JPH07155985A - Solder composition - Google Patents
Solder compositionInfo
- Publication number
- JPH07155985A JPH07155985A JP5340025A JP34002593A JPH07155985A JP H07155985 A JPH07155985 A JP H07155985A JP 5340025 A JP5340025 A JP 5340025A JP 34002593 A JP34002593 A JP 34002593A JP H07155985 A JPH07155985 A JP H07155985A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- acid
- org
- powder
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は半田組成物に関するもの
であって、特に電子回路基板のパッド表面に薄い半田被
膜を形成し、半田によるメッキを施すのに適した半田組
成物に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder composition, and more particularly to a solder composition suitable for forming a thin solder coating on the pad surface of an electronic circuit board and plating with solder. .
【０００２】[0002]
【従来の技術】従来電子回路基板においてパッドの表面
に薄い半田メッキを施し、パッド表面の銅が酸化したり
腐蝕したりするのを防止することが行われている。2. Description of the Related Art Conventionally, in electronic circuit boards, the surface of pads is thinly plated with solder to prevent the copper on the pads from being oxidized or corroded.
【０００３】そしてそのための半田組成物としては、半
田粉末とフラックスとを混合したソルダペーストや、錫
粉末と有機酸鉛塩とフラックスとをペースト状に混合し
た反応性半田組成物が使用されている。As a solder composition therefor, a solder paste in which solder powder and flux are mixed and a reactive solder composition in which tin powder, organic acid lead salt and flux are mixed in paste form are used. .
【０００４】[0004]
【発明が解決しようとする課題】しかしながら前記ソル
ダペーストや反応性半田組成物を使用して半田メッキを
施す場合、半田被膜の厚みが大きいときには十分に均一
な被膜が形成されるが、２０μｍ程度の薄い被膜を形成
すると、半田の表面張力により半田がパッドの一部に集
中し、厚みにばらつきが生じたり、局部的に半田被膜が
切れてパッドの銅が露出することがある。However, when solder plating is performed using the above-mentioned solder paste or reactive solder composition, a sufficiently uniform film is formed when the thickness of the solder film is large, but about 20 μm. When a thin film is formed, the solder may be concentrated on a part of the pad due to the surface tension of the solder, resulting in uneven thickness, or the solder film may be locally cut off to expose the copper of the pad.
【０００５】ＱＦＰのような幅の狭いパッドにおいては
かかる問題点は少いが、特に円形や方形などの大きな面
積を有するパッドの場合には、その全体に亙って均一な
厚みの半田メッキを形成することが困難である。Although such a problem is less likely to occur in a pad having a narrow width such as QFP, especially in the case of a pad having a large area such as a circle or a square, solder plating having a uniform thickness is used throughout the pad. Difficult to form.
【０００６】本発明はかかる事情に鑑みなされたもので
あって、回路基板のパッド上に薄い均一な半田被膜を形
成することができる半田組成物を提供することを目的と
するものである。The present invention has been made in view of the above circumstances, and an object thereof is to provide a solder composition capable of forming a thin and uniform solder coating on a pad of a circuit board.
【０００７】[0007]
【課題を解決する手段】而して本願第一の発明は、半田
粉末とフラックスとを混合してなるソルダペーストにお
いて、有機酸銅塩を添加したことを特徴とするものであ
る。The first invention of the present application is characterized by adding an organic acid copper salt to a solder paste obtained by mixing solder powder and flux.
【０００８】本発明におけるソルダペーストとしては、
通常回路基板のパッドに半田被膜を形成するために使用
されるソルダペーストを、そのまま使用することがで
き、それに有機酸銅塩を添加する。As the solder paste in the present invention,
The solder paste normally used to form the solder coating on the pads of the circuit board can be used as is, to which the organic acid copper salt is added.
【０００９】また本願第二の発明は、錫又は半田の粉末
と有機酸鉛塩とを含む反応性半田組成物において、有機
酸銅塩を添加したことを特徴とするものである。The second invention of the present application is characterized in that an organic acid copper salt is added to a reactive solder composition containing tin or solder powder and an organic acid lead salt.
【００１０】この第二の発明において、反応性半田組成
物は、錫又は半田の粉末と有機酸鉛塩とを含み、これを
加熱することにより有機酸鉛塩と金属錫との間にイオン
交換反応を生じ、金属鉛を析出して当該金属鉛と金属錫
とで半田合金を形成し、パッド表面に半田被膜を形成す
るものである。In the second invention, the reactive solder composition contains tin or solder powder and an organic acid lead salt, and is heated to ion-exchange between the organic acid lead salt and metallic tin. A reaction is caused, metallic lead is deposited, a solder alloy is formed by the metallic lead and metallic tin, and a solder film is formed on the pad surface.
【００１１】これらの発明において、有機酸銅塩を構成
する有機酸としては、ロジン、ナフテン酸又はそれらの
誘導体が適当であるが、その他ステアリン酸、オレイン
酸、ネオデカン酸、セバシン酸、フマル酸などの脂肪族
カルボン酸や、安息香酸、フタル酸、イソフタル酸、ト
リメリット酸、ピロメリット酸などの芳香族カルボン酸
などを使用することができる。In these inventions, rosin, naphthenic acid or derivatives thereof are suitable as the organic acid constituting the organic acid copper salt, but other stearic acid, oleic acid, neodecanoic acid, sebacic acid, fumaric acid, etc. The aliphatic carboxylic acids, aromatic carboxylic acids such as benzoic acid, phthalic acid, isophthalic acid, trimellitic acid, and pyromellitic acid can be used.
【００１２】また前記有機酸銅塩の添加量は、当該有機
酸銅塩中の銅が、半田組成物に対して０．０２〜２．０
重量％程度となるようにするのが適当である。The amount of the organic acid copper salt added is such that the copper in the organic acid copper salt is 0.02 to 2.0 with respect to the solder composition.
It is suitable to set it to about the weight%.
【００１３】銅の量として０．０２重量％含まれていれ
ば一応の効果があると認められるが、好ましくは０．１
重量％以上含むのが良い。It is recognized that if the amount of copper contained is 0.02% by weight, the effect is temporary, but preferably 0.1.
It is better to contain more than weight%.
【００１４】また銅の量として２．０重量％を越える
と、加熱時に析出した銅が半田に溶解し、半田の共晶点
が上昇し、半熔融状態となるため、パッド表面に適切な
半田層を形成することができない。If the amount of copper exceeds 2.0% by weight, the copper deposited during heating is dissolved in the solder, the eutectic point of the solder rises, and a semi-molten state occurs, so that a suitable solder is applied to the pad surface. No layers can be formed.
【００１５】[0015]
【作用】本発明においては、半田組成物を回路基板のパ
ッドに塗布し、これを加熱することにより、有機酸銅塩
と半田合金又は錫又は半田の粉末との間でイオン交換反
応を生じ、微細な金属銅の粉末を析出する。In the present invention, the solder composition is applied to the pad of the circuit board and heated to cause an ion exchange reaction between the organic acid copper salt and the solder alloy or tin or solder powder, Precipitate a fine powder of metallic copper.
【００１６】一方、第一の発明においては、加熱により
半田粉末が熔融する。また第二の発明においては、有機
酸鉛塩と錫又は半田の粉末との間でイオン交換反応を生
じ、金属鉛が析出して、錫と鉛との合金すなわち半田合
金を生じると共に、当該半田合金は加熱により熔融す
る。On the other hand, in the first invention, the solder powder is melted by heating. In the second invention, an ion exchange reaction occurs between the organic acid lead salt and tin or solder powder, and metallic lead is deposited to form an alloy of tin and lead, that is, a solder alloy, and The alloy melts when heated.
【００１７】而して析出した金属銅は極めて清浄である
ため半田の濡れ性に優れており、当該金属銅の微粉末が
熔融半田中に分散することにより熔融半田の表面張力が
低下し、パッドの表面に薄く拡がることができる。Since the metal copper thus deposited is extremely clean, the wettability of the solder is excellent. When the fine powder of the metal copper is dispersed in the molten solder, the surface tension of the molten solder is lowered and the pad Can spread thinly on the surface of.
【００１８】[0018]
【発明の効果】本発明によれば、大きい面積のパッドの
表面に半田が薄く拡がることができ、薄く且つ均一な厚
みの半田被膜を形成することができると共に、部分的に
半田が切れてパッドの銅が露出するようなことがない。According to the present invention, the solder can be spread thinly on the surface of a pad having a large area, and a thin solder coating having a uniform thickness can be formed. The copper is never exposed.
【００１９】従って本発明の半田組成物で半田被膜を形
成した回路基板は、パッドの表面が均一に半田で被覆さ
れ、酸化や腐蝕を生じることがないと共に、さらに半田
を積み増すことにより優れた半田付け性を有するものと
なる。Therefore, the circuit board on which the solder coating is formed by the solder composition of the present invention has the surface of the pad uniformly coated with the solder, which does not cause oxidation or corrosion, and is excellent by further stacking the solder. It has solderability.
【００２０】なおソルダペーストや反応性半田組成物に
銅粉末を添加することにより、ニッケルなどに対する半
田の濡れ性を改善することが行われており、かかる半田
組成物においても本発明と同様の効果を生じると考えら
れる。It should be noted that by adding copper powder to the solder paste or the reactive solder composition, the wettability of the solder with respect to nickel or the like has been improved, and such a solder composition also has the same effect as the present invention. It is believed that
【００２１】しかしながらこのものにおいては、銅の粒
子径が大きいために半田被膜に凹凸が生じ易く、また微
細なピッチのＱＦＰパッドなどにおいてブリッジを生じ
易いという欠点を有している。[0021] However, this one has the drawback that since the copper particle size is large, unevenness is likely to occur in the solder coating, and bridges are likely to occur in QFP pads with a fine pitch.
【００２２】[0022]
ソルダペーストの調製 次の配合でソルダペーストを調製した。 Preparation of Solder Paste A solder paste was prepared with the following composition.
【００２３】 半田粉末（錫／鉛＝６５〜３５、平均粒子径１０μｍ） ４０．０重量％ ロジン ３０．０重量％ トリエタノールアミン ５．０重量％ ワックス ３．０重量％ 溶剤（ブチルカルビトール） ２２．０重量％Solder powder (tin / lead = 65 to 35, average particle size 10 μm) 40.0% by weight Rosin 30.0% by weight Triethanolamine 5.0% by weight Wax 3.0% by weight Solvent (butyl carbitol) 22.0% by weight
【００２４】反応性半田組成物の調製 次の配合で反応性半田組成物を調製した。Preparation of Reactive Solder Composition A reactive solder composition was prepared with the following formulation.
【００２５】 錫粉末（平均粒子径１０μｍ） ２５．４重量％ ロジン酸鉛 ３２．３重量％ ロジン １０．０重量％ トリエタノールアミン ５．０重量％ セルロース ８．０重量％ ワックス ３．０重量％ 溶剤（ミネラルスピリット） １６．３重量％Tin powder (average particle size 10 μm) 25.4% by weight Lead rosinate 32.3% by weight Rosin 10.0% by weight Triethanolamine 5.0% by weight Cellulose 8.0% by weight Wax 3.0% by weight Solvent (mineral spirits) 16.3% by weight
【００２６】有機酸銅塩の添加 前記ソルダペースト及び反応性半田組成物に、それぞれ
ロジン酸銅塩を添加した。ロジン酸銅塩の添加量は、当
該ロジン酸銅塩中の銅の量が、ソルダペースト又は反応
性半田組成物１００重量部に対して、０．１重量部、
０．５重量部、１．０重量部、５．０重量部、１０．０
重量部となるようにした。Addition of Organic Acid Copper Salt A rosin acid copper salt was added to each of the solder paste and the reactive solder composition. The amount of copper rosin acid salt added is such that the amount of copper in the copper rosin acid salt is 0.1 parts by weight with respect to 100 parts by weight of the solder paste or reactive solder composition.
0.5 parts by weight, 1.0 parts by weight, 5.0 parts by weight, 10.0
It was made to be a weight part.
【００２７】半田被膜の形成 上記ソルダペースト及び反応性半田組成物を、直径１０
mmの円形パッドを有する基板に２００μｍ厚みで塗布
し、２２０℃で２分間加熱してリフローを行って、パッ
ド上に半田層を形成した。Formation of Solder Film The above solder paste and reactive solder composition were treated with a diameter of 10
It was applied to a substrate having a circular pad of mm with a thickness of 200 μm, heated at 220 ° C. for 2 minutes and reflowed to form a solder layer on the pad.
【００２８】試験結果 パッド上に形成された半田層について、その平均厚み
（μｍ）を測定した。また目視により半田層の厚みのば
らつき状態を観察し、部分的に生じた半田切れの数を数
えた。Test Results The average thickness (μm) of the solder layer formed on the pad was measured. Further, the state of variation in the thickness of the solder layer was visually observed, and the number of partially broken solders was counted.
【００２９】試験の結果を表１に示す。The results of the test are shown in Table 1.
【００３０】なお前記実施例におけるロジン酸銅塩に代
えて、ステアリン酸銅及び酢酸銅を使用したものについ
ても実験を行ったが、ロジン酸銅塩を使用した場合と殆
ど同様の結果が得られた。Experiments were also conducted using copper stearate and copper acetate instead of the copper rosin acid salt in the above-mentioned examples, but almost the same results were obtained as when copper rosin acid salt was used. It was
【００３１】[0031]
【表１】 ＊ 銅の量が５〜１０部添加したものは、生じた錫−鉛
−銅の合金の共晶点が上昇し、均一に熔融しないため、
適切な半田層が形成されない。[Table 1] * When the amount of copper added is 5 to 10 parts, the eutectic point of the resulting tin-lead-copper alloy rises and the alloy does not melt uniformly.
The proper solder layer is not formed.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 藤原 孝浩 兵庫県加古川市野口町水足671番地の４ ハリマ化成株式会社中央研究所内 (72)発明者 城石 弘和 東京都千代田区丸の内２丁目６番１号 古 河電気工業株式会社内 (72)発明者 福永 隆男 東京都千代田区丸の内２丁目６番１号 古 河電気工業株式会社内 (72)発明者 日笠 和人 東京都千代田区丸の内２丁目６番１号 古 河電気工業株式会社内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Takahiro Fujiwara 4 671 Mizukushi, Noguchi-cho, Kakogawa-shi, Hyogo Prefecture Central Research Laboratory, Harima Kasei Co., Ltd. (72) Hirokazu Shiroishi, 2-6-1, Marunouchi, Chiyoda-ku, Tokyo Issue Furukawa Electric Co., Ltd. (72) Inventor Takao Fukunaga 2-6-1, Marunouchi, Chiyoda-ku, Tokyo Furukawa Electric Co., Ltd. (72) Inventor Kazuto Hikasa 2-6, Marunouchi, Chiyoda-ku, Tokyo No. 1 inside Furukawa Electric Co., Ltd.
Claims (3)
ソルダペーストにおいて、有機酸銅塩を添加したことを
特徴とする、半田組成物1. A solder composition, wherein an organic acid copper salt is added to a solder paste prepared by mixing solder powder and flux.
反応性半田組成物において、有機酸銅塩を添加したこと
を特徴とする、半田組成物2. A reactive solder composition containing tin or solder powder and an organic acid lead salt, wherein an organic acid copper salt is added.
の銅が、半田組成物の０．０２〜２．０重量％であるこ
とを特徴とする、半田組成物3. The solder composition according to claim 1, wherein copper in the organic acid copper salt is 0.02 to 2.0% by weight of the solder composition.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34002593A JP3392924B2 (en) | 1993-12-06 | 1993-12-06 | Solder composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34002593A JP3392924B2 (en) | 1993-12-06 | 1993-12-06 | Solder composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07155985A true JPH07155985A (en) | 1995-06-20 |
| JP3392924B2 JP3392924B2 (en) | 2003-03-31 |
Family
ID=18333029
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP34002593A Expired - Lifetime JP3392924B2 (en) | 1993-12-06 | 1993-12-06 | Solder composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3392924B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6923875B2 (en) | 2002-02-28 | 2005-08-02 | Harima Chemicals, Inc. | Solder precipitating composition |
| US7569164B2 (en) * | 2007-01-29 | 2009-08-04 | Harima Chemicals, Inc. | Solder precoating method |
| US7798389B2 (en) | 2002-02-15 | 2010-09-21 | Harima Chemicals, Inc. | Flux for soldering, soldering method, and printed circuit board |
-
1993
- 1993-12-06 JP JP34002593A patent/JP3392924B2/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7798389B2 (en) | 2002-02-15 | 2010-09-21 | Harima Chemicals, Inc. | Flux for soldering, soldering method, and printed circuit board |
| US6923875B2 (en) | 2002-02-28 | 2005-08-02 | Harima Chemicals, Inc. | Solder precipitating composition |
| US7569164B2 (en) * | 2007-01-29 | 2009-08-04 | Harima Chemicals, Inc. | Solder precoating method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3392924B2 (en) | 2003-03-31 |
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| Date | Code | Title | Description |
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