JPH07105368B2 - Adhesive sheet for semiconductor wafer dicing - Google Patents
Adhesive sheet for semiconductor wafer dicingInfo
- Publication number
- JPH07105368B2 JPH07105368B2 JP22782092A JP22782092A JPH07105368B2 JP H07105368 B2 JPH07105368 B2 JP H07105368B2 JP 22782092 A JP22782092 A JP 22782092A JP 22782092 A JP22782092 A JP 22782092A JP H07105368 B2 JPH07105368 B2 JP H07105368B2
- Authority
- JP
- Japan
- Prior art keywords
- pressure
- sensitive adhesive
- semiconductor wafer
- adhesive sheet
- wafer dicing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dicing (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明はシリコンやガリウムヒ素
などの半導体ウエハをダイシングによりチップ化する時
に使用する半導体ウエハダイシング用粘着シートに関す
るものであって、特に、半導体ウエハをダイシングによ
りチップ化させた後、紫外線照射後のエキスパンドの拡
張率が１０％以上を示し、チップの整列性が優れ、後工
程のピックアップやマウンティングが容易にできる半導
体ウエハダイシング用粘着シートに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pressure-sensitive adhesive sheet for semiconductor wafer dicing, which is used when dicing a semiconductor wafer such as silicon or gallium arsenide into chips. In particular, the semiconductor wafer is diced into chips. Further, the present invention relates to a pressure-sensitive adhesive sheet for semiconductor wafer dicing, which exhibits an expansion rate of 10% or more after irradiation with ultraviolet rays, has excellent chip alignment, and can be easily picked up and mounted in a subsequent step.
【０００２】[0002]
【従来の技術】シリコンやガリウムヒ素などの半導体ウ
エハをウエハチップに分離するために、半導体ウエハを
あらかじめ粘着シートに貼着固定し、その後にダイシン
グ、洗浄、乾燥、エキスパンド、マウンティングがなさ
れるが、これらの工程中においてウエハチップが粘着シ
ートから脱離飛散することが生じている。また、ウエハ
チップの脱離飛散を抑えるために接着力を強くすること
は容易にできるが、粘着シートから剥がれ難く、近年、
集積度が高くなりウエハチップの面積が大きくなるにつ
れて、ますますピックアップが困難になってきている。2. Description of the Related Art In order to separate a semiconductor wafer such as silicon or gallium arsenide into wafer chips, the semiconductor wafer is previously attached and fixed to an adhesive sheet, and then dicing, washing, drying, expanding and mounting are performed. During these steps, the wafer chips may be detached and scattered from the adhesive sheet. In addition, it is easy to increase the adhesive strength in order to suppress detachment and scattering of the wafer chips, but it is difficult to peel off from the adhesive sheet.
As the degree of integration increases and the area of wafer chips increases, it becomes more difficult to pick up.
【０００３】これらの点を解決するために紫外線を透過
させ得る表面基材とその表面基材の片面に塗布された、
紫外線照射により架橋硬化し、接着力が低減する性能を
有する粘着剤層を形成した半導体ウエハ固定用紫外線硬
化型粘着シートを使用することにより、ダイシング、洗
浄、乾燥工程中は強接着力を保ち、その後、支持体側か
ら紫外線を照射し紫外線硬化型粘着剤層を架橋硬化させ
て接着力を低減させ、ウエハチップのピックアップを容
易にできるようにした技術が用いられている。In order to solve these problems, a surface base material capable of transmitting ultraviolet rays and one surface of the surface base material are coated,
Cross-linking and curing by UV irradiation, by using a semiconductor wafer fixing UV-curing pressure-sensitive adhesive sheet formed with a pressure-sensitive adhesive layer having the ability to reduce the adhesive force, while maintaining a strong adhesive force during the dicing, washing, drying process, After that, a technique is used in which ultraviolet rays are irradiated from the support side to crosslink and cure the ultraviolet-curable pressure-sensitive adhesive layer to reduce the adhesive force and facilitate the pick-up of wafer chips.
【０００４】ところが、紫外線を照射させることによっ
て粘着剤層を架橋硬化させると、接着力は容易に低減さ
せることができるが、硬化させることによって粘着剤層
が固く、脆くなってしまう現象が起きてくる。これで
も、ダイシング、洗浄、乾燥および紫外線照射までの工
程では問題ないが、次工程のエキスパンド時に拡張率が
１０％を越すと基材フィルムは充分に伸びるが、紫外線
によって架橋硬化させた粘着剤層は不規則なヒビワレが
発生するようになり、これによって細かくダイシングさ
れたチップの整列性が悪くなって、次工程のピックアッ
プの時に誤動作を生じてうまくピックアップができなく
なってしまう。However, when the pressure-sensitive adhesive layer is crosslinked and cured by irradiating it with ultraviolet rays, the adhesive force can be easily reduced, but the curing causes the phenomenon that the pressure-sensitive adhesive layer becomes hard and brittle. come. Even with this, there is no problem in the steps up to dicing, washing, drying and UV irradiation, but when the expansion rate exceeds 10% during the expanding step of the next step, the base film is sufficiently stretched, but the adhesive layer crosslinked and cured by UV rays is used. Causes irregular cracks, which deteriorates the alignment of the finely diced chips, which causes a malfunction at the time of picking up in the next step and prevents successful picking up.
【０００５】そこで、粘着剤層に柔軟性を残しエキスパ
ンダーで１０％以上伸ばしてもヒビワレが発生しない粘
着剤層にするためには、どうしても架橋硬化をある程度
不充分にせざるを得ない。そのために紫外線照射後の接
着力が充分に低減せず、ピックアップ工程でチップサイ
ズが少し大きくなってしまうと、接着力が強いためうま
くピックアップができない。このようなことから、紫外
線を照射して充分に架橋硬化し、接着力を大幅に低減さ
せ、且つ、エキスパンド時に１０％以上拡張させても粘
着剤層にヒビワレが発生せず、ウエハチップの脱離が起
こらないダイシング用粘着シートの開発が必要となって
きたのである。Therefore, in order to obtain a pressure-sensitive adhesive layer which remains flexible in the pressure-sensitive adhesive layer and is not cracked even when it is expanded by an expander by 10% or more, it is inevitable that crosslinking and curing are insufficient to some extent. Therefore, the adhesive force after irradiation with ultraviolet rays is not sufficiently reduced, and if the chip size becomes a little larger in the pickup process, the adhesive force is too strong to pick up successfully. For this reason, ultraviolet rays are radiated to sufficiently crosslink and cure, the adhesive strength is significantly reduced, and even if the adhesive layer is expanded by 10% or more during expansion, the adhesive layer is not cracked and the wafer chip is removed. It is necessary to develop an adhesive sheet for dicing that does not separate.
【０００６】[0006]
【発明が解決しようとする課題】本発明は、前記従来技
術の問題点に着目して、粘着シートに紫外線を照射して
充分に架橋硬化させることによって接着力を大幅に低減
することができ、なお且つ、エキスパンダーで拡張率１
０％を越えても粘着剤層にヒビワレが発生せず、また、
ウエハチップの脱離が起こらず、次工程のピックアップ
が容易にできる半導体ウエハダイシング用粘着シートを
提供することを目的としている。SUMMARY OF THE INVENTION The present invention focuses on the problems of the above-mentioned prior art, and can significantly reduce the adhesive strength by irradiating the pressure-sensitive adhesive sheet with ultraviolet rays to sufficiently crosslink and cure the adhesive sheet, Moreover, the expander has an expansion rate of 1
Even if it exceeds 0%, the adhesive layer does not crack, and
It is an object of the present invention to provide a pressure-sensitive adhesive sheet for semiconductor wafer dicing, in which detachment of a wafer chip does not occur and which can be easily picked up in the next step.
【０００７】[0007]
【課題を解決するための手段】本発明者は半導体チップ
の製造において、ダイシングに必要な強度を有し、ま
た、エキスパンドにおいて前述のような欠点のないダイ
シング用粘着シートの開発に鋭意検討した結果、以下に
記述するような表面基材と粘着剤層の組み合せが適する
ことを見いだし本発明を完成させた。Means for Solving the Problems As a result of intensive studies made by the present inventors on the development of a pressure-sensitive adhesive sheet for dicing, which has the strength required for dicing in the production of semiconductor chips and does not have the above-mentioned drawbacks in expanding. The inventors have found that a combination of a surface base material and an adhesive layer as described below is suitable and completed the present invention.
【０００８】本発明の表面基材としてはエキスパンド性
に優れ、且つ、電気抵抗値の低い内部可塑化ポリ塩化ビ
ニルフィルムが用いられる。ここでいう内部可塑化ポリ
塩化ビニルフィルムとは、ポリ塩化ビニルにジブチルフ
タレート（ＤＢＰ）やジオクチルフタレート（ＤＯＰ）
などの可塑剤を配合することなく、塩化ビニルと他のモ
ノマーを共重合することによって可塑性を付与したポリ
塩化ビニルから得られたフィルムであって、しかも電気
抵抗値が低いフィルムを意味し、たとえば、塩化ビニル
と共重合し得るモノマーを共重合させて得られる共重合
体、特に、塩化ビニル−酢酸ビニル、塩化ビニル−高級
アルキルビニルエーテル、塩化ビニル−エチレン酢酸ビ
ニル、塩化ビニル−アクリレート、塩化ビニル−エチレ
ン、塩化ビニル−プロピレン等の共重合体をフィルム化
したものが挙げられる。この内部可塑化ポリ塩化ビニル
フィルムには、電気抵抗値を低い値に保持することがで
きるかぎり、自体公知の他の配合剤を配合させることが
できる。As the surface base material of the present invention, an internally plasticized polyvinyl chloride film having excellent expandability and low electric resistance value is used. The term “internal plasticized polyvinyl chloride film” as used herein means polyvinyl chloride with dibutyl phthalate (DBP) or dioctyl phthalate (DOP).
A film obtained from polyvinyl chloride to which plasticity has been imparted by copolymerizing vinyl chloride and another monomer without adding a plasticizer, such as a film having a low electric resistance value. , A copolymer obtained by copolymerizing a monomer copolymerizable with vinyl chloride, particularly vinyl chloride-vinyl acetate, vinyl chloride-higher alkyl vinyl ether, vinyl chloride-ethylene vinyl acetate, vinyl chloride-acrylate, vinyl chloride- Examples thereof include films of copolymers of ethylene, vinyl chloride-propylene and the like. The internally plasticized polyvinyl chloride film may be blended with other compounding agents known per se as long as the electrical resistance value can be maintained at a low value.
【０００９】本発明における表面基材は、前記内部可塑
化ポリ塩化ビニルフィルムからなるものであるが、該フ
ィルムに限定されず、該フィルム層と他の電気抵抗値が
低い化合物との層からなるもの等、本発明が目的とする
紫外線透過性や電気特性を損なわないかぎり、他の層が
形成されていてもよい。The surface substrate in the present invention is composed of the above-mentioned internally plasticized polyvinyl chloride film, but is not limited to the film, and is composed of the film layer and a layer of another compound having a low electric resistance value. Other layers such as those may be formed as long as they do not impair the ultraviolet ray transmittance and electric characteristics intended by the present invention.
【００１０】この内部可塑化ポリ塩化ビニルフィルムの
厚みとしては３０ないし２００ミクロン、好ましくは６
０ないし１２０ミクロンが良い。３０ミクロン以下では
ダイシング時に回転刃がフィルム層を突切ってしまう。
また、２００ミクロンを越えるとエキスパンド時に充分
伸びないでピックアップが困難になる。The thickness of the internally plasticized polyvinyl chloride film is 30 to 200 microns, preferably 6
0 to 120 microns is good. If it is less than 30 microns, the rotary blade will cut through the film layer during dicing.
On the other hand, if it exceeds 200 microns, it will not be sufficiently expanded at the time of expanding and picking up will be difficult.
【００１１】次に、紫外線硬化型粘着剤層にはアクリル
系粘着剤に紫外線重合型プレポリマーおよび／または紫
外線重合型モノマーを１ないし１５０％配合し、更に、
架橋剤、光開始剤を加えた紫外線硬化型粘着剤が用いら
れ、また、これに必要により粘着付与剤や可塑剤が配合
される。Next, in the UV-curable pressure-sensitive adhesive layer, an acrylic pressure-sensitive adhesive is blended with 1 to 150% of a UV-polymerizable prepolymer and / or a UV-polymerizable monomer.
An ultraviolet-curable pressure-sensitive adhesive containing a crosslinking agent and a photoinitiator is used, and a tackifier and a plasticizer are added to the ultraviolet-curable pressure-sensitive adhesive as necessary.
【００１２】ここで、アクリル系粘着剤としてはエステ
ル基中の炭素数が２ないし８個のアクリル酸エステル重
合物および酢酸ビニル、塩化ビニリデン、メタクリル酸
エステル等のビニル系モノマーとの共重合物を主成分と
したものを挙げることができる。Here, as the acrylic adhesive, an acrylic ester polymer having 2 to 8 carbon atoms in the ester group and a copolymer with a vinyl monomer such as vinyl acetate, vinylidene chloride or methacrylic acid ester are used. The main component can be mentioned.
【００１３】また、紫外線重合型プレポリマーおよび／
または紫外線重合型モノマーとしては１０，０００ない
し５０，０００の分子量（ＧＰＣ測定でスチレン換算に
よる）を有するポリウレタンポリアクリレートであり、
且つ、ポリウレタンポリアクリレートの重合性アクリル
当量（ポリウレタンポリアクリレート分子量／該ポリウ
レタンアクリレート１分子に存在するアクリル基数）が
２８０ないし３５０のものが用いられる。ここでポリウ
レタンポリアクリレートの分子量が１０，０００以下の
場合は、紫外線照射して次の工程のエキスパンド時に拡
張率が１０％を越すと、粘着剤層に不規則なヒビワレが
発生し、逆に、５０，０００以上になるとポリウレタン
ポリアクリレートの合成時や保存時に増粘したり、はな
はだしい場合にはゲル化してしまい、粘着剤塗料を調成
する時に高粘度になり、粘着剤塗工時に均一で安定な粘
着剤層が得られないといった問題が起こる。また、ポリ
ウレタンポリアクリレートの重合性アクリル当量が２８
０以下になると紫外線硬化後の粘着剤層の架橋密度が高
すぎるため、エキスパンド時に充分な硬化皮膜の伸度が
得られず、逆に、３５０以上になると架橋密度が小さく
なり粘着性の低下が充分に進まないためピックアップが
困難になるといった問題が生じてくる。Further, a UV-polymerizable prepolymer and / or
Alternatively, the UV-polymerizable monomer is a polyurethane polyacrylate having a molecular weight of 10,000 to 50,000 (in terms of styrene by GPC measurement),
Further, a polyurethane polyacrylate having a polymerizable acrylic equivalent (molecular weight of polyurethane polyacrylate / number of acrylic groups present in one molecule of the polyurethane acrylate) of 280 to 350 is used. Here, when the molecular weight of the polyurethane polyacrylate is 10,000 or less, if the expansion rate exceeds 10% during the expansion of the next step by irradiation with ultraviolet rays, irregular cracks will occur in the adhesive layer, and conversely, If it exceeds 50,000, it will thicken during the synthesis and storage of the polyurethane polyacrylate, or will gel when it is unfavorable, and it will become highly viscous when preparing the pressure sensitive adhesive paint, and it will be uniform and stable during the pressure sensitive adhesive coating. There is a problem that a proper adhesive layer cannot be obtained. Also, the polymerizable acrylic equivalent of polyurethane polyacrylate is 28
When it is 0 or less, the crosslink density of the pressure-sensitive adhesive layer after ultraviolet curing is too high, so that sufficient elongation of the cured film cannot be obtained at the time of expanding, and conversely, when it is 350 or more, the crosslink density becomes small and the adhesiveness decreases. There is a problem that it is difficult to pick up because it does not proceed sufficiently.
【００１４】次に、紫外線硬化型粘着剤には紫外線硬化
反応を向上させるために架橋剤、光開始剤を配合するこ
とが効果的である。架橋剤としては、ポリイソシアネー
ト、リン酸金属塩等を挙げることができる。光開始剤と
しては、ベンゾイン、ベンゾインエチルエーテル、ベン
ゾインイソプロピルエーテル、ジフェニルスルファイ
ド、アントラセン、ベンゾフェノン、α−クロロアント
ラキノン、ジフェニルジスルファイド、ジアセチル、ヘ
キサクロルブタジエン、ペンタクロルブタジエン、オク
タクロロブテン、１−クロルメチルナフタリン等を挙げ
ることができ、これらの１種または２種以上のものが
０．１ないし５％配合され通常は３％以下で充分に効果
が発揮される。Next, it is effective to add a cross-linking agent and a photoinitiator to the UV-curable adhesive in order to improve the UV-curing reaction. Examples of the cross-linking agent include polyisocyanate and phosphoric acid metal salt. As the photoinitiator, benzoin, benzoin ethyl ether, benzoin isopropyl ether, diphenylsulfide, anthracene, benzophenone, α-chloroanthraquinone, diphenyldisulfide, diacetyl, hexachlorobutadiene, pentachlorobutadiene, octachlorobutene, 1- Chloromethylnaphthalene and the like can be mentioned. One or more of these are blended in an amount of 0.1 to 5%, and usually 3% or less is sufficient to exert the effect.
【００１５】また、必要により配合される粘着付与剤と
しては、エチレン−酢酸ビニル共重合体に塩化ビニルモ
ノマーをグラフト重合させた樹脂、または、可塑剤と相
溶性を有するものであれば公知のどのようなものでもよ
いが、具体的には、ロジンのグリセリンエステル、ロジ
ンのペンタエリスリットエステル等のロジン及び変性ロ
ジンの誘導体、テルペンフェノール等のテルペン変性
体、アルキルフェノールおよび変性フェノール等のフェ
ノール樹脂等の１種または２種以上のものが用いられ
る。その配合量としてはエチレン−酢酸ビニル共重合体
に塩化ビニルモノマーをグラフト重合させた樹脂１００
重量部に対して１ないし１００重量部、好ましくは５な
いし３０重量部が良い。粘着付与剤が１００重量部以上
になると粘着剤層に紫外線を照射させても接着力が適切
に低減しなくなる。Any known tackifier may be used as long as it is compatible with a resin prepared by graft-polymerizing a vinyl chloride monomer onto an ethylene-vinyl acetate copolymer, or a plasticizer. Specific examples include rosin glycerin ester, rosin pentaerythrite ester and other rosin and modified rosin derivatives, terpene modified products such as terpene phenols, and phenolic resins such as alkylphenols and modified phenols. One type or two or more types are used. As the blending amount, a resin 100 obtained by graft-polymerizing an ethylene-vinyl acetate copolymer with a vinyl chloride monomer is used.
The amount is preferably 1 to 100 parts by weight, more preferably 5 to 30 parts by weight. If the tackifier is 100 parts by weight or more, the adhesive force will not be appropriately reduced even if the pressure-sensitive adhesive layer is irradiated with ultraviolet rays.
【００１６】更に、必要により配合される可塑剤として
は、一般にポリ塩化ビニル用可塑剤として用いられてい
るものが使用できるが、具体的にはフタル酸２−エチル
ヘキシル、フタル酸ブチル等のフタル酸エステル系、ア
ジピン酸２−エチルヘキシル、アジピン酸ブチル等の脂
肪族二塩基酸エステル系、リン酸トリブチル、リン酸ト
リフェニル、リン酸トリクレジル等の無機酸エステル
系、ポリエステル系、エポキシ系、その他塩素化パラフ
ィン等の１種または２種以上のものが用いられる。その
配合量としては、エチレン−酢酸ビニル共重合体に塩化
ビニルモノマーをグラフト重合させた樹脂１００重量部
に対して１ないし５０重量部、好ましくは５ないし２０
重量部が良い。可塑剤を５０重量部以上にすると紫外線
重合性化合物との相溶性があるため、粘着剤層に紫外線
を照射させても粘着層が硬化せず接着力が低減し難くな
り、また、シリコンウエハに転移して表面を汚染させる
ことになる。Further, as a plasticizer to be blended if necessary, those generally used as a plasticizer for polyvinyl chloride can be used, and specifically, phthalic acid such as 2-ethylhexyl phthalate and butyl phthalate. Ester type, 2-diethylhexyl adipate, butyl adipate and other aliphatic dibasic acid ester type, tributyl phosphate, triphenyl phosphate, inorganic acid ester type such as tricresyl phosphate, polyester type, epoxy type and other chlorinated One or more kinds of paraffin and the like are used. The blending amount thereof is 1 to 50 parts by weight, preferably 5 to 20 parts by weight with respect to 100 parts by weight of a resin obtained by graft-polymerizing a vinyl chloride monomer on an ethylene-vinyl acetate copolymer.
Good parts by weight. When the amount of the plasticizer is 50 parts by weight or more, it is compatible with the UV-polymerizable compound, so that even if the pressure-sensitive adhesive layer is irradiated with ultraviolet rays, the pressure-sensitive adhesive layer does not cure and the adhesive strength is difficult to reduce. It will transfer and contaminate the surface.
【００１７】上記、紫外線硬化型粘着剤層の組成物はト
ルエン、酢酸エチル、テトラヒドロフラン、メチルエチ
ルケトン等の溶剤を用いて粘着剤として調整し、通常の
方法により前述の内部可塑化ポリ塩化ビニルフィルムの
表面に厚さ３ないし５０ミクロンに塗布し粘着剤層を設
け、半導体ウエハダイシング用粘着シートを得ることが
できる。塗布する際に希釈剤や乾燥時の熱のためにフィ
ルムか軟化したり膨潤して作業性が困難な時には、粘着
剤を剥離シートの上に塗布して乾燥させ、その後に内部
可塑化ポリ塩化ビニルフィルムを貼合してもよい。ま
た、必要に応じてこの粘着シートの粘着剤層は剥離シー
トと組合わせて保護される。The composition of the UV-curable pressure-sensitive adhesive layer is prepared as a pressure-sensitive adhesive using a solvent such as toluene, ethyl acetate, tetrahydrofuran or methyl ethyl ketone, and the surface of the aforementioned internal plasticized polyvinyl chloride film is prepared by a conventional method. Then, a pressure-sensitive adhesive layer is provided by applying the pressure-sensitive adhesive layer to a thickness of 3 to 50 μm to obtain a pressure-sensitive adhesive sheet for semiconductor wafer dicing. When it is difficult to work because the film softens or swells due to the diluent or heat during drying, it is necessary to apply the adhesive on the release sheet and dry it. You may stick a vinyl film. If necessary, the pressure-sensitive adhesive layer of this pressure-sensitive adhesive sheet is protected in combination with a release sheet.
【００１８】このようにして得られた半導体ウエハダイ
シング用粘着シートを用いて半導体チップを製造するに
は、まず、半導体ウエハダイシング用粘着シートの粘着
層上に半導体ウエハを粘着固定する。この場合、本発明
の紫外線硬化型粘着剤は接着力が５０ないし１０００ｇ
／２５ｍｍで半導体ウエハを固定することができる。In order to manufacture a semiconductor chip using the adhesive sheet for semiconductor wafer dicing thus obtained, first, the semiconductor wafer is adhesively fixed on the adhesive layer of the adhesive sheet for semiconductor wafer dicing. In this case, the ultraviolet curable adhesive of the present invention has an adhesive force of 50 to 1000 g.
The semiconductor wafer can be fixed at / 25 mm.
【００１９】次に、ダイシングソーを使って半導体ウエ
ハの表面に形成されている素子を囲むように縦横に格子
状に完全カットする。続いて、半導体ウエハダイシング
用粘着シートの表面基材側から紫外線源を用い紫外線を
照射して紫外線硬化型粘着剤を架橋反応させ、更に、エ
キスパンドさせた後、真空チャックまたはコレット方式
で半導体ウエハダイシング用粘着シートから剥離分離し
半導体チップを得ることができる。Next, a dicing saw is used to completely cut the elements formed on the surface of the semiconductor wafer in a grid pattern vertically and horizontally. Next, the surface of the adhesive sheet for semiconductor wafer dicing is irradiated with ultraviolet rays from the side of the substrate using an ultraviolet source to cross-link the ultraviolet-curable adhesive, and after expanding, semiconductor wafer dicing is performed using a vacuum chuck or collet method. The semiconductor chip can be obtained by peeling and separating from the pressure-sensitive adhesive sheet.
【００２０】本発明に使用する紫外線は２００ないし４
００ｎｍの波長範囲で紫外線源としては水銀アーク、低
圧・中圧・高圧水銀ランプ、炭酸アーク等を用いること
ができ、また、紫外線照射時間は０．１ないし１０秒間
で充分である。本発明の紫外線硬化型粘着剤は紫外線照
射により接着力は５ないし１００ｇ／２５ｍｍに低減
し、真空チャックまたはコレット方式で半導体ウエハダ
イシングシートから容易に剥離することができる。The ultraviolet rays used in the present invention are 200 to 4
In the wavelength range of 00 nm, a mercury arc, a low-pressure / medium-pressure / high-pressure mercury lamp, a carbonic acid arc or the like can be used as an ultraviolet ray source, and an ultraviolet ray irradiation time of 0.1 to 10 seconds is sufficient. The UV-curable pressure-sensitive adhesive of the present invention has an adhesive force reduced to 5 to 100 g / 25 mm by UV irradiation, and can be easily peeled from a semiconductor wafer dicing sheet by a vacuum chuck or a collet method.
【００２１】[0021]
【発明の効果】本発明による半導体ウエハダイシング用
粘着シートを半導体ウエハをチップ化する時に使用した
場合、ダイシング時、洗浄および乾燥工程でチップの脱
離飛散や位置ずれを生ずることなくチップを粘着シート
に固定することができる。また、紫外線を照射させるこ
とによって粘着剤層が架橋硬化し固くなるにもかかわら
ず、柔軟性を有するためにエキスパンド工程で延伸性に
優れ、拡張率が１０％以上になっても粘着剤層にヒビワ
レやフィルム基材から粘着剤の脱離が起こらず、チップ
間の間隙を均一に広げることができ良好な整列性を得る
ことができる。更に、接着力が低減しているためピック
アップも容易にできるものである。When the pressure-sensitive adhesive sheet for semiconductor wafer dicing according to the present invention is used for chipping a semiconductor wafer, the chips are pressure-sensitive adhesive sheet without desorption and scattering of chips during the dicing, washing and drying steps. Can be fixed to. Also, even though the pressure-sensitive adhesive layer is cross-linked and hardened by being irradiated with ultraviolet rays, it has excellent flexibility in the expanding step due to its flexibility, and the pressure-sensitive adhesive layer can be formed even when the expansion ratio is 10% or more. Adhesives are not detached from cracks and film bases, and the gaps between chips can be uniformly widened, and good alignment can be obtained. Further, since the adhesive force is reduced, the pickup can be easily performed.
【００２２】[0022]
【実施例１】 アクリル系粘着剤（２エチルヘキシルアクリレートと ｎブチルアクリレートとの共重合体。綜研化学製） １００重量部 ポリウレタンポリアクリレート［重合性アクリル当量が ３００で紫外線重合型プレポリマーが３０，０００ の分子量（ＧＰＣ測定でスチレン換算による）を有 する。荒川化学工業製］ ５０重量部 架橋剤（ポリイソシアネート化合物。日本ポリウレタン 製） ３重量部 光開始剤（ベンゾフェノン） ２重量部 トルエンと酢酸エチル（１：１）混合溶剤 ３０重量部 上記、配合により紫外線硬化型粘着剤を調製し、これを
シリコーン樹脂がコートされている厚さ５０ミクロンの
ポリエステルフィルム上に、乾燥後の厚みが１０ミクロ
ンになるようにアプリケーターを用いて塗布し、１００
℃で２分間乾燥した。乾燥後に内部可塑化ポリ塩化ビニ
ルフィルム（厚さ１００ミクロン）の表面に前記の粘着
剤がくるように貼合し、本発明の半導体ウエハダイシン
グ用粘着シートを作成した。Example 1 Acrylic pressure-sensitive adhesive (copolymer of 2 ethylhexyl acrylate and n-butyl acrylate, manufactured by Soken Kagaku Co., Ltd.) 100 parts by weight Polyurethane polyacrylate [polymerizable acrylic equivalent is 300 and UV-curable prepolymer is 30,000] Has a molecular weight of (in terms of styrene by GPC measurement). Arakawa Chemical Industries] 50 parts by weight Crosslinking agent (polyisocyanate compound; made by Nippon Polyurethane Co., Ltd.) 3 parts by weight Photoinitiator (benzophenone) 2 parts by weight Mixed solvent of toluene and ethyl acetate (1: 1) 30 parts by weight A curable pressure-sensitive adhesive was prepared, and this was applied onto a 50-micron-thick polyester film coated with a silicone resin with an applicator so that the thickness after drying would be 10 microns, and then 100
It was dried at 0 ° C for 2 minutes. After drying, the above-mentioned pressure-sensitive adhesive was attached to the surface of an internally plasticized polyvinyl chloride film (thickness 100 μm) so that the pressure-sensitive adhesive sheet for semiconductor wafer dicing of the present invention was prepared.
【００２３】[0023]
【試験項目】このようにして得られた半導体ウエハダイ
シング用粘着シートを用いてダイシングテストを行い、
接着力、エキスパンド適性を試験し、結果を試験結果表
に示した。[Test item] A dicing test is performed using the thus obtained adhesive sheet for semiconductor wafer dicing,
The adhesive strength and expandability were tested, and the results are shown in the test result table.
【００２４】[0024]
【比較例１】 アクリル系粘着剤（２エチルヘキシルアクリレートと ｎブチルアクリレートとの共重合体。綜研化学製） １００重量部 ポリウレタンポリアクリレート［重合性アクリル当量が ２２０で紫外線重合型プレポリマーが７，０００の 分子量（ＧＰＣ換算でスチレン換算による）を有す る。荒川化学工業製］ ５０重量部 架橋剤（ポリイソシアネート化合物。日本ポリウレタン 製） ３重量部 光開始剤（ベンゾフェノン） ２重量部 トルエンと酢酸エチル（１：１）混合溶剤 ３０重量部 上記、配合により紫外線硬化型粘着剤を調製し、これを
実施例１と同じ条件により、塗布、乾燥、貼合し半導体
ウエハダイシング用粘着シートを作成し、実施例１と同
様の試験を行い、その結果を試験結果表に示した。Comparative Example 1 Acrylic pressure-sensitive adhesive (copolymer of 2 ethylhexyl acrylate and n-butyl acrylate; manufactured by Soken Chemical Co., Ltd.) 100 parts by weight Polyurethane polyacrylate [polymerizable acrylic equivalent is 220 and UV-curable prepolymer is 7,000 It has a molecular weight of (in terms of GPC and in terms of styrene). Arakawa Chemical Industries] 50 parts by weight Crosslinking agent (polyisocyanate compound; made by Nippon Polyurethane Co., Ltd.) 3 parts by weight Photoinitiator (benzophenone) 2 parts by weight Mixed solvent of toluene and ethyl acetate (1: 1) 30 parts by weight A curable pressure-sensitive adhesive was prepared, which was applied, dried, and laminated under the same conditions as in Example 1 to prepare a pressure-sensitive adhesive sheet for semiconductor wafer dicing, and the same test as in Example 1 was conducted. Shown in the table.
【００２５】[0025]
【試験結果】 註 ＊１ステンレス板（ＳＵＳ−＃３０４ １２００メ
ッシュ仕上げ）に貼着させて２０℃で２４時間後の接着
力を測定する。 ＊２ステンレス板（ＳＵＳ−＃３０４ １２００メッシ
ュ仕上げ）に貼着させて２０℃で２４時間後に粘着シー
ト側から紫外線を１０秒間照射（照度１００ｍｗ／ｃｍ
２ ）させた後、接着力を測定する。 ＊３それぞれの粘着シート上に５インチのシリコンウエ
ハを貼着し、フラットフレームに貼着し４０ミクロンの
ダイヤモンドブレードで５ｍｍ角にフルカットしてダイ
シングし、その後、粘着シート面から＊２の条件で紫外
線を照射し、更に、エキスパンダーで１０％拡張させ、
粘着面の状態およびチップの整列性を観察する。【Test results】 Note * 1 Adhere to a stainless steel plate (SUS- # 304 1200 mesh finish) and measure the adhesive strength after 24 hours at 20 ° C. * 2 Affixed to a stainless steel plate (SUS- # 304 1200 mesh finish) and after 24 hours at 20 ° C, the adhesive sheet side was irradiated with ultraviolet rays for 10 seconds (illuminance 100 mw / cm.
After 2 ), the adhesive force is measured. * 3 A 5-inch silicon wafer is attached to each adhesive sheet, attached to a flat frame, fully cut into a 5 mm square with a 40 micron diamond blade, and then diced. And irradiate it with ultraviolet rays, and then expand it by 10% with an expander,
Observe the state of the adhesive surface and the alignment of the chips.
Claims (4)
おいて紫外線透過用の表面基材が、エキスパンド性に優
れ、且つ、電気抵抗値の低い内部可塑化ポリ塩化ビニル
フィルムからなり、その一面に紫外線の照射によって接
着力が低減する紫外線硬化型の粘着剤層を形成したこと
を特徴とする半導体ウエハダイシング用粘着シート。1. A pressure-sensitive adhesive sheet for semiconductor wafer dicing, wherein a surface substrate for transmitting ultraviolet rays comprises an internally plasticized polyvinyl chloride film having excellent expandability and low electric resistance, and one surface thereof is irradiated with ultraviolet rays. A pressure-sensitive adhesive sheet for semiconductor wafer dicing, comprising a UV-curable pressure-sensitive adhesive layer having reduced adhesive strength.
着剤と紫外線重合型プレポリマーおよび／または紫外線
重合型モノマーと架橋剤、光開始剤を含むことを特徴と
する請求項１記載の半導体ウエハダイシング用粘着シー
ト。2. The pressure-sensitive adhesive layer according to claim 1, wherein the pressure-sensitive adhesive layer contains an acrylic pressure-sensitive adhesive, a UV-polymerizable prepolymer and / or a UV-polymerizable monomer, a cross-linking agent, and a photoinitiator. Adhesive sheet for semiconductor wafer dicing.
プレポリマーおよび／または紫外線重合型モノマーが１
０，０００ないし５０，０００（ＧＰＣ測定でスチレン
換算による）の分子量を有するポリウレタンポリアクリ
レートであることを特徴とする請求項１記載の半導体ウ
エハダイシング用粘着シート。3. The ultraviolet-polymerizable prepolymer and / or the ultraviolet-polymerizable monomer of the pressure-sensitive adhesive layer according to claim 2,
The pressure-sensitive adhesive sheet for semiconductor wafer dicing according to claim 1, which is a polyurethane polyacrylate having a molecular weight of 50,000 to 50,000 (in terms of styrene measured by GPC).
レートの重合性アクリル当量（ポリウレタンポリアクリ
レート分子量／該ポリウレタンアクリレート１分子中に
存在するアクリル基数）が２８０ないし３５０であるこ
とを特徴とする請求項１記載の半導体ウエハダイシング
用粘着シート。4. The polymerizable acrylic equivalent (polyurethane polyacrylate molecular weight / the number of acrylic groups present in one molecule of the polyurethane acrylate) of the polyurethane polyacrylate according to claim 3, is 280 to 350. An adhesive sheet for semiconductor wafer dicing as described above.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22782092A JPH07105368B2 (en) | 1992-08-05 | 1992-08-05 | Adhesive sheet for semiconductor wafer dicing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22782092A JPH07105368B2 (en) | 1992-08-05 | 1992-08-05 | Adhesive sheet for semiconductor wafer dicing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0661346A JPH0661346A (en) | 1994-03-04 |
| JPH07105368B2 true JPH07105368B2 (en) | 1995-11-13 |
Family
ID=16866893
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22782092A Expired - Lifetime JPH07105368B2 (en) | 1992-08-05 | 1992-08-05 | Adhesive sheet for semiconductor wafer dicing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07105368B2 (en) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3318576B2 (en) * | 1995-09-20 | 2002-08-26 | 新東工業株式会社 | How to measure sand properties |
| JPH1161065A (en) * | 1997-08-25 | 1999-03-05 | Sumitomo Bakelite Co Ltd | Pressure-sensitive adhesive sheet for semiconductor wafer |
| JP4230080B2 (en) * | 2000-02-18 | 2009-02-25 | リンテック株式会社 | Wafer sticking adhesive sheet |
| JP2001240842A (en) * | 2000-02-28 | 2001-09-04 | Nitto Denko Corp | Uv-curing type adhesive composition and its adhesive sheets |
| JP4608759B2 (en) * | 2000-10-19 | 2011-01-12 | 住友ベークライト株式会社 | Adhesive sheet for semiconductor wafer processing |
| KR100384901B1 (en) * | 2001-04-12 | 2003-05-23 | 엘지전선 주식회사 | Melt-flow controlling method for elastomer by UV irradiation |
| KR100405951B1 (en) * | 2001-04-12 | 2003-11-14 | 엘지전선 주식회사 | Low poisson ratio elastomer by UV irradiation |
| AU2002349577A1 (en) * | 2002-10-18 | 2004-05-04 | Lg Cable Ltd. | Melt-flow controlling method for elastomer by uv irradiation |
| JP4493643B2 (en) * | 2006-12-06 | 2010-06-30 | 日東電工株式会社 | Re-peelable pressure-sensitive adhesive composition, and pressure-sensitive adhesive tape or sheet |
| JP2011077235A (en) * | 2009-09-30 | 2011-04-14 | Nitto Denko Corp | Pressure-sensitive adhesive sheet for retaining element, and method of manufacturing element |
| JP5089710B2 (en) * | 2010-01-05 | 2012-12-05 | 日東電工株式会社 | Adhesive tape or sheet |
| US9422462B2 (en) | 2011-06-27 | 2016-08-23 | Denka Company Limited | Adhesive sheet |
| JP5978051B2 (en) * | 2011-10-17 | 2016-08-24 | 日東電工株式会社 | Adhesive tape film and adhesive tape |
| JP5909078B2 (en) * | 2011-11-09 | 2016-04-26 | 日本化薬株式会社 | UV curable resin composition, cured product and article |
| MY168337A (en) * | 2011-12-02 | 2018-10-31 | Denka Company Ltd | Pressure-sensitive adhesive sheet and method of manufacturing electronic component using the same |
-
1992
- 1992-08-05 JP JP22782092A patent/JPH07105368B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0661346A (en) | 1994-03-04 |
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