JPH0715145A - Manufacture of ultra-multilayer lamination board - Google Patents
Manufacture of ultra-multilayer lamination boardInfo
- Publication number
- JPH0715145A JPH0715145A JP5155678A JP15567893A JPH0715145A JP H0715145 A JPH0715145 A JP H0715145A JP 5155678 A JP5155678 A JP 5155678A JP 15567893 A JP15567893 A JP 15567893A JP H0715145 A JPH0715145 A JP H0715145A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- ultra
- multilayer
- conductive
- multilayer lamination
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、超多層積層板の製造方
法に関し、具体的には、電子機器、電気機器に用いられ
る超多層積層板の製造方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing an ultra-multilayer laminate, and more particularly to a method for producing an ultra-multilayer laminate used in electronic equipment and electric equipment.
【０００２】[0002]
【従来の技術】電子機器、電気機器に利用される従来の
多層プリント配線板の製造方法としては、表面に回路が
形成された内層材と表面に金属箔が張られた外層材から
なる金属箔張り多層積層板にスルーホール加工、スルー
ホールメッキ処理を経て、上記金属箔にエッチングでパ
ターニングする方法が知られている。2. Description of the Related Art A conventional method for manufacturing a multilayer printed wiring board used in electronic equipment and electric equipment is a metal foil comprising an inner layer material having a circuit formed on the surface and an outer layer material having a metal foil stretched on the surface. There is known a method of patterning the above-mentioned metal foil by etching after subjecting the laminated multilayer laminate to through-hole processing and through-hole plating.
【０００３】しかし、この多層プリント配線板の製造方
法を、板厚の厚い超多層積層板に適用すると、スルーホ
ール加工の工程では、板厚が厚いためドリルが折れた
り、あるいはスルーホールメッキ処理ではショートの原
因となるスミアリング、さらには、スルーホール全長に
わたって充分にメッキができず、導通信頼性を充分付与
できない問題がある。However, if this method for manufacturing a multilayer printed wiring board is applied to an ultra-multilayer laminated board having a large plate thickness, the drill is broken in the through hole processing step due to the large plate thickness, or in the through hole plating process. There is a problem that smearing that causes a short circuit and further, plating cannot be sufficiently performed over the entire length of the through hole, and sufficient conduction reliability cannot be provided.
【０００４】[0004]
【発明が解決しようとする課題】本発明は、上述の事実
を鑑みてなされたもので、その目的とするところは、板
厚の厚い超多層積層板においてスルーホール加工上での
ドリルの折れを防止し、スルーホールの導通信頼性の高
い超多層積層板の製造方法を提供することにある。SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned fact, and an object of the present invention is to prevent breakage of a drill during through-hole processing in an ultra-multilayer laminated board having a large thickness. It is an object of the present invention to provide a method for manufacturing an ultra-multilayer laminated board which prevents the occurrence of the through hole and has high reliability of conduction.
【０００５】[0005]
【課題を解決するための手段】本発明の超多層積層板の
製造方法は、上下に積載された、導電回路とこの導電回
路に導通する導電路（７）が形成されたスルーホール
（５）を有する複数の多層積層板（３）のスルーホール
（５）が一連に連通した被圧体を加熱加圧した後にスル
ーホール（５）の導電路（７）間を導体（２）で接合す
ることを特徴とする。According to the method of manufacturing an ultra-multilayer laminate of the present invention, a through hole (5) having a conductive circuit and a conductive path (7) electrically connected to the conductive circuit, which are stacked vertically, are formed. A plurality of multilayer laminated plates (3) having a plurality of through holes (5) are connected to each other in series and, after heating and pressurizing an object to be pressed, the conductive paths (7) of the through holes (5) are joined by a conductor (2). It is characterized by
【０００６】[0006]
【作用】本発明の超多層積層板の製造方法に基づいて、
上下に積載された、導電回路とこの導電回路に導通する
導電路（７）が形成されたスルーホール（５）を有する
複数の多層積層板（３）のスルーホール（５）が一連に
連通した被圧体を加熱加圧した後にスルーホール（５）
の導電路（７）間を導体（２）で接合すると、板厚の厚
い超多層積層板に適用しても、板厚の薄い多層積層板に
あらかじめスルーホール（５）加工およびスルーホール
メッキが行われているので、ドリルの折れおよびスミア
リングの発生を防止でき、かつ、導体（２）による接合
によってスルーホール（５）の導電路（７）は導通する
ので導通信頼性が高い。Based on the method for producing an ultra-multilayer laminate of the present invention,
Through holes (5) of a plurality of multilayer laminated plates (3) stacked one above the other and having through holes (5) formed with a conductive circuit and a conductive path (7) conducting to this conductive circuit are connected in series. Through-hole (5) after heating and pressing the object
When the conductive paths (7) are joined by the conductor (2), through-hole (5) processing and through-hole plating are performed in advance on a thin multilayer laminated plate even when applied to a thick ultra-multilayer laminated plate. Since it is performed, the breakage of the drill and the occurrence of smearing can be prevented, and the conduction path (7) of the through hole (5) is electrically conducted by the joining by the conductor (2), so that the conduction reliability is high.
【０００７】以下、本発明を詳細に説明する。まず、多
層積層板は次のようにして作ることができる。基材に樹
脂を含浸し半硬化させて得られるプリプレグを１枚又
は、複数枚重ねてその外側表面に導電回路となる金属箔
を重ね合わせて温度140 〜180 ℃、圧力30〜70kg／cm2
で70〜120 分で一次成形して金属箔を張った積層板を作
る。The present invention will be described in detail below. First, the multilayer laminate can be manufactured as follows. One or a plurality of prepregs obtained by impregnating a base material with a resin and semi-curing them are stacked and a metal foil to be a conductive circuit is laid on the outer surface of the prepreg, and the temperature is 140 to 180 ° C and the pressure is 30 to 70 kg / cm 2.
In 70-120 minutes, the primary molding is performed to make a laminated sheet with metal foil.
【０００８】次に、この積層板の表面の金属箔に常法に
よって導電回路を形成する。この積層板の両面に前記の
プリプレグを１枚又は、複数枚重ねて、さらにその外側
両表面に導電回路となる金属箔を重ね合わせて温度140
〜180 ℃、圧力30〜70kg／cm 2 で70〜120 分で２次成形
して、多層積層板を作る。Next, the metal foil on the surface of this laminated plate was subjected to a conventional method.
Therefore, a conductive circuit is formed. On both sides of this laminate
One or more prepregs are stacked and the outside
A metal foil to be a conductive circuit is laid on both surfaces and the temperature is 140
~ 180 ℃, pressure 30 ~ 70kg / cm 2Secondary molding in 70 to 120 minutes
Then, a multilayer laminated board is made.
【０００９】樹脂は、エポキシ樹脂、ポリイミド樹脂、
フッ素樹脂、ＰＰＯ樹脂、不飽和ポリエステル樹脂など
の単独およびこれらの変性、混合樹脂などを用いること
ができる。また、これらの樹脂に無機フィラーや有機フ
ィラーを含むものを用いることもできる。これら樹脂を
含浸する基材としては、通常は、ガラスの布、不織布な
どが用いられる。この他、セルロース繊維紙などの有機
繊維紙、石英繊維などの無機繊維やポリイミド系の樹脂
繊維など高耐熱性有機繊維などの織布や不織布をそれぞ
れ用途に応じて単独及び組合せて用いることができる。The resin is an epoxy resin, a polyimide resin,
Fluorine resins, PPO resins, unsaturated polyester resins and the like may be used alone, or modified or mixed resins thereof. Further, it is also possible to use a resin containing an inorganic filler or an organic filler in these resins. As the base material impregnated with these resins, glass cloth, non-woven cloth and the like are usually used. In addition, organic fiber paper such as cellulose fiber paper, inorganic fiber such as quartz fiber, and woven or non-woven fabric such as high heat resistant organic fiber such as polyimide resin fiber can be used individually or in combination depending on the application. .
【００１０】さらに、次の工程を経て超多層積層板が得
られる。 多層積層板の表面の金属箔を全面エッチングする工
程。この場合２〜５μｍの厚みの金属箔を残す。この工
程で導電回路が形成されたプリント配線板を得る。 ドリルによってスルーホール加工する工程。この工程
でスルーホールが形成される。 スルーホールに銅メッキ層を形成する工程。これは、
通常の無電解銅メッキ法および銅メッキ法で行うことが
できる。 で得られた多層積層板を複数枚プリプレグを介して
積載する工程。この工程で被圧体を得る。 で積載された複数の多層積層板のスルーホールが一
連に連通した被圧体を温度140 〜180 ℃、圧力30〜70kg
／cm2 、時間70〜120 分で加熱加圧による成形をする工
程。この工程では、スルーホールの導電路が断絶した超
多層積層板を得る。 スルーホールの導電路間を導体で接合する工程。な
お、導体としては、ペースト状の銅または銀、または、
半田を用い、スルーホール内に封入するのが好ましい。Furthermore, an ultra-multilayer laminate is obtained through the following steps. The step of etching the entire metal foil on the surface of the multilayer laminate. In this case, a metal foil having a thickness of 2 to 5 μm is left. In this step, a printed wiring board on which a conductive circuit is formed is obtained. Through hole processing with a drill. Through holes are formed in this step. Step of forming a copper plating layer on the through hole. this is,
It can be performed by the usual electroless copper plating method and copper plating method. A step of stacking the multi-layer laminated board obtained in step 1 through a plurality of prepregs. In this step, the body to be pressed is obtained. The temperature of the pressure-sensitive body, which has a series of through-holes in the multi-layer laminated plates loaded in, is 140-180 ℃, and the pressure is 30-70 kg.
/ Cm 2 , the process of molding by heating and pressurizing for 70 to 120 minutes. In this step, an ultra-multilayer laminated plate having a disconnected conductive path of a through hole is obtained. The process of joining the conductive paths of the through holes with a conductor. As the conductor, paste copper or silver, or
It is preferable to fill the through holes with solder.
【００１１】超多層積層板の製造に用いられる金属箔と
しては、銅、アルミニウム、ニッケル、ステンレスなど
の金属箔が、特に銅箔が電気伝導性の良好な点で好まし
い。この場合、電解銅箔、圧延銅箔いずれでも良く特に
限定するものではない。As the metal foil used for producing the super multi-layer laminate, metal foils such as copper, aluminum, nickel and stainless steel are preferable, and copper foil is particularly preferable in view of good electric conductivity. In this case, either electrolytic copper foil or rolled copper foil may be used and is not particularly limited.
【００１２】以下、本発明の実施例を挙げる。Examples of the present invention will be given below.
【００１３】[0013]
【実施例】実施例１ 図１は、本発明の一実施例に係る超多層積層板の側面図
である。EXAMPLE 1 FIG. 1 is a side view of an ultra-multilayer laminate according to an example of the present invention.
【００１４】厚み0.2mm でガラス布基材にエポキシ樹脂
を含浸成形した両面銅張積層板の表面の銅箔に導電回路
を形成し、さらに黒化処理により表面粗化したプリント
配線板に厚み0.2 mmのガラス布基材にエポキシ樹脂を含
浸したプリプレグを２枚挿入し、さらに、最外層に３５
μｍの銅箔を組み合わせて積層物とし、キャリアプレー
トに積層搭載した後、この積層物をプレス熱盤間に挿入
し、加熱温度150 ℃、圧力50kg／cm2 、成形時間100 分
で成形して両面銅張りした多層積層板（３）とし、この
多層積層板（３）の最外層の３５μｍの銅箔をエッチン
グレグして３μｍの導電回路を形成した。ドリルにより
多層積層板（３）をスルーホール加工し、できたスルー
ホール（５）に無電解および電解メッキ法により銅メッ
キ層とし、こうして得られた多層積層板（３）を３枚の
プリプレグを介して積載し、積載された複数の多層積層
板（３）のスルーホール（５）が一連に連通した被圧体
とし、この被圧体を加熱温度150 ℃、圧力50kg／cm2 、
成形時間100 分で成形した。スルーホール（５）の導電
路（７）間に半田を注入により封入し、接合した。A conductive circuit is formed on a copper foil on the surface of a double-sided copper-clad laminate obtained by impregnating and molding an epoxy resin on a glass cloth substrate having a thickness of 0.2 mm, and the surface is roughened by a blackening treatment. 2 pieces of prepreg impregnated with epoxy resin is inserted into the glass cloth base material of mm
After combining the copper foil with a thickness of μm into a laminate and mounting it on a carrier plate, insert this laminate between press hot plates and heat at a temperature of 150 ° C, pressure of 50 kg / cm 2 and molding time of 100 minutes. A multilayer laminated plate (3) with copper-clad double sides was formed, and the outermost 35 μm copper foil of this multilayer laminated plate (3) was etched to form a conductive circuit of 3 μm. The multilayer laminated plate (3) is subjected to through-hole processing with a drill, and the through hole (5) thus formed is used as a copper plating layer by electroless and electrolytic plating methods. The thus obtained multilayer laminated plate (3) is provided with three prepregs. The through-holes (5) of the plurality of laminated multi-layered plates (3), which are stacked through each other, are connected in series to form a pressure-sensitive body, and the pressure-controlled body has a heating temperature of 150 ° C. and a pressure of 50 kg / cm 2 ,
It was molded with a molding time of 100 minutes. Solder was injected into the through hole (5) between the conductive paths (7) to be sealed and joined.
【００１５】以上のようにして層の数に応じて多層積層
板（３）を接合すればよいので、スルーホール（５）を
有する板厚の厚い超多層積層板でも容易に上述の工程で
製造でき、超多層積層板の導電路（７）間を導体（２）
で接合すると、スルーホール（５）の導通信頼性を付与
できる。Since the multi-layer laminated plates (3) may be joined according to the number of layers as described above, even a super-thick multi-layer laminated plate having a through hole (5) and having a large thickness can be easily manufactured by the above-mentioned process. The conductor (2) can be formed between the conductive paths (7) of the super multilayer laminate.
By joining with, the conduction reliability of the through hole (5) can be provided.
【００１６】[0016]
【発明の効果】本発明の超多層積層板の製造方法による
と、板厚の厚い超多層積層板を製造するにあたり、スル
ーホール加工上でのドリルの折れを防止し、スルーホー
ル導電路の導通信頼性を付与できる。According to the method for producing an ultra-multilayer laminate of the present invention, when producing an ultra-multilayer laminate having a large thickness, it is possible to prevent the drill from breaking during through-hole processing and to conduct the through-hole conductive paths. Reliability can be added.
【図１】本発明の一実施例に係る超多層積層板の側面図
である。FIG. 1 is a side view of an ultra-multilayer laminate according to an embodiment of the present invention.
２ 導体 ３ 多層積層板 ５ スルーホール ７ 導電路 2 conductor 3 multi-layer laminate 5 through hole 7 conductive path
Claims (1)
回路に導通する導電路（７）が形成されたスルーホール
（５）を有する複数の多層積層板（３）のスルーホール
（５）が一連に連通した被圧体を加熱加圧した後にスル
ーホール（５）の導電路（７）間を導体（２）で接合す
ることを特徴とする超多層積層板の製造方法。1. A through hole (5) of a plurality of multi-layer laminates (3) having a through hole (5) stacked vertically and having a conductive circuit and a conductive path (7) electrically connected to the conductive circuit. 2. A method for manufacturing an ultra-multilayer laminate, comprising heating and pressurizing an object to be continuously communicated in series, and then joining the conductive paths (7) of the through holes (5) with a conductor (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5155678A JP2776202B2 (en) | 1993-06-25 | 1993-06-25 | Manufacturing method of super multilayer laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5155678A JP2776202B2 (en) | 1993-06-25 | 1993-06-25 | Manufacturing method of super multilayer laminate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0715145A true JPH0715145A (en) | 1995-01-17 |
| JP2776202B2 JP2776202B2 (en) | 1998-07-16 |
Family
ID=15611188
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5155678A Expired - Lifetime JP2776202B2 (en) | 1993-06-25 | 1993-06-25 | Manufacturing method of super multilayer laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2776202B2 (en) |
-
1993
- 1993-06-25 JP JP5155678A patent/JP2776202B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP2776202B2 (en) | 1998-07-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2001045478A1 (en) | Multilayered printed wiring board and production method therefor | |
| JP2003031952A (en) | Core substrate and multilayer circuit board using the same | |
| JPH05198946A (en) | Manufacture of multilayer printed circuit board | |
| JP2006203148A (en) | Multilayer printed circuit board and manufacturing method thereof | |
| JP2004327510A (en) | Copper-plated laminated board for multilayered printed wiring board, multilayered printed wiring board and method of manufacturing the same | |
| TW201406224A (en) | Multilayer printed circuit board and method for manufacturing same | |
| JP3654982B2 (en) | Manufacturing method of multilayer printed wiring board | |
| JP3173249B2 (en) | Multilayer printed wiring board and method of manufacturing the same | |
| JP2001326458A (en) | Printed wiring board and its manufacturing method | |
| JPH0946041A (en) | Manufacture of printed wiring board | |
| JPH0621619A (en) | Printed circuit board and method for formation thereof | |
| JP2776202B2 (en) | Manufacturing method of super multilayer laminate | |
| JPH11112149A (en) | Multilayered printed wiring board | |
| JPH11112147A (en) | Multilayered printed wiring board | |
| JP4681111B2 (en) | Multilayer circuit board manufacturing method and press apparatus | |
| JP2003086941A (en) | Printed wiring board | |
| JPS63199636A (en) | Laminated board | |
| JPH088538A (en) | Multilayer printed wiring board and manufacture thereof | |
| JP2003249742A (en) | Method of manufacturing heavy current circuit substrate | |
| JP2002344141A (en) | Multilayer circuit board and manufacturing method thereof | |
| JPH0510840B2 (en) | ||
| JP3288290B2 (en) | Multilayer printed wiring board | |
| JP2000252631A (en) | Multilayer printed wiring board and its manufacture | |
| JPH01313998A (en) | Manufacture of metal composite laminated board | |
| JPH10313177A (en) | Manufacture of multilayered printed wiring board |