JPH07153507A - Connector surface mounting mechanism - Google Patents
Connector surface mounting mechanismInfo
- Publication number
- JPH07153507A JPH07153507A JP5317514A JP31751493A JPH07153507A JP H07153507 A JPH07153507 A JP H07153507A JP 5317514 A JP5317514 A JP 5317514A JP 31751493 A JP31751493 A JP 31751493A JP H07153507 A JPH07153507 A JP H07153507A
- Authority
- JP
- Japan
- Prior art keywords
- connector
- fitting groove
- pad
- pad surface
- rib
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明はコネクタ表面実装機構、
とりわけSMT(表面実装技術)対応のコネクタの実装
機構に関するものである。BACKGROUND OF THE INVENTION The present invention relates to a connector surface mounting mechanism,
In particular, the present invention relates to a mounting mechanism of an SMT (surface mounting technology) compatible connector.
【0002】[0002]
【従来の技術】この種の表面実装型コネクタの回路基板
への実装において、従来広く知られる技術は、図9に示
す、実開平3ー52964号公報で開示されているもの
がある。同図において、回路基板P表面に装着されるコ
ネクタ110は、絶縁ハウジング111両側面にネジ留
部を有し、絶縁ハウジング111後面から突出する複数
の接触子112を備える。複数の接触子112は回路基
板Pに平行に伸展してクランク状に下方に屈曲し、回路
基板Pのパッド面P1に接触する接続面113を備え
る。2. Description of the Related Art A widely known conventional technique for mounting a surface mount type connector on a circuit board is disclosed in Japanese Utility Model Laid-Open No. 52964/1993. In the figure, the connector 110 mounted on the surface of the circuit board P has screw retaining portions on both side surfaces of the insulating housing 111 and includes a plurality of contacts 112 protruding from the rear surface of the insulating housing 111. The plurality of contacts 112 include a connection surface 113 that extends in parallel with the circuit board P, bends downward in a crank shape, and contacts the pad surface P1 of the circuit board P.
【0003】さらに、接続面113先端には下方に伸び
る突条部114が設けられている。一方、回路基板Pの
パッド面P1に貫通孔を設け、突条部114をこの貫通
孔に挿入する。接続に際しては、予めクリーム半田をパ
ッド面P1に塗布したのちコネクタ110の各接触子1
12の接続面113が対応するパッド面P1に接面する
ように位置づけた後、ネジ116にてコネクタ110を
回路基板Pに螺着させ、半田溶接がなされるものであ
る。Further, a ridge 114 extending downward is provided at the tip of the connecting surface 113. On the other hand, a through hole is provided on the pad surface P1 of the circuit board P, and the protrusion 114 is inserted into this through hole. At the time of connection, after applying cream solder to the pad surface P1 in advance, each contact 1 of the connector 110
After the connection surfaces 113 of the twelve are positioned so as to be in contact with the corresponding pad surface P1, the connector 110 is screwed onto the circuit board P with the screws 116, and solder welding is performed.
【0004】[0004]
【発明が解決しようとする課題】前述のように、従来技
術では、回路基板へのコネクタの配設後、リフロー炉等
での半田付け加工に先立って、両者を取付けるべく図1
0に示すように、ネジ116による係合を行なうのが常
である。しかし、この締め付け作業によって、ハウジン
グ111がネジ116を軸として共に回動し、この回動
によって、接触子112が位置移動し、この結果、接触
子112先端の突条部114には、ネジ116を中心と
する円軌道上を移動する力Rが働く。As described above, according to the prior art, after the connector is arranged on the circuit board and before the soldering process in the reflow furnace or the like, both of them are mounted as shown in FIG.
As shown in FIG. However, due to this tightening work, the housing 111 rotates together with the screw 116 as an axis, and this rotation causes the contact 112 to move in position. As a result, the screw 116 is attached to the ridge 114 at the tip of the contact 112. A force R that moves on a circular orbit centered at is applied.
【0005】これはパッド面P1の貫通孔に仮封入され
ていた接触子112の突条部114の細孔からの逸脱と
いった不都合を生むことになり、しかもこの逸脱時に突
条部114がパッド面P1上のクリーム半田を掻き取
り、あるいは押しやって片方向に集めたり、さらにはパ
ッド面P1からクリーム半田をはみ出させて、絶縁部上
に滞留させる等の好ましからざる状態を惹起させてい
た。これらは確実な半田付けを困難にするために、不良
品発生の原因になるばかりか、現場における作業性を著
しく損なう原因になっていた。This causes a disadvantage such that the contact 112, which has been temporarily enclosed in the through hole of the pad surface P1, deviates from the pores of the protrusion 114, and at the time of this deviation, the protrusion 114 causes the pad surface to move. The cream solder on P1 is scraped or pushed to collect in one direction, or the cream solder is extruded from the pad surface P1 to cause the solder to remain on the insulating portion, which is an undesirable state. Since these make reliable soldering difficult, they cause not only defective products but also workability in the field.
【0006】さらに、突条部114のパッド面P1の貫
通孔からの逸脱がなくとも、回転力のストレスを与えた
ままで半田溶接することによって、使用中に剥離を招い
たり、錆や腐食の発生が顕著になるなど、種々の不具合
を招く原因ともなっていた。Further, even if the protruding surface 114 of the pad surface P1 does not deviate from the through hole, solder welding is performed while the stress of the rotating force is applied, so that peeling may occur during use or rust or corrosion may occur. It is also a cause of various problems such as remarkable.
【0007】本発明はこのような課題や欠点を解決する
ためなされたもので、その目的はコネクタの組み付け工
程にあって、基板と接触子のずれの発生がなく、容易な
作業で確実な電気的接続を低コストで実現するコネクタ
表面実装機構を提供するものである。The present invention has been made to solve the above problems and drawbacks, and its purpose is to prevent the occurrence of displacement between the substrate and the contactor during the assembly process of the connector, and to ensure reliable electrical operation with easy work. The present invention provides a connector surface mounting mechanism that realizes physical connection at low cost.
【0008】[0008]
【課題を解決するための手段】上記課題を実現するため
本発明に係るコネクタ表面実装機構は、半田材料が載せ
られた電気接続用のパッド面をその表面に有する基板
と、絶縁ハウジングから突出して設けられ、かつ先端に
接続面を有する少なくとも1個の接触子を備え、該絶縁
ハウジングの前記基板への装着時に前記接触子が前記パ
ッド面に接続するコネクタとで構成されるものにおい
て、前記基板の端縁から基板内側に伸展する少なくとも
1本の嵌合溝を備え、前記パッド面の辺に沿い、パッド
面近傍にスリット状の開口を設け、前記絶縁ハウジング
底部に連ねて、前記嵌合溝に嵌挿する挿入板およびその
下端に連設された幅広の停止板から成るリブを設け、前
記リブの前記嵌合溝への嵌挿完了時に前記スリット状の
開口に嵌挿される、下方に伸びる突出部を前記接続面の
先端付近の側面に設けて構成したことを特徴とするもの
である。In order to achieve the above object, a connector surface mounting mechanism according to the present invention comprises a board having a pad surface for electrical connection on which a solder material is placed, and a board protruding from an insulating housing. A board provided with at least one contactor having a connecting surface at a tip thereof, the connector being connected to the pad surface when the insulating housing is mounted on the board, At least one fitting groove extending from the edge of the pad to the inside of the substrate, a slit-shaped opening is provided near the pad surface along the side of the pad surface, and the fitting groove is connected to the bottom of the insulating housing. A rib composed of an insertion plate to be inserted into and a wide stop plate continuously provided at the lower end thereof is provided, and the rib is inserted into the slit-shaped opening when the insertion of the rib into the fitting groove is completed, It is characterized in that a projecting portion extending in the configuration provided on the side surface near the tip of the connecting surface.
【0009】[0009]
【作用】ハウジング底部に連ねて設けた挿入板を、基板
の端縁からX軸方向に伸びて設けられた嵌合溝に嵌挿し
てX軸方向に押し込むと、挿入板は嵌合溝に沿ってX軸
方向に円滑に進行する。従って、コネクタはXY平面上
で回動するようながたつきを発生させない。When the insertion plate connected to the bottom of the housing is inserted into the fitting groove extending from the edge of the board in the X-axis direction and pushed in in the X-axis direction, the insertion plate moves along the fitting groove. Smoothly in the X-axis direction. Therefore, the connector does not generate rattling such as rotating on the XY plane.
【0010】さらに、停止板は、縦方向(Z軸方向)の
ガタを防止するよう作用する。すなわち、コネクタのY
軸、Z軸方向のずれ等は、リブと嵌合溝との作用によっ
て著しく改善される。Further, the stop plate acts to prevent looseness in the vertical direction (Z-axis direction). That is, Y of the connector
Deviations in the axial and Z-axis directions are remarkably improved by the action of the rib and the fitting groove.
【0011】また、リブの嵌合溝への嵌挿完了時に、接
続面の先端付近の側面に設けた下方に伸びる突出部が、
パッド面近傍に設けたスリット状の開口に嵌挿ロックさ
れることにより、コネクタのX軸方向のずれも防止され
る。Further, when the rib is completely inserted into the fitting groove, a downwardly extending protrusion provided on the side surface near the tip of the connecting surface is
The connector is prevented from being displaced in the X-axis direction by being fitted and locked in the slit-shaped opening provided near the pad surface.
【0012】[0012]
【実施例】以下、この発明の一実施例を添付図面の図1
〜図8に基づいて説明する。図1は本発明に係るコネク
タ表面実装機構の基本的形態を示す斜視図である。同図
において、10は基板で、その表面にはコネクタ2の接
触子4A、4Bとの電気的接続のための導電パッド面1
2A、12Bが形成されている。導電パッド面12A、
12B表面にはクリーム半田16が塗布されている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of the present invention will now be described with reference to FIG.
~ It demonstrates based on FIG. FIG. 1 is a perspective view showing a basic form of a connector surface mounting mechanism according to the present invention. In the figure, 10 is a substrate, on the surface of which a conductive pad surface 1 for electrical connection with the contacts 4A, 4B of the connector 2 is provided.
2A and 12B are formed. Conductive pad surface 12A,
Cream solder 16 is applied to the surface of 12B.
【0013】また、パッド面12A、12Bの辺に沿
い、かつパッド面12A、12B近傍にはスリット状の
開口13A、13Bが設けられ、さらに、基板10の端
縁から内部に向かい、少なくとも1本の嵌合溝11が穿
設されるとともに、コネクタ2の絶縁ハウジング3をネ
ジ15で係止するための固定孔14が透設されている。Further, slit-shaped openings 13A and 13B are provided along the sides of the pad surfaces 12A and 12B and near the pad surfaces 12A and 12B, and further, at least one opening is provided from the edge of the substrate 10 toward the inside. And a fixing hole 14 for locking the insulating housing 3 of the connector 2 with a screw 15 is transparently provided.
【0014】コネクタ2は、絶縁ハウジング3と、これ
より突出する複数の細い板状の接触子4A、4Bを有す
る。接触子4A、4Bは絶縁ハウジング3後面において
縦横の複数位置に配設され、基板10に平行にハウジン
グ3から突出した後、クランク状に基板側へ屈曲され、
先端部には基板10の各パッド面12A、12Bに接面
する接続面5A、5Bを有している。The connector 2 has an insulating housing 3 and a plurality of thin plate-shaped contacts 4A and 4B projecting from the insulating housing 3. The contacts 4A, 4B are arranged at a plurality of vertical and horizontal positions on the rear surface of the insulating housing 3, protrude from the housing 3 in parallel with the substrate 10, and then are bent in a crank shape toward the substrate side.
The tip end portion has connection surfaces 5A and 5B which come into contact with the respective pad surfaces 12A and 12B of the substrate 10.
【0015】ハウジング3の底部に連ねて、嵌合溝11
に嵌挿する挿入板7Aおよびその下端に連設された幅広
の停止板7Bから成るリブ7を設け、さらに、リブ7の
嵌合溝11への嵌挿完了時に、スリット状の開口13
A、13Bに嵌挿される、下方に伸びる突出部6A、6
Bを接続面5A、5Bの先端付近の側面に設けている。The fitting groove 11 is connected to the bottom of the housing 3.
A rib 7 composed of an insertion plate 7A to be inserted into and a wide stop plate 7B continuously provided at the lower end thereof is provided, and when the rib 7 is completely inserted into the fitting groove 11, a slit-shaped opening 13 is formed.
Protruding portions 6A, 6 extending downward, which are inserted into A, 13B.
B is provided on the side surface near the tips of the connection surfaces 5A and 5B.
【0016】図2〜図4は、図1に示したコネクタ表面
実装機構の嵌合時の各状態を示すもので、図2は上面
図、図3は側面図、図4は背面図である。これら図が示
すように、リブ7の嵌合溝11への嵌挿完了時には、ハ
ウジング3を基板10に固定するための固定片8に設け
た固定孔8Aと、基板10に設けた固定孔14との軸線
が一致する。よって、これら固定孔8A、固定孔14に
ネジ15を螺合することでハウジング3は基板10に固
定される。また、この嵌合時にはパッド面12A、12
Bの上に接触子4A、4Bが接合し、クリーム半田16
はその間に挟まれる。2 to 4 show the respective states when the connector surface mounting mechanism shown in FIG. 1 is fitted, FIG. 2 is a top view, FIG. 3 is a side view, and FIG. 4 is a rear view. . As shown in these figures, when the insertion of the rib 7 into the fitting groove 11 is completed, the fixing hole 8A provided in the fixing piece 8 for fixing the housing 3 to the substrate 10 and the fixing hole 14 provided in the substrate 10 are shown. The axes of and match. Therefore, the housing 3 is fixed to the substrate 10 by screwing the screws 15 into the fixing holes 8A and the fixing holes 14. Further, at the time of this fitting, the pad surfaces 12A, 12
The contactors 4A and 4B are bonded onto B, and the cream solder 16
Is sandwiched between them.
【0017】図5〜図7は、図1のコネクタ表面実装機
構の組み付け過程の側面説明図である。図5は、図1の
状態に対応する側面説明図で、ハウジング3の停止板7
Bを基板10の嵌合溝11に嵌挿する前の状態を示して
いる。図6においては、停止板7Bの嵌合溝11への嵌
挿が開始された状態で、突出部6A、6Bが基板10上
に乗り上げた状態でプラスX方向に進行する。5 to 7 are side views for explaining the assembling process of the connector surface mounting mechanism of FIG. FIG. 5 is a side explanatory view corresponding to the state of FIG. 1, and shows the stop plate 7 of the housing 3.
The state before inserting B into the fitting groove 11 of the board | substrate 10 is shown. In FIG. 6, the insertion of the stop plate 7B into the engagement groove 11 is started, and the protrusions 6A and 6B move in the plus X direction while riding on the substrate 10.
【0018】この間、接触子4A、4Bは弾性変位し、
接続面5A、5Bはパッド面12A、12Bよりも高い
位置に置かれ、さらにこの位置が継続する。従ってこの
間、パッド面12A、12Bに塗布されたクリーム半田
は元のままに維持される。さらに図7は、嵌挿の完了に
近い状態を示すもので、突出部6A、6Bがそれぞれ開
口13A、13Bに挿入直前の位置にあることが分か
る。During this time, the contacts 4A, 4B are elastically displaced,
The connection surfaces 5A and 5B are placed higher than the pad surfaces 12A and 12B, and this position continues. Therefore, during this period, the cream solder applied to the pad surfaces 12A and 12B is maintained as it is. Further, FIG. 7 shows a state close to the completion of fitting and insertion, and it can be seen that the projecting portions 6A and 6B are located at positions immediately before insertion into the openings 13A and 13B, respectively.
【0019】図8は、図1のコネクタ表面実装機構の組
み付け過程の要部上面説明図である。同図に示すよう
に、接触子4Aおよび4Bは、リブ7を嵌合溝11へ嵌
挿することによって、図中プラスX方向に進行するが、
接触子4Aおよび4Bの先端はこの進行方向と直角方向
に、パッド面12A、12Bと接触しない離れた位置に
まで一部の幅が拡張され、さらにその側面に下方に伸び
る突出部6A、6Bを設けている。FIG. 8 is an explanatory plan view of the essential parts of the assembly process of the connector surface mounting mechanism of FIG. As shown in the figure, the contacts 4A and 4B move in the plus X direction in the figure by inserting the rib 7 into the fitting groove 11,
The tips of the contacts 4A and 4B have a part of their widths extended in a direction perpendicular to this direction of travel to a position where they do not contact the pad surfaces 12A and 12B, and projecting portions 6A and 6B extending downward to the side surfaces thereof. It is provided.
【0020】例えば、接触子4Aはその先端のプラスY
方向外端に、突出部6Aを設けている。突出部6Aは、
図示の態様からさらにプラスX方向に進むが、そのプラ
スY方向の位置が基板10上に配設されたパッド面12
B、さらに12Aの半田領域をも越えているから、リブ
7の嵌挿が進行しても、パッド面12Bの下端(図8に
よる)を若干外れて通過し、さらにパッド面12Aに差
しかかっても、その半田領域を横切ることなく、若干の
距離を隔てて進み、やがて開口13Aに至ってこの開口
に落ち込み、嵌挿係止される。これと同時に、接続面5
Aも正しくクリーム半田16の載ったパッド面12A上
に落ち込んで正しく接合する。For example, the contactor 4A has a plus Y at its tip.
A projecting portion 6A is provided at the outer end in the direction. The protruding portion 6A is
From the illustrated mode, the position further extends in the plus X direction, but the position in the plus Y direction is the pad surface 12 disposed on the substrate 10.
B, since it further exceeds the solder area of 12A, even if the fitting of the rib 7 progresses, it passes slightly off the lower end of the pad surface 12B (according to FIG. 8) and reaches the pad surface 12A. However, it does not traverse the solder region, it proceeds with a slight distance, and eventually reaches the opening 13A, falls into this opening, and is fitted and locked. At the same time, the connecting surface 5
A also correctly falls onto the pad surface 12A on which the cream solder 16 is placed and is correctly joined.
【0021】一方、接触子4Bにおいても略同様に作動
する。接触子4Bはその先端のマイナスY方向の外端
に、突出部6Bを設けている。突出部6Bはこの後、さ
らにプラスX方向に進むが、そのマイナスY方向の位置
が基板10上に配設されたパッド面12Bの半田領域を
越えているから、従ってリブ7の嵌挿が進行して、パッ
ド面12Bに差しかかっても、その半田領域を横切るこ
となく、若干の距離を隔てて進み、やがて開口13Bに
至ってこの開口に落ち込み、嵌挿係止される。これと同
時に、接続面5Bも正しくクリーム半田16の載ったパ
ッド面12B上に落ち込んで正しく接合する。On the other hand, the contactor 4B operates in substantially the same manner. The contactor 4B is provided with a protrusion 6B at the outer end in the minus Y direction of the tip thereof. After that, the protruding portion 6B further advances in the plus X direction, but since the position in the minus Y direction exceeds the solder region of the pad surface 12B arranged on the substrate 10, the fitting of the rib 7 proceeds accordingly. Then, even when the pad surface 12B is approached, the solder surface is not traversed, the solder surface is advanced by a slight distance, and eventually reaches the opening 13B to fall into the opening and be fitted and locked. At the same time, the connection surface 5B also falls properly onto the pad surface 12B on which the cream solder 16 is placed, and is properly joined.
【0022】このように、コネクタ2の基板10への装
着過程にあって、本発明による構成ではパッド面12
A、12B上に載せられたクリーム半田16が接触子4
A、4Bや突出部6A、6B等と接触することがないか
ら、クリーム半田16が片寄せられたり、押しやられて
パッド面12A、12Bからはみ出る等の問題は発生し
ない。As described above, in the process of mounting the connector 2 on the substrate 10, in the structure according to the present invention, the pad surface 12 is formed.
The cream solder 16 placed on the A and 12B contacts 4
Since it does not come into contact with A, 4B, the protruding portions 6A, 6B, etc., the problem that the cream solder 16 is biased or pushed out of the pad surfaces 12A, 12B does not occur.
【0023】この理由は、リブの嵌合溝への嵌挿動作に
よってリブの進行方向以外の移動や回動が阻止されるこ
とで、ハウジングの移動にガタが発生せず、また外力が
加わっても、ずれの発生することがないから、この結果
として、ハウジングに取付けられた接触子の移動から、
ブレやガタつきが排除出来るからである。The reason for this is that movement and rotation of the ribs in directions other than the advancing direction are blocked by the fitting / inserting operation of the ribs into the fitting groove, so that there is no rattling in the movement of the housing and an external force is applied. However, since there is no displacement, as a result of this, the movement of the contacts attached to the housing
This is because blurring and rattling can be eliminated.
【0024】前記ではリブに停止板を備えた構成につき
説明したが、作業空間に余裕のない条件下では、前記の
ような、側面からコネクタをスライドして導入させる構
成の適用が困難な場合も存在する。このような場合に
は、停止板のない、挿入板のみから成るリブ構造を採用
して、上方から垂直に導入できる構成も有効である。In the above description, the structure in which the rib is provided with the stop plate has been described. However, under the condition that the working space is not sufficient, it may be difficult to apply the above-described structure in which the connector is slid and introduced from the side surface. Exists. In such a case, it is also effective to adopt a rib structure composed of only an insertion plate without a stop plate so that the rib structure can be vertically introduced from above.
【0025】[0025]
【発明の効果】以上説明した様に、本発明に係るコネク
タ表面実装機構は、挿入板が嵌合溝に沿ってX軸方向に
円滑に進行するから、コネクタはXY平面上で回動する
ようながたつきを発生させない。さらに停止板は、縦方
向(Z軸方向)のガタを防止するよう作用する。すなわ
ち、コネクタのY軸、Z軸方向のずれ等は、リブと嵌合
溝との作用によって著しく改善される。この結果、コネ
クタの基板への嵌挿時、および嵌挿後にネジを用いて固
定する作業において、ガタつきが発生しないから、パッ
ド面と接続面のズレはなく、よって塗布されているクリ
ーム半田の片寄せ、移動やパッド面からの排除といった
不都合が発生することがない。この結果、確実な半田付
けが可能になり、確実な電気的接続の実現によって回路
の信頼性を向上させることができる。As described above, in the connector surface mounting mechanism according to the present invention, the insertion plate smoothly advances in the X-axis direction along the fitting groove, so that the connector rotates on the XY plane. Does not cause rattling. Further, the stop plate acts to prevent looseness in the vertical direction (Z-axis direction). That is, the displacement of the connector in the Y-axis and Z-axis directions is remarkably improved by the action of the rib and the fitting groove. As a result, there is no backlash in the work of inserting the connector into the board and in the work of fixing with a screw after the insertion, so that there is no gap between the pad surface and the connection surface, and therefore the applied cream solder Inconveniences such as biasing, movement, and removal from the pad surface do not occur. As a result, reliable soldering is possible, and reliability of the circuit can be improved by realizing reliable electrical connection.
【0026】さらにネジの固定においては、ハウジング
を嵌合溝に正しく嵌挿すれば同時に、ハウジング固定片
の固定孔と、基板の固定孔の位置が合致した状態になる
から、ネジ止めの作業性が大幅に改善されるという利点
があり、著しいコスト低減を実現するものである。Further, when fixing the screw, when the housing is properly inserted into the fitting groove, the fixing hole of the housing fixing piece and the fixing hole of the substrate are aligned at the same time. Has the advantage of being significantly improved, and realizes a significant cost reduction.
【図1】本発明に係るコネクタ表面実装機構の実施例の
斜視図である。FIG. 1 is a perspective view of an embodiment of a connector surface mounting mechanism according to the present invention.
【図2】図1のコネクタ表面実装機構の嵌合時の上面図
である。FIG. 2 is a top view of the connector surface mounting mechanism of FIG. 1 when mated.
【図3】図1のコネクタ表面実装機構の嵌合時の側面図
である。FIG. 3 is a side view of the connector surface mounting mechanism of FIG. 1 when fitted.
【図4】図1のコネクタ表面実装機構の嵌合時の背面図
である。FIG. 4 is a rear view of the connector surface mounting mechanism of FIG. 1 when fitted.
【図5】図1のコネクタ表面実装機構の組み付け過程の
側面説明図である。5 is a side view for explaining the assembling process of the connector surface mounting mechanism of FIG. 1. FIG.
【図6】図1のコネクタ表面実装機構の組み付け過程の
側面説明図である。6 is a side view for explaining the assembling process of the connector surface mounting mechanism of FIG. 1. FIG.
【図7】図1のコネクタ表面実装機構の組み付け過程の
側面説明図である。FIG. 7 is a side view for explaining the assembling process of the connector surface mounting mechanism of FIG.
【図8】図1のコネクタ表面実装機構の組み付け過程の
要部上面説明図である。FIG. 8 is an explanatory top view of the main parts of the assembly process of the connector surface mounting mechanism of FIG.
【図9】従来の表面実装型コネクタの斜視図である。FIG. 9 is a perspective view of a conventional surface mount connector.
【図10】図9の部分切欠拡大図である。FIG. 10 is an enlarged view of the partial cutaway of FIG. 9.
1 コネクタ表面実装機構 2 コネクタ 3 絶縁ハウジング 4A、4B 接触子 5A、5B 接続面 6A、6B 突出部 7 リブ 7A 挿入板 7B 停止板 8 固定片 8A 固定孔 10 基板 11 嵌合溝 12A、12B パッド面 13A、13B 開口 14 固定孔 15 ネジ 16 クリーム半田 1 Connector Surface Mounting Mechanism 2 Connector 3 Insulating Housing 4A, 4B Contact 5A, 5B Connection Surface 6A, 6B Projection 7 Rib 7A Insertion Plate 7B Stop Plate 8 Fixing Piece 8A Fixing Hole 10 Board 11 Fitting Groove 12A, 12B Pad Surface 13A, 13B Opening 14 Fixing hole 15 Screw 16 Cream solder
Claims (2)
ド面をその表面に有する基板と、絶縁ハウジングから突
出して設けられ、かつ先端に接続面を有する少なくとも
1個の接触子を備え、該絶縁ハウジングの前記基板への
装着時に前記接触子が前記パッド面に接続するコネクタ
とで構成されるものにおいて、前記基板の端縁から基板
内側に伸展する少なくとも1本の嵌合溝を備え、前記パ
ッド面の辺に沿い、パッド面近傍にスリット状の開口を
設け、前記絶縁ハウジング底部に連ねて、前記嵌合溝に
嵌挿する挿入板およびその下端に連設された幅広の停止
板から成るリブを設け、前記リブの前記嵌合溝への嵌挿
完了時に前記スリット状の開口に嵌挿される、下方に伸
びる突出部を前記接続面の先端付近の側面に設けて構成
したことを特徴とするコネクタ表面実装機構。1. A substrate having a pad surface for electrical connection on which a solder material is placed, and at least one contact member projecting from an insulating housing and having a connecting surface at its tip, A connector, in which the contactor is connected to the pad surface when the insulating housing is mounted on the board, comprising at least one fitting groove extending from the edge of the board to the inside of the board, A slit-shaped opening is provided in the vicinity of the pad surface along the side of the pad surface, and is composed of an insertion plate connected to the bottom of the insulating housing and fitted into the fitting groove, and a wide stop plate continuously provided at the lower end thereof. A rib is provided, and a downwardly extending protrusion that is inserted into the slit-shaped opening when the insertion of the rib into the fitting groove is completed is provided on a side surface near the tip of the connection surface. You Connector surface mounting mechanism.
ド面をその表面に有する基板と、絶縁ハウジングから突
出して設けられ、かつ先端に接続面を有する少なくとも
1個の接触子を備え、該絶縁ハウジングの前記基板への
装着時に前記接触子が前記パッド面に接続するコネクタ
とで構成されるものにおいて、前記基板の端縁から基板
内側に伸展する少なくとも1本の嵌合溝を備え、前記パ
ッド面の辺に沿い、パッド面近傍にスリット状の開口を
設け、前記絶縁ハウジング底部に連ねて、前記嵌合溝に
嵌挿する挿入板から成るリブを設け、前記リブの前記嵌
合溝への嵌挿完了時に前記スリット状の開口に嵌挿され
る、下方に伸びる突出部を前記接続面の先端付近の側面
に設けて構成したことを特徴とするコネクタ表面実装機
構。2. A substrate having a pad surface for electrical connection on which a solder material is placed, and at least one contact member projecting from an insulating housing and having a connecting surface at its tip, A connector, in which the contactor is connected to the pad surface when the insulating housing is mounted on the board, comprising at least one fitting groove extending from the edge of the board to the inside of the board, A slit-like opening is provided in the vicinity of the pad surface along the side of the pad surface, and a rib that is connected to the bottom of the insulating housing and is formed of an insertion plate that is inserted into the fitting groove is provided. 2. A connector surface mounting mechanism, characterized in that a downwardly extending projecting portion that is fitted and inserted into the slit-shaped opening when completion of fitting is provided on a side surface near the tip of the connecting surface.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5317514A JPH07153507A (en) | 1993-11-25 | 1993-11-25 | Connector surface mounting mechanism |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5317514A JPH07153507A (en) | 1993-11-25 | 1993-11-25 | Connector surface mounting mechanism |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH07153507A true JPH07153507A (en) | 1995-06-16 |
Family
ID=18089089
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5317514A Pending JPH07153507A (en) | 1993-11-25 | 1993-11-25 | Connector surface mounting mechanism |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH07153507A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1997017823A1 (en) * | 1995-11-08 | 1997-05-15 | Minnesota Mining And Manufacturing Company | Connector break-off locator tab |
US5971775A (en) * | 1996-06-25 | 1999-10-26 | Thomas & Betts International, Inc. | Single-sided, straddle mount printed circuit board connector |
US6790052B2 (en) | 2000-02-14 | 2004-09-14 | Molex Incorporated | Circuit board straddle mounted connector |
JP2020077739A (en) * | 2018-11-07 | 2020-05-21 | 北川工業株式会社 | Noise filter |
-
1993
- 1993-11-25 JP JP5317514A patent/JPH07153507A/en active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1997017823A1 (en) * | 1995-11-08 | 1997-05-15 | Minnesota Mining And Manufacturing Company | Connector break-off locator tab |
GB2321557A (en) * | 1995-11-08 | 1998-07-29 | Minnesota Mining & Mfg | Connector break-off locator tab |
GB2321557B (en) * | 1995-11-08 | 1999-12-01 | Minnesota Mining & Mfg | Connector break-off locator tab |
US5971775A (en) * | 1996-06-25 | 1999-10-26 | Thomas & Betts International, Inc. | Single-sided, straddle mount printed circuit board connector |
US6790052B2 (en) | 2000-02-14 | 2004-09-14 | Molex Incorporated | Circuit board straddle mounted connector |
JP2020077739A (en) * | 2018-11-07 | 2020-05-21 | 北川工業株式会社 | Noise filter |
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