JPH07106195A - Chip-shaped electronic component and its manufacture - Google Patents
Chip-shaped electronic component and its manufactureInfo
- Publication number
- JPH07106195A JPH07106195A JP5268048A JP26804893A JPH07106195A JP H07106195 A JPH07106195 A JP H07106195A JP 5268048 A JP5268048 A JP 5268048A JP 26804893 A JP26804893 A JP 26804893A JP H07106195 A JPH07106195 A JP H07106195A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- cap
- shaped
- component element
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Details Of Resistors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、筒形または柱状の電子
部品素子の表面に、その外周側で両端側に分離された電
極を形成し、この電子部品素子の両端にキャップ状端子
を嵌め込み、これを前記電極に各々接続したチップ状電
子部品に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention has electrodes formed on the surface of a cylindrical or columnar electronic component element, the electrodes being separated on the outer peripheral side of the electronic component element, and with cap-shaped terminals fitted on both ends of the electronic component element. , And a chip-shaped electronic component in which the electrodes are connected to the electrodes.
【０００２】[0002]
【従来の技術】従来におけるこの種のチップ状電子部品
の例として、図５に示すような筒形磁器コンデンサをあ
げることができる。この筒形磁器コンデンサは、円筒状
の誘電体セラミックからなる電子部品素体２の内周面及
び外周面に内周電極３及び外周電極４が各々形成され、
さらに電子部品素体２の両端にキャップ状端子５及び６
が各々嵌め込まれている。内周電極３は、前記電子部品
素体２の内周からその一端部の外周面にわたって形成さ
れている。また、外周電極４は、電子部品素体２の外周
面に形成され、同外周面において内周電極３の電子部品
素体２の外周側に引き出された部分３ａとの間に間隙部
８が設けられている。キャップ状端子５、６は、その内
周に突起７を有すると共に、その全面に半田メッキが施
されている。このキャップ状端子５、６は、電子部品素
体２の両端に嵌合された後、加熱炉に通すことにより、
その内面側に施された半田メッキで内周電極３の電子部
品素体２の外周側に導出された部分３ａと外周電極４と
に各々半田結合される。さらに、電子部品素体２の外周
部のキャップ状端子５、６の間には、防湿及び電気的絶
縁等のため、樹脂膜からなる絶縁保護膜９が形成され
る。2. Description of the Related Art As an example of a conventional chip-shaped electronic component of this type, there is a cylindrical ceramic capacitor as shown in FIG. In this cylindrical porcelain capacitor, an inner peripheral electrode 3 and an outer peripheral electrode 4 are formed on the inner peripheral surface and the outer peripheral surface of an electronic component body 2 made of a cylindrical dielectric ceramic,
Furthermore, cap-shaped terminals 5 and 6 are provided on both ends of the electronic component body 2.
Are fitted respectively. The inner peripheral electrode 3 is formed from the inner periphery of the electronic component body 2 to the outer peripheral surface of one end thereof. The outer peripheral electrode 4 is formed on the outer peripheral surface of the electronic component element body 2, and a gap 8 is formed between the outer peripheral electrode 4 and the portion 3a of the inner peripheral electrode 3 that is drawn to the outer peripheral side of the electronic component element body 2. It is provided. The cap-shaped terminals 5 and 6 have protrusions 7 on their inner circumferences, and the entire surfaces thereof are plated with solder. The cap-shaped terminals 5 and 6 are fitted to both ends of the electronic component element body 2 and then passed through a heating furnace,
Solder plating is applied to the inner surface of the inner peripheral electrode 3 to connect the outer peripheral electrode 4 with the portion 3a of the inner peripheral electrode 3 which is led to the outer peripheral side of the electronic component element body 2. Further, an insulating protective film 9 made of a resin film is formed between the cap-shaped terminals 5 and 6 on the outer peripheral portion of the electronic component element body 2 for moisture proof and electrical insulation.
【０００３】このような従来の筒形磁器コンデンサは、
例えば、プリント基板に搭載し、接着された後、プリン
ト基板を半田フローすることによって、プリント基板上
の回路に半田結合される。さらに、従来におけるこの種
のチップ状電子部品の他の例として、半導体セラミック
からなる電子部品素体の表面に電極を形成し、この電子
部品素体の両端にキャップ状端子を嵌め込んだバリスタ
や、半導体セラミックからなる電子部品素体の表面に再
酸化誘電体層を形成し、この誘電体層の上に電極を形成
し、この電子部品素体の両端にキャップ状端子を嵌め込
んだ還元再酸化形誘電体磁器コンデンサ等をあげること
ができる。Such a conventional cylindrical ceramic capacitor is
For example, after mounting on a printed circuit board and adhering it, the printed circuit board is solder-flowed to be soldered to a circuit on the printed circuit board. Further, as another example of this type of chip-shaped electronic component in the related art, a varistor in which electrodes are formed on the surface of an electronic component element body made of a semiconductor ceramic and cap-shaped terminals are fitted at both ends of the electronic element element body, , A re-oxidizing dielectric layer is formed on the surface of an electronic component body made of semiconductor ceramic, electrodes are formed on the dielectric layer, and cap-shaped terminals are fitted on both ends of the electronic component body. Oxidized dielectric ceramic capacitors and the like can be mentioned.
【０００４】この種のチップ状電子部品は、電子部品素
体２の両端に嵌め込めれるキャップ状端子５、６は、何
れも同じものが使用されており、図５（ａ）に示す状態
から、図５（ｂ）に示すように、電子部品素体２の両端
に同時に嵌め込まれる。その嵌め込まれる深さは、少な
くとも一方のキャップ状端子５、６の底面が電子部品素
子２の端面に突き当たるまでである。この場合、何れか
一方或は双方のキャップ状端子５、６の底面が電子部品
素子２の端面に突き当たるか定かではない。In this type of chip-shaped electronic component, the same cap-shaped terminals 5 and 6 that can be fitted into both ends of the electronic component element body 2 are used, and from the state shown in FIG. As shown in FIG. 5B, the electronic component body 2 is fitted into both ends at the same time. The depth of fitting is such that the bottom surface of at least one of the cap-shaped terminals 5 and 6 abuts on the end surface of the electronic component element 2. In this case, it is not clear whether the bottom surface of either one or both of the cap-shaped terminals 5 and 6 abuts on the end surface of the electronic component element 2.
【０００５】[0005]
【考案が解決しようとしている課題】今日、チップ状電
子部品の小型化が急速に進展しており、使用される電子
部品素体も益々小型化されている。このような状況の中
で、前述のようなキャップ状端子を用いたチップ状電子
部品には、問題が指摘されている。例えば、前述の円筒
磁器コンデンサの場合、キャップ状端子６の底面が電子
部品素体２の端面２ａに突き当たるまで同キャップ状端
子６を電子部品素体２の端部に嵌合される可能性がある
ため、内周電極３と外周電極４の縁を、その端面２ａか
ら離して形成しなければならない。このため、内周電極
３と外周電極４との対向面積を広くとることができず、
充分大きな静電容量を取得できないという課題がある。Recently, the miniaturization of chip-shaped electronic components is rapidly progressing, and the electronic component bodies used are also miniaturized. Under such circumstances, problems have been pointed out for the chip-shaped electronic component using the cap-shaped terminal as described above. For example, in the case of the cylindrical ceramic capacitor described above, the cap-shaped terminal 6 may be fitted to the end of the electronic component element body 2 until the bottom surface of the cap-shaped terminal 6 hits the end surface 2a of the electronic component element body 2. Therefore, the edges of the inner peripheral electrode 3 and the outer peripheral electrode 4 must be formed apart from the end surface 2a. Therefore, the facing area between the inner peripheral electrode 3 and the outer peripheral electrode 4 cannot be widened,
There is a problem that a sufficiently large capacitance cannot be obtained.
【０００６】さらに、他のチップ状電子部品において
も、電子部品素体の両端に嵌め込まれるキャップ状端子
による電極の短絡を防止するため、電子部品素体の外周
側の電極の間隙部分を端面近くに配置することができ
ず、またその幅を或る程度広くしなければならない。こ
のため、採用し得る電極形状が制約を受け、所要の特性
を得にくいという課題がある。本発明は、このような従
来の課題に鑑み、電子部品素体の端部に嵌め込まれるキ
ャップ状端子による電極の短絡等を起こすことなく、自
由な電極形状を採用できるチップ状電子部品とその製造
方法を提供することを目的とする。Further, also in other chip-shaped electronic parts, in order to prevent short circuit of the electrodes due to the cap-shaped terminals fitted at both ends of the electronic part element body, the gap part of the electrode on the outer peripheral side of the electronic part element body is close to the end face. Can not be placed in, and its width must be increased to some extent. Therefore, there is a problem in that the electrode shape that can be adopted is restricted and it is difficult to obtain the required characteristics. In view of such conventional problems, the present invention provides a chip-shaped electronic component that can adopt a free electrode shape without causing a short circuit of the electrode due to a cap-shaped terminal fitted to the end of the electronic component element body, and the manufacturing thereof. The purpose is to provide a method.
【０００７】[0007]
【課題を解決するための手段】すなわち、本発明は、前
記の目的を達成するため、筒状または柱状の電子部品素
子１２と、この電子部品素子１２の外周側で両端側に分
離された電極１３、１４、１８、１９、２１、２２と、
この電子部品素子１２の両端に嵌め込まれ、前記電極１
３、１４、１８、１９、２１、２２に接続されたキャッ
プ状端子１５、１６とを有するチップ状電子部品におい
て、特定の一方のキャップ状端子１６の底面と電子部品
素子１２の端面１２ａとの間に間隙２４が設けられてい
ることを特徴とするチップ状電子部品を提供する。That is, in order to achieve the above-mentioned object, the present invention provides a cylindrical or columnar electronic component element 12 and electrodes separated on both outer peripheral sides of the electronic component element 12. 13, 14, 18, 19, 21, 22 and
The electrodes 1 are fitted into both ends of the electronic component element 12 and
In the chip-shaped electronic component having the cap-shaped terminals 15 and 16 connected to 3, 14, 18, 19, 21, and 22, the bottom surface of one specific cap-shaped terminal 16 and the end surface 12a of the electronic component element 12 are formed. A chip-shaped electronic component having a gap 24 provided therebetween is provided.
【０００８】この場合において、電子部品素子１２の端
面１２ａとの間に間隙２４を有するキャップ状端子１６
が、他方のキャップ状端子１５より電子部品素子１２に
対する圧入抵抗が大きいのがよい。このようなチップ状
電子部品として、より具体的には、筒状の電子部品素子
１２の内外周に互いに対向するよう設けられた内周電極
１３と外周電極１４を有するものがあげらる。そして、
これら内外周電極１３、１４を、その縁が電子部品素子
１２の端面１２ａに達するよう形成し、この端部側の端
面１２ａとキャップ状端子１６の底面との間に間隙２４
を設ける。また、電子部品素子１２の外周側に電極１
８、１９、２１、２２の間隙部２０を有するチップ状電
子部品においては、その間隙部分２０を電子部品素子１
２の一端寄りに配置し、この端面１２ａとキャップ状端
子１６の底面との間に間隙２４を設ける。In this case, the cap-shaped terminal 16 having the gap 24 between the end surface 12a of the electronic component element 12 and the end surface 12a.
However, it is preferable that the press-fitting resistance with respect to the electronic component element 12 is larger than that of the other cap-shaped terminal 15. More specifically, such a chip-shaped electronic component may be one having an inner peripheral electrode 13 and an outer peripheral electrode 14 which are provided on the inner and outer peripheries of a cylindrical electronic component element 12 so as to face each other. And
The inner and outer electrodes 13, 14 are formed so that their edges reach the end face 12a of the electronic component element 12, and a gap 24 is formed between the end face 12a on the end side and the bottom face of the cap-shaped terminal 16.
To provide. Further, the electrode 1 is provided on the outer peripheral side of the electronic component element 12.
In the chip-shaped electronic component having the gap portions 20 of 8, 19, 21, and 22, the gap portion 20 is provided in the electronic component element 1
2 is disposed near one end, and a gap 24 is provided between the end surface 12a and the bottom surface of the cap-shaped terminal 16.
【０００９】さらに、本発明では、筒状または柱状の電
子部品素子１２を作る工程と、この電子部品素子１２の
表面に、その外周側で両端側に分離された電極１３、１
４、１８、１９、２１、２２を形成する工程と、この電
子部品素子１２の両端にキャップ状端子１５、１６を嵌
め込み、これを前記電極１３、１４、１８、１９、２
１、２２に接続する工程とを有するチップ状電子部品の
製造方法において、電子部品素子１２に対する圧入抵抗
が互いに異なるキャップ状端子１５、１６を用い、これ
らキャップ状端子１５、１６を、その一方の底面が電子
部品素子１２の端面１２ａに突き当たるまで同じ圧力で
電子部品素子１２の端部に嵌め込むことを特徴とするチ
ップ状電子部品の製造方法を提供する。Further, according to the present invention, a step of forming a cylindrical or columnar electronic component element 12 and electrodes 13, 1 separated on both sides at the outer peripheral side of the surface of the electronic component element 12.
4, 18, 19, 21, 22 and cap-shaped terminals 15, 16 are fitted to both ends of the electronic component element 12, and the electrodes 13, 14, 18, 19, 2 are inserted into the cap-shaped terminals 15, 16.
In the method for manufacturing a chip-shaped electronic component having a step of connecting the cap-shaped terminals 15 and 16 to each other, the cap-shaped terminals 15 and 16 having different press-fitting resistances to the electronic component element 12 are used. A method for manufacturing a chip-shaped electronic component, characterized in that the chip-shaped electronic component is fitted into the end of the electronic component element 12 with the same pressure until the bottom surface hits the end surface 12a of the electronic component element 12.
【００１０】この場合において、電子部品素子１２に対
する圧入抵抗が互いに異なるキャップ状端子１５、１６
を得るための具体的な手段としては、それらの電子部品
素子１２の端部に対する嵌め合い寸法を互いに異ならせ
ることがあげられる。また他の手段として、キャップ状
端子１５、１６の内周面に突起１７を設け、それらの突
起１７の変形強度を互いに異ならたり、或はそれらの突
起１７の形状を互いに異ならせる等をあげることができ
る。In this case, the cap-shaped terminals 15 and 16 having different press-fitting resistances to the electronic component element 12 are provided.
As a specific means for obtaining the above, it is possible to make the fitting dimensions of the electronic component elements 12 with respect to the end portions different from each other. As another means, the protrusions 17 may be provided on the inner peripheral surfaces of the cap-shaped terminals 15 and 16 so that the deformation strengths of the protrusions 17 are different from each other, or the shapes of the protrusions 17 are different from each other. You can
【００１１】[0011]
【作用】前記本発明によるチップ状電子部品では、特定
の一方のキャップ状端子１６を、その底面が電子部品素
子１２の端面に突き当たるまで嵌合せずに、それら底面
と端面との間に間隙２４を設けているため、一対の電極
１３、１４を電子部品素体１２の端面１２ａにまで引き
出しても、嵌め込まれるキャップ状端子１６によってそ
れら電極１３、１４が短絡されない。これにより、電極
１３、１４の対向面積を大きくすることができる。ま
た、電子部品素体１２の外周側における一対の電極１
８、１９或は２１、２２の間隙部２０を可能な限り電子
部品素体１２の端面１２ａの近くに設けることもでき
る。これにより、任意の電極形状を採用することがで
き、所要の特性を得ることができる。In the chip-shaped electronic component according to the present invention, the particular one cap-shaped terminal 16 is not fitted until the bottom surface thereof abuts on the end face of the electronic component element 12, and the gap 24 is provided between the bottom face and the end face. Therefore, even if the pair of electrodes 13 and 14 are pulled out to the end face 12a of the electronic component body 12, the cap-shaped terminals 16 that are fitted do not short-circuit the electrodes 13 and 14. Thereby, the facing area of the electrodes 13 and 14 can be increased. In addition, the pair of electrodes 1 on the outer peripheral side of the electronic component body 12
The gap 20 of 8, 19 or 21, 22 may be provided as close to the end face 12a of the electronic component body 12 as possible. As a result, any electrode shape can be adopted and desired characteristics can be obtained.
【００１２】さらに、前記本発明によるチップ状電子部
品の製造方法では、前記のような間隙２４が極めて得や
すい。すなわち、電子部品素子１２に対する圧入抵抗が
互いに異なるキャップ状端子１５、１６を用い、これら
キャップ状端子１５、１６を、その一方の底面が電子部
品素子１２の端面に突き当たるまで同じ圧力で電子部品
素子１２の端面に嵌め込むので、電子部品素子１２に対
する圧入抵抗が大きいキャップ状端子１６側に、その底
面と電子部品素体１２の端面との間に自ずと間隙２４が
形成できる。このため、前記チップ状電子部品が容易に
製造できる。Further, in the method of manufacturing a chip-shaped electronic component according to the present invention, it is extremely easy to obtain the gap 24 as described above. That is, the cap-shaped terminals 15 and 16 having different press-fitting resistances to the electronic component element 12 are used, and the cap-shaped terminals 15 and 16 are applied with the same pressure until one bottom surface of the cap-shaped terminals 15 and 16 abuts on the end face of the electronic component element 12. Since it is fitted into the end face of 12, the gap 24 can be naturally formed between the bottom face and the end face of the electronic component element body 12 on the side of the cap-shaped terminal 16 having a large press-fit resistance to the electronic component element 12. Therefore, the chip-shaped electronic component can be easily manufactured.
【００１３】[0013]
【実施例】次に、図面を参照しながら、本発明の実施例
について詳細に説明する。図１は、本発明を筒形磁器コ
ンデンサに適用した実施例であり、その構成を製造方法
と共に説明する。まず、誘電体セラミックを主体とする
セラミックスラリーを、押出成形等の手段で円筒形に成
形し、これを所定の長さに切断し、円筒状の誘電体セラ
ミック成形体を得る。次ぎに、これを脱バインダし、焼
成することにより、誘電体セラミックの焼結体からなる
電子部品素体１２を得る。Embodiments of the present invention will now be described in detail with reference to the drawings. FIG. 1 shows an embodiment in which the present invention is applied to a cylindrical ceramic capacitor, and the configuration thereof will be described together with the manufacturing method. First, a ceramic slurry mainly composed of a dielectric ceramic is formed into a cylindrical shape by a means such as extrusion molding, and this is cut into a predetermined length to obtain a cylindrical dielectric ceramic formed body. Next, this is debindered and fired to obtain an electronic component body 12 made of a sintered body of a dielectric ceramic.
【００１４】次ぎに、この電子部品素体１２の内周面及
び外周面に導電ペーストを塗布し、焼き付けて内周電極
１３及び外周電極１４が各々形成される。内周電極１３
は、前記電子部品素体１２の内周からその一端部の外周
面にわたって形成され、その内周側の縁は電子部品素体
１２の図１において右側の端面１２ａに達している。ま
た、外周電極１４は、電子部品素体１２の外周面に形成
され、内周電極１３の電子部品素体１２の外周側に引き
出された部分１３ａと外周電極１４との間に間隙部２０
が設けられている。外周電極１４の他方の縁は、電子部
品素体１２の図１において右側の端面１２ａに達してい
る。Next, a conductive paste is applied to the inner peripheral surface and the outer peripheral surface of the electronic component body 12 and baked to form the inner peripheral electrode 13 and the outer peripheral electrode 14, respectively. Inner electrode 13
Is formed from the inner periphery of the electronic component element body 12 to the outer peripheral surface of one end thereof, and the edge on the inner periphery side reaches the end surface 12a of the electronic component element body 12 on the right side in FIG. Further, the outer peripheral electrode 14 is formed on the outer peripheral surface of the electronic component body 12, and a gap portion 20 is provided between the outer peripheral electrode 14 and a portion 13 a of the inner peripheral electrode 13 that is pulled out to the outer peripheral side of the electronic component body 12.
Is provided. The other edge of the outer peripheral electrode 14 reaches the right end face 12 a of the electronic component element body 12 in FIG. 1.
【００１５】他方、キャップ状端子１５、１６が用意さ
れる。このキャップ状端子１５、１６は、その内周に突
起１７を有すると共に、その全面に半田メッキが施され
ている。このキャップ状端子１５、１６は、電子部品素
体１２の端部に対する圧入抵抗が互いに異なっており、
図１（ａ）において右側のキャップ状端子１６が左側の
キャップ状端子１５より電子部品素体１２の端部に対す
る圧入抵抗が大きい。そして、これらのキャップ状端子
１５、１６は、図１（ａ）の状態から、電子部品素体１
２の両端に何れも同じ圧力で圧入される。具体的には、
両側のキャップ状端子１５、１６を同時に電子部品素体
１２に圧入する。すると、電子部品素体１２を介して働
く相互の反力により、双方の圧入圧力は等しくなる。そ
して、一方のキャップ状端子１５の底面が電子部品素体
１２の端面に突き当たったときに圧入を停止する。この
結果、圧入抵抗の小さなキャップ状端子１５が電子部品
素体１２の端面に突き当り、他方の圧入抵抗の大きなキ
ャップ状端子１６は、電子部品素体１２の端面１２ａか
ら間隙１４を残して嵌め込まれる。この結果、電子部品
素体１２の端面１２ａに達した内周電極１３と外周電極
１４とが、キャップ状端子１６によって短絡されない。On the other hand, cap-shaped terminals 15 and 16 are prepared. The cap-shaped terminals 15 and 16 have protrusions 17 on their inner circumferences, and their entire surfaces are plated with solder. The cap-shaped terminals 15 and 16 have different press-fitting resistances to the ends of the electronic component element body 12,
In FIG. 1A, the right cap-shaped terminal 16 has a larger press-fit resistance to the end of the electronic component element body 12 than the left cap-shaped terminal 15. The cap-shaped terminals 15 and 16 are attached to the electronic component body 1 from the state of FIG.
Both ends of 2 are pressed with the same pressure. In particular,
The cap-shaped terminals 15 and 16 on both sides are simultaneously pressed into the electronic component element body 12. Then, due to mutual reaction forces acting via the electronic component element body 12, both press-fitting pressures become equal. Then, when the bottom surface of the one cap-shaped terminal 15 hits the end surface of the electronic component element body 12, the press-fitting is stopped. As a result, the cap-shaped terminal 15 having a small press-fitting resistance abuts on the end surface of the electronic component element body 12, and the other cap-shaped terminal 16 having a large press-fitting resistance is fitted from the end surface 12a of the electronic component element body 12 leaving a gap 14. . As a result, the inner peripheral electrode 13 and the outer peripheral electrode 14 reaching the end surface 12a of the electronic component body 12 are not short-circuited by the cap-shaped terminal 16.
【００１６】このようにしてキャップ状端子１５、１６
が電子部品素体１２の両端に嵌合された後、加熱炉に通
すことにより、その内面側に施された半田メッキで内周
電極１３の電子部品素体１２の外周側に導出された部分
１３ａと外周電極１４とに各々半田結合される。さら
に、電子部品素体１２の外周部のキャップ状端子１５、
１６の間に、防湿及び電気的絶縁等のため、樹脂膜から
なる絶縁保護膜２５が形成される。これにより、図１
（ｂ）で示すようなチップ状電子部品が完成する。この
ようにして製造されたチップ状電子部品は、図１（ｂ）
において右側のキャップ状端子１６の底面と電子部品素
体１２の端面１２ａとの間に間隙２４を有する。In this way, the cap-shaped terminals 15 and 16
After being fitted to both ends of the electronic component body 12, the portion of the inner peripheral electrode 13 which is led to the outer peripheral side of the electronic component body 12 by solder plating applied to the inner surface side of the inner peripheral electrode 13 is passed through a heating furnace. 13a and the outer peripheral electrode 14 are soldered to each other. Furthermore, the cap-shaped terminal 15 on the outer peripheral portion of the electronic component body 12,
An insulating protective film 25 made of a resin film is formed between 16 for moisture proof and electrical insulation. As a result,
A chip-shaped electronic component as shown in (b) is completed. The chip-shaped electronic component manufactured in this manner is shown in FIG.
There is a gap 24 between the bottom surface of the cap-shaped terminal 16 on the right side and the end surface 12 a of the electronic component element body 12.
【００１７】図２は、前述のようにして電子部品素体１
２の端部に嵌め込まれるキャップ状端子１５、１６を開
口部側から見たものである。これらキャップ状端子１
５、１６の電子部品素子１２に対する圧入抵抗は、特に
キャップ状端子１５、１６と電子部品素子１２との嵌め
合い寸法に依存する。そのため、電子部品素子１２の両
端の径ｄが等しい場合、図２（ａ）で示すように、突起
１７の先端が接する仮想円の直径ｄ1、ｄ2が、何れも電
子部品素子１２の両端の径ｄより僅かに小さく、且つｄ
1＞ｄ2とすることで、キャップ状端子１６の圧入抵抗を
キャップ状端子１５より圧入抵抗を大きくすることがで
きる。FIG. 2 shows the electronic component body 1 as described above.
2 is a view of the cap-shaped terminals 15 and 16 fitted in the end portion of 2 viewed from the opening side. These cap-shaped terminals 1
The press-fitting resistance of the electronic components element 5 and 16 to the electronic component element 12 depends particularly on the fitting size of the cap-shaped terminals 15 and 16 and the electronic component element 12. Therefore, when the diameters d of both ends of the electronic component element 12 are equal, as shown in FIG. 2A, the diameters d1 and d2 of the virtual circle with which the tips of the protrusions 17 are in contact are the diameters of both ends of the electronic component element 12. slightly smaller than d, and d
By setting 1> d2, the press-fitting resistance of the cap-shaped terminal 16 can be made larger than that of the cap-shaped terminal 15.
【００１８】また、キャップ状端子１５、１６の電子部
品素子１２に対する嵌め合い寸法が同じ場合でも、例え
ば、図２（ｂ）で示すように、突起１７の形状を変え
て、その先端の電子部品素体１２に対する接触面積を異
ならせることにより、キャップ状端子１５、１６の圧入
抵抗を異ならせることができる。同様にして、突起１７
の変形強度を異ならせて、嵌め込み時の突起１７の潰れ
具合いを異ならせるという手段でも、キャップ状端子１
５、１６の圧入抵抗を異ならせることができる。Even if the cap-shaped terminals 15 and 16 have the same fitting dimensions with respect to the electronic component element 12, for example, as shown in FIG. 2B, the shape of the protrusion 17 is changed and the electronic component at the tip thereof is changed. By making the contact area with the element body 12 different, the press-fitting resistance of the cap-shaped terminals 15, 16 can be made different. Similarly, the protrusion 17
Even if the deformation strength of the projections 17 is made different so that the protrusions 17 are crushed at the time of fitting, the cap-shaped terminal 1
The press-fit resistances of 5 and 16 can be different.
【００１９】次ぎに、図３は本発明をバリスタに適用し
た例である。このバリスタは、円筒状の半導体セラミッ
クからなる電子部品素体１２の内外周面に電極１８、１
９が各々形成され、さらに電子部品素体１２の両端にキ
ャップ状端子１５及び１６が各々嵌め込まれている。電
極１８、１９は、何れも前記電子部品素体１２の内周か
らその一端部の外周面にわたって形成されており、電子
部品素体１２の外周側にこれら電極１８、１９の間隙部
２０が形成されている。この間隙部２０は、電子部品素
体１２の一端側に寄って設けられており、この一端側に
嵌め込まれたキャップ状端子１６は、その底面と電子部
品素体１２の端面１２ａとの間に間隙２４を有する。す
なわち、同じ深さのキャップ状端子１５、１６であって
も、一方のキャップ状端子１６が他方のキャップ状端子
１５より浅く嵌合されたため、電極１８の電子部品素体
１２の外周側にある部分の幅をより狭くし、間隙部２０
を電子部品素子１２のより端部寄りに配置できる。Next, FIG. 3 shows an example in which the present invention is applied to a varistor. This varistor has electrodes 18, 1 on the inner and outer peripheral surfaces of an electronic component body 12 made of a cylindrical semiconductor ceramic.
9 are formed, and cap-shaped terminals 15 and 16 are fitted on both ends of the electronic component body 12. Each of the electrodes 18 and 19 is formed from the inner periphery of the electronic component body 12 to the outer peripheral surface of one end thereof, and the gap portion 20 of the electrodes 18 and 19 is formed on the outer peripheral side of the electronic component body 12. Has been done. The gap 20 is provided close to one end side of the electronic component body 12, and the cap-shaped terminal 16 fitted in the one end side is provided between the bottom surface and the end surface 12 a of the electronic component body 12. It has a gap 24. That is, even if the cap-shaped terminals 15 and 16 have the same depth, one of the cap-shaped terminals 16 is fitted shallower than the other of the cap-shaped terminals 15, so that the electrode 18 is on the outer peripheral side of the electronic component body 12. The width of the part is made narrower and the gap 20
Can be arranged closer to the end of the electronic component 12.
【００２０】キャップ状端子１５、１６がその内周に突
起１７を有すると共に、その全面に半田メッキが施され
ていることは、前記実施例と同じである。また、それら
の電子部品素体１２に対する圧入抵抗が互いに異なって
いることも前記実施例と同じである。そして、このキャ
ップ状端子１５、１６は、電子部品素体１２の両端に嵌
合された後、加熱炉に通すことにより、その内面側に施
された半田メッキで電極１８、１９の電子部品素体１２
の外周側に導出された部分に各々半田結合される。さら
に、電子部品素体２の外周部のキャップ状端子１５、１
６の間には、前記実施例と同様にして、樹脂膜からなる
絶縁保護膜２５が形成される。As in the previous embodiment, the cap-shaped terminals 15 and 16 have the protrusions 17 on their inner circumferences and solder plating is applied to the entire surfaces thereof. Further, the press-fitting resistances for the electronic component bodies 12 are different from each other, as in the above-described embodiment. Then, the cap-shaped terminals 15 and 16 are fitted to both ends of the electronic component element body 12 and then passed through a heating furnace, so that the electronic component elements of the electrodes 18 and 19 are solder-plated on the inner surface side thereof. Body 12
Are solder-bonded to the parts led out to the outer peripheral side of. Further, the cap-shaped terminals 15, 1 on the outer peripheral portion of the electronic component body 2
An insulating protective film 25 made of a resin film is formed between 6 and in the same manner as in the above embodiment.
【００２１】次ぎに、図４は本発明を還元再酸化形半導
体磁器コンデンサに適用した例である。このコンデンサ
は、還元された円筒状の半導体セラミックからなる電子
部品素体１２を再酸化し、その表面に薄い誘電体層２３
を形成している。この誘電体層２３の表面に電極２１、
２２が各々形成され、さらに電子部品素体１２の両端に
キャップ状端子１５及び１６が各々嵌め込まれている。
電極２１、２２は、何れも前記電子部品素体１２の内周
面から外周面にわたって形成されており、電子部品素体
１２の外周側にこれら電極２１、２２の間隙部２０が形
成されている。この間隙部２０は、電子部品素体１２の
一端側に寄って設けられており、この一端側に嵌め込ま
れたキャップ状端子１６は、その底面と電子部品素体１
２の端面１２ａとの間に間隙２４を有する。Next, FIG. 4 shows an example in which the present invention is applied to a reduction / reoxidation type semiconductor ceramic capacitor. This capacitor reoxidizes an electronic component body 12 made of a reduced cylindrical semiconductor ceramic, and a thin dielectric layer 23 is formed on the surface thereof.
Is formed. The electrode 21, on the surface of the dielectric layer 23,
22 are formed, and the cap-shaped terminals 15 and 16 are fitted on both ends of the electronic component body 12.
Each of the electrodes 21 and 22 is formed from the inner peripheral surface to the outer peripheral surface of the electronic component body 12, and the gap portion 20 between the electrodes 21 and 22 is formed on the outer peripheral side of the electronic component body 12. . The gap 20 is provided close to one end side of the electronic component base body 12, and the cap-shaped terminal 16 fitted in the one end side has a bottom surface and the electronic component base body 1.
There is a gap 24 between the two end faces 12a.
【００２２】キャップ状端子１５、１６の構成及びその
嵌合方法は、前述の実施例と同じである。さらに、電子
部品素体２の外周部のキャップ状端子１５、１６の間に
は、樹脂膜からなる絶縁保護膜２５が形成されることも
それら実施例と同じである。The structure of the cap-shaped terminals 15 and 16 and the fitting method thereof are the same as those in the above-mentioned embodiment. Further, an insulating protective film 25 made of a resin film is formed between the cap-shaped terminals 15 and 16 on the outer peripheral portion of the electronic component element body 2 as in those examples.
【００２３】[0023]
【発明の効果】以上説明した通り、前記本発明では、電
子部品素体の端部に嵌め込まれるキャップ状端子による
電極の短絡等を起こすことなく、自由な電極形状を採用
できる。この結果、小形のチップ状電子部品であって
も、所要の電気的特性を得ることが可能となる。As described above, in the present invention, a free electrode shape can be adopted without causing a short circuit of the electrode due to the cap-shaped terminal fitted to the end of the electronic component body. As a result, it becomes possible to obtain required electrical characteristics even with a small chip-shaped electronic component.
【図１】本発明の実施例によるチップ状電子部品の半完
成状態と完成状態の縦断側面図である。FIG. 1 is a vertical sectional side view of a chip-shaped electronic component in a semi-finished state and a finished state according to an embodiment of the present invention.
【図２】本発明の実施例によるチップ状電子部品に使用
されるキャップ状端子の正面図である。FIG. 2 is a front view of a cap-shaped terminal used in a chip-shaped electronic component according to an embodiment of the present invention.
【図３】本発明の他の実施例によるチップ状電子部品の
完成状態の縦断側面図である。FIG. 3 is a vertical sectional side view showing a completed state of a chip-shaped electronic component according to another embodiment of the present invention.
【図４】本発明のさらに他の実施例によるチップ状電子
部品の完成状態の縦断側面図である。FIG. 4 is a vertical cross-sectional side view of a completed chip-shaped electronic component according to still another embodiment of the present invention.
【図５】従来例によるチップ状電子部品の半完成状態と
完成状態の縦断側面図である。FIG. 5 is a vertical sectional side view of a semi-finished state and a finished state of a chip-shaped electronic component according to a conventional example.
１２ 電子部品素子 １２ａ 電子部品素子の端面 １３ 電極 １４ 電極 １５ キャップ状端子 １６ キャップ状端子 １８ 電極 １９ 電極 ２０ 電子部品素子の外周側の電極の間隙部 ２１ 電極 ２２ 電極 ２４ 間隙 12 electronic component element 12a end face of electronic component element 13 electrode 14 electrode 15 cap-shaped terminal 16 cap-shaped terminal 18 electrode 19 electrode 20 gap part of electrode on outer peripheral side of electronic component element 21 electrode 22 electrode 24 gap
Claims (8)
この電子部品素子１２の外周側で両端側に分離された電
極１３、１４、１８、１９、２１、２２と、この電子部
品素子１２の両端に嵌め込まれ、前記電極１３、１４、
１８、１９、２１、２２に接続されたキャップ状端子１
５、１６とを有するチップ状電子部品において、特定の
一方のキャップ状端子１６の底面と電子部品素子１２の
端面１２ａとの間に間隙２４が設けられていることを特
徴とするチップ状電子部品。1. A cylindrical or columnar electronic component element 12,
Electrodes 13, 14, 18, 19, 21, 22 separated at both ends on the outer peripheral side of the electronic component element 12 and the electrodes 13, 14, fitted into both ends of the electronic component element 12,
Cap-shaped terminal 1 connected to 18, 19, 21, 22
In the chip-shaped electronic component having the components 5 and 16, a gap 24 is provided between the bottom surface of one specific cap-shaped terminal 16 and the end face 12a of the electronic component element 12. .
２の端面１２ａとの間に間隙２４を有するキャップ状端
子１６が、他方のキャップ状端子１５より電子部品素子
１２に対する圧入抵抗が大きいことを特徴とするチップ
状電子部品。2. The electronic component element 1 according to claim 1,
The chip-shaped electronic component is characterized in that the cap-shaped terminal 16 having the gap 24 between the second end face 12a and the other cap-shaped terminal 15 has a larger press-fit resistance to the electronic component element 12.
極が筒状の電子部品素子１２の内外周で互いに対向する
よう設けられた内周電極１３と外周電極１４であって、
且つこれら内外周電極１３、１４の縁が電子部品素子１
２の端面１２ａに達しており、この端面１２ａとキャッ
プ状端子１６の底面との間に間隙２４を有することを特
徴とするチップ状電子部品。3. The inner peripheral electrode 13 and the outer peripheral electrode 14 according to claim 1 or 2, wherein the electrodes are provided so as to face each other on the inner and outer circumferences of the cylindrical electronic component element 12.
In addition, the edges of the inner and outer electrodes 13, 14 are the electronic component element 1
The chip-shaped electronic component reaching the end surface 12a of the second terminal 2 and having a gap 24 between the end surface 12a and the bottom surface of the cap-shaped terminal 16.
子部品素子１２の外周側における電極１８、１９、２
１、２２の間隙部２０が電子部品素子１２の一端寄りに
配置され、その端部側の端面１２ａとキャップ状端子１
６の底面との間に間隙２４を有することを特徴とするチ
ップ状電子部品。4. The electrodes 18, 19, 2 on the outer peripheral side of the electronic component element 12 according to claim 1 or 2.
The gap portion 20 of 1 and 22 is arranged near one end of the electronic component element 12, and the end surface 12a on the end portion side and the cap-shaped terminal 1 are arranged.
A chip-shaped electronic component having a gap 24 between it and the bottom surface of 6.
る工程と、この電子部品素子１２の表面に、その外周側
で両端側に分離された電極１３、１４、１８、１９、２
１、２２を形成する工程と、この電子部品素子１２の両
端にキャップ状端子１５、１６を嵌め込み、これを前記
電極１３、１４、１８、１９、２１、２２に接続する工
程とを有するチップ状電子部品の製造方法において、電
子部品素子１２に対する圧入抵抗が互いに異なるキャッ
プ状端子１５、１６を用い、これらキャップ状端子１
５、１６を、その一方の底面が電子部品素子１２の端面
１２ａに突き当たるまで同じ圧力で電子部品素子１２の
端部に嵌め込むことを特徴とするチップ状電子部品の製
造方法。5. A step of producing a cylindrical or columnar electronic component element 12, and electrodes 13, 14, 18, 19, 2 separated on both sides on the outer peripheral side of the surface of the electronic component element 12.
A chip shape having a step of forming Nos. 1 and 22 and a step of fitting cap-shaped terminals 15 and 16 to both ends of the electronic component element 12 and connecting the terminals to the electrodes 13, 14, 18, 19, 21, and 22. In the method of manufacturing an electronic component, cap-shaped terminals 15 and 16 having different press-fitting resistances to the electronic component element 12 are used.
A method for manufacturing a chip-shaped electronic component, characterized in that 5, and 16 are fitted into the end portion of the electronic component element 12 with the same pressure until one bottom surface of the electronic component element 12 abuts against the end surface 12a of the electronic component element 12.
１５、１６は、それらの電子部品素子１２の端部に対す
る嵌め合い寸法が互いに異なることを特徴とする電子部
品の製造方法。6. The method of manufacturing an electronic component according to claim 5, wherein the cap-shaped terminals 15 and 16 have different fitting dimensions with respect to the ends of the electronic component element 12.
プ状端子１５、１６は、それらの内周面に突起１７を有
し、且つ各キャップ状端子１５、１６の突起１７は、そ
れらの変形強度が互いに異なることを特徴とする電子部
品の製造方法。7. The cap-shaped terminals 15 and 16 according to claim 5 or 6, wherein the cap-shaped terminals 15 and 16 have projections 17 on their inner peripheral surfaces, and the projections 17 of the cap-shaped terminals 15 and 16 have deformation strengths thereof. And a method for manufacturing an electronic component, wherein:
ャップ状端子１５、１６は、それらの内周面に突起１７
を有し、且つ各キャップ状端子１５、１６の突起１７
は、それらの形状が互いに異なることを特徴とする電子
部品の製造方法。8. The cap-shaped terminals 15 and 16 according to any one of claims 5 to 7, wherein the cap-shaped terminals 15 and 16 have protrusions 17 on their inner peripheral surfaces.
And a projection 17 of each cap-shaped terminal 15, 16.
Is a method for manufacturing an electronic component, wherein the shapes are different from each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5268048A JPH07106195A (en) | 1993-09-30 | 1993-09-30 | Chip-shaped electronic component and its manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5268048A JPH07106195A (en) | 1993-09-30 | 1993-09-30 | Chip-shaped electronic component and its manufacture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07106195A true JPH07106195A (en) | 1995-04-21 |
Family
ID=17453163
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5268048A Pending JPH07106195A (en) | 1993-09-30 | 1993-09-30 | Chip-shaped electronic component and its manufacture |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07106195A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012227409A (en) * | 2011-04-21 | 2012-11-15 | Toko Inc | Electronic component |
-
1993
- 1993-09-30 JP JP5268048A patent/JPH07106195A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012227409A (en) * | 2011-04-21 | 2012-11-15 | Toko Inc | Electronic component |
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