JPH07150120A - Composite pressure-sensitive adhesive tape or sheet - Google Patents
Composite pressure-sensitive adhesive tape or sheetInfo
- Publication number
- JPH07150120A JPH07150120A JP30147793A JP30147793A JPH07150120A JP H07150120 A JPH07150120 A JP H07150120A JP 30147793 A JP30147793 A JP 30147793A JP 30147793 A JP30147793 A JP 30147793A JP H07150120 A JPH07150120 A JP H07150120A
- Authority
- JP
- Japan
- Prior art keywords
- composite
- adhesive tape
- film
- sensitive adhesive
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
Landscapes
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、例えば、電解コンデン
サ、電池、プリント基板などの電子部品を構成する巻回
絶縁体の端末を固定、もしくはプリント基板などをマス
キングするための複合粘着テープ又はシートに関し、詳
しくは電解液成分や洗浄溶剤などの有機溶剤に対する耐
性に優れ、かつ面実装での半田熱に対する熱寸法変化率
の小さい複合粘着テープ又はシートに関する。 なお、
以下においては電解コンデンサを例示して本発明を説明
するが、本発明の複合粘着テープ又はシートはこの用途
に何ら限定されるものではない。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a composite pressure-sensitive adhesive tape or sheet for fixing ends of winding insulators constituting electronic parts such as electrolytic capacitors, batteries and printed circuit boards or masking printed circuit boards. More specifically, the present invention relates to a composite pressure-sensitive adhesive tape or sheet that has excellent resistance to organic solvents such as electrolytic solution components and cleaning solvents, and has a small thermal dimensional change rate with respect to solder heat during surface mounting. In addition,
Hereinafter, the present invention will be described by exemplifying an electrolytic capacitor, but the composite adhesive tape or sheet of the present invention is not limited to this application.
【０００２】[0002]
【従来の技術】電解コンデンサは、通常、例えばアルミ
ニウム箔からなる陽極箔と陰極箔とが電解液を保持した
電解紙を介して巻回され、そのコンデンサ素子の外周が
粘着テープにより巻回されてその端末が固定されてい
る。 かかる電解液の成分として、例えばエチレングリ
コール、γ−ブチロラクトン等の極性又は誘電率の高い
有機溶剤が用いられているため、電解コンデンサ素子の
止め材としては、これらの溶剤に対して耐性があり、か
つ１００℃以下での耐熱性に優れたポリプロピレンフィ
ルムを基材として用いた粘着テープ又はシートが多く使
用されている。2. Description of the Related Art In an electrolytic capacitor, an anode foil and a cathode foil made of, for example, an aluminum foil are usually wound via electrolytic paper holding an electrolytic solution, and the outer periphery of the capacitor element is wound with an adhesive tape. The terminal is fixed. As a component of such an electrolytic solution, for example, ethylene glycol, γ-butyrolactone or the like, an organic solvent having a high polarity or a high dielectric constant is used, and therefore as a stopper for the electrolytic capacitor element, it has resistance to these solvents, In addition, an adhesive tape or sheet using a polypropylene film as a base material, which is excellent in heat resistance at 100 ° C. or lower, is often used.
【０００３】[0003]
【発明が解決しようとする課題】近年、電解コンデンサ
の小型化による面実装化が進み、電解コンデンサの素子
止め部材自体に耐半田性が要求されている。 しかし、
従来のポリプロピレンフィルム単体を基材とした粘着テ
ープでは、耐半田性が低く、面実装後の熱収縮、熔融に
より、素子止め部材としての機能が著しく低下するとい
う問題が発生した。 そのため前記の溶剤に対する耐性
があり、かつ耐半田性を有するポリエステルフィルム又
はポリフェニレンサルファイドフィルムなどのエンジニ
アプラスチックフィルム等を基材とした粘着テープが用
いられることがあるが、かかるポリフェニレンサルファ
イドフィルム基材の粘着テープは、基材フィルム中の塩
素イオン濃度が高く、電極やアルミケース等の腐食を促
進させたり、基材フィルムの引き裂き強度が小さく、テ
ーピング作業時などに裂けが発生するという欠点を有し
ていた。 一方、ポリエステルフィルムは、耐溶剤性が
低いという問題を有しており、両方の特性を満足する粘
着テープは未だ得られていなかった。In recent years, the surface mounting of electrolytic capacitors has progressed due to miniaturization, and the element stopping members themselves of electrolytic capacitors are required to have solder resistance. But,
The conventional adhesive tape using a polypropylene film as a base material has low solder resistance and has a problem that the function as an element stopping member is significantly deteriorated due to heat shrinkage and melting after surface mounting. Therefore, there is a resistance to the solvent, and an adhesive tape having a base material such as an engineered plastic film such as a polyester film or a polyphenylene sulfide film having solder resistance may be used, but the adhesion of such a polyphenylene sulfide film base material The tape has the drawbacks that the chlorine ion concentration in the base film is high, it accelerates the corrosion of the electrodes and the aluminum case, and the base film has a low tear strength, and tears occur during taping work. It was On the other hand, the polyester film has a problem of low solvent resistance, and an adhesive tape satisfying both properties has not yet been obtained.
【０００４】[0004]
【課題を解決するための手段】本発明者らはかかる問題
点を解決するために鋭意研究した結果、基材として耐熱
性を有するフィルムと、耐溶剤性を有するフィルムとか
らなる複合フィルム基材を採用したが、単にこれらを複
合化するだけでは、コンデンサなどに巻止めた場合にそ
の端末が剥がれたり、またテーピング性などの作業性に
劣るという問題があることを知見し、よって特定の弾性
率を有するように複合基材フィルムを構成することによ
って、これらの問題点を一挙に解決した。Means for Solving the Problems As a result of intensive studies conducted by the present inventors in order to solve such problems, a composite film substrate comprising a film having heat resistance as a substrate and a film having solvent resistance. However, we found that simply compounding these would cause problems such as the terminal peeling off when wound on a capacitor, and poor workability such as taping. These problems were solved all at once by constructing the composite base material film so as to have a high rate.
【０００５】即ち、本発明は、少なくとも二層のプラス
チックフィルム層から構成される複合基材フィルムであ
って、その少なくとも一層のプラスチックフィルム層が
耐熱性を有し、他の少なくとも一層のプラスチックフィ
ルム層が耐溶剤性を有し、かつその弾性率が１０〜１０
００kg／mm2 である複合基材フィルム上に、粘着剤層が
設けられてなる複合粘着テープ又はシートを提供する。That is, the present invention is a composite substrate film composed of at least two plastic film layers, wherein at least one plastic film layer has heat resistance, and at least another plastic film layer. Has solvent resistance, and its elastic modulus is 10 to 10
Provided is a composite pressure-sensitive adhesive tape or sheet in which a pressure-sensitive adhesive layer is provided on a composite substrate film having a weight of 00 kg / mm 2 .
【０００６】本発明で用いられる複合基材フィルムは、
少なくとも二層、即ち二層もしくは三層以上のプラスチ
ックフィルム層で構成されており、その少なくとも一層
が耐熱性を有し、他の少なくとも一層が耐溶剤性を有す
ると共に、基材全体の弾性率が１０〜１０００kg／m
m2 、好ましくは５０〜５００kg／mm2 の範囲である。
この弾性率が１０kg／mm2 未満の場合は、テーピング性
などの作業性に劣り、一方１０００kg／mm2 を越える場
合は、テープを巻止めた場合にその端末が剥がれやすい
という問題がある。The composite substrate film used in the present invention is
At least two layers, that is, composed of two or more plastic film layers, at least one of which has heat resistance, the other at least one has solvent resistance, the elastic modulus of the entire substrate 10-1000kg / m
m 2 is preferably in the range of 50 to 500 kg / mm 2 .
When the elastic modulus is less than 10 kg / mm 2 , workability such as taping is poor, while when it exceeds 1000 kg / mm 2 , there is a problem that the end of the tape is easily peeled off when the tape is wound.
【０００７】かかる複合基材フィルムの弾性率を上記範
囲とするには、各プラスチックフィルム層の材質はもち
ろんその厚みを設計して所定の弾性率となるように調整
することができる。 本発明においては、複合基材フィ
ルムの一方のプラスチックフィルム層の厚さが、他方の
層の厚さに対して、厚み比で１／１００〜１００／１、
好ましくは１／２０〜２０／１とする。 ここで厚み比
が１／１００未満の場合、例えば耐溶剤性を有するフィ
ルム層の厚みの比が１／１００未満の場合、基材が有機
溶剤により膨潤、加水分解、溶解して機械的強度が低下
して素子の巻き緩みや素子バラケが発生する場合があ
る。 また耐熱性を有するフィルム層の厚みの比が１／
１００未満の場合、テーピングや素子巻付け時にカール
が発生したり、腰がないため巻き付け不良を生じる場合
がある。 また半田熱に対する熱寸法安定性が低下して
テープ収縮または破断により素子の巻き緩みや素子バラ
ケが発生する場合があるため好ましくない。In order to set the elastic modulus of such a composite substrate film in the above range, not only the material of each plastic film layer but also its thickness can be designed and adjusted so as to have a predetermined elastic modulus. In the present invention, the thickness of one plastic film layer of the composite substrate film is 1/100 to 100/1 in terms of thickness ratio with respect to the thickness of the other layer.
It is preferably 1/20 to 20/1. Here, when the thickness ratio is less than 1/100, for example, when the thickness ratio of the solvent-resistant film layer is less than 1/100, the base material is swollen, hydrolyzed and dissolved by the organic solvent to have a mechanical strength. In some cases, the coil may be lowered and loosening of the element or element variation may occur. Further, the thickness ratio of the heat-resistant film layer is 1 /
If it is less than 100, curling may occur during taping or element winding, or winding failure may occur due to lack of stiffness. In addition, the thermal dimensional stability with respect to the solder heat is reduced, and the tape may shrink or break, resulting in loosening of the element or element variation, which is not preferable.
【０００８】また巻き止め後のコンデンサケースへの収
納性を考慮して、単独のフィルム層を厚みが３〜３００
μｍ、二層以上の総厚みが５〜２００μｍ、好ましくは
１５〜８０μｍとすることが好ましい。In consideration of the storability in the capacitor case after being wound, a single film layer having a thickness of 3 to 300 is used.
μm, the total thickness of two or more layers is 5 to 200 μm, preferably 15 to 80 μm.
【０００９】本発明で用いる複合基材フィルムの少なく
とも一層のプラスチックフィルム層が耐熱性を有すると
は、例えば面実装での半田熱（通常２００〜３００℃×
１〜５分間）に対して十分な耐性、即ち熱寸法安定性を
有する限り特に限定されないが、本発明においては特
に、その融点が２００℃以上、好ましくは２５０℃以上
であり、かつ被着体に貼り合わせた状態で、３００℃以
下、５分以内での熱寸法変化率が、ＭＤ及びＴＤ方向共
に８０％以下、好ましくは５０％以下であることが望ま
しい。 耐熱性がこの範囲外の場合、テープ収縮により
素子の巻き緩みや素子バラケが発生する恐れがある。The fact that at least one plastic film layer of the composite substrate film used in the present invention has heat resistance means, for example, solder heat in surface mounting (usually 200 to 300 ° C.).
It is not particularly limited as long as it has sufficient resistance to 1 to 5 minutes), that is, thermal dimensional stability, but in the present invention, its melting point is 200 ° C. or higher, preferably 250 ° C. or higher, and the adherend is It is desirable that the rate of thermal dimensional change within 300 minutes at a temperature of 300 ° C. or lower in the state of being bonded to is 80% or less, preferably 50% or less in both MD and TD directions. If the heat resistance is out of this range, tape winding may cause loosening of the element or variation of the element.
【００１０】かかる耐熱性を有するプラスチックフィル
ム層の材質は、その耐熱性が上記の範囲にある限り特に
限定はされないが、例えば、ポリエステル、ポリアミ
ド、ポリフェニレンサルファイド、ポリイミド、ポリカ
ーボネート、ポリスルホン、ポリエーテルエーテルケト
ン、ポリテトラフルオロエチレンなどのフッ素樹脂など
が挙げられ、特にポリエステルやポリイミドフィルムが
好ましく用いられる。The material of the heat-resistant plastic film layer is not particularly limited as long as the heat resistance is within the above range, and examples thereof include polyester, polyamide, polyphenylene sulfide, polyimide, polycarbonate, polysulfone and polyether ether ketone. , And fluororesins such as polytetrafluoroethylene, and polyester and polyimide films are particularly preferably used.
【００１１】また、本発明で用いる複合基材フィルムの
少なくとも一層のプラスチックフィルム層が耐溶剤性を
有するとは、電解液成分として用いられる極性又は誘電
率の高い有機溶剤に対して十分な耐性、即ち熱寸法、破
断強度、伸び率などの安定性を有する限り特に限定され
ないが、本発明においては特に、被着体に貼り合わせた
状態で、ＳＰ値９．０以上の極性溶剤に常温で２時間浸
漬した後、２５０℃で５分又は１２０℃以下で１０００
時間後の熱寸法変化率が、ＭＤ及びＴＤ方向共に８０％
以下、好ましくは９０％以下であり、かつその破断強度
及び伸び率の減衰率が共に９０％以下、好ましくは５０
％以下であることが望ましい。 ここでＳＰ値が９．０
以上の極性溶剤としては、例えば、エチレングリコー
ル、γ−ブチロラクトン、ジメチルホルムアミド、ジメ
チルアセトアミドなどのアミド類、プロピレンカーボネ
ート、ラクトン類などが挙げられる。 耐溶剤性がこの
範囲外の場合、テープ収縮により素子の巻き緩みや素子
バラケが発生する恐れがある。Further, at least one plastic film layer of the composite substrate film used in the present invention has solvent resistance means that it has sufficient resistance to an organic solvent having a high polarity or a high dielectric constant used as an electrolyte solution component, That is, it is not particularly limited as long as it has stability such as thermal dimension, breaking strength, and elongation. After soaking for 5 hours, 250 ℃ for 5 minutes or 120 ℃ or less
Thermal dimensional change rate after time is 80% in both MD and TD directions
The following is preferably 90% or less, and both the breaking strength and the attenuation rate of elongation are 90% or less, preferably 50%.
% Or less is desirable. Here, the SP value is 9.0.
Examples of the polar solvent include amides such as ethylene glycol, γ-butyrolactone, dimethylformamide and dimethylacetamide, propylene carbonate and lactones. If the solvent resistance is out of this range, tape shrinkage may cause loosening of the element or element variation.
【００１２】かかる耐溶剤性を有するプラスチックフィ
ルム層の材質は、その耐溶剤性が上記の範囲にある限り
特に限定はされないが、例えば、フッ化ビニリデン、ポ
リテトラフルオロエチレンなどのフッ素樹脂、ポリエチ
レン、ポリプロピレン、ポリメチルペンテンなどのポリ
オレフィン系樹脂、ポリビニルアルコールなどが挙げら
れ、特にポリエチレン、ポリプロピレン、フッ化ビニリ
デンが好ましく用いられる。The material of the solvent-resistant plastic film layer is not particularly limited as long as the solvent resistance is within the above range. For example, vinylidene fluoride, fluororesin such as polytetrafluoroethylene, polyethylene, Polyolefin, polyolefin resin such as polymethylpentene, polyvinyl alcohol and the like can be mentioned, and particularly polyethylene, polypropylene and vinylidene fluoride are preferably used.
【００１３】かかる複合基材フィルムにおける上記各フ
ィルム層の二層もしくは三層以上を積層する方法は特に
限定されないが、例えばウレタン系やイソシアネート系
の接着剤や粘着剤により貼り合わせることができる。
この接着剤あるいは粘着剤としては、本発明の粘着テー
プの使用条件下において、各フィルム層間の接着力が５
００ｇ／25mm幅以上、好ましくは１０００ｇ／25mm幅以
上となるようなものを用いる。 この接着力が５００ｇ
／25mm幅未満の場合、巻止め部材としての機能が低下
し、さらに巻止めの作業性が悪くなる恐れがある。 ま
た接着剤層あるいは粘着剤層の厚みはフィルム間の接着
力、各フィルム層のの弾性率及び厚みを考慮して、例え
ば１〜５０μｍ、好ましくは１〜１０μｍとするのが望
ましい。The method of laminating two or more layers of each of the above-mentioned film layers in such a composite substrate film is not particularly limited, but it is possible to bond them by using, for example, a urethane-based or isocyanate-based adhesive or pressure-sensitive adhesive.
As this adhesive or pressure-sensitive adhesive, the adhesive force between the film layers is 5 under the use conditions of the pressure-sensitive adhesive tape of the present invention.
A material having a width of 00 g / 25 mm or more, preferably 1000 g / 25 mm or more is used. This adhesion is 500g
If the width is less than / 25 mm, the function as the winding stop member may be deteriorated, and the workability of the winding stop may be deteriorated. The thickness of the adhesive layer or the pressure-sensitive adhesive layer is, for example, 1 to 50 μm, preferably 1 to 10 μm in consideration of the adhesive force between films, the elastic modulus and thickness of each film layer.
【００１４】上記各層から構成される複合基材フィルム
は、その全体の弾性率が１０〜１０００kg／mm2 となる
ように、個々のフィルム層及び接着剤層の厚みを決め、
その総厚みが５〜２００μｍ、好ましくは１５〜８０μ
ｍとなるように構成することが望ましい。The thickness of each film layer and the adhesive layer of the composite substrate film composed of the above layers is determined so that the elastic modulus of the whole is 10 to 1000 kg / mm 2 .
Its total thickness is 5-200 μm, preferably 15-80 μm
It is desirable to configure so that m.
【００１５】またこの複合基材フィルムを電解コンデン
サの素子止め部材として使用する場合には、その基材フ
ィルム中の塩素イオン濃度が高くなると、電極、アルミ
ケース等の腐食が促進され、コンデンサ能力が低下する
ため、複合基材フィルム中の硫酸銀、ハロゲンイオン、
無機物イオンの含有率を１００ｐｐｍ以下とすることが
好ましい。When this composite base material film is used as an element stopping member for an electrolytic capacitor, when the chlorine ion concentration in the base material film becomes high, corrosion of the electrodes, aluminum case, etc. is promoted, and the capacity of the capacitor is improved. Since it decreases, silver sulfate, halogen ions in the composite substrate film,
It is preferable that the content rate of the inorganic ion is 100 ppm or less.
【００１６】本発明の粘着テープは、上記複合基材フィ
ルム上に粘着剤層が設けられており、かかる粘着剤は特
に限定されないが、例えばアクリル系、シリコーン系、
ゴム系、あるいはホットメルト系が挙げられ、その厚み
は通常１〜１００μｍ、好ましくは５〜５０μｍが望ま
しい。In the pressure-sensitive adhesive tape of the present invention, a pressure-sensitive adhesive layer is provided on the above-mentioned composite substrate film, and the pressure-sensitive adhesive is not particularly limited. For example, acrylic type, silicone type,
Examples thereof include rubber type and hot melt type, and the thickness thereof is usually 1 to 100 μm, preferably 5 to 50 μm.
【００１７】上記の如く構成された本発明の複合粘着テ
ープもしくはシートは、巻回絶縁体、例えば電解コンデ
ンサ素子、フィルムコンデンサ、電池素子などの外周に
巻き付け端末固定に用いることができ、またプリント基
板などのマスキングや機構部品（スイッチ、コネクタな
ど）などのカバーレイなどにも用いることができる。The composite pressure-sensitive adhesive tape or sheet of the present invention constructed as described above can be wound around an outer periphery of a wound insulator such as an electrolytic capacitor element, a film capacitor, a battery element or the like to be used for fixing a terminal, and a printed circuit board. It can also be used for masking such as and cover lay for mechanical parts (switch, connector, etc.).
【００１８】例えばアルミニウム箔からなる陽極箔と陰
極箔とを電解紙を介して巻回したコンデンサ素子の外周
を、本発明の複合粘着テープ又はシートにより巻回して
なる電解コンデンサを得ることができる。For example, an electrolytic capacitor can be obtained in which the outer periphery of a capacitor element obtained by winding an anode foil and a cathode foil made of aluminum foil via electrolytic paper is wound with the composite adhesive tape or sheet of the present invention.
【００１９】[0019]
【実施例】以下、本発明を実施例によりさらに詳しく説
明するが、本発明はこれらに何ら限定されるものではな
い。 実施例１ 図１に示す如く、ポリプロピレンフィルム（厚さ５μ
ｍ）１をウレタン系接着剤２（厚さ２μｍ）を介してポ
リエステルフィルム３（厚さ１５μｍ）にラミネートす
ることにより得た複合基材フィルムのポリエステルフィ
ルム３上に、ゴム（ＮＲ−ＳＢＲ）系粘着剤４を塗布
し、乾燥温度１３０℃×１分間にて処理して、総厚さ５
３μｍの粘着テープを得た。EXAMPLES The present invention will be described in more detail with reference to examples below, but the present invention is not limited thereto. Example 1 As shown in FIG. 1, a polypropylene film (thickness 5 μm
m) 1 on the polyester film 3 of the composite substrate film obtained by laminating the polyester adhesive film 2 (thickness 2 μm) on the polyester film 3 (thickness 15 μm), rubber (NR-SBR) type. Adhesive 4 is applied and treated at a drying temperature of 130 ° C for 1 minute to give a total thickness of 5
A 3 μm adhesive tape was obtained.
【００２０】実施例２ 図２に示す如く、Ｔダイス押出機にて成膜した低密度ポ
リエチレン樹脂フィルム５（厚さ１０μｍ）に、コロナ
処理されたポリエチレンナフタレートフィルム６（厚さ
３０μｍ）を、ウレタン系接着剤２（厚さ２μｍ）を介
して熱ラミネートロールによりて処理面にて貼り合わせ
た。 得られた複合基材フィルムのポリエチレンナフタ
レートフィルム６上に、アクリル系粘着剤７を塗布し、
総厚さ７０μｍの粘着テープを得た。Example 2 As shown in FIG. 2, a corona-treated polyethylene naphthalate film 6 (thickness 30 μm) was formed on a low-density polyethylene resin film 5 (thickness 10 μm) formed by a T-die extruder. The urethane-based adhesive 2 (thickness: 2 μm) was used to bond the treated surface with a heat laminating roll. Acrylic adhesive 7 is applied on polyethylene naphthalate film 6 of the obtained composite substrate film,
An adhesive tape having a total thickness of 70 μm was obtained.
【００２１】実施例３ 図３に示す如く、コロナ処理されたポリテトラフルオロ
エチレンフィルム８（厚さ１０μｍ）の処理面にウレタ
ン系接着剤２（厚さ２μｍ）を塗布し、ポリエステルフ
ィルム９（厚さ２５μｍ）と貼り合わせて得た二層フィ
ルムのポリエステルフィルム面にさらに前述のウレタン
系接着剤２（厚さ２μｍ）を塗布し、両面がコロナ処理
されたポリプロピレンフィルム１０（厚さ１５μｍ）を
貼り合わせた。 得られた三層からなる複合基材フィル
ムのポリプロピレンフィルム面に実施例２と同じアクリ
ル系粘着剤７を塗布し、総厚８０μｍの粘着テープを得
た。Example 3 As shown in FIG. 3, the urethane-based adhesive 2 (thickness 2 μm) was applied to the treated surface of the polytetrafluoroethylene film 8 (thickness 10 μm) which had been subjected to the corona treatment, and the polyester film 9 (thickness) 25 μm) and the above-mentioned urethane adhesive 2 (thickness 2 μm) is further applied to the polyester film surface of the two-layer film obtained by bonding the polypropylene film 10 (thickness 15 μm) having corona treatment on both sides. I matched it. The same acrylic pressure-sensitive adhesive 7 as in Example 2 was applied to the polypropylene film surface of the obtained composite substrate film having three layers to obtain a pressure-sensitive adhesive tape having a total thickness of 80 μm.
【００２２】比較例１ ポリプロピレンフィルム（５０μｍ）に実施例１と同様
の粘着剤を塗布し、総厚さ７０μｍの粘着テープを得
た。Comparative Example 1 A polypropylene film (50 μm) was coated with the same adhesive as in Example 1 to obtain an adhesive tape having a total thickness of 70 μm.
【００２３】比較例２ ポリイミドフィルム（１２．５μｍ）に実施例２と同様
の粘着剤を塗布し、総厚さ４５μｍの粘着テープを得
た。Comparative Example 2 A polyimide film (12.5 μm) was coated with the same adhesive as in Example 2 to obtain an adhesive tape having a total thickness of 45 μm.
【００２４】実施例及び比較例で得た粘着テープの各種
特性を測定、評価し、その結果を表１に示す。 この結
果から本発明の複合粘着テープは、耐熱性及び耐溶剤性
に優れ、端末剥がれもなく、極めて実用的な巻止め用複
合粘着テープであることがわかる。Various characteristics of the adhesive tapes obtained in Examples and Comparative Examples were measured and evaluated, and the results are shown in Table 1. From these results, it can be seen that the composite adhesive tape of the present invention is a highly practical composite adhesive tape for winding, which has excellent heat resistance and solvent resistance, does not peel off at the ends.
【００２５】[0025]
【表１】 [Table 1]
【００２６】ここで各特性の測定方法は以下の通りであ
る。 〔引張強度、及び伸び率〕ＪＩＳ−Ｃ２３１８に準じ
て、各粘着テープを定速緊張型引張試験機を用いて、幅
１５ｍｍ、つかみ間約１００ｍｍで３００±２０ｍｍ／
ｍｉｎの速さで引っ張り、切断したときの引張荷重及び
伸びを測定した。Here, the measuring method of each characteristic is as follows. [Tensile Strength and Elongation Rate] According to JIS-C2318, each adhesive tape was measured using a constant speed tension type tensile tester with a width of 15 mm and a gripping distance of about 100 mm of 300 ± 20 mm /
Tensile load and elongation when pulled and cut at a speed of min were measured.
【００２７】〔弾性率〕ＪＩＳ−Ｋ７１１３に準じて、
上記の荷重−伸び曲線より初期弾性率を求めた。[Elastic Modulus] According to JIS-K7113,
The initial elastic modulus was determined from the above load-elongation curve.
【００２８】〔熱寸法変化率〕各粘着テープを電解コン
デンサ素子に貼り合わせた状態で、２５０℃で５分間放
置したときのＭＤ方向及びＴＤ方向の熱寸法変化率を測
定した。[Thermal dimensional change rate] The thermal dimensional change rate in the MD and TD directions was measured when each adhesive tape was attached to an electrolytic capacitor element and left at 250 ° C. for 5 minutes.
【００２９】〔引張強度Ａ〕各粘着テープを電解コンデ
ンサ素子に貼り合わせた状態で、γ−ブチロラクトンに
２４時間浸漬後、２５０℃で５分間放置した後、テープ
を剥離し、引張り強度試験機にて３００ｍｍ／ｍｉｎの
速度で強度、伸度を測定した。[Tensile Strength A] After each adhesive tape was attached to an electrolytic capacitor element, it was immersed in γ-butyrolactone for 24 hours, then left at 250 ° C. for 5 minutes, and then the tape was peeled off to obtain a tensile strength tester. Strength and elongation were measured at a speed of 300 mm / min.
【００３０】〔引張強度Ｂ〕各粘着テープを電解コンデ
ンサ素子に貼り合わせた状態で、γ−ブチロラクトンに
浸漬したまま、１２０℃で１０００時間放置した後、テ
ープを剥離し、引張り強度試験機にて３００ｍｍ／ｍｉ
ｎの速度で強度、伸度を測定した。[Tensile Strength B] While each adhesive tape was attached to an electrolytic capacitor element, the tape was peeled off by leaving it for 1000 hours at 120 ° C. while being immersed in γ-butyrolactone, and then peeled off with a tensile strength tester. 300 mm / mi
Strength and elongation were measured at a speed of n.
【００３１】〔端末ハガレ〕各粘着テープを電解コンデ
ンサ素子に貼り合わせた状態の試料片を５個作成し、室
温でγ−ブチロラクトンに５００時間浸漬した後、テー
プの端末ハガレの有無を調べ、５個中の端末ハガレ個数
をカウントした。[Terminal peeling] Five sample pieces in a state where each adhesive tape was attached to an electrolytic capacitor element were prepared and immersed in γ-butyrolactone for 500 hours at room temperature, and then the presence or absence of terminal peeling of the tape was examined. The number of peeled terminals was counted.
【００３２】〔実用性〕各粘着テープの電解コンデンサ
の巻止めの固着性を下記基準にて評価した。 ○ 良好 △ やや緩む × 完全にテープがほぐれ、固着していない[Practicality] The adhesiveness of the winding stop of the electrolytic capacitor of each adhesive tape was evaluated according to the following criteria. ○ Good △ Slightly loose × Tape is completely loosened and not fixed
【００３３】[0033]
【発明の効果】本発明の複合粘着テープは、有機溶剤に
対する耐性に優れ、かつ面実装での半田熱に対する熱寸
法変化率が小さいという特性を併せ持つため、種々の巻
回絶縁体、例えば電解コンデンサ、電池素子（フィルム
コンデンサ）などの巻止めに好適に用いることができ
る。EFFECT OF THE INVENTION The composite adhesive tape of the present invention has both excellent resistance to organic solvents and a small thermal dimensional change rate with respect to solder heat in surface mounting. Therefore, various wound insulators such as electrolytic capacitors can be used. It can be suitably used for winding a battery element (film capacitor) or the like.
【図１】本発明の複合粘着テープの一例を示す断面図で
ある。FIG. 1 is a cross-sectional view showing an example of a composite adhesive tape of the present invention.
【図２】本発明の複合粘着テープの他例を示す断面図で
ある。FIG. 2 is a cross-sectional view showing another example of the composite adhesive tape of the present invention.
【図３】本発明の複合粘着テープの他例を示す断面図で
ある。FIG. 3 is a cross-sectional view showing another example of the composite adhesive tape of the present invention.
１、３、５、６、８、９、１０ フィルム層 ２ 接着剤層 ４、７ 粘着剤層 1, 3, 5, 6, 8, 9, 10 Film layer 2 Adhesive layer 4, 7 Adhesive layer
───────────────────────────────────────────────────── フロントページの続き (72)発明者 相澤 馨 大阪府茨木市下穂積１丁目１番２号 日東 電工株式会社内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Kaoru Aizawa 1-2-1, Shimohozumi, Ibaraki City, Osaka Prefecture Nitto Denko Corporation
Claims (7)
層から構成される複合基材フィルムであって、その少な
くとも一層のプラスチックフィルム層が耐熱性を有し、
他の少なくとも一層のプラスチックフィルム層が耐溶剤
性を有し、かつその弾性率が１０〜１０００kg／mm2 で
ある複合基材フィルム上に、粘着剤層が設けられてなる
複合粘着テープ又はシート。1. A composite substrate film comprising at least two plastic film layers, wherein at least one plastic film layer has heat resistance.
A composite pressure-sensitive adhesive tape or sheet in which a pressure-sensitive adhesive layer is provided on a composite base material film in which at least one other plastic film layer has solvent resistance and the elastic modulus is 10 to 1000 kg / mm 2 .
フィルム層の厚さが、他方の層の厚さに対して、厚み比
で１／１００〜１００／１であることを特徴とする請求
項１記載の複合粘着テープ又はシート。2. The thickness of one plastic film layer of the composite substrate film is 1/100 to 100/1 in terms of a thickness ratio with respect to the thickness of the other layer. The composite pressure-sensitive adhesive tape or sheet as described above.
ラスチックフィルム層が、その融点が２００℃以上であ
り、かつ、被着体に貼り合わせた状態で、３００℃以
下、５分以内での熱寸法変化率が、ＭＤ及びＴＤ方向共
に８０％以下である、耐熱性を有することを特徴とする
請求項１記載の巻止め用複合粘着テープ又はシート。3. A composite substrate film having at least one plastic film layer having a melting point of 200 ° C. or higher and a thermal dimension of 300 ° C. or lower and within 5 minutes when adhered to an adherend. The composite pressure-sensitive adhesive tape or sheet according to claim 1, which has heat resistance such that the rate of change is 80% or less in both MD and TD directions.
ラスチックフィルム層が、被着体に貼り合わせた状態
で、ＳＰ値９．０以上の極性溶剤に常温で２時間浸漬し
た後、２５０℃で５分又は１２０℃以下で１０００時間
経過後の熱寸法変化率が、ＭＤ及びＴＤ方向共に８０％
以下であり、かつその破断強度及び伸び率の減衰率が共
に９０％以下である、耐溶剤性を有することを特徴とす
る請求項１記載の複合粘着テープ又はシート。4. A composite substrate film, in which at least one plastic film layer is adhered to an adherend, immersed in a polar solvent having an SP value of 9.0 or more at room temperature for 2 hours, and then at 250 ° C. for 5 hours. The rate of thermal dimensional change after a lapse of 1000 minutes at a temperature of 120 ° C or less is 80% in both MD and TD
The composite pressure-sensitive adhesive tape or sheet according to claim 1, wherein the composite pressure-sensitive adhesive tape or sheet has the following properties, and has a breaking strength and an elongation reduction ratio of 90% or less.
求項４記載のフィルム層であり、他の層が請求項３記載
のフィルム層であることを特徴とする請求項１記載の複
合粘着テープ又はシート。5. The composite pressure-sensitive adhesive tape according to claim 1, wherein at least one layer of the composite substrate film is the film layer according to claim 4, and the other layer is the film layer according to claim 3. Sheet.
ことを特徴とする請求項１〜５記載の複合粘着テープ又
はシート。6. The composite adhesive tape or sheet according to claim 1, which is used for fixing an end of an electrolytic capacitor element.
したコンデンサ素子の外周を請求項１〜６記載の複合粘
着テープ又はシートにより巻回してなる電解コンデン
サ。7. An electrolytic capacitor obtained by winding the outer periphery of a capacitor element obtained by winding an anode foil and a cathode foil via electrolytic paper with the composite adhesive tape or sheet according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30147793A JPH07150120A (en) | 1993-12-01 | 1993-12-01 | Composite pressure-sensitive adhesive tape or sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30147793A JPH07150120A (en) | 1993-12-01 | 1993-12-01 | Composite pressure-sensitive adhesive tape or sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07150120A true JPH07150120A (en) | 1995-06-13 |
Family
ID=17897380
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30147793A Pending JPH07150120A (en) | 1993-12-01 | 1993-12-01 | Composite pressure-sensitive adhesive tape or sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07150120A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003132875A (en) * | 2001-10-24 | 2003-05-09 | Matsushita Electric Ind Co Ltd | Lithium secondary battery |
| JP2008283118A (en) * | 2007-05-14 | 2008-11-20 | Nitto Denko Corp | Winding stop tape for aluminum electrolytic capacitor element, and aluminum electrolytic capacitor |
| KR20160143058A (en) * | 2015-06-04 | 2016-12-14 | 주식회사 테이팩스 | Seal tape, preparation method thereof and lithium secondary battery comprising the same |
-
1993
- 1993-12-01 JP JP30147793A patent/JPH07150120A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003132875A (en) * | 2001-10-24 | 2003-05-09 | Matsushita Electric Ind Co Ltd | Lithium secondary battery |
| JP2008283118A (en) * | 2007-05-14 | 2008-11-20 | Nitto Denko Corp | Winding stop tape for aluminum electrolytic capacitor element, and aluminum electrolytic capacitor |
| KR20160143058A (en) * | 2015-06-04 | 2016-12-14 | 주식회사 테이팩스 | Seal tape, preparation method thereof and lithium secondary battery comprising the same |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2001074585A1 (en) | Metallized polyimide film | |
| JP5883542B2 (en) | Copper-clad laminate with protective layer and multilayer printed wiring board | |
| JPWO2007015372A1 (en) | Anisotropic conductive film and manufacturing method thereof | |
| TW200912491A (en) | Film and reel for anisotropic electroconductive connection | |
| JPH04221629A (en) | Conductor foil assembly and manufacture of conductor foil assembly as well as conductor foil laminate | |
| JPH0458146B2 (en) | ||
| JPH0762302A (en) | Composite pressure-sensitive adhesive tape or sheet | |
| JPH07150120A (en) | Composite pressure-sensitive adhesive tape or sheet | |
| US5501897A (en) | Tracking resistant pressure-sensitive adhesive tape | |
| JPH05217446A (en) | Protective method of conductive foil, protective conductive-foil aggregate used for said method and protective conductive-foil laminated object | |
| JP2002211677A (en) | Bottom cover tape for electronic component carrier | |
| JP3680669B2 (en) | Multilayer anisotropic conductive film laminate | |
| WO2014181659A1 (en) | Transparent-circuit-board manufacturing method | |
| JP2000244083A (en) | Flexible circuit board | |
| JP4916057B2 (en) | Protective film for FPC, resin conductor foil laminate with protective film for FPC, and method for producing flexible printed wiring board using the same | |
| JP2003305792A (en) | Laminated resin sheet | |
| JP2010129802A (en) | Method of manufacturing flexible wiring circuit board | |
| JP5379469B2 (en) | Chemical treatment method | |
| JP2000208563A (en) | Film carrier tape | |
| JPH0473824A (en) | Tracking resistant adhesive tape | |
| US9648723B2 (en) | Process of fabricating printed circuit board | |
| CN209890542U (en) | Double-sided silica gel polyimide adhesive tape | |
| JPH03209792A (en) | Both-side metal-cladded flexible printed circuit board and manufacture thereof | |
| JPS5842290A (en) | Substrate for flexible printed circuit | |
| JPH11135097A (en) | Manufacture of battery separator |