JPH07122585A - Resin applying device - Google Patents
Resin applying deviceInfo
- Publication number
- JPH07122585A JPH07122585A JP27077993A JP27077993A JPH07122585A JP H07122585 A JPH07122585 A JP H07122585A JP 27077993 A JP27077993 A JP 27077993A JP 27077993 A JP27077993 A JP 27077993A JP H07122585 A JPH07122585 A JP H07122585A
- Authority
- JP
- Japan
- Prior art keywords
- tip
- nozzle
- resin
- substrate
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は基板上に載置された半導
体素子及びその周辺に樹脂を塗布する樹脂塗布装置に関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor element mounted on a substrate and a resin coating device for coating a resin around the semiconductor element.
【０００２】[0002]
【従来の技術】従来、樹脂塗布装置が例えば特開平１−
２９７８７０号公報により図６の様に示されている。こ
の図に於て、基板５１上に複数の発光ダイオード５２が
載置され配線されている。ノズル５３を備えた樹脂塗布
装置５４が発光ダイオード５２の上方に配置され、発光
ダイオード５２の周辺にシリコン樹脂５５を塗布してい
る。この様にシリコン樹脂５５を設ける事により、発光
ダイオード５２の輝度の向上を計っている。2. Description of the Related Art Conventionally, a resin coating device is disclosed in, for example, Japanese Patent Laid-Open No. 1-
This is shown in FIG. 6 according to 297870. In this figure, a plurality of light emitting diodes 52 are placed and wired on a substrate 51. A resin coating device 54 equipped with a nozzle 53 is arranged above the light emitting diode 52, and a silicon resin 55 is coated around the light emitting diode 52. By thus providing the silicon resin 55, the luminance of the light emitting diode 52 is improved.
【０００３】[0003]
【発明が解決しようとする課題】しかし上述の装置５４
では、各々の発光ダイオード５２に設けられた各々のシ
リコン樹脂５５の塗布量のばらつきが大きいという欠点
がある。そのため、例えば、基板５１上に２５個の発光
ダイオード５２と各々のシリコン樹脂５５とその上方に
棒状レンズ（図示せず）を備えた線状光源に於て、図５
の破線に示す様に各点に於ける輝度のばらつきが平均値
±２５％と大きい。本発明者がこの輝度のばらつきが大
きい理由を究明したところ、図７に示す様に、塗布した
後にノズル５３を引上げた時に、ノズル５３の先端に残
るシリコン樹脂５６の量が大きくかつそのばらつきが大
きいためである。However, the device 54 as described above.
Then, there is a drawback that the coating amount of each silicon resin 55 provided on each light emitting diode 52 varies widely. Therefore, for example, in a linear light source provided with 25 light emitting diodes 52, each silicon resin 55, and a rod-shaped lens (not shown) above the substrate 51 on a substrate 51, as shown in FIG.
As indicated by the broken line, the variation in the brightness at each point is large with an average value of ± 25%. When the present inventor has clarified the reason why the variation in the brightness is large, as shown in FIG. 7, when the nozzle 53 is pulled up after coating, the amount of the silicon resin 56 remaining at the tip of the nozzle 53 is large and the variation is large. Because it is big.
【０００４】その原因は、シリコン樹脂５５を塗布する
時に、ノズル５３が半導体素子５２の略真上にあるの
で、落下したシリコン樹脂５５の塊が半導体素子５２及
びその周辺のみに位置し、基板５１に十分接触する前
に、ノズル５３を引上げるためである。そのためシリコ
ン樹脂５５と基板５１との接着力が不十分である時に、
ノズル５３を引上げるので、ノズル５３の先端とシリコ
ン樹脂５５との接着力が比較的大きくなる。またこの接
着力はノズル５３の先端とシリコン樹脂５５との界面状
態及びノズル５３の引上げのタイミングによりばらつき
易い。The reason for this is that, when the silicon resin 55 is applied, the nozzle 53 is almost directly above the semiconductor element 52, so that the lumps of the dropped silicon resin 55 are located only in the semiconductor element 52 and its periphery, and the substrate 51. This is for pulling up the nozzle 53 before sufficiently contacting with. Therefore, when the adhesive force between the silicon resin 55 and the substrate 51 is insufficient,
Since the nozzle 53 is pulled up, the adhesive force between the tip of the nozzle 53 and the silicone resin 55 becomes relatively large. Further, this adhesive force tends to vary depending on the interface state between the tip of the nozzle 53 and the silicone resin 55 and the timing of pulling up the nozzle 53.
【０００５】その結果、残ったシリコン樹脂５６の量が
大きくなりかつその量が大きくばらつく。またシリコン
樹脂５５を基板５１に十分接触させてから、ノズル５３
を引上げると作業時間が長くかかり、作業性が悪くな
る。故に本発明はかかる従来の欠点を鑑みて、基板上に
載置された半導体素子及びその周辺に塗布される樹脂量
のばらつきの少ない樹脂塗布装置を提供するものであ
る。As a result, the amount of the remaining silicon resin 56 becomes large and the amount greatly varies. Further, after the silicon resin 55 is sufficiently brought into contact with the substrate 51, the nozzle 53
If you pull up, work time will be long and workability will be poor. Therefore, in view of the above-mentioned conventional drawbacks, the present invention provides a resin coating device in which a semiconductor element mounted on a substrate and the amount of resin coated around the semiconductor element are less varied.
【０００６】[0006]
【課題を解決するための手段】本発明は上述の課題を解
決するために、樹脂が内蔵された容器と、容器の下端に
固定されかつ引下げられて樹脂が所定量だけ供給されか
つその供給を停止し引上げられるノズルとを備え、基板
上に載置された半導体素子及びその周辺に樹脂を塗布す
る樹脂塗布装置に於て、ノズルの先端から供給された樹
脂が基板の表面と半導体素子及びその周辺に塗布される
様に、ノズルは先端が斜めに形成されかつその最先端は
基板に略接触している様に設けるものである。SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention provides a container in which a resin is built in and a resin which is fixed and pulled down at the lower end of the container to supply a predetermined amount of the resin and to supply the resin. In a resin coating device that includes a nozzle that is stopped and pulled up, and a resin coating device that coats a resin on a semiconductor element mounted on a substrate and its periphery, the resin supplied from the tip of the nozzle is the surface of the substrate and the semiconductor element and its The nozzle is provided so that its tip is formed obliquely so that it is applied to the periphery, and its tip is substantially in contact with the substrate.
【０００７】[0007]
【作用】本発明は上述の様に、ノズルの先端を基板に略
接触した位置に於て、その斜めに形成された先端から基
板の表面と半導体素子及びその周辺に樹脂を塗布する。
故に樹脂は基板に十分の量が接触する。その結果、樹脂
と基板との接着力が十分となり、ノズルを引上げる時
に、ノズルの先端と樹脂との接着力が小さくなる。故に
ノズルの先端に残る樹脂量も殆んどなくなり、ばらつき
も小さくなるので、半導体素子の周辺に塗布される樹脂
量が略一定となる。According to the present invention, as described above, at the position where the tip of the nozzle is substantially in contact with the substrate, the resin is applied from the obliquely formed tip to the surface of the substrate, the semiconductor element and its periphery.
Therefore, the resin contacts the substrate in a sufficient amount. As a result, the adhesive force between the resin and the substrate becomes sufficient, and when pulling up the nozzle, the adhesive force between the tip of the nozzle and the resin becomes small. Therefore, the amount of resin remaining at the tip of the nozzle is almost eliminated and the variation is small, so that the amount of resin applied around the semiconductor element is substantially constant.
【０００８】[0008]
【実施例】以下に本発明の実施例を図１乃至図３に従い
説明する。図１は本実施例に係る樹脂塗布装置と基板を
示す部分斜視図、図２は樹脂が塗布された時の本樹脂塗
布装置と基板の要部断面図、図３はノズルが引上げられ
た時のそれらの要部断面図である。これらの図に於て、
基準台１は例えば鉄板からなり、縦が約１２００mm横が
約６００mm、厚さが約１０mmの平坦なものである。ヘッ
ド支持部２は例えば硬鋼からなり、外形は略直方体であ
り、その表面の内部には長尺の凹部３が形成されてい
る。脚４は鉄からなり、ボルトにより基準台１に固定さ
れ、ヘッド支持部２は脚４の上に固定されている。Embodiments of the present invention will be described below with reference to FIGS. FIG. 1 is a partial perspective view showing a resin coating device and a substrate according to this embodiment, FIG. 2 is a sectional view of a main portion of the resin coating device and the substrate when a resin is coated, and FIG. 3 is a nozzle pulled up. FIG. 3 is a cross-sectional view of relevant parts of those. In these figures,
The reference table 1 is made of, for example, an iron plate, and is a flat object having a length of about 1200 mm, a width of about 600 mm, and a thickness of about 10 mm. The head supporting portion 2 is made of, for example, hard steel, has an outer shape of a substantially rectangular parallelepiped, and a long concave portion 3 is formed inside the surface thereof. The leg 4 is made of iron, is fixed to the reference base 1 by a bolt, and the head support portion 2 is fixed on the leg 4.
【０００９】ヘッド５は例えばアルミニウムのブロック
からなり、その底面に凸部が形成され、この凸部がヘッ
ド支持部２の凹部３に設けられた軸受部に当接する事に
よりヘッド５がＸ方向に移動出来る様に構成されてい
る。パルスモータ６がヘッド支持部２の端の表面に固定
され、プーリー７が軸を介してヘッド支持部２の端の側
面に固定され、ベルト８によりパルスモータ６の軸に固
定されたプーリー９に連結されている。ベルト１０はヘ
ッド支持部２の１方の端に固定されたプーリー１１とヘ
ッド支持部２の他方の端（図示せず）に固定されたプー
リー（図示せず）を連結している。ヘッド５に固定され
たプーリー１２がベルト１０に係合する事により、ベル
ト１０が移動する事により、ヘッド５がＸ方向に移動す
る様になっている。The head 5 is made of, for example, an aluminum block, and a convex portion is formed on the bottom surface thereof, and the convex portion abuts on a bearing portion provided in the concave portion 3 of the head support portion 2 to move the head 5 in the X direction. It is structured so that it can be moved. The pulse motor 6 is fixed to the surface of the end of the head support 2, the pulley 7 is fixed to the side surface of the end of the head support 2 via a shaft, and the pulley 9 is fixed to the shaft of the pulse motor 6 by a belt 8. It is connected. The belt 10 connects a pulley 11 fixed to one end of the head support portion 2 and a pulley (not shown) fixed to the other end (not shown) of the head support portion 2. When the pulley 12 fixed to the head 5 is engaged with the belt 10, the belt 10 moves, and the head 5 moves in the X direction.
【００１０】容器支持部１３は例えばアルミニウムのブ
ロックからなり、ヘッド５に固定されている。ノズル支
持部１４もアルミニウムのブロックからなり、ヘッド５
に固定されている。容器支持部１３とノズル支持部１４
は各々、上述のＸ方向の構成と同様にＺ方向に移動出来
る様に構成されている。The container support 13 is made of, for example, an aluminum block and is fixed to the head 5. The nozzle support 14 is also made of an aluminum block, and the head 5
It is fixed to. Container support 13 and nozzle support 14
Each is configured to be movable in the Z direction similarly to the configuration in the X direction described above.
【００１１】容器１５は例えばポリプロピレン樹脂から
なり、外径が約２６mm、長さ１３０mmの略円筒状のもの
であり、その下端の外形が円錐台の形状をしており、そ
の先端がネジ切りされた細い円筒状に形成されている。
樹脂１６は例えばシリコン樹脂からなり、容器１５に内
蔵され、容器１５の上端付近の外側はネジ切りされ、蓋
１７が固定されている。蓋１７にはチューブ（図示せ
ず）が固定され、所定の時間内に所定の圧力の空気を圧
送出来る様に構成されている。The container 15 is made of polypropylene resin, for example, and has a substantially cylindrical shape having an outer diameter of about 26 mm and a length of 130 mm, the outer shape of the lower end of which is a truncated cone shape, and its tip is threaded. It is shaped like a thin cylinder.
The resin 16 is made of, for example, silicon resin, is built in the container 15, and the outside of the vicinity of the upper end of the container 15 is threaded and the lid 17 is fixed. A tube (not shown) is fixed to the lid 17 so that air having a predetermined pressure can be fed under pressure within a predetermined time.
【００１２】ノズル１８は例えば医療用の注射針が用い
られ、径大部１９と径小部２０と先端２１から構成され
ており、その全長は約３５mmである。径大部１９は例え
ばポリプロピレン樹脂からなり、その先端の内側はネジ
切りされており、容器１５の下端に固定されている。径
小部２０は例えばステンレスからなり、その外径が約
０．４mm、内径が約０．２mm、長さが約１７mmの円筒状
のものであり、径大部１９と一体成形されている。ノズ
ル１８の先端２１はステンレスからなり、その外径が約
０．４mm、内径が約０．２mmの管を約１５°に斜めに形
成されたものであり、その長さは約１．５mmである。そ
して径小部２０の途中の部位がノズル支持部１４の先端
に当接する事により、径小部２０と先端２１は垂直線に
対し所定の角度θ（θは約４０°〜５０°）になる様
に、傾けられている。The nozzle 18 is, for example, a medical injection needle and is composed of a large-diameter portion 19, a small-diameter portion 20 and a tip 21, and its total length is about 35 mm. The large-diameter portion 19 is made of polypropylene resin, for example, and the inside of its tip is threaded and fixed to the lower end of the container 15. The small-diameter portion 20 is made of, for example, stainless steel and has a cylindrical shape with an outer diameter of about 0.4 mm, an inner diameter of about 0.2 mm, and a length of about 17 mm, and is integrally molded with the large-diameter portion 19. The tip 21 of the nozzle 18 is made of stainless steel, and is a pipe having an outer diameter of about 0.4 mm and an inner diameter of about 0.2 mm formed obliquely at about 15 °, and its length is about 1.5 mm. is there. Then, a portion in the middle of the small diameter portion 20 comes into contact with the tip of the nozzle support portion 14, so that the small diameter portion 20 and the tip 21 form a predetermined angle θ (θ is about 40 ° to 50 °) with respect to the vertical line. Like, is tilted.
【００１３】脚２２は例えば鉄からなり、基準台１の上
に固定されている。基台２３は例えば鉄からなり、縦横
が共に約３００mm、厚さが約１０mmであり、その底面に
基台支持部２４が固定されている。基台支持部２４の先
端に形成された凸部と脚２２の側面に形成された凹部が
係合する事により、基台２３はＹ方向に移動出来る様に
構成されている。The leg 22 is made of, for example, iron and is fixed on the reference table 1. The base 23 is made of, for example, iron, has a length and width of about 300 mm, a thickness of about 10 mm, and a base support 24 is fixed to the bottom surface thereof. The base 23 is configured to be movable in the Y direction by engaging the convex portion formed at the tip of the base support portion 24 and the concave portion formed on the side surface of the leg 22.
【００１４】基板２５が複数個密着して、又は所定の間
隔を置いて基台２３上に配置されている。基板２５は例
えばガラスエポキシ樹脂からなり、幅が約４mm、長さが
約２６０mm、厚さが約１mmのものであり、その表面上に
銅箔からなる配線パターン２６、２７が形成されてい
る。複数の半導体素子、例えば発光ダイオード２８は略
直線上に約１０mmの間隔で整列する様に、各々の配線パ
ターン２６上に導電性接着剤を介して載置され、配線さ
れている。発光ダイオード２８は例えば、１辺が０．２
〜０．４mmの略立方体の燐化ガリウムや燐化ガリウム砒
素等からなる。この様にして１方の基台２３上に１５個
の基板２５が配置され、他方の基台（図示せず）上に１
５個の基板２５が配置される。A plurality of substrates 25 are arranged on the base 23 in close contact with each other or at predetermined intervals. The substrate 25 is made of, for example, glass epoxy resin and has a width of about 4 mm, a length of about 260 mm and a thickness of about 1 mm, and wiring patterns 26 and 27 made of copper foil are formed on the surface thereof. A plurality of semiconductor elements, for example, light emitting diodes 28 are mounted and wired on each wiring pattern 26 via a conductive adhesive so that they are aligned on a substantially straight line at intervals of about 10 mm. The light emitting diode 28 has, for example, 0.2 per side.
It is made of approximately cubic gallium phosphide, gallium arsenide phosphide, or the like of about 0.4 mm. In this way, fifteen substrates 25 are arranged on one base 23 and one on the other base (not shown).
Five substrates 25 are arranged.
【００１５】シリンダ２９は基準台１の上に固定され、
銅板等からなる押え板支持部３０はシリンダ２９の軸３
１の先端に固定されている。押え板３２は燐青銅等の板
バネからなり、押え板支持部３０に固定されている。押
え板３２の先端で押えられる事により、基板２５は保持
され、基板２５の反りも矯正される。The cylinder 29 is fixed on the reference table 1,
The holding plate support portion 30 made of a copper plate or the like is used for the shaft 3 of the cylinder 29.
It is fixed to the tip of 1. The holding plate 32 is made of a leaf spring such as phosphor bronze and is fixed to the holding plate support portion 30. The substrate 25 is held by being pressed by the tip of the pressing plate 32, and the warp of the substrate 25 is also corrected.
【００１６】操作部３３はキー３４と表示部３５からな
り、ノズル１８をＸ軸方向とＺ軸方向に移動させる量と
その順序が入力され、基板２５をＹ軸方向に移動させる
量とその順序が入力される。制御部３６は操作部３３に
電気的接続され、ＣＰＵとメモリ等からなり、上述の入
力に応じた出力信号をパルスモータ６等に出力する。以
上の部品により、基板２５を搭載した本実施例の樹脂塗
布装置３７が構成されている。The operation unit 33 comprises a key 34 and a display unit 35, and the amount and the order of moving the nozzle 18 in the X-axis direction and the Z-axis direction are input, and the amount and the order of moving the substrate 25 in the Y-axis direction. Is entered. The control unit 36 is electrically connected to the operation unit 33, includes a CPU and a memory, and outputs an output signal corresponding to the above-described input to the pulse motor 6 or the like. The resin coating device 37 of the present embodiment on which the substrate 25 is mounted is configured by the above components.
【００１７】次にこの樹脂塗布装置３７に於ける樹脂塗
布の動作を再び図１乃至図３に従い説明する。最初に発
光ダイオード２８が載置され配線された複数の基板２５
を基台２３の所定の位置に配置する。キー３４を押して
キー入力する事により、基板２５の所定位置を合わせ
て、Ｙ方向の位置決めをする。Next, the operation of resin coating in the resin coating device 37 will be described again with reference to FIGS. First, a plurality of substrates 25 on which the light emitting diodes 28 are mounted and wired
Is placed at a predetermined position on the base 23. By pressing the key 34 and inputting a key, a predetermined position of the substrate 25 is aligned and positioned in the Y direction.
【００１８】次に、ノズル１８の先端２１と発光ダイオ
ード２８の側面との距離Ａが０．３〜０．７mmになる様
に、容器１５の上下位置を調節して容器１５をヘッド５
に固定する。そしてキー３４を押す事により、ノズル１
８の最先端が基板３５の表面に接触する様にして、Ｚ方
向の位置決めをする。更にノズル１８の最先端の位置が
所定の位置に来る様に、キー３４を押す事によりＸ方向
の位置決めをする。そして再び所定のプログラムに従っ
たキー入力する事により、Ｘ、Ｙ、Ｚ方向に於ける移動
量と移動の順序を操作部３３に入力して、動作を開始さ
せる。Next, the vertical position of the container 15 is adjusted so that the distance A between the tip 21 of the nozzle 18 and the side surface of the light emitting diode 28 is 0.3 to 0.7 mm, and the container 15 is moved to the head 5.
Fixed to. By pressing the key 34, the nozzle 1
Positioning in the Z direction is made so that the leading edge of 8 contacts the surface of the substrate 35. Further, the key 34 is pressed to position the nozzle 18 in the X direction so that the tip of the nozzle 18 comes to a predetermined position. Then, by again inputting a key according to a predetermined program, the amount of movement and the order of movement in the X, Y, and Z directions are input to the operation unit 33 to start the operation.
【００１９】次に、図２に示す様にノズル１８が引下げ
られて、ノズル１８の最先端が基板２５の表面に接触
し、ノズル１８と発光ダイオード２８の距離Ａが０．３
〜０．７mmになり、ノズルの角度θが４０°〜５０°に
なる位置でノズル１８は静止する。次に容器１５内に１
０kg／cm2の圧力で約０．２秒間空気が加圧される事に
よりシリコン樹脂１６がノズル１８から供給される。こ
の様に、ノズル１８の先端が基板２５の表面に略接触す
る様に、ノズル１８は発光ダイオード２８の側面に近接
して斜めからシリコン樹脂１６を供給し、その後に供給
が停止される。Next, as shown in FIG. 2, the nozzle 18 is pulled down, the tip of the nozzle 18 contacts the surface of the substrate 25, and the distance A between the nozzle 18 and the light emitting diode 28 is 0.3.
The nozzle 18 is stationary at a position where the nozzle angle θ is 40 ° to 50 °. Then 1 in container 15
The silicon resin 16 is supplied from the nozzle 18 by pressurizing the air at a pressure of 0 kg / cm 2 for about 0.2 seconds. In this way, the nozzle 18 obliquely supplies the silicon resin 16 close to the side surface of the light emitting diode 28 so that the tip of the nozzle 18 substantially contacts the surface of the substrate 25, and thereafter the supply is stopped.
【００２０】上述の様に、シリコン樹脂１６は基板２５
の表面に接触したノズル１８の先端から供給されるの
で、供給されたシリコン樹脂３８は基板２５の表面に十
分接触する。従って、供給されたシリコン樹脂３８と基
板２５との接着力は、従来の装置によるものと異なり、
十分大きいものとなる。As described above, the silicone resin 16 is applied to the substrate 25.
Since it is supplied from the tip of the nozzle 18 in contact with the surface of the substrate, the supplied silicon resin 38 sufficiently contacts the surface of the substrate 25. Therefore, the adhesive force between the supplied silicon resin 38 and the substrate 25 is different from that in the conventional device.
It will be large enough.
【００２１】次に操作部３３に入力されたプログラムに
従い、容器１５とノズル支持部１４は、図３の断面図に
示す様に真直ぐ上方に引上げられる。この時、図２に示
された供給されたシリコン樹脂３８と基板２５との接着
力は十分大きいので、ノズル１８の先端２１と供給され
たシリコン樹脂３８との接着力は小さくなる。故にノズ
ル１８の先端２１に残ったシリコン樹脂３９の量は殆ん
どなく、かつそのばらつきも小さい。上述の様に供給さ
れたシリコン樹脂３８の量は加圧する空気の圧力と時間
により正確に制御され、ノズル１８に残ったシリコン樹
脂３９の量がばらつきなく制御されるので、発光ダイオ
ード２８に塗布されるシリコン樹脂４０の量はばらつき
が少なくなる。Next, according to the program input to the operation section 33, the container 15 and the nozzle support section 14 are pulled straight up as shown in the sectional view of FIG. At this time, since the adhesive force between the supplied silicon resin 38 and the substrate 25 shown in FIG. 2 is sufficiently large, the adhesive force between the tip 21 of the nozzle 18 and the supplied silicon resin 38 becomes small. Therefore, the amount of the silicon resin 39 remaining on the tip 21 of the nozzle 18 is almost non-existent, and its variation is small. The amount of the silicon resin 38 supplied as described above is accurately controlled by the pressure and time of the pressurized air, and the amount of the silicon resin 39 remaining in the nozzle 18 is controlled without variation, so that it is applied to the light emitting diode 28. The amount of the silicon resin 40 that is used is less variable.
【００２２】次にこの樹脂塗布装置３７により、基板２
５上の発光ダイオード２８にシリコン樹脂４０を塗布さ
れたものを用いた線状光源４１を図４の断面図に示す。
この図に於て、棒状レンズ４２が発光ダイオード２８の
上方に設けられ、スペーサ４３、４４により支持されて
いる。発光ダイオード２８の個数は従来の装置と同じく
２５個である。Next, with the resin coating device 37, the substrate 2
4 shows a linear light source 41 using a light emitting diode 28 on which the silicon resin 40 is applied.
In this figure, a rod-shaped lens 42 is provided above the light emitting diode 28 and is supported by spacers 43 and 44. The number of light emitting diodes 28 is 25, as in the conventional device.
【００２３】更に、この線状光源４１の輝度特性を図５
の特性図に従い説明する。この図に於て、横軸は各々の
発光ダイオード２８の真上の点の位置を示し、縦軸は各
々の位置に於ける棒状レンズを介しての輝度を示し、そ
れらの平均値を１００％とし各々の輝度を百分率で示し
ている。この線状光源４１による測定値を実線で示して
いる。この特性図により、輝度のばらつきが平均値±１
０％以内と小さい事が判る。Further, the brightness characteristics of this linear light source 41 are shown in FIG.
It will be described with reference to the characteristic diagram of FIG. In this figure, the horizontal axis represents the position of the point directly above each light emitting diode 28, and the vertical axis represents the brightness through the rod-shaped lens at each position, and the average value thereof is 100%. And each luminance is shown as a percentage. The measurement value by this linear light source 41 is shown by the solid line. Based on this characteristic diagram, the variation in brightness is an average value ± 1.
You can see that it is as small as 0% or less.
【００２４】なお上述の説明では、半導体素子２８とし
て発光ダイオードを例示したが、本発明はこれに限定さ
れる事なく、他の素子にも適用可能である。In the above description, the light emitting diode is illustrated as the semiconductor element 28, but the present invention is not limited to this and can be applied to other elements.
【００２５】[0025]
【発明の効果】本発明は上述の様に、ノズルの先端を基
板に略接触した位置に於て、その斜めに形成された先端
から基板の表面と半導体素子及びその周辺に樹脂を塗布
する。故に樹脂は基板に十分の量が接触する。その結
果、樹脂と基板との接着力が十分となり、ノズルを引上
げる時に、ノズルの先端と樹脂との接着力が小さくな
る。故にノズルの先端に残る樹脂量も殆んどなくなり、
ばらつきも小さくなるので、半導体素子の周辺に塗布さ
れる樹脂量が略一定となる。As described above, according to the present invention, at the position where the tip of the nozzle is substantially in contact with the substrate, the resin is applied from the obliquely formed tip to the surface of the substrate, the semiconductor element and its periphery. Therefore, the resin contacts the substrate in a sufficient amount. As a result, the adhesive force between the resin and the substrate becomes sufficient, and when pulling up the nozzle, the adhesive force between the tip of the nozzle and the resin becomes small. Therefore, the amount of resin remaining at the tip of the nozzle has almost disappeared,
Since the variation is also small, the amount of resin applied around the semiconductor element is substantially constant.
【図１】本発明の実施例に係る樹脂塗布装置と基板を示
す部分斜視図である。FIG. 1 is a partial perspective view showing a resin coating device and a substrate according to an embodiment of the present invention.
【図２】樹脂が塗布された時の本実施例に係る樹脂塗布
装置及び基板の要部断面図である。FIG. 2 is a cross-sectional view of essential parts of a resin coating device and a substrate according to the present embodiment when resin is coated.
【図３】ノズルが引上げられた時の本実施例に係る樹脂
塗布装置と基板の要部断面図である。FIG. 3 is a cross-sectional view of essential parts of a resin coating device and a substrate according to this embodiment when a nozzle is pulled up.
【図４】本実施例に係る樹脂塗布装置により、基板上の
発光ダイオードにシリコン樹脂が塗布されたものを用い
た線状光源の断面図である。FIG. 4 is a cross-sectional view of a linear light source using a light emitting diode on a substrate coated with a silicone resin by the resin coating device according to the present embodiment.
【図５】本実施例に係る樹脂塗布装置により樹脂を塗布
された線状光源及び従来の樹脂塗布装置により樹脂を塗
布された線状光源の各々の輝度特性図である。FIG. 5 is a luminance characteristic diagram of each of a linear light source coated with a resin by the resin coating device according to the present embodiment and a linear light source coated with a resin by a conventional resin coating device.
【図６】樹脂が塗布された時の従来の樹脂塗布装置と基
板の要部断面図である。FIG. 6 is a cross-sectional view of main parts of a conventional resin coating device and a substrate when resin is coated.
【図７】ノズルが引上げられた時の従来の樹脂塗布装置
と基板の要部断面図である。FIG. 7 is a cross-sectional view of essential parts of a conventional resin coating device and a substrate when a nozzle is pulled up.
１５ 容器 １６ 樹脂 １８ ノズル ２１ ノズルの先端 ２５ 基板 ２８ 半導体素子 ３７ 樹脂塗布装置 15 Container 16 Resin 18 Nozzle 21 Tip of Nozzle 25 Substrate 28 Semiconductor Element 37 Resin Coating Device
Claims (1)
端に固定されかつ引下げられて前記樹脂が所定量だけ供
給されかつその供給を停止し引上げられるノズルを備
え、基板上に載置された半導体素子及びその周辺に前記
樹脂を塗布する樹脂塗布装置に於て、前記ノズルの先端
から供給された樹脂が前記基板の表面と前記半導体素子
及びその周辺に塗布される様に、前記ノズルは先端が斜
めに形成されかつその最先端は前記基板に略接触してい
る事を特徴とする樹脂塗布装置。1. A container comprising a resin, a nozzle fixed to the lower end of the container and being lowered to supply a predetermined amount of the resin, and to stop the supply of the resin and pull it up. In a resin coating device that coats the resin on the semiconductor element and its periphery, the nozzle is arranged so that the resin supplied from the tip of the nozzle is coated on the surface of the substrate, the semiconductor element and its periphery. A resin coating device, wherein a tip is formed obliquely and a tip of the tip is substantially in contact with the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27077993A JPH07122585A (en) | 1993-10-28 | 1993-10-28 | Resin applying device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27077993A JPH07122585A (en) | 1993-10-28 | 1993-10-28 | Resin applying device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07122585A true JPH07122585A (en) | 1995-05-12 |
Family
ID=17490885
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27077993A Pending JPH07122585A (en) | 1993-10-28 | 1993-10-28 | Resin applying device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07122585A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007517388A (en) * | 2003-12-30 | 2007-06-28 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | Photoelectric module and manufacturing method thereof |
| JP2011249829A (en) * | 2011-07-20 | 2011-12-08 | Mitsubishi Chemicals Corp | White light-emitting element |
| JP2012138536A (en) * | 2010-12-28 | 2012-07-19 | Konica Minolta Advanced Layers Inc | Method for manufacturing light-emitting device |
| JP2016146452A (en) * | 2015-02-09 | 2016-08-12 | 新日本無線株式会社 | Led module and manufacturing method therefor |
| EP3534416A1 (en) * | 2018-02-28 | 2019-09-04 | Nichia Corporation | Method of manifacturing light emitting device and light emitting device |
-
1993
- 1993-10-28 JP JP27077993A patent/JPH07122585A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007517388A (en) * | 2003-12-30 | 2007-06-28 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | Photoelectric module and manufacturing method thereof |
| US8044474B2 (en) | 2003-12-30 | 2011-10-25 | Osram Opto Semiconductors Gmbh | Optoelectronic module, and method for the production thereof |
| JP2012138536A (en) * | 2010-12-28 | 2012-07-19 | Konica Minolta Advanced Layers Inc | Method for manufacturing light-emitting device |
| JP2011249829A (en) * | 2011-07-20 | 2011-12-08 | Mitsubishi Chemicals Corp | White light-emitting element |
| JP2016146452A (en) * | 2015-02-09 | 2016-08-12 | 新日本無線株式会社 | Led module and manufacturing method therefor |
| EP3534416A1 (en) * | 2018-02-28 | 2019-09-04 | Nichia Corporation | Method of manifacturing light emitting device and light emitting device |
| US10749082B2 (en) | 2018-02-28 | 2020-08-18 | Nichia Corporation | Method of manufacturing light emitting device and light emitting device |
| US11257993B2 (en) | 2018-02-28 | 2022-02-22 | Nichia Corporation | Method of manufacturing light emitting device and light emitting device |
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