JPH0687531A - Delivery jig and device - Google Patents
Delivery jig and deviceInfo
- Publication number
- JPH0687531A JPH0687531A JP24035292A JP24035292A JPH0687531A JP H0687531 A JPH0687531 A JP H0687531A JP 24035292 A JP24035292 A JP 24035292A JP 24035292 A JP24035292 A JP 24035292A JP H0687531 A JPH0687531 A JP H0687531A
- Authority
- JP
- Japan
- Prior art keywords
- held
- wafer
- contact
- delivery
- supporting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、受け渡し技術に関し、
特に半導体ウェハのような高清浄度を維持することが必
要とされる被保持物の受け渡し工程に適用して有効な技
術に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to delivery technology,
In particular, the present invention relates to a technique effective when applied to a step of delivering a held object such as a semiconductor wafer which needs to maintain high cleanliness.
【０００２】[0002]
【従来の技術】半導体装置の製造におけるウエハ処理工
程などでは、半導体ウエハの受け渡しにおいてウエハを
保持し任意の場所に移動させることが出来るハンドリン
グ機構が使われている。2. Description of the Related Art In a wafer processing process or the like in manufacturing a semiconductor device, a handling mechanism that can hold a wafer and move it to an arbitrary place is used in the delivery of the semiconductor wafer.
【０００３】従来の方式では、ウエハとこの保持部との
接触領域は一定である。つまり常に、保持部の同じ接触
領域によってウエハが保持されている。このことは、例
えば半導体装置の洗浄装置においては、洗浄前に、ウエ
ハを保持した部分と、洗浄後、ウエハを保持する部分と
が同じである事を示している。In the conventional method, the contact area between the wafer and the holding portion is constant. That is, the wafer is always held by the same contact area of the holder. This means that, for example, in a semiconductor device cleaning apparatus, the portion that holds the wafer before cleaning is the same as the portion that holds the wafer after cleaning.
【０００４】なお、従来における半導体ウエハのハンド
リング技術については、たとえば、株式会社工業調査
会、昭和５７年１１月１８日発行、「電子材料」１９８
２年１１月号Ｐ１０９〜Ｐ１１６、などの文献に記載さ
れている。Regarding the conventional semiconductor wafer handling technology, for example, "Electronic Materials" 198, published by Kogyo Kogyokai Co., Ltd., November 18, 1982.
It is described in the literature such as November 2010, P109 to P116.
【０００５】[0005]
【発明が解決しようとする課題】上述の従来の半導体ウ
エハの受け渡し方式では、例えば洗浄装置において、同
一のハンドリング機構を用いて洗浄装置に対するウエハ
の装填および取り出しを行う場合、洗浄前のウエハ裏面
に付いていた異物が、装填時にハンドリング機構に付着
し、高清浄に洗浄したウエハを洗浄後に取り出す際にハ
ンドリング機構に受け取ったときに、当該ハンドリング
機構を介して洗浄済のウエハに再付着して再び汚染して
しまう（クロスコンタミネーション）とういう問題があ
る事を本発明者は見出した。In the conventional semiconductor wafer transfer system described above, for example, in the cleaning apparatus, when the wafer is loaded and unloaded from the cleaning apparatus using the same handling mechanism, the back surface of the wafer before cleaning is not cleaned. The attached foreign matter adheres to the handling mechanism at the time of loading, and when it is received by the handling mechanism when taking out a wafer that has been cleaned with high cleanliness after cleaning, it re-adheres to the cleaned wafer via the handling mechanism and re-attaches. The present inventor has found that there is a problem called contamination (cross contamination).
【０００６】このことは、半導体ウエハに形成される半
導体集積回路などの微細化、高性能化に伴って汚染や付
着する異物にたいする許容限度が低下しつつあることを
考慮すれば、半導体装置の信頼度や、歩留り向上などの
観点から重要な問題となるものである。This is because the reliability of the semiconductor device is reduced in consideration of the fact that the permissible limit for contaminants and foreign matter adhering to the semiconductor integrated circuit formed on the semiconductor wafer is becoming smaller as the size and performance of the semiconductor integrated circuit are becoming smaller. It is an important issue from the viewpoints of the degree of improvement and the yield.
【０００７】本発明の目的は、受け渡し操作における被
保持物の異物などによる汚染を確実に防止する事が可能
な受け渡し技術を提供することにある。An object of the present invention is to provide a delivery technique capable of reliably preventing contamination of a held object due to foreign matter or the like in the delivery operation.
【０００８】本発明の前記並びにその他の目的と新規な
特徴は、本明細書の記述及び添付図面から明らかになる
であろう。The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.
【０００９】[0009]
【課題を解決するための手段】本願において開示される
発明のうち、代表的なものの概要を簡単に説明すれば、
下記のとおりである。Among the inventions disclosed in the present application, a brief description will be given to the outline of typical ones.
It is as follows.
【００１０】すなわち、本発明は、複数の処理部位の間
における板状の被保持物の受け渡し動作を行う受け渡し
治具において、被保持物を互いに独立に支持可能な複数
の接触面を備え、二つの処理部位間における被保持物の
往復経路または、三以上の処理部位間における被保持物
の移動経路における各経路毎に互いに異なる接触面を使
い分けるようにしたものである。That is, according to the present invention, in a transfer jig for transferring a plate-shaped object to be held between a plurality of processing parts, a plurality of contact surfaces capable of independently supporting the object to be held are provided. Different contact surfaces are used for each of the reciprocating path of the held object between two processing parts or the moving path of the held object between three or more processing parts.
【００１１】また、本発明は、請求項１記載の受け渡し
治具において、接触面が、同心円をなす円弧状に刻設さ
れた階段状構造を呈し、被保持物の径方向に互いに異な
る高さに位置する接触面を使い分けて当該被保持物を支
持する構造としたものである。Further, according to the present invention, in the delivery jig according to the first aspect, the contact surfaces have a stepped structure engraved in an arc shape forming a concentric circle, and the heights of the held objects differ from each other in the radial direction. The contact surface located at is properly used to support the held object.
【００１２】また、本発明は、請求項１または２記載の
受け渡し治具において、階段構造の一部を可動部に刻設
し、被保持物の径方向における階段状構造間の距離を変
化させることにより、互いに異なる接触面を使い分けて
被保持物を支持可能にしたものである。Further, according to the present invention, in the delivery jig according to the first or second aspect, a part of the staircase structure is engraved in the movable part to change the distance between the staircase structures in the radial direction of the held object. This makes it possible to support the object to be held by selectively using different contact surfaces.
【００１３】また、本発明は、請求項１記載の受け渡し
治具において、被保持物を支持する接触面を上下方向に
所定の間隔で重なり合うように配置し、各段の接触面を
使い分けて被保持物を支持する構造としたものである。Further, according to the present invention, in the delivery jig according to the first aspect, the contact surfaces for supporting the object to be held are arranged so as to overlap each other in the vertical direction at a predetermined interval, and the contact surfaces of each step are selectively used. It has a structure for supporting a holding object.
【００１４】また、本発明の受け渡し治具は、被保持物
の載置面に、当該載置面から突出・引込み自在な複数の
支持片を配置し、載置面によって直接的に被保持物を支
持する第１の動作と、載置面から突出させた支持片によ
って被保持物を支持する第２の動作とを可能にしたもの
である。Further, in the delivery jig of the present invention, a plurality of support pieces which can be projected / retracted from the mounting surface are arranged on the mounting surface of the holding object, and the supporting surface directly holds the object. It is possible to perform a first operation of supporting the object and a second operation of supporting the held object by the support piece protruding from the mounting surface.
【００１５】また、本発明の受け渡し装置は、第１およ
び第２の処理部位の間に、第１の処理部位から第２の処
理部位への被保持物の支持および移動を専ら行う第１の
受け渡し機構と、第２の処理部位から第１の処理部位へ
の被保持物の支持および移動を専ら行う第２の受け渡し
機構とを備えたものである。Further, in the delivery device of the present invention, between the first and second processing parts, the first and second processing parts exclusively support and move the object to be held from the first processing part to the second processing part. It is provided with a delivery mechanism and a second delivery mechanism for exclusively supporting and moving the held object from the second processing portion to the first processing portion.
【００１６】[0016]
【作用】上記した本発明の受け渡し治具によれば、各処
理部位の間における被保持物の移動経路毎に、被保持物
を異なる接触面を使い分けて支持するので、たとえば、
洗浄処理などにおいては、洗浄前の被保持物に付着して
いた異物が受け渡し治具を介して洗浄後の被保持物に付
着することによる再汚染が発生したり、あるいは、たと
えば薄膜形成処理などにおいては、薄膜形成中に被保持
物に付着した異物が処理後、受け渡し治具を介して、処
理前の清浄な被保持物に付着して汚染する、などの不具
合が確実に解消され、たとえば清浄度レベルの異なる被
保持物の受け渡し操作における被保持物の異物などによ
る汚染を確実に防止する事が可能となる。According to the above-described delivery jig of the present invention, the held object is supported by using different contact surfaces for each moving path of the held object between the processing parts.
In the cleaning process, recontamination may occur due to foreign substances attached to the object to be held before cleaning being attached to the object to be held after cleaning via the transfer jig, or for example, thin film forming processing, etc. In, in the thin film formation, after the foreign matter adhered to the object to be held is processed and then adhered to and contaminated with the clean object to be held before the processing via the transfer jig, problems such as reliably are eliminated. It is possible to reliably prevent contamination of the held objects due to foreign matters during the operation of passing the held objects having different cleanliness levels.
【００１７】また、本発明の受け渡し装置によれば、第
１および第２の処理部位の間における被保持物の移動経
路毎に、専用の第１および第２の受け渡し機構を設けた
ので、第１および第２の処理部位の間における被保持物
の移動に際して、各経路間における受け渡し機構を介し
た異物の相互的な付着が防止され、受け渡し操作におけ
る被保持物の異物などによる汚染を確実に防止する事が
可能となる。Further, according to the delivery device of the present invention, the dedicated first and second delivery mechanisms are provided for each movement path of the held object between the first and second processing parts. When the object to be held is moved between the first and second processing parts, mutual adhesion of foreign matter through the delivery mechanism between the paths is prevented, and contamination of the object to be held in the delivery operation by foreign matter is surely performed. It is possible to prevent it.
【００１８】[0018]
【実施例１】以下、図面を参照しながら、本発明の一実
施例である受け渡し治具および装置について詳細に説明
する。Embodiment 1 Hereinafter, a delivery jig and an apparatus according to an embodiment of the present invention will be described in detail with reference to the drawings.
【００１９】図１（ａ）および（ｂ）は、本実施例の受
け渡し治具Ａの構成および作用の一例を示す略断面図で
あり、図２は、その平面図である。1 (a) and 1 (b) are schematic sectional views showing an example of the structure and operation of the transfer jig A of this embodiment, and FIG. 2 is a plan view thereof.
【００２０】例えば、平板状の基体部１の一面には、同
心円をなす円弧状に、かつ断面が階段状となるように、
段差部２および段差部３が刻設されている。For example, on one surface of the flat plate-shaped base portion 1, concentric circular arcs and a stepwise cross-section,
The step portion 2 and the step portion 3 are engraved.
【００２１】内側の段差部２の外径は、受け渡し操作の
対象となるウエハ４の外径よりも小さく、外側の段差部
３の外径はウエハ４の外径よりも僅かに大きく設定され
ている。これにより、図１の（ａ）に例示されるよう
に、基体部１の長手方向におけるウエハ４の一方の端縁
４ａを外側の段差部３の接触面３ａに当接させ、他方の
端縁４ｂを内側の段差部２の接触面２ｂに当接させた姿
勢、および、これとは逆に、同図（ｂ）に例示されるよ
うに、ウエハ４の端縁４ａを内側の段差部２の接触面２
ａに当接させ、端縁４ｂの側を外側の段差部３の接触面
３ｂに当接させた姿勢、の各々を使い分けて、当該ウエ
ハ４を支持することが可能になっている。The outer diameter of the inner step portion 2 is set to be smaller than the outer diameter of the wafer 4 to be transferred, and the outer diameter of the outer step portion 3 is set to be slightly larger than the outer diameter of the wafer 4. There is. As a result, as illustrated in FIG. 1A, one edge 4a of the wafer 4 in the longitudinal direction of the base portion 1 is brought into contact with the contact surface 3a of the outer step portion 3 and the other edge is abutted. 4b is brought into contact with the contact surface 2b of the inner stepped portion 2 and, conversely, as shown in FIG. 2B, the edge 4a of the wafer 4 is placed inside the stepped portion 2b. Contact surface 2
It is possible to support the wafer 4 by properly using each of a posture in which it is brought into contact with a and the end edge 4b side is brought into contact with the contact surface 3b of the outer step portion 3.
【００２２】すなわち、前述の各支持姿勢において、ウ
エハ４は、基体部１の同一領域に接することがない。That is, in each of the supporting postures described above, the wafer 4 does not contact the same region of the base portion 1.
【００２３】基体部１の一端には、図示しないロボット
ハンドなどに固定するための複数の螺子孔１ａが穿設さ
れ、他端部には、当該基体部１に支持されたウエハ４の
下側に必要に応じて図示しない光センサなどによりウエ
ハ４有無等を検知するための逃げ溝１ｂが開設されてい
る。A plurality of screw holes 1a for fixing to a robot hand (not shown) or the like are formed at one end of the base portion 1, and the lower side of the wafer 4 supported by the base portion 1 is provided at the other end. In addition, an escape groove 1b for detecting the presence or absence of the wafer 4 and the like is provided by an optical sensor or the like (not shown) as needed.
【００２４】そして、このように構成された本実施例の
受け渡し治具Ａによれば、たとえば、特定の位置に位置
決めされているウエハ４の下に基体部１を長手方向に差
し入れ、さらに僅かに持ち上げることによって当該ウエ
ハ４を支持することによって、たとえば、図示しない洗
浄装置と当該洗浄装置の外側に設けられたカセットとの
間でウエハ４の受け渡し動作を行うとき、外側の段差部
３と内側の段差部２の半径の差分ΔＳ程度にストローク
をずらす動作を行う。According to the delivery jig A of the present embodiment having such a configuration, for example, the base portion 1 is inserted in the longitudinal direction below the wafer 4 positioned at a specific position, and then slightly further. By supporting the wafer 4 by lifting it, for example, when the wafer 4 is transferred between a cleaning device (not shown) and a cassette provided outside the cleaning device, the step portion 3 on the outer side and the inner step An operation is performed to shift the stroke to a difference ΔS of the radius of the step portion 2.
【００２５】これにより、たとえば、カット側から洗浄
装置へ洗浄前のウエハ４を装填する操作では、図１
（ａ）のように、段差部３の接触面３ａと段差部２の接
触面２ｂとで、ウエハ４の端縁４ａおよび４ｂを支持
し、逆に、洗浄済のウエハ４を洗浄装置から外部のカセ
ットにとり出す場合には、図１（ｂ）のように、段差部
２の接触面２ａと段差部３の接触面３ｂとで、ウエハ４
の端縁４ａおよび４ｂを支持させることができる。As a result, for example, in the operation of loading the uncleaned wafer 4 from the cut side into the cleaning device, as shown in FIG.
As shown in (a), the contact surface 3a of the step portion 3 and the contact surface 2b of the step portion 2 support the edges 4a and 4b of the wafer 4, and conversely, the cleaned wafer 4 is removed from the cleaning device. In the case of taking out the wafer 4 into the cassette of FIG. 1B, the contact surface 2a of the stepped portion 2 and the contact surface 3b of the stepped portion 3 are used as shown in FIG.
Edges 4a and 4b can be supported.
【００２６】すなわち、共通の受け渡し治具Ａを用いる
場合でも、清浄度レベルの異なる洗浄前のウエハ４と洗
浄後のウエハ４は、基体部１の同一領域に接触すること
がなくなる。このため、たとえば、洗浄処理の場合に
は、洗浄前のウエハ４に付着していた異物が基体部１を
介して洗浄後のウエハ４に再付着するなどの汚染（クロ
スコンタミネーション）が確実に回避される。That is, even when the common transfer jig A is used, the uncleaned wafer 4 and the cleaned wafer 4 having different cleanliness levels do not come into contact with the same region of the base portion 1. For this reason, for example, in the case of the cleaning process, contamination (cross contamination) such as foreign matter adhered to the wafer 4 before cleaning redeposits on the wafer 4 after cleaning via the base portion 1 is surely performed. Avoided.
【００２７】[0027]
【実施例２】図３（ａ）および（ｂ）は本発明の他の実
施例である受け渡し治具Ｂの構成および作用の一例を示
す略断面図である。[Embodiment 2] FIGS. 3A and 3B are schematic sectional views showing an example of the structure and operation of a delivery jig B which is another embodiment of the present invention.
【００２８】この実施例２の場合には、段差部２および
段差部３における接触面２ｂおよび接触面３ｂの領域
を、ウエハ４の径方向に移動可能に設けられた可動片５
に設け、当該可動片５を送り螺子６およびモータ７を介
して駆動する構成としたものである。又、可動片５を送
り螺子６以外のカム・リンク機構およびモータ７以外の
エアシリンダ等を介して駆動する構成もある。In the case of the second embodiment, the movable piece 5 is provided so as to be movable in the radial direction of the wafer 4 in the regions of the contact surface 2b and the contact surface 3b in the step portion 2 and the step portion 3.
And the movable piece 5 is driven via the feed screw 6 and the motor 7. There is also a configuration in which the movable piece 5 is driven via a cam / link mechanism other than the feed screw 6 and an air cylinder other than the motor 7.
【００２９】そして、ウエハ４の支持動作に際しては、
可動片５を拡開方向に移動させ、内側の小径の段差部２
の接触面２ａおよび２ｂによってウエハ４の端縁４ａお
よび４ｂを当接支持する保持姿勢（図３（ａ））と、可
動片５を縮閉方向に移動させ、外側の大径の段差部３の
接触面３ａおよび３ｂによってウエハ４の端縁４ａおよ
び４ｂを当接支持する保持姿勢（図３（ｂ））を使い分
けることを可能にしたものである。Then, in the supporting operation of the wafer 4,
The movable piece 5 is moved in the expanding direction, and the step portion 2 having a small diameter inside is moved.
The holding position (FIG. 3A) in which the edges 4a and 4b of the wafer 4 are abutted and supported by the contact surfaces 2a and 2b of FIG. It is possible to properly use the holding posture (FIG. 3B) in which the end edges 4a and 4b of the wafer 4 are contacted and supported by the contact surfaces 3a and 3b.
【００３０】これにより、前記実施例１の場合と同様
に、前記各支持姿勢の各々で、ウエハ４の基体部１の同
一領域に接することがないので、当該基体部１を介した
ウエハ４の汚染が回避される。As a result, as in the case of the first embodiment, in each of the supporting postures, the wafer 4 does not come into contact with the same region of the base portion 1 of the wafer 4, so that the wafer 4 is placed through the base portion 1. Pollution is avoided.
【００３１】また、一種類の受け渡し治具Ｂによって、
径寸法の異なる複数種のウエハ４の受け渡し操作を行う
ことができる。Further, with one kind of transfer jig B,
A plurality of types of wafers 4 having different diameters can be delivered and received.
【００３２】[0032]
【実施例３】図４（ａ）および（ｂ）は、本発明のさら
に他の実施例である受け渡し治具Ｃの構成および作用の
一例を示す略断面図である。Third Embodiment FIGS. 4 (a) and 4 (b) are schematic cross-sectional views showing an example of the structure and operation of a delivery jig C which is still another embodiment of the present invention.
【００３３】この受け渡し治具Ｃは、基体部１０におけ
るウエハ４の載置面１０ａに、回動動作によって当該載
置面１０ａから突出し、あるいは、当該載置面１０ａの
内部に完全に引き込まれる複数の回転接触子１１を埋め
込んだものである。A plurality of the transfer jigs C are projected on the mounting surface 10a of the wafer 4 in the base portion 10 by the rotating operation or are completely drawn into the mounting surface 10a. The rotary contact 11 is embedded.
【００３４】すなわち、本実施例の場合には、回転接触
子１１の各々は略三角形を呈し、回転軸１１ａによって
載置面１０ａに交差する平面内で回動自在に支持され、
図示しない駆動機構により、突出および引込みのための
回動姿勢が同期して制御される。That is, in the case of this embodiment, each of the rotary contacts 11 has a substantially triangular shape, and is rotatably supported by the rotary shaft 11a in a plane intersecting with the mounting surface 10a.
A rotation mechanism for projecting and retracting is controlled in synchronization by a drive mechanism (not shown).
【００３５】これにより、図４の（ａ）に例示されるよ
うに、三角形の複数の回転接触子１１の各々の頂点を載
置面１０ａから突出させ、複数の当該回転接触子１１に
よってウエハ４を略点接触によって支持する保持状態
と、同図（ｂ）に例示されるように、複数の回転接触子
１１を載置面１０ａの内部に引込み、当該載置面１０ａ
によって面接触で支持する保持状態とを、たとえば、所
望の処理装置に対するウエハ４の装填および取り出し操
作の各々で使い分けることが可能となり、前述の各実施
例の場合と同様に、洗浄や薄膜形成処理などにおけるウ
エハ４の取扱に際してのクロスコンタミネーションを防
止することができる。As a result, as shown in FIG. 4A, the vertices of the plurality of triangular rotary contacts 11 are projected from the mounting surface 10a, and the wafers 4 are moved by the plurality of rotary contacts 11. And a holding state in which the plurality of rotary contacts 11 are drawn into the mounting surface 10a, as illustrated in FIG.
The holding state in which the wafer 4 is supported by surface contact can be selectively used, for example, in each of the loading and unloading operations of the wafer 4 with respect to a desired processing apparatus. As in the case of the above-described respective embodiments, the cleaning and the thin film forming processing are performed. It is possible to prevent cross-contamination when handling the wafer 4 in such cases.
【００３６】[0036]
【実施例４】図５は、本発明のさらに他の実施例である
受け渡し治具Ｄの構成の一例を示す略側面図である。Fourth Embodiment FIG. 5 is a schematic side view showing an example of the structure of a delivery jig D which is still another embodiment of the present invention.
【００３７】この実施例４の場合には、基体部２０にウ
エハ４が載置される複数のフィンガ２１およびフィンガ
２２を上下二段に配置し、たとえば、所望の処理装置に
対するウエハ４の装填および取り出し操作の各々で、複
数のフィンガ２１およびフィンガ２２を使い分けるよう
にしたものである。これにより、前述の各実施例の場合
と同様に、洗浄や薄膜形成処理などにおけるウエハ４の
取扱に際してのクロスコンタミネーションを防止するこ
とができる。In the case of the fourth embodiment, a plurality of fingers 21 and fingers 22 on which the wafer 4 is mounted are arranged on the base portion 20 in two upper and lower stages, and, for example, loading of the wafer 4 into a desired processing apparatus and A plurality of fingers 21 and 22 are selectively used in each of the taking-out operations. This makes it possible to prevent cross-contamination during handling of the wafer 4 during cleaning, thin film formation processing, etc., as in the case of each of the above-described embodiments.
【００３８】なお、図５ではフィンガを二段に配置した
例を示してあるが、三段以上の構造としてもよいことは
言うまでもない。Although FIG. 5 shows an example in which the fingers are arranged in two stages, it goes without saying that a structure having three or more stages is also possible.
【００３９】[0039]
【実施例５】図６は、本発明の一実施例である受け渡し
装置Ｅの構成の一例を示す概念図である。Fifth Embodiment FIG. 6 is a conceptual diagram showing an example of the configuration of a delivery device E which is an embodiment of the present invention.
【００４０】本実施例の受け渡し装置Ｅは、複数のプロ
セスチャンバ３０およびプロセスチャンバ３１の間にお
けるウエハ４の受け渡し操作を行うために、ロボット３
２ａおよび当該ロボット３２ａによって駆動されるフィ
ンガ３２ｂからなる受け渡し機構３２、およびロボット
３３ａおよび当該ロボット３３ａによって駆動されるフ
ィンガ３３ｂからなる受け渡し機構３３を多重に配置し
たものである。The transfer device E of the present embodiment uses the robot 3 to transfer the wafer 4 between the plurality of process chambers 30 and 31.
2a and a transfer mechanism 32 including a finger 32b driven by the robot 32a, and a transfer mechanism 33 including a robot 33a and a finger 33b driven by the robot 33a are arranged in multiple layers.
【００４１】そして、たとえば、プロセスチャンバ３０
からプロセスチャンバ３１へのウエハ４の移動に際して
は、一方の受け渡し機構３２のフィンガ３２ｂを用いて
ウエハ４の受け渡しを行い、プロセスチャンバ３１から
のウエハ４の取り出し操作は、他の受け渡し機構３３の
フィンガ３３ｂを用いる、というように、各受け渡し工
程で複数の受け渡し機構３２および３３を使い分けるも
のである。Then, for example, the process chamber 30
When the wafer 4 is moved from the process chamber 31 to the process chamber 31, the wafer 4 is transferred using the finger 32b of the one transfer mechanism 32, and the operation of taking out the wafer 4 from the process chamber 31 is performed by the finger of the other transfer mechanism 33. 33b is used, and a plurality of transfer mechanisms 32 and 33 are used properly in each transfer process.
【００４２】これにより、プロセスチャンバ３０や３１
におけるウエハ４の所定の処理の前後におけるクロスコ
ンタミネーションを防止することができる。As a result, the process chambers 30 and 31 are
It is possible to prevent cross contamination before and after the predetermined processing of the wafer 4 in FIG.
【００４３】以上、本発明者によってなされた発明を実
施例に基づき説明したが、本発明は前記実施例に限定さ
れるものでなく、その要旨を逸脱しない範囲で種々変更
可能である事はいうまでもない。Although the invention made by the present inventor has been described based on the embodiments, the present invention is not limited to the embodiments, and various modifications can be made without departing from the scope of the invention. There is no end.
【００４４】以上の説明では主として本発明者によって
なされた発明をその背景となった利用分野である半導体
製造装置の製造におけるウエハ処理工程での半導体ウエ
ハの受け渡し技術に適用した場合について説明したが、
これに限定されるものではなく、高清浄度が必要とされ
る一般の精密製品の取扱い技術に広く適用できる。In the above description, the case where the invention made by the present inventor is mainly applied to the delivery technology of the semiconductor wafer in the wafer processing step in the manufacturing of the semiconductor manufacturing apparatus which is the field of application of the invention has been described.
The present invention is not limited to this, and can be widely applied to general precision product handling techniques that require high cleanliness.
【００４５】[0045]
【発明の効果】本願において開示される発明の代表的な
ものによって得られる効果を簡単に説明すれば、下記の
通りである。The effects obtained by the representative one of the inventions disclosed in the present application will be briefly described as follows.
【００４６】すなわち、本発明の受け渡し治具によれ
ば、被保持物に対する接触領域を、たとえば当該被保持
物の清浄度などのレベルに応じて使い分けることができ
るので、清浄度レベルの異なる被保持物の受け渡し操作
における被保持物の異物などによる汚染を確実に防止す
る事ができるという効果が得られる。That is, according to the delivery jig of the present invention, the contact area with respect to the object to be held can be selectively used according to the level of the degree of cleanliness of the object to be held. The effect that it is possible to reliably prevent contamination of the held object due to foreign matter or the like in the operation of delivering the object is obtained.
【００４７】また、本発明の受け渡し装置によれば、被
保持物に接触する複数の受け渡し機構を、たとえば当該
被保持物の清浄度などのレベルに応じて使い分けること
ができるので、受け渡し操作における被保持物の異物な
どによる汚染を確実に防止する事ができるという効果が
得られる。Further, according to the delivery device of the present invention, it is possible to properly use a plurality of delivery mechanisms that come into contact with the object to be held according to the level of cleanliness of the object to be held. It is possible to obtain an effect that it is possible to surely prevent the foreign matter of the holding object from being contaminated.
【００４８】この結果、たとえば、被保持物であるウエ
ハに形成される半導体装置の特性等に与える異物の影響
を低減でき、信頼度の向上に寄与することができる。As a result, for example, the influence of foreign matter on the characteristics of the semiconductor device formed on the wafer to be held can be reduced and the reliability can be improved.
【図１】（ａ）および（ｂ）は、本実施例の受け渡し治
具Ａの構成および作用の一例を示す略断面図である。1A and 1B are schematic cross-sectional views showing an example of the configuration and operation of a delivery jig A of this embodiment.
【図２】その平面図である。FIG. 2 is a plan view thereof.
【図３】（ａ）および（ｂ）は本発明の他の実施例であ
る受け渡し治具Ｂの構成および作用の一例を示す略断面
図である。3 (a) and 3 (b) are schematic cross-sectional views showing an example of the configuration and operation of a delivery jig B which is another embodiment of the present invention.
【図４】（ａ）および（ｂ）は、本発明のさらに他の実
施例である受け渡し治具Ｃの構成および作用の一例を示
す略断面図である。4 (a) and 4 (b) are schematic cross-sectional views showing an example of the configuration and operation of a delivery jig C that is still another embodiment of the present invention.
【図５】本発明のさらに他の実施例である受け渡し治具
Ｄの構成の一例を示す略側面図である。FIG. 5 is a schematic side view showing an example of the configuration of a delivery jig D that is still another embodiment of the present invention.
【図６】本発明の一実施例である受け渡し装置Ｅの構成
の一例を示す概念図である。FIG. 6 is a conceptual diagram showing an example of a configuration of a delivery device E which is an embodiment of the present invention.
１ 基体部 １ａ 螺子孔 １ｂ 逃げ溝 ２ 段差部 ２ａ 接触面 ２ｂ 接触面 ３ 段差部 ３ａ 接触面 ３ｂ 接触面 ４ ウエハ（被保持物） ４ａ 端縁 ４ｂ 端縁 ５ 可動片 ６ 送り螺子 ７ モータ １０ 基体部 １０ａ 載置面 １１ 回転接触子（支持片） １１ａ 回転軸 ２０ 基体部 ２１ フィンガ ２２ フィンガ ３０ プロセスチャンバ（第１の処理部位） ３１ プロセスチャンバ（第２の処理部位） ３２ 受け渡し機構（第１の受け渡し機構） ３２ａ ロボット ３２ｂ フィンガ ３３ 受け渡し機構（第２の受け渡し機構） ３３ａ ロボット ３３ｂ フィンガ Ａ 受け渡し治具 Ｂ 受け渡し治具 Ｃ 受け渡し治具 Ｄ 受け渡し治具 Ｅ 受け渡し装置 DESCRIPTION OF SYMBOLS 1 Base part 1a Screw hole 1b Escape groove 2 Step part 2a Contact surface 2b Contact surface 3 Step part 3a Contact surface 3b Contact surface 4 Wafer (holding object) 4a End edge 4b End edge 5 Movable piece 6 Feed screw 7 Motor 10 Base Part 10a Mounting surface 11 Rotating contactor (supporting piece) 11a Rotating shaft 20 Base part 21 Finger 22 Finger 30 Process chamber (first processing part) 31 Process chamber (second processing part) 32 Delivery mechanism (first) Delivery mechanism) 32a robot 32b finger 33 delivery mechanism (second delivery mechanism) 33a robot 33b finger A delivery jig B delivery jig C delivery jig D delivery jig E delivery device
───────────────────────────────────────────────────── フロントページの続き (72)発明者 田辺 義和 東京都青梅市今井2326番地 株式会社日立 製作所デバイス開発センタ内 ─────────────────────────────────────────────────── ─── Continued Front Page (72) Inventor Yoshikazu Tanabe 2326 Imai, Ome-shi, Tokyo Hitachi, Ltd. Device Development Center
Claims (6)
持物の受け渡し動作を行う受け渡し治具であって、前記
被保持物を互いに独立に支持可能な複数の接触面を備
え、二つの前記処理部位間における前記被保持物の往復
経路または、三以上の前記処理部位間における前記被保
持物の移動経路の各々毎に、互いに異なる前記接触面を
使い分けることを特徴とする受け渡し治具。1. A transfer jig for transferring a plate-shaped object to be held between a plurality of processing parts, comprising a plurality of contact surfaces capable of supporting the object to be held independently of each other. A delivery jig, wherein different contact surfaces are used for each of a reciprocating path of the held object between the processing parts or a moving path of the held object among three or more processing parts.
設された階段状構造を呈し、前記被保持物の径方向に互
いに異なる高さに位置する前記接触面を使い分けて当該
被保持物を支持することを特徴とする請求項１記載の受
け渡し治具。2. The contact surface has a stepped structure carved in an arc shape forming a concentric circle, and the contact surface positioned at different heights in the radial direction of the object to be held is selectively used. The delivery jig according to claim 1, which supports an object.
れ、前記被保持物の径方向における前記階段状構造間の
距離を変化させることにより、互いに異なる前記接触面
を使い分けて前記被保持物を支持可能にしたことを特徴
とする請求項１または２記載の受け渡し治具。3. A part of the staircase structure is engraved in a movable part, and by changing the distance between the staircase structures in the radial direction of the object to be held, the contact surfaces different from each other are selectively used. The delivery jig according to claim 1 or 2, wherein the holding object can be supported.
向に所定の間隔で重なり合うように配置され、各段の前
記接触面を使い分けて前記被保持物を支持することを特
徴とする請求項１記載の受け渡し治具。4. The contact surface for supporting the object to be held is arranged so as to overlap in the vertical direction at a predetermined interval, and the object to be held is supported by properly using the contact surface of each step. The delivery jig according to item 1.
出・引込み自在な複数の支持片を配置し、前記載置面に
よって直接的に前記被保持物を支持する第１の動作と、
前記載置面から突出させた前記支持片によって前記被保
持物を支持する第２の動作とを使い分けることを可能に
したことを特徴する受け渡し治具。5. A first support for arranging a plurality of support pieces projecting and retractable from the mounting surface on a mounting surface of the held object, and directly supporting the held object by the mounting surface. Operation,
A delivery jig characterized in that it is possible to selectively use the second operation of supporting the held object by the support piece protruding from the placement surface.
第１の処理部位から第２の処理部位への被保持物の支持
および移動を専ら行う第１の受け渡し機構と、前記第２
の処理部位から第１の処理部位への被保持物の支持およ
び移動を専ら行う第２の受け渡し機構とを備えたことを
特徴とする受け渡し装置。6. A first transfer mechanism for exclusively supporting and moving an object to be held between the first processing part and the second processing part between the first and second processing parts, and the first transfer mechanism. Two
And a second transfer mechanism for exclusively supporting and moving the object to be held from the processing part to the first processing part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24035292A JPH0687531A (en) | 1992-09-09 | 1992-09-09 | Delivery jig and device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24035292A JPH0687531A (en) | 1992-09-09 | 1992-09-09 | Delivery jig and device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0687531A true JPH0687531A (en) | 1994-03-29 |
Family
ID=17058216
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24035292A Pending JPH0687531A (en) | 1992-09-09 | 1992-09-09 | Delivery jig and device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0687531A (en) |
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| US5711646A (en) * | 1994-10-07 | 1998-01-27 | Tokyo Electron Limited | Substrate transfer apparatus |
| JP2010153808A (en) * | 2008-11-26 | 2010-07-08 | Hitachi Kokusai Electric Inc | Substrate processing apparatus |
| JP2010206042A (en) * | 2009-03-05 | 2010-09-16 | Dainippon Screen Mfg Co Ltd | Substrate conveyance apparatus |
| CN102205540A (en) * | 2010-03-31 | 2011-10-05 | 株式会社安川电机 | Substrate transport hand and substrate transport robot |
| JP2012130985A (en) * | 2010-12-21 | 2012-07-12 | Kawasaki Heavy Ind Ltd | End effector for transfer robot |
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| JP2016208018A (en) * | 2015-04-15 | 2016-12-08 | ラム リサーチ コーポレーションＬａｍ Ｒｅｓｅａｒｃｈ Ｃｏｒｐｏｒａｔｉｏｎ | End effector assembly for clean/dirty substrate handling |
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| JP2010153808A (en) * | 2008-11-26 | 2010-07-08 | Hitachi Kokusai Electric Inc | Substrate processing apparatus |
| JP2010206042A (en) * | 2009-03-05 | 2010-09-16 | Dainippon Screen Mfg Co Ltd | Substrate conveyance apparatus |
| CN102205540A (en) * | 2010-03-31 | 2011-10-05 | 株式会社安川电机 | Substrate transport hand and substrate transport robot |
| JP2011228625A (en) * | 2010-03-31 | 2011-11-10 | Yaskawa Electric Corp | Substrate transfer hand and substrate transfer robot |
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| JP2012130985A (en) * | 2010-12-21 | 2012-07-12 | Kawasaki Heavy Ind Ltd | End effector for transfer robot |
| JP2014024161A (en) * | 2012-07-27 | 2014-02-06 | Ebara Corp | Workpiece conveying device |
| JP2016208018A (en) * | 2015-04-15 | 2016-12-08 | ラム リサーチ コーポレーションＬａｍ Ｒｅｓｅａｒｃｈ Ｃｏｒｐｏｒａｔｉｏｎ | End effector assembly for clean/dirty substrate handling |
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| JP2017183593A (en) * | 2016-03-31 | 2017-10-05 | 平田機工株式会社 | Hand unit and transfer method |
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| US10109515B2 (en) | 2016-03-31 | 2018-10-23 | Hirata Corporation | Hand unit and transfer method |
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| US10622242B2 (en) | 2017-08-30 | 2020-04-14 | SCREEN Holdings Co., Ltd. | Substrate inverting device, substrate processing apparatus, and substrate supporting device, and substrate inverting method, substrate processing method, and substrate supporting method |
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| CN109427637A (en) * | 2017-08-30 | 2019-03-05 | 株式会社斯库林集团 | Substrate inversion set, substrate board treatment and baseplate support device and its method |
| JP2020205386A (en) * | 2019-06-19 | 2020-12-24 | 信越半導体株式会社 | Conveyance jig for semiconductor wafer and conveyance method using the same |
| JP2022043081A (en) * | 2020-06-30 | 2022-03-15 | 株式会社荏原製作所 | Substrate processing apparatus |
| CN117260792A (en) * | 2023-11-17 | 2023-12-22 | 上海普达特半导体设备有限公司 | Manipulator and equipment with clamp splice |
| CN117373994A (en) * | 2023-11-17 | 2024-01-09 | 上海普达特半导体设备有限公司 | Robot for transporting wafers and semiconductor processing apparatus |
| CN117260792B (en) * | 2023-11-17 | 2024-02-27 | 上海普达特半导体设备有限公司 | Manipulator and equipment with clamp splice |
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