JPH0717454U - Motor power supply device for machine tool drive - Google Patents
Motor power supply device for machine tool driveInfo
- Publication number
- JPH0717454U JPH0717454U JP048004U JP4800493U JPH0717454U JP H0717454 U JPH0717454 U JP H0717454U JP 048004 U JP048004 U JP 048004U JP 4800493 U JP4800493 U JP 4800493U JP H0717454 U JPH0717454 U JP H0717454U
- Authority
- JP
- Japan
- Prior art keywords
- machine tool
- cooling
- semiconductor device
- power supply
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Landscapes
- Control Of Ac Motors In General (AREA)
Abstract
(57)【要約】
【構成】 工作機械用液冷式冷却手段によって冷却され
ているヒートシンクを有する電力用半導体装置モジュー
ルを有する工作機械駆動用モータ給電装置である。
【効果】 冷却効果が大きく、温度管理が容易であり、
取り扱いも容易であり、電力用半導体装置モジュールの
信頼性を向上し、大容量化を可能にすることができ、さ
らに、錆等を発生する懸念はなく、付加的冷媒通路を必
要とすることもなく、ヒートシンクが強電盤の盤壁を貫
通することゝすれば、強電盤を小型にすることもでき
る。
(57) [Summary] [Construction] A motor power supply device for driving a machine tool having a power semiconductor device module having a heat sink cooled by a liquid cooling type machine tool cooling means. [Effect] The cooling effect is large and the temperature control is easy,
It is easy to handle, it can improve the reliability of the power semiconductor device module, and it is possible to increase the capacity. Furthermore, there is no concern that rust etc. will occur, and an additional refrigerant passage may be required. However, if the heat sink penetrates the wall of the high-voltage panel, the high-voltage panel can be made smaller.
Description
【０００１】[0001]
本考案は、電力用半導体装置モジュールを使用して、工作機械駆動用のモータ に電力を供給する工作機械駆動用モータ給電装置に関する。特に、冷却効果が高 く、温度管理が容易であり、信頼性の向上した工作機械駆動用モータ給電装置に 関する。 The present invention relates to a machine tool driving motor power supply device for supplying power to a machine tool driving motor using a power semiconductor device module. In particular, it relates to a motor power supply device for driving a machine tool, which has a high cooling effect, easy temperature control, and improved reliability.
【０００２】[0002]
工作機械駆動モータ、特に、スピンドルモータやサーボモータは、電力用トラ ンジスタやフライホイールダイオード等が組み合わされてＰＷＭ回路等を構成し ており、大きさが１０ｃｍ角程度の電力用半導体装置モジュールによって給電さ れる場合が多い。電力用半導体装置モジュールは、その体積に比して、発熱量が 極めて大きいので、極めて大きなヒートシンクを有するか、強制風冷方式をもっ て強制的に冷却することゝされる場合が一般である。そして、強制風冷装置には 、サーモスタット等の温度検出手段を使用してなす自動温度制御手段が使用され ている。 Machine tool drive motors, especially spindle motors and servomotors, are composed of PWM circuits, etc. by combining power transistors, flywheel diodes, etc., and are fed by a power semiconductor device module of about 10 cm square. It is often touched. Since the power semiconductor device module has an extremely large amount of heat generation compared to its volume, it is common to have a very large heat sink or to be forcibly cooled by a forced air cooling method. The forced air cooling device uses automatic temperature control means using temperature detection means such as a thermostat.
【０００３】[0003]
ところで、電力用半導体装置モジュールは、発熱量に比して体積が小さいため 、その信頼性は使用温度に大きく依存し、使用温度が最大許容接合部温度（ジャ ンクション温度）を超えると、急激に劣化して性能が低下し、最悪の場合は破損 するに至る。 By the way, since the power semiconductor device module has a small volume compared to the amount of heat generation, its reliability greatly depends on the operating temperature, and when the operating temperature exceeds the maximum allowable junction temperature (junction temperature), it rapidly increases. It deteriorates and its performance deteriorates, and in the worst case, it breaks.
【０００４】 一方、自動温度制御手段を使用する強制風冷方式の電力用半導体装置モジュー ルの特性は周囲温度によって支配されるばかりでなく、制御応答速度が遅く温度 管理が困難であると云う欠点があり、また、電力用半導体装置モジュールを強電 盤に取り付ける場合、気密を保持するため複雑な構造を必要とすると云う欠点も ある。On the other hand, the characteristics of the forced-air-cooling type power semiconductor device module using the automatic temperature control means are not only controlled by the ambient temperature, but also the control response speed is slow and the temperature control is difficult. In addition, there is a drawback in that when a power semiconductor device module is attached to a strong board, a complicated structure is required to maintain airtightness.
【０００５】 本考案の目的は、これらの欠点を解消することにあり、冷却効果が高く、温度 管理が容易であり、取り扱いも容易であり、大容量化も可能であり、信頼性が向 上している工作機械駆動用モータ給電装置を提供することにある。An object of the present invention is to eliminate these drawbacks, a high cooling effect, easy temperature control, easy handling, large capacity, and improved reliability. The present invention is to provide a machine power supply device for driving a machine tool.
【０００６】[0006]
上記の目的は、工作機械用液冷式冷却手段（２）によって冷却されているヒー トシンク（３）を有する電力用半導体装置モジュール（１）を有する工作機械駆 動用モータ給電装置によって達成される。 The above object is achieved by a machine tool driving motor power supply apparatus having a power semiconductor device module (1) having a heat sink (3) cooled by a machine tool liquid cooling type cooling means (2).
【０００７】[0007]
本考案は、工作機械が本来工作機械本体冷却用油圧源を有することに着目して 、これを電力用半導体装置モジュールの冷却にも利用しようと云う着想を具体化 して完成したものであり、電力用半導体装置モジュールに貼着されたヒートシン クに冷却用油圧路を穿設して、こゝに冷却用油流を流し、高効率・高温度制御応 答速度をもって電力用半導体装置モジュールを冷却することゝしたものである。 The present invention was completed by focusing on the fact that the machine tool originally has a hydraulic pressure source for cooling the machine tool body, and embodying the idea of using this also for cooling the power semiconductor device module. The heat sink attached to the power semiconductor device module is provided with a cooling hydraulic passage, and a cooling oil flow is made to flow through this to cool the power semiconductor device module with high efficiency and high temperature control response speed. It is what you have done.
【０００８】[0008]
以下、図面を参照して、本考案の１実施例に係る工作機械駆動用モータ給電装 置を説明する。 Hereinafter, a machine tool driving motor power supply device according to an embodiment of the present invention will be described with reference to the drawings.
【０００９】 図１参照 図において、１は電力用半導体装置モジュールであり、電力用トランジスタや フライホイールダイオード等を含みＰＷＭ回路等を構成しており、通常１０ｃｍ 角程度の大きさである。３はそのヒートシンクであり、１１は電力用半導体装置 モジュール１を構成する各チップのパッド群であり、プリント板４に接続される 。Referring to FIG. 1, reference numeral 1 denotes a power semiconductor device module, which includes a power transistor, a flywheel diode, and the like to configure a PWM circuit and the like, and is usually about 10 cm square. Reference numeral 3 denotes the heat sink, and reference numeral 11 denotes a pad group of each chip constituting the power semiconductor device module 1, which is connected to the printed board 4.
【００１０】 ２は工作機械用液冷式冷却手段であり、下記のように構成される。２１は工作 機械本体冷却用油圧源であり、自動温度制御装置が設けられており、一定の低温 度の油圧が供給され、ポンプ５によって圧送された冷却油は、ヒートシンク３中 に穿設されている冷却用油圧路２２を通過してヒートシンク３を冷却した後、工 作機械本体の被冷却各部６を冷却し、その後、工作機械冷却用油圧源２１に還流 する。Reference numeral 2 denotes a liquid cooling type cooling means for machine tools, which is configured as follows. 21 is a hydraulic pressure source for cooling the main body of the machine tool, which is provided with an automatic temperature control device, is supplied with hydraulic pressure at a constant low temperature, and the cooling oil pumped by the pump 5 is bored in the heat sink 3. After the heat sink 3 is cooled by passing through the cooling hydraulic passage 22, the parts to be cooled 6 of the working machine body are cooled and then returned to the machine tool cooling hydraulic source 21.
【００１１】 ヒートシンク３は強電盤の中に配設され、ポンプ５及び工作機械本体の被冷却 各部６とそれぞれ連通する油圧路２３・２４が強電盤の盤壁を貫通するようにし ても、液冷系はすべて強電盤の盤外に配設し、ヒートシンク３が強電盤の盤壁を 貫通するようにしてもよい。The heat sink 3 is arranged in the high-power board, and even if the hydraulic paths 23 and 24 communicating with the pump 5 and the respective parts 6 to be cooled of the machine tool main body penetrate the board wall of the high-power board, All the cooling systems may be arranged outside the board of the high-power board, and the heat sink 3 may penetrate the board wall of the high-power board.
【００１２】 いづれの構造にあっても、液体は気体に比し、体積当り熱容量が大きいので、 冷却効果が大きく、温度制御応答性も良好である。In any structure, liquid has a larger heat capacity per volume than gas, so that the cooling effect is large and the temperature control response is also good.
【００１３】[0013]
以上説明したように、本考案に係る工作機械駆動用モータ給電装置は、工作機 械用液冷式冷却手段によって冷却されているヒートシンクを有する電力用半導体 装置モジュールを有するように構成されており、強制液冷方式は強制風冷方式に 比し、冷却効果が高く温度制御応答性も良好であるから、冷却効果が大きく、温 度管理が容易であり、取り扱いも容易であり、電力用半導体装置モジュールの信 頼性を向上し、大容量化を可能にすることができる。さらに、本考案に係る冷媒 は工作機械各部冷却用の油であるから、錆等を発生する懸念はなく、付加的冷媒 通路を必要とすることもなく、取り扱い上も安全である。 As described above, the motor power supply device for driving a machine tool according to the present invention is configured to have a power semiconductor device module having a heat sink cooled by a liquid cooling type cooling means for a machine tool, The forced liquid cooling method has a higher cooling effect and better temperature control response than the forced air cooling method, so the cooling effect is large, the temperature control is easy, and the handling is easy. The reliability of the module can be improved and the capacity can be increased. Further, since the refrigerant according to the present invention is an oil for cooling each part of the machine tool, there is no concern that rust or the like will be generated, no additional refrigerant passage is required, and it is safe in handling.
【００１４】 また、ヒートシンクが強電盤の盤壁を貫通することゝすれば、強電盤の小型化 にも貢献する。Further, if the heat sink penetrates the board wall of the heavy electric board, it contributes to downsizing of the heavy electric board.
【図１】本考案の１実施例に係る工作機械駆動用モータ
給電装置の概念的構成図である。FIG. 1 is a conceptual configuration diagram of a machine tool driving motor power feeding device according to an embodiment of the present invention.
１ 電力用半導体装置モジュール １１ パッド群 ２ 工作機械用液冷式冷却手 ２１ 工作機械冷却用油圧源 ２２ 冷却用油圧路 ２３・２４ 油圧路 ３ ヒートシンク ４ プリント板 ５ ポンプ ６ 工作機械本体被冷却各部 DESCRIPTION OF SYMBOLS 1 Semiconductor device module for electric power 11 Pad group 2 Liquid cooling type cooling machine for machine tool 21 Hydraulic power source for machine tool cooling 22 Hydraulic path for cooling 23/24 Hydraulic path 3 Heat sink 4 Printed board 5 Pump 6 Machine tool body Cooled parts
Claims (1)
て冷却されてなるヒートシンク（３）を有する電力用半
導体装置モジュール（１）を有することを特徴とする工
作機械駆動用モータ給電装置。1. A motor power supply device for driving a machine tool, comprising a power semiconductor device module (1) having a heat sink (3) cooled by a liquid cooling type machine tool cooling means (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP048004U JPH0717454U (en) | 1993-09-03 | 1993-09-03 | Motor power supply device for machine tool drive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP048004U JPH0717454U (en) | 1993-09-03 | 1993-09-03 | Motor power supply device for machine tool drive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0717454U true JPH0717454U (en) | 1995-03-28 |
Family
ID=12791164
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP048004U Pending JPH0717454U (en) | 1993-09-03 | 1993-09-03 | Motor power supply device for machine tool drive |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0717454U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000117521A (en) * | 1998-10-09 | 2000-04-25 | Hilti Ag | Machining device |
-
1993
- 1993-09-03 JP JP048004U patent/JPH0717454U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000117521A (en) * | 1998-10-09 | 2000-04-25 | Hilti Ag | Machining device |
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