JPH07130438A - Ic socket - Google Patents
Ic socketInfo
- Publication number
- JPH07130438A JPH07130438A JP5274522A JP27452293A JPH07130438A JP H07130438 A JPH07130438 A JP H07130438A JP 5274522 A JP5274522 A JP 5274522A JP 27452293 A JP27452293 A JP 27452293A JP H07130438 A JPH07130438 A JP H07130438A
- Authority
- JP
- Japan
- Prior art keywords
- pad
- socket
- board
- printed circuit
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
Landscapes
- Connecting Device With Holders (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は半導体装置用のＩＣ（Ｌ
ＳＩ）ソケットに関する。BACKGROUND OF THE INVENTION The present invention relates to an IC (L
SI) socket.
【０００２】最近のＬＳＩの傾向として、デバイス技術
の向上により高集積化・超高速化が図られており、ＬＳ
Ｉのボードへの実装にＩＣソケットを使用する場合にソ
ケットによる特性悪化（リード長、インピーダンスマッ
チング等の問題）により正規の特性が出ないとか、又、
デバイスの電気的特性試験を行う場合においても同様な
障害により正規の測定が出来ないことがあり、ソケット
の特性向上が望まれている。As a recent trend of LSI, high integration and ultra high speed have been achieved by improving device technology.
When using an IC socket for mounting I on a board, the characteristic may not be obtained due to deterioration of characteristics (problems such as lead length and impedance matching) due to the socket, or
Even in the case of conducting an electrical characteristic test of a device, it may not be possible to perform a normal measurement due to the same obstacle, and it is desired to improve the characteristics of the socket.
【０００３】[0003]
【従来の技術】従来のＩＣソケットを図６に示す。これ
は同図に示すようにＩＣ（又はＬＳＩ）１のリード２と
コンタクトさせる部分と、信号ライン３とコンタクトさ
せる部分を一体形成させたリード４をソケット本体５に
設け、これをボード６に取り付け、ソケットのリード４
をボード６に半田付けしていた。2. Description of the Related Art A conventional IC socket is shown in FIG. As shown in the figure, a lead 4 in which a portion to be brought into contact with the lead 2 of the IC (or LSI) 1 and a portion to be brought into contact with the signal line 3 are integrally formed is provided in the socket body 5, and this is attached to the board 6. , Socket lead 4
Was soldered to board 6.
【０００４】[0004]
【発明が解決しようとする課題】上記従来のＩＣソケッ
トでは、実際のＩＣの端子２の位置より外側にソケット
のリード４が位置しており、そのリード４が長いため、
電気的特性の悪化を招いていた。In the above-mentioned conventional IC socket, the lead 4 of the socket is located outside the actual position of the terminal 2 of the IC, and the lead 4 is long.
This caused deterioration of electrical characteristics.
【０００５】本発明は、電気的特性の悪化を招かないよ
うにしてデバイスの特性を十分に引き出せるようにした
ＩＣソケットを実現しようとする。The present invention intends to realize an IC socket in which the characteristics of the device can be sufficiently brought out without deteriorating the electrical characteristics.
【０００６】[0006]
【課題を解決するための手段】本発明のＩＣソケットに
於いては、プリント基板１０の上面にＩＣ１９のリード
２０と接触する第１のパッド１１を設けると共に、該プ
リント基板１０の下面にＩＣ１９を搭載するボード１５
の内層配線１７に接触する第２のパッド１２を設け、該
第１のパッド１１と第２のパッド１２をプリント基板１
０の内層配線１３で接続して成ることを特徴とする。In the IC socket of the present invention, the first pad 11 that comes into contact with the leads 20 of the IC 19 is provided on the upper surface of the printed circuit board 10 and the IC 19 is provided on the lower surface of the printed circuit board 10. Board 15
A second pad 12 that contacts the inner layer wiring 17 of the printed circuit board 1 and the first pad 11 and the second pad 12 are connected to each other.
It is characterized in that they are connected by 0 inner layer wiring 13.
【０００７】また、それに加えて、上記プリント基板１
０が円板状であり、且つ下面に同心円状に段差が設けら
れ、該段差の平面部に前記第２のパッド１２が配置され
ていることを特徴とする。また上記第２のパッド１２が
ばね状の接触子２７を有することを特徴とする。In addition to the above, the printed circuit board 1 is also provided.
It is characterized in that 0 is a disk shape, a step is provided on the lower surface in a concentric shape, and the second pad 12 is arranged on the plane part of the step. Further, the second pad 12 has a spring-shaped contactor 27.
【０００８】この構成を採ることにより、電気的特性の
悪化を招かないようにしてデバイスの特性を十分に引き
出せるようにしたＩＣソケットが得られる。By adopting this structure, it is possible to obtain an IC socket in which the characteristics of the device can be sufficiently brought out without deteriorating the electric characteristics.
【０００９】[0009]
【作用】本発明では、図２に示すように、プリント基板
１０の上面にＩＣ１９のリード２０に接触する第１のパ
ッド１１を設け、下面にボード１５の内層配線１７に接
触する第２のパッド１２を設け、該第１のパッド１１と
第２のパッド１２間をプリント基板１０の内層配線１３
で接続したことにより、図２の如く、本ＩＣソケット１
４に対応した接続部を設けたボード１５に接続すると、
ＩＣ１９のリード２０を接触させた第１のパッド１１は
ほぼボード１５の上面と一致する。このためボード１５
からＩＣ１９のリード２０までの長さは従来に比して短
かくなる。これによりソケットの電気的特性が改善さ
れ、ＩＣの特性を十分に引き出すことができる。In the present invention, as shown in FIG. 2, the first pad 11 that contacts the leads 20 of the IC 19 is provided on the upper surface of the printed circuit board 10, and the second pad that contacts the inner layer wiring 17 of the board 15 is provided on the lower surface. 12 is provided, and the inner layer wiring 13 of the printed circuit board 10 is provided between the first pad 11 and the second pad 12.
As shown in Fig. 2, the IC socket 1
When connected to the board 15 provided with a connection part corresponding to 4,
The first pad 11 with which the lead 20 of the IC 19 is brought into contact substantially coincides with the upper surface of the board 15. For this reason board 15
The length from to the lead 20 of the IC 19 becomes shorter than the conventional one. As a result, the electrical characteristics of the socket are improved, and the characteristics of the IC can be fully brought out.
【００１０】[0010]
【実施例】図１は本発明の実施例を示す図であり、
（ａ）は上面図、（ｂ）は断面図、（ｃ）は下面図であ
る。同図において、１０は本実施例のＩＣソケットの本
体をなすプリント基板であり、該プリント基板は、円板
状をなし、その上面は平面であるが、下面は（ｂ）図の
如く段差が設けられ、中心部より外周部の方が薄くなっ
ている。FIG. 1 is a diagram showing an embodiment of the present invention,
(A) is a top view, (b) is a sectional view, and (c) is a bottom view. In the figure, reference numeral 10 is a printed circuit board which is the main body of the IC socket of the present embodiment. The printed circuit board has a disk shape and its upper surface is a flat surface, but its lower surface has a step as shown in FIG. It is provided, and the outer peripheral portion is thinner than the central portion.
【００１１】また、該プリント基板１０の上面には、Ｉ
Ｃのリードに接触するパッド（第１のパッド）１１が設
けられている。また下面にはボードの配線に接触するパ
ッド（第２のパッド）１２が該基板の同心円状に形成さ
れた段差の平面部に設けられている。そして上面のパッ
ド（第１のパッド）１１と下面のパッド（第２のパッ
ド）１２との間はプリント基板１０の内層配線１３で接
続されている。On the upper surface of the printed circuit board 10, I
A pad (first pad) 11 that contacts the lead of C is provided. Further, a pad (second pad) 12 that comes into contact with the wiring of the board is provided on the lower surface in the plane portion of the step formed in the concentric shape of the substrate. The upper pad (first pad) 11 and the lower pad (second pad) 12 are connected by an inner layer wiring 13 of the printed board 10.
【００１２】このように構成された本実施例は図２に示
すようにして用いられる。同図において、１４は本発明
のＩＣソケットであり、１５はボードである。該ボード
にはＩＣソケット１４の下面に対応した段差を有する凹
部が形成され、該凹部にはＩＣソケット１４の下面のパ
ッド（第２のパッド）１２に対応してパッド１６が設け
られている。そして該パッド１６はそれぞれボード１５
の内層配線１７を介して端子１８に接続されている。な
お内層配線１７は信号ライン、電源ライン、アースライ
ンを含んでいる。The present embodiment thus constructed is used as shown in FIG. In the figure, 14 is an IC socket of the present invention, and 15 is a board. A recess having a step corresponding to the lower surface of the IC socket 14 is formed on the board, and a pad 16 corresponding to the pad (second pad) 12 on the lower surface of the IC socket 14 is provided in the recess. The pads 16 are the boards 15
Is connected to the terminal 18 via the inner layer wiring 17. The inner layer wiring 17 includes a signal line, a power supply line, and a ground line.
【００１３】本実施例のＩＣソケット１４は、上記のボ
ード１５の凹部に嵌入され、その下面のパッド（第２の
パッド）１２をボード１５のパッド１６に接触させ、上
面にＩＣ１９を載置してそのリード２０を上面のパッド
（第１のパッド）１１に接触させて用いられる。The IC socket 14 of this embodiment is fitted in the recess of the board 15 described above, the pad (second pad) 12 on the lower surface thereof is brought into contact with the pad 16 of the board 15, and the IC 19 is placed on the upper surface. The lead 20 is used by bringing it into contact with the pad (first pad) 11 on the upper surface.
【００１４】以上の本実施例によれば、ＩＣ１９のリー
ド２０と接触する第１のパッド１１はボード１５の上面
とほぼ同一面上にあることになるため、図６で説明した
従来例に比して信号線の長さが短かくなり、インピーダ
ンスマッチングが取れるため電気的特性が向上する。According to the present embodiment described above, the first pad 11 that contacts the lead 20 of the IC 19 is on the same plane as the upper surface of the board 15, so that the first pad 11 is different from the conventional example described in FIG. As a result, the length of the signal line becomes short, and impedance matching is obtained, so that the electrical characteristics are improved.
【００１５】また、本実施例は図３（ａ）の如く、ボー
ド１５のパッド１６をＧＮＤパッド１６ａと、信号又は
電源パッド１６ｂに分割して形成しておき、図３（ｂ）
の如く中央の信号又は電源パッド１６ｂに相当する部分
に窓２１ａが、又は図３（ｃ）の如くＧＮＤパッド１６
ａに相当する部分に窓２１ｂが設けられたシート２１を
ＩＣソケット１４とボード１５との間に挟み込むことに
より１つのパッドを電源、ＧＮＤ、信号用に使い分ける
ことができる。In this embodiment, the pad 16 of the board 15 is divided into a GND pad 16a and a signal or power supply pad 16b as shown in FIG.
As shown in FIG. 3C, the window 21a is provided in a portion corresponding to the central signal or power supply pad 16b as shown in FIG.
By sandwiching the sheet 21 having the window 21b in the portion corresponding to a between the IC socket 14 and the board 15, one pad can be selectively used for power supply, GND, and signal.
【００１６】また、本実施例のボード１５への取り付け
は、図４（ａ）の斜視図及び図４（ｂ）の断面図に示す
ように、ボード１５には複数本の位置決めピン２２と、
ヒンジ２３により回動可能で、且つ止め金２４で係止さ
れる押えばね２５を設けておき、ＩＣソケット１４には
位置決めピン２２に対応する位置決め孔２６を設けて
（ａ）図の如くボード１５へ取り付け固定される。Further, as shown in the perspective view of FIG. 4A and the sectional view of FIG. 4B, the board 15 of the present embodiment is attached to the board 15 with a plurality of positioning pins 22.
A holding spring 25 that can be rotated by a hinge 23 and that is locked by a stopper plate 24 is provided, and a positioning hole 26 corresponding to the positioning pin 22 is provided in the IC socket 14, and a board 15 is provided as shown in FIG. It is attached and fixed to.
【００１７】また、ボード側のパッド１６とＩＣソケッ
ト側のパッド１２との接触を良好にするため、図５の如
く、何れか一方（図はＩＣソケット側）に板ばね状の接
触子２７を設けても良い。Further, in order to improve the contact between the pad 16 on the board side and the pad 12 on the IC socket side, as shown in FIG. 5, a leaf spring-shaped contactor 27 is provided on one of them (the IC socket side in the figure). It may be provided.
【００１８】[0018]
【発明の効果】本発明に依れば、ＩＣソケットのリード
の部分を見掛け上ボードの一部として、ＩＣとボード側
信号ラインとを最短距離で、且つインピーダンスマッチ
ングの取れたコンタクトを取ることができるため、ソケ
ットの電気的特性を改善しデバイスの特性を十分に引き
出すことが可能となる。According to the present invention, the leads of the IC socket can be apparently used as a part of the board to make contact with the IC and the board-side signal line at the shortest distance and with impedance matching. Therefore, the electrical characteristics of the socket can be improved and the characteristics of the device can be sufficiently obtained.
【図１】本発明の実施例を示す図で、（ａ）は上面図、
（ｂ）は断面図、（ｃ）は下面図である。FIG. 1 is a view showing an embodiment of the present invention, (a) is a top view,
(B) is a sectional view and (c) is a bottom view.
【図２】本発明の実施例の使用方法を説明するための図
である。FIG. 2 is a diagram for explaining how to use the embodiment of the present invention.
【図３】本発明の実施例の他の使用方法を説明するため
の図である。FIG. 3 is a diagram for explaining another method of using the embodiment of the present invention.
【図４】本発明の実施例のボードへの取付固定方法を示
す図である。FIG. 4 is a diagram showing a method of attaching and fixing to a board according to an embodiment of the present invention.
【図５】本発明の実施例のパッドの１例を示す図であ
る。FIG. 5 is a diagram showing an example of a pad according to an embodiment of the present invention.
【図６】従来のＩＣソケットをボードと共に示す図であ
る。FIG. 6 is a view showing a conventional IC socket together with a board.
１０…プリント基板 １１…第１のパッド １２…第２のパッド １３，１７…内層配線 １４…ＩＣソケット １５…ボード １６…パッド １９…ＩＣ ２０…リード ２１…シート DESCRIPTION OF SYMBOLS 10 ... Printed circuit board 11 ... 1st pad 12 ... 2nd pad 13, 17 ... Inner layer wiring 14 ... IC socket 15 ... Board 16 ... Pad 19 ... IC 20 ... Lead 21 ... Sheet
Claims (3)
９）のリード（２０）と接触する第１のパッド（１１）
を設けると共に、該プリント基板（１０）の下面にＩＣ
（１９）を搭載するボード（１５）の内層配線（１７）
に接触する第２のパッド（１２）を設け、該第１のパッ
ド（１１）と第２のパッド（１２）をプリント基板（１
０）の内層配線（１３）で接続して成ることを特徴とす
るＩＣソケット。1. An IC (1) is provided on an upper surface of a printed circuit board (10).
First pad (11) in contact with lead (20) of 9)
And the IC is provided on the lower surface of the printed circuit board (10).
Inner layer wiring (17) of board (15) mounting (19)
A second pad (12) which is in contact with the first pad (11) and the second pad (12).
An IC socket characterized by being connected by the inner layer wiring (13) of (0).
り、且つ下面に同心円状に段差が設けられ、該段差の平
面部に前記第２のパッド（１２）が配置されていること
を特徴とする請求項１のＩＣソケット。2. The printed circuit board (10) is disc-shaped, and concentrically formed steps are provided on the lower surface, and the second pad (12) is arranged on the plane portion of the steps. The IC socket according to claim 1, which is characterized in that.
触子（２７）を有することを特徴とする請求項１のＩＣ
ソケット。3. IC according to claim 1, characterized in that the second pad (12) has spring-shaped contacts (27).
socket.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5274522A JPH07130438A (en) | 1993-11-02 | 1993-11-02 | Ic socket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5274522A JPH07130438A (en) | 1993-11-02 | 1993-11-02 | Ic socket |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07130438A true JPH07130438A (en) | 1995-05-19 |
Family
ID=17542881
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5274522A Withdrawn JPH07130438A (en) | 1993-11-02 | 1993-11-02 | Ic socket |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07130438A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100265021B1 (en) * | 1996-07-24 | 2000-09-01 | 미다라이 후지오 | Electrical connector, process cartridge and electrophotographic image forming apparatus |
| WO2012132202A1 (en) * | 2011-03-30 | 2012-10-04 | Ha Kilseong | Base board, enhancement module, and connection structure for base board and enhancement module |
-
1993
- 1993-11-02 JP JP5274522A patent/JPH07130438A/en not_active Withdrawn
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100265021B1 (en) * | 1996-07-24 | 2000-09-01 | 미다라이 후지오 | Electrical connector, process cartridge and electrophotographic image forming apparatus |
| WO2012132202A1 (en) * | 2011-03-30 | 2012-10-04 | Ha Kilseong | Base board, enhancement module, and connection structure for base board and enhancement module |
| GB2503597A (en) * | 2011-03-30 | 2014-01-01 | Kilseong Ha | Base board, enhancement module, and connection structure for base board and enhancement module |
| US8832344B2 (en) | 2011-03-30 | 2014-09-09 | Kilseong Ha | Baseboard, extension module, and structure for connecting baseboard and extension module |
| JP5850045B2 (en) * | 2011-03-30 | 2016-02-03 | 吉成 河 | Expansion module and base board / expansion module connection structure |
| GB2503597B (en) * | 2011-03-30 | 2018-09-19 | Ha Kilseong | Baseboard, extension module, and structure for connecting baseboard and extension module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20010130 |