JPH0687009B2 - Component attitude detector - Google Patents
Component attitude detectorInfo
- Publication number
- JPH0687009B2 JPH0687009B2 JP61107066A JP10706686A JPH0687009B2 JP H0687009 B2 JPH0687009 B2 JP H0687009B2 JP 61107066 A JP61107066 A JP 61107066A JP 10706686 A JP10706686 A JP 10706686A JP H0687009 B2 JPH0687009 B2 JP H0687009B2
- Authority
- JP
- Japan
- Prior art keywords
- component
- line sensor
- light
- sensor
- light source
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Length Measuring Devices By Optical Means (AREA)
- Supply And Installment Of Electrical Components (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明は、吸着ノズル等の保持装置で保持された物体が
正しく保持されているが、また正しい物体かを高速・確
実に判定し、高い検出信頼性を供給する事ができる部品
姿勢検出装置に関するものである。Description: TECHNICAL FIELD The present invention is capable of accurately determining whether or not an object held by a holding device such as a suction nozzle is correctly held at high speed and reliably, and has high detection reliability. The present invention relates to a component posture detection device that can supply the characteristics.
従来の技術 従来の部品検出装置の例として、チップ形電子部品装着
機の部品検出装置について説明する。2. Description of the Related Art As an example of a conventional component detection device, a component detection device of a chip type electronic component mounting machine will be described.
第２図にチップ形電子部品の装着部関連図を示す。検出
物体であるチップ形電子部品１（以下チップ部品と称
す）は部品供給部２から、間欠回転する装着ヘッド３の
吸着ノズル４により、真空吸着でチップ部品１を吸着保
持している。次にX,Y方向規正部６によりX,Y方向の位置
規正をしたのち、チップ部品１の吸着姿勢を検出器７で
検査し、XYテーブル８に保持されたプリント基板９まで
運ばれ装着される。FIG. 2 shows a diagram relating to the mounting portion of the chip type electronic component. A chip-type electronic component 1 (hereinafter referred to as a chip component), which is a detection object, sucks and holds the chip component 1 by vacuum suction from a component supply unit 2 by a suction nozzle 4 of a mounting head 3 that rotates intermittently. Next, after the X and Y direction regulating section 6 regulates the positions in the X and Y directions, the suction posture of the chip component 1 is inspected by the detector 7, and the chip component 1 is conveyed to the printed circuit board 9 held by the XY table 8 and mounted. It
従来この種の装置では次のような検出方法をとってい
た。第３図にチップ部品１が吸着ノズル４に正常に吸着
している状態を示す。この場合２対の透過形光センサ
（以下光センサ）10,11が垂直方向に２段に設けられて
いる。光センサ10は吸着ノズル４の直下に置かれ、チッ
プ部品１の有無を判定し、光センサ11は吸着ノズル４の
下端よりチップ部品１の厚みｔより下方でかつ、長辺Ｌ
よりも小さい距距離内に設置されている。この時、光セ
ンサ10がオンであればチップ部品１は無い。光センサ10
がオフで11がオンであれば、第３図の正常吸着であり、
光センサ10,11共にオフであれば第４図に示す異常吸着
であると判断できた。Conventionally, this type of device has adopted the following detection method. FIG. 3 shows a state in which the chip component 1 is normally sucked by the suction nozzle 4. In this case, two pairs of transmissive optical sensors (hereinafter, optical sensors) 10 and 11 are provided in two stages in the vertical direction. The optical sensor 10 is placed immediately below the suction nozzle 4 and determines the presence or absence of the chip component 1. The optical sensor 11 is below the lower end of the suction nozzle 4 below the thickness t of the chip component 1 and has a long side L.
It is installed within a smaller distance. At this time, if the optical sensor 10 is on, there is no chip component 1. Optical sensor 10
If is off and 11 is on, it means normal adsorption of Fig. 3,
If both the optical sensors 10 and 11 are off, it can be determined that the adsorption is abnormal as shown in FIG.
発明が解決しようとする問題点 しかしながら、上記方法では第５図に示すように、吸着
ノズル４に正常に吸着されたチップ部品１に対して、厚
さ方向には正常であっても、チップ部品1aのように、90
゜水平面内で方向がまちがった場合には、検出は不可能
であるという問題を有していた。However, according to the above method, as shown in FIG. 5, even if the chip component 1 normally sucked by the suction nozzle 4 is normal in the thickness direction, 90, like 1a
There was a problem that detection was impossible if the direction was wrong in the horizontal plane.
本発明は上記問題点に鑑み、検出物体の厚み方向に発生
する異常吸着のみでなく、水平面内で生じる方向まちが
いをも検出し得る部品姿勢検出装置を提供するものであ
る。In view of the above problems, the present invention provides a component posture detection device that can detect not only abnormal suction that occurs in the thickness direction of a detection object but also directional deviation that occurs in a horizontal plane.
問題点を解決するための手段 上記問題点を解決するために本発明は、平行光を出す光
源と、検出部品を吸着保持する吸着ノズルをはさんで前
記光源と対向して配された、前記平行光を受光する第１
のラインセンサおよび第２のラインセンサと、前記検出
部品が前記光源と第１のラインセンサまたは第２のライ
ンセンサとの間の所定位置に挿入され、前記平行光の一
部をさえぎることにより前記第１のラインセンサ及び第
２のラインセンサから得られる前記検出部品の投影デー
タと、予め求めておいた所定のデータとを比較し、前記
検出部品のの姿勢を検出する演算処理部とを有し、光源
及び検出部品により生成される投影面上において前記第
１ラインセンサはその受光面を前記吸着ノズル下端近傍
に水平に配し、かつ前記第２のラインセンサはその受光
面を前記吸着ノズル下端近傍からその軸芯と略一致する
垂直方向に配したものである。Means for Solving the Problems In order to solve the above problems, the present invention is directed to a light source that emits parallel light and an adsorption nozzle that adsorbs and holds a detection component, and is arranged to face the light source. First to receive parallel light
Line sensor and second line sensor, and the detection component is inserted in a predetermined position between the light source and the first line sensor or the second line sensor, and by blocking a part of the parallel light, And a calculation processing unit that compares the projection data of the detection component obtained from the first line sensor and the second line sensor with predetermined data obtained in advance to detect the attitude of the detection component. Then, on the projection surface generated by the light source and the detection component, the light receiving surface of the first line sensor is horizontally arranged in the vicinity of the lower end of the suction nozzle, and the second line sensor has the light receiving surface of the suction nozzle. It is arranged in the vertical direction from the vicinity of the lower end so as to substantially coincide with the axis thereof.
作 用 本発明は上記した構成によって、検出物体自身で光をさ
えぎり、厚み方向及び長さ方向の異常をあらかじめ入力
してあったデータと比較することにより判別することが
可能となる。Operation According to the present invention, with the above-described configuration, it is possible to determine by blocking the light by the detection object itself and comparing the abnormality in the thickness direction and the length direction with the previously input data.
実 施 例 以下に、本発明の一実施例であるチップ形電子部品装着
機の部品検出装置について、第６図を参考にして説明し
ていく。まず本実施例のシステム構成について説明す
る。センサ部12は吸着部品１の厚みおよび長さを測り、
データを増幅器13へ送る。一方、同時に装着機本体のコ
ントローラ14から入力回路15を通してその部品番号が比
較値記憶部16へ送られ、比較値記憶部16は対応する厚み
及び長さの標準データを送り出す。上記２つの厚み及び
長さのデータが演算処理部17で比較され、判定結果は出
力回路18を通して装着機本体のコントローラ14へ送られ
る、という構成になっている。又19はチップ部品の厚
み，長さの標準データを入力するキー入力部である。Practical Example A component detecting device for a chip-type electronic component mounting machine according to an embodiment of the present invention will be described below with reference to FIG. First, the system configuration of this embodiment will be described. The sensor unit 12 measures the thickness and length of the suction component 1,
Send data to amplifier 13. On the other hand, at the same time, the controller 14 of the mounting machine main body sends the part number to the comparison value storage unit 16 through the input circuit 15, and the comparison value storage unit 16 sends out the standard data of the corresponding thickness and length. The data of the two thicknesses and lengths are compared by the arithmetic processing unit 17, and the determination result is sent to the controller 14 of the mounting machine body through the output circuit 18. Reference numeral 19 is a key input section for inputting standard data of the thickness and length of chip parts.
つぎに、センサ部12の構造について説明する。センサ部
12の外形は第７図のようなもので、特に吸着ノズル４及
びチップ部品１が入りこむのに十分な溝をもっている。
そして、この溝の一方の側壁に平行光を出す光源20が埋
めこまれ、反対側の側壁にはハーフミラー21を介して、
光源20に相対して、ラインセンサ22,23が水平方向およ
び垂直方向に各々埋めこまれている。ここで、ラインセ
ンサ22,23について説明する。このセンサは撮像素子と
して用いられる電荷結合素子（別称はCCD）の一次元タ
イプのものである。センサの受光面には、多数のセンサ
素子が並んでいて、素子一つ一つは光源からの光を受光
しているか否か、の信号を出す事ができる。そこで、図
のように光源20とラインセンサ22,23間に物体が入りこ
むと、その分光がさえぎられ、センサ受光面に影が投影
される。この時、素子を順にスキャンする事により、ど
れだけの素子に影ができているかが分かる。24は余分な
光がラインセンサ22,23に入り込まないようにするスリ
ットである。Next, the structure of the sensor unit 12 will be described. Sensor part
The outer shape of 12 is as shown in FIG. 7, and has a groove sufficient for the suction nozzle 4 and the chip component 1 to enter.
Then, a light source 20 that emits parallel light is embedded in one side wall of this groove, and a half mirror 21 is provided on the opposite side wall,
Line sensors 22 and 23 are embedded in the horizontal direction and the vertical direction, respectively, relative to the light source 20. Here, the line sensors 22 and 23 will be described. This sensor is a one-dimensional type of charge-coupled device (also called CCD) used as an imaging device. A large number of sensor elements are arranged on the light-receiving surface of the sensor, and each element can output a signal indicating whether or not it receives light from a light source. Therefore, when an object enters between the light source 20 and the line sensors 22 and 23 as shown in the figure, the spectrum is blocked and a shadow is projected on the light receiving surface of the sensor. At this time, by sequentially scanning the elements, it is possible to know how many elements have shadows. Reference numeral 24 is a slit that prevents excess light from entering the line sensors 22 and 23.
第１図は、チップ部品１の吸着の状態とラインセンサ2
2,23の受光の部分との関係を示したものである。厚み方
向は垂直におかれたラインセンサ22により、遮光された
部分の長さがチップ部品１の厚みｔである。一方、水平
方向にに置かれたラインセンサより、チップ部品１の辺
の長さＬが測定される。こうして得られたデータt,ある
いはＬがあらかじめ設定されたものと比較し、一定公差
内であれば正常，公差外であれば異常という判断が可能
である。FIG. 1 shows the state of suction of the chip component 1 and the line sensor 2.
It shows the relationship with the light receiving part of 2,23. The thickness t of the chip component 1 is the length of the portion shielded from light by the line sensor 22 placed vertically in the thickness direction. On the other hand, the length L of the side of the chip component 1 is measured by the line sensor placed in the horizontal direction. By comparing the data t or L thus obtained with the preset data, it is possible to judge that the data is normal if it is within a certain tolerance and abnormal if it is outside the tolerance.
以上のように本実施例によれば、光源及び水平方向，垂
直方向の２方向の長さを検出し得るセンサを有し、吸着
ノズルにより保持された検出物体がこれらの間に入り、
光の一部をさえぎることにより物体の厚みと、長さを検
出するセンサ部と、あらかじめ求めておいた検出物体の
厚み、及び水平方向の寸法を各々記憶しておく比較記憶
部と、上記２つの厚みデータを比較し、前記検出物体が
正しく保持されているか、また正しい物体を保持してい
るか否かを判定する演算処理部とを設けることにより、
検出物体の吸着の有無，吸着された姿勢の正常，異常の
判別、さらには、当該の部品であるか否かの判別もでき
る。As described above, according to the present embodiment, the light source and the sensor capable of detecting the length in two directions of the horizontal direction and the vertical direction are provided, and the detection object held by the suction nozzle enters between them,
A sensor unit for detecting the thickness and length of the object by blocking a part of the light; a comparison storage unit for storing the thickness of the detected object and a horizontal dimension which are obtained in advance; By comparing the two thickness data, by providing an arithmetic processing unit that determines whether the detected object is correctly held, and whether or not the correct object is held,
Whether or not the detected object is adsorbed, whether the adsorbed posture is normal or abnormal, and whether or not it is the relevant part can be determined.
発明の効果 以上のように本発明は、吸着ノズルの下端部近傍の水平
方向及び、吸着ノズルの軸心と略一致する垂直方向の２
方向の長さを検出し得る一組のラインセンサを有し、吸
着ノズルにより保持された検出物体が光源とラインセン
サの間に入り、光の一部をさえぎることにより、物体の
厚みと、長さを検出して得たデータとあらかじめ求めて
おいた検出物体の厚み、及び水平方向のデータを比較
し、前記検出物体の姿勢を検出する演算処理部を設ける
ことにより、検出物体の吸着の有無，吸着された姿勢の
正常，異常の判別、さらには、当該の部品であるか否か
の判別もできる。EFFECTS OF THE INVENTION As described above, according to the present invention, the suction nozzle has a horizontal direction in the vicinity of the lower end portion and a vertical direction that substantially coincides with the axis of the suction nozzle.
It has a set of line sensors that can detect the length in the direction, and the detection object held by the suction nozzle enters between the light source and the line sensor to block a part of the light, thereby increasing the thickness and length of the object. Whether or not the detected object is adsorbed by providing an arithmetic processing unit that compares the data obtained by detecting the height with the thickness of the detected object obtained in advance and the horizontal data to detect the attitude of the detected object. It is also possible to judge whether the sucked posture is normal or abnormal, and further to judge whether or not the part concerned.
第１図は本発明の一実施例における検出の原理説明図、
第２図はチップ部品装着機の斜視図、第３図は従来のチ
ップ部品の吸着部の縦断面図、第４図は異常吸着の場合
の同縦断面図、第５図a,bは各々チップ部品が水平面内
で90゜ずれた場合の吸着部の縦断面図び平面図、第６図
は本発明の一実施例におけるチップ部品装着機の部品検
出装置のブロック図、第７図a,bは各々同検出装置及び
センサ部の断面図及び平面図である。 １……チップ部品、４……吸着ノズル、10,11……光セ
ンサ、12……センサ部、16……比較値記憶部、17……演
算処理部、20……光源、21……ハーフミラー、22,23…
…ラインセンサ。FIG. 1 is an explanatory view of the principle of detection in one embodiment of the present invention,
FIG. 2 is a perspective view of a chip component mounting machine, FIG. 3 is a vertical cross-sectional view of a conventional chip component suction part, FIG. 4 is the same vertical cross-sectional view in the case of abnormal suction, and FIGS. FIG. 7 is a block diagram of a component detection device of a chip component mounting machine according to an embodiment of the present invention, where FIG. 6 is a vertical sectional view and a plan view of a suction part when the chip components are displaced by 90 ° in a horizontal plane. 3B is a cross-sectional view and a plan view of the detection device and the sensor unit, respectively. 1 ... Chip part, 4 ... Suction nozzle, 10,11 ... Optical sensor, 12 ... Sensor section, 16 ... Comparison value storage section, 17 ... Calculation processing section, 20 ... Light source, 21 ... Half Mirrors, 22,23 ...
… A line sensor.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 河井 誠 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (72)発明者 佐藤 健一 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (56)参考文献 特開 昭61−25002（ＪＰ，Ａ) 特開 昭60−86403（ＪＰ，Ａ) ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Makoto Kawai, 1006 Kadoma, Kadoma City, Osaka Prefecture, Matsushita Electric Industrial Co., Ltd. (72) Kenichi Sato, 1006, Kadoma, Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd. 56) References JP 61-25002 (JP, A) JP 60-86403 (JP, A)
Claims (1)
部品を取出し基板上の所定位置に装着する電子部品装着
機の部品姿勢検出装置であって、 平行光を出す光源と、 検出部品を吸着保持する吸着ノズルをはさんで前記光源
と対向して配された、前記平行光を受光する第１のライ
ンセンサおよび第２のラインセンサと、 前記検出部品が前記光源と第１のラインセンサまたは第
２のラインセンサとの間の所定位置に挿入され、前記平
行光の一部をさえぎることにより前記第１のラインセン
サ及び第２のラインセンサから得られる前記検出部品の
投影データと、予め求めておいた所定のデータとを比較
し、前記検出部品の姿勢を検出する演算処理部とを有
し、 前記光源及び前記検出部品により生成される投影面上に
おいて、 前記第１のラインセンサはその受光面を前記吸着ノズル
下端近傍に水平方向に配し、かつ前記第２のラインセン
サはその受光面を前記吸着ノズル下端近傍から軸芯と略
一致する垂直方向に配したことを特徴とする部品姿勢検
出装置。1. A component attitude detecting device for an electronic component mounting machine for picking up a component from a predetermined component supply section by a suction nozzle and mounting the component at a predetermined position on a substrate, wherein a light source for emitting parallel light and a suction component for holding the detected component. A first line sensor and a second line sensor, which are arranged to face the light source with an adsorption nozzle interposed therebetween, and which receive the parallel light; and the detection component is the light source and the first line sensor or the first line sensor. Projection data of the detection component, which is inserted at a predetermined position between the second line sensor and the first line sensor and the second line sensor by blocking a part of the parallel light, and previously obtained. And a calculation processing unit that detects a posture of the detection component by comparing the predetermined data with the predetermined data, and the first line on the projection surface generated by the light source and the detection component. The sensor has its light-receiving surface arranged horizontally in the vicinity of the lower end of the suction nozzle, and the second line sensor has its light-receiving surface arranged in the vertical direction from the vicinity of the lower end of the suction nozzle substantially in line with the axis. And component attitude detection device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61107066A JPH0687009B2 (en) | 1986-05-09 | 1986-05-09 | Component attitude detector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61107066A JPH0687009B2 (en) | 1986-05-09 | 1986-05-09 | Component attitude detector |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62263405A JPS62263405A (en) | 1987-11-16 |
| JPH0687009B2 true JPH0687009B2 (en) | 1994-11-02 |
Family
ID=14449622
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61107066A Expired - Lifetime JPH0687009B2 (en) | 1986-05-09 | 1986-05-09 | Component attitude detector |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0687009B2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5278634A (en) | 1991-02-22 | 1994-01-11 | Cyberoptics Corporation | High precision component alignment sensor system |
| JP2554424B2 (en) * | 1992-08-04 | 1996-11-13 | ヤマハ発動機株式会社 | Parts mounting device |
| JP4330512B2 (en) | 2004-10-08 | 2009-09-16 | パナソニック株式会社 | Component mounting equipment |
| JP4674220B2 (en) * | 2007-03-05 | 2011-04-20 | ヤマハ発動機株式会社 | Component transfer device, surface mounter, and electronic component inspection device |
| US7746481B2 (en) | 2007-03-20 | 2010-06-29 | Cyberoptics Corporation | Method for measuring center of rotation of a nozzle of a pick and place machine using a collimated laser beam |
-
1986
- 1986-05-09 JP JP61107066A patent/JPH0687009B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62263405A (en) | 1987-11-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |