JPH07157575A - Prepreg for printed circuit board and multi-layer printed circuit board - Google Patents
Prepreg for printed circuit board and multi-layer printed circuit boardInfo
- Publication number
- JPH07157575A JPH07157575A JP5304501A JP30450193A JPH07157575A JP H07157575 A JPH07157575 A JP H07157575A JP 5304501 A JP5304501 A JP 5304501A JP 30450193 A JP30450193 A JP 30450193A JP H07157575 A JPH07157575 A JP H07157575A
- Authority
- JP
- Japan
- Prior art keywords
- prepreg
- printed circuit
- printed wiring
- circuit board
- glass fiber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、たて／よこ異方性が小
さく、寸法安定性に優れた印刷配線板用プリプレグ及び
多層印刷配線板に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a prepreg for printed wiring boards and a multilayer printed wiring board which have small vertical / horizontal anisotropy and are excellent in dimensional stability.
【０００２】[0002]
【従来の技術】印刷配線板の高密度化に伴い、多層印刷
配線板、銅張積層板等には様々な優れた特性が要求され
ている。特に高多層化、スルーホールの小径化等の促進
によって、ドリル加工性の良好な印刷配線板用プリプレ
グ及び寸法安定性の優れた多層印刷配線板、銅張積層板
が要求されている。2. Description of the Related Art With the increasing density of printed wiring boards, various excellent characteristics are required for multilayer printed wiring boards, copper clad laminates and the like. In particular, due to an increase in the number of layers and a reduction in the diameter of through holes, there is a demand for a prepreg for a printed wiring board having good drilling workability, a multilayer printed wiring board having excellent dimensional stability, and a copper clad laminate.
【０００３】一般に多層印刷配線板は、回路を形成した
内層板と、印刷配線板用プリプレグを組合せ積層し、加
熱加圧することによって製造される。小径ドリル加工、
高密度の回路加工にとって時寸法安定性は、重要な特性
となっている。寸法安定性を向上させることによってド
リル穴あけ時の位置ずれを小さくでき、また多層プレス
後の回路形成位置合わせも精確にできる。Generally, a multilayer printed wiring board is manufactured by combining and laminating an inner layer board on which a circuit is formed and a prepreg for a printed wiring board, and heating and pressing. Small diameter drilling,
Time-dimensional stability is an important characteristic for high-density circuit processing. By improving the dimensional stability, it is possible to reduce the positional deviation during drilling, and it is also possible to accurately align the circuit formation after multilayer pressing.
【０００４】寸法安定性を向上させる手段としては、特
開昭５９−１２４９０号公報に積層プレス後に積層板を
加熱することにより歪みをとる方法が開示され、また特
開昭５９−６４３４９号公報には、印刷配線板用プリプ
レグ製造に用いるガラス繊維織布のたて糸とよこ糸の打
ち込み本数差を０から５本の範囲内とする方法が開示さ
れている。As a means for improving the dimensional stability, JP-A-59-12490 discloses a method of removing strain by heating a laminated plate after laminating press, and JP-A-59-64349. Discloses a method in which the difference in the number of warp yarns and weft yarns of a glass fiber woven fabric used for producing a prepreg for a printed wiring board is set within a range of 0 to 5.
【０００５】[0005]
【発明が解決しようとする課題】しかし、積層板を加熱
することによって歪みをとり寸法安定性をとる方法は、
新たに加熱処理工程を加えなければならず、製造時間が
増えるうえ熱エネルギーも消費する。打ち込み本数差を
０から５本の範囲内とする方法は、寸法安定性に効果が
あるものの、プリプレグ１枚で内層板を製造する際や層
間接着用プリプレグ枚数を１枚とするような厚み１ｍｍ
以下の薄い多層印刷配線板製造においては、たて、よこ
異方性が大きくなるという問題が発生する。However, the method of removing strain by heating the laminated plate to obtain dimensional stability is as follows.
A new heat treatment process must be added, which increases the manufacturing time and consumes heat energy. The method of setting the difference in the number of punched rods within the range of 0 to 5 has an effect on dimensional stability, but when manufacturing the inner layer board with one prepreg or when the number of prepregs for interlayer adhesion is set to 1 mm, the thickness is 1 mm.
In the following thin multilayer printed wiring board production, there arises a problem that the vertical and horizontal anisotropy becomes large.
【０００６】特に、印刷配線板用プリプレグの重さが２
０ｇ／ｍ2から１７０ｇ／ｍ2のプリプレグは、重さ１８
０ｇ／ｍ2から２００ｇ／ｍ2のプリプレグに対し剛性が
小さくなることからたて、よこ異方性が大きくなる傾向
を示し、高密度回路を形成しにくいといった問題点が発
生していた。Particularly, the weight of the prepreg for the printed wiring board is 2
A prepreg of 0 g / m 2 to 170 g / m 2 has a weight of 18
Since the rigidity becomes small with respect to the prepreg of 0 g / m 2 to 200 g / m 2 , there is a tendency that the lateral anisotropy becomes large, and it is difficult to form a high-density circuit.
【０００７】本発明は、厚さ１ｍｍ以下の薄い多層印刷
配線板においても寸法安定性に優れ、たて、よこ異方性
を小さくできる印刷配線板用プリプレグと該プリプレグ
を使用した多層印刷配線板に関する。The present invention provides a prepreg for a printed wiring board which is excellent in dimensional stability even in a thin multilayer printed wiring board having a thickness of 1 mm or less and which can reduce the vertical anisotropy, and a multilayer printed wiring board using the prepreg. Regarding
【０００８】[0008]
【課題を解決するための手段】本発明は、たて、よこの
織密度比を、たて／よこ＝０．６７から０．９０とし且
つ、重さが２０ｇ／ｍ2から１１０ｇ／ｍ2であるガラス
繊維織布を用いた印刷配線板用プリプレグ及び該プリプ
レグを使用した多層印刷配線板であるAccording to the present invention, the warp and weft density ratio is set to warp / weft = 0.67 to 0.90 and the weight is 20 g / m 2 to 110 g / m 2. A prepreg for a printed wiring board using the woven glass fiber fabric and a multilayer printed wiring board using the prepreg.
【０００９】本発明に使用される樹脂又は樹脂組成物と
しては、熱硬化性樹脂、熱可塑性樹脂が用いられる。熱
硬化性樹脂としては、エポキシ樹脂及びその組成物、ポ
リイミド樹脂及びその組成物、シアネート樹脂及びその
組成物、フェノール樹脂及びその組成物、ポリエステル
樹脂及びその組成物等がある。また、エポキシ樹脂とし
ては、ビスフェノールＡ型エポキシ樹脂、ビスフェノー
ルＦ型エポキシ樹脂、ビスフェノールＳ型エポキシ樹
脂、フェノールノボラック型エポキシ樹脂、クレゾール
ノボラック型エポキシ樹脂、脂環式エポキシ樹脂、グリ
シジルエステル型エポキシ樹脂、グリシジルアミン型エ
ポキシ樹脂、ヒダントイン型エポキシ樹脂、イソシアネ
ート型エポキシ樹脂、及びそれらのハロゲン化物、水素
添加物などがあり数種類を併用することもできる。また
前記樹脂を混合する方法、温度には制限はない。As the resin or resin composition used in the present invention, a thermosetting resin or a thermoplastic resin is used. Examples of the thermosetting resin include epoxy resin and its composition, polyimide resin and its composition, cyanate resin and its composition, phenolic resin and its composition, polyester resin and its composition, and the like. As the epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, alicyclic epoxy resin, glycidyl ester type epoxy resin, glycidyl There are amine-type epoxy resins, hydantoin-type epoxy resins, isocyanate-type epoxy resins, and halides and hydrogenates thereof, and several types can be used together. There is no limitation on the method of mixing the resin and the temperature.
【００１０】熱可塑性樹脂としては、テフロン樹脂及び
その組成物、ポリエチレン、ポリプロピレン及びその組
成物がある。The thermoplastic resin includes Teflon resin and its composition, polyethylene, polypropylene and its composition.
【００１１】ガラス繊維の種類としては、重さ２０ｇ／
ｍ2から１１０ｇ／ｍ2のものを用いる。理由は、重さが
軽くなるほど寸法変化に影響をあたえるためである。The type of glass fiber weighs 20 g /
m 2 to 110 g / m 2 is used. The reason is that the lighter the weight, the more it affects the dimensional change.
【００１２】ガラス繊維のフィラメント径は０．００２
ｍｍから０．００８ｍｍが好ましい。理由は、フィラメ
ント径が細いほど剛性がなく、寸法変化に影響をあたえ
るためである。The filament diameter of the glass fiber is 0.002
mm to 0.008 mm is preferable. The reason is that the smaller the filament diameter is, the less rigid it is, which affects the dimensional change.
【００１３】ガラス繊維織布の織密度は、たて／よこ＝
０．６７から０．９０にする必要がある。織密度を前述
の数値とすることにより寸法収縮率を小さくできるため
に、たて、よこ異方性を小さくすることができる。Woven density of glass fiber woven fabric is warp / width =
It is necessary to change from 0.67 to 0.90. Since the dimensional shrinkage can be reduced by setting the weaving density to the above-mentioned numerical value, the warp anisotropy can be reduced.
【００１４】[0014]
【作用】織密度比をたて／よこ＝０．６７から０．９０
とすることにより、たてよりよこの織本数を多くする
と、たて方向の寸法収縮率を小さくできるため寸法変化
安定性が向上する。Function: Warp density ratio warp / weft = 0.67 to 0.90
As a result, when the number of weaves of the warp is increased, the dimensional shrinkage ratio in the warp direction can be reduced, so that the dimensional change stability is improved.
【００１５】[0015]
実施例１ 以下の物質を合成しワニスを得た。 ビスフェノールＡノボラック型エポキシ樹脂 ８５重量部 ビスフェノールＡノボラック樹脂 １５重量部 ジシアンジアミド １．９重量部 イミダゾール ０．１８重量部 メチルセロソルブ ３０重量部 メチルエチルケトン １．０重量部 該ワニスをフィラメント径５μｍ、重さ４８ｇ／ｍ2、
織密度比たて／よこ＝０．８３のガラス織布に含浸し、
印刷配線板用プリプレグを得た。両面に回路加工がされ
ている内層回路板の両側に該印刷配線板用プリプレグを
１枚づつ配置し、更にその両側に厚さ３５μｍ銅はくを
配置した後、温度１７５℃、加熱加圧１００分、加圧３
０ｋｇ／ｃｍ2の条件で加圧加熱し４層板を得た。Example 1 The following substances were synthesized to obtain a varnish. Bisphenol A novolac type epoxy resin 85 parts by weight Bisphenol A novolac resin 15 parts by weight Dicyandiamide 1.9 parts by weight Imidazole 0.18 parts by weight Methyl cellosolve 30 parts by weight Methyl ethyl ketone 1.0 parts by weight The varnish has a filament diameter of 5 μm and a weight of 48 g / m 2 ,
Woven density ratio Warp / width = 0.83 impregnated with a glass woven cloth,
A prepreg for a printed wiring board was obtained. The printed wiring board prepregs are arranged on both sides of the inner layer circuit board having the circuit processing on both sides, and copper foil having a thickness of 35 μm is arranged on both sides of the prepreg. Min, pressurization 3
A 4-layer plate was obtained by heating under pressure under the condition of 0 kg / cm 2 .
【００１６】実施例２ 実施例１に使用したワニスをフィラメント径７μｍ、重
さ１０７ｇ／ｍ2、織密度比たて／よこ＝０．８４のガ
ラス織布に含浸し、実施例１と同様にして４層板を得
た。Example 2 A glass woven fabric having a filament diameter of 7 μm, a weight of 107 g / m 2 , and a weaving density ratio of warp / weft = 0.84 was impregnated with the varnish used in Example 1, and the same procedure as in Example 1 was performed. A four-layer board was obtained.
【００１７】実施例３ 内層回路板の両側に印刷配線板用プリプレグを２枚づつ
配置した以外実施例１と同様にして４層板を得た。Example 3 A four-layer board was obtained in the same manner as in Example 1 except that two prepregs for printed wiring boards were arranged on both sides of the inner layer circuit board.
【００１８】比較例１ 織密度比たて／よこ＝１．２５とした以外実施例１と同
様にして４層板を得た。Comparative Example 1 A four-layer board was obtained in the same manner as in Example 1 except that the weaving density ratio warp / weft = 1.25.
【００１９】比較例２ 織密度比たて／よこ＝１．１８とした以外実施例２と同
様にして４層板を得た。Comparative Example 2 A four-layer board was obtained in the same manner as in Example 2 except that the weaving density ratio warp / weft = 1.18.
【００２０】比較例３ 内層回路板の両側に印刷配線板用プリプレグを２枚づつ
配置した以外比較例１と同様にして４層板を得た。Comparative Example 3 A four-layer board was obtained in the same manner as Comparative Example 1 except that two prepregs for printed wiring boards were arranged on both sides of the inner layer circuit board.
【００２１】実施例１に使用したワニスをフィラメント
径９μｍ、重さ２０９ｇ／ｍ2、織密度比たて／よこ＝
１．２９のガラス織布に含浸し印刷配線板用プリプレグ
を得た以外実施例１と同様にして４層板を得た。The varnish used in Example 1 had a filament diameter of 9 μm, a weight of 209 g / m 2 , and a weaving density ratio warp / width =
A 4-layer board was obtained in the same manner as in Example 1 except that the woven glass cloth of 1.29 was impregnated to obtain a prepreg for a printed wiring board.
【００２２】実施例、比較例について４層板のたてとよ
この寸法変化を測定し、結果を表１に示す。For the examples and comparative examples, the dimensional changes of the vertical and horizontal four-layer plates were measured, and the results are shown in Table 1.
【００２３】[0023]
【表１】 [Table 1]
【００２４】表１の補足説明 たて、よこの寸法変化の基準値を内層板の回路形成用フ
ィルムとし、該基準値を初期値として寸法変化を測定し
た。またσは標準偏差を示す。Supplementary explanation of Table 1 Further, the reference value of the dimensional change was used as the circuit forming film of the inner layer plate, and the dimensional change was measured with the reference value as the initial value. Further, σ indicates a standard deviation.
【００２５】[0025]
【発明の効果】本発明によれば、たて／よこ異方性が小
さく、寸法安定性に優れた印刷配線板用プリプレグ及び
多層印刷配線板を得ることができる。According to the present invention, it is possible to obtain a prepreg for printed wiring boards and a multilayer printed wiring board having small vertical / horizontal anisotropy and excellent dimensional stability.
Claims (3)
＝０．６７から０．９０とし且つ、重さが２０ｇ／ｍ2
から１１０ｇ／ｍ2であるガラス繊維織布を用いた印刷
配線板用プリプレグ。1. The warp weave density ratio is set to warp / weft = 0.67 to 0.90 and the weight is 20 g / m 2.
To 110 g / m 2 of woven glass fiber prepreg for printed wiring boards.
２から０．００８ｍｍである請求項１記載の印刷配線板
用プリプレグ。2. The glass fiber filament diameter is 0.00
The prepreg for a printed wiring board according to claim 1, which has a thickness of 2 to 0.008 mm.
板用プリプレグを用いた多層印刷配線板。3. A multilayer printed wiring board using the prepreg for a printed wiring board according to claim 1 or 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5304501A JPH07157575A (en) | 1993-12-06 | 1993-12-06 | Prepreg for printed circuit board and multi-layer printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5304501A JPH07157575A (en) | 1993-12-06 | 1993-12-06 | Prepreg for printed circuit board and multi-layer printed circuit board |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002263808A Division JP2003163462A (en) | 2002-09-10 | 2002-09-10 | Prepreg for printed wiring board and multilayer printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07157575A true JPH07157575A (en) | 1995-06-20 |
Family
ID=17933796
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5304501A Pending JPH07157575A (en) | 1993-12-06 | 1993-12-06 | Prepreg for printed circuit board and multi-layer printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07157575A (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5498968A (en) * | 1978-01-12 | 1979-08-04 | Citizen Watch Co Ltd | Watch circuit board |
| JPS54108270A (en) * | 1978-02-13 | 1979-08-24 | Mitsubishi Gas Chemical Co | Method of producing multiilayer printed circuit board |
| JPS58210690A (en) * | 1982-05-31 | 1983-12-07 | 松下電工株式会社 | Thin film copper-lined laminated board |
| JPS5964349A (en) * | 1982-10-04 | 1984-04-12 | 松下電工株式会社 | Glass-cloth base material laminated board |
| JPS59231893A (en) * | 1983-06-14 | 1984-12-26 | 日立化成工業株式会社 | Method of producing multilayer printed circuit board |
| JPH02144992A (en) * | 1988-11-28 | 1990-06-04 | Sumitomo Bakelite Co Ltd | Multilayer copper-plated laminated board incorporating internal-layer circuit |
| JPH04274381A (en) * | 1991-03-01 | 1992-09-30 | Arisawa Mfg Co Ltd | Glass fiber woven fabric and printed circuit board using the same fabric |
| JPH06254848A (en) * | 1993-03-02 | 1994-09-13 | Ube Ind Ltd | Thermoplastic prepreg fabric and laminate from the same |
| JPH06272135A (en) * | 1993-03-22 | 1994-09-27 | Unitika Ltd | Woven fabric of glass yarn for multi-layer printed-wiring board and prepreg for multi-layer printed-wiring board |
-
1993
- 1993-12-06 JP JP5304501A patent/JPH07157575A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5498968A (en) * | 1978-01-12 | 1979-08-04 | Citizen Watch Co Ltd | Watch circuit board |
| JPS54108270A (en) * | 1978-02-13 | 1979-08-24 | Mitsubishi Gas Chemical Co | Method of producing multiilayer printed circuit board |
| JPS58210690A (en) * | 1982-05-31 | 1983-12-07 | 松下電工株式会社 | Thin film copper-lined laminated board |
| JPS5964349A (en) * | 1982-10-04 | 1984-04-12 | 松下電工株式会社 | Glass-cloth base material laminated board |
| JPS59231893A (en) * | 1983-06-14 | 1984-12-26 | 日立化成工業株式会社 | Method of producing multilayer printed circuit board |
| JPH02144992A (en) * | 1988-11-28 | 1990-06-04 | Sumitomo Bakelite Co Ltd | Multilayer copper-plated laminated board incorporating internal-layer circuit |
| JPH04274381A (en) * | 1991-03-01 | 1992-09-30 | Arisawa Mfg Co Ltd | Glass fiber woven fabric and printed circuit board using the same fabric |
| JPH06254848A (en) * | 1993-03-02 | 1994-09-13 | Ube Ind Ltd | Thermoplastic prepreg fabric and laminate from the same |
| JPH06272135A (en) * | 1993-03-22 | 1994-09-27 | Unitika Ltd | Woven fabric of glass yarn for multi-layer printed-wiring board and prepreg for multi-layer printed-wiring board |
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