JPH071795Y2 - Immersion type substrate cleaning equipment - Google Patents
Immersion type substrate cleaning equipmentInfo
- Publication number
- JPH071795Y2 JPH071795Y2 JP1991079854U JP7985491U JPH071795Y2 JP H071795 Y2 JPH071795 Y2 JP H071795Y2 JP 1991079854 U JP1991079854 U JP 1991079854U JP 7985491 U JP7985491 U JP 7985491U JP H071795 Y2 JPH071795 Y2 JP H071795Y2
- Authority
- JP
- Japan
- Prior art keywords
- cleaning
- cleaning liquid
- substrate
- straightening
- carrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
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- Cleaning Or Drying Semiconductors (AREA)
Description
【０００１】[0001]
【産業上の利用分野】この考案は、半導体基板や液晶用
ガラス基板等の薄板状被処理基板(以下単に基板と称す
る)を洗浄処理するのに用いられる浸漬型の基板洗浄装
置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an immersion type substrate cleaning apparatus used for cleaning a thin substrate to be processed (hereinafter simply referred to as a substrate) such as a semiconductor substrate or a glass substrate for liquid crystal. .
【０００２】[0002]
【従来の技術】この種の装置としては、従来より例えば
本出願人の提案に係る実開平２−７６８３７号公報に開
示され、図１０に示すもの（以下従来例１という）、あ
るいは特開平１−１８４９２５号公報に開示され、図１
１にもの（以下従来例２という）が知られている。2. Description of the Related Art An apparatus of this type is conventionally disclosed, for example, in Japanese Utility Model Application Laid-Open No. 2-76837 proposed by the present applicant and shown in FIG. No. 184925, and FIG.
No. 1 (hereinafter referred to as Conventional Example 2) is known.
【０００３】従来例１は図１０に示すように、石英材料
で形成した処理槽１０２の内部を整流多孔板１０４で上
下に仕切り、下部に洗浄液供給部３Ａを、上部に洗浄処
理部３Ｂを区画形成し、洗浄液供給部３Ａより洗浄液を
供給して洗浄処理部３Ｂに貯溜するとともに、整流多孔
板１０４により洗浄液の上昇流を形成して処理槽１０２
の上辺部よりオーバーフローさせ、複数の被処理基板Ｗ
を直立状に整列して収容したキャリア１０５を洗浄処理
部３Ｂの洗浄液中に浸漬して、キャリア載置台１１０上
に載置し、洗浄液の上昇流で基板を洗浄するように構成
されている。なお、キャリア１０５は図示しない自動搬
送ロボットによって自動搬送され、また、オーバーフロ
ーした洗浄液は廃液槽１０１を介して回収され、精製し
て再利用される。In the conventional example 1, as shown in FIG. 10 , the inside of a processing tank 102 made of a quartz material is vertically partitioned by a rectifying perforated plate 104, and a cleaning liquid supply section 3A is partitioned in the lower part and a cleaning processing section 3B is partitioned in the upper part. The cleaning liquid is formed and supplied from the cleaning liquid supply unit 3A to be stored in the cleaning processing unit 3B, and an upward flow of the cleaning liquid is formed by the straightening perforated plate 104 to form the processing tank 102.
A plurality of substrates W to be processed by overflowing from the upper side
The carrier 105, which is housed in an upright state, is immersed in the cleaning liquid of the cleaning processing section 3B, placed on the carrier mounting table 110, and the substrate is cleaned by an upward flow of the cleaning liquid. The carrier 105 is automatically transported by an automatic transport robot (not shown), and the overflowed cleaning liquid is collected through the waste liquid tank 101, purified, and reused.
【０００４】従来例２は図１１に示すように、上記従来
例１（図１０）において、キャリア載置台１１０を介さ
ずにキャリア１０５を直接整流多孔板１０４上に載置す
るとともに、洗浄処理部３Ｂは正面視でその側壁２の上
部が内側に向けて突設され、突設部２ａとキャリア１０
５の外側との間の上昇流を減じ、キャリア１０５内によ
り多く上昇流を流すように構成されている。なお、同図
中の符号５ａはキャリア側壁の開口である。As shown in FIG. 11 , the conventional example 2 is different from the conventional example 1 ( FIG. 10 ) in that the carrier 105 is placed directly on the flow straightening porous plate 104 without the carrier placing table 110, and the cleaning processing section is used. 3B is a front view of the upper portion of the side wall 2 of which protrudes inward, and the protruding portion 2a and the carrier 10
5 is configured so that the upward flow between the outside of the carrier 5 and the outside of the carrier 5 is reduced and more upward flow is made to flow in the carrier 105. Reference numeral 5a in the figure is an opening in the side wall of the carrier.
【０００５】[0005]
【考案が解決しようとする課題】一般にこの種の浸漬型
基板洗浄装置ではプロセス中で発生し、前処理工程で基
板に付着した処理液及び塵粒子を速やかに処理槽外に排
出し、基板表面に再付着するのを防止しなければならな
い。しかるに、上記従来例１及び従来例２ともに、洗浄
処理の迅速性に欠けるという難点があった。それは以下
のような理由によるものと考えられる。図１２及び図１
３はそれぞれ従来例１及び従来例２の流速ベクトル図で
あり、それぞれ左右の対称性を考慮して左半部のみを示
す。即ち、従来例１は、図１２に示すように、処理槽の
１０２の側壁２とキャリア１０５の側壁との間の３カ所
に渦流Ｑ1〜Ｑ3が発生し、この渦流が洗浄液を停溜さ
せ、塵粒子等の迅速な排出を妨げている。Generally, in this type of immersion type substrate cleaning apparatus, the processing liquid and dust particles generated in the process and adhering to the substrate in the pre-processing step are quickly discharged to the outside of the processing tank, and the substrate surface Must be prevented from reattaching to. However, both of the conventional example 1 and the conventional example 2 have a drawback that the cleaning process is not swift. It is considered that this is due to the following reasons. 12 and 1
3 are flow velocity vector diagrams of Conventional Example 1 and Conventional Example 2, respectively, showing only the left half part in consideration of left-right symmetry. That is, in Conventional Example 1, as shown in FIG. 12 , vortexes Q 1 to Q 3 are generated at three places between the side wall 2 of the processing tank 102 and the side wall of the carrier 105, and the vortexes retain the cleaning liquid. This prevents the rapid discharge of dust particles and the like.
【０００６】また、従来例２は、図１３に示すように、
３カ所に渦流Ｑ4〜Ｑ6が発生し、同様に塵粒子等の迅速
な排出を妨げている。本考案はこのような事情を考慮
し、鋭意研究の結果なされたもので、上記渦流の発生を
極力抑制して、洗浄処理の迅速性を一層向上させること
を技術課題とする。Further, in the conventional example 2, as shown in FIG.
Vortex Q 4 to Q 6 at three locations is generated, which likewise hinders rapid emission of dust particles and the like. The present invention has been made as a result of earnest research in consideration of such a situation, and it is a technical subject to suppress the generation of the above-mentioned vortex as much as possible and further improve the quickness of the cleaning process.
【０００７】[0007]
【課題を解決するための手段】本考案は上記課題を解決
するものとして、以下のように構成される。請求項１の
考案は、処理槽の内部を整流多孔板で上下に仕切り、下
部に洗浄液供給部を、その上方に洗浄処理部を区画形成
し、洗浄液供給部より洗浄液を供給し、整流多孔板を介
して洗浄処理部に洗浄液の上昇流を形成して処理槽の上
辺部よりオーバーフローさせ、洗浄液を貯溜した洗浄処
理部内に、複数の被処理基板を直立状に整列して浸漬
し、洗浄液の上昇流で基板を洗浄するように構成した浸
漬型基板洗浄装置において、洗浄処理部は平面視では矩
形状をなし、正面視又は側面視のいずれか一方では、処
理槽の側壁の少なくとも上部が外側へ向けて２０度以下
の広がり形状をなし、側壁と被処理基板との間に洗浄液
の上昇整流を生ずる狭部隙間を形成したことを特徴とす
るものである。[Means for Solving the Problems] The present invention is configured as follows to solve the above problems. According to a first aspect of the present invention, the inside of the processing tank is divided into upper and lower parts by a straightening perforated plate, a cleaning liquid supply part is formed in the lower part and a cleaning treatment part is formed above the partitioning part, and the cleaning liquid is supplied from the cleaning liquid supply part to form the straightening porous plate. An upward flow of the cleaning liquid is formed in the cleaning processing unit through the above to overflow from the upper side of the processing tank, and the plurality of substrates to be processed are vertically aligned and immersed in the cleaning processing unit in which the cleaning liquid is stored. In an immersion type substrate cleaning apparatus configured to clean a substrate with an upward flow, the cleaning processing unit has a rectangular shape in a plan view, and at least an upper part of a side wall of a processing tank is an outside in a front view or a side view. It is characterized in that it has a spread shape of 20 degrees or less toward the side, and that a narrow gap is formed between the side wall and the substrate to be processed, which causes upward rectification of the cleaning liquid.
【０００８】請求項２の考案は、処理槽の内部を整流多
孔板で上下に仕切り、下部に洗浄液供給部を、その上方
に洗浄処理部を区画形成し、洗浄液供給部より洗浄液を
供給し、整流多孔板を介して洗浄処理部に洗浄液の上昇
流を形成して処理槽の上辺部よりオーバーフローさせ、
複数の被処理基板を直立状に整列して収容したキャリア
を、洗浄液を貯溜した洗浄処理部内に浸漬し、洗浄液の
上昇流で基板を洗浄するように構成した浸漬型基板洗浄
装置において、キャリアを整流多孔板より少なくとも２
０mm以上上方へ離間配置可能に支持するとともに、その
断面外形が流線形をなす整流杆を、キャリアの下端部の
下側に沿って配置したことを特徴とするものである。According to a second aspect of the present invention, the inside of the processing tank is partitioned into upper and lower parts by a straightening perforated plate, a cleaning liquid supply part is formed in the lower part and a cleaning processing part is formed above the cleaning liquid supply part, and the cleaning liquid is supplied from the cleaning liquid supply part. An upward flow of the cleaning liquid is formed in the cleaning processing section through the straightening perforated plate to overflow from the upper side of the processing tank,
A carrier in which a plurality of substrates to be processed are aligned and housed is dipped in a cleaning processing unit in which a cleaning liquid is stored, and the carrier is used in an immersion type substrate cleaning apparatus configured to clean the substrate with an upward flow of the cleaning liquid. At least 2 than straightening perforated plate
It is characterized in that a straightening rod having a streamline cross-sectional outer shape is arranged along the lower side of the lower end portion of the carrier while supporting it so that it can be spaced upward by 0 mm or more.
【０００９】請求項３の考案は、処理槽の内部を整流多
孔板で上下に仕切り、下部に洗浄液供給部を、その上方
に洗浄処理部を区画形成し、洗浄液供給部より洗浄液を
供給し、整流多孔板を介して洗浄処理部に洗浄液の上昇
流を形成して処理槽の上辺部よりオーバーフローさせ、
洗浄液を貯溜した洗浄処理部内に、複数の被処理基板を
直立状に整列して浸漬し、洗浄液の上昇流で基板を洗浄
するように構成した浸漬型基板洗浄装置において、被処
理基板を整流多孔板より少なくとも２０mm以上上方へ離
間配置可能に支持するとともに、被処理基板の保持杆の
下端の断面外形が流線形をなすように形成したことを特
徴とするものである。According to a third aspect of the present invention, the inside of the processing tank is divided into upper and lower parts by a straightening perforated plate, a cleaning liquid supply part is formed in the lower part, and a cleaning processing part is formed above the cleaning liquid supply part, and the cleaning liquid is supplied from the cleaning liquid supply part. An upward flow of the cleaning liquid is formed in the cleaning processing section through the straightening perforated plate to overflow from the upper side of the processing tank,
In an immersion type substrate cleaning device configured to immerse a plurality of substrates to be processed in an upright state in a cleaning processing unit in which a cleaning liquid is stored, and to clean the substrates with an upward flow of the cleaning liquid, the substrate to be processed is rectified It is characterized in that the plate is supported so as to be spaced apart from the plate by at least 20 mm or more, and the cross-sectional outer shape of the lower end of the holding rod of the substrate to be processed is streamlined.
【００１０】[0010]
【作用】請求項１の考案では、洗浄処理部の側壁と被処
理基板との間に狭部隙間が形成されていることから、狭
部隙間の上昇速度が速くなり、例えば図５及び図６に示
すように、従来例１（図１２）で生じていた渦流Ｑ1〜
Ｑ3がなくなる。そして側壁の上部２ａが外側へ向けて
２０度以下の広がり形状をなすよう形成されていること
から、図６で示すように、従来例２（図１３）で生じて
いた渦流Ｑ4・Ｑ6や搬送ロボットの挟持スペース部で生
じていた渦流Ｑ5がなくなる。これにより洗浄処理部内
において洗浄液の均一な上昇整流が形成され、渦流や停
溜部は生じない。According to the first aspect of the invention, since the narrow portion gap is formed between the side wall of the cleaning processing portion and the substrate to be processed, the ascending speed of the narrow portion gap is increased. As shown in Fig. 12 , the vortex Q 1-
Q 3 is gone. Since the upper portion 2a of the side wall is formed so as to have a shape that expands outward by 20 degrees or less, as shown in FIG. 6, the vortex flows Q 4 and Q 6 generated in the conventional example 2 ( FIG. 13 ) are generated . The eddy current Q 5 generated in the holding space of the transfer robot disappears. As a result, a uniform rising rectification of the cleaning liquid is formed in the cleaning processing unit, and no eddy currents or stagnant portions are generated.
【００１１】請求項２の考案では、キャリアを整流多孔
板より少なくとも２０mm以上上方に離間配置しているの
で、例えば図４に示すように整流多孔板４の直ぐ上で生
ずる渦流ｑの影響を受けることはなく、上昇整流によっ
て基板の洗浄がなされることになる。また、断面外形が
流線形をなす整流杆１１をキャリアの下端部５ｂの下側
に沿って配置していることから、キャリアの下端近傍に
渦流や停溜部が生ずるのを回避することができる。According to the second aspect of the present invention, the carriers are arranged at least 20 mm or more above the rectifying perforated plate, so that they are affected by the vortex flow q generated immediately above the rectifying perforated plate 4 as shown in FIG. 4, for example. However, the substrate is cleaned by the rising rectification. Further, since the rectifying rod 11 having a streamlined cross-sectional outer shape is arranged along the lower side of the lower end portion 5b of the carrier, it is possible to avoid generation of a vortex or a stagnant portion near the lower end of the carrier. .
【００１２】請求項３の考案では、被処理基板を整流多
孔板より少なくとも２０mm以上上方に離間配置している
ので、例えば図４に示すように整流多孔板４の直ぐ上で
生ずる渦流ｑの影響を受けることはなく、上昇整流によ
って基板の洗浄がなされることになる。また、被処理基
板の保持杆の下端の断面外形が流線形であるため、被処
理基板の保持杆の下端では渦流の発生を回避することが
できる。According to the third aspect of the present invention, since the substrate to be processed is disposed at least 20 mm above the straightening perforated plate, the influence of the vortex flow q generated immediately above the straightening perforated plate 4 as shown in FIG. 4, for example. Therefore, the substrate is cleaned by the rising rectification. Further, since the cross-sectional outer shape of the lower end of the holding rod of the substrate to be processed is streamlined, it is possible to avoid the generation of vortex at the lower end of the holding rod of the substrate to be processed.
【００１３】[0013]
【実施例】以下本考案の実施例を図面に基づいて説明す
る。図１は本考案の第１の実施例に係る浸漬型基板洗浄
装置の縦断正面図、図２はその縦断側面図である。この
実施例装置は、図示しない排液槽内に石英製処理槽２を
配置し、処理槽２の内部を整流多孔板４で上下に仕切
り、下部に洗浄液供給部３Ａを、その上方に洗浄処理部
３Ｂを区画形成し、複数の被処理基板Ｗを直立状に整列
して収容したキャリア５を自動搬送ロボット６で、洗浄
処理部３Ｂ内に浸漬し、洗浄液供給部３Ａより純水洗浄
液７を供給し、整流多孔板４を介して上昇流を形成して
処理槽２の上辺部よりオーバーフローさせ、純水洗浄液
の上昇流で基板Ｗを洗浄するように構成されている。Embodiments of the present invention will be described below with reference to the drawings. 1 is a vertical sectional front view of an immersion type substrate cleaning apparatus according to a first embodiment of the present invention, and FIG. 2 is a vertical sectional side view thereof. In the apparatus of this embodiment, a quartz treatment tank 2 is arranged in a drainage tank (not shown), the inside of the treatment tank 2 is partitioned into upper and lower parts by a rectifying porous plate 4, and a cleaning liquid supply part 3A is provided in the lower part and a cleaning process is provided above it. The carrier 5 in which the parts 3B are partitioned and formed and a plurality of substrates W to be processed are aligned and housed is dipped into the cleaning processing part 3B by the automatic transfer robot 6, and the pure water cleaning liquid 7 is supplied from the cleaning liquid supply part 3A. The substrate W is supplied to form an upward flow through the rectifying porous plate 4, overflows from the upper side of the processing tank 2, and the substrate W is cleaned by the upward flow of the pure water cleaning liquid.
【００１４】洗浄液供給部３Ａには２本の給液管８・８
が配管され、その給液管８の下面には液吐出孔８ａが等
ピッチであけられており、この給液管８を介して純水洗
浄液７を供給するようになっている。上記整流多孔板４
は下側の洗浄液供給部３Ａ内を一定の正圧にして、所定
温度の純水洗浄液７及び必要に応じてそこへ供給される
Ｎ2ガス等の上昇流を均一な整流に形成するものであ
り、整流孔４ａはキャリア５内の基板Ｗが位置する直径
幅に対応する部分では密に、その外側では疎となるよう
に直径約１mmの円孔が千鳥配置（図３）にあけられてい
る。The cleaning liquid supply section 3A has two liquid supply pipes 8
The liquid supply holes 8a are formed in the lower surface of the liquid supply pipe 8 at equal pitches, and the pure water cleaning liquid 7 is supplied through the liquid supply pipe 8. The straightening porous plate 4
Is for forming a constant positive pressure in the lower cleaning liquid supply section 3A to form a uniform rectification of the pure water cleaning liquid 7 at a predetermined temperature and, if necessary, an upward flow of N 2 gas or the like supplied thereto. The rectifying holes 4a are formed in staggered arrangement (FIG. 3) so that circular holes having a diameter of about 1 mm are formed so that the rectifying holes 4a are dense at the portion corresponding to the diameter width where the substrate W is located in the carrier 5 and are sparse at the outside thereof. There is.
【００１５】上記洗浄処理部３Ｂは平面視では矩形状に
形成され、正面視及び側面視では処理槽２の側壁の上部
２ａが外側へ向けて２０度以下の広がり形状をなし、側
壁の下部２ｂが垂直形状をなし、垂直側壁２ｂとキャリ
ア５の外壁との間に洗浄液の上昇整流を生ずる狭部隙間
Ｄが形成されている。この狭部隙間Ｄによって、従来例
１（図１２）で生じていた渦流Ｑ1〜Ｑ3をなくして上昇
整流を形成させ（図５及び図６参照）、側壁上部２ａを
外側へ向けてゆるやかに広げることにより、図１３で生
じていた自動搬送ロボット６挟持用スペースに渦流Ｑ5
が生じないようにしてある（図６参照）。The cleaning processing section 3B is formed in a rectangular shape in a plan view, and an upper portion 2a of the side wall of the processing tank 2 has an expansive shape of 20 degrees or less toward the outside in a front view and a side view, and a lower portion 2b of the side wall. Has a vertical shape, and a narrow gap D is formed between the vertical side wall 2b and the outer wall of the carrier 5 to cause upward rectification of the cleaning liquid. Due to the narrow gap D, the swirling flows Q 1 to Q 3 generated in the conventional example 1 ( FIG. 12 ) are eliminated to form upward rectification (see FIGS. 5 and 6), and the side wall upper portion 2 a is gently turned outward. The vortex Q 5 is generated in the space for sandwiching the automatic transfer robot 6 generated in FIG.
Is prevented (see FIG. 6).
【００１６】なお、整流多孔板４の周縁部には上記狭部
隙間に対置させて整流孔４ｂがあけられており、この整
流孔４ｂによって狭部隙間Ｄを上昇する整流Ｒが形成さ
れ、この上昇整流Ｒによって、基板相互間を通過した液
流がカセット外へまわり込まないようにしてある。A rectifying hole 4b is formed in the peripheral portion of the rectifying porous plate 4 so as to be opposed to the narrow gap, and the rectifying hole 4b forms a rectifying R for raising the narrow gap D. The rising rectification R prevents the liquid flow passing between the substrates from wrapping around the outside of the cassette.
【００１７】上記整流多孔板４の上側には、キャリア５
の載置台１０が着脱自在に設けられている。この載置台
１０は、断面が円形の整流杆１１を縦横に組み合わせて
構成され、整流杆１１がキャリア５の下端部５ｂの真下
に位置するように、キャリア位置決め部材１２が整流杆
１１に固設され、また、キャリア５を整流多孔板４より
少なくとも２０mm以上上方に離間して支持するように構
成されている。これにより、図４に示すように、整流多
孔板４の直ぐ上で生ずる渦流ｑの影響を受けず、また、
キャリア５の下端部５ｂの近傍に渦流や停溜部が生ずる
のを回避することができる。A carrier 5 is provided above the straightening porous plate 4.
The mounting table 10 is detachably provided. The mounting table 10 is configured by vertically and horizontally combining straightening rods 11 having a circular cross section, and a carrier positioning member 12 is fixed to the straightening rods 11 so that the straightening rods 11 are located directly below the lower end portion 5b of the carrier 5. In addition, the carrier 5 is configured so as to be supported at a distance of at least 20 mm or more above the rectifying porous plate 4. As a result, as shown in FIG. 4, it is not affected by the vortex flow q generated immediately above the rectifying porous plate 4, and
It is possible to avoid eddy currents and stagnant portions from being generated in the vicinity of the lower end portion 5b of the carrier 5.
【００１８】上記整流杆１１は円形に限らず、断面外形
が渦流を生じない流線形を有するものであれば良い。ま
た、図４に示すように、キャリア５の下端部５ｂと整流
杆１１との間に洗浄液が流通できる隙間ｄを設けるのが
望ましく、図２中の符号１３はこの隙間ｄを形成するた
めのスペーサである。なお、整流杆１１の断面外形が流
線形の場合、スペーサ１３を省略することもできる。ま
た、自動搬送用ロボット６でキャリア５を浸漬保持した
まま、基板を洗浄する場合には、位置決め部材１２及び
整流杆１１のみ設け、上記載置台１０は必ずしも必要で
ない。The rectifying rod 11 is not limited to a circular shape, and may have any cross-sectional outer shape having a streamline shape that does not generate a vortex. Further, as shown in FIG. 4, it is desirable to provide a gap d between the lower end portion 5b of the carrier 5 and the rectifying rod 11 through which the cleaning liquid can flow. Reference numeral 13 in FIG. 2 indicates the gap d. It is a spacer. In addition, when the cross-sectional outer shape of the rectifying rod 11 is streamlined, the spacer 13 may be omitted. Further, when cleaning the substrate while the carrier 5 is immersed and held by the automatic transfer robot 6, only the positioning member 12 and the rectifying rod 11 are provided, and the mounting table 10 is not necessarily required.
【００１９】図７は図２の処理槽をさらに改良した第２
の実施例を示す縦断側面図である。即ち、図２のように
処理槽２内に２組のキャリア５を浸漬した場合、当該キ
ャリア５・５の隙間Ｓ0に仮想線で示すように、処理液
７の逆流又は渦流ｑが発生することがある。そこで本実
施例では、図７で示すようにキャリア５・５の隙間にス
ペーサ２０を立設配置して流路を狭めることにより、キ
ャリア５とスペーサ２０との隙間に上昇流Ｆを形成さ
せ、上記逆流又は渦流ｑの発生を回避するようにしたも
のである。なお、スペーサ２０の形状は流路を狭めるも
のであれば、単なるプレートでも良い。また、上記逆流
ｑを回避するために、スペーサ２０の上端はなるべく水
面付近に延出するのが望ましい。FIG. 7 shows a second modified version of the processing tank of FIG.
FIG. 4 is a vertical sectional side view showing the embodiment of FIG. That is, when two sets of the carriers 5 are immersed in the treatment tank 2 as shown in FIG. 2, a backflow or a vortex flow q of the treatment liquid 7 is generated in the gap S 0 between the carriers 5 and 5 as shown by an imaginary line. Sometimes. Therefore, in the present embodiment, as shown in FIG. 7, the spacer 20 is erected vertically in the gap between the carriers 5 and 5 to narrow the flow path, thereby forming the upward flow F in the gap between the carrier 5 and the spacer 20, The above-mentioned backflow or vortex flow q is avoided. The spacer 20 may be a simple plate as long as it narrows the flow path. Further, in order to avoid the backflow q, it is desirable that the upper end of the spacer 20 extends as close to the water surface as possible.
【００２０】図８は図１の処理槽をさらに変形した第３
の実施例を示す縦断正面図である。この実施例は、いわ
ゆるキャリアレスタイプの処理槽２を用いるものであ
り、前記キャリア５を介在させずに自動搬送用ロボット
６の一対のアームチャック６ａ・６ａで複数の基板Ｗを
直接チャックして整流多孔板４上の一対の保持杆３０・
３０に浸漬保持させ、洗浄液供給部３Ａ内に装填したフ
ィルタカートリッジ１０を介して、純水洗浄液７の均一
な上昇流を供給して処理槽２の上辺部よりオーバーフロ
ーさせ、純水洗浄液の上昇流で基板Ｗを洗浄するように
構成されている。FIG. 8 shows a third modified version of the processing tank of FIG.
It is a vertical cross-sectional front view showing the embodiment of FIG. In this embodiment, a so-called carrierless type processing tank 2 is used, and a plurality of substrates W are directly chucked by a pair of arm chucks 6a, 6a of an automatic transfer robot 6 without interposing the carrier 5. A pair of holding rods 30 on the straightening porous plate 4
The pure water cleaning liquid 7 is supplied by the uniform upflow of the pure water cleaning liquid 7 through the filter cartridge 10 loaded in the cleaning liquid supply unit 3A so that the pure water cleaning liquid 7 overflows from the upper side portion of the processing tank 2 and the upflow of the pure water cleaning liquid. The substrate W is cleaned by.
【００２１】この処理槽２は洗浄液供給部３Ａを構成す
る下部処理槽２Ａと洗浄処理部３Ｂを構成する上部処理
槽２Ｂとから成り、メンテナンスの便宜を考慮して両者
は分離可能に組み付けられ、フィルタカートリッジ１０
を適宜交換し得るように構成されている。The processing tank 2 is composed of a lower processing tank 2A constituting a cleaning liquid supply section 3A and an upper processing tank 2B constituting a cleaning processing section 3B, and both are separably assembled in consideration of maintenance convenience. Filter cartridge 10
Are configured so that they can be replaced appropriately.
【００２２】上記フィルタカートリッジ１０は図８で示
すように、フランジ基枠１１に炉材としてメンブランフ
ィルタ１２を波形をなすように横設して多数のサポータ
１３…で上下方向より支持するとともに、メンブランフ
ィルタ１２を洗浄液供給部３Ａの上方間口の全域に亙り
敷設して成り、給液管８より圧送されてくる洗浄液７の
速度圧を十分に分散させて均一な上昇流を形成するよう
に構成されている。上記一対の保持杆３０・３０は整流
多孔板４上に離間配置され、前後方向に所定ピッチで形
成された多数の基板保持溝（図示せず）により、複数の
被処理基板Ｗを直立状に整列保持するように構成されて
いる。As shown in FIG. 8 , in the filter cartridge 10, a membrane filter 12 as a furnace material is horizontally installed in a flange base frame 11 in a corrugated manner, and is supported vertically by a large number of supporters 13 ... The filter 12 is laid all over the upper opening of the cleaning liquid supply unit 3A, and is configured to sufficiently disperse the velocity pressure of the cleaning liquid 7 pumped from the liquid supply pipe 8 to form a uniform upward flow. ing. The pair of holding rods 30 and 30 are spaced apart from each other on the flow straightening porous plate 4, and a plurality of substrate holding grooves (not shown) are formed at a predetermined pitch in the front-rear direction so that the plurality of substrates W to be processed are upright. It is configured to hold in line.
【００２３】図９は上記図８の処理槽をさらに変形した
第４の実施例を示す縦断正面図である。この実施例は、
前記整流多孔板４を排除するとともに、保持杆３０を処
理槽２の上縁部より支持具３１で吊り下げて浸漬配置
し、この保持杆３０で複数の基板Ｗを浸漬保持するよう
に構成したものである。ここで、保持杆３０の下端部は
流線形をなすように形成され、処理液７の上昇流の抵抗
を無くして渦流の発生を防止するように構成されてい
る。なお、洗浄液供給部３Ａ内に装填したフィルタカー
トリッジ１０の上縁から基板Ｗの下縁までの距離Ｈは、
前記同様２０〜３０mmに設定されている。FIG. 9 is a vertical sectional front view showing a fourth embodiment in which the processing tank of FIG. 8 is further modified. This example
In addition to eliminating the rectifying porous plate 4, the holding rod 30 is suspended from the upper edge portion of the processing tank 2 by a supporting member 31 so as to be immersed therein, and the holding rod 30 is configured to hold a plurality of substrates W by immersion. It is a thing. Here, the lower end portion of the holding rod 30 is formed to have a streamlined shape, and is configured to eliminate the resistance of the upward flow of the processing liquid 7 and prevent the generation of a vortex flow. The distance H from the upper edge of the filter cartridge 10 loaded in the cleaning liquid supply unit 3A to the lower edge of the substrate W is
Similar to the above, it is set to 20 to 30 mm.
【００２４】[0024]
【考案の効果】以上の説明で明らかなように、本考案で
は次のような効果を奏する。 イ．請求項１の考案では、洗浄処理部の側壁と基板との
間に狭部隙間が形成され、かつ、側壁の少なくとも上部
が外側へ向けて２０度以下の広がり形状に形成されてい
るので、洗浄処理部内において、洗浄液の均一な上昇流
が形成され、従来例のような渦流や停溜部は生じない。
これにより迅速な洗浄処理をなすことができる。 ロ．請求項２に記載の考案では、キャリアを整流多孔板
より少なくとも２０mm以上上方に離間配置し、断面外形
が流線形をなす整流杆をキャリアの下端縁の下側に沿っ
て配置していることから、整流多孔板の直ぐ上で生ずる
渦流の影響を受けず、また、キャリアの下端部近傍に渦
流や停溜部が生ずるのを回避することができる。これに
より均一な上昇流が形成され、一層迅速な洗浄処理をな
すことができる。 ハ．請求項３に記載の考案では、基板を整流多孔板より
少なくとも２０mm以上上方に離間配置し、その下端の断
面外形が流線形をな基板保持杆を配置していることか
ら、整流多孔板の直ぐ上で生ずる渦流の影響を受けず、
また、基板保持杆の下端部近傍に渦流や停溜部が生ずる
のを回避することができる。これにより均一な上昇流が
形成され、一層迅速な洗浄処理をなすことができる。As is clear from the above description, the present invention has the following effects. I. According to the first aspect of the present invention, since the narrow gap is formed between the side wall of the cleaning unit and the substrate, and at least the upper portion of the side wall is formed to have a shape that expands outward by 20 degrees or less. A uniform ascending flow of the cleaning liquid is formed in the processing section, and the swirling flow and the stagnant portion unlike the conventional example do not occur.
As a result, a quick cleaning process can be performed. B. According to the second aspect of the present invention, the carrier is arranged at least 20 mm or more above the rectifying porous plate, and the rectifying rod having a streamline cross-section is arranged along the lower side of the lower end edge of the carrier. It is possible to avoid the influence of the vortex flow generated immediately above the rectifying perforated plate and to prevent the generation of the vortex flow and the stagnant portion in the vicinity of the lower end portion of the carrier. As a result, a uniform upward flow is formed, and a quicker cleaning process can be performed. C. According to the third aspect of the present invention, the substrate is arranged at least 20 mm or more above the straightening perforated plate, and the substrate holding rod having a streamline cross-sectional outer shape at the lower end is arranged. Not affected by the vortex flow generated above,
Further, it is possible to avoid the generation of a vortex or a stagnant portion near the lower end of the substrate holding rod. As a result, a uniform upward flow is formed, and a quicker cleaning process can be performed.
【図１】本考案の第１の実施例に係る浸漬型基板洗浄装
置の縦断正面図である。FIG. 1 is a vertical sectional front view of an immersion type substrate cleaning apparatus according to a first embodiment of the present invention.
【図２】本考案の第１の実施例に係る浸漬型基板洗浄装
置の縦断側面図である。FIG. 2 is a vertical sectional side view of the immersion type substrate cleaning apparatus according to the first embodiment of the present invention.
【図３】整流多孔板の要部平面図である。FIG. 3 is a plan view of a main part of a rectifying porous plate.
【図４】整流多孔板及び整流杆の作用説明図である。FIG. 4 is an explanatory view of the operation of a rectifying porous plate and a rectifying rod.
【図５】洗浄処理部側壁の上部が段差状に広がっている
場合の流速ベクトル図である。FIG. 5 is a flow velocity vector diagram in the case where the upper portion of the side wall of the cleaning processing unit spreads like a step.
【図６】本考案の第１の実施例に係る流速ベクトル図で
ある。FIG. 6 is a flow velocity vector diagram according to the first embodiment of the present invention.
【図７】図２の処理槽をさらに改良した第２の実施例を
示す縦断側面図である。FIG. 7 is a vertical cross-sectional side view showing a second embodiment in which the treatment tank of FIG. 2 is further improved.
【図８】図１の処理槽をさらに改良した第３の実施例を
示す縦断側面図である。FIG. 8 is a vertical cross-sectional side view showing a third embodiment in which the processing tank of FIG. 1 is further improved.
【図９】図１の処理槽をさらに変形した第４の実施例を
示す縦断側面図である。9 is a vertical cross-sectional side view showing a fourth embodiment in which the processing tank of FIG. 1 is further modified.
【図１０】従来例１の第１図相当図である。10 is a view corresponding to FIG. 1 of Conventional Example 1. FIG.
【図１１】従来例２の第１図相当図である。11 is a view corresponding to FIG. 1 of Conventional Example 2. FIG.
【図１２】従来例１に係る流速ベクトル図である。FIG. 12 is a flow velocity vector diagram according to Conventional Example 1.
【図１３】従来例２に係る流速ベクトル図である。FIG. 13 is a flow velocity vector diagram according to Conventional Example 2.
２…処理槽、２ａ…処理槽の側壁上部、２ｂ…処理槽の
側壁下部、３Ａ…洗浄液供給部、３Ｂ…洗浄処理部、４
…整流多孔板、５…キャリア、５ｂ…キャリアの下端
部、７…洗浄液、１１…整流杆、３０…基板保持杆、Ｗ
…基板、Ｄ…狭部隙間。2 ... Treatment tank, 2a ... Upper portion of side wall of treatment tank, 2b ... Lower portion of side wall of treatment tank, 3A ... Cleaning liquid supply section, 3B ... Cleaning treatment section, 4
... rectifying porous plate, 5 ... carrier, 5b ... lower end of carrier, 7 ... cleaning liquid, 11 ... rectifying rod, 30 ... substrate holding rod, W
... Substrate, D ... Narrow space.
───────────────────────────────────────────────────── フロントページの続き (72)考案者 杉原 一男 滋賀県彦根市高宮町480番地の１ 大日本 スクリーン製造株式会社 彦根地区事業所 内 (72)考案者 松永 実信 京都府京都市伏見区羽束師古川町322番地 大日本スクリーン製造株式会社 洛西工 場内 (72)考案者 寺嶋 幸三 京都府京都市伏見区羽束師古川町322番地 大日本スクリーン製造株式会社 洛西工 場内 (56)参考文献 特開 昭61−125136（ＪＰ，Ａ) 特開 昭63−271937（ＪＰ，Ａ) ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Kazuo Sugihara, 1 480 Takamiya-cho, Hikone, Shiga Prefecture Dai Nippon Screen Mfg. Co., Ltd., Hikone District, Ltd. (72) Minoru Matsunaga Hajika, Fushimi-ku, Kyoto, Kyoto Prefecture 322 Furukawa-cho Dainippon Screen Mfg. Co., Ltd. in Rakusai Factory (72) Creator Kozo Terashima 322 Furukawa-cho, Fushimi-ku, Kyoto, Kyoto Prefecture Fukukawacho 322 Dainippon Screen Mfg. Co., Ltd. (56) References 61-125136 (JP, A) JP-A-63-271937 (JP, A)
Claims (3)
り、下部に洗浄液供給部を、その上方に洗浄処理部を区
画形成し、洗浄液供給部より洗浄液を供給し、整流多孔
板を介して洗浄処理部に洗浄液の上昇流を形成して処理
槽の上辺部よりオーバーフローさせ、洗浄液を貯溜した
洗浄処理部内に、複数の被処理基板を直立状に整列して
浸漬し、洗浄液の上昇流で基板を洗浄するように構成し
た浸漬型基板洗浄装置において、洗浄処理部は平面視で
は矩形状をなし、正面視又は側面視のいずれか一方で
は、処理槽の側壁の少なくとも上部が外側へ向けて２０
度以下の広がり形状をなし、側壁と被処理基板との間に
洗浄液の上昇整流を生ずる狭部隙間を形成したことを特
徴とする浸漬型基板洗浄装置。1. The inside of the processing tank is partitioned into upper and lower parts by a straightening perforated plate, a cleaning liquid supply part is formed in the lower part and a cleaning treatment part is formed above the partitioning part, and the cleaning liquid is supplied from the cleaning liquid supply part through the straightening perforated plate. As a result, a rising flow of the cleaning liquid is formed in the cleaning processing unit and overflows from the upper side of the processing tank, and a plurality of substrates to be processed are vertically aligned and immersed in the cleaning processing unit in which the cleaning liquid is stored. In the immersion type substrate cleaning apparatus configured to clean the substrate with a substrate, the cleaning processing section has a rectangular shape in a plan view, and at least an upper portion of the side wall of the processing tank faces outward in either of the front view and the side view. 20
An immersion type substrate cleaning apparatus characterized in that a narrow gap is formed between the side wall and a substrate to be processed, the narrow part gap having a spread shape of less than or equal to 10 degrees.
り、下部に洗浄液供給部を、その上方に洗浄処理部を区
画形成し、洗浄液供給部より洗浄液を供給し、整流多孔
板を介して洗浄処理部に洗浄液の上昇流を形成して処理
槽の上辺部よりオーバーフローさせ、複数の被処理基板
を直立状に整列して収容したキャリアを、洗浄液を貯溜
した洗浄処理部内に浸漬し、洗浄液の上昇流で基板を洗
浄するように構成した浸漬型基板洗浄装置において、キ
ャリアを整流多孔板より少なくとも２０mm以上上方へ離
間配置可能に支持するとともに、その断面外形が流線形
をなす整流杆を、キャリアの下端縁の下側に沿って配置
したことを特徴とする浸漬型基板洗浄装置。2. The inside of the treatment tank is partitioned into upper and lower parts by a straightening perforated plate, a cleaning liquid supply part is formed in the lower part, and a cleaning treatment part is formed above the partitioning part, and the cleaning liquid is supplied from the cleaning liquid supply part through the straightening perforated plate. By forming an upward flow of the cleaning liquid in the cleaning processing unit and causing it to overflow from the upper side of the processing tank, a plurality of substrates to be processed are vertically aligned and accommodated in the carrier, and the carrier is immersed in the cleaning processing unit that stores the cleaning liquid. In an immersion-type substrate cleaning apparatus configured to clean a substrate with an upward flow of a cleaning liquid, a carrier is supported so as to be spaced apart from a rectifying porous plate by at least 20 mm or more, and a rectifying rod whose cross-sectional outer shape is streamlined. And an immersion type substrate cleaning apparatus, which is arranged along the lower side of the lower edge of the carrier.
り、下部に洗浄液供給部を、その上方に洗浄処理部を区
画形成し、洗浄液供給部より洗浄液を供給し、整流多孔
板を介して洗浄処理部に洗浄液の上昇流を形成して処理
槽の上辺部よりオーバーフローさせ、洗浄液を貯溜した
洗浄処理部内に、複数の被処理基板を直立状に整列して
浸漬し、洗浄液の上昇流で基板を洗浄するように構成し
た浸漬型基板洗浄装置において、被処理基板を整流多孔
板より少なくとも２０mm以上上方へ離間配置可能に支持
するとともに、被処理基板の保持杆の下端の断面外形が
流線形をなすように形成したことを特徴とする浸漬型基
板洗浄装置。3. The inside of the treatment tank is partitioned into upper and lower parts by a straightening perforated plate, a cleaning liquid supply part is formed in the lower part, and a cleaning treatment part is formed above the partitioning part, and the cleaning liquid is supplied from the cleaning liquid supply part through the straightening perforated plate. As a result, a rising flow of the cleaning liquid is formed in the cleaning processing unit and overflows from the upper side of the processing tank, and a plurality of substrates to be processed are vertically aligned and immersed in the cleaning processing unit in which the cleaning liquid is stored. In the immersion type substrate cleaning apparatus configured to clean the substrate by the method described above, the substrate to be processed is supported so that it can be spaced apart at least 20 mm or more above the rectifying porous plate, and the sectional outer shape of the lower end of the holding rod of the substrate to be processed flows. An immersion type substrate cleaning apparatus, which is formed in a linear shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1991079854U JPH071795Y2 (en) | 1990-09-10 | 1991-09-05 | Immersion type substrate cleaning equipment |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9538190 | 1990-09-10 | ||
| JP2-95381 | 1990-09-10 | ||
| JP1991079854U JPH071795Y2 (en) | 1990-09-10 | 1991-09-05 | Immersion type substrate cleaning equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0497336U JPH0497336U (en) | 1992-08-24 |
| JPH071795Y2 true JPH071795Y2 (en) | 1995-01-18 |
Family
ID=31948714
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1991079854U Expired - Lifetime JPH071795Y2 (en) | 1990-09-10 | 1991-09-05 | Immersion type substrate cleaning equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH071795Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2872895B2 (en) * | 1993-10-05 | 1999-03-24 | 株式会社カイジョー | Substrate holding cassette |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61125136A (en) * | 1984-11-22 | 1986-06-12 | Hitachi Ltd | Treatment tank |
| JPS63271937A (en) * | 1987-04-28 | 1988-11-09 | Matsushita Electric Ind Co Ltd | Cleaning device |
| JPH0650982Y2 (en) * | 1988-11-30 | 1994-12-21 | 大日本スクリーン製造株式会社 | Immersion type substrate processing equipment |
-
1991
- 1991-09-05 JP JP1991079854U patent/JPH071795Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0497336U (en) | 1992-08-24 |
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