JPH07121555B2 - Resin material joining method - Google Patents
Resin material joining methodInfo
- Publication number
- JPH07121555B2 JPH07121555B2 JP62237744A JP23774487A JPH07121555B2 JP H07121555 B2 JPH07121555 B2 JP H07121555B2 JP 62237744 A JP62237744 A JP 62237744A JP 23774487 A JP23774487 A JP 23774487A JP H07121555 B2 JPH07121555 B2 JP H07121555B2
- Authority
- JP
- Japan
- Prior art keywords
- adhesive layer
- conductor
- adhesive
- joining
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Lining Or Joining Of Plastics Or The Like (AREA)
Description
【発明の詳細な説明】 (技術分野) 本発明は樹脂材料の接合方法に係り、特にポリプロピレ
ン等の難接着性の熱可塑性樹脂材料(部材)を、所定の
材料に対して、高い接合強度をもって有利に接合せしめ
るための方法に関するものである。Description: TECHNICAL FIELD The present invention relates to a method for joining resin materials, and in particular, a thermoplastic resin material (member) having a low adhesion property such as polypropylene with a high joining strength to a predetermined material. It relates to a method for advantageously joining.
(従来技術とその問題点) 従来から、自動車用内装材等、樹脂材料を接合せしめた
ものが各種の用途に用いられてきているが、そのような
樹脂材料と相手材との接合には、一般に、接着剤や両面
テープが用いられているところから、それら両部材の接
合力は、接着剤や両面テープの接着力のみに依存するこ
ととなり、そのために、高い接着力を期待することは困
難であって、年月を経ることによって、剥がれ等が惹起
される問題を内在している。(Prior Art and its Problems) Conventionally, a material obtained by joining a resin material such as an automobile interior material has been used for various purposes. For joining such a resin material and a mating material, In general, since adhesives and double-sided tapes are used, the joining force between these two members depends only on the adhesives and the double-sided tapes, and it is difficult to expect high adhesiveness. However, there is an inherent problem that peeling or the like is caused over time.
また、樹脂材料の接合技術の一つとして、高周波誘導加
熱を利用して樹脂材料を溶融せしめ、相手材と接合せし
める高周波溶接手法も知られているが、厚いシート材料
や、意匠効果の維持のために、接合面部分のみの加熱、
溶融操作が要請される材料、更には損失係数の小さいポ
リプロピレン等の材料の接合には、そのような高周波溶
接手法を適用することは困難であったのである。In addition, as one of the joining techniques for resin materials, a high-frequency welding method is known in which high-frequency induction heating is used to melt the resin material and join it with the mating material. In order to heat only the joint surface part,
It was difficult to apply such a high-frequency welding method to join materials required to be melted, and further materials such as polypropylene having a small loss coefficient.
そこで、特公昭53-21903号公報や特開昭60-130664号公
報等において、導電体粒子や導電体繊維を混合、分散せ
しめてなる接着剤を用いて、所定の樹脂材料の接合面に
適用した後、高周波溶接することにより、相手材との接
合を図る技術が提案されるに至った。Therefore, in Japanese Patent Publication No. 53-21903 and Japanese Patent Laid-Open No. 60-130664, etc., it is applied to a bonding surface of a predetermined resin material by using an adhesive obtained by mixing and dispersing conductive particles and conductive fibers. After that, a technique for joining with a mating material by high-frequency welding has been proposed.
しかしながら、かかる導電体粒子乃至は導電体繊維が配
合されてなる接着剤を用いる手法にあっては、樹脂材料
の接合面に形成された接着剤層中に存在する導電体によ
って高周波誘導加熱が惹起され、以て接着剤層部分の加
熱が為され得て、樹脂材料と相手材との有効な接合が為
され得るものであるが、高周波加熱に寄与する導電体
は、接着剤層内に分散せしめられているところから、高
周波誘導加熱による加熱効率が今一つ充分でなく、導電
体の混合量を増大させたり、高周波誘導加熱時間を長く
したりしなければならない等の問題を内在している。However, in the method of using an adhesive containing such conductive particles or conductive fibers, high frequency induction heating is caused by the conductive material present in the adhesive layer formed on the bonding surface of the resin material. As a result, the adhesive layer portion can be heated, and effective bonding between the resin material and the mating material can be achieved.However, the conductor that contributes to high frequency heating is dispersed in the adhesive layer. However, the efficiency of high-frequency induction heating is not sufficient yet, and there are inherent problems such as the need to increase the mixing amount of conductors and lengthen the high-frequency induction heating time.
(解決手段) ここにおいて、本発明は、かかる事情を背景にして為さ
れたものであって、上記した従来の問題を悉く解消する
ものであり、その特徴とするところは、少なくとも一方
が熱可塑性樹脂からなる第一の部材と第二の部材とを接
合せしめる方法にして、それら第一及び第二の部材のう
ちの少なくとも一方の接合面に熱可塑性接着剤からなる
接着剤層を所定厚さに形成した後、かかる接着剤層の表
面に、該熱可塑性接着剤の融点以上に加熱した粉粒体
状、箔状若しくは繊維状の導電体を投射し、該接着剤層
表面の投射部位を溶融して該導電体を当該表面部位に付
着固定せしめ、更にその後、それら両部材の接合面を重
ね合わせて、高周波溶接することにより、前記接着剤層
を介して前記第一の部材と第二の部材とを接合せしめる
ようにしたことにある。(Solution) Here, the present invention has been made in view of such circumstances, and is intended to solve the above-mentioned conventional problems, and is characterized in that at least one of them is thermoplastic. A method for joining a first member and a second member made of resin to each other, and an adhesive layer made of a thermoplastic adhesive having a predetermined thickness is provided on a joining surface of at least one of the first and second members. Then, on the surface of such an adhesive layer, a granular or foil-shaped or fibrous electric conductor heated to a temperature equal to or higher than the melting point of the thermoplastic adhesive is projected, and the projected portion of the adhesive layer surface is projected. The conductor is melted and adhered and fixed to the surface portion, and then the joining surfaces of the two members are overlapped with each other and high-frequency welding is performed, so that the first member and the second member are bonded via the adhesive layer. So that it can be joined to There is something I did.
また、本発明にあっては、前記付着固定せしめられる導
電体量:X(g/m2)は、前記接着剤層を形成するための熱
可塑性接着剤の使用量をY(g/m2)とした場合におい
て、次式: X≧0.1Y を満足するように調整されることが望ましいのである。Further, in the present invention, the amount of the conductor to be adhered and fixed: X (g / m 2 ) is the amount of the thermoplastic adhesive used for forming the adhesive layer to be Y (g / m 2). ), It is desirable that the following formula: X ≧ 0.1Y be satisfied.
(作用・効果) 従って、かくの如き本発明手法に従えば、粉粒体状、箔
状若しくは繊維状の導電体は、それが先に提案された如
き接着剤に混合せしめられるものではなく、樹脂材料
(第一の部材及び/又は第二の部材)の接合面に形成さ
れた所定厚さの接着剤層の表面を溶融してそこに付着固
定せしめられ、かかる接着剤層表面部位に偏在、即ち相
手材との界面近傍に偏在させられた状態下において、高
周波誘導加熱が行なわれることとなるところから、高周
波誘導加熱作用が、かかる導電体の偏在部分に集中的に
与えられるようになるのであり、以て有効な加熱作用が
惹起され、そして効率的に高周波接着が行なわれ得るよ
うになるために、短時間の高周波加熱操作にて、また導
電体量も少なく為し得、そして高い接合強度を有利に実
現し得るのである。(Operation / Effect) Therefore, according to the method of the present invention as described above, the powdery, granular, foil-shaped or fibrous conductor is not mixed with the adhesive as previously proposed, The surface of the adhesive layer having a predetermined thickness formed on the joint surface of the resin material (first member and / or second member) is melted and adhered and fixed thereto, and unevenly distributed on the surface portion of the adhesive layer. That is, since the high frequency induction heating is performed under the condition of being unevenly distributed in the vicinity of the interface with the mating material, the high frequency induction heating action is concentratedly applied to the unevenly distributed portion of the conductor. Therefore, since an effective heating action is induced and the high-frequency bonding can be efficiently performed, a high-frequency heating operation for a short time can be performed, and the amount of the conductor can be reduced, and it is high. Achieving a favorable bonding strength To get.
(構成の具体的説明) ところで、かかる本発明において、接合せしめられる第
一の部材と第二の部材は、それらの少なくとも一方が熱
可塑性樹脂からなる樹脂材料であって、また熱可塑性樹
脂としても、各種の公知の樹脂が対象とされるものであ
るが、特にポリプロピレン(PP)、ポリエチレン(P
E)、ポリメチルペンテン、ポリ塩化ビニル(PVC)、ポ
リアミド(PAm;ナイロン)、ポリフェニレンサルファイ
ド(PPS)、ポリエーテルサルファイド(PES)、ポリカ
ーボネート(PC)、ポリアセタール(POM)、ポリエー
テルエーテルケトン(PEEK)、ポリフェニレンオキサイ
ド(PPO)等の難接着性の熱可塑性樹脂からなる材料
(部材)の接合操作に有利に適用されるものである。(Specific Description of Configuration) Incidentally, in the present invention, at least one of the first member and the second member to be joined is a resin material made of a thermoplastic resin, and also as a thermoplastic resin. , Various well-known resins are targeted, especially polypropylene (PP), polyethylene (P
E), polymethylpentene, polyvinyl chloride (PVC), polyamide (PAm; nylon), polyphenylene sulfide (PPS), polyether sulfide (PES), polycarbonate (PC), polyacetal (POM), polyether ether ketone (PEEK) ), Polyphenylene oxide (PPO) or the like, which is advantageously applied to a joining operation of materials (members) made of a thermoplastic resin having poor adhesion.
なお、かかる樹脂材料の接合せしめられる相手材として
は、同一材質の樹脂材料の他、材質の異なる他の樹脂材
料であっても何等差支えなく、更に木や金属等の材質の
部材に対する接合も可能であり、またかかる接合される
べき樹脂材料の形態としては、一般に、所定厚さのシー
ト状材料が対象とされるものであるが、その他、複雑な
形状の成形品等、各種の形状のものの接合にも同様に適
用され得るものである。The mating material to which the resin material is joined may be the resin material of the same material or another resin material of different material, and it is also possible to join to a member made of a material such as wood or metal. Further, as the form of the resin material to be joined, generally, a sheet-shaped material having a predetermined thickness is targeted, but in addition, molded articles of various shapes, such as various shapes The same applies to joining.
そして、この接合されるべき第一の部材と第二の部材の
うち、その少なくとも一方のものの接合面に、適当な熱
可塑性接着剤が適用されて、所定厚さの接着剤層が形成
されることとなる。なお、この熱可塑性接着剤として
は、酢酸ビニル系、アクリル系、エチレン共重合系、ポ
リアミド系、ポリエステル系、ポリウレタン系等の熱可
塑性樹脂からなる接着剤が、適宜に選択使用されること
となる。また、かかる熱可塑性接着剤からなる接着剤層
の形成には、公知の各種の手法を採用することが可能で
ある。Then, an appropriate thermoplastic adhesive is applied to the joining surface of at least one of the first member and the second member to be joined to form an adhesive layer having a predetermined thickness. It will be. As the thermoplastic adhesive, an adhesive made of a thermoplastic resin such as vinyl acetate-based, acrylic-based, ethylene copolymer-based, polyamide-based, polyester-based, polyurethane-based, etc. will be appropriately selected and used. . In addition, various known methods can be adopted for forming the adhesive layer made of such a thermoplastic adhesive.
次いで、このようにして所定の部材の接合面上に形成さ
れた接着剤層に対して、更にその表面に、粉粒体状、箔
状若しくは繊維状の導電体が均一に付着固定せしめら
れ、以てかかる接着剤層の表層部位に導電体が偏在する
層が形成せしめられることとなる。Then, with respect to the adhesive layer thus formed on the joint surface of the predetermined member, further on the surface thereof, powder-shaped, foil-shaped or fibrous electric conductors are uniformly adhered and fixed, Thus, a layer in which the conductor is unevenly distributed is formed on the surface layer portion of the adhesive layer.
ところで、この導電体を接着剤層表面に付着固定せしめ
るための手法としては、導電体の粉粒物、箔片、繊維或
いはその類似物が自由に移動して接着剤層表面において
不均一な偏りを生じないように、かかる接着剤層表層部
に該導電体を有利に固定せしめるべく、特に本発明にあ
っては、かかる導電体を、接合面に形成された接着剤層
を構成する熱可塑性接着剤の融点以上に加熱せしめて、
かかる接着剤層の表面に投射し、以て接着剤層表面の投
射部位を溶融して導電体を当該表面部位に付着固定する
手法が採用されることとなる。なお、この導電体の加熱
方法としては、導電体を熱風により加熱したり、溶射フ
レームにより加熱したりする方法等が採用される。By the way, as a method for adhering and fixing the conductor on the surface of the adhesive layer, powder particles, foil pieces, fibers or the like of the conductor are free to move to cause uneven unevenness on the surface of the adhesive layer. In order to advantageously fix the electric conductor to the surface layer portion of the adhesive layer so as to prevent the occurrence of the above, particularly in the present invention, the electric conductor is formed of a thermoplastic resin that constitutes an adhesive layer formed on the joint surface. Heat to above the melting point of the adhesive,
A method of projecting onto the surface of such an adhesive layer and then melting the projected site on the surface of the adhesive layer to attach and fix the conductor to the surface site is adopted. As a method for heating the conductor, a method of heating the conductor with hot air or a flame spraying frame may be used.
また、このように付着固定せしめられる導電体の量(Xg
/m2)としては、その種類や高周波溶接条件等によって
適宜に決定されることとなるが、一般に、接合面に対す
る熱可塑性接着剤の使用量(Yg/m2)に対して、次式: X≧0.1Y を満足するように定めるのが望ましい。換言すれば、導
電体量(X)は、接着剤の使用量(Y)の10%まで低減
せしめることが可能であるのであり、このような少ない
導電体量において、高周波溶接が実施出来ることは、か
かる導電体が接着剤層の表層部に偏在させられているか
らである。一方、かかる導電体量(X)を増大せしめれ
ば、高周波加熱時間を短縮することが可能となるが、そ
の上限としては、一般に、50%以下、換言すれば0.5Y以
下程度とされることとなる。In addition, the amount of conductor (Xg
/ m 2 ) will be appropriately determined depending on the type and high-frequency welding conditions, etc., but in general, the following formula is used for the amount of the thermoplastic adhesive (Yg / m 2 ) used for the joint surface: It is desirable to set it so as to satisfy X ≧ 0.1Y. In other words, the amount of conductor (X) can be reduced to 10% of the amount of adhesive used (Y), and high-frequency welding can be performed with such a small amount of conductor. This is because the conductor is unevenly distributed in the surface layer portion of the adhesive layer. On the other hand, if the amount of the conductor (X) is increased, the high frequency heating time can be shortened, but the upper limit is generally 50% or less, in other words, about 0.5Y or less. Becomes
なお、上記の如くして接着剤層表面に付着固定せしめら
れる導電体としては、よく知られているように、例えば
Fe、Co、Ni、Cr等の金属やそれらの合金、更にはC等の
導電性物質からなるものであり、そのような導電性の材
料を公知の適当な手段にて粉粒化し、箔状化(小片状
化)し、或いは繊維状化したもの、或いはそれらの類似
物が用いられるのである。Incidentally, as the electric conductor which is adhered and fixed to the surface of the adhesive layer as described above, as well known, for example,
It is made of a metal such as Fe, Co, Ni, or Cr, or an alloy thereof, or a conductive substance such as C. Such a conductive material is powdered by a known appropriate means to form a foil. Those which are made into small pieces (pieces), or made into fibers, or their analogues are used.
そして、このようにして得られた、接着剤層の表面に所
定の導電体が付着固定せしめられてなる部材には、他方
の部材の接合面が重ね合わされ、常法に従って高周波溶
接が実施される。なお、この高周波溶接には、通常の高
周波溶接条件を採用することが可能であり、例えば周波
数としては、50KHz程度から10MHz程度が採用され、また
その際、空気圧等によって適当な加圧が実施され(例え
ば3〜4kg/cm2程度)、更には接着面積にもよるが、溶
接時間(加熱時間)としては、1〜10秒程度が採用され
ることとなる。Then, the member obtained by adhering and fixing a predetermined electric conductor to the surface of the adhesive layer thus obtained is overlaid with the joint surface of the other member, and high-frequency welding is carried out in accordance with a conventional method. . It should be noted that, for this high-frequency welding, it is possible to adopt ordinary high-frequency welding conditions.For example, as the frequency, about 50 KHz to 10 MHz is adopted, and at that time, appropriate pressure is applied by air pressure or the like. The welding time (heating time) is about 1 to 10 seconds (depending on the bonding area, for example, about 3 to 4 kg / cm 2 ).
そして、かくの如き高周波溶接操作によって、少なくと
も一方が熱可塑性樹脂からなる第一の部材と第二の部材
とが、それらの接合界面に存在せしめられた接着剤層を
介して、その表面部位に付着固定された導電体の効率的
な誘導加熱作用によって、迅速に且つ強固に接合せしめ
られることとなるのである。Then, by such a high-frequency welding operation, at least one of the first member and the second member made of a thermoplastic resin, through the adhesive layer made to exist at their bonding interface, to the surface portion thereof. The efficient induction heating action of the adhered and fixed electric conductor enables quick and strong joining.
(実施例) 以下に、本発明の幾つかの実施例を示し、本発明を更に
具体的に明らかにすることとするが、本発明が、そのよ
うな実施例の記載によって、何等の制約をも受けるもの
でないことは、言うまでもないところである。(Examples) Hereinafter, several examples of the present invention will be shown to clarify the present invention more specifically, but the present invention does not impose any restrictions due to the description of such examples. Needless to say, it is not something to receive.
また、本発明には、以下の実施例の他にも、更には上記
の具体的記述以外にも、本発明の趣旨を逸脱しない限り
において、当業者の知識に基づいて種々なる変更、修
正、改良等を加え得るものであることが、理解されるべ
きである。In addition to the following embodiments, the present invention further includes various changes and modifications based on the knowledge of those skilled in the art, in addition to the above specific description, without departing from the spirit of the present invention. It should be understood that improvements and the like can be added.
実施例1 第一の部材及び第二の部材として、各種の熱可塑性樹脂
からなる樹脂シートを準備し、下記第1表に示される如
き組合せにおいて、樹脂シートの接合を試みた。Example 1 As the first member and the second member, resin sheets made of various thermoplastic resins were prepared, and joining of the resin sheets was tried in the combinations shown in Table 1 below.
なお、熱可塑性接着剤としては、ポリオレフィン系樹脂
接着剤(住友スリーエム株式会社製PPE-20、3748-TC)
を用い、通常のカレンダリング手法によって、接合すべ
き樹脂シートの接合面に50μmの厚さで塗布してY=50
g/m2)、目的とする接着剤層を形成した。なお、第1表
において、接着剤塗布面が片面と表示されているもの
は、第一の部材(表において上段のもの)の接合面にの
み接着剤層が形成されたものである。As the thermoplastic adhesive, a polyolefin resin adhesive (Sumitomo 3M PPE-20, 3748-TC)
Using a standard calendering method, apply a thickness of 50 μm on the bonding surface of the resin sheets to be bonded and Y = 50
g / m 2 ), the desired adhesive layer was formed. It should be noted that in Table 1, the adhesive-coated surface is shown as one-sided, in which the adhesive layer is formed only on the bonding surface of the first member (the upper one in the table).
次いで、かかる接着剤層の形成された樹脂シートに対し
て、その接着剤層の表面に、第1表に示される如き各種
の導電体を下記A〜Dに示される導電体付着固定方法に
従って適用した。なお、導電体として用いた粉粒体の粒
度は、何れも100メッシュ以下であり、また箔は、厚さ:
10μm以下、最大寸法:1mmの大きさのものであり、更に
繊維は、直径:10μm×長さ:0.5mmの大きさのものであ
った。また、第1表におけるNo.10においては、接着剤
の塗布や導電体の適用は行なわれず、更にNo.11の場合
においては、単にシリコン系の両面接着テープのみが用
いられた。Next, various electric conductors as shown in Table 1 are applied to the surface of the adhesive layer on the resin sheet on which the adhesive layer is formed according to the electric conductor attachment / fixing method shown in A to D below. did. The particle size of the powder used as the conductor is 100 mesh or less, and the foil has a thickness of:
The size was 10 μm or less, the maximum size was 1 mm, and the fiber was 10 μm in diameter × length: 0.5 mm. Further, in No. 10 in Table 1, no adhesive was applied or no conductor was applied, and in No. 11, only the silicon-based double-sided adhesive tape was used.
A:導電体を300℃の熱風で熱可塑性樹脂接着剤層の表面
に付着固定。A: The conductor is attached and fixed to the surface of the thermoplastic resin adhesive layer with hot air at 300 ° C.
B:導電体に液状ポリオレフィン系樹脂接着剤を塗布し、
そして熱可塑性樹脂接着剤層の表面に付着固定。B: Apply a liquid polyolefin resin adhesive to the conductor,
Then, it is attached and fixed on the surface of the thermoplastic resin adhesive layer.
C:熱可塑性樹脂接着剤層の表面に導電体を散布(固定さ
せず)。C: A conductor is dispersed (not fixed) on the surface of the thermoplastic resin adhesive layer.
D:導電性樹脂ペースト接着剤(導電体含有量=30重量
%)を樹脂シートの接合面に塗布。D: A conductive resin paste adhesive (conductor content = 30% by weight) was applied to the bonding surface of the resin sheet.
そして、上記のように処置された第一の部材(樹脂シー
ト)と第二の部材(樹脂シート)とを、それらの接合面
において重ね合わせ、通常の高周波溶接機を用いて、出
力:5KW、周波数:5MHz、発振時間(溶接時間):5秒の条
件下に、高周波溶接を行なった。Then, the first member (resin sheet) and the second member (resin sheet) treated as described above are overlapped at their joint surfaces, and using a normal high-frequency welding machine, output: 5 KW, High frequency welding was performed under the conditions of frequency: 5 MHz and oscillation time (welding time): 5 seconds.
かくして得られた各種の接合樹脂シートについて、ASTM
-D-903に準拠して剥離試験を行ない、それぞれの場合に
おける接着性を評価し、その結果を、第1表に併わせ示
した。なお、第1表における評価記号に関して、○印は
優、△印は可、×印は不可であることを示している。As for various kinds of bonding resin sheets thus obtained,
The peeling test was performed according to -D-903, the adhesiveness in each case was evaluated, and the results are also shown in Table 1. Regarding the evaluation symbols in Table 1, ◯ indicates excellent, Δ indicates acceptable, and X indicates not.
第1表の結果から明らかなように、単なる高周波溶接の
みを実施した場合(No.10)においては全く接合が出来
ず、また従来の如きシリコン系両面接着テープにて接合
せしめた場合(No.11)においても、充分な剥離荷重を
得ることが出来ず、更に、導電体を単に接着剤表面に散
布しただけのもの(No.12)や接着剤中に導電体を分散
せしめたもの(No.18)にあっても、充分な剥離荷重を
得ることは困難であった。As is clear from the results in Table 1, when only high-frequency welding was performed (No. 10), no joining was possible, and when the conventional double-sided adhesive tape was used for joining (No. 10). Even in 11), it was not possible to obtain a sufficient peeling load, and furthermore, conductors were simply dispersed on the adhesive surface (No. 12) or conductors were dispersed in the adhesive (No. .18), it was difficult to obtain a sufficient peeling load.
これに対して、本発明に従って、接着剤層表面に導電体
を付着固定せしめた状態において、第一の部材と第二の
部材を重ね合わせ、高周波溶接した場合(No.13〜17)
にあっては、導電体が移動することもないところから、
かかる接着剤層表面部位における均一な且つ効率的な高
周波加熱が実施され得て、二つの部材の有効な接合が図
られ、以て剥離荷重の大きな、従って剥離位置も一方の
部材(樹脂シート)位置となる、高接合強度の接合シー
トを得ることが出来たのである。On the other hand, according to the present invention, in the state where the conductor is attached and fixed to the surface of the adhesive layer, the first member and the second member are overlapped and subjected to high frequency welding (No. 13 to 17)
In that case, since the conductor does not move,
A uniform and efficient high-frequency heating can be carried out at the surface portion of the adhesive layer, and the two members can be effectively joined, so that the peeling load is large, and therefore the peeling position is also one member (resin sheet). It was possible to obtain a bonding sheet with high bonding strength, which is the position.
実施例2 実施例1と同様にして、下記第2表に示される如き、各
種組合せの樹脂シートの接合を行なった。 Example 2 In the same manner as in Example 1, resin sheets of various combinations were joined as shown in Table 2 below.
なお、導電体の種類及びその性状、接着剤の塗布面、導
電体の加熱方法、接着剤の融点、導電体の加熱温度、投
射方法は、それぞれ下記第2表に示される通りである。
また、導電体の投射量(X)は20g/m2とし、熱可塑性接
着剤の塗布量(Y)は50g/m2となるようにした。更に、
空気圧送及び溶射の送給ガス圧は1.0kgf/cm2とした。ま
た、熱可塑性接着剤としては、ポリオレフィン系の2種
類のものを用い、融点が120℃のものは、PPE-20:3748-T
C(住友スリーエム株式会社製)であり、更に融点が135
℃のものは、アドマーQE050(三井石油化学工業株式会
社製)であった。The types and properties of the conductor, the coated surface of the adhesive, the heating method of the conductor, the melting point of the adhesive, the heating temperature of the conductor, and the projection method are as shown in Table 2 below.
The amount of projection (X) of the conductor was set to 20 g / m 2, and the amount of application of the thermoplastic adhesive (Y) was set to 50 g / m 2 . Furthermore,
The gas pressure for pneumatic and thermal spraying was 1.0 kgf / cm 2 . Two types of polyolefin-based thermoplastic adhesives are used, and those with a melting point of 120 ° C are PPE-20: 3748-T.
C (manufactured by Sumitomo 3M Limited) with a melting point of 135
The one at ℃ was Admer QE050 (manufactured by Mitsui Petrochemical Industry Co., Ltd.).
第2表から明らかなように、接着剤層の表面に導電体が
付着固定せしめられた場合(No.23〜29)においては、
高い接合強度の接合シートを得ることが出来たのに対し
て、接着剤層の表面に導電体が適用されても、かかる導
電体が全く固定されていない場合(No.20)や固定の状
態が充分でない場合(No.21及び22)においては、充分
な剥離荷重を得ることが出来ず、剥離位置も界面となっ
て、接合強度の低いものとなっている。As is clear from Table 2, when the conductor is adhered and fixed to the surface of the adhesive layer (No. 23 to 29),
We were able to obtain a bonding sheet with high bonding strength, but when a conductor was applied to the surface of the adhesive layer, but the conductor was not fixed at all (No. 20) or in a fixed state. If the value is not sufficient (Nos. 21 and 22), a sufficient peeling load cannot be obtained, and the peeling position becomes an interface, resulting in low bonding strength.
実施例3 前記実施例と同様にして、下記第3表に示される、各種
組合せの樹脂シートの接合を行ない、その結果を下記第
3表に併わせ示した。 Example 3 The resin sheets of various combinations shown in Table 3 below were joined in the same manner as in the above Example, and the results are also shown in Table 3 below.
なお、本実施例では、導電体の投射量(X)と接着剤の
塗布量(Y)についても、種々変化せしめた。また、導
電体の種類及びその性状、接着剤の塗布面、接着剤の塗
布量、導電体の加熱方法、接着剤の融点、導電体の加熱
温度、投射方法、導電体の投射量は、何れも、下記第3
表に示される通りである。In this example, the projection amount (X) of the conductor and the application amount (Y) of the adhesive were also changed variously. In addition, the type and properties of the conductor, the coated surface of the adhesive, the coating amount of the adhesive, the heating method of the conductor, the melting point of the adhesive, the heating temperature of the conductor, the projection method, the projection amount of the conductor are all Also, the following third
As shown in the table.
かかる第3表から明らかなように、導電体が単に接着剤
層の表面に散布されただけでは充分な効果を期待するこ
とが出来ず、また導電体の使用量が余りにも少なくなる
と、充分な高周波誘導加熱作用を短時間に充分に発揮さ
せることが困難となるのであり、更に導電体の確実な固
定が行なわれない場合にあっても、剥離荷重、ひいては
接合強度が低下することが認められるのである。As is clear from Table 3, a sufficient effect cannot be expected when the electric conductor is simply dispersed on the surface of the adhesive layer, and when the amount of the electric conductor used is too small, the effect is insufficient. It is difficult to fully exhibit the high-frequency induction heating action in a short time, and it is recognized that the peeling load and eventually the bonding strength are reduced even when the conductor is not securely fixed. Of.
これに対して、No.33〜39に示されるように、樹脂シー
トの接合面に形成された接着剤層の表面に、導電体を充
分な量において確実に固定せしめた場合にあっては、大
きな剥離荷重が得られ、また剥離位置も何れか一方の樹
脂シート部分となり、高い接合強度の接合シートが得ら
れることが認められる。On the other hand, as shown in No. 33 to 39, on the surface of the adhesive layer formed on the bonding surface of the resin sheet, when the conductor is securely fixed in a sufficient amount, It is recognized that a large peeling load can be obtained, and the peeling position is located on either one of the resin sheet portions, so that a bonding sheet with high bonding strength can be obtained.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 吉田 節美 愛知県名古屋市千種区春岡2丁目27番16号 吉田化学株式会社内 (56)参考文献 特開 昭50−50738(JP,A) 米国特許3461014(US,A) 国際公開87/74(WO,A) ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Setsumi Yoshida 2-27-16 Haruoka, Chikusa-ku, Nagoya-shi, Aichi Yoshida Chemical Co., Ltd. (56) References JP-A-50-50738 (JP, A) USA Patent 3461014 (US, A) International Publication 87/74 (WO, A)
Claims (2)
一の部材と第二の部材とを接合せしめる方法にして、そ
れら第一及び第二の部材のうちの少なくとも一方の接合
面に熱可塑性接着剤からなる接着剤層を所定厚さに形成
した後、かかる接着剤層の表面に、該熱可塑性接着剤の
融点以上に加熱した粉粒体状、箔状若しくは繊維状の導
電体を投射し、該接着剤層表面の投射部位を溶融して該
導電体を当該表面部位に付着固定せしめ、更にその後、
それら両部材の接合面を重ね合わせて、高周波溶接する
ことにより、前記接着剤層を介して前記第一の部材と第
二の部材とを接合せしめることを特徴とする樹脂材料の
接合方法。1. A method for joining a first member and a second member, at least one of which is made of a thermoplastic resin, to form a thermoplastic adhesive on the joint surface of at least one of the first and second members. After forming an adhesive layer made of an agent to a predetermined thickness, a powdery, granular, foil-like or fibrous conductor heated to a temperature equal to or higher than the melting point of the thermoplastic adhesive is projected on the surface of the adhesive layer. , The projection portion of the adhesive layer surface is melted to adhere and fix the conductor to the surface portion, and then,
A method for joining resin materials, characterized in that the first member and the second member are joined via the adhesive layer by superposing the joining surfaces of the two members and performing high-frequency welding.
m2)と前記接着剤層を形成するための熱可塑性接着剤の
使用量:Y(g/m2)とが、次式: X≧0.1Y を満足するものである特許請求の範囲第1項に記載の接
合方法。2. The amount of the conductive material to be adhered and fixed: X (g /
m 2 ) and the amount of the thermoplastic adhesive used to form the adhesive layer: Y (g / m 2 ) satisfy the following formula: X ≧ 0.1Y. The method of joining according to item.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62237744A JPH07121555B2 (en) | 1987-09-22 | 1987-09-22 | Resin material joining method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62237744A JPH07121555B2 (en) | 1987-09-22 | 1987-09-22 | Resin material joining method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6478818A JPS6478818A (en) | 1989-03-24 |
JPH07121555B2 true JPH07121555B2 (en) | 1995-12-25 |
Family
ID=17019826
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62237744A Expired - Lifetime JPH07121555B2 (en) | 1987-09-22 | 1987-09-22 | Resin material joining method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH07121555B2 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009046132A (en) * | 2007-08-16 | 2009-03-05 | Murata Mfg Co Ltd | Storing tape for chip-type electronic component, and taping electronic component using it |
JP5606578B2 (en) * | 2012-10-22 | 2014-10-15 | 本田技研工業株式会社 | Reinforcing method and reinforcing device |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3461014A (en) | 1964-06-11 | 1969-08-12 | Albert L James | Magnetic induction method for heat-sealing and bonding predetermined sealing areas |
-
1987
- 1987-09-22 JP JP62237744A patent/JPH07121555B2/en not_active Expired - Lifetime
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3461014A (en) | 1964-06-11 | 1969-08-12 | Albert L James | Magnetic induction method for heat-sealing and bonding predetermined sealing areas |
Also Published As
Publication number | Publication date |
---|---|
JPS6478818A (en) | 1989-03-24 |
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