JPH07136875A - Part mounting device - Google Patents
Part mounting deviceInfo
- Publication number
- JPH07136875A JPH07136875A JP5285033A JP28503393A JPH07136875A JP H07136875 A JPH07136875 A JP H07136875A JP 5285033 A JP5285033 A JP 5285033A JP 28503393 A JP28503393 A JP 28503393A JP H07136875 A JPH07136875 A JP H07136875A
- Authority
- JP
- Japan
- Prior art keywords
- parts
- component mounting
- component
- standard
- time
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Automatic Assembly (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、生産ライン中に複数台
の部品装着機を並べる部品装着装置に関し、電子回路基
板組立工程に利用することができる。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting apparatus for arranging a plurality of component mounting machines in a production line and can be used in an electronic circuit board assembling process.
【０００２】[0002]
【従来の技術】生産ライン中に複数台の部品装着機を並
べ、各部品装着機に部品装着の一端を担わせるに際し、
どの部品装着機にどの部品を振り分けるかは作業能率上
大きな意味を持つ。その振り分け作業を自動化し、作業
時間と労力を減少させようという装置が、特開平５−２
５９６９３号公報に記載されている。2. Description of the Related Art When arranging a plurality of component mounting machines on a production line and having each component mounting machine play a part of component mounting,
Which part is to be allocated to which part mounting machine has a great significance in work efficiency. An apparatus for automating the sorting work to reduce the working time and labor is disclosed in Japanese Patent Laid-Open No. 5-2.
It is described in Japanese Patent No. 59693.
【０００３】[0003]
【発明が解決しようとする課題】特開平５−２５９６９
３号公報記載の装置は、同一機種の実装機が存在する場
合にそれらをひとくくりにした仮想実装システムを構成
し、その上で各実装機に関し最適実装デ−タ、部品毎の
タクトデ−タを作成している。すなわち単一ライン中に
同一機種の実装機が複数台存在するような大規模システ
ムに適用されるものであるが、本発明は、ライン中に同
一機種の部品装着機が存在しない小規模システムにも適
用できる部品振り分け手法を提供しようとするものであ
る。[Patent Document 1] Japanese Patent Application Laid-Open No. 5-25969
The apparatus described in Japanese Patent Publication No. 3 constitutes a virtual mounting system in which mounting machines of the same model are combined, and optimal mounting data for each mounting machine and tact data for each component are then formed. Are being created. That is, the present invention is applied to a large-scale system in which there are a plurality of mounting machines of the same model in a single line, but the present invention is applicable to a small-scale system in which there are no component mounting machines of the same model in a line. It also intends to provide a component allocation method that can be applied to.
【０００４】[0004]
【課題を解決するための手段】本発明では、生産ライン
に配置した複数台の部品装着機の各々がどの部品を装着
するかの振り分けを、以下の処理により行うものとし
た。 ａ．部品装着機毎に、部品タイプ毎の標準タクトタイム
を求める。 ｂ．各部品装着機毎の標準タクトタイムから、部品タイ
プ毎に代表標準タクトタイムを求める。 ｃ．代表標準タクトタイムと部品タイプ毎の装着点数か
ら、延べ装着時間を求める。 ｄ．延べ装着時間と部品装着機台数から標準サイクルタ
イムを求める。 ｅ．処理マシンとして、ライン上流側の部品装着機を選
定する。 ｆ．選定した部品装着機に、優先順位の高い部品から振
り分ける。 ｇ．振り分けた部品の標準タクトタイムの合計が標準サ
イクルタイムを超えたとき、その部品装着機への振り分
けを停止する。 ｈ．上流から下流への配列において、次位にある部品装
着機を処理マシンとして選定する。 ｉ．前部品の振り分けを完了するまで、上記ｆ、ｇ、ｈ
の処理を繰り返す。According to the present invention, which component is to be mounted by each of the plurality of component mounting machines arranged on the production line is distributed by the following processing. a. Determine the standard tact time for each component type for each component mounting machine. b. From the standard tact time for each component mounting machine, find the representative standard tact time for each component type. c. Calculate the total mounting time from the representative standard tact time and the number of mounting points for each component type. d. Calculate the standard cycle time from the total mounting time and the number of component mounting machines. e. As the processing machine, the component mounting machine on the upstream side of the line is selected. f. The parts with the highest priority are distributed to the selected parts mounting machine. g. When the total standard tact time of the distributed parts exceeds the standard cycle time, the distribution to the parts mounting machine is stopped. h. In the arrangement from upstream to downstream, the next component mounting machine is selected as the processing machine. i. Until the allocation of the previous parts is completed, the above f, g, h
The process of is repeated.
【０００５】[0005]
【作用】上記処理により、各部品装着機の稼働時間が均
等化された。By the above processing, the operating time of each component mounting machine is equalized.
【０００６】[0006]
【実施例】図１において、１は生産ラインである。生産
ライン１は電子回路基板の組立に使用されるものであ
り、３台の部品装着機１０Ａ、１０Ｂ、１０Ｃを有す
る。部品装着機１０Ａ、１０Ｂ、１０Ｃの上流側及び下
流側には電子回路基板組立作業に関連したその他の機械
が配置されるが、これらは図示を省略する。２０は生産
ライン中の各機械を制御する制御部、２１は情報を処理
した上で制御部２０に伝達する処理部である。処理部２
１にはデ−タ記憶部２２、ＣＡＤ装置２３、キ−ボ−ド
等の入力装置２４、表示装置２５が接続されている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In FIG. 1, 1 is a production line. The production line 1 is used for assembling an electronic circuit board and has three component mounting machines 10A, 10B and 10C. Other machines related to the electronic circuit board assembling work are arranged on the upstream side and the downstream side of the component mounting machines 10A, 10B, and 10C, but these are not shown. Reference numeral 20 is a control unit that controls each machine in the production line, and reference numeral 21 is a processing unit that processes information and then transmits the information to the control unit 20. Processing unit 2
1, a data storage unit 22, a CAD device 23, an input device 24 such as a keyboard, and a display device 25 are connected.
【０００７】次に、部品装着機１０Ａ、１０Ｂ、１０Ｃ
への部品の振り分けに際して行う処理について説明す
る。まず、部品のタイプ毎に、部品装着機１０Ａ、１０
Ｂ、１０Ｃのそれぞれで装着した場合の標準タクトタイ
ムを求める。その例を図３に示す。ここで「チップＳ」
とは「チップ部品で、サイズ小のもの」の意、「チップ
Ｌ」とは「チップ部品で、サイズ大のもの」の意であ
る。また「ＳＯＰ」は「スモ−ルアウトラインパッケ−
ジ（の部品）」の略称、「ＱＦＰ」は「クァドフラット
パッケ−ジ（の部品）」の略称である。「特殊異形」と
あるのは、前述の部品カテゴリに入らない特殊形状の部
品を意味する。部品装着機１０Ａ、１０Ｂ、１０Ｃ（図
３の表中では部品装着機Ａ、部品装着機Ｂ、部品装着機
１０Ｃと略記する。図５についても同じ）は各々機種が
異なり、取り扱える部品の種類も異なる。図３におい
て、各部品装着機のコラムにタクトタイムを記載した部
品が、すなわちその部品装着機で取り扱える部品であ
る。標準タクトタイムは、電子回路基板上の部品装着位
置を仮に設定しておき（実際のＣＡＤデ−タでも良
い）、部品装着機における部品供給装置の位置も仮に定
め、シミュレ−ションプログラムを実行することにより
求める。Next, the component mounting machines 10A, 10B, 10C
The processing performed when the parts are distributed to the will be described. First, the component mounting machines 10A, 10
Find the standard takt time for each of B and 10C. An example thereof is shown in FIG. Where "chip S"
Means "chip component and small size", and "chip L" means "chip component and large size". Also, "SOP" means "small outline package".
"(Parts of)" and "QFP" are abbreviations of "parts of quad flat package". “Special variant” means a part having a special shape that does not fall into the above-mentioned part category. The component mounting machines 10A, 10B, and 10C (abbreviated as component mounting machine A, component mounting machine B, and component mounting machine 10C in the table of FIG. 3; the same applies to FIG. 5) are different models and the types of components that can be handled. different. In FIG. 3, the components in which the tact time is described in the column of each component mounting machine are the components that can be handled by the component mounting machine. For the standard tact time, the component mounting position on the electronic circuit board is provisionally set (actual CAD data may be used), the position of the component supply device in the component mounting machine is also provisionally determined, and the simulation program is executed. Seek by.
【０００８】図３において、Ｔminは各部品タイプに関
する標準タクトタイムの内、最も短いものである。これ
を代表標準タクトタイムとする。In FIG. 3, Tmin is the shortest standard tact time for each part type. This is the representative standard tact time.
【０００９】代表標準タクトタイムに、その部品タイプ
の装着部品数Ｎを乗じ、延べ時間を算出する。算出結果
を図４に示す。得られた延べ時間５５．８秒を部品装着
機の台数（３台）で除し、更に補正係数を乗じて、標準
サイクルタイムを算出する。補正係数は、代表（＝最
小）標準タクトタイムから求めた延べ最小タクトタイム
と実際の延べタクトタイムとの比率である。The representative standard tact time is multiplied by the number N of mounted parts of the part type to calculate the total time. The calculation result is shown in FIG. The obtained total time of 55.8 seconds is divided by the number of component mounting machines (3 units), and the correction cycle is further multiplied to calculate the standard cycle time. The correction coefficient is the ratio of the total minimum tact time obtained from the representative (= minimum) standard tact time and the actual total tact time.
【００１０】補正係数＝延べタクトタイム÷延べ最小タ
クトタイム 第１回目の補正係数の設定では、延べタクトタイムは過
去の例から求める。２回目以降、すなわち振り分けの修
正を行う場合は、前回の振り分け状態で計算した全部品
のタクトタイムの合計を延べタクトタイムとする。Correction coefficient = total tact time / total minimum tact time In setting the first correction coefficient, the total tact time is obtained from the past example. After the second time, that is, when the distribution is corrected, the total tact time of all parts calculated in the previous distribution state is the total tact time.
【００１１】ここでは補正係数が１．１となった。標準
サイクルタイムは ５５．８秒÷３×１．１＝２０．５秒 これにより、図２に示す処理フロ−の最初のステップが
完了した。Here, the correction coefficient is 1.1. The standard cycle time is 55.8 seconds ÷ 3 × 1.1 = 20.5 seconds. This completes the first step of the process flow shown in FIG.
【００１２】部品の振り分けは図２の処理フロ−に従っ
て行う。まず最上流の部品装着機１０Ａにつき、優先順
位の高い部品から振り分ける。優先順位は、まず部品装
着機１０Ａでしか装着できないもの、次いで標準タクト
タイムの短い順とする。The parts are distributed according to the processing flow shown in FIG. First, the highest-ranking component mounting machine 10A is sorted from the component having the highest priority. The priority is such that the components can be mounted only by the component mounting machine 10A, and then the standard tact time is shortest.
【００１３】チップＳ（０．３秒）→チップＬ（０．４
秒）→ＳＯＰ（０．６秒） 振り分けた部品の標準タクトタイムの合計が標準サイク
ルタイム２０．５秒を超過した時点で部品装着機１０Ａ
への振り分けを停止する。Chip S (0.3 seconds) → Chip L (0.4
Second) → SOP (0.6 seconds) When the total of the standard tact times of the distributed parts exceeds the standard cycle time of 20.5 seconds, the parts mounting machine 10A
Stop the distribution to.
【００１４】０．３秒（チップＳ）×５５ ＋ ０．４
秒（チップＬ）×１０ ＝ ２０．５秒 ≧ ２０．５秒（標準サイクルタイ
ム）0.3 seconds (chip S) × 55 + 0.4
Second (chip L) x 10 = 20.5 seconds ≥ 20.5 seconds (standard cycle time)
【００１５】次に、上流から下流への配列において次位
の部品装着機１０Ｂにつき、標準タクトタイムの短い部
品から振り分ける。Next, in the arrangement from the upstream to the downstream, the next component mounting machine 10B is sorted from the component having the shortest standard tact time.
【００１６】ＳＯＰ（１．０秒）→ＱＦＰ（１．５秒）
→特殊異形１（２．１秒）→特殊異形２（２．３秒） 振り分けた部品の標準タクトタイムの合計が標準サイク
ルタイム２０．５秒を超過した時点で部品装着機１０Ｂ
への振り分けを停止する。SOP (1.0 second) → QFP (1.5 second)
-> Special variant 1 (2.1 seconds)-> Special variant 2 (2.3 seconds) When the total standard tact time of the sorted parts exceeds the standard cycle time of 20.5 seconds, the component mounting machine 10B
Stop the distribution to.
【００１７】 １．０秒（ＳＯＰ）×９ ＋ １．５秒（ＱＦＰ）×４ ＋ ２．１秒（特殊異形１）×３ ＝ ２１．３秒 ≧ ２０．５秒（標準サイクルタイム）1.0 seconds (SOP) × 9 + 1.5 seconds (QFP) × 4 + 2.1 seconds (special variant 1) × 3 = 21.3 seconds ≧ 20.5 seconds (standard cycle time)
【００１８】残った部品は最下流の部品装着機Ｃに振り
分ける。The remaining parts are distributed to the most downstream parts mounting machine C.
【００１９】０．８秒（チップＬ）×６ ＋ ２．７秒
（特殊異形２）×４＋ ３．０秒（特殊異形３）×２
＝ ２１．６秒0.8 seconds (chip L) x 6 + 2.7 seconds (special variant 2) x 4 + 3.0 seconds (special variant 3) x 2
= 21.6 seconds
【００２０】以上の結果を図５に示す。部品装着機３台
のサイクルタイムはほぼ均等になった。The above results are shown in FIG. The cycle times of the three component mounting machines became almost equal.
【００２１】[0021]
【発明の効果】本発明によれば、小規模システムにおい
ても部品振り分けを自動的に行うことができ、また処理
ステップ数が比較的少ないので演算装置が格別高機能の
ものでなくても計算処理を素早く行うことができる。According to the present invention, parts can be automatically distributed even in a small-scale system, and since the number of processing steps is relatively small, calculation processing can be performed even if the arithmetic unit does not have a particularly high function. Can be done quickly.
【図１】部品装着装置の概略構成図である。FIG. 1 is a schematic configuration diagram of a component mounting apparatus.
【図２】処理フロ−を示すフロ−チャ−トである。FIG. 2 is a flowchart showing a processing flow.
【図３】処理の基礎デ−タを示す表である。FIG. 3 is a table showing basic data of processing.
【図４】処理途中の計算結果を示す表である。FIG. 4 is a table showing calculation results during processing.
【図５】同じく処理途中の計算結果を示す表である。FIG. 5 is a table similarly showing calculation results during the process.
１ 生産ライン １０Ａ 部品装着機 １０Ｂ 部品装着機 １０Ｃ 部品装着機 ２０ 制御部 ２１ 処理部 1 Production line 10A Component mounting machine 10B Component mounting machine 10C Component mounting machine 20 Control part 21 Processing part
Claims (2)
するものにおいて、どの部品装着機がどの部品を装着す
るかの振り分けを、以下の処理により行うことを特徴と
する部品装着装置。 ａ．部品装着機毎に、部品タイプ毎の標準タクトタイム
を求める。 ｂ．各部品装着機毎の標準タクトタイムから、部品タイ
プ毎に代表標準タクトタイムを求める。 ｃ．代表標準タクトタイムと部品タイプ毎の装着点数か
ら、延べ装着時間を求める。 ｄ．延べ装着時間と部品装着機台数から標準サイクルタ
イムを求める。 ｅ．処理マシンとして、ライン上流側の部品装着機を選
定する。 ｆ．選定した部品装着機に、優先順位の高い部品から振
り分ける。 ｇ．振り分けた部品の標準タクトタイムの合計が標準サ
イクルタイムを超えたとき、その部品装着機への振り分
けを停止する。 ｈ．上流から下流への配列において、次位にある部品装
着機を処理マシンとして選定する。 ｉ．全部品の振り分けを完了するまで、上記ｆ、ｇ、ｈ
の処理を繰り返す。1. A component mounting apparatus, wherein a plurality of component mounting machines are arranged on a production line, and which component mounting machine mounts which component is distributed by the following processing. a. Determine the standard tact time for each component type for each component mounting machine. b. From the standard tact time for each component mounting machine, find the representative standard tact time for each component type. c. Calculate the total mounting time from the representative standard tact time and the number of mounting points for each component type. d. Calculate the standard cycle time from the total mounting time and the number of component mounting machines. e. As the processing machine, the component mounting machine on the upstream side of the line is selected. f. The parts with the highest priority are distributed to the selected parts mounting machine. g. When the total standard tact time of the distributed parts exceeds the standard cycle time, the distribution to the parts mounting machine is stopped. h. In the arrangement from upstream to downstream, the next component mounting machine is selected as the processing machine. i. Until the allocation of all parts is completed, the above f, g, h
The process of is repeated.
トタイムを求めるに際し、部品装着位置、部品供給位置
を仮に設定し、その上でシミュレ−ションプログラムに
より求めることを特徴とする請求項１記載の部品装着装
置。2. When the standard tact time for each component type is determined for each component mounting machine, the component mounting position and the component supply position are provisionally set, and then the standard tact time is determined by a simulation program. The component mounting device described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28503393A JP3197714B2 (en) | 1993-11-15 | 1993-11-15 | Component mounting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28503393A JP3197714B2 (en) | 1993-11-15 | 1993-11-15 | Component mounting device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07136875A true JPH07136875A (en) | 1995-05-30 |
| JP3197714B2 JP3197714B2 (en) | 2001-08-13 |
Family
ID=17686293
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28503393A Expired - Lifetime JP3197714B2 (en) | 1993-11-15 | 1993-11-15 | Component mounting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3197714B2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0918199A (en) * | 1995-06-30 | 1997-01-17 | Matsushita Electric Ind Co Ltd | Method for generating electronic component mounting data |
| EP1063876A1 (en) * | 1999-05-11 | 2000-12-27 | Sony Corporation | Apparatus for mounting electronic parts |
| US6935017B2 (en) | 1995-11-06 | 2005-08-30 | Matsushita Electric Industrial Co., Ltd. | Component mounting apparatus having component supply tables provided on opposite sides of a component transfer path |
| US7100278B2 (en) | 1995-11-06 | 2006-09-05 | Matsushita Electric Industrial Co., Ltd. | Component mounting apparatus and method |
| US7356919B2 (en) | 1995-11-06 | 2008-04-15 | Matsushita Electric Industrial Co., Ltd. | Component mounting method |
| JP2008130849A (en) * | 2006-11-21 | 2008-06-05 | Matsushita Electric Ind Co Ltd | Method for determining mounting conditions |
-
1993
- 1993-11-15 JP JP28503393A patent/JP3197714B2/en not_active Expired - Lifetime
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0918199A (en) * | 1995-06-30 | 1997-01-17 | Matsushita Electric Ind Co Ltd | Method for generating electronic component mounting data |
| US6935017B2 (en) | 1995-11-06 | 2005-08-30 | Matsushita Electric Industrial Co., Ltd. | Component mounting apparatus having component supply tables provided on opposite sides of a component transfer path |
| US7069648B2 (en) | 1995-11-06 | 2006-07-04 | Matsushita Electric Industrial Co., Ltd. | Component mounting method |
| US7100278B2 (en) | 1995-11-06 | 2006-09-05 | Matsushita Electric Industrial Co., Ltd. | Component mounting apparatus and method |
| US7120996B2 (en) | 1995-11-06 | 2006-10-17 | Matsushita Electric Industrial Co., Ltd. | Component mounting apparatus having component supply tables provided on opposite sides of a component transfer path |
| US7200925B2 (en) | 1995-11-06 | 2007-04-10 | Matsushita Electric, Industrial Co., Ltd. | Component mounting method |
| US7356919B2 (en) | 1995-11-06 | 2008-04-15 | Matsushita Electric Industrial Co., Ltd. | Component mounting method |
| EP1063876A1 (en) * | 1999-05-11 | 2000-12-27 | Sony Corporation | Apparatus for mounting electronic parts |
| JP2008130849A (en) * | 2006-11-21 | 2008-06-05 | Matsushita Electric Ind Co Ltd | Method for determining mounting conditions |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3197714B2 (en) | 2001-08-13 |
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