JPH07145471A - Hard alloy mold for resin and powder molding - Google Patents
Hard alloy mold for resin and powder moldingInfo
- Publication number
- JPH07145471A JPH07145471A JP31410293A JP31410293A JPH07145471A JP H07145471 A JPH07145471 A JP H07145471A JP 31410293 A JP31410293 A JP 31410293A JP 31410293 A JP31410293 A JP 31410293A JP H07145471 A JPH07145471 A JP H07145471A
- Authority
- JP
- Japan
- Prior art keywords
- metal molds
- powder
- metal
- raw materials
- hard alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Powder Metallurgy (AREA)
- Physical Vapour Deposition (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、樹脂及び粉末をプレス
成形、射出成形する場合等に用いられる硬質合金金型に
関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hard alloy mold used for press molding or injection molding of resin and powder.
【０００２】[0002]
【従来の技術】粉末冶金における原料粉末のプレス成形
には古くから超硬合金が用いられている。最近はプレス
成形におけるニアネットシェイプ化に伴い、パンチ形状
も多様化し、パンチ面が受ける圧力も均一ではなく、局
所的に高圧になったりする場合が増えてきている。ま
た、成形助剤として用いられるワックス、樹脂も目的に
応じ、その種類が増えてきている。そこで最近では、特
にパンチ面のプレス圧が高圧な部分に局所的に粉末や樹
脂が付着する現象が発生し、製品精度の劣化、作業効率
の劣化を招いている。2. Description of the Related Art Cemented carbide has been used for a long time in press molding of raw material powder in powder metallurgy. With the recent trend toward near-net shapes in press molding, the shape of punches has diversified, and the pressure applied to the punch surface is not uniform, and there are increasing cases where the pressure locally becomes high. Further, the types of waxes and resins used as molding aids are increasing depending on the purpose. Therefore, in recent years, a phenomenon in which powder or resin is locally adhered to a portion of the punch surface where the press pressure is high is caused, resulting in deterioration of product accuracy and deterioration of work efficiency.
【０００３】また、ＩＣに使用されている樹脂をプレス
成形、射出成形する場合においても上述した付着現象が
発生する。この場合、樹脂自体が金型に対する腐蝕性成
分を含有するため、金型の腐蝕が付着現象の発生を助長
する一因となる。この様な問題を解決する手段とし、一
時、金型のセラミック化が試みられた。しかし、セラミ
ックは金型の付着、腐蝕に対しては、効果が認められる
ものの金型の強度不足をもたらし金型の破損、チッピン
グ等の問題で一部しか普及していないのが現状である。The above-mentioned adhesion phenomenon also occurs when the resin used in the IC is press-molded or injection-molded. In this case, since the resin itself contains a corrosive component for the mold, the corrosion of the mold contributes to the occurrence of the adhesion phenomenon. As a means for solving such a problem, it has been attempted to make the mold ceramic. However, although ceramics are effective against the adhesion and corrosion of molds, the current situation is that ceramics are not widely used due to problems such as insufficient mold strength, damage to the molds, and chipping.
【０００４】また、最近では金型にＰＶＤやＣＶＤコー
ティングを施すことにより、硬質皮膜を金型表面に成膜
する技術が開発されている。しかしこの場合は、Ｔｉ系
の炭化物、炭窒化物、窒化物が主流であり、硬度も十分
ではなく繰り返し使用時における摩耗発生による寿命が
短い。また、皮膜の凹凸、または皮膜内の欠陥により付
着に対し、満足にいく効果も得られていないのが現状で
ある。Further, recently, a technique has been developed in which a hard film is formed on the surface of the mold by applying PVD or CVD coating to the mold. In this case, however, Ti-based carbides, carbonitrides, and nitrides are the mainstream, the hardness is not sufficient, and the life is short due to the occurrence of wear during repeated use. In addition, the present situation is that a satisfactory effect on adhesion is not obtained due to unevenness of the film or defects in the film.
【０００５】[0005]
【発明が解決しようとする課題】本発明の目的は機械的
強度に問題を有しない硬質合金金型において、粉末、樹
脂の付着を防止するとともに腐蝕に対し耐蝕性を向上
し、金型の長寿命化を図ることを目的とする。SUMMARY OF THE INVENTION It is an object of the present invention to prevent the adhesion of powder and resin in a hard alloy mold having no problem in mechanical strength, improve corrosion resistance against corrosion, and improve the mold length. The purpose is to extend the life.
【０００６】[0006]
【課題を解決するための手段】そこで本発明者は、上述
の様な付着現象の原因を突き止めるべく種々検討した結
果、硬質合金中の金属相部分が初期に優先的に摩耗する
ことに伴う金型表面の凹凸の発生が、付着を誘発するも
のであることを確認した。例えば、炭化タングステンと
Ｃｏよりなる超硬合金においては、Ｃｏ金属相の初期の
摩耗による凹凸の発生が付着を誘発する。The inventors of the present invention have conducted various studies to find out the cause of the above-described adhesion phenomenon, and as a result, the metal phase portion in the hard alloy is preferentially worn in the early stage, and the metal It was confirmed that the generation of irregularities on the mold surface induces adhesion. For example, in a cemented carbide composed of tungsten carbide and Co, the generation of irregularities due to the initial wear of the Co metal phase induces adhesion.
【０００７】そこで、金属表面のＣｏ相を除去する手法
を検討した結果、硼化処理により金属Ｃｏ相を除去でき
るという知見を得た。つまり、金属Ｃｏ層が、硼化処理
により硼化Ｃｏ相に変わり、また１部は（ＷＣｏ）Ｂ相
に変わり、金属表面は炭化タングステンと硼化Ｃｏもし
くは（ＷＣｏ）Ｂ相より構成され、実質上金型表面に金
属Ｃｏ相がなくなるわけである。これら硼化Ｃｏ相は、
ビッカース硬さ１０００以上の数値を有しており、金属
Ｃｏ相のビッカース硬さ約３００に対し格段に硬く、金
属表面の局所的優先摩耗に基づく凹凸の発生に対し著し
い効果を発揮するわけである。Then, as a result of studying a method of removing the Co phase on the metal surface, it was found that the metal Co phase can be removed by the boriding treatment. That is, the metallic Co layer is changed to the Co boride phase by the boriding treatment, a part of the metallic Co layer is changed to the (WCo) B phase, and the metallic surface is composed of tungsten carbide and Co boride or (WCo) B phase. The metallic Co phase disappears on the surface of the upper mold. These Co boride phases are
It has a Vickers hardness of 1000 or more, is significantly harder than the Vickers hardness of the metal Co phase of about 300, and exerts a remarkable effect on the generation of irregularities due to local preferential wear of the metal surface. .
【０００８】一方、ダイヤモンド膜、ダイヤモンドライ
クカーボン膜等はビッカース硬さ５０００以上の高硬度
膜であり、このような金型の表面を被覆するには理想的
な膜である。本発明者は、ダイヤモンド膜、ダイヤモン
ドライクカーボン膜を金型へ応用する研究を重ねてきた
が、密着性に難点があり所望の特性を得られなかった。
その原因を検討した結果、金属Ｃｏの存在がダイヤモン
ド膜、ダイヤモンドライクカーボン膜の密着性を劣化さ
せることが明らかとなった。そこで、上述の硼化処理を
適用し金属Ｃｏを硼化Ｃｏに変えた金型上にダイヤモン
ド膜、ダイヤモンドライクカーボン膜を成膜した結果、
著しく密着性が改善される結果を得るに至った。On the other hand, a diamond film, a diamond-like carbon film and the like are high hardness films having a Vickers hardness of 5000 or more, and are ideal films for covering the surface of such a mold. The present inventor has conducted extensive research on applying a diamond film and a diamond-like carbon film to a mold, but the desired characteristics cannot be obtained due to the difficulty in adhesion.
As a result of examining the cause, it was revealed that the presence of metallic Co deteriorates the adhesion of the diamond film and the diamond-like carbon film. Therefore, as a result of forming the diamond film and the diamond-like carbon film on the mold in which the metal Co is changed to Co boride by applying the above-mentioned boration treatment,
The result is that the adhesion is remarkably improved.
【０００９】[0009]
【作用】次に数値限定した理由について述べる。付着に
対しては金属相のミーンフリーパス（平均厚み）が薄い
方が好ましい。そのため、炭化タングステン粒子の平均
粒径が１μｍ以下であるとより長寿命化が達成される。
Ｃｒ、Ｍｏはその含有量が０．０１％未満では腐蝕に対
し効果が認められず、また５％を越えて含有すると硬質
合金の靱性を劣化するため０．０１％以上５％以下とし
た。Next, the reason for limiting the numerical values will be described. For adhesion, it is preferable that the mean free path (average thickness) of the metal phase is thin. Therefore, when the average particle diameter of the tungsten carbide particles is 1 μm or less, a longer life is achieved.
If the content of Cr or Mo is less than 0.01%, no effect on corrosion is observed, and if it exceeds 5%, the toughness of the hard alloy deteriorates, so the content is made 0.01% to 5%.
【００１０】この発明は、上記の研究結果に基づいて成
されたものであり、硬質合金表面を硼化処理し金属成分
を除去すること及び、この上にダイヤモンドあるいはダ
イヤモンドライクカーボン膜を被覆し密着性を改善せし
めた樹脂及び粉末成形用硬質合金金型に特徴と有するも
のである。The present invention was made on the basis of the above-mentioned research results. The hard alloy surface is borated to remove metal components, and a diamond or diamond-like carbon film is coated on the hard alloy surface for close adhesion. It is characterized by a resin having improved properties and a hard alloy mold for powder molding.
【００１１】[0011]
【実施例】以下にこの発明の硬質金型について具体的に
説明する。硬質金型として８５％ＷＣ−１５％Ｃｏ合金
を２種類の粒度で試作し、またＣｏの１部をＮｉ、Ｃ
ｒ、Ｍｏで置換した合金も試作した。これらの合金にお
いてφ１０ｍｍのプレスパンチを試作した。このパンチ
をＢ4Ｃを主成分とする粉末の中で９００℃１ｈｒ硼化
処理を行い本発明パンチとした。組成及び皮膜等に付い
て表１に示す。EXAMPLES The hard mold of the present invention will be described in detail below. As a hard mold, 85% WC-15% Co alloy was trial-produced with two kinds of grain sizes, and a part of Co was Ni, C.
An alloy substituting r and Mo was also manufactured. A press punch with a diameter of 10 mm was prototyped in these alloys. This punch was borated at 900 ° C. for 1 hr in a powder containing B 4 C as a main component to obtain a punch of the present invention. Table 1 shows the composition and the film.
【００１２】[0012]
【表１】 [Table 1]
【００１３】ついで、本発明パンチと無硼化処理パンチ
に、イオンプレーティング法によりダイヤモンドライク
カーボン膜１．０μｍ、マイクロ波プラズマＣＶＤ法に
よりダイヤ膜を４μｍ成膜した。これらのパンチを用い
以下のテスト１、テスト２を行い付着性の評価を行った
結果を表２に示す。 テスト１ 粉末 超硬合金粉末（２ｗｔ％パラフ
ィンワックス添加） プレス圧力 ２．０ｔ／ｃｍ2 寿命基準 付着面積が２ｍｍ2を越えるショット回数 テスト２ 樹脂 ＩＣ封入用樹脂 引張テスト １５０℃、２.０ｔ／ｃｍ2の圧力でパンチ
面と樹脂を圧着、その後接着面の引張り強度を引張りテ
ストにて測定Then, a diamond-like carbon film of 1.0 μm was formed by an ion plating method and a diamond film of 4 μm was formed by a microwave plasma CVD method on the punch of the present invention and the boride-free processed punch. Table 2 shows the results of evaluation of adhesiveness by performing the following tests 1 and 2 using these punches. Test 1 Powder Cemented carbide powder (2 wt% paraffin wax added) Pressing pressure 2.0 t / cm 2 Life standard Number of shots where adhesion area exceeds 2 mm 2 Test 2 Resin IC encapsulating resin Tensile test 150 ° C, 2.0 t / cm crimping punch surfaces and the resin in the second pressure, measured at subsequent traction test the tensile strength of the adhesive surface
【００１４】[0014]
【表２】 [Table 2]
【００１５】先の実施例と同様の粉末を用いてＴｉＣ、
ＴａＣ等を含有する硬質合金からなるパンチを試作し、
実施例１と同様の評価をした結果を表３・表４に併記す
る。Using the same powder as in the previous embodiment, TiC,
Prototype of punch made of hard alloy containing TaC,
The results of the same evaluations as in Example 1 are also shown in Tables 3 and 4.
【００１５】[0015]
【表３】 [Table 3]
【００１６】[0016]
【表４】 [Table 4]
【００１７】[0017]
【発明の効果】表１、表２に示される結果から本発明合
金は、粉末成型時における粉末の付着現象に対し明らか
に効果が認められるとともに、ダイヤモンド及びダイヤ
モンドライクカーボン膜と基体の密着性をも改良し、膜
の剥離も発生せず、長寿命化されることが明らかであ
る。これにより、金型の長寿命化が達成されるだけでな
く、付着物を除去するための作業効率の低下を防止する
ことができるものである。From the results shown in Tables 1 and 2, the alloy of the present invention is clearly effective against the adhesion phenomenon of powder during powder molding, and the adhesion between the diamond and the diamond-like carbon film and the substrate is improved. It is also clear that the film has been improved, the film does not peel, and the life is extended. As a result, not only the life of the mold can be extended, but also the work efficiency for removing the deposit can be prevented from lowering.
フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｃ２３Ｃ 14/06 Ｆ 9271−4Ｋ 16/26 Continuation of the front page (51) Int.Cl. 6 Identification number Office reference number FI technical display location C23C 14/06 F 9271-4K 16/26
Claims (6)
及び粉末成形用硬質合金金型1. A resin and a hard alloy mold for powder molding, the surface of which is treated with boride.
ｅ、Ｃｏ、Ｎｉの１種もしくは２種以上の金属及び不可
避不純物からなることを特徴とすると請求項１記載の硬
質合金金型。2. The hard alloy is tungsten carbide and F.
The hard alloy mold according to claim 1, which is composed of one or more metals of e, Co, and Ni and inevitable impurities.
以下であることを特徴とする請求項１乃至２記載の硬質
合金金型。3. The tungsten carbide has an average particle size of 1 μm.
The hard alloy mold according to claim 1 or 2, wherein:
量％以上５重量％以下を含有する請求項１乃至３記載の
硬質合金金型。4. The hard alloy mold according to claim 1, which contains Cr and / or Mo in an amount of 0.01% by weight or more and 5% by weight or less.
ａ、６ａ族の炭化物、炭窒化物、窒化物に置き換えたこ
とを特徴とする請求項１乃至４記載の硬質合金金型。5. A part of the tungsten carbide is 4a, 5
The hard alloy mold according to any one of claims 1 to 4, characterized in that it is replaced with a carbide, carbonitride, or nitride of group a, 6a.
に、硬質炭素膜、もしくはダイヤモンドライクカーボン
膜、もしくはダイヤモンド膜を被覆したことを特徴とす
る硬質合金金型。6. A hard alloy mold comprising the hard alloy mold according to claim 1 coated with a hard carbon film, a diamond-like carbon film, or a diamond film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31410293A JP3327424B2 (en) | 1993-11-19 | 1993-11-19 | Hard alloy mold for resin and powder molding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31410293A JP3327424B2 (en) | 1993-11-19 | 1993-11-19 | Hard alloy mold for resin and powder molding |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07145471A true JPH07145471A (en) | 1995-06-06 |
| JP3327424B2 JP3327424B2 (en) | 2002-09-24 |
Family
ID=18049270
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31410293A Expired - Fee Related JP3327424B2 (en) | 1993-11-19 | 1993-11-19 | Hard alloy mold for resin and powder molding |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3327424B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011068991A (en) * | 2009-09-25 | 2011-04-07 | Hamilton Sundstrand Corp | Wear-resistant device and method for treating the same |
| CN108165930A (en) * | 2018-01-16 | 2018-06-15 | 马鞍山市新桥工业设计有限公司 | A kind of metallic surface treatment process |
| CN114427058A (en) * | 2022-01-06 | 2022-05-03 | 四川神工钨钢刀具有限公司 | Hard alloy and manufacturing method thereof |
-
1993
- 1993-11-19 JP JP31410293A patent/JP3327424B2/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011068991A (en) * | 2009-09-25 | 2011-04-07 | Hamilton Sundstrand Corp | Wear-resistant device and method for treating the same |
| US8852751B2 (en) | 2009-09-25 | 2014-10-07 | Hamilton Sundstrand Corporation | Wear resistant device and process therefor |
| CN108165930A (en) * | 2018-01-16 | 2018-06-15 | 马鞍山市新桥工业设计有限公司 | A kind of metallic surface treatment process |
| CN114427058A (en) * | 2022-01-06 | 2022-05-03 | 四川神工钨钢刀具有限公司 | Hard alloy and manufacturing method thereof |
| CN114427058B (en) * | 2022-01-06 | 2023-11-21 | 四川神工钨钢刀具有限公司 | Hard alloy and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3327424B2 (en) | 2002-09-24 |
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