａの側に形成したものである。FIG. 2 shows a similar enlarged conceptual sectional view of a main part of a circuit board having bumps according to another embodiment of the present invention. In this embodiment, a conductive hole for arranging a conductive sphere 8 is formed. 3A is formed on the surface protective layer 6A side.
【００１７】即ち、可撓性又は硬質の絶縁べ−ス材１の
一方面に形成された回路配線パタ−ン２の上面には、例
えば感光性ポリイミド樹脂等の適宜な感光性樹脂を用い
て行う塗布、露光、現像及び熱処理等の工程により、回
路配線パタ−ン２の所要個所に導通用孔３Ａを形成する
ように表面保護層６Ａを設け、その導通用孔３Ａに対し
てバンプとなる上記構成の導電性球体８を配置させて上
記手段の半田部材９によってこの導電性球体８と回路配
線パタ−ン２とを電気的に接合するように構成したもの
である。That is, an appropriate photosensitive resin such as photosensitive polyimide resin is used on the upper surface of the circuit wiring pattern 2 formed on one surface of the flexible or hard insulating base material 1. The surface protection layer 6A is provided so as to form the conduction hole 3A at a required portion of the circuit wiring pattern 2 by the steps such as coating, exposure, development and heat treatment, and a bump is formed in the conduction hole 3A. The conductive spheres 8 having the above-described structure are arranged, and the conductive spheres 8 and the circuit wiring pattern 2 are electrically joined by the solder member 9 of the above means.
【００１８】図２の構造では導通用孔３Ａを上記手段で
簡易に形成できるので、図１に示す導通用孔３をエキシ
マレ−ザ−光の照射で形成する手法に比して安価に構成
できる。In the structure of FIG. 2, the conducting hole 3A can be easily formed by the above-mentioned means, so that the conducting hole 3 shown in FIG. 1 can be constructed at a lower cost than the method of forming by excimer laser light irradiation. .
【００１９】図３の（１）から（５）は図１に示す構造
のバンプを備えた回路基板の製造工程図であって、先
ず、同図（１）の如く例えば接着剤のあるもの又は無接
着剤型からなる可撓性或いは硬質の両面銅張板等の材料
を用意し、これにフォトエッチング処理を施して絶縁べ
−ス材１の一方面には所要の回路配線パタ−ン２を形成
し、また、その他方面には回路配線パタ−ン２の位置す
る該当個所に孔１０を有するメタルマスク１１を形成す
る。そして、回路配線パタ−ン２の表面には接着剤４を
用いてポリイミドフィルム等の絶縁フィルム５を貼着し
て表面保護層６を形成する。FIGS. 3 (1) to 3 (5) are manufacturing process diagrams of a circuit board provided with bumps having the structure shown in FIG. 1. First, as shown in FIG. A material such as a flexible or hard double-sided copper clad board made of an adhesive-free type is prepared, and a photoetching process is performed on this material to form a desired circuit wiring pattern 2 on one surface of the insulating base material 1. Further, a metal mask 11 having a hole 10 is formed on the other side of the circuit wiring pattern 2. Then, an insulating film 5 such as a polyimide film is attached to the surface of the circuit wiring pattern 2 with an adhesive 4 to form a surface protective layer 6.
【００２０】そこで、同図（２）のように、メタルマス
ク１１の側からエキシマレ−ザ−光Ａを照射して絶縁べ
−ス材１に対して回路配線パタ−ン２に達する導通用孔
３を形成する。次いで、同図（３）の如く、メタルマス
ク１１のみをエッチング除去する。その際、導通用孔３
の底部に露出する回路配線パタ−ン２の部分はエッチン
グされないように適宜レジスト処理され、メタルマスク
１１のエッチング処理後にそのレジストを剥離する。Therefore, as shown in FIG. 2B, a hole for conduction which reaches the circuit wiring pattern 2 with respect to the insulating base material 1 by irradiating the excimer laser light A from the side of the metal mask 11. 3 is formed. Then, as shown in FIG. 3C, only the metal mask 11 is removed by etching. At that time, the hole 3 for conduction
The portion of the circuit wiring pattern 2 exposed at the bottom of the metal mask 11 is appropriately resisted so as not to be etched, and the resist is removed after the metal mask 11 is etched.
【００２１】次に、同図（４）のように、既述した如く
半田メッキ又は付着溶融できるペ−スト状半田の他、加
熱溶融により半田組成物を生成するペ−スト等からなる
半田部材９を導通用孔３の底部に設ける。Next, as shown in FIG. 4 (4), as described above, in addition to the paste-like solder that can be solder-plated or adhered and melted, a solder member composed of a paste or the like that produces a solder composition by heating and melting. 9 is provided at the bottom of the conduction hole 3.
【００２２】更に、その導通用孔３に上記構造の導電性
球体８を配置した後、半田部材９を加熱溶融して回路配
線パタ−ン２と導電性球体８とを電気的に接合すること
により、導電性球体８からなるバンプを備えた回路基板
を製作することができる。Further, after placing the conductive sphere 8 having the above structure in the hole 3 for conduction, the solder member 9 is heated and melted to electrically connect the circuit wiring pattern 2 and the conductive sphere 8. Thus, it is possible to manufacture a circuit board having bumps formed of the conductive spheres 8.
【００２３】図４の（１）から（４）は図２に示す構造
のバンプを備えた回路基板の製造工程図を示し、この実
施例では先ず、同図（１）の如く例えば接着剤のあるも
の又は無接着剤型からなる可撓性或いは硬質の片面銅張
板等の材料を用意し、これにフォトエッチング処理を施
して絶縁べ−ス材１の一方面に所要の回路配線パタ−ン
２を形成する。4 (1) to 4 (4) are views showing a manufacturing process of a circuit board provided with bumps having the structure shown in FIG. 2. In this embodiment, first, as shown in FIG. Prepare a material such as a flexible or hard one-sided copper clad plate of a certain type or a non-adhesive type, and subject it to photoetching treatment to form a desired circuit wiring pattern on one surface of the insulating base material 1. 2 is formed.
【００２４】次いで、同図（２）のように、例えば感光
性ポリイミド等の感光性樹脂を用いて適宜塗布、露光、
現像及び熱処理等の工程を介して回路配線パタ−ン２の
一部を露出させる導通用孔３Ａを有する表面保護層６Ａ
を回路配線パタ−ン２の表面に形成する。Then, as shown in FIG. 2B, for example, a photosensitive resin such as photosensitive polyimide is used to apply, expose and
A surface protective layer 6A having a conduction hole 3A for exposing a part of the circuit wiring pattern 2 through processes such as development and heat treatment.
Are formed on the surface of the circuit wiring pattern 2.
【００２５】そこで、同図（３）及び（４）の如く、上
記工程と同様に導通用孔３Ａの底部に対する半田部材９
の形成工程に続いて、導通用孔３Ａに対する導電性球体
８の配置と回路配線パタ−ン２に対するその導電性球体
８の電気的接合処理を施すことにより、導電性球体８で
構成されるバンプを備えた回路基板を製作することがで
きる。Therefore, as shown in FIGS. 3 (3) and 4 (4), the solder member 9 for the bottom of the conduction hole 3 A is formed as in the above process.
After the step of forming the conductive spheres 8 is arranged, the conductive spheres 8 are arranged in the conduction holes 3A and the conductive spheres 8 are electrically connected to the circuit wiring pattern 2 to form bumps formed of the conductive spheres 8. It is possible to manufacture a circuit board provided with.
【００２６】この図４の手法では、図３の手法の如きメ
タルマスク１１の形成及びエキシマレ−ザ−光による導
通用孔３の形成工程を介することなく、感光性樹脂から
なる表面保護層６Ａの形成と同時に導通用孔３Ａを形成
できるので、工程の簡易化による製品の低コスト化を図
れる。In the method shown in FIG. 4, the surface protective layer 6A made of a photosensitive resin is formed without the steps of forming the metal mask 11 and the holes 3 for conduction by excimer laser light as in the method shown in FIG. Since the conduction hole 3A can be formed at the same time as the formation, the cost of the product can be reduced by simplifying the process.
【００２７】[0027]
【発明の効果】本発明によるバンプを備えた回路基板及
びその製造法によれば、端子部分となる体積の大きなバ
ンプを導電性球体で容易に構成できるので、従来の如く
バンプをメッキ処理で形成する手法に比して工数を好適
に削減して製品を安価に製作できる。According to the circuit board having bumps and the method of manufacturing the same according to the present invention, since bumps having a large volume which are terminal portions can be easily formed of conductive spheres, the bumps are formed by plating as in the prior art. As compared with the method described above, the man-hours can be suitably reduced and the product can be manufactured at low cost.
【００２８】バンプとなる導電性球体は予め種々の構造
に形成できるので、用途に応じて最適なバンプを導電性
球体で簡易に構成できる。Since the conductive spheres to be the bumps can be formed in various structures in advance, the optimum bumps can be easily formed of the conductive spheres according to the application.
【００２９】導電性球体で構成されるこのようなバンプ
を備えた回路基板の製造手法は簡易であって製品の低コ
スト化を図れる。The method of manufacturing a circuit board having such bumps made of conductive spheres is simple and the cost of the product can be reduced.
【図１】 本発明の一実施例によるバンプを備えた回路
基板の概念的な要部拡大断面構成図。FIG. 1 is an enlarged schematic cross-sectional configuration diagram of a main part of a circuit board including bumps according to an embodiment of the present invention.
【図２】 本発明の他の実施例によるバンプを備えた回
路基板の同様な概念的要部拡大断面構成図。FIG. 2 is an enlarged cross-sectional configuration diagram of a similar conceptual main part of a circuit board having bumps according to another embodiment of the present invention.
【図３】 図１のバンプを備えた回路基板の製造工程
図。FIG. 3 is a manufacturing process diagram of a circuit board including the bumps of FIG. 1;
【図４】 図２のバンプを備えた回路基板の製造工程
図。FIG. 4 is a manufacturing process diagram of a circuit board having the bumps of FIG. 2;
【図５】 従来のバンプを備えた回路基板の製造工程
図。FIG. 5 is a manufacturing process diagram of a conventional circuit board having bumps.
１ 絶縁べ−ス材 ６Ａ 表面保護層 ２ 回路配線パタ−ン ７ 耐腐食性皮膜 ３ 導通用孔 ８ 導電性球体 ３Ａ 導通用孔 ９ 半田部材 ４ 接着剤 １０ 孔 ５ 絶縁フィルム １１ メタルマスク ６ 表面保護層 Ａ エキシマレ−
ザ−光DESCRIPTION OF SYMBOLS 1 Insulating base material 6A Surface protection layer 2 Circuit wiring pattern 7 Corrosion resistant film 3 Conduction hole 8 Conductive sphere 3A Conduction hole 9 Solder member 4 Adhesive 10 Hole 5 Insulating film 11 Metal mask 6 Surface protection Layer A Excimer
The light
Claims (11)
パタ−ンを備え、上記絶縁べ−ス材の他方面に於ける上
記回路配線パタ−ンの位置する該当部位からこの絶縁べ
−ス材を貫通して一端が上記回路配線パタ−ンに電気的
に接合すると共に他端がこの絶縁べ−ス材の外部に突出
して回路部品と電気的に接続する為のバンプを備え、こ
のバンプを導電性の球体で構成したことを特徴とするバ
ンプを備えた回路基板。1. An insulating base material is provided with a required circuit wiring pattern on one surface thereof, and the insulation is provided from a corresponding portion on the other surface of the insulating base material where the circuit wiring pattern is located. It has bumps for penetrating the base material, one end of which is electrically joined to the circuit wiring pattern and the other end of which protrudes outside the insulating base material to electrically connect with circuit parts. A circuit board having bumps, characterized in that the bumps are made of conductive spheres.
パタ−ンを備え、該回路配線パタ−ンの表面には表面保
護層を備え、この表面保護層を貫通して一端が上記回路
配線パタ−ンに電気的に接合すると共に他端がこの表面
保護層の外部に突出して回路部品と電気的に接続する為
のバンプを備え、このバンプを導電性の球体で構成した
ことを特徴とするバンプを備えた回路基板。2. An insulating base material is provided with a required circuit wiring pattern on one surface thereof, and a surface protective layer is provided on a surface of the circuit wiring pattern, and one end is penetrated through the surface protective layer. A bump for electrically connecting to the circuit wiring pattern and having the other end protruding outside the surface protective layer to electrically connect to a circuit component, the bump being formed of a conductive sphere. A circuit board provided with bumps.
属層を有する導電性金属で構成された請求項１又は２の
バンプを備えた回路基板。3. The circuit board having bumps according to claim 1, wherein the conductive sphere is made of a conductive metal having a corrosion resistant metal layer on a surface thereof.
属層を有する樹脂性部材で構成された請求項１又は２の
バンプを備えた回路基板。4. The circuit board having bumps according to claim 1, wherein the conductive sphere is made of a resin material having a corrosion resistant metal layer on a surface thereof.
上記回路配線パタ−ンに接続する為の半田部材よりも高
い融点温度を有する半田組成物で構成された請求項１又
は２のバンプを備えた回路基板。5. The conductive sphere is formed of a solder composition having a melting point temperature higher than that of a solder member for connecting the conductive sphere to the circuit wiring pattern. Circuit board with bumps.
置させる孔を有する感光性樹脂で構成された請求項２の
バンプを備えた回路基板。6. The circuit board having bumps according to claim 2, wherein the surface protective layer is made of a photosensitive resin having holes for arranging the conductive spheres.
パタ−ンを形成すると共に、該絶縁べ−ス材の他方面に
は上記回路配線パタ−ンの位置する該当個所に孔を有す
るメタルマスクを形成し、また上記回路配線パタ−ン上
には表面保護層を形成した後、上記メタルマスク側から
エキシマレ−ザ−光を照射して上記絶縁べ−ス材に上記
回路配線パタ−ンに達する導通用孔を形成し、次いで上
記メタルマスクのみをエッチング除去した後、上記導通
用孔に導電性球体を配置しながら該導電性球体と上記回
路配線パタ−ンとを電気的に接合する各工程を有するこ
とを特徴とするバンプを備えた回路基板の製造法。7. A desired circuit wiring pattern is formed on one surface of the insulating base material, and a hole is formed on the other surface of the insulating base material at a corresponding position where the circuit wiring pattern is located. And a surface protection layer on the circuit wiring pattern, and then an excimer laser beam is irradiated from the metal mask side to the insulating base material to form the circuit wiring. A conductive hole reaching the pattern is formed, and then only the metal mask is removed by etching. Then, the conductive sphere and the circuit wiring pattern are electrically connected while the conductive sphere is arranged in the conductive hole. A method of manufacturing a circuit board having bumps, the method including the steps of bonding to.
パタ−ンを形成し、この回路配線パタ−ンの表面に感光
性樹脂を塗布して予備加熱、露光、現像及び加熱の各処
理により上記回路配線パタ−ンの所要の位置に導通用孔
を有する表面保護層を形成した後、上記導通用孔に導電
性球体を配置しながら該導電性球体と上記回路配線パタ
−ンとを電気的に接合する各工程を有することを特徴と
するバンプを備えた回路基板の製造法。8. A desired circuit wiring pattern is formed on one surface of an insulating base material, and a photosensitive resin is applied to the surface of the circuit wiring pattern to carry out preheating, exposure, development and heating. After forming a surface protective layer having a hole for conduction at a required position of the circuit wiring pattern by each treatment, the conductive sphere and the circuit wiring pattern are arranged while arranging a conductive sphere in the hole for conduction. A method of manufacturing a circuit board having bumps, the method including the steps of electrically bonding and.
とを電気的に接合する手段は、ペ−スト状半田の付着溶
融により行われる請求項７又は８のバンプを備えた回路
基板の製造法。9. A circuit board having bumps according to claim 7, wherein the means for electrically connecting the conductive sphere and the circuit wiring pattern is performed by adhesion and melting of paste solder. Manufacturing method.
ンとを電気的に接合する手段は、加熱溶融により半田組
成物を生成するペ−ストの塗布溶融により行われる請求
項７又は８のバンプを備えた回路基板の製造法。10. The conductive sphere and the circuit wiring pattern.
9. The method for manufacturing a circuit board having bumps according to claim 7, wherein the means for electrically connecting the circuit board with the solder is performed by coating and melting a paste that produces a solder composition by heating and melting.
ンとを電気的に接合する手段は、上記導通用孔の底部に
メッキ形成された半田の溶融により行われる請求項７又
は８のバンプを備えた回路基板の製造法。11. The conductive sphere and the circuit wiring pattern.
9. The method of manufacturing a circuit board having bumps according to claim 7, wherein the means for electrically connecting the circuit board with the solder is performed by melting solder plated on the bottom of the conduction hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1489494A JPH07212017A (en) | 1994-01-13 | 1994-01-13 | Bump-provided circuit board and its manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1489494A JPH07212017A (en) | 1994-01-13 | 1994-01-13 | Bump-provided circuit board and its manufacture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07212017A true JPH07212017A (en) | 1995-08-11 |
Family
ID=11873711
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1489494A Pending JPH07212017A (en) | 1994-01-13 | 1994-01-13 | Bump-provided circuit board and its manufacture |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07212017A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6906427B2 (en) | 1997-04-17 | 2005-06-14 | Sekisui Chemical Co., Ltd. | Conductive particles and method and device for manufacturing the same, anisotropic conductive adhesive and conductive connection structure, and electronic circuit components and method of manufacturing the same |
| JP2007179999A (en) * | 2005-09-26 | 2007-07-12 | D D K Ltd | Electrical contact, and production method for the electrical contact |
| CN101938885A (en) * | 2009-06-26 | 2011-01-05 | 孙庆爱 | The manufacture method of printed circuit board (PCB) and the printed circuit board (PCB) that utilizes this method to make |
| KR20190129635A (en) * | 2018-05-11 | 2019-11-20 | 주식회사 네패스 | Semiconductor package |
-
1994
- 1994-01-13 JP JP1489494A patent/JPH07212017A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6906427B2 (en) | 1997-04-17 | 2005-06-14 | Sekisui Chemical Co., Ltd. | Conductive particles and method and device for manufacturing the same, anisotropic conductive adhesive and conductive connection structure, and electronic circuit components and method of manufacturing the same |
| JP2007179999A (en) * | 2005-09-26 | 2007-07-12 | D D K Ltd | Electrical contact, and production method for the electrical contact |
| CN101938885A (en) * | 2009-06-26 | 2011-01-05 | 孙庆爱 | The manufacture method of printed circuit board (PCB) and the printed circuit board (PCB) that utilizes this method to make |
| KR20190129635A (en) * | 2018-05-11 | 2019-11-20 | 주식회사 네패스 | Semiconductor package |
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