JPH07167627A - Detector for external-size abnormality - Google Patents
Detector for external-size abnormalityInfo
- Publication number
- JPH07167627A JPH07167627A JP31673993A JP31673993A JPH07167627A JP H07167627 A JPH07167627 A JP H07167627A JP 31673993 A JP31673993 A JP 31673993A JP 31673993 A JP31673993 A JP 31673993A JP H07167627 A JPH07167627 A JP H07167627A
- Authority
- JP
- Japan
- Prior art keywords
- light
- light receiving
- diffraction pattern
- wire rod
- receiving sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Length Measuring Devices By Optical Means (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、線材や球体等の被検体
の外形寸法の異常を検出する外形寸法異常検出装置に関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an external dimension abnormality detecting device for detecting an abnormality in the external dimension of a subject such as a wire rod or a sphere.
【０００２】[0002]
【従来の技術】従来より、例えば糸やワイヤの線材の製
造工程や、例えば糸から布を織る工程や銅線を束ねて被
覆し電気ケーブルを製造する工程等、その線材を用いた
製品を製造する製造工程において、その長手方向に連続
的に送られてくる線材の外形寸法をチェックし、異常の
有無の検査を行なう検査工程が置かれている。この外形
寸法のチェックは線材に限らず球体やその他の形状の製
品検査においても行なわれている。2. Description of the Related Art Conventionally, for example, a process of manufacturing a wire material of a thread or a wire, a process of weaving a cloth from a thread, a process of bundling and covering copper wires to manufacture an electric cable, and manufacturing a product using the wire material. In the manufacturing process described above, there is an inspection process for checking the outer dimensions of the wire continuously fed in the longitudinal direction and inspecting for abnormalities. This external dimension check is performed not only for wire rods but also for product inspection of spheres and other shapes.
【０００３】従来、外形寸法のチェックを行なう手法と
して、例えば以下の手法が考えられている。図１６は、
外形寸法のチェックを行なう一手法を示した模式図であ
る。光源１０から発せられた光ビーム１１を矢印方向に
高速で回転する回転多面鏡１２で反射させ被検体１を横
切るようにその被検体１を走査し、その被検体１の背後
に配置された受光素子アレイ１３で受光し、その受光信
号に基づいて被検体１の影の部分の寸法が測定され、被
検体１の外形寸法の正常，異常が判定される。Conventionally, for example, the following method has been considered as a method for checking the external dimensions. 16
It is a schematic diagram showing one method of checking the external dimensions. A light beam 11 emitted from a light source 10 is reflected by a rotating polygon mirror 12 that rotates at a high speed in the direction of an arrow, and the subject 1 is scanned so as to cross the subject 1, and the light received behind the subject 1 is received. Light is received by the element array 13, and the size of the shaded portion of the subject 1 is measured based on the received light signal to determine whether the outer dimensions of the subject 1 are normal or abnormal.
【０００４】図１７は、外形寸法のチェックを行なうも
う１つの手法を示した模式図である。光源２０から発せ
られた発散光束２１がレンズ２２で平行光束２３に変換
され、レンズ２４を経由して受光素子アレイ２５上に照
射される。２つのレンズ２２，２４の中間に被検体１を
配置すると受光素子アレイ２５にその被検体１の影が形
成され、その影の寸法が測定されて被検体１の外形寸法
の正常，異常が判定される。FIG. 17 is a schematic diagram showing another method for checking the external dimensions. The divergent light beam 21 emitted from the light source 20 is converted into a parallel light beam 23 by the lens 22 and is irradiated onto the light receiving element array 25 via the lens 24. When the subject 1 is arranged between the two lenses 22 and 24, a shadow of the subject 1 is formed on the light-receiving element array 25, and the dimension of the shadow is measured to determine whether the outer dimension of the subject 1 is normal or abnormal. To be done.
【０００５】[0005]
【発明が解決しようとする課題】図１６，図１７に示し
た外形寸法をチェックする手法は、いずれも受光素子ア
レイ上に形成された被検体の影のエッジをとらえてその
影の寸法を測定し、その寸法から被検体の外形寸法の正
常，異常を検出する手法である。ところが、一例を挙げ
ると、糸から布を織る工程では、糸が例えば６０００ｍ
／分もの高速で織機に搬送されて布が織られており、そ
の糸の搬送の途中で、図１６，もしくは図１７に示す手
法を用いて糸の外形寸法のチェックを行なうことを考え
た場合、受光素子アレイの走査速度等の問題から例えば
約１０ｃｍおきにしか外形寸法を測定することができ
ず、検出の間隔が粗すぎるという問題がある。例えば上
述の布を織る工程を例にとると、高速で搬送されてきた
糸が切れると途中まで織った布が製品化できず多大の損
失となる場合があり、１０ｃｍおきどころが、常に連続
的にモニタしている必要がある。Both of the techniques for checking the external dimensions shown in FIGS. 16 and 17 measure the size of the shadow of the subject formed on the light-receiving element array by capturing the edge of the shadow. Then, it is a method of detecting whether the external dimensions of the subject are normal or abnormal from the dimensions. However, to give an example, in the process of weaving cloth from yarn, the yarn is, for example, 6000 m.
When the cloth is conveyed to the loom at a speed as high as 1 / min, and it is considered to check the external dimensions of the thread using the method shown in FIG. 16 or 17 during the conveyance of the thread. However, due to problems such as the scanning speed of the light-receiving element array, the external dimensions can be measured only every about 10 cm, and the detection interval is too coarse. For example, taking the above-mentioned cloth weaving process as an example, if the yarn conveyed at a high speed is broken, the cloth woven halfway may not be commercialized, resulting in a great loss. Need to be monitored.
【０００６】また、検出の間隔の問題とは別に、受光素
子アレイを構成する受光素子のピッチの問題から、寸法
の検出分解能が十分ではないという問題もある。本発明
は、上記事情に鑑み、被検体の外形寸法の異常を、従来
と比べ高速かつ高精度に検出することのできる外形寸法
異常検出装置を提供することを目的とする。In addition to the problem of the detection interval, there is also a problem that the dimensional detection resolution is not sufficient due to the problem of the pitch of the light receiving elements that form the light receiving element array. The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an external dimension abnormality detecting device capable of detecting an abnormality in the external dimension of a subject at a higher speed and with higher accuracy than in the past.
【０００７】[0007]
【課題を解決するための手段】上記目的を達成する本発
明の外形寸法異常検出装置は、 （１）所定の検出面上に被検体の回析パターンを形成す
る回折光学系 （２）検出面上に、被検体の外形寸法の変動により回折
パターンが伸縮する方向に互いに離れて配置された少な
くとも２つの受光センサ （３）受光センサそれぞれで得られた信号どうしの相違
を表す信号に基づいて被検体の外形寸法の正常、異常を
判定する信号処理部を備えたことを特徴とするものであ
る。The external dimension abnormality detecting apparatus of the present invention which achieves the above object is (1) a diffractive optical system for forming a diffraction pattern of an object on a predetermined detection surface (2) a detection surface Above, at least two light-receiving sensors arranged apart from each other in the direction in which the diffraction pattern expands and contracts due to fluctuations in the external dimensions of the subject. (3) Based on the signals representing the differences between the signals obtained by the light-receiving sensors, respectively. It is characterized in that it is provided with a signal processing unit for judging whether the external dimensions of the sample are normal or abnormal.
【０００８】ここで、上記２つの受光センサを、上記回
折パターンのうち、互いに同一次数の回折光を受光する
ように配置することが好ましい。Here, it is preferable that the two light receiving sensors are arranged so as to receive diffracted lights of the same order among the diffraction patterns.
【０００９】[0009]
【作用】上記本発明の外形寸法異常検出装置は、回析パ
ターンの移動を一対の受光センサで常にモニタするもの
であり、高精度かつ高分解能の検出が可能となる。また
信号処理部は、一対の受光センサの出力の差分の検出等
の簡単なアナログ処理ですむため、応答速度が速く、連
続的かつ高速な検出が可能となる。The above-mentioned apparatus for detecting an abnormality in external dimensions according to the present invention constantly monitors the movement of the diffraction pattern with a pair of light receiving sensors, and can detect with high accuracy and high resolution. Further, since the signal processing unit only needs to perform simple analog processing such as detection of the difference between the outputs of the pair of light receiving sensors, the response speed is fast and continuous and high speed detection is possible.
【００１０】[0010]
【実施例】ここでは先ず回折パターンの原理について説
明し、次いで本発明の実施例について説明する。図１
は、回折パターンを得る光学系の模式図、図２は線材の
回折パターンの模式図、図３は線材の回折パターンの強
度分布を表した図である。EXAMPLES First, the principle of the diffraction pattern will be described, and then examples of the present invention will be described. Figure 1
2 is a schematic diagram of an optical system for obtaining a diffraction pattern, FIG. 2 is a schematic diagram of a diffraction pattern of a wire, and FIG. 3 is a diagram showing an intensity distribution of the diffraction pattern of the wire.
【００１１】レーザ光３１をレンズ３２で平行光束に
し、レンズ３３で集光すると、そのレンズ３３の後側焦
点面（検出面）３４に、２つのレンズ３２，３３の間に
配置された被検体（ここでは線材２）の回折パターン３
０が観測される。この回折パターン３０の広がる方向
は、図２に示すように、線材２の延びる方向と直交する
方向である。When the laser light 31 is made into a parallel light flux by the lens 32 and is condensed by the lens 33, the subject positioned between the two lenses 32, 33 on the rear focal plane (detection surface) 34 of the lens 33. Diffraction pattern 3 of (here, wire 2)
0 is observed. The spreading direction of the diffraction pattern 30 is, as shown in FIG. 2, a direction orthogonal to the extending direction of the wire 2.
【００１２】ここで、もしレンズ３２，３３の間を通る
線材２の径が太くなると、図３（Ａ）に示すように回折
パターン３０が矢印Ａ方向に縮まり、線材２の径が細く
なると、図３（Ｂ）に示すように回折パターン３０が矢
印Ｂ方向に広がる。このように、回折パターン３０は、
線材２の太さに関係するが、線材２が２つのレンズ３
２，３３（図１参照）の間のどこを通過してもその回折
パターンおよびその回折パターンが形成される位置は不
変である。Here, if the diameter of the wire 2 passing between the lenses 32 and 33 becomes thicker, the diffraction pattern 30 shrinks in the direction of arrow A as shown in FIG. 3A, and if the diameter of the wire 2 becomes thinner, As shown in FIG. 3B, the diffraction pattern 30 spreads in the direction of arrow B. Thus, the diffraction pattern 30 is
Although it depends on the thickness of the wire rod 2, the lens 3 with two wire rods 2
The diffraction pattern and the position where the diffraction pattern is formed remain unchanged regardless of where the beam passes between 2, 33 (see FIG. 1).
【００１３】本発明は、この原理を応用したものである
が、受光センサに工夫があり、高速かつ高精度な外形寸
法異常検出を可能としたものである。図４は図１に示す
ような線材２の外形寸法の異常検出に用いられる受光セ
ンサの第１の実施例を示す正面図である。図１に示す検
出面３４に配置される基板４０上の、図３に示すような
回折パターン３０のうちの所定の次数の回折光、例えば
図３に示す１次回折光３０ａを受光する位置に、受光セ
ンサ４１ａと受光センサ４１ｂとからなる受光センサ対
４１が２対配置されている。ただし、図示のように２つ
の受光センサ４１ａどうしの出力は互いに接続されてお
り、また２つの受光センサ４１ｂどうしの出力も互いに
接続されている。Although the present invention is an application of this principle, the light receiving sensor is devised to enable high-speed and highly accurate external dimension abnormality detection. FIG. 4 is a front view showing a first embodiment of a light receiving sensor used for detecting an abnormality in the outer dimension of the wire 2 as shown in FIG. On the substrate 40 arranged on the detection surface 34 shown in FIG. 1, at a position for receiving diffracted light of a predetermined order in the diffraction pattern 30 as shown in FIG. 3, for example, first-order diffracted light 30a shown in FIG. Two light receiving sensor pairs 41 each including a light receiving sensor 41a and a light receiving sensor 41b are arranged. However, as shown in the figure, the outputs of the two light receiving sensors 41a are connected to each other, and the outputs of the two light receiving sensors 41b are also connected to each other.
【００１４】線材２が、レンズ３２，３３の間のどの位
置を通過しても回折パターン３０が形成される位置は不
変であるが、線材２が傾いて通過すると、回折パターン
３０も傾くことになる。この回折パターン３０が傾いて
も各受光センサ４１ａ，４１ｂに入射する光量が変化し
ないよう、各受光センサ４１ａ，４１ｂは、中心点０を
中心とした円弧状に形成されている。Although the position where the diffraction pattern 30 is formed does not change regardless of where the wire 2 passes between the lenses 32 and 33, when the wire 2 tilts and passes, the diffraction pattern 30 also tilts. Become. Each light receiving sensor 41a, 41b is formed in an arc shape centered on the center point 0 so that the amount of light incident on each light receiving sensor 41a, 41b does not change even if the diffraction pattern 30 is tilted.
【００１５】図５は、図４に示す基板４０が検出面３４
に配置され、そこに線材２の回折パターン３０が形成さ
れたときの、受光センサ４１ａ，４１ｂと１次回折光３
０ａとの位置関係を示した図である。図５（Ａ）は、線
材２が規定どおりの太さにある場合であり、受光センサ
対４１を構成する２つの受光センサ４１ａ，４１ｂは、
１次回折光を、互いに同一の光量だけ受光している。In FIG. 5, the substrate 40 shown in FIG.
When the diffraction pattern 30 of the wire 2 is formed on the light receiving sensors 41a and 41b and the first-order diffracted light 3
It is the figure which showed the positional relationship with 0a. FIG. 5A shows a case where the wire 2 has a prescribed thickness, and the two light receiving sensors 41a and 41b forming the light receiving sensor pair 41 are
The first-order diffracted light is received by the same amount of light.
【００１６】図５（Ｂ）は、図１に示す２つのレンズ３
２，３３の間を規定よりも太い線材２が通過している場
合であり、１次回折光３０ａが矢印Ａ方向に寄り、２つ
の受光センサ４１ａ，４１ｂのうち受光センサ４１ａ
に、より大光量の光が入射している。図５（Ｃ）は、図
１に示す２つのレンズ３２，３３の間を、規定よりも細
い線材２が通過している場合であり、１次回折光３０ａ
が矢印Ｂ方向に寄り、２つの受光センサ４１ａ，４１ｂ
のうち受光センサ４１ｂの方に、より大光量の光が入射
している。したがって２つの受光センサ４１ａ，４１ｂ
の受光信号どうしの差を演算することにより、線材２の
外形寸法の正常、異常を検出することができる。FIG. 5B shows the two lenses 3 shown in FIG.
In the case where the wire rod 2 thicker than the regulation is passing between 2 and 33, the first-order diffracted light 30a shifts in the direction of arrow A, and the light receiving sensor 41a of the two light receiving sensors 41a and 41b
A larger amount of light is incident on. FIG. 5C shows a case where the wire rod 2 thinner than the standard is passing between the two lenses 32 and 33 shown in FIG.
Is closer to the direction of arrow B, and the two light receiving sensors 41a and 41b
A larger amount of light is incident on the light receiving sensor 41b. Therefore, the two light receiving sensors 41a and 41b
By calculating the difference between the received light signals, it is possible to detect whether the outer dimensions of the wire 2 are normal or abnormal.
【００１７】図６は、図４に示す受光センサ４１ａ，４
１ｂと接続された、線材２の外形寸法の異常検出を行な
う信号処理回路を示した回路ブロック図である。図４に
示す受光センサ４１ａ，４１ｂによる各受光信号ＪA ，
ＪB がこの信号処理回路に入力され、受光信号ＪA は直
接に引算器５１に入力され、受光信号Ｊ B はアンプ５２
を経由してｘ倍された後、引算器５１に入力される。ア
ンプ５１は、線材２が規定どおりの寸法にあるときの、
２つの受光信号ＪA ，ＪB の差異を補正するためのもの
であり、ＪA ＝ｘＪB となるようにアンプ５２のゲイン
ｘが調整されている。FIG. 6 shows the light receiving sensors 41a, 4a shown in FIG.
1b is connected to the wire 2 to detect the external dimensions of abnormalities.
3 is a circuit block diagram showing a signal processing circuit. In Figure 4
Each light receiving signal J by the light receiving sensors 41a and 41b shownA ，
JB Is input to this signal processing circuit and the received light signal JA Is straight
It is input to the subtractor 51 immediately and the received light signal J B Is the amplifier 52
After being multiplied by x, the input is input to the subtractor 51. A
The pump 51 is provided when the wire rod 2 has a specified size.
Two received light signals JA , JB For correcting the difference in
And JA = XJB Gain of amplifier 52 so that
x is adjusted.
【００１８】引算器５１では、差分△Ｊ＝ＪA −ｘＪB
が演算されて、割算器５３に入力される。また、受光信
号ＪA ，アンプ５２を経由した受光信号ｘＪB は加算器
５４に入力されて互いに加算され、その加算結果ＪA ＋
ｘＪB が減算器５５で１／２に減衰され、これにより得
られた平均値＜Ｊ＞＝（ＪA ＋ｘＪB ）／２も割算器５
３に入力される。この平均値＜Ｊ＞は、レーザ光の光量
変化等をキャンセルするためのものであり、割算器５３
では、差分△Ｊが平均値＜Ｊ＞で割り算されて規格化さ
れた差分 △Ｊ／＜Ｊ＞＝（ＪA −ｘＪB ）／｛（ＪA ＋ｘＪB ）／２｝ が求められる。[0018] In subtracter 51, the difference △ J = J A -xJ B
Is calculated and input to the divider 53. Further, the received light signal J A and the received light signal xJ B passed through the amplifier 52 are input to the adder 54 and added to each other, and the addition result J A +
xJ B is attenuated to 1/2 by the subtractor 55, and the average value <J> = (J A + xJ B ) / 2 obtained by this is also divided by the divider 5
Input to 3. The average value <J> is for canceling a change in the light amount of the laser light, and the divider 53
In the difference △ J average value <J> is divided by normalized difference △ J / <J> = ( J A -xJ B) / {(J A + xJ B) / 2} is determined.
【００１９】この規格化された差分△Ｊ／＜Ｊ＞は、比
較器５４に入力される。この比較器５４には２つのしき
い値ＳH ，ＳL （ＳL ＜ＳH ）が設定されており、 ＳL ≦△Ｊ／＜Ｊ＞≦ＳH のときに、その線材２の太さは正常、 △Ｊ／＜Ｊ＞＜ＳL もしくは ＳH ＜△Ｊ／＜Ｊ＞ のときにその線材２の太さは異常であると判定される。The standardized difference ΔJ / <J> is input to the comparator 54. Two thresholds S H and S L (S L <S H ) are set in the comparator 54, and when S L ≦ ΔJ / <J> ≦ S H , the thickness of the wire 2 is increased. Is normal, and when ΔJ / <J><S L or SH <ΔJ / <J>, the thickness of the wire 2 is determined to be abnormal.
【００２０】この判定結果は比較器５４から出力され、
太さが異常であると判定された場合に警報等が発せられ
る等の処置が採られる。図７は、本発明の外形寸法異常
検出装置の受光センサの第２実施例を示す正面図であ
る。前述したように、線材２が傾くと、その回折パター
ン３０は、図７に示す中心点０を中心に回転する方向に
傾く。したがって、この第２実施例に示すように、外側
の受光センサ４１ｂの長さよりも内側の受光センサ４１
ａの長さの方が短くてすみ、そのような受光センサ４１
ａ，４１ｂを形成することにより内側の受光センサ４１
ａに、外側の受光センサ４１ｂと対応しない無駄な部分
が生じない。This determination result is output from the comparator 54,
If the thickness is determined to be abnormal, measures such as issuing an alarm are taken. FIG. 7 is a front view showing a second embodiment of the light receiving sensor of the external dimension abnormality detecting device of the present invention. As described above, when the wire 2 tilts, the diffraction pattern 30 tilts in the direction of rotation around the center point 0 shown in FIG. Therefore, as shown in the second embodiment, the light receiving sensor 41 on the inner side than the length of the light receiving sensor 41b on the outer side.
Since the length of a is shorter, such a light receiving sensor 41
By forming a and 41b, the inner light receiving sensor 41
There is no useless portion in a that does not correspond to the outer light receiving sensor 41b.
【００２１】図８は、本発明の外形寸法異常検出装置の
受光センサの第３の実施例を示す正面図である。中心点
０から離れるほど回折光強度が弱まる。この第３実施例
では、外側の受光センサ４１ｂの幅ＷB が内側の受光セ
ンサ４１ａの幅ＷA よりも幅広（ＷA ＜ＷB ）に形成さ
れているため、光量差が補償された受光信号を得ること
ができる。FIG. 8 is a front view showing a third embodiment of the light receiving sensor of the external dimension abnormality detecting device of the present invention. The diffracted light intensity becomes weaker as the distance from the center point 0 increases. In the third embodiment, since the width W B of the outer light receiving sensor 41b is wider than the width W A of the inner light receiving sensor 41a (W A <W B ), the light receiving with the light amount difference compensated is received. You can get a signal.
【００２２】図９は、本発明の外形寸法異常検出装置の
受光センサの第４実施例を示す正面図である。この第４
の実施例には、１次回折光３０ａを受光する位置に配置
された受光センサ対４１のほか、２次回折光３０ｂ（図
３参照）を受光する位置に配置された、受光センサ４２
ａと受光センサ４２ｂからなる受光センサ対４２が配置
されている。FIG. 9 is a front view showing a fourth embodiment of the light receiving sensor of the external dimension abnormality detecting device of the present invention. This 4th
In this embodiment, in addition to the light receiving sensor pair 41 arranged at the position for receiving the first-order diffracted light 30a, the light-receiving sensor 42 arranged at the position for receiving the second-order diffracted light 30b (see FIG. 3).
A light receiving sensor pair 42 including a and a light receiving sensor 42b is arranged.
【００２３】図３を参照して説明したように、線材２の
太さに応じて回折パターン３０が伸縮するが、その伸縮
の際、２次回折光３０ｂは１次回折光３０ａよりも大き
く移動する。図９に示す第４実施例では、１次回折光３
０ａを受光する位置と２次回折光３０ｂを受光する位置
との双方に受光センサ対４１，４２が配置されているた
め、そのいずれを使用するかに応じて検出感度を切り換
えることができる。As described with reference to FIG. 3, the diffraction pattern 30 expands and contracts according to the thickness of the wire rod 2. When the expansion and contraction occur, the second-order diffracted light 30b moves more than the first-order diffracted light 30a. In the fourth embodiment shown in FIG. 9, the first-order diffracted light 3
Since the light receiving sensor pairs 41 and 42 are arranged at both the position for receiving 0a and the position for receiving the second-order diffracted light 30b, the detection sensitivity can be switched depending on which one is used.
【００２４】図１０は、本発明の外形寸法異常検出装置
の受光センサの第５実施例を示す正面図、図１１は線材
の一部分を示した図である。図１０に示す第５実施例に
は、受光センサ対４１のほか図の左右に受光センサ４３
ａ，４３ｂ，４３ｃ，４３ｄが配置されている。被検体
としての線材２に、図１１に示すような凹凸２ａや毛羽
２ｂが存在すると、図１０の上下方向に広がる回折光の
みでなく、図１０の左右、もしくは斜めに広がる回折光
が発生する。その回折光を受光センサ４３ａ〜４３ｄで
捉えることにより、線材２の外形寸法のモニタのほか、
線材２の凹凸２ａや毛羽２ｂ、その他の形状の異常も検
出することができる。FIG. 10 is a front view showing a fifth embodiment of the light receiving sensor of the external dimension abnormality detecting device of the present invention, and FIG. 11 is a view showing a part of the wire rod. In the fifth embodiment shown in FIG. 10, in addition to the light receiving sensor pair 41, the light receiving sensors 43 are provided on the left and right of the drawing.
a, 43b, 43c, 43d are arranged. When the wire rod 2 as the subject has the unevenness 2a and the fluff 2b as shown in FIG. 11, not only the diffracted light that spreads in the vertical direction of FIG. 10 but also the diffracted light that spreads horizontally or obliquely in FIG. 10 is generated. . By capturing the diffracted light with the light receiving sensors 43a to 43d, in addition to monitoring the external dimensions of the wire rod 2,
It is possible to detect irregularities 2a and fluff 2b of the wire 2 and other abnormalities in the shape.
【００２５】図１２は、球体３を被検体とした場合の、
図１と同様な模式図である。２つのレンズ３２，３３の
間に球体３が配置されると、検出面３４上に同心円状の
回折パターン５０が形成される。球体３が真球を保った
ままその直径のみが変化すると、回折パターン５０は中
心点０に吸い込まれるように収縮しあるいは中心点０か
ら湧き出るように拡大する。また球体３が真球からずれ
楕円球状になると、回折パターン５０として、ゆがんだ
回折パターンが形成されることになる。FIG. 12 shows the case where the sphere 3 is used as the subject.
It is a schematic diagram similar to FIG. When the sphere 3 is arranged between the two lenses 32 and 33, a concentric diffraction pattern 50 is formed on the detection surface 34. If only the diameter of the sphere 3 changes while maintaining a perfect sphere, the diffraction pattern 50 contracts so as to be sucked into the center point 0 or expands so as to spring out from the center point 0. Further, when the spherical body 3 deviates from the true sphere and becomes an ellipsoidal shape, a distorted diffraction pattern is formed as the diffraction pattern 50.
【００２６】レンズ３２，３３の間の、球体３の配置位
置によっては回折パターン５０は不変であるため、例え
ば上方から多数の球体３を順次レンズ３２，３３の間を
通過するように落下させること等により、それら多数の
球体３の外形寸法の、正常，異常を順次判定することが
できる。図１３は、球体を被検体としたときの、受光セ
ンサの一例を示す正面図である。Since the diffraction pattern 50 does not change depending on the arrangement position of the sphere 3 between the lenses 32 and 33, for example, a large number of spheres 3 are dropped from above so as to sequentially pass between the lenses 32 and 33. Thus, it is possible to sequentially determine whether the external dimensions of the large number of spherical bodies 3 are normal or abnormal. FIG. 13 is a front view showing an example of a light receiving sensor when a sphere is the subject.
【００２７】この図１３に示す例では基板６０上の、１
次回折光を受光する位置に３対の受光センサ６１，６
２，６３、２次回折光を受光する位置に他の３対の受光
センサ対６４，６５，６６が備えられている。図１４
は、図１３に示す複数の受光センサ対の受光信号を入力
して球体３の外形寸法の正常，異常を判定する信号処理
回路の回路ブロック図である。In the example shown in FIG. 13, 1 on the substrate 60
Three pairs of light receiving sensors 61, 6 are provided at positions for receiving the second-order diffracted light.
The other three pairs of light receiving sensor pairs 64, 65, 66 are provided at the positions for receiving the 2, 63, and 2nd order diffracted light. 14
FIG. 14 is a circuit block diagram of a signal processing circuit that receives the light receiving signals of the plurality of light receiving sensor pairs shown in FIG. 13 and determines whether the outer dimensions of the sphere 3 are normal or abnormal.
【００２８】図１４に示す信号処理回路には、図６に示
す信号処理回路と同様な構成の信号処理回路が複数備え
られており、各受光センサ対６１〜６６で得られた受光
センサは、各個別の信号処理回路に入力されそれぞれ個
別に正常，異常が判定される。球体２が真球の場合は、
それらの受光センサ対６１〜６６の全てで同時に正常，
異常が検出されることになるが、球体２が真球からずれ
ると、ある受光センサ対の信号処理回路では正常と判定
され、他の受光センサ対の信号処理回路では異常と判定
される場合が生じる。そこで図１４に示す信号処理回路
には、アンド回路５５が備えられており、全ての個別の
信号処理回路で正常と判定された場合のみを正常、個別
の信号処理回路のうちのいずいれか１つででも異常と判
定された場合は異常と判定するように構成されている。The signal processing circuit shown in FIG. 14 is provided with a plurality of signal processing circuits having the same configuration as the signal processing circuit shown in FIG. 6, and the light receiving sensors obtained by the respective light receiving sensor pairs 61 to 66 are: The signal is input to each individual signal processing circuit and is individually judged as normal or abnormal. If sphere 2 is a true sphere,
All of the light receiving sensor pairs 61 to 66 are normal at the same time,
Although an abnormality will be detected, if the sphere 2 deviates from the true sphere, the signal processing circuit of a certain light receiving sensor pair may determine that it is normal, and the signal processing circuit of another light receiving sensor pair may determine that it is abnormal. Occurs. Therefore, the signal processing circuit shown in FIG. 14 is provided with an AND circuit 55, which is normal only when all the individual signal processing circuits are determined to be normal, and which one of the individual signal processing circuits is selected. If even one is determined to be abnormal, it is determined to be abnormal.
【００２９】図１５は、球体３の、互いに異なる方向か
らみた外形寸法の正常，異常を検出するように構成され
た光学系を示す模式図である。このように、被検体の外
形寸法の正常，異常をより正確に判定するために、複数
の方向の回析パターンを得、それら複数の方向の回析パ
ターンをモニタするように構成してもよい。FIG. 15 is a schematic diagram showing an optical system configured to detect normality and abnormality of the outer dimensions of the spherical body 3 when viewed from different directions. As described above, in order to more accurately determine whether the external dimensions of the subject are normal or abnormal, diffraction patterns in a plurality of directions may be obtained and the diffraction patterns in the plurality of directions may be monitored. .
【００３０】尚、上記実施例は線材もしくは球体を被検
体とする例であるが、本発明の外形寸法異常検出装置は
線材ないし球体を被検体とするものに限られるものでは
なく、その外形形状の規格が定まっているものであれば
どのような外形形状のものを被検体とすることもでき
る。また上記実施例では、１次回折光ないし２次回折光
を検出するものとして説明したが、本発明では１次回折
光ないし２次回折光を検出するものに限られるものでは
なく、３次回折光ないしそれ以上の次数の回折光を受光
するように構成してもよい。Although the above embodiment is an example in which a wire or a sphere is the subject, the external dimension abnormality detecting device of the present invention is not limited to the one in which the wire or the sphere is the subject, and its outer shape. Any external shape can be used as the subject as long as the standard is defined. Further, in the above-described embodiment, the description is made assuming that the first-order diffracted light or the second-order diffracted light is detected, but the present invention is not limited to the detection of the first-order diffracted light or the second-order diffracted light, and the third-order diffracted light or more is detected. It may be configured to receive diffracted light of the order.
【００３１】[0031]
【発明の効果】以上説明したように、本発明の外形寸法
異常検出装置は、回析パターンの移動を受光センサのペ
アで常にモニタするものであり、高精度かつ高分解能の
検出を、連続的にリアルタイムで行なうことができる。
また、本発明の外形寸法異常検出装置は、可動部分は不
要であり、また、ＣＣＤ等を受光センサアレイとして用
いた従来例と比べ処理回路が簡単ですみ、安価であり、
しかも長期に渡り高い信頼性が維持される。As described above, the external dimension abnormality detecting device of the present invention constantly monitors the movement of the diffraction pattern by a pair of light receiving sensors, and continuously detects highly accurate and high resolution detection. Can be done in real time.
Further, the external dimension abnormality detecting device of the present invention does not require a movable part, and has a simple processing circuit as compared with a conventional example using a CCD or the like as a light receiving sensor array, which is inexpensive,
Moreover, high reliability is maintained for a long time.
【図１】回折パターンを得る光学系の模式図である。FIG. 1 is a schematic diagram of an optical system that obtains a diffraction pattern.
【図２】線材の回折パターンの模式図である。FIG. 2 is a schematic diagram of a diffraction pattern of a wire.
【図３】線材の回折パターンの強度分布を表した図であ
る。FIG. 3 is a diagram showing an intensity distribution of a diffraction pattern of a wire.
【図４】図１に示すような線材の外形寸法の異常検出に
用いられる受光センサの第１の実施例を示す正面図であ
る。FIG. 4 is a front view showing a first embodiment of a light receiving sensor used for detecting an abnormality in the outer dimensions of a wire as shown in FIG.
【図５】図４に示す基板が検出面に配置され、そこに線
材の回折パターンが形成されたときの、受光センサと１
次回折光との位置関係を示した図である。5 is a diagram illustrating a light receiving sensor and a light receiving sensor when the substrate shown in FIG. 4 is arranged on a detection surface and a diffraction pattern of a wire is formed thereon.
It is the figure which showed the positional relationship with the next-order diffracted light.
【図６】図４に示す受光センサと接続される、線材の外
形寸法の異常検出を行なう信号処理回路を示した回路ブ
ロック図である。6 is a circuit block diagram showing a signal processing circuit that is connected to the light receiving sensor shown in FIG. 4 and performs abnormality detection of the outer dimension of a wire.
【図７】本発明の外形寸法異常検出装置の受光センサの
第２実施例を示す正面図である。FIG. 7 is a front view showing a second embodiment of the light receiving sensor of the external dimension abnormality detecting device of the present invention.
【図８】本発明の外形寸法異常検出装置の受光センサの
第３の実施例を示す正面図である。FIG. 8 is a front view showing a third embodiment of the light receiving sensor of the external dimension abnormality detecting device of the present invention.
【図９】本発明の外形寸法異常検出装置の受光センサの
第４実施例を示す正面図である。FIG. 9 is a front view showing a fourth embodiment of the light receiving sensor of the external dimension abnormality detecting device of the present invention.
【図１０】本発明の外形寸法異常検出装置の受光センサ
の第５実施例を示す正面図である。FIG. 10 is a front view showing a fifth embodiment of the light receiving sensor of the external dimension abnormality detecting device of the present invention.
【図１１】線材の一部分を示した図である。FIG. 11 is a diagram showing a part of a wire rod.
【図１２】球体を被検体とした場合の、図１と同様な模
式図である。FIG. 12 is a schematic view similar to FIG. 1 when a sphere is used as a subject.
【図１３】球体を被検体としたときの、受光センサの一
例を示す正面図である。FIG. 13 is a front view showing an example of a light receiving sensor when a sphere is used as a subject.
【図１４】図１３に示す複数の受光センサ対の受光信号
を入力して球体の外形寸法の正常，異常を判定する信号
処理回路の回路ブロック図である。FIG. 14 is a circuit block diagram of a signal processing circuit that receives the light receiving signals of the plurality of light receiving sensor pairs shown in FIG. 13 and determines whether the outer dimensions of the sphere are normal or abnormal.
【図１５】球体３の、互いに異なる方向からみた外形寸
法の正常，異常を検出するように構成された光学系を示
す模式図である。FIG. 15 is a schematic diagram showing an optical system configured to detect normality / abnormality of external dimensions of the spherical body 3 when viewed from different directions.
【図１６】外形寸法のチェックを行なう一手法を示した
模式図である。FIG. 16 is a schematic diagram showing a method for checking the external dimensions.
【図１７】外形寸法のチェックを行なうもう１つの手法
を示した模式図である。FIG. 17 is a schematic diagram showing another method for checking the external dimensions.
２ 線材 ３ 球体 ３０，５０ 回折パターン ３０ａ １次回折光 ３０ｂ ２次回折光 ３１ レーザ光 ３２，３３ レンズ ３４ 検出面 ４０，１６０ 基板 ４１，４２，６１，６２，…，６６ 受光センサ対 ４１ａ，４１ｂ，４２ａ，４２ｂ 受光センサ ５１ 引算器 ５０ アンプ ５４ 比較器 2 wire 3 spherical body 30,50 diffraction pattern 30a first-order diffracted light 30b second-order diffracted light 31 laser light 32,33 lens 34 detection surface 40,160 substrate 41,42,61,62, ..., 66 light-receiving sensor pair 41a, 41b, 42a , 42b Light receiving sensor 51 Subtractor 50 Amplifier 54 Comparator
Claims (2)
を形成する回折光学系と、 前記検出面上に、前記被検体の外形寸法の変動により前
記回折パターンが伸縮する方向に互いに離れて配置され
た少なくとも２つの受光センサと、 該受光センサそれぞれで得られた信号どうしの相違を表
す信号に基づいて前記被検体の外形寸法の正常、異常を
判定する信号処理部とを備えたことを特徴とする外形寸
法異常検出装置。1. A diffractive optical system that forms a diffraction pattern of a subject on a predetermined detection surface, and is separated from each other in the direction in which the diffraction pattern expands and contracts on the detection surface due to fluctuations in the outer dimensions of the subject. And at least two light receiving sensors arranged in parallel, and a signal processing unit that determines whether the external dimensions of the subject are normal or abnormal based on the signals representing the difference between the signals obtained by the respective light receiving sensors. External dimension abnormality detection device characterized by.
ーンのうち、互いに同一次数の回折光を受光するように
配置された受光センサであることを特徴とする請求項１
記載の外形寸法異常検出装置。2. The two light-receiving sensors are light-receiving sensors arranged so as to receive diffracted lights of the same order among the diffraction patterns.
External dimension abnormality detection device described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31673993A JPH07167627A (en) | 1993-12-16 | 1993-12-16 | Detector for external-size abnormality |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31673993A JPH07167627A (en) | 1993-12-16 | 1993-12-16 | Detector for external-size abnormality |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07167627A true JPH07167627A (en) | 1995-07-04 |
Family
ID=18080373
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31673993A Pending JPH07167627A (en) | 1993-12-16 | 1993-12-16 | Detector for external-size abnormality |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07167627A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE202008001018U1 (en) | 2008-01-29 | 2009-06-25 | Pepperl + Fuchs Gmbh | Sensor for the detection of objects by light diffraction |
| WO2019239845A1 (en) * | 2018-06-14 | 2019-12-19 | パナソニックＩｐマネジメント株式会社 | Object detection device and photodetector |
| CN112902852A (en) * | 2021-01-25 | 2021-06-04 | 上海兰宝传感科技股份有限公司 | Device and method for detecting size of micro object |
-
1993
- 1993-12-16 JP JP31673993A patent/JPH07167627A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE202008001018U1 (en) | 2008-01-29 | 2009-06-25 | Pepperl + Fuchs Gmbh | Sensor for the detection of objects by light diffraction |
| WO2009095193A1 (en) * | 2008-01-29 | 2009-08-06 | Pepperl + Fuchs Gmbh | Sensor for detecting objects by means of light diffraction |
| WO2019239845A1 (en) * | 2018-06-14 | 2019-12-19 | パナソニックＩｐマネジメント株式会社 | Object detection device and photodetector |
| JPWO2019239845A1 (en) * | 2018-06-14 | 2021-07-26 | パナソニックＩｐマネジメント株式会社 | Object detector and photodetector |
| CN112902852A (en) * | 2021-01-25 | 2021-06-04 | 上海兰宝传感科技股份有限公司 | Device and method for detecting size of micro object |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5309222A (en) | Surface undulation inspection apparatus | |
| US6922254B2 (en) | Method for measuring the diameter of an elongated article of a circular cross section | |
| JP3197529B2 (en) | Non-contact measurement method of wheel alignment characteristics and its measurement device | |
| US4583857A (en) | Apparatus for automatic optical property testing | |
| US4395119A (en) | Method for automatic, non-destructive measurement of eccentricity of coated electrodes | |
| GB2135769A (en) | Detecting faults in transparent objects | |
| US4906097A (en) | Imaging and inspection apparatus and method | |
| US5701173A (en) | Method and apparatus for reducing the unwanted effects of noise present in a three dimensional color imaging system | |
| JPH07167627A (en) | Detector for external-size abnormality | |
| US5414517A (en) | Method and apparatus for measuring the shape of glossy objects | |
| WO2007025350A1 (en) | Fibre assessment apparatus and method | |
| US5523844A (en) | Displacement detection apparatus | |
| CN101091426B (en) | Component shape profiling method and component mounting method | |
| EP1265051B1 (en) | A method of monitoring a moving linear textile formation and a device for carrying out the method | |
| JPH0226164B2 (en) | ||
| JP3570488B2 (en) | Measurement method of alloying degree of galvanized steel sheet using laser beam | |
| JPH02114146A (en) | Method and device for measuring crack length and strain in structure part and test piece | |
| WO2024004166A1 (en) | Distance measurement device | |
| JPH0769271B2 (en) | Defect inspection equipment | |
| JP2890942B2 (en) | Defect inspection equipment | |
| JPH1123239A (en) | Inspection apparatus | |
| JP2518484B2 (en) | Optical stranded wire flaw detection method and equipment | |
| JPH0486548A (en) | Packaged substrate appearance inspection device | |
| JPH05157700A (en) | Surface state inspecting device | |
| JPH0642168Y2 (en) | Smoothness / Glossiness meter |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20031216 |