JPH0699124A - Device for washing square substrate - Google Patents
Device for washing square substrateInfo
- Publication number
- JPH0699124A JPH0699124A JP4209690A JP20969092A JPH0699124A JP H0699124 A JPH0699124 A JP H0699124A JP 4209690 A JP4209690 A JP 4209690A JP 20969092 A JP20969092 A JP 20969092A JP H0699124 A JPH0699124 A JP H0699124A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- cleaning
- nozzle
- coating
- corner
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Coating Apparatus (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明はＬＣＤ、フォトマスクの
製造等に用いられる回転塗布の後処理用洗浄装置に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cleaning device for post-treatment of spin coating used for manufacturing LCDs, photomasks and the like.
【０００２】[0002]
【従来の技術】ガラス基板や半導体ウェハ等の板状基板
の表面にレジスト等の被膜を形成するには、従来から塗
布装置によって板状基板の表面にレジスト液等を塗布
し、これをホットプレート等で加熱するようにしてい
る。回転塗布装置によってレジスト液等を塗布すると、
例えば図１０に示すような角形板状基板Ｗの場合は遠心
力によってとくにコーナー部分a1乃至a4に塗布液が偏
り、塗布シーケンス及び塗布液種類によって違いはある
が、この部分だけ膜厚均一部分の約２〜３倍の厚膜にな
ってしまう（コーナー部分以外の端部、即ち辺部分b1乃
至b4の厚みは膜厚均一部分の２倍以下の膜厚であってそ
れ程問題はない）。2. Description of the Related Art In order to form a coating film such as a resist on the surface of a plate-shaped substrate such as a glass substrate or a semiconductor wafer, conventionally, a resist solution or the like is applied to the surface of the plate-shaped substrate by a coating device, and this is applied to a hot plate. I try to heat it. When applying a resist solution etc. with a spin coating device,
For example, in the case of a rectangular plate-like substrate W as shown in FIG. 10, the coating liquid is biased toward the corners a 1 to a 4 due to centrifugal force, and although there are differences depending on the coating sequence and the type of coating liquid, only this portion has a uniform film thickness. The thickness is about 2 to 3 times as large as that of a part (the thickness of the end portions other than the corner portions, that is, the side portions b 1 to b 4 is less than twice the thickness of the uniform thickness portion. Absent).
【０００３】例えば絶縁膜形成（塗布）の場合には基板
コーナー部辺りに下地金属膜との配線を行うために、塗
布時又は塗布膜焼成前に予め基板コーナー部の厚膜部分
を剥離除去する工程が必要であった。またFringe-Free
法（回転カップ法）においても、レジスト塗布時にコー
ナー部が厚膜になるとパターニング（露光−現像）の際
に、厚膜部分が現像残りを起こす可能性がある。従って
絶縁膜形成の場合と同じく、塗布時又は塗布膜焼成前に
予め基板コーナー部の厚膜部分を剥離除去する工程が必
要であった。For example, in the case of forming (coating) an insulating film, in order to perform wiring with the underlying metal film around the corner of the substrate, the thick film portion of the corner of the substrate is peeled and removed at the time of coating or before firing of the coating film. A process was needed. See also Fringe-Free
Also in the method (rotary cup method), if the corner portion becomes a thick film at the time of resist coating, the thick film portion may cause a development residue during patterning (exposure-development). Therefore, as in the case of forming the insulating film, a step of peeling and removing the thick film portion at the corner portion of the substrate is required at the time of coating or before firing the coating film.
【０００４】[0004]
【発明が解決しようとする課題】上述の塗膜厚膜部分の
剥離は物理的に行われるため、基板表面が傷ついたり変
形することがあった。Since the above-mentioned thick film portion of the coating film is physically peeled off, the surface of the substrate may be damaged or deformed.
【０００５】[0005]
【課題を解決するための手段】上記課題を解決すべく本
発明に係る角形基板の洗浄装置は、基板の裏面を吸着し
てこれを回転せしめるスピンチャック上に塗布工程後の
角形基板を固定し、この角形基板のコーナー部に偏向し
て厚膜となっている塗布液を、回転する角型基板のコー
ナー部が通過する軌跡の上方に設けたノズルから、洗浄
液を吐出することによって洗い流す手段をとるものであ
る。In order to solve the above problems, a cleaning apparatus for a rectangular substrate according to the present invention fixes a rectangular substrate after a coating process on a spin chuck that attracts the back surface of the substrate and rotates it. A means for rinsing the coating liquid, which is deflected to the corner portion of the rectangular substrate and becomes a thick film, by discharging the cleaning liquid from a nozzle provided above the trajectory through which the corner portion of the rotating rectangular substrate passes. To take.
【０００６】[0006]
【作用】スピンチャック上に固定した角形板状基板を回
転させながら上面のコーナー部分のみを洗浄ノズルで洗
浄し、塗膜の厚膜部分を除去する。Function: While rotating the rectangular plate-shaped substrate fixed on the spin chuck, only the corner portion of the upper surface is washed with the washing nozzle to remove the thick film portion of the coating film.
【０００７】[0007]
【実施例】以下に本発明の実施例を添付図面に基づいて
説明する。ここで、図１は本発明に係るコーナー部洗浄
装置を組み込んだ被膜形成装置の概略平面図、図２は同
コーナー部洗浄装置の部分断面図、図３は同コーナー部
洗浄装置の概略平面図である。また図４は本発明に係る
コーナー部洗浄装置による好ましい洗浄液噴射方向を示
す概略平面図(a)及び概略側面図(b)であり、図５乃至図
９はコーナー部洗浄を行った角形板状基板Ｗの塗布膜厚
測定結果である。Embodiments of the present invention will be described below with reference to the accompanying drawings. Here, FIG. 1 is a schematic plan view of a film forming apparatus incorporating the corner cleaning apparatus according to the present invention, FIG. 2 is a partial sectional view of the corner cleaning apparatus, and FIG. 3 is a schematic plan view of the corner cleaning apparatus. Is. Further, FIG. 4 is a schematic plan view (a) and a schematic side view (b) showing a preferable cleaning liquid jetting direction by the corner cleaning apparatus according to the present invention, and FIGS. 5 to 9 are rectangular plate-like shapes after the corner cleaning. It is a coating film thickness measurement result of the substrate W.
【０００８】被膜形成装置は図１の左側を上流部とし、
この上流部にガラス基板等の角形板状基板Ｗの投入部１
を設け、この投入部１の下流側に塗布装置２を配置し、
塗布装置２の下流側に順次、減圧乾燥装置３、本発明に
係るコーナー部洗浄装置４及びホットプレート５ａ・・・
とクーリングプレート５ｂを備えた加熱部５を配置し、
投入部１から加熱部５に至るまでは搬送装置６によって
角形板状基板Ｗの前後端の下面を支持した状態で搬送
し、加熱部５においては垂直面内でクランク動をなす搬
送装置７によりガラス基板等の角形板状基板Ｗの下面を
支持した状態で各ホットプレート５ａ上を順次移し換
え、最終的にクーリングプレート５ｂで温度を調整しつ
つ角形板状基板Ｗを取り出し部８まで搬送するようにし
ている。The film forming apparatus has an upstream portion on the left side of FIG.
Into this upstream portion, a loading portion 1 for a rectangular plate-shaped substrate W such as a glass substrate
Is provided, and the coating device 2 is arranged on the downstream side of the charging unit 1,
In the downstream side of the coating device 2, a reduced pressure drying device 3, a corner cleaning device 4 according to the present invention, and a hot plate 5a ...
And a heating unit 5 equipped with a cooling plate 5b,
From the feeding section 1 to the heating section 5, the rectangular plate-shaped substrate W is conveyed while being supported by the lower surfaces of the front and rear ends of the rectangular plate-shaped substrate W, and in the heating section 5, it is conveyed by a conveying apparatus 7 that makes a crank motion in a vertical plane. The hot plate 5a is sequentially transferred in a state of supporting the lower surface of the rectangular plate-shaped substrate W such as a glass substrate, and finally the rectangular plate-shaped substrate W is conveyed to the take-out section 8 while adjusting the temperature by the cooling plate 5b. I am trying.
【０００９】また、塗布装置２の前面側には交換可能な
塗布液供給装置９を配置し、この塗布液供給装置９から
供給される塗布液を移動可能なノズル１０を用いて角形
板状基板Ｗ表面に滴下するようにしている。A replaceable coating liquid supply device 9 is arranged on the front side of the coating device 2, and a rectangular plate-shaped substrate is formed by using a nozzle 10 capable of moving the coating liquid supplied from the coating liquid supply device 9. It is designed to be dropped on the W surface.
【００１０】そして、塗布装置２で塗布液が塗布された
角形板状基板Ｗは減圧乾燥器３において、ある程度（生
乾き）乾燥せしめられてコーナー部洗浄装置４に送られ
る。この時角形板状基板Ｗのコーナー部a1乃至a4には図
１０に示すように塗布液が厚膜状になっている。Then, the rectangular plate-shaped substrate W coated with the coating liquid by the coating device 2 is dried (dry) to a certain extent in the vacuum dryer 3 and sent to the corner cleaning device 4. At this time, the coating liquid is in the form of a thick film on the corner portions a 1 to a 4 of the rectangular plate-shaped substrate W as shown in FIG.
【００１１】コーナー部洗浄装置４は図１乃至図３に示
すように、カップ１１内にマウント１２を設け、このマ
ウント１２を貫通して正逆回転可能なスピンチャック１
３を設けてある。このスピンチャック１３の中心には真
空ポンプにつながる吸引孔が形成され、このスピンチャ
ック１３上に中心を合せて角形板状基板Ｗが吸着、固定
されている。コーナー部洗浄に使用するノズル１４（ノ
ズル内径１mm以下が好ましく、洗浄液は連続的に噴射さ
れる）は台座１５、支柱１６及び上下に首振り可能なア
ーム１７によって保持されており、このアーム１７に接
するノズル１４の柄１４aは図３に仮想線及び矢印で示
すように前後にスライド可能であり、また矢印で示すよ
うに左右にローリングさせることも可能である。従って
基板Ｗに対するノズル１４の位置を回転軌跡上方に置
き、噴出方向を自在に調節して洗浄液導入管１８からの
洗浄液をコーナー部に噴出することができる。As shown in FIGS. 1 to 3, the corner cleaning device 4 is provided with a mount 12 in a cup 11, and a spin chuck 1 which penetrates the mount 12 and is rotatable in the forward and reverse directions.
3 is provided. A suction hole connected to a vacuum pump is formed at the center of the spin chuck 13, and the rectangular plate-shaped substrate W is attracted and fixed on the spin chuck 13 with its center aligned. The nozzle 14 used for cleaning the corner portion (nozzle inner diameter is preferably 1 mm or less, and the cleaning liquid is continuously sprayed) is held by a pedestal 15, a support 16 and an arm 17 which can be vertically swung. The handle 14a of the contacting nozzle 14 can be slid back and forth as shown by imaginary lines and arrows in FIG. 3, and can also be rolled left and right as shown by arrows. Therefore, the position of the nozzle 14 with respect to the substrate W can be placed above the rotation locus, and the ejection direction can be freely adjusted to eject the cleaning liquid from the cleaning liquid introducing pipe 18 to the corner portion.
【００１２】本発明の装置を用いて角形板状基板Ｗのコ
ーナー部を洗浄するには、先ずスピンチャック１３に載
置された角形板状基板Ｗの外接円Ｃ軌道（図４参照）付
近の上方向から洗浄ノズル１４を臨ませる。ノズル１４
の位置、噴出角度、噴出圧、流量等は塗布液、洗浄液、
基板Ｗの用途、塗布被膜除去巾等を考慮して調整する必
要があるが、とくに洗浄液噴出時に基板Ｗ端部（側面）
に当たって塗布液を含む飛沫（スプラッシュ）となり、
基板Ｗ表面へ再付着することがないように基板Ｗの回転
数、洗浄液の流量を設定することが大事である。またノ
ズル１４先端部と基板Ｗ表面との間隔は、基板Ｗの歪み
或いは撓み等を考慮する必要があるが、極力狭く（即ち
ノズル１４が基板Ｗに接しない範囲でなるべく近接する
ように）して塗布液を含む洗浄液の飛散を抑制すること
が好ましい。In order to clean the corners of the rectangular plate-shaped substrate W by using the apparatus of the present invention, first, the rectangular plate-shaped substrate W placed on the spin chuck 13 is in the vicinity of the circumscribed circle C orbit (see FIG. 4). The cleaning nozzle 14 is exposed from above. Nozzle 14
Position, ejection angle, ejection pressure, flow rate, etc.
It is necessary to make adjustments in consideration of the application of the substrate W, the coating film removal width, etc., but especially when the cleaning liquid is jetted, the edge of the substrate W (side surface)
When it hits, it becomes a splash containing the coating liquid (splash),
It is important to set the number of rotations of the substrate W and the flow rate of the cleaning liquid so as not to re-adhere to the surface of the substrate W. The distance between the tip of the nozzle 14 and the surface of the substrate W must be taken into consideration in terms of distortion or bending of the substrate W, but it should be as narrow as possible (that is, the nozzle 14 should be as close to the substrate W as possible). It is preferable to suppress the scattering of the cleaning liquid containing the coating liquid.
【００１３】上記洗浄液は塗膜の種類に合せて、水、有
機溶剤、無機溶剤を自由に選択することができる。また
洗浄液の噴出方向については図４に示す方向が好まし
い。即ち同図(a)に示すように、反時計回りに回転する
角形板状基板Ｗを上方向から見た場合、基板Ｗの外接円
Ｃ（２点鎖線で表した）のコーナー部aにおける接線lt
と、基板Ｗの中心とコーナー部aを結ぶ線分lcとに囲ま
れたR1の範囲（０〜９０度）から、矢印で例を示したよ
うに、コーナー部aに洗浄液が噴出されるようにノズル
１４の先端を向けることが好ましい。このようにノズル
１４を向けると噴出される洗浄液は基板Ｗの回転方向に
逆らうことなく、また基板Ｗの内方向に向かうことがな
いため、コーナー部の厚膜部分の塗布被膜のみを除去す
ることができる。また同図(b)に示すように、角形板状
基板Ｗを側面から見た場合、基板Ｗ面とそのコーナー部
a上の垂線lpとに囲まれたR2の範囲（０〜９０度。更に
好ましくは基板Ｗ面から３０〜４５℃）から、矢印で例
を示したように、コーナー部aに洗浄液が噴出されるよ
うにノズル１４の先端を向けることが好ましい。このよ
うにノズル１４を向けると噴出される洗浄液は基板Ｗの
内方向に向かうことがないため、コーナー部の厚膜部分
の塗布被膜のみを除去することができる。Water, an organic solvent or an inorganic solvent can be freely selected as the above-mentioned cleaning liquid according to the type of coating film. Further, the jetting direction of the cleaning liquid is preferably the direction shown in FIG. That is, as shown in FIG. 7A, when the rectangular plate-shaped substrate W rotating counterclockwise is viewed from above, the tangent line at the corner portion a of the circumscribed circle C (represented by a two-dot chain line) of the substrate W l t
Then, from the range of R 1 (0 to 90 degrees) surrounded by the line segment l c connecting the center of the substrate W and the corner portion a, as shown by the arrow, the cleaning liquid is jetted to the corner portion a. It is preferable to orient the tip of the nozzle 14 so that. In this way, when the nozzle 14 is directed, the cleaning liquid ejected does not go against the rotation direction of the substrate W and does not go inward of the substrate W. Therefore, only the coating film on the thick film portion of the corner portion should be removed. You can Further, as shown in FIG. 3B, when the rectangular plate-shaped substrate W is viewed from the side, the substrate W surface and its corner portion
From the range of R 2 (0 to 90 degrees, more preferably 30 to 45 ° C. from the substrate W surface) surrounded by the vertical line l p on the a, as shown by the arrow, the cleaning liquid is applied to the corner a. It is preferable to direct the tip of the nozzle 14 so that it is ejected. In this way, when the nozzle 14 is directed, the sprayed cleaning liquid does not flow inward of the substrate W, and therefore only the coating film on the thick film portion of the corner portion can be removed.
【００１４】上記基板のＷ周端面及び周端の裏面には塗
布液の一部が廻り込むため、コーナー部洗浄装置４には
裏面洗浄用ノズル１９を設けて裏面洗浄装置を兼ねるこ
とが望ましい。洗浄液噴射によって発生した塗布液を含
む飛沫は傾斜板２０に当たり、ここを伝って、コーナー
部洗浄及び裏面洗浄に使用された洗浄液とともにカップ
１１の底部に溜まり、ここから図示しない排出孔を通っ
て外部へ排出される。また同時に発生した塗布液を含む
ミストはエッジ２１によってカップ１１の外への飛散が
妨げられ、図示しない吸引装置によって外部へ排出され
る。Since a part of the coating liquid wraps around the W peripheral end surface and the rear surface of the peripheral edge of the substrate, it is desirable to provide a rear surface cleaning nozzle 19 in the corner cleaning device 4 to serve also as the rear surface cleaning device. Splashes containing the coating liquid generated by spraying the cleaning liquid hit the inclined plate 20, travel along the slope plate 20, and accumulate at the bottom of the cup 11 together with the cleaning liquid used for the corner cleaning and the back surface cleaning. Is discharged to. The mist containing the coating liquid generated at the same time is prevented from scattering outside the cup 11 by the edge 21, and is discharged to the outside by a suction device (not shown).
【００１５】本発明の装置に係る実施例を図５乃至図９
の実験結果に基づいて更に詳述する。ここにおいて図５
及び図６はともに約200×200mmの角形板状金属被覆基板
Ｗにポリイミド製液晶用配向膜を塗布した後、コーナー
部を洗浄したときの塗膜厚を、触針式表面形状測定器に
よって測定したものである。使用した洗浄液はＮ-メチ
ルピロリドン（ＮＭＰ）とエチレングリコールモノブチ
ルエーテルの１：１混合液であり、スピンチャック１３
の回転数は500rpm、洗浄時間20.0秒、洗浄液使用量は40
ml/分であった。同図において縦軸は基板Ｗの垂直方向
の距離を表し、横軸はコーナー部周辺の基板Ｗ水平方向
の距離を表す。また基板表面はS0、塗膜表面はS1で示し
てあり、膜厚は図５では約1.5×103Å、図６では約1.2
×103Åであることが分かる。またS2は、洗浄によって
除去されたコーナー部の厚膜面S3（仮想線で示す）を洗
浄液で洗い流したときに残留する、境界部分の塗膜***
を表す。塗膜***S2は無いことが理想であるが、多少残
っていても下地金属膜との配線を行うには差し支えな
い。却ってこれを無くそうとしてコーナー部の洗浄巾を
増やし過ぎると、基板Ｗの均一塗膜面の端部も洗い流す
ことになり好ましくない。Embodiments of the apparatus of the present invention are shown in FIGS.
It will be described in more detail based on the experimental results. Here in FIG.
6 and 6 are both about 200 × 200 mm rectangular plate-shaped metal-coated substrate W, the polyimide alignment film for liquid crystal is applied, and the coating thickness when the corners are washed is measured by a stylus type surface profiler. It was done. The cleaning solution used was a 1: 1 mixture of N-methylpyrrolidone (NMP) and ethylene glycol monobutyl ether.
Rotation speed is 500 rpm, cleaning time is 20.0 seconds, cleaning liquid usage is 40
It was ml / min. In the figure, the vertical axis represents the vertical distance of the substrate W, and the horizontal axis represents the horizontal distance of the substrate W around the corner portion. The substrate surface is shown as S 0 and the coating film surface is shown as S 1 , and the film thickness is about 1.5 × 10 3 Å in FIG. 5 and about 1.2 in FIG.
It can be seen that it is × 10 3 Å. Further, S 2 represents a coating film bulge at the boundary portion which remains when the thick film surface S 3 (shown by an imaginary line) at the corner portion removed by cleaning is washed away with the cleaning liquid. It is ideal that the coating film swell S 2 is not present, but even if a small amount remains, it does not interfere with wiring to the underlying metal film. On the contrary, if the cleaning width of the corner portion is excessively increased in order to eliminate this, the end portion of the uniform coating surface of the substrate W is also washed off, which is not preferable.
【００１６】また図７乃至図９は、いずれも約400×400
mmの角形板状基板Ｗにキノンアジド化合物とフェノール
ノボラック型樹脂とからなるポジ型フォトレジスト（東
京応化工業（株）製 OFPR800-5cp）を5×103Å程度塗
布し、コーナー部を洗浄したときの塗膜厚を上記の測定
器で測定したものである。また溶剤としてはメチルイソ
ブチルケトン（ＭＩＢＫ）を用い、1.2Torrで減圧乾燥
後コーナー部洗浄を行った。更に図７においてはスピン
チャック１３の回転数900rpm、洗浄時間10秒、洗浄液使
用量は60ml/分、ノズル径φ1mm、図８及び図９において
は同回転数1000rpm、洗浄時間5秒、洗浄液使用量は60ml
/分、但しノズル径は図８のものはφ1mm、図９のものは
φ2mmであった。7 to 9 are all about 400 × 400.
When a positive photoresist (OFPR800-5cp manufactured by Tokyo Ohka Kogyo Co., Ltd.) consisting of a quinone azide compound and a phenol novolac type resin is applied to a square plate substrate W having a size of 5 mm by about 5 × 10 3 Å and the corner is washed. The thickness of the coating film was measured by the above measuring device. Methyl isobutyl ketone (MIBK) was used as a solvent, and the corner portion was washed after drying under reduced pressure at 1.2 Torr. Further, in FIG. 7, the rotation speed of the spin chuck 13 is 900 rpm, the cleaning time is 10 seconds, the cleaning liquid usage amount is 60 ml / min, the nozzle diameter is φ1 mm, and in FIGS. 8 and 9, the same rotation speed 1000 rpm, cleaning time 5 seconds, cleaning liquid usage amount. Is 60 ml
However, the nozzle diameter was φ1 mm in FIG. 8 and φ2 mm in FIG.
【００１７】図７において、塗膜***S2と塗膜表面S1と
の差をT1、塗膜表面S1と基板表面はS0との差をT2とした
とき、T1/T2の比が2.0以下であると現像残りが発生する
ことがないため好ましい。図８においては、T1/T2の比
が1.0程度に減っているため図７乃至図９のなかでは最
もよい洗浄結果である。また図９と図８の違いはノズル
１４の孔径だけである。図９はT1/T2の比が2.0以上とな
っている場合の例である。[0017] In FIG. 7, T 1 the difference between the coating film ridge S 2 and the coating film surface S 1, when the coating surface S 1 and the surface of the substrate which was T 2 the difference between S 0, T 1 / T It is preferable that the ratio of 2 is 2.0 or less because no development residue occurs. In FIG. 8, the ratio of T 1 / T 2 is reduced to about 1.0, which is the best cleaning result in FIGS. 7 to 9. Further, the difference between FIG. 9 and FIG. 8 is only the hole diameter of the nozzle 14. FIG. 9 shows an example in which the ratio of T 1 / T 2 is 2.0 or more.
【００１８】本発明に係るコーナー部洗浄装置は、上述
のように裏面洗浄を兼ねて減圧乾燥装置の後に配置して
もよいが、回転塗布装置自体にコーナー部洗浄機能を備
えさせてもよいし、また減圧乾燥工程の前に配置する
等、都合によってどの工程の前後に置いてもよい。また
上述のように角形板状基板Ｗの中心をスピンチャック１
３の中心に合わせると、全てのコーナー部を同時に洗浄
することができるが、全てのコーナー部を洗浄する必要
がないときは上記中心部をずらすことも可能である。The corner cleaning device according to the present invention may be arranged after the reduced pressure drying device also for back surface cleaning as described above, but the spin coating device itself may be provided with a corner cleaning function. Also, it may be placed before or after any step, for example, by arranging it before the vacuum drying step. In addition, as described above, the center of the rectangular plate-shaped substrate W is attached to the spin chuck 1
If all the corners can be cleaned at the same time by aligning with the center of No. 3, it is possible to shift the center if it is not necessary to clean all the corners.
【００１９】[0019]
【発明の効果】以上に説明したように本発明に係るコー
ナー部洗浄装置によれば、回転塗布時の遠心力によって
コーナー部に偏って厚膜となった塗布被膜を容易に洗浄
することができるため、下地金属膜との配線を行う必要
のある絶縁膜形成、塗膜が均一厚さでないとパターニン
グの際に現像残りを起こす恐れのあるフォトレジスト膜
の形成等に有用である。更に厚膜部は溶剤によって洗浄
し、物理的に除去する必要がないため、塗膜面を傷つけ
たり基板を変形させることがない。As described above, according to the corner portion cleaning device of the present invention, it is possible to easily wash the coating film which is thickened by being concentrated in the corner portion due to the centrifugal force during spin coating. Therefore, it is useful for forming an insulating film that needs to be wired to the underlying metal film, forming a photoresist film that may cause development residue during patterning unless the coating film has a uniform thickness, and the like. Furthermore, since the thick film portion does not need to be washed with a solvent and physically removed, it does not damage the coating surface or deform the substrate.
【図１】本発明に係るコーナー部洗浄装置を組み込んだ
被膜形成装置の概略平面図FIG. 1 is a schematic plan view of a film forming apparatus incorporating a corner cleaning device according to the present invention.
【図２】同コーナー部洗浄装置の部分断面図FIG. 2 is a partial sectional view of the same corner cleaning device.
【図３】同コーナー部洗浄装置の概略平面図FIG. 3 is a schematic plan view of the corner cleaning device.
【図４】同コーナー部洗浄装置による好ましい洗浄液噴
射方向を示す概略平面図(a)及び概略側面図(b)FIG. 4 is a schematic plan view (a) and a schematic side view (b) showing preferred cleaning liquid jetting directions by the corner cleaning device.
【図５】同コーナー部洗浄装置によるコーナー部洗浄を
行った角形板状基板の塗布膜厚測定結果FIG. 5: Results of coating film thickness measurement on a rectangular plate-shaped substrate subjected to corner cleaning with the same corner cleaning device
【図６】同上[FIG. 6] Same as above
【図７】同上[FIG. 7] Same as above
【図８】同上[FIG. 8] Same as above
【図９】同上[FIG. 9] Same as above
【図１０】角形板状基板の概略図FIG. 10 is a schematic view of a rectangular plate substrate.
２…塗布装置、４…コーナー部洗浄装置、１３…スピン
チャック、１４…ノズル、１９…裏面洗浄用ノズル、Ｗ
…角形板状基板、a、a1、a2、a3、a4…コーナー部、s0
…基板表面、s1…塗膜表面、s2…境界***。2 ... Coating device, 4 ... Corner cleaning device, 13 ... Spin chuck, 14 ... Nozzle, 19 ... Backside cleaning nozzle, W
… Square plate substrate, a, a 1 , a 2 , a 3 , a 4 … Corner part, s 0
… Substrate surface, s 1 … Coating surface, s 2 … Boundary ridge.
─────────────────────────────────────────────────────
─────────────────────────────────────────────────── ───
【手続補正書】[Procedure amendment]
【提出日】平成５年１１月４日[Submission date] November 4, 1993
【手続補正１】[Procedure Amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】発明の名称[Name of item to be amended] Title of invention
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【発明の名称】 角形基板の洗浄装置Title: Cleaning device for rectangular substrate
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０１Ｌ 21/304 ３４１ Ｎ 8831−4Ｍ (72)発明者 熊澤 博嗣 神奈川県川崎市中原区中丸子150番地 東 京応化工業株式会社内─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. 5 Identification number Internal reference number FI Technical indication H01L 21/304 341 N 8831-4M (72) Inventor Hirotsugu Kumazawa 150 Nakamaruko, Nakahara-ku, Kawasaki-shi, Kanagawa Tokyo Ohka Kogyo Co., Ltd.
Claims (1)
を回転せしめるスピンチャックを備えた洗浄装置におい
て、この洗浄装置は回転塗布時の遠心力によって基板コ
ーナー部に偏向して厚膜となっている塗膜の洗浄液を吐
出するノズルを有し、このノズルは回転する角型基板の
コーナー部が通過する軌跡の上方に設けられていること
を特徴とする角形基板の洗浄装置。1. A cleaning apparatus equipped with a spin chuck for adsorbing a back surface of a plate-shaped rectangular substrate and rotating the substrate, wherein the cleaning apparatus deflects to a corner portion of the substrate by a centrifugal force during spin coating to form a thick film. An apparatus for cleaning a rectangular substrate, characterized in that it has a nozzle for discharging the cleaning liquid for the coating film, which is provided above the path through which the corner of the rotating rectangular substrate passes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4209690A JP2624426B2 (en) | 1992-07-14 | 1992-07-14 | Cleaning equipment for rectangular substrates |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4209690A JP2624426B2 (en) | 1992-07-14 | 1992-07-14 | Cleaning equipment for rectangular substrates |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0699124A true JPH0699124A (en) | 1994-04-12 |
| JP2624426B2 JP2624426B2 (en) | 1997-06-25 |
Family
ID=16577020
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4209690A Expired - Lifetime JP2624426B2 (en) | 1992-07-14 | 1992-07-14 | Cleaning equipment for rectangular substrates |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2624426B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004088418A1 (en) * | 2003-03-28 | 2004-10-14 | Hoya Corporation | Method of manufacturing mask blank |
| KR100796750B1 (en) * | 2001-05-21 | 2008-01-22 | 삼성전자주식회사 | Wet equipment |
| US7328713B2 (en) * | 2004-11-30 | 2008-02-12 | Samsung Electronics Co., Ltd. | Nozzle apparatus for stripping edge bead of wafer |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04171072A (en) * | 1990-11-05 | 1992-06-18 | Toshiba Corp | Substrate coater |
-
1992
- 1992-07-14 JP JP4209690A patent/JP2624426B2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04171072A (en) * | 1990-11-05 | 1992-06-18 | Toshiba Corp | Substrate coater |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100796750B1 (en) * | 2001-05-21 | 2008-01-22 | 삼성전자주식회사 | Wet equipment |
| WO2004088418A1 (en) * | 2003-03-28 | 2004-10-14 | Hoya Corporation | Method of manufacturing mask blank |
| EP1617287A1 (en) * | 2003-03-28 | 2006-01-18 | Hoya Corporation | Method of manufacturing mask blank |
| JPWO2004088418A1 (en) * | 2003-03-28 | 2006-07-06 | Hoya株式会社 | Manufacturing method of mask blanks |
| EP1617287A4 (en) * | 2003-03-28 | 2010-01-27 | Hoya Corp | Method of manufacturing mask blank |
| US7328713B2 (en) * | 2004-11-30 | 2008-02-12 | Samsung Electronics Co., Ltd. | Nozzle apparatus for stripping edge bead of wafer |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2624426B2 (en) | 1997-06-25 |
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