JPH071601A - Optical element molding machine - Google Patents
Optical element molding machineInfo
- Publication number
- JPH071601A JPH071601A JP17218193A JP17218193A JPH071601A JP H071601 A JPH071601 A JP H071601A JP 17218193 A JP17218193 A JP 17218193A JP 17218193 A JP17218193 A JP 17218193A JP H071601 A JPH071601 A JP H071601A
- Authority
- JP
- Japan
- Prior art keywords
- thermocouple
- mold
- molding die
- die
- optical element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、成形型の温度測定を行
うための熱電対を備えた光学素子成形装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical element molding apparatus equipped with a thermocouple for measuring the temperature of a molding die.
【０００２】[0002]
【従来の技術】従来、成形型の温度測定が行える光学素
子成形装置としては、例えば特開昭６３−９５１３１号
公報および実開平４−２５８２４号公報記載の発明があ
る。特開昭６３−９５１３１号公報記載の発明において
は、ガラスプレス装置における金型の温度センサー部の
構造は温度センサー用の挿入穴に温度センサーを挿入し
て取り付けるものと考えられる。また、実開平４−２５
８２４号公報記載の発明においては、成形装置の成形型
に熱電対における測温接点および測温接点側素線が組み
込まれた構成になっている。2. Description of the Related Art Conventionally, as an optical element molding apparatus capable of measuring the temperature of a molding die, there are inventions described in, for example, JP-A-63-95131 and JP-A-4-25824. In the invention described in Japanese Patent Laid-Open No. 63-95131, it is considered that the structure of the temperature sensor part of the mold in the glass press device is one in which the temperature sensor is inserted into the insertion hole for the temperature sensor and attached. Also, the actual Kaihei 4-25
In the invention described in Japanese Patent No. 824, the molding die of the molding apparatus has a structure in which the temperature measuring contact and the temperature measuring contact side element wire in the thermocouple are incorporated.
【０００３】[0003]
【発明が解決しようとする課題】しかるに、前記特開昭
６３−９５１３１号公報記載のガラスプレス装置におい
ては、特に温度センサーの先端が挿入穴に密着していな
いと正確な温度測定はできず、成形品の形状精度ばらつ
きや、型とガラスとの融着を生ずる問題がある。However, in the glass press device described in JP-A-63-95131, accurate temperature measurement cannot be performed unless the tip of the temperature sensor is in close contact with the insertion hole. There are problems in that the precision of the shape of the molded product varies and the mold and glass are fused.
【０００４】また、前記実開平４−２５８２４号公報記
載の成形装置においては、熱電対の測温接点が成形型に
固着されているので、上記公報のように温度センサーと
成形型の間に空隙は生ずることがないため、温度の計測
精度は向上するが、熱電対が劣化して故障した場合には
簡単に熱電対を交換することができない問題がある。Further, in the molding apparatus described in Japanese Utility Model Laid-Open No. 4-25824, since the temperature measuring contact of the thermocouple is fixed to the molding die, there is a gap between the temperature sensor and the molding die as described in the above publication. Since this does not occur, the accuracy of temperature measurement is improved, but there is a problem that the thermocouple cannot be easily replaced when the thermocouple deteriorates and fails.
【０００５】因って、本発明は前記従来技術における問
題点に鑑みて開発されたもので、熱電対による成形型の
温度計測精度の保証ができるとともに、熱電対の交換が
簡単に行うことのできる光学素子成形装置を提供するこ
とを目的とする。Therefore, the present invention was developed in view of the above problems in the prior art, and it is possible to guarantee the accuracy of temperature measurement of a molding die by a thermocouple and to easily replace the thermocouple. It is an object of the present invention to provide an optical element molding device that can be used.
【０００６】[0006]
【課題を解決するための手段】本発明は、温度測定を行
うための熱電対を成形型内部に設けた光学素子成形装置
において、成形型と型保持部とを着脱可能に密着固定す
る固定機構を設けるとともに、前記熱電対と型保持部と
の間に耐熱性弾性部材を介して該熱電対先端を成形型内
部に密着させる機構を設けて構成したものである。SUMMARY OF THE INVENTION The present invention relates to an optical element molding apparatus in which a thermocouple for temperature measurement is provided inside a molding die, and a fixing mechanism for detachably and closely fixing the molding die and the die holding portion. And a mechanism for bringing the tip of the thermocouple into close contact with the inside of the molding die via a heat resistant elastic member between the thermocouple and the die holding portion.
【０００７】[0007]
【作用】本発明では、成形中の成形型の温度計測を常に
正確に行うことができるとともに、成形型と型保持部と
の密着固定機構を解除することにより熱電対の交換を簡
単に行うことができる。According to the present invention, the temperature of the molding die during molding can always be measured accurately, and the thermocouple can be easily replaced by releasing the close contact fixing mechanism between the molding die and the mold holding portion. You can
【０００８】[0008]
【実施例１】図１〜図３は本実施例を示し、図１は装置
の断面図、図２は成形型の断面図、図３は型保持部と熱
電対の断面図である。１はＳｉＣ，ＡｌＮ，ＢＮ等のセ
ラミック材料，超硬合金および耐熱性ステンレス材料等
から形成された成形型で、この成形型１の上端面１ａは
所望の成形品に対応した形状に鏡面加工されている。成
形型１の下端面１ｂには第１の穴１ｃ，第２の穴１ｄ，
第３の穴１ｅが３段階に順次それらの内径が小さくなる
ように設けられている。なお、第３の穴１ｅの内径は該
第３の穴１ｅに挿入される熱電対４の外径値に対して僅
かに大きい内径に仕上げられている。また、第３の穴１
ｅの最深部は、成形面１ａに近接して形成されている。Embodiment 1 FIGS. 1 to 3 show this embodiment, FIG. 1 is a sectional view of an apparatus, FIG. 2 is a sectional view of a molding die, and FIG. 3 is a sectional view of a die holding portion and a thermocouple. Reference numeral 1 denotes a molding die formed of a ceramic material such as SiC, AlN, BN, etc., a cemented carbide, a heat resistant stainless steel material, etc. The upper end surface 1a of this molding die 1 is mirror-finished into a shape corresponding to a desired molded product. ing. The lower end surface 1b of the mold 1 has a first hole 1c, a second hole 1d,
The third holes 1e are provided so that their inner diameters are successively reduced in three steps. The inner diameter of the third hole 1e is slightly larger than the outer diameter of the thermocouple 4 inserted into the third hole 1e. Also, the third hole 1
The deepest part of e is formed close to the molding surface 1a.
【０００９】２は型保持部で、この型保持部２の中央に
設けられた熱電対用穴２ａからは前記熱電対４が突き出
されている。熱電対用穴２ａから突き出た熱電対４の側
面には円筒状の当接部材５がその上端面部付近を溶接さ
れることにより固定されている。当接部材５と型保持部
材２の型当てつけ面２ｂとの間には、Ｎｉ系合金や耐熱
性ステンレス等の耐熱性を有する材料からなる皿バネ６
が介在している。この状態で、前記型当てつけ面２ｂか
ら突き出た熱電対４の長さＬは、成形型１の下端面１ｂ
から第３の穴１ｅの最深部までの深さｌよりやや長くな
るように設定する。Reference numeral 2 denotes a mold holding portion, and the thermocouple 4 is projected from a thermocouple hole 2a provided at the center of the mold holding portion 2. A cylindrical contact member 5 is fixed to the side surface of the thermocouple 4 protruding from the thermocouple hole 2a by welding the vicinity of the upper end surface portion thereof. A disc spring 6 made of a heat-resistant material such as a Ni-based alloy or heat-resistant stainless steel is provided between the contact member 5 and the mold pressing surface 2b of the mold holding member 2.
Is intervening. In this state, the length L of the thermocouple 4 protruding from the mold contact surface 2b is determined by the lower end surface 1b of the molding die 1.
It is set to be slightly longer than the depth 1 from to the deepest part of the third hole 1e.
【００１０】次に、嵌合内径部２ｃに前記成形型１の嵌
合外径部１ｆを嵌合させた後、型固定部材３の固定用ネ
ジ部３ａを型保持部２の固定用ネジ部２ｄにねじ込ん
で、型押さえ部３ｂを成形型１のフランジ部１ｇに当て
つけて固定する。Next, after fitting the fitting outer diameter portion 1f of the molding die 1 to the fitting inner diameter portion 2c, the fixing screw portion 3a of the die fixing member 3 is fixed to the die holding portion 2. It is screwed into 2d, and the mold pressing portion 3b is fixed to the flange portion 1g of the molding die 1 by applying it.
【００１１】以上の構成から成る装置は、熱電対４の突
出し長さＬが第３の穴１ｅの深さｌより長く設定されて
いるので、型保持部２内に成形型１をセットした時に、
Ｌ−ｌだけ皿バネ６が弾性変形して縮み、熱電対４の先
端部４ａが第３の穴１ｅの最深部に密着する。In the apparatus having the above construction, since the protruding length L of the thermocouple 4 is set longer than the depth 1 of the third hole 1e, when the molding die 1 is set in the die holding portion 2. ,
The disc spring 6 elastically deforms and contracts by Ll, and the tip portion 4a of the thermocouple 4 comes into close contact with the deepest portion of the third hole 1e.
【００１２】本実施例によれば、成形型１の成形面１ａ
の近傍の温度を正確に計測することができる。また、型
固定部材３を外して成形型１を取り去れば、熱電対４は
開放されるので、熱電対４の交換を容易に行うことがで
きる。According to this embodiment, the molding surface 1a of the molding die 1 is
The temperature in the vicinity of can be accurately measured. Further, when the mold fixing member 3 is removed and the molding die 1 is removed, the thermocouple 4 is opened, so that the thermocouple 4 can be easily replaced.
【００１３】[0013]
【実施例２】本実施例は、前記実施例１における当接部
材５と成形型１との線膨張係数を変更したものであり、
他の構成は同一な構成から成るもで、図１を用いて説明
する。前記実施例１と異なる点は、当接部材５の線膨張
係数を成形型１の線膨張係数より大きくしたことであ
る。このような組み合わせとして、表１の材料の例が挙
げられる。[Embodiment 2] In this embodiment, the coefficient of linear expansion between the contact member 5 and the molding die 1 in Embodiment 1 is changed.
Other configurations are the same, and will be described with reference to FIG. The difference from the first embodiment is that the linear expansion coefficient of the contact member 5 is made larger than that of the mold 1. Examples of such a combination include the materials in Table 1.
【００１４】[0014]
【表１】 [Table 1]
【００１５】上記構成の装置は、成形型１を型保持部２
にセットした状態で成形型１を図示していない加熱ヒー
タにより所定の温度に昇温すると、成形型１よりも当接
部材５の方が線膨張係数が大きいので、膨張差分だけ熱
間でさらに皿バネ６が縮む。In the apparatus having the above-mentioned structure, the molding die 1 is attached to the die holding portion 2
When the molding die 1 is heated to a predetermined temperature by a heater (not shown) in the state of being set to, the contact member 5 has a larger linear expansion coefficient than the molding die 1, and therefore the expansion difference is hot. The disc spring 6 contracts.
【００１６】本実施例によれば、熱電対４の先端部４ａ
と第３の穴１ｅの最深部との密着状態がより確実にな
る。According to this embodiment, the tip portion 4a of the thermocouple 4 is
The state of close contact with the deepest part of the third hole 1e becomes more reliable.
【００１７】尚、表１に挙げた材料の組み合わせはこれ
に限定されるものではなく、上記構成要件を満たせばよ
いことは言うまでもない。また、ここに挙げた材料以外
でも構成し得る。It is needless to say that the combination of materials listed in Table 1 is not limited to this, and may satisfy the above structural requirements. In addition, the materials other than those listed here may be used.
【００１８】[0018]
【実施例３】図４および図５は本実施例を示し、図４は
装置の断面図、図５は型保持部と熱電対の断面図であ
る。前記実施例１と異なる点は、成形型１の第２の穴１
ｄの形成を廃止したことと、型保持部２の型当てつけ面
２ｂ中央に弾性体当接穴２ｅを形成したこと、皿バネ６
の代わりに耐熱性バネ７が当接部材５と弾性体当接面２
ｆとの間に介在していることである。耐熱性バネ７の材
質としては、ＺｒＯ2 ，Ｓｉ3 Ｎ4 のセラミックやイン
コネル等の耐熱性合金を用いることができる。Third Embodiment FIGS. 4 and 5 show the present embodiment, FIG. 4 is a sectional view of an apparatus, and FIG. 5 is a sectional view of a mold holding portion and a thermocouple. The difference from the first embodiment is that the second hole 1 of the molding die 1 is used.
The formation of d is abolished, and the elastic body contact hole 2e is formed in the center of the mold pressing surface 2b of the mold holding portion 2.
Instead of the heat-resistant spring 7, the heat-resistant spring 7 and the elastic member contact surface 2
That is, it is interposed between f and As a material of the heat resistant spring 7, a heat resistant alloy such as ZrO 2 , Si 3 N 4 ceramics or Inconel can be used.
【００１９】本実施例の作用は、前記実施例１の作用と
同様であり、作用の説明を省略する。The operation of this embodiment is similar to that of the first embodiment, and the description of the operation is omitted.
【００２０】本実施例によれば、型保持部２内に当接部
材５が位置するので、成形型１に形成すべき穴加工を簡
略化できる。According to this embodiment, since the abutting member 5 is located in the die holding portion 2, it is possible to simplify the processing of holes to be formed in the forming die 1.
【００２１】[0021]
【発明の効果】以上説明した様に、本発明に係る光学素
子成形装置によれば、成形型の温度計測精度の保証がで
きるとともに、熱電対の交換が簡単に行える。As described above, according to the optical element molding apparatus of the present invention, the temperature measurement accuracy of the molding die can be guaranteed and the thermocouple can be easily replaced.
【図１】実施例１を示す断面図である。FIG. 1 is a cross-sectional view showing a first embodiment.
【図２】実施例１を示す断面図である。FIG. 2 is a cross-sectional view showing a first embodiment.
【図３】実施例１を示す断面図である。FIG. 3 is a cross-sectional view showing the first embodiment.
【図４】実施例２を示す断面図である。FIG. 4 is a sectional view showing a second embodiment.
【図５】実施例２を示す断面図である。FIG. 5 is a cross-sectional view showing a second embodiment.
１ 成形型 ２ 型保持部 ３ 型固定部材 ４ 熱電対 ５ 当接部材 ６ 皿バネ ７ 耐熱性バネ 1 Mold 2 Mold holding 3 Mold fixing member 4 Thermocouple 5 Abutment member 6 Disc spring 7 Heat resistant spring
Claims (1)
部に設けた光学素子成形装置において、成形型と型保持
部とを着脱可能に密着固定する固定機構を設けるととも
に、前記熱電対と型保持部との間に耐熱性弾性部材を介
して該熱電対先端を成形型内部に密着させる機構を設け
て構成したことを特徴とする光学素子成形装置。1. In an optical element molding apparatus in which a thermocouple for measuring temperature is provided inside a molding die, a fixing mechanism for detachably and closely fixing the molding die and a die holding portion is provided, and the thermocouple is connected to the thermocouple. An optical element molding apparatus, characterized in that a mechanism for bringing the tip of the thermocouple into close contact with the inside of the molding die via a heat resistant elastic member is provided between the die holding portion and the die holding portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17218193A JP3296892B2 (en) | 1993-06-18 | 1993-06-18 | Optical element molding equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17218193A JP3296892B2 (en) | 1993-06-18 | 1993-06-18 | Optical element molding equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH071601A true JPH071601A (en) | 1995-01-06 |
| JP3296892B2 JP3296892B2 (en) | 2002-07-02 |
Family
ID=15937084
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17218193A Expired - Fee Related JP3296892B2 (en) | 1993-06-18 | 1993-06-18 | Optical element molding equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3296892B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010116297A (en) * | 2008-11-13 | 2010-05-27 | Canon Inc | Apparatus for manufacturing optical element, and method for manufacturing the same |
-
1993
- 1993-06-18 JP JP17218193A patent/JP3296892B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010116297A (en) * | 2008-11-13 | 2010-05-27 | Canon Inc | Apparatus for manufacturing optical element, and method for manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3296892B2 (en) | 2002-07-02 |
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