JPH07146309A - Multi-wired probe - Google Patents

Abstract

PURPOSE:To enable a multi-wired probe to inspect even narrow-pitched circuits by fixing contact wires which are coated with insulating layers and have specific mum-order thicknesses and spring properties with resin-molded plates in an arranging state and forming the wires in U-shapes by removing the insulating layers from the wires at their contacting sections. CONSTITUTION:Contact wires 12 which are coated with insulating layers and have specific mum-order thicknesses and spring properties are fixed with resin-molded plates in an arranging state and the wires 12 are formed in U-shapes by removing the insulating layers from the wires at their contacting sections 14. A multi-wired probe 15 constituted in such a way can inspect circuits for continuity without hindrance even when the arranging pitches of the circuits is short. Since the sections 14 are formed in U-shapes, in addition, the sections 14 do not shave off circuits to be inspected even when the sections 14 are repeatedly brought into contact with the circuits and can be brought into contact under high contact pressures, resulting in stable contact and, at the same time, the buckling of the wires 12 at the contacting sections 12 can be prevented. Moreover, the wires do not short-circuit with another and no erroneous inspection occurs, since each wire 12 is coated with the insulating layer. Therefore, the inspection reliability and accuracy of the probe can be improved.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明は、微細な回路の導通検査
等を行う為のマルチワイヤープローブに関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multi-wire probe for conducting a continuity inspection of fine circuits.

【０００２】[0002]

【従来の技術】従来、微細な回路の導通検査を行うに
は、図６に示すようにバンプ又はタブ１を多数配設した
プレート型プローブ２を検査物３に当接したり、図７に
示すようにテーパ付丸線の先端を屈曲してなるＩＣタッ
チプローブ４を検査物３に当接したり、図８に示すよう
にスプリングプローブ５を検査物３に当接したりしてい
た。2. Description of the Related Art Conventionally, in order to conduct a fine circuit continuity test, as shown in FIG. 6, a plate type probe 2 having a large number of bumps or tabs 1 arranged thereon is brought into contact with a test object 3 or shown in FIG. As described above, the IC touch probe 4 formed by bending the tip of the tapered round wire is brought into contact with the inspection object 3 or the spring probe 5 is brought into contact with the inspection object 3 as shown in FIG.

【０００３】ところで、これらのプローブは、いずれも
検査物３の回路ならびにピッチが数10μｍと狭い場合、
検査できないものである。これは各プローブの接触部先
端のピッチが 100〜 300μｍと広い為であり、また数10
μｍオーダーの狭いものを作ることができなかったから
である。また、図７及び図８のプローブは、タングステ
ンやＢｅＣｕＲよりなるので、プローブの接触部先端で
検査物３の回路を削り取ってしまうという問題があっ
た。By the way, all of these probes have a circuit of the inspection object 3 and a pitch as narrow as several tens of μm.
It cannot be inspected. This is because the pitch of the contact tip of each probe is as wide as 100 to 300 μm.
This is because it was not possible to make a narrow product on the order of μm. Further, since the probe of FIGS. 7 and 8 is made of tungsten or BeCuR, there is a problem that the circuit of the inspection object 3 is scraped off at the tip of the contact portion of the probe.

【０００４】[0004]

【発明が解決しようとする課題】そこで本発明は、数10
μｍオーダーの狭いピッチの狭い回路でも検査でき、ま
た回路を削り取ることのないマルチワイヤープローブを
提供しようとするものである。Therefore, according to the present invention,
An object of the present invention is to provide a multi-wire probe that can inspect even a circuit with a narrow pitch of μm order and does not scrape the circuit.

【０００５】[0005]

【課題を解決するための手段】上記課題を解決するため
の本発明のマルチワイヤープローブは、絶縁被覆をした
数10μｍオーダーのばね性接点ワイヤーが整列されて樹
脂モールド板にて固定され、接触部は、絶縁被覆が剥さ
れてＵ字形に成形されていることを特徴とするものであ
る。In the multi-wire probe of the present invention for solving the above-mentioned problems, an insulating coating spring-like contact wire of the order of several 10 μm is aligned and fixed by a resin mold plate, and a contact portion is provided. Is characterized in that the insulating coating is peeled off to form a U-shape.

【０００６】[0006]

【作用】上記のように構成された本発明のマルチワイヤ
ープローブは、数10μｍオーダーのばね性接点ワイヤー
が整列しているので、狭いピッチの狭い回路でも検査で
きる。また接触部がＵ字形に成形されているので、検査
物の回路を削り取ることがなく、しかも測定の為繰り返
し接触しても削り取ることがない。さらに、接触部がＵ
字形である為、高い接触圧力をかけることができて、接
触が安定すると共にワイヤーの座屈が防止される。ま
た、隣り合う各ばね性接点ワイヤーは、絶縁被覆されて
いるので、短絡することがなく、検査不良が生じない。Since the multi-wire probe of the present invention constructed as described above has the spring contact wires of the order of several tens of μm aligned, it can be inspected even in a circuit with a narrow pitch. Further, since the contact portion is formed in a U-shape, the circuit of the inspection object is not scraped off, and it is not scraped off even when repeatedly contacted for measurement. Furthermore, the contact part is U
Since it is in the shape of a letter, a high contact pressure can be applied to stabilize the contact and prevent the wire from buckling. In addition, since the adjacent spring-type contact wires are insulation-coated, short-circuiting does not occur and inspection failures do not occur.

【０００７】[0007]

【実施例】本発明のマルチワイヤープローブの一実施例
を図によって説明すると、図１に示すように線径30μｍ
のＡｕ10％−Ｐｔ10％−Ｐｄ35％−Ａｇ30％−Ｃｕ14％
−Ｚｎ１％よりなるワイヤー10に 7.5μｍの厚さでウレ
タン (又はエポキシ)11 をコーティングして絶縁被覆し
た。次にこの絶縁被覆したコーティングワイヤー12を
1,280本整列し、図２に示すように長手方向に15mmピッ
チでエポキシの樹脂モールド板13を取付けて、コーティ
ングワイヤー12を固定した。然る後図３に示すように絶
縁被覆のコーティングワイヤー12をＵ字形に屈曲成形す
ると共に樹脂モールド板13を貼り合わせた。然る後、図
４に示すようにＵ字形に屈曲成形されたコーティングワ
イヤー12の絶縁被覆であるウレタン (又はエポキシ)11
を熱処理により除去して接触部14を形成した。EXAMPLE An example of the multi-wire probe of the present invention will be described with reference to the drawing. As shown in FIG. 1, the wire diameter is 30 μm.
Au 10% -Pt 10% -Pd 35% -Ag 30% -Cu 14%
A wire 10 made of 1% Zn was coated with urethane (or epoxy) 11 to a thickness of 7.5 μm for insulation. Next, the insulating coated wire 12
1,280 pieces were aligned, and an epoxy resin mold plate 13 was attached at a pitch of 15 mm in the longitudinal direction as shown in FIG. 2, and the coating wire 12 was fixed. Thereafter, as shown in FIG. 3, the coating wire 12 having an insulation coating was bent and formed into a U shape, and the resin mold plate 13 was bonded. Then, as shown in FIG. 4, urethane (or epoxy) 11 which is an insulation coating of the coating wire 12 which is bent and formed in a U shape is formed.
Was removed by heat treatment to form the contact portion 14.

【０００８】こうして得られたマルチワイヤープローブ
15は、図５に示すように検査物３の回路にＵ字形の接触
部14を当接して、導通検査する。この時、検査物３の回
路ならびにそのピッチが数10μｍと狭くとも何ら支障な
く導通検査できる。また接触部14がＵ字形であるため、
検査物の回路を削り取ることがなく、しかも測定の為繰
り返し接触しても削り取ることがない。さらに、接触部
14がＵ字形である為、高い接触圧力をかけることができ
て、接触が安定すると共に接触部14のワイヤーの座屈が
防止される。また隣り合う各ワイヤー10はウレタン11で
絶縁被覆されているので、短絡することがなく。検査不
良が生じることがない。The multi-wire probe thus obtained
As shown in FIG. 5, the reference numeral 15 makes a U-shaped contact portion 14 contact the circuit of the inspection object 3 to conduct a continuity inspection. At this time, even if the circuit of the inspection object 3 and its pitch are as narrow as several tens of μm, the continuity inspection can be performed without any trouble. Moreover, since the contact portion 14 is U-shaped,
The circuit of the object to be inspected is not scraped off, and it is not scraped off even after repeated contact due to measurement. Furthermore, the contact part
Since 14 is U-shaped, a high contact pressure can be applied, the contact is stabilized, and the buckling of the wire at the contact portion 14 is prevented. Also, since each adjacent wire 10 is insulation-coated with urethane 11, there is no short circuit. Inspection failure does not occur.

【０００９】尚、上記実施例のマルチワイヤープローブ
15では、ワイヤー10にＡｕ10％−Ｐｔ10％−Ｐｄ35％−
Ａｇ30％−Ｃｕ14％−Ｚｎ１％よりなる合金を用いた
が、これに限るものではなく、ばね性、耐食性ならびに
電気接触特性の良い材料ならばどのようなものでも良
い。The multi-wire probe of the above embodiment
In No.15, the wire 10 has Au10% -Pt10% -Pd35%-
Although an alloy composed of Ag30% -Cu14% -Zn1% was used, the material is not limited to this, and any material having good spring property, corrosion resistance and electrical contact property may be used.

【００１０】[0010]

【発明の効果】以上の通り本発明のマルチワイヤープロ
ーブは、検査する回路ならびにそのピッチが狭くとも何
ら支障がなく導通検査できる。また、接触部がＵ字形で
ある為、例え繰り返し接触しても検査物の回路を削り取
ることがなく、その上高い接触圧力をかけることができ
て接触が安定すると共に接触部のワイヤーの座屈が防止
される。さらに隣り合う各ワイヤーが絶縁被覆されてい
るので、短絡することがなく、検査不良が生じることが
ない。従って検査の信頼性が向上し、検査精度が高くな
る。As described above, the multi-wire probe of the present invention can perform the continuity inspection without any trouble even if the circuit to be inspected and its pitch are narrow. Also, since the contact part is U-shaped, even if it repeatedly contacts, the circuit of the inspection object is not scraped off, high contact pressure can be applied and the contact is stable and the wire buckling of the contact part Is prevented. Further, since the wires adjacent to each other are insulation-coated, there is no short circuit and no inspection failure occurs. Therefore, the reliability of the inspection is improved and the inspection accuracy is increased.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明のマルチワイヤープローブの一実施例の
製造工程を示す図である。FIG. 1 is a diagram showing a manufacturing process of an embodiment of a multi-wire probe of the present invention.

【図２】本発明のマルチワイヤープローブの一実施例の
製造工程を示す図である。FIG. 2 is a diagram showing a manufacturing process of an embodiment of the multi-wire probe of the present invention.

【図３】本発明のマルチワイヤープローブの一実施例の
製造工程を示す図である。FIG. 3 is a diagram showing a manufacturing process of an embodiment of the multi-wire probe of the present invention.

【図４】本発明のマルチワイヤープローブの一実施例の
製造工程を示す図である。FIG. 4 is a diagram showing a manufacturing process of an embodiment of the multi-wire probe of the present invention.

【図５】本発明のマルチワイヤープローブを検査物に当
接して導通検査する状態を示す図である。FIG. 5 is a diagram showing a state in which the multi-wire probe of the present invention is brought into contact with a test object to conduct a continuity test.

【図６】従来のプレート型プローブによる検査物の導通
検査の状況を示す概略図である。FIG. 6 is a schematic view showing a state of a continuity inspection of an inspection object by a conventional plate type probe.

【図７】従来の１Ｃタッチプローブによる検査物の導通
検査の状況を示す概略図である。FIG. 7 is a schematic diagram showing a state of a continuity test of a test object by a conventional 1C touch probe.

【図８】従来のスプリングプローブによる検査物の導通
検査の状況を示す概略図である。FIG. 8 is a schematic view showing a situation of a continuity inspection of an inspection object by a conventional spring probe.

【符号の説明】[Explanation of symbols]

10 ワイヤ 11 ウレタン (絶縁被覆) 12 コーティングワイヤー 13 樹脂モールド板 14 接触部 15 マルチワイヤープローブ 10 Wire 11 Urethane (insulating coating) 12 Coated wire 13 Resin mold plate 14 Contact part 15 Multi-wire probe

Claims (1)

【特許請求の範囲】[Claims] 【請求項１】 絶縁被覆した数10μｍオーダーのばね性
接点ワイヤーが整列されて樹脂モールド板にて固定さ
れ、接触部は絶縁被覆が剥されてＵ字形に成形されてい
ることを特徴とするマルチワイヤープローブ。1. A multi-type in which insulating-coated spring-like contact wires of the order of several 10 μm are aligned and fixed by a resin mold plate, and the insulating coating is peeled off at the contact portion to form a U-shape. Wire probe.