JPH0712001B2 - Electronic component encapsulation material - Google Patents
Electronic component encapsulation materialInfo
- Publication number
- JPH0712001B2 JPH0712001B2 JP5407692A JP5407692A JPH0712001B2 JP H0712001 B2 JPH0712001 B2 JP H0712001B2 JP 5407692 A JP5407692 A JP 5407692A JP 5407692 A JP5407692 A JP 5407692A JP H0712001 B2 JPH0712001 B2 JP H0712001B2
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin
- epoxy
- imide
- compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Details Of Resistors (AREA)
- Organic Insulating Materials (AREA)
- Insulating Bodies (AREA)
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
- Epoxy Resins (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明はエポキシ変性ポリイミド
樹脂を用いた電子部品封止用材料に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a material for encapsulating electronic parts using an epoxy-modified polyimide resin.
【０００２】[0002]
【従来技術】従来よりポリイミド樹脂は、耐熱性ポリマ
ーとして汎用されているが、溶媒可溶性及び溶融成形性
を向上させるために耐熱性が犠牲にされている。又、ポ
リイミド樹脂は吸水率が高いという欠点もある。このた
めポリイミド樹脂にエポキシ樹脂を配合させて耐熱性を
向上させると共に吸水率の低下も図られているが、耐熱
性が向上し、吸水率も低下するものの、密着力及び難燃
性が低下してしまい、多層積層板とか電子部品封止用材
料としては採用できないものであった。2. Description of the Related Art Conventionally, polyimide resins have been widely used as heat resistant polymers, but heat resistance is sacrificed in order to improve solvent solubility and melt moldability. Further, the polyimide resin has a drawback that it has a high water absorption. Therefore, the epoxy resin is mixed with the polyimide resin to improve the heat resistance and the water absorption is also reduced, but the heat resistance is improved and the water absorption is reduced, but the adhesion and the flame retardance are decreased. Therefore, it cannot be used as a multilayer laminate or a material for encapsulating electronic components.
【０００３】そこで、本発明者等はエポキシ樹脂の配合
量を増す代わりに、エポキシ樹脂とポリイミド樹脂をつ
なぐ働きをする成分を配合すれば樹脂間の密着力が高ま
ることを見出だした。即ち、分子内にイミド基とアミノ
基を各々複数個有する芳香族系化合物にエポキシ樹脂を
反応させて得られるエポキシ変性ポリイミド樹脂を開発
しており、この樹脂によれば層間密着力及び耐湿性の向
上がもたらされる。Therefore, the inventors of the present invention have found that, instead of increasing the compounding amount of the epoxy resin, compounding a component that functions to connect the epoxy resin and the polyimide resin enhances the adhesive force between the resins. That is, we have developed an epoxy-modified polyimide resin obtained by reacting an epoxy resin with an aromatic compound having a plurality of imide groups and amino groups in the molecule, and according to this resin, interlayer adhesion and moisture resistance are improved. Improvement is brought about.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、分子内
にイミド基とアミノ基を各々複数個有する芳香族系化合
物とエポキシ樹脂の二種の物質を反応させるだけでは、
未反応のイミド基が残留して、高温に長期間さらされる
と、ミクロなクラックが生じ、耐電圧特性が劣化するな
ど耐熱性に悪影響を与えてしまっている。However, if two substances, that is, an aromatic compound having a plurality of imide groups and a plurality of amino groups in the molecule, and an epoxy resin are reacted with each other,
When unreacted imide groups remain and are exposed to high temperature for a long period of time, microcracks are generated and the withstand voltage characteristics are deteriorated, which adversely affects the heat resistance.
【０００５】本発明は上記事情に鑑みて為されたもので
あり、その目的とするところは耐熱性に優れ、密着力が
強く、しかも吸水率が低く、難燃性に優れた電子部品封
止用材料を提供することにある。The present invention has been made in view of the above circumstances, and an object of the present invention is to seal electronic parts having excellent heat resistance, high adhesion, low water absorption and excellent flame retardancy. The purpose is to provide materials.
【０００６】[0006]
【課題を解決するための手段】本発明の電子部品封止用
材料は、分子内にイミド基とアミノ基を各々複数個有す
る芳香族系化合物にブロム化エポキシ樹脂を含むエポキ
シ樹脂をルイス酸化合物と不飽和イミド化合物の存在下
で反応させて調製したエポキシ変性ポリイミド樹脂に硬
化剤、充填剤、離型剤等を配合させて成るものであり、
この構成により上記課題が解決されたものである。A material for encapsulating electronic parts of the present invention is a Lewis acid compound containing an epoxy resin containing a brominated epoxy resin in an aromatic compound having a plurality of imide groups and amino groups in the molecule. And an epoxy-modified polyimide resin prepared by reacting in the presence of an unsaturated imide compound with a curing agent, a filler, a release agent, and the like,
The above problem is solved by this configuration.
【０００７】本発明における分子内にイミド基とアミノ
基を各々複数個有する芳香族系化合物としては、例え
ば、特開昭６２−２９５８４号公報に開示されているよ
うにThe aromatic compounds having a plurality of imide groups and amino groups in the molecule of the present invention are disclosed, for example, in JP-A-62-29584.
【０００８】[0008]
【化１】 [Chemical 1]
【０００９】(式中、Xは末端官能基を表し、Ar1、Ar2は
２価の芳香族基、R1は水素原子、炭素数１〜１０のアル
キル基、R2は水素原子、炭素数１〜２０のアルキル基、
アルコキシ基あるいは水酸基を表し、mは０又は正の整
数を示す)で表される末端官能型イミド樹脂とか一般式(In the formula, X represents a terminal functional group, Ar 1 and Ar 2 are divalent aromatic groups, R 1 is a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, R 2 is a hydrogen atom and a carbon number. 1-20 alkyl groups,
Represents an alkoxy group or a hydroxyl group, m is 0 or a positive integer) or a terminal functional type imide resin represented by the general formula
【００１０】[0010]
【化２】 [Chemical 2]
【００１１】(式中、Ar1は２価の芳香族基、Ar4は４価
の芳香族基、Ar3は３価の芳香族基を示し、n、pは０又
は正の整数(但し、n＋p＞０)である。)で表される芳香
族化合物や、一般式(In the formula, Ar 1 is a divalent aromatic group, Ar 4 is a tetravalent aromatic group, Ar 3 is a trivalent aromatic group, n and p are 0 or a positive integer (provided that , N + p> 0)), or an aromatic compound represented by the general formula
【００１２】[0012]
【化３】 [Chemical 3]
【００１３】(式中、Ar4は４価の芳香族基を示し、R1、
R2は水素原子、ハロゲン原子又はアルキル基を示し、
R1、R2のうちの少なくとも一方は常にアルキル基であ
る。qは正の整数である。)で表される芳香族化合物を挙
げることができ、これらの化合物は単独で、又は２種以
上混合して使用される。(In the formula, Ar 4 represents a tetravalent aromatic group, and R 1 ,
R 2 represents a hydrogen atom, a halogen atom or an alkyl group,
At least one of R 1 and R 2 is always an alkyl group. q is a positive integer. ), And these compounds may be used alone or in admixture of two or more.
【００１４】又、本発明においてエポキシ樹脂に含有さ
せるブロム化エポキシ樹脂としては一般式In the present invention, the brominated epoxy resin contained in the epoxy resin has the general formula
【００１５】[0015]
【化４】 [Chemical 4]
【００１６】(式中、qは正の整数)で表されるブロム化
ノボラックエポキシ樹脂や、式(Wherein q is a positive integer) Brominated novolac epoxy resin represented by the formula
【００１７】[0017]
【化５】 [Chemical 5]
【００１８】で表わされるテトラブロムビスフェノール
Ａのジグリシジルエーテル化合物などが使用される。こ
のブロム化エポキシ樹脂に含まれる臭素は全樹脂分に対
して6〜20重量％の範囲にあるのが好ましい。6重量％未
満であると、充分な難燃性を確保できず、一方20重量％
を超えると耐熱性が低下する傾向にある。A diglycidyl ether compound of tetrabromobisphenol A represented by the following is used. The bromine contained in the brominated epoxy resin is preferably in the range of 6 to 20% by weight based on the total resin content. If it is less than 6% by weight, sufficient flame retardancy cannot be secured, while 20% by weight
If it exceeds, heat resistance tends to decrease.
【００１９】エポキシ樹脂成分は芳香族化合物に対して
好ましくは重量比で３:１〜6の範囲で使用される。この
範囲を逸脱してエポキシリッチの場合は、吸水率が低下
し、密着性は向上するが耐熱性が低下してしまうもので
ある。本発明にあっては、硬化剤としてルイス酸化合物
と不飽和イミド化合物を併用する。The epoxy resin component is preferably used in a weight ratio of 3: 1 to 6 with respect to the aromatic compound. In the case of epoxy rich outside this range, the water absorption rate decreases, the adhesion improves, but the heat resistance decreases. In the present invention, a Lewis acid compound and an unsaturated imide compound are used together as a curing agent.
【００２０】ルイス酸化合物としては式、The Lewis acid compound has the formula:
【００２１】[0021]
【化６】 [Chemical 6]
【００２２】であらわされるフェノールノボラックや
式、Phenolic novolacs and formulas represented by
【００２３】[0023]
【化７】 [Chemical 7]
【００２４】であらわされるクレゾールノボラックなど
である。又、不飽和イミド化合物としては式、Examples include cresol novolac represented by The unsaturated imide compound has the formula:
【００２５】[0025]
【化８】 [Chemical 8]
【００２６】で表されるマレインイミドや式、Maleimide or a formula represented by
【００２７】[0027]
【化９】 [Chemical 9]
【００２８】で表されるビスマレイミドが好適に使用さ
れる。このルイス酸化合物と不飽和イミド化合物の配合
割合は任意であるが、ルイス酸化合物が多くなると耐熱
性が低下するが、吸水率も低下する傾向にあり、不飽和
イミド化合物が多くなると、耐熱性は向上するが、吸水
率が高くなる傾向にある。又、これらルイス酸化合物と
不飽和イミド化合物は芳香族化合物に対して重量比で１
〜４:１０の範囲で使用される。これらルイス酸化合物
と不飽和イミド化合物の量がこの範囲よりも多くなる
と、耐熱性が低下し吸水率が高くなる傾向にある。Bismaleimide represented by the following is preferably used. The mixing ratio of the Lewis acid compound and the unsaturated imide compound is arbitrary, but the heat resistance decreases when the Lewis acid compound increases, but the water absorption tends to decrease, and when the unsaturated imide compound increases, the heat resistance increases. , But the water absorption tends to increase. The Lewis acid compound and the unsaturated imide compound have a weight ratio of 1 to the aromatic compound.
Used in the range of up to 4:10. If the amounts of these Lewis acid compound and unsaturated imide compound are more than this range, the heat resistance tends to decrease and the water absorption tends to increase.
【００２９】これら芳香族化合物、エポキシ樹脂成分及
び不飽和イミド化合物は混合され、例えば90〜100℃で1
0〜80分間加熱され、次いで常温にまで冷却され約30分
間撹拌下反応させてエポキシ変性ポリイミド樹脂が製造
される。この場合、不飽和イミド化合物の存在下で反応
させることによりアミノ基と反応させてイミノ基を生成
させ、このようにして得られた分子内にアミノ基、イミ
ノ基及びイミド基を含有するポリイミド樹脂プレポリマ
ーにエポキシ樹脂を反応させることによりアミノ基の残
留を抑制でき、又、ルイス酸化合物を用いることにより
エポキシ樹脂とアミノ基との反応率を高めることがで
き、未反応のアミノ基の極めて少ない耐熱性及び密着性
に優れたエポキシ変性ポリイミド樹脂が得られるのであ
る。These aromatic compounds, epoxy resin components and unsaturated imide compounds are mixed and, for example, at 90-100 ° C.
The epoxy-modified polyimide resin is manufactured by heating for 0 to 80 minutes, then cooling to room temperature and reacting for about 30 minutes with stirring. In this case, a polyimide resin containing an amino group, an imino group and an imide group in the molecule thus obtained by reacting with an amino group to form an imino group by reacting in the presence of an unsaturated imide compound By reacting the prepolymer with an epoxy resin, it is possible to suppress the residue of amino groups, and by using a Lewis acid compound, the reaction rate between the epoxy resin and the amino groups can be increased, and the unreacted amino groups are extremely small. Thus, an epoxy-modified polyimide resin having excellent heat resistance and adhesion can be obtained.
【００３０】このエポキシ変性ポリイミド樹脂に硬化
剤、シリカ等の充填剤、ガラス繊維、カップリング剤、
着色剤、ステアリン酸カルシウム等の離型剤、希釈剤な
どが添加されて電子部品封止用材料が製造される。この
封止用材料の配合割合はエポキシ変性ポリイミド樹脂30
重量部、シリカ等の充填剤70重量部、離型剤0.05部であ
る。A curing agent, a filler such as silica, a glass fiber, a coupling agent,
A colorant, a release agent such as calcium stearate, a diluent and the like are added to produce an electronic component sealing material. The compounding ratio of this sealing material is 30% epoxy modified polyimide resin.
Parts by weight, 70 parts by weight of a filler such as silica, and 0.05 part of a release agent.
【００３１】又、電子部品封止用材料のワニスがガラス
布、不織布、紙などの基材に含浸され、乾燥されてプリ
プレグが製造される。このプリプレグが複数枚積層成形
され、その片面又は両面に銅箔、アルミニウム箔などの
金属箔が貼着されて金属箔張り積層板が製造される。次
に本発明の実施例を具体的に説明する。以下において部
とあるのは重量部を示す。(実施例)イミド樹脂成分とし
て末端官能型イミド樹脂(商品名「TMS-20」、住友化学
(株)製)200部、エポキシ樹脂成分として液状エポキシ樹
脂(商品名「R-140Q」、三井石油化学(株)製)149部とブロ
ム化ノボラック樹脂(臭素含有量３６重量％、商品名「BR
EN(M-80)」、日本化薬(株)製)136部、硬化剤のルイス酸
化合物としてオルソクレゾールノボラック(商品名「D-
5」、東都化成(株)製)82部、不飽和ビスマレイミド20部
を混合し、90℃で50分間加熱し、次いで常温にまで冷却
して30分間撹拌下反応させてエポキシ変性ポリイミド樹
脂を製造した。このもののＴgは230℃であった。A prepreg is manufactured by impregnating a base material such as glass cloth, non-woven cloth or paper with a varnish as a material for sealing electronic parts and drying it. A plurality of the prepregs are laminated and molded, and a metal foil such as a copper foil or an aluminum foil is attached to one or both surfaces of the prepreg to manufacture a metal foil-clad laminate. Next, examples of the present invention will be specifically described. In the following, "part" means "part by weight". (Example) Terminal functional imide resin as an imide resin component (trade name "TMS-20", Sumitomo Chemical
200 parts, liquid epoxy resin (trade name "R-140Q", manufactured by Mitsui Petrochemical Co., Ltd.) as an epoxy resin component and brominated novolac resin (bromine content 36% by weight, trade name " BR
EN (M-80) ", manufactured by Nippon Kayaku Co., Ltd., 136 parts, orthocresol novolac (trade name" D-
5 ", Toto Kasei Co., Ltd.) 82 parts, unsaturated bismaleimide 20 parts are mixed, heated at 90 ° C. for 50 minutes, then cooled to room temperature and reacted under stirring for 30 minutes to obtain an epoxy-modified polyimide resin. Manufactured. This product had a Tg of 230 ° C.
【００３２】このエポキシ変性ポリイミド樹脂ワニスを
ガラス布に含浸させ、乾燥させてプリプレグを製造し
た。このプリプレグを複数枚積層成形して厚み0.4mmの
積層板を製造した。この積層板の層間密着力、吸水率(5
cm×5cmで厚み0.4mmの試料片を23℃の水中に24時間浸
漬)、長期耐熱性(200℃、24hr)、難燃性(UL 94 V-O)を
測定した。結果を第１表に示す。 (比較例１)イミド樹脂成分として実施例と同一の末端官
能型イミド樹脂426部、エポキシ樹脂成分として実施例
と同一の液状エポキシ樹脂231部と実施例と同一のブロ
ム化ノボラック樹脂259部を混合し、常温下、30分かけ
て反応させてエポキシ樹脂変性ポリイミド樹脂を製造し
た。このもののＴgは230℃であった。A glass cloth was impregnated with this epoxy-modified polyimide resin varnish and dried to produce a prepreg. A plurality of the prepregs were laminated to form a laminated plate having a thickness of 0.4 mm. The interlayer adhesion and water absorption (5%
A sample piece having a size of cm × 5 cm and a thickness of 0.4 mm was immersed in water at 23 ° C. for 24 hours, and long-term heat resistance (200 ° C., 24 hr) and flame retardancy (UL 94 VO) were measured. The results are shown in Table 1. Comparative Example 1 Mixing 426 parts of the same terminal functional imide resin as the imide resin component, 231 parts of the same liquid epoxy resin as the epoxy resin component, and 259 parts of the same brominated novolac resin as the example. Then, the mixture was reacted at room temperature for 30 minutes to produce an epoxy resin-modified polyimide resin. This product had a Tg of 230 ° C.
【００３３】次いで、実施例と同様にして積層板を製造
し、同様の測定を行った。結果を第１表に示す。 (比較例２)Ｔgが250℃のポリイミド樹脂ワニスを使用し
た以外は実施例と同様にして積層板を製造し、同様の測
定を行った。結果を第１表に示す。 (比較例３)Ｔgが150℃のエポキシ樹脂ワニスを使用した
以外は実施例と同様にして積層板を製造し、同様の測定
を行った。結果を第１表に示す。Then, a laminated plate was manufactured in the same manner as in the example, and the same measurement was performed. The results are shown in Table 1. (Comparative Example 2) A laminated board was produced in the same manner as in Example except that a polyimide resin varnish having Tg of 250 ° C was used, and the same measurement was performed. The results are shown in Table 1. (Comparative Example 3) A laminated board was produced in the same manner as in Example except that an epoxy resin varnish having Tg of 150 ° C was used, and the same measurement was performed. The results are shown in Table 1.
【００３４】 第１表 実施例 比較例 １ ２ ３ 層間密着力 (kg／cm) 1.20 1.40 0.90 1.70 吸水率 (％) 0.37 0.53 1.00 0.43 長期耐熱性 ○ × ○ ×難燃性 ○ ○ × ○ 第１表の結果より、実施例にあっては、密着力は比較例
１及び３のものよりは劣るものの、実用上問題となる程
の差ではなく、ポリイミド樹脂単体の比較例２から著し
く向上していることが判る。又、吸水率も低く、長期耐
熱性、難燃性にも優れて、全体的にバランスの採れた性
能を有し、マルチ材として好適に採用できることが理解
できる。 Table 1 Example Comparative Example 1 2 3 Interlayer adhesion (kg / cm) 1.20 1.40 0.90 1.70 Water absorption (%) 0.37 0.53 1.00 0.43 Long-term heat resistance ○ × ○ × Flame retardance ○ ○ × ○ 1st From the results shown in the table, in Example, although the adhesive strength was inferior to that of Comparative Examples 1 and 3, the difference was not so much as to cause a problem in practical use, and was significantly improved from Comparative Example 2 of the polyimide resin alone. It is understood that there is. Further, it can be understood that the water absorption rate is low, the long-term heat resistance and the flame retardancy are excellent, the performance is well balanced as a whole, and the multi-material can be suitably used.
【００３５】[0035]
【発明の効果】本発明の電気絶縁用積層板は、分子内に
イミド基とアミノ基を各々複数個有する芳香族系化合物
にブロム化エポキシ樹脂を含むエポキシ樹脂をルイス酸
化合物と不飽和イミド化合物の存在下で反応させてエポ
キシ変性ポリイミド樹脂を調製し、このエポキシ変性ポ
リイミド樹脂のワニスを基材を含浸させ、乾燥させてプ
リプレグを形成し、このプリプレグを複数枚積層成形し
て成るものであり、本発明の電子部品封止用材料は、上
記エポキシ変性ポリイミド樹脂を配合させて成るもので
あり、いずれも特定のイミド基の残留率の小さいエポキ
シ変性ポリイミド樹脂を用いることにより、耐熱性に優
れ、密着力が強く、しかも吸水率の低く、難燃性に優
れ、電子部品封止用材料として好適に採用できるもので
ある。The electrical insulating laminate of the present invention comprises an epoxy resin containing a brominated epoxy resin in an aromatic compound having a plurality of imide groups and amino groups in the molecule, a Lewis acid compound and an unsaturated imide compound. Is prepared by reacting in the presence of an epoxy-modified polyimide resin, impregnating a base material with a varnish of the epoxy-modified polyimide resin, and drying to form a prepreg, which is formed by laminating and molding a plurality of prepregs. , The electronic component sealing material of the present invention is made by blending the epoxy-modified polyimide resin, and by using an epoxy-modified polyimide resin having a small residual rate of a specific imide group, both have excellent heat resistance. The adhesiveness is strong, the water absorption is low, the flame retardancy is excellent, and it can be suitably used as a material for encapsulating electronic parts.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｃ０８Ｇ 73/10 ＮＴＦ Ｃ０８Ｊ 5/24 ＣＦＣ 7310−4Ｆ Ｈ０１Ｂ 3/30 Ｄ 9059−5Ｇ 17/60 Ｋ 4232−5Ｇ Ｈ０１Ｌ 23/29 23/31 ─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. 6 Identification code Internal reference number FI Technical indication C08G 73/10 NTF C08J 5/24 CFC 7310-4F H01B 3/30 D 9059-5G 17/60 K 4232-5G H01L 23/29 23/31
Claims (2)
有する芳香族系化合物にブロム化エポキシ樹脂を含むエ
ポキシ樹脂をルイス酸化合物と不飽和イミド化合物の存
在下で反応させて調製したエポキシ変性ポリイミド樹脂
を配合させて成ることを特徴とする電子部品封止用材
料。1. An epoxy prepared by reacting an aromatic compound having a plurality of imide groups and amino groups in the molecule with an epoxy resin containing a brominated epoxy resin in the presence of a Lewis acid compound and an unsaturated imide compound. A material for encapsulating electronic parts, characterized by being mixed with a modified polyimide resin.
樹脂分に対して6〜20重量％であることを特徴とする請
求項１記載の電子部品封止用材料。2. The encapsulating material for electronic parts according to claim 1, wherein the bromine contained in the brominated epoxy resin is 6 to 20% by weight based on the total resin content.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5407692A JPH0712001B2 (en) | 1988-05-26 | 1992-03-13 | Electronic component encapsulation material |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63128661A JPH064708B2 (en) | 1987-07-06 | 1988-05-26 | Laminated board for electrical insulation |
| JP5407692A JPH0712001B2 (en) | 1988-05-26 | 1992-03-13 | Electronic component encapsulation material |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63128661A Division JPH064708B2 (en) | 1987-07-06 | 1988-05-26 | Laminated board for electrical insulation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05114502A JPH05114502A (en) | 1993-05-07 |
| JPH0712001B2 true JPH0712001B2 (en) | 1995-02-08 |
Family
ID=26394817
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5407692A Expired - Lifetime JPH0712001B2 (en) | 1988-05-26 | 1992-03-13 | Electronic component encapsulation material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0712001B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008114967A1 (en) | 2007-03-16 | 2008-09-25 | Lg Electronics Inc. | Method of generating random access preambles in wireless communication system |
-
1992
- 1992-03-13 JP JP5407692A patent/JPH0712001B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05114502A (en) | 1993-05-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3613724B2 (en) | Phosphorus-containing epoxy resin composition | |
| US4287014A (en) | Novel crosslinkable resin composition and method for producing a laminate using said composition | |
| WO2006068063A1 (en) | Modified phenolic resin, epoxy resin composition containing the same, and prepreg containing the composition | |
| US4529790A (en) | Epoxy resin composition | |
| JP3371916B2 (en) | Epoxy resin composition | |
| KR0139001B1 (en) | Epoxy resins and compositions containing aromatic diamine curing agent | |
| JPH0712001B2 (en) | Electronic component encapsulation material | |
| EP0230328A2 (en) | Epoxy resin composition | |
| JPH1160692A (en) | Resin composition for printed wiring board and printed wiring board using the same | |
| JP3899571B2 (en) | Thermosetting resin composition | |
| JPH0588892B2 (en) | ||
| JPH10182794A (en) | Fast-curing epoxy resin composition | |
| CA2207177A1 (en) | Novel ester compound and thermosetting resin composition using the same | |
| US5096987A (en) | Dipropargyl ether or alpha, alpha'-bis(4-hydroxyphenyl)-para-diisopropylbenzene | |
| JPH10237162A (en) | Epoxy resin composition and cured articles | |
| JPH0795481B2 (en) | Electronic component encapsulation material | |
| JPH01113440A (en) | Laminated plate for electrical insulation and sealing material for electrical part | |
| JPH10251380A (en) | Thermoset resin composition | |
| JPH0717729B2 (en) | Substrates for electrical and electronic equipment laminates impregnated with an epoxy resin composition | |
| JP2702228B2 (en) | Heat-resistant flame-retardant epoxy resin composition | |
| US5204415A (en) | Polymers prepared from dipropargyl ether of alpha, alpha'-bis (4-hydroxyphenyl)-para-diisopropylbenzene | |
| JPH0830123B2 (en) | A cloth-like or mat-like substrate for an electric insulating material impregnated with an epoxy resin composition | |
| JPH0562591B2 (en) | ||
| JP2000017146A (en) | Thermosetting resin composition and its cured product | |
| JP2702226B2 (en) | Heat-resistant flame-retardant epoxy resin composition |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 19950725 |